Electroplating cavity and wafer electroplating device

Abstract

The invention provides an electroplating cavity and a wafer electroplating device. The electroplating cavity comprises an electroplating cavity body and a groove formed in the periphery of the electroplating cavity body in a surrounding mode, and the groove is used for receiving electroplating liquid overflowing from the electroplating cavity body; and the liquid discharging structure is communicated with the groove and is used for discharging the electroplating liquid exceeding the preset height in the groove. According to the electroplating cavity and the wafer electroplating device, the groove and the liquid discharging structure communicated with the groove are arranged on the periphery of the electroplating cavity body, electroplating liquid overflowing from the electroplating cavity is buffered and discharged, and the electroplating liquid is prevented from overflowing from the electroplating cavity and cannot be discharged in time, so that the electroplating liquid is prevented from being wasted, and the production environment is prevented from being polluted; meanwhile, the phenomenon that the wafer in the electroplating cavity is scrapped and the loss is caused as the wafer electroplating device suddenly stops working due to the fact that the electroplating liquid overflows out of the electroplating cavity can be prevented; and a powerful guarantee is provided for maintaining the normal operation of the system and improving the processing yield of the wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to an electroplating chamber and a wafer electroplating device. Background Art

[0002] In the field of semiconductor manufacturing, electroplating is a common method for depositing metal films on wafers. Especially in advanced packaging technology, electroplating is generally used to form copper pillars, solder bumps, etc. on wafers to achieve chip interconnection due to its advantages of simple process, low cost, and easy mass production.

[0003] The electroplating device used in the electroplating process generally includes an electroplating chamber and a circulation pipeline connected to the electroplating chamber. Figure 1The electroplating device includes: an electroplating chamber body 100' and an electroplating tank 200'. The electroplating chamber body 100' is divided into an anode chamber 101' and a cathode chamber 102' by a membrane frame 300' with an ion membrane. The electroplating tank 200' includes a cathode tank 201' and an anode tank 202', wherein the cathode tank 201' is used to hold a cathode plating solution, and the cathode tank 201' transports the cathode plating solution to the cathode chamber 102' through a first pipeline 2011', and the cathode chamber 102' transports the plating solution back to the cathode tank 201' through a second pipeline 2012' to form a cathode circulation pipeline; the anode tank 202' is used to hold an anode plating solution, and the anode tank 202' transports the anode plating solution to the anode chamber 101' through a third pipeline 2021', and the anode chamber 101' transports the plating solution back to the anode tank 202' through a fourth pipeline 2022' to form an anode circulation pipeline. Each pipeline is provided with a ball valve to control the flow rate on the pipeline. In order to facilitate the second pipeline 2012' to transport the electroplating solution from the cathode chamber 101' back to the cathode tank 201', in actual setting, the cathode chamber 102' includes an inner wall 1021' and a first outer wall 1022'. A groove 1023' is formed between the inner wall 1021' and the first outer wall 1022'. A first liquid discharge port 1024' is provided at the bottom of the groove 1023'. The cathode plating liquid in the cathode cavity 102' flows out through the top of the inner wall 1021' and is collected in the groove 1023', discharged through the first liquid discharge port 1024', and then transported back to the cathode tank 201' through the second pipeline 2012'. When the amount of cathode plating liquid output from the cathode cavity 102' by the second pipeline 2012' is equal to the amount of cathode plating liquid input into the cathode cavity 102' by the first pipeline 2011', the cathode liquid supply system is in a state of dynamic equilibrium. However, it is found in the actual process that once the ball valve on the second pipeline 2012' is stuck at a small opening, the cathode The dynamic equilibrium state of the liquid supply system is broken, that is, the amount of cathode plating liquid output from the cathode chamber 102' by the second pipeline 2012' will be less than the amount of cathode plating liquid input into the cathode chamber 102' by the first pipeline 2011'. At this time, since the plating liquid in the groove 1023' cannot be discharged in time, the cathode plating liquid will quickly fill the groove 1023' and overflow the groove 1023', and flow to the outside of the electroplating device, causing waste of plating liquid and pollution of the production environment. At the same time, when the abnormal situation is monitored outside the machine, an alarm will be immediately issued and the operation will be terminated, and the wafers in the electroplating chamber will also be scrapped, causing losses. Summary of the invention

[0004] In order to prevent the ball valve on the pipeline for transporting the plating liquid from the cathode chamber to the cathode tank from getting stuck at a small opening, causing the plating liquid to overflow from the cathode chamber, resulting in waste of the plating liquid and pollution of the production environment, and at the same time, when the machine monitors an abnormal situation externally, it will immediately alarm and terminate the operation, and the wafer in the plating chamber will also be scrapped, causing losses, the present invention proposes a plating chamber and a wafer plating device.

[0005] On the one hand, the present invention proposes a plating chamber, including a plating chamber body, including: a groove surrounded by the outer periphery of the plating chamber body, used to receive the plating liquid overflowing from the plating chamber body; a drainage structure, connected to the groove, used to discharge the plating liquid in the groove that exceeds a predetermined height.

[0006] According to a specific implementation of the embodiment of the present application, the groove has a first outer wall, and the drainage structure includes a second drainage port, which is opened at a predetermined height of the first outer wall.

[0007] According to a specific implementation of the embodiment of the present application, there are multiple second liquid discharge ports.

[0008] According to a specific implementation of the embodiment of the present application, the second liquid discharge port is connected to one end of the buffer line, the buffer line remains normally open, and a flow sensor is provided on the buffer line, and the flow sensor is configured to monitor the liquid flow in the buffer line.

[0009] According to a specific implementation of the embodiment of the present application, the flow sensor is communicatively connected to the controller, and when the flow sensor detects that liquid is flowing through the buffer line, the controller issues a reminder message.

[0010] According to a specific implementation of the embodiment of the present application, the diameter of the second liquid discharge port is greater than or equal to 1 inch.

[0011] According to a specific implementation of the embodiment of the present application, the other end of the buffer pipeline is connected to the liquid storage tank.

[0012] According to a specific implementation of the embodiment of the present application, the drainage structure includes a buffer groove and a third drainage port arranged at the bottom of the buffer groove, and the buffer groove is arranged at the periphery of the groove.

[0013] According to a specific implementation of the embodiment of the present application, the width of the buffer groove is greater than or equal to 20 mm; the depth of the buffer groove is greater than or equal to 15 mm.

[0014] According to a specific implementation of the embodiment of the present application, the groove has a first outer wall, the buffer groove is arranged around the first outer wall, and the predetermined height is the height of the first outer wall.

[0015] According to a specific implementation of the embodiment of the present application, the buffer groove has a second outer wall, the second outer wall is arranged outside the groove, and the height of the second outer wall is greater than or equal to the height of the first outer wall.

[0016] In a second aspect, the present invention provides an electroplating device, comprising a buffer line, a controller, a liquid storage tank and any one of the above-mentioned electroplating chambers.

[0017] The electroplating chamber and wafer electroplating device of the present invention provide a groove and a drainage structure connected to the groove on the periphery of the electroplating chamber body to buffer and discharge the electroplating liquid overflowing from the electroplating chamber, thereby preventing the electroplating liquid from overflowing from the electroplating chamber and failing to be discharged in time, thereby causing waste of the electroplating liquid and polluting the production environment; at the same time, it can prevent the machine from suddenly terminating the operation of the wafer electroplating device due to the overflow of the electroplating liquid outside the electroplating chamber, thereby causing the wafer in the electroplating chamber to be scrapped and causing losses; thus, it provides a strong guarantee for maintaining the normal operation of the system and improving the processing yield of the wafer;

[0018] Furthermore, by arranging a flow sensor on the buffer pipeline, the flow through the buffer pipeline is monitored, thereby achieving the purpose of monitoring the flow state of the electroplating circulation system, further ensuring the normal operation of the electroplating circulation system;

[0019] Furthermore, by arranging a buffer groove around the outside of the groove, an inner and outer double groove structure is formed, thereby further improving the buffering effect when the electroplating solution overflows.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of an electroplating device is shown;

[0023] Figure 2 A schematic structural diagram of an electroplating device including an electroplating chamber according to Embodiment 1 of the present invention is shown;

[0024] Figure 3 A schematic top view of a local structure of a cathode chamber according to an embodiment of the present invention is shown; and

[0025] Figure 4 A schematic structural diagram of an electroplating device including an electroplating chamber according to Embodiment 2 of the present invention is shown. DETAILED DESCRIPTION

[0026] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0027] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] Example 1

[0033] Please refer to Figure 2 , Figure 2 The schematic diagram of the structure of the electroplating chamber and the electroplating device of the embodiment of the present invention is shown. The electroplating device includes: an electroplating chamber and an electroplating tank 200, wherein the electroplating chamber includes an electroplating chamber body 100. The electroplating chamber body 100 is divided into an anode chamber 101 and a cathode chamber 102 by a membrane frame 300 with an ion membrane. The electroplating tank 200 includes a cathode tank 201 and an anode tank 202, wherein the cathode tank 201 is used to hold a cathode plating solution, the cathode tank 201 transports the cathode plating solution to the cathode chamber 102 through a first pipeline 2011, and the cathode chamber 102 transports the cathode plating solution back to the cathode tank 201 through a second pipeline 2012 to form a cathode circulation pipeline; the anode tank 202 is used to hold an anode plating solution, the anode tank 202 transports the anode plating solution to the anode chamber 101 through a third pipeline 2021, and the anode chamber 101 transports the plating solution back to the anode tank 202 through a fourth pipeline 2022 to form an anode circulation pipeline. Among them, each pipeline is provided with a valve to control the flow rate on the pipeline. Exemplarily, the valve in the embodiment of the present invention selects a ball valve that can control the opening degree and thus control the flow rate. In order to facilitate the second pipeline 2012 to transport the cathode plating solution from the cathode chamber 101 back to the cathode tank 201, in actual setting, the plating chamber of the present application is provided with a groove 1023 on the periphery of the plating chamber body 100, which is used to receive the plating solution overflowing from the plating chamber body 100, and the groove 1023 is connected to a drainage structure. It should be understood that the plating chamber structure in which the groove 1023 is provided outside the plating chamber body 100 in the embodiment of the present invention is also suitable for plating chambers without ion membranes. This embodiment is exemplified by taking the plating chamber provided with an ion membrane as an example.

[0034] In this embodiment, the groove 1023 is arranged around the outside of the cathode chamber 102. Specifically, the cathode chamber 102 includes an inner wall 1021 and a first outer wall 1022. The groove 1023 is formed between the inner wall 1021 and the first outer wall 1022. A first drain port 1024 is provided at the bottom of the groove 1023. The cathode plating liquid in the cathode chamber 102 flows out through the top of the inner wall 1021, is collected in the groove 1023, is discharged through the first drain port 1024, and then is transported back to the cathode tank 201 through the second pipeline 2012. When the amount of cathode plating liquid output from the cathode chamber 102 by the second pipeline 2012 is equal to the amount of cathode plating liquid input into the cathode chamber 102 by the first pipeline 2011, the cathode liquid supply system is in a state of dynamic equilibrium.

[0035] Taking into account that the degree of opening and closing of the valve may fluctuate during the actual process, once the ball valve on the second pipeline 2012 is stuck at a smaller opening, the amount of cathode plating liquid output from the cathode chamber 102 by the second pipeline 2012 will be less than the amount of cathode plating liquid input into the cathode chamber 102 by the first pipeline 2011, that is, the dynamic balance of the cathode liquid supply system will be broken, and the cathode plating liquid will quickly fill the groove 1023 and overflow the groove 1023, flowing to the outside of the electroplating device, causing waste of plating liquid and pollution of the production environment. When the outside of the machine detects that the plating liquid is flowing out, the machine will be directly stopped, and the wafers in the electroplating chamber body 100 will also be scrapped, causing greater losses.

[0036] To this end, an embodiment of the present invention proposes a solution, in which the groove 1023 is connected to a drainage structure that is different from the first drainage port 1024. Exemplarily, the drainage structure is a second drainage port 1025, and the second drainage port 1025 is opened at a predetermined height of the groove 1023. The second drainage port 1025 is connected to a buffer line 1026, and the buffer line 1026 remains normally open. Specifically, when the ball valve located on the second pipeline 2012 is stuck with a very small opening, the electroplating liquid in the groove 1023 cannot flow back to the cathode tank 201 through the second pipeline 2012 in time, and the electroplating liquid in the groove 1023 will quickly gather to a predetermined height. At this time, the second drainage port 1025 can directly drain the electroplating liquid that has reached the predetermined height in time without performing other actions. In order to further ensure that the drainage speed is fast enough, the number of the second drainage ports 1025 can be multiple, and exemplarily, such as Figure 3 As shown, the number of second drain ports 1025 provided in the embodiment of the present invention is 4, and the 4 second drain ports 1025 are provided in a circular array on the first outer wall 1022. Furthermore, the diameter of the second drain ports 1025 is greater than or equal to 1 inch; illustratively, the diameter of the second drain ports 1025 in the embodiment of the present invention is equal to 1.5 inches.

[0037] Furthermore, the other end of the buffer line 1026 is connected to a liquid storage tank for collecting overflowed electroplating solution. It should be understood that the liquid storage tank can be the cathode tank 201, which can directly recover the overflowed electroplating solution to the cathode tank 201 to prevent waste of electroplating solution.

[0038] Furthermore, a flow sensor 1027 is provided on the buffer line 1026 connected to the second liquid discharge port 1025, and the flow sensor 1027 is configured to monitor the liquid flow in the buffer line 1026. The flow sensor 1027 is communicatively connected to a controller (not shown in the figure). When the flow sensor 1027 detects that liquid flows through the buffer line 1026, the controller sends a reminder message to remind the staff to check the ball valve on the second line 2012. It should be understood that once there is liquid in the buffer line 1026, it means that the amount of the plating liquid in the groove 1023 has reached a predetermined height, which further indicates that the amount of the plating liquid output from the cathode chamber 102 by the second line 2012 is less than the amount of the plating liquid input into the cathode chamber 102 by the first line 2011, and the dynamic balance of the cathode circulation system has been broken. At this time, it is necessary to immediately check and adjust the ball valve on the second line 2012 to prompt the cathode circulation system to reach a balanced state again.

[0039] Example 2

[0040] This embodiment provides an electroplating chamber and an electroplating device. Figure 4 The structure of the electroplating chamber and the electroplating device is basically the same as that of the electroplating chamber and the electroplating device in Example 1, except that the drainage structure includes a buffer tank 1028 and a third drainage port 1030 arranged at the bottom of the buffer tank 1028, and the buffer tank 1028 is arranged at the periphery of the groove 1023, and the buffer tank 1028 is communicated with the third drainage port 1030. Specifically, the buffer tank 1028 is arranged at the periphery of the groove 1023 for receiving the electroplating liquid overflowing from the groove 1023, and at this time, the third drainage port 1030 is arranged at the bottom of the buffer tank 1028, and the buffer tank 1028 is communicated with the third drainage port 1030. It should be understood that in this embodiment, the preset height of the second drainage port 1025 is higher than the height of the liquid level in the groove 1023 when the flow state of the electroplating circulation system is in a normal state. Moreover, in this embodiment, the second liquid discharge port 1025 is no longer connected to the buffer pipeline 1026, and only serves to discharge the electroplating liquid exceeding the predetermined height in the groove 1023 into the buffer tank 1028. Figure 4, a second outer wall 1029 is provided on the side of the first outer wall 1022 away from the inner wall 1021, and the above-mentioned buffer groove 1028 is formed between the second outer wall 1029 and the first outer wall 1022. In order to achieve a good buffering effect, the size of the buffer groove 1028 should be as large as possible. For example, the width of the buffer groove 1028 is greater than or equal to 20mm; the depth of the buffer groove 1028 is greater than or equal to 15mm. Exemplarily, the width of the buffer groove 1028 in the embodiment of the present invention is 20mm; the depth of the buffer groove 1028 is at least greater than 15mm. When the depth of the buffer groove 1028 is required to be at least greater than 15mm, the heights of the first outer wall 1022 and the second outer wall 1029 are both at least greater than 15mm. Furthermore, in actual setting, the height of the second outer wall 1029 is set higher than the first outer wall 1022.

[0041] In this embodiment, the buffer groove 1028 and the groove 1023 form an inner and outer double groove structure, which can further improve the buffering effect. Figure 4 In the normal process, as the first pipeline 2011 continuously inputs the plating solution into the cathode chamber 102, the plating solution in the cathode chamber 102 will flow through the top of the inner wall 1021 to reach the groove 1023, and the first liquid discharge port 1024 at the bottom of the groove 1023 will discharge the plating solution at the same flow rate. In this state, the plating solution will not flow into the buffer tank 1028. Once the flow rate on the second pipeline 2012 decreases due to the stuck ball valve, and the flow rate on the first pipeline 2011 remains unchanged, the plating solution in the groove 1023 will continue to accumulate and soon reach the groove 1023. The liquid level of the predetermined height set in 23 reaches the second drain port 1025, and then the plating liquid exceeding the predetermined height is discharged to the buffer tank 1028 through the second drain port 1025, and then discharged through the third drain port 1030 at the bottom of the buffer tank 1028. At this time, the flow sensor 1032 on the buffer line 1031 connected to the third drain port 1030 will detect the flow in the buffer line 1031 and send the information to the controller. The controller sends a reminder message to remind the staff to check the ball valve on the second pipeline 2012.

[0042] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A plating chamber, comprising a plating chamber body, characterized in that: include: A groove arranged around the outer periphery of the electroplating chamber body, used for receiving the electroplating liquid overflowing from the electroplating chamber body; The liquid discharge structure is communicated with the groove and is used for discharging the electroplating liquid exceeding a predetermined height in the groove.

2. The electroplating chamber according to claim 1, characterized in that: The groove has a first outer wall, and the drainage structure includes a second drainage port, which is opened at a predetermined height of the first outer wall.

3. The electroplating chamber according to claim 2, characterized in that: The number of the second liquid discharge ports is plural.

4. The electroplating chamber according to claim 2, characterized in that: The second liquid discharge port is connected to one end of a buffer pipeline, the buffer pipeline is kept normally open, a flow sensor is arranged on the buffer pipeline, and the flow sensor is configured to monitor the liquid flow in the buffer pipeline.

5. The electroplating chamber according to claim 4, characterized in that: The flow sensor is in communication connection with the controller, and when the flow sensor detects that liquid flows through the buffer pipeline, the controller issues a reminder message.

6. The electroplating chamber according to claim 4, characterized in that: The diameter of the second liquid discharge port is greater than or equal to 1 inch.

7. The electroplating chamber according to claim 4, characterized in that: The other end of the buffer pipeline is connected to the liquid storage tank.

8. The electroplating chamber according to claim 1 or 2, characterized in that: The liquid discharge structure comprises a buffer groove and a third liquid discharge port arranged at the bottom of the buffer groove, and the buffer groove is arranged around the periphery of the groove.

9. The electroplating chamber according to claim 8, characterized in that: The width of the buffer groove is greater than or equal to 20 mm; the depth of the buffer groove is greater than or equal to 15 mm.

10. The electroplating chamber according to claim 8, characterized in that: The groove has a first outer wall, the buffer groove is arranged around the periphery of the first outer wall, and the predetermined height is the height of the first outer wall.

11. The electroplating chamber according to claim 10, characterized in that: The buffer groove has a second outer wall, the second outer wall is arranged outside the groove, and the height of the second outer wall is greater than or equal to the height of the first outer wall.

12. An electroplating device, characterized in that: The invention comprises a buffer pipeline, a controller, a liquid storage tank and an electroplating chamber as claimed in any one of claims 1 to 11.

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