Array current selective area processing device and method for preparing periodic heterostructure plate strip

Abstract

According to the array current area selection processing device and method for preparing the periodic heterostructure plate strip, the array type pulse current applying device can apply pulse current to a metal plate in a local area, and the lower moving bottom plate adjusting device and the upper moving bottom plate adjusting device can change the size of a local energized area of the metal plate; the positive electrode copper block lifting device and the negative electrode copper block lifting device can enable the copper blocks of all the electrodes to be in close contact with the metal plate; compared with a conventional heat preservation heating annealing device or a whole metal plate with pulse current, a heterostructure is formed through a positive electrode area, a negative electrode area and a non-contact electrifying area of the plate and an electrode, regionalized efficient modification is achieved, and heterostructure metal materials with different sizes of crystalline grains distributed periodically are formed, so that the strength and the toughness are improved; the plate shape of the metal plate is improved; the device can be operated in a sealed mode, modification is achieved only through pulse current, the operation cost is effectively reduced, the reaction is fast, and the preparation period is shortened.

Description

Technical Field

[0001] The present invention belongs to the technical field of metal plate preparation, and in particular relates to an array current selection processing device and method for preparing periodic heterogeneous structure strips. Background Art

[0002] The thickness of the metal plate is generally between 0.5mm and 10mm. It is often used to manufacture mechanical parts, ships, bridges, building structures, etc., and its service performance requires sufficient strength and toughness. It is often prepared by rolling, and its structure and properties are adjusted by subsequent processes such as long-term heat treatment. Heterostructure (HS) materials are a revolutionary development in materials science, characterized by heterogeneous bands with different mechanical or physical properties. During the deformation process, due to the synergistic effect between the soft zone and the hard zone, heterogeneous deformation induced (HDI) stress is formed, resulting in significant HDI strengthening and strain hardening. This mechanism greatly improves its performance, surpassing traditional homogeneous materials, and has a wide range of industrial application potential. For example, current industrial technology and facilities can produce HS materials, and HS steel can be produced using current industrial rolling and annealing technologies, which is expected to develop a series of new high-performance and low-cost automotive steels. Secondly, through customized heterostructure design, the strength-plasticity synergy of lightweight alloys such as magnesium alloys and titanium alloys can be significantly improved. Thereby further improving its specific strength, it has great application potential in the aerospace and automotive fields. Third, compared with several titanium alloys, heterostructured pure titanium has superior mechanical properties and biocompatibility, and has broad application prospects in biomedical engineering. Fourth, heterostructured copper alloys with high strength and conductivity are expected to be used as contact conductors in high-speed railway networks. It is also one of the important directions for improving the performance of metal plates and strips. However, its preparation method relies on a combination of traditional rolling, annealing and other processes, which has a long preparation cycle, is difficult to mass produce, and has high costs. It is necessary to explore more effective processing methods to produce HS materials suitable for industrialization at low cost. Summary of the invention

[0003] In order to solve the shortcomings and deficiencies of the prior art, an array current selection processing device and method for preparing periodic heterogeneous structure strips are provided, thereby solving the problems of high difficulty in preparing structured heterogeneous materials, long preparation cycle and difficulty in large-scale production.

[0004] An array current selection processing device for preparing periodic heterogeneous structure plates and strips provided to achieve the purpose of the present invention includes a middle support base, characterized in that: an array pulse current applying device is installed above the surface of the middle support base, a metal plate is clamped in the middle of the array pulse current applying device, conveying devices for conveying metal plates are installed on both sides of the middle support base, negative ceramic plate lifting devices are installed on both sides of the array pulse current applying device, a negative copper block lifting device is installed on the upper surface of the array pulse current applying device, a positive copper block lifting device is installed below the array pulse current applying device, a positive ceramic plate adjusting device is installed on the middle support base, and a sealed box is installed on the outside of the array pulse current applying device, and the sealed box is filled with nitrogen or helium.

[0005] Preferably, the array-type pulse current application device includes a lower array-type positive ceramic plate arranged on a middle supporting base, a card slot is arranged inside the lower array-type positive ceramic plate, the lower array-type positive ceramic plate is connected to a positive copper block through the internal card slot and is penetrated by the positive copper block, a plurality of the positive copper blocks are connected in parallel through wires, an upper array-type negative ceramic plate is arranged above the lower array-type positive ceramic plate, a negative copper block is arranged in the card slot on the upper array-type negative ceramic plate, and a plurality of the negative copper blocks are connected in parallel through wires.

[0006] Preferably, the negative copper block and the positive copper block are both T-shaped, and the portion where the other end contacts the metal plate is arc-shaped, and the negative copper blocks and the positive copper blocks between adjacent columns are arranged alternately.

[0007] Preferably, the conveying device comprises conveying rollers for supporting and conveying the metal sheet, and the conveying rollers are mounted on the middle supporting base via a bearing seat.

[0008] Preferably, the negative electrode ceramic plate lifting device includes steel plates arranged on both sides of the upper array-type negative electrode ceramic plate, and two holes are opened on both sides of the upper array-type negative electrode ceramic plate. Holes are opened on both sides of the steel plate and correspond to the holes opened in the upper array-type negative electrode ceramic plate. The steel plate and the upper array-type negative electrode ceramic plate are tightly fitted, and the holes of the steel plate are threadedly connected to the top rod of the medium and high pressure oil cylinder. The medium and high pressure oil cylinder is fixedly installed on the middle support base, and four groups of the medium and high pressure oil cylinders are arranged.

[0009] Preferably, the negative electrode copper block lifting device includes an upper support seat insulating block inserted on the negative electrode copper block, the upper support seat insulating block is fixedly connected to the piston rod of the upper support seat cylinder, the other end of the upper support seat cylinder is fixedly connected to the upper support seat, the four corner ends of the upper support seat are fixedly connected to fixing columns, and the other end of the fixing column is fixedly connected to the middle support base.

[0010] Preferably, the positive copper block lifting device includes a lower base micro-cylinder insulating block clamped under the positive copper block, a piston rod of the lower base micro-cylinder is fixedly connected to the bottom of the lower base micro-cylinder insulating block, and the bottom end of the lower base micro-cylinder is fixedly connected to the positive ceramic plate adjusting device.

[0011] Preferably, the sealed box includes an upper box body and a lower box body, both of which are top and bottom open structures, the upper box body is fixedly connected to the groove on the lower surface of the upper array-type negative ceramic plate, and the lower box body is fixedly connected to the positive ceramic plate adjustment device. A notch for passing the metal plate is opened on the upper surface of the lower box body, and the wall thickness of the lower box body is greater than the maximum adjustment distance of the positive ceramic plate adjustment device to prevent poor sealing during the adjustment process.

[0012] Preferably, a square groove is provided at the center of the middle supporting base, and the positive ceramic plate adjusting device comprises two groups of middle base slide rails, and the two groups of middle base slide rails are respectively fixedly connected to the two sides of the square groove of the middle supporting base, and the middle base slide rails are slidably connected to the upper movable bottom plate, and the upper movable bottom plate is "L"-shaped, and the lower box body is fixedly connected to the upper movable bottom plate, and the lower array-type positive ceramic plate is slidably arranged in the lower box body, and a through groove for passing the lower array-type positive ceramic plate is provided at the center of the upper movable bottom plate, and a middle base three-axis guide rod cylinder is fixedly connected to one side of the middle supporting base, and the piston of the middle base three-axis guide rod cylinder is fixedly connected to the side plate of the upper movable bottom plate, and the upper surface of the middle supporting base is away from the middle base The top end of the lower support column is fixedly connected to the lower support base, and the other end of the lower support column is fixedly connected to the lower support base. One side of the lower support base is fixedly connected to the lower base three-axis guide rod cylinder. Two sets of lower base slide rails are fixedly connected to the upper surface of the lower support base away from the lower base three-axis guide rod cylinder. Two lower base baffles are fixedly connected to the lower movable base plate on the side of the upper surface of the lower support base away from the lower base three-axis guide rod cylinder for limiting the lower movable base plate. The lower movable base plate is slidably arranged on the lower base slide rail, and the lower movable base plate is "L" shaped, and the side plates of the lower movable base plate are fixedly connected to the pistons of the lower base three-axis guide rod cylinders.

[0013] The array current selection processing method for preparing a periodic heterostructure strip comprises the following steps:

[0014] S1, selecting metal plates of different corresponding specifications according to the width of the notch on the upper surface of the lower box, adjusting the positive electrode copper block to a suitable position by adjusting the positive electrode ceramic plate adjustment device, so that the ratio of the energized area to the non-energized area meets the processing requirements, thereby forming a heterogeneous structure that meets the requirements;

[0015] S2, by controlling the lower base micro cylinder in the positive copper block lifting device to lower the positive copper block to a certain height, by controlling the upper support seat cylinder in the negative copper block lifting device to raise the negative copper block to a certain height, and then by the medium and high pressure oil cylinder to raise the upper array type negative ceramic plate to an appropriate height so that the metal plate can pass through, at this time the lower box body of the sealed box is separated from the upper box body;

[0016] S3, using a conveying roller to feed the metal sheet into the array pulse current applying device, lowering the upper array negative ceramic plate through a medium-high pressure oil cylinder so that the lower surface of the upper box body is close to the upper surface of the lower box body, and according to the pre-determined area where the pulse current needs to be passed, the positive copper block is raised by controlling the corresponding lower base micro cylinder in the positive copper block lifting device, so that the arc end of the positive copper block is in close contact with the lower surface of the metal sheet, and the negative copper block is lowered by controlling the corresponding upper support seat cylinder in the negative copper block lifting device so that the arc end of the negative copper block is in close contact with the upper surface of the metal sheet;

[0017] S4, applying a pulse current to a local area of ​​the metal sheet using a positive copper block and a negative copper block in an array-type pulse current applying device, and regulating the organization and toughness of the metal sheet by the pulse current, thereby forming a heterogeneous structure;

[0018] S5, repeating the above S2 to S4, using the conveyor roller to send out the metal sheet that has been electrically treated, and sending the next section of untreated metal sheet into the array pulse current application device for electrical treatment, until the entire metal sheet has been electrically treated to obtain a qualified metal sheet.

[0019] Compared with the prior art, the array current selection processing device and method for preparing periodic heterogeneous structure strips provided by the present invention have the following advantages:

[0020] (1) Improved the processing performance of metal sheets

[0021] This device uses array pulse current to quickly change the local grain size and organizational structure of metal sheets applied to thin plates and strips through local heating, achieving regionalized and efficient modification to form heterogeneous structural metal materials with periodic distribution of grains of different sizes, thereby improving strength and toughness, improving the plasticity of the metal, and reducing energy consumption.

[0022] (2) Improve the shape of metal sheets

[0023] This device passes array pulse current to achieve rapid release of local residual stress, thereby improving shape defects such as warping, wave, and uneven plate shape caused by rolling. In addition, pulse current is passed through part of the metal plate and no pulse current is passed through part of the metal plate, so that the material retains some anti-deformation ability, which can make the plate shape smoother and more uniform in the subsequent rolling process.

[0024] (3) High degree of industrialization

[0025] This device uses an array pulse current process, which has a rapid response and a high degree of automation compared to traditional rolling, annealing and other combined processes, greatly shortening the preparation cycle to a certain extent. In addition, the device has a simple structure and can be replicated in batches to achieve large-scale production, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective view of the device of the present invention;

[0027] Figure 2 is a three-dimensional diagram of the array type pulse current applying device of the present invention;

[0028] Figure 3 The present invention Figure 2 A-direction view when working;

[0029] Figure 4 is a three-dimensional diagram of the sealing box in the present invention;

[0030] Figure 5 yes Figure 2 A cross-sectional view of

[0031] Figure 6 is a three-dimensional diagram of the copper block of the present invention;

[0032] Figure 7 yes Figure 5 A partial enlarged view of point C in the middle;

[0033] Figure 8 It is a three-dimensional diagram of the negative electrode copper block lifting device of the present invention;

[0034] Fig. 9 It is a three-dimensional diagram of the positive electrode copper block lifting device of the present invention;

[0035] Fig.10 It is a partial stereogram of the positive electrode ceramic plate adjusting device of the present invention;

[0036] Fig.11 It is a three-dimensional diagram of the lower support base in the present invention;

[0037] Fig.12 This is the overall schematic diagram of the present invention used in series

[0038] Fig.13 It is a schematic diagram of the power supply of the power supply area W with different sizes;

[0039] Fig.14 is a schematic diagram of the method of the present invention;

[0040] Fig.15 is a schematic diagram of the power supply of the metal sheet after the power supply treatment;

[0041] Fig.16 The microstructure distribution in the thickness direction of the copper plate after the electrical treatment in the present invention;

[0042] Fig.17 The change of tensile properties of copper plate when it is not electrified and when it is pulsed with current

[0043] In the figure: 1. middle support base; 2. array pulse current applying device; 201. lower array positive ceramic plate; 202. positive copper block; 203. wire; 204. negative copper block; 205. upper array negative ceramic plate; 206. sealing box; 2061. upper box body; 2062. lower box body; 3. metal sheet; 4. conveying device; 401. conveying roller; 402. bearing seat; 5. negative ceramic plate lifting device; 501. steel plate; 502. medium and high pressure oil cylinder; 6. negative copper block lifting device; 601. upper support seat insulating block ;602, upper support seat cylinder; 603, upper support seat; 604, fixed column; 7, positive copper block lifting device; 701, lower base micro cylinder insulating block; 702, lower base micro cylinder; 8, positive ceramic plate adjustment device; 801, middle base slide rail; 802, upper movable bottom plate; 803, middle base three-axis guide rod cylinder; 804, middle base baffle; 805, lower support column; 806, lower support base; 807, lower base three-axis guide rod cylinder; 808, lower base slide rail; 809, lower base baffle; 810, lower movable bottom plate. DETAILED DESCRIPTION

[0044] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings:

[0045] The present invention provides an array current selection processing device for preparing periodic heterogeneous structure plates and strips, comprising a middle support base 1, an array pulse current applying device 2 is installed above the surface of the middle support base 1, a metal plate 3 is clamped in the middle of the array pulse current applying device 2, conveying devices 4 for conveying the metal plate 3 are installed on both sides of the middle support base 1, negative ceramic plate lifting devices 5 are installed on both sides of the array pulse current applying device 2, a negative copper block lifting device 6 is installed on the upper surface of the array pulse current applying device 2, a positive copper block lifting device 7 is installed below the array pulse current applying device 2, a positive ceramic plate adjusting device 8 is installed on the middle support base 1, and a sealing box 206 is installed on the outside of the array pulse current applying device 2, and the sealing box 206 is filled with nitrogen or helium to prevent the metal plate 3 from being oxidized in the working area.

[0046] The array-type pulse current applying device 2 includes a lower array-type positive ceramic plate 201 arranged on a middle supporting base 1, a card slot is arranged inside the lower array-type positive ceramic plate 201, the lower array-type positive ceramic plate 201 is connected to a positive copper block 202 through the internal card slot, and is penetrated by the positive copper block 202, a plurality of positive copper blocks 202 are connected in parallel through a wire 203, an upper array-type negative ceramic plate 205 is arranged above the lower array-type positive ceramic plate 201, a negative copper block 204 is arranged in the card slot on the upper array-type negative ceramic plate 205, a plurality of negative copper blocks 204 are connected in parallel through the wire 203, and after the wire 203 is energized, the current can pass through the negative copper block 204 in the upper array-type negative ceramic plate 205 and the positive copper block 202 in the lower array-type positive ceramic plate 201 to apply a pulse current to the metal plate 3 clamped therebetween. The negative copper block 204 and the positive copper block 202 are both T-shaped, and the part where the other end contacts the metal plate 3 is arc-shaped. The negative copper blocks 204 and the positive copper blocks 202 between adjacent rows are arranged alternately, dividing the surface of the metal plate 3 into a powered area W and a non-powered area V. Figures 9 to 11 As shown, by adjusting the positive ceramic plate adjusting device 8, the size of the energized area W can be adjusted, such as Fig.13 The shaded area in the figure indicates that a pulse current is applied, and the blank area indicates that no pulse current is applied, where (a) indicates that the area of ​​the energized area is the same as the area of ​​the non-energized area; (b) indicates that the area of ​​the energized area is smaller than the area of ​​the non-energized area.

[0047] The conveying device 4 includes a conveying roller 401 for supporting and conveying the metal sheet 3. The conveying roller 401 is installed on the middle support base 1 through a bearing seat 402, and can continuously convey the metal sheet 3 into the array-type pulse current application device 2.

[0048] The negative electrode ceramic plate lifting device 5 includes a steel plate 501 arranged on both sides of the upper array-type negative electrode ceramic plate 205. Two holes are opened on both sides of the upper array-type negative electrode ceramic plate 205. Holes are opened on both sides of the steel plate 501, and correspond to the holes opened on the upper array-type negative electrode ceramic plate 205. The steel plate 501 and the upper array-type negative electrode ceramic plate 205 are tightly fitted. The holes of the steel plate 501 are threadedly connected to the top rod of the medium and high pressure oil cylinder 502. The medium and high pressure oil cylinder 502 is fixedly installed on the middle support base 1. Four groups of medium and high pressure oil cylinders 502 are arranged. The lifting and lowering of the upper array-type negative electrode ceramic plate 205 can be adjusted by four medium and high pressure oil cylinders 502.

[0049] The negative copper block lifting device 6 includes an upper support seat insulating block 601 inserted on the negative copper block 204, the upper support seat insulating block 601 is fixedly connected to the piston rod of the upper support seat cylinder 602, the other end of the upper support seat cylinder 602 is fixedly connected to the upper support seat 603, the four corner ends of the upper support seat 603 are fixedly connected to the fixed column 604, the other end of the fixed column 604 is fixedly connected to the middle support base 1, the negative copper block 204 can be extended and retracted up and down by controlling the upper support seat cylinder 602, and the lifting and lowering of the piston rod of each support seat cylinder 602 can be controlled separately.

[0050] The positive copper block lifting device 7 includes a lower base micro-cylinder insulating block 701 clamped under the positive copper block 202, and the piston rod of the lower base micro-cylinder 702 is fixedly connected to the lower part of the lower base micro-cylinder insulating block 701. The bottom end of the lower base micro-cylinder 702 is fixedly connected to the positive ceramic plate adjustment device 8 and the lower base micro-cylinder insulating block 702 to avoid overflow of pulse current, and the lifting and lowering of the piston rod of each lower base micro-cylinder 701 can be controlled individually.

[0051] The sealed box 206 includes an upper box body 2061 and a lower box body 2062. Both the upper box body 2061 and the lower box body 2062 are open structures at the top and bottom. The upper box body 2061 is fixedly connected to the groove on the lower surface of the upper array-type negative ceramic plate 205, and the lower box body 2062 is fixedly connected to the positive ceramic plate adjustment device 8. A notch is opened on the upper surface of the lower box body 2062 for passing the metal plate 3. The wall thickness of the lower box body 2062 is greater than the maximum adjustment distance of the positive ceramic plate adjustment device 8 to prevent poor sealing during the adjustment process.

[0052] A square groove is provided at the center of the middle support base 1, and the positive ceramic plate adjustment device 8 includes two groups of middle base slide rails 801, and the two groups of middle base slide rails 801 are respectively fixedly connected to the two sides of the square groove of the middle support base 1, and the middle base slide rails 801 are slidably connected to the upper movable bottom plate 802, and the upper movable bottom plate 802 is "L"-shaped, and the lower box body 2062 is fixedly connected to the upper movable bottom plate 802, and the lower array-type positive ceramic plate 201 is slidably arranged in the lower box body 2062, and a through groove for passing through the lower array-type positive ceramic plate 201 is provided at the center of the upper movable bottom plate 802, and a middle base three-axis guide rod cylinder 803 is fixedly connected to one side of the middle support base 1, and the piston of the middle base three-axis guide rod cylinder 803 is fixedly connected to the side plate of the upper movable bottom plate 802, and two The middle base baffle 804 is used to limit the upper movable base plate 802. Four lower support columns 805 are fixedly connected to the lower surface of the middle support base 1. The other end of the lower support column 805 is fixedly connected to the lower support base 806. One side of the lower support base 806 is fixedly connected to the lower base three-axis guide rod cylinder 807. The upper surface of the lower support base 806 is fixedly connected to two groups of lower base slide rails 808. Two lower base baffles 809 are fixedly connected to the side of the upper surface of the lower support base 806 away from the lower base three-axis guide rod cylinder 807, which are used to limit the lower movable base plate 810. The lower movable base plate 810 is slidably set on the lower base slide rail 808. The lower movable base plate 810 is "L"-shaped. The side plate of the lower movable base plate 810 is fixedly connected to the piston of the lower base three-axis guide rod cylinder 807, so as to realize the adjustment of the displacement of the lower array-type positive ceramic plate 201.

[0053] The array current selection processing method for preparing a periodic heterostructure strip comprises the following steps:

[0054] S1, select metal plates 3 of different corresponding specifications according to the width of the notch on the upper surface of the lower box 2062, and adjust the positive copper block 202 to a suitable position by adjusting the positive ceramic plate adjustment device 8, so that the ratio of the energized area to the non-energized area meets the processing requirements, thereby forming a heterogeneous structure that meets the requirements;

[0055] S2, by controlling the lower base micro cylinder 702 in the positive copper block lifting device 7 to lower the positive copper block 202 to a certain height, by controlling the upper support seat cylinder 602 in the negative copper block lifting device 6 to raise the negative copper block 204 to a certain height, and then by the medium and high pressure oil cylinder 502 to raise the upper array type negative ceramic plate 205 to a proper height, so that the metal plate 3 can pass through, at this time, the lower box body 2062 of the sealing box 206 is separated from the upper box body 2061;

[0056] S3, using the conveying roller 401 to deliver the metal sheet 3 into the array pulse current applying device 2, and using the medium and high pressure oil cylinder 502 to lower the upper array negative ceramic plate 205 so that the lower surface of the upper box 2061 is close to the upper surface of the lower box 2062, according to the predetermined area where the pulse current needs to be passed, by controlling the corresponding lower base micro cylinder 702 in the positive copper block lifting device 7 to raise the positive copper block 202, so that the arc end of the positive copper block 202 is in close contact with the lower surface of the metal sheet 3, and by controlling the corresponding upper support seat cylinder 602 in the negative copper block lifting device 6 to lower the negative copper block 204, so that the arc end of the negative copper block 204 is in close contact with the upper surface of the metal sheet 3;

[0057] S4, using the positive copper block 202 and the negative copper block 204 in the array-type pulse current applying device 2 to apply a pulse current to a local area of ​​the metal plate 3, and regulating the organization and toughness of the metal plate 3 by the pulse current, thereby forming a heterogeneous structure;

[0058] S5, repeat the above S2 to S4, use the conveyor roller 401 to send out the metal sheet 3 that has been electrically treated, and send the next section of untreated metal sheet 3 into the array pulse current application device 2 for electrical treatment, until the entire metal sheet 3 has completed the electrical treatment, and a qualified metal sheet 3 is obtained.

[0059] The present invention can process metal plates 3 with a width L≥50mm. The device sets the width of each electrode copper block to 50mm, the length of the electrified area 5≤n≤15mm, and the thickness range to ≤10mm.

[0060] In S4, initial reference values ​​of process parameters when applying array pulse current to different metal sheets are determined based on simulation results.

[0061] like Fig.15 As shown, by controlling the array-type pulse current applying device 2, different forms of pulse current are applied to the metal plate 3. Figure (a) shows the energized area formed by all electrodes being energized; Figure (b) shows the pulse current being passed between columns at intervals; various special energized areas can also be formed, such as Figure (c) showing a wavy energized area; Figure (d) showing a W-shaped energized area; Figure (e) showing a diamond energized area; and Figure (f) showing an H-shaped energized area. Different energization methods are selected according to different materials and applications.

[0062] like Fig.16As shown in the figure, the microstructure and performance of the metal plate 3 can be efficiently regulated in a short time by array pulse current treatment. Taking a 5 mm thick copper plate as an example, the microstructure grains obtained by pulse current treatment for 5 s with a peak current of 300 A, a duty cycle of 20%, and a frequency of 1000 Hz are significantly smaller. Region a is the energized area M where the metal plate 3 is in contact with the electrode. The grains in this area are larger than those in the non-contact energized area N between the metal plate 3 and the copper block. The grains are reorganized and recrystallized here. The other areas are the N area and the V area, and the grains are fibrous. A heterogeneous structure is formed by this energization method. The synergistic effect between the soft area, the transition area and the hard area forms heterogeneous deformation induced (HDI) stress, resulting in significant HDI strengthening and strain hardening, as shown in FIG. Fig.17 As shown, the plasticity of the copper plate subjected to array pulse current is significantly improved and the deformation resistance is significantly reduced.

[0063] The above embodiments are not limited to the technical solutions of the embodiments themselves, and the embodiments can be combined with each other to form new embodiments. The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Any modification or equivalent replacement that does not deviate from the spirit and scope of the present invention shall be included in the scope of the technical solutions of the present invention.

Claims

1. An array current selection processing device for preparing a periodic heterogeneous structure strip, comprising a middle support base (1), characterized in that: An array-type pulse current applying device (2) is installed above the surface of the middle support base (1), a metal plate (3) is clamped in the middle of the array-type pulse current applying device (2), conveying devices (4) for conveying the metal plate (3) are installed on both sides of the middle support base (1), negative ceramic plate lifting devices (5) are installed on both sides of the array-type pulse current applying device (2), a negative copper block lifting device (6) is installed on the upper surface of the array-type pulse current applying device (2), a positive copper block lifting device (7) is installed below the array-type pulse current applying device (2), a positive ceramic plate adjusting device (8) is installed on the middle support base (1), and a sealing box (206) is installed on the outside of the array-type pulse current applying device (2), and the sealing box (206) is filled with nitrogen or helium.

2. The array current selection processing device for preparing a periodic heterostructure strip according to claim 1, characterized in that: The array-type pulse current applying device (2) comprises a lower array-type positive ceramic plate (201) arranged on a middle supporting base (1), a card slot being arranged inside the lower array-type positive ceramic plate (201), the lower array-type positive ceramic plate (201) being connected to a positive copper block (202) via the internal card slot and being penetrated by the positive copper block (202), a plurality of the positive copper blocks (202) being connected in parallel via a wire (203), an upper array-type negative ceramic plate (205) being arranged above the lower array-type positive ceramic plate (201), a negative copper block (204) being arranged in the card slot on the upper array-type negative ceramic plate (205), and a plurality of the negative copper blocks (204) being connected in parallel via a wire (203).

3. The array current selection processing device for preparing a periodic heterogeneous structure strip according to claim 2, characterized in that: The negative copper block (204) and the positive copper block (202) are both T-shaped, and the portion where the other end contacts the metal plate (3) is arc-shaped. The negative copper blocks (204) and the positive copper blocks (202) in adjacent columns are arranged in an alternating manner.

4. The array current selection processing device for preparing a periodic heterostructure strip according to claim 1, characterized in that: The conveying device (4) comprises a conveying roller (401) for supporting and conveying the metal plate (3); the conveying roller (401) is mounted on the middle supporting base (1) via a bearing seat (402).

5. The array current selection processing device for preparing a periodic heterostructure strip according to claim 1, characterized in that: The negative electrode ceramic plate lifting device (5) comprises steel plates (501) arranged on both sides of the upper array type negative electrode ceramic plate (205), and two holes are provided on both sides of the upper array type negative electrode ceramic plate (205). Holes are provided on both sides of the steel plate (501) and correspond to the holes provided on the upper array type negative electrode ceramic plate (205). The steel plate (501) and the upper array type negative electrode ceramic plate (205) are tightly fitted, and the holes of the steel plate (501) are threadedly connected to the top rod of the medium and high pressure oil cylinder (502). The medium and high pressure oil cylinder (502) is fixedly installed on the middle support base (1), and four groups of the medium and high pressure oil cylinder (502) are provided.

6. The array current selection processing device for preparing a periodic heterogeneous structure strip according to claim 1, characterized in that: The negative electrode copper block lifting device (6) comprises an upper support seat insulating block (601) inserted on the negative electrode copper block (204), the upper support seat insulating block (601) is fixedly connected to the piston rod of the upper support seat cylinder (602), the other end of the upper support seat cylinder (602) is fixedly connected to the upper support seat (603), the four corner ends of the upper support seat (603) are fixedly connected to the fixing columns (604), and the other end of the fixing columns (604) is fixedly connected to the middle support base (1).

7. The array current selection processing device for preparing a periodic heterostructure strip according to claim 1, characterized in that: The positive electrode copper block lifting device (7) comprises a lower base micro-cylinder insulating block (701) clamped below the positive electrode copper block (202); a piston rod of the lower base micro-cylinder (702) is fixedly connected below the lower base micro-cylinder insulating block (701); and the bottom end of the lower base micro-cylinder (702) is fixedly connected to the positive electrode ceramic plate adjusting device (8).

8. The array current selection processing device for preparing a periodic heterostructure strip according to claim 2, characterized in that: The sealed box (206) comprises an upper box body (2061) and a lower box body (2062), both of which are top and bottom open structures. The upper box body (2061) is fixedly connected to the groove on the lower surface of the upper array-type negative ceramic plate (205), and the lower box body (2062) is fixedly connected to the positive ceramic plate adjustment device (8). A notch for passing the metal plate (3) is provided on the upper surface of the lower box body (2062). The wall thickness of the lower box body (2062) is greater than the maximum adjustment distance of the positive ceramic plate adjustment device (8) to prevent the occurrence of poor sealing during the adjustment process.

9. The array current selection processing device for preparing a periodic heterostructure strip according to claim 8, characterized in that: A square groove is provided at the center of the middle support base (1); the positive electrode ceramic plate adjustment device (8) comprises two sets of middle base slide rails (801); the two sets of middle base slide rails (801) are respectively fixedly connected to the two sides of the square groove of the middle support base (1); the middle base slide rails (801) are slidably connected to the upper movable bottom plate (802); the upper movable bottom plate (802) is "L" shaped; the lower box body (2062) is fixedly connected to the upper movable bottom plate (802); the lower array The positive electrode ceramic plate (201) is slidably arranged in the lower box body (2062); a through groove for passing the lower array positive electrode ceramic plate (201) is opened at the center of the upper movable bottom plate (802); a middle base three-axis guide rod cylinder (803) is fixedly connected to one side of the middle support base (1); a piston of the middle base three-axis guide rod cylinder (803) is fixedly connected to the side plate of the upper movable bottom plate (802); and a piston of the middle base three-axis guide rod cylinder (803) is fixedly connected to the side plate of the upper movable bottom plate (802). One side of the middle support base (803) is fixedly connected to two middle base baffles (804) for limiting the upper movable base plate (802); the lower surface of the middle support base (1) is fixedly connected to four lower support columns (805); the other end of the lower support column (805) is fixedly connected to the lower support base (806); one side of the lower support base (806) is fixedly connected to a lower base three-axis guide rod cylinder (807); the upper surface of the lower support base (806) is fixedly connected to two groups of lower bases The slide rail (808) has two lower base baffles (809) fixedly connected to the side of the upper surface of the lower support base (806) away from the lower base three-axis guide rod cylinder (807), which are used to limit the lower movable base plate (810). The lower movable base plate (810) is slidably arranged on the lower base slide rail (808). The lower movable base plate (810) is "L"-shaped, and the side plate of the lower movable base plate (810) is fixedly connected to the piston of the lower base three-axis guide rod cylinder (807).

10. An array current selection processing method for preparing a periodic heterogeneous structure strip based on the array current selection processing device for preparing a periodic heterogeneous structure strip according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, selecting metal plates (3) of different corresponding specifications according to the width of the notch on the upper surface of the lower box (2062), adjusting the positive electrode copper block (202) to a suitable position by adjusting the positive electrode ceramic plate adjustment device (8), so that the ratio of the energized area to the non-energized area meets the processing requirements, thereby forming a heterogeneous structure that meets the requirements; S2, by controlling the lower base micro cylinder (702) in the positive copper block lifting device (7) to lower the positive copper block (202) to a certain height, by controlling the upper support seat cylinder (602) in the negative copper block lifting device (6) to raise the negative copper block (204) to a certain height, and then by using the medium and high pressure oil cylinder (502) to raise the upper array type negative electrode ceramic plate (205) to an appropriate height so that the metal plate (3) can pass through, at which time the lower box body (2062) of the sealing box (206) is separated from the upper box body (2061); S3, using a conveying roller (401) to feed the metal plate (3) into the array pulse current applying device (2), and using a medium-high pressure oil cylinder (502) to lower the upper array negative electrode ceramic plate (205) so that the lower surface of the upper box (2061) is close to the upper surface of the lower box (2062), and according to the previously determined area where the pulse current needs to be passed, the positive electrode copper block (202) is raised by controlling the corresponding lower base micro cylinder (702) in the positive electrode copper block lifting device (7) so that the arc end of the positive electrode copper block (202) is in close contact with the lower surface of the metal plate (3), and the negative electrode copper block (204) is lowered by controlling the corresponding upper support seat cylinder (602) in the negative electrode copper block lifting device (6) so that the arc end of the negative electrode copper block (204) is in close contact with the upper surface of the metal plate (3); S4, using the positive copper block (202) and the negative copper block (204) in the array-type pulse current applying device (2) to apply a pulse current to a local area of ​​the metal plate (3), and regulating the organization and toughness of the metal plate (3) by the pulse current, thereby forming a heterogeneous structure; S5, repeat the above S2 to S4, use the conveyor roller (401) to send out the metal plate (3) that has been electrically treated, and send the next section of untreated metal plate (3) into the array pulse current application device (2) for electrical treatment, until the entire metal plate (3) has completed the electrical treatment, and a qualified metal plate (3) is obtained.

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