Electroplating bath structure capable of horizontally and circularly injecting electroplating liquid

Abstract

The invention relates to an electroplating bath structure for horizontally and circularly injecting electroplating liquid. The electroplating bath structure comprises a bath shell, the bottom partition plate is arranged in the tank shell, and the bottom partition plate is provided with a plurality of reflux inlets; the two side partition plates are matched with the bottom partition plate to be arranged in the tank shell, each side partition plate is provided with a plurality of overflow ports and a plurality of liquid spraying boxes, the outer side face of each liquid spraying box is provided with a liquid inlet, and the inner side face of each liquid spraying box is provided with a plurality of liquid spraying holes. Therefore, the problem that the electroplating liquid circularly injected upwards easily impacts the to-be-electroplated film to cause damage in the prior art is solved, and the effect of horizontally and circularly injecting the electroplating liquid to prevent the to-be-electroplated film from being impacted and damaged is achieved.

Description

Technical Field

[0001] The present invention relates to a plating tank structure for horizontally circulating the plating solution, and in particular to a design in which the film to be plated will not fluctuate up and down and be damaged by impact. Background Art

[0002] The thin film electroplating method is to allow the film to be plated to be horizontally transferred through the plating solution of the plating tank for electroplating. The existing plating solution circulation design for thin film electroplating products generally circulates the plating solution from the bottom of the plating tank to ensure the concentration of the plating solution in the plating tank. However, the plating solution circulated upward from the bottom of the plating tank can easily impact the film to be plated upward, causing the film to be plated to arch upward and collide, causing damage to the film to be plated. Summary of the invention

[0003] In order to solve the problem in the prior art that the plating solution injected in an upward cycle is easy to impact and cause damage to the film to be plated, the present invention provides a plating tank structure for horizontally circulating the plating solution, which has the effect of horizontally circulating the plating solution to avoid impact and damage to the film to be plated; it has the effect of eliminating the vortex suction of the plating solution reflux to avoid impact and damage to the film to be plated.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A plating tank structure for horizontally circulating injection of plating liquid comprises: a tank shell; a bottom baffle plate arranged inside the tank shell, the bottom baffle plate having a plurality of reflux ports; and two side baffle plates arranged inside the tank shell in cooperation with the bottom baffle plate, each of the side baffle plates being provided with a plurality of overflow ports and a plurality of liquid spray boxes, the outer side surface of each liquid spray box being provided with a liquid inlet, and the inner side surface of each liquid spray box being provided with a plurality of liquid spray holes.

[0006] In addition, the bottom partition plate is provided with a plurality of return flow covers at each of the return flow ports between the side partition plates, and the vertical surface of each of the return flow covers has a plurality of return flow holes.

[0007] The beneficial effects of the present invention are that it can horizontally inject the plating solution into the circulation to avoid impact damage to the film to be plated; it can eliminate the vortex suction of the plating solution backflow to avoid impact damage to the film to be plated. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0009] Figure 1 It is a structural appearance diagram of the present invention.

[0010] Figure 2 It is a partial perspective structural appearance diagram of the present invention.

[0011] Figure 3 It is a structural appearance diagram of the present invention in use state.

[0012] Description of the numbers in the figure:

[0013] 10 slot shell

[0014] 20 bottom partition

[0015] 21 Reflux port

[0016] 30 side partition

[0017] 31 Overflow port

[0018] 40 spray box

[0019] 41 Liquid inlet

[0020] 42 spray holes

[0021] 50 Reflux Hood

[0022] 51 Reflux Hole

[0023] 60 Support roller

[0024] 70 Film to be plated DETAILED DESCRIPTION

[0025] First, see Figure 1 to Figure 3 As shown, the present invention includes: a tank shell 10; a bottom partition 20, which is arranged inside the tank shell 10, and the bottom partition 20 has a plurality of reflux ports 21; and two side partitions 30, which are arranged inside the tank shell 10 in cooperation with the bottom partition 20, and each of the side partitions 30 is provided with a plurality of overflow ports 31 and a plurality of spray boxes 40, and each of the outer side surfaces of the spray boxes 40 has a liquid inlet 41, and each of the inner side surfaces of the spray boxes 40 has a plurality of spray holes 42, and the bottom partition 20 is provided with a plurality of reflux covers 50 relative to each of the reflux ports 21 between the side partitions 30, and each of the upright surfaces of the reflux covers 50 has a plurality of reflux holes 51.

[0026] Based on the above structure, the two side partitions 30 of the present invention can provide a plurality of support rollers 60 for horizontal installation, and the film to be plated 70 is supported by the plurality of support rollers 60, and the plating liquid is circulated and injected through the plurality of spray holes 42 of the plurality of spray boxes 40, so that the plating liquid only flows horizontally around the film to be plated 70, and the plurality of spray holes 42 are used to disperse and reduce the flow intensity of the injected plating liquid, so that the circulating flow of the plating liquid has a very small impact on the film to be plated 70, and the film to be plated 70 will not fluctuate up and down, but can be plated very smoothly; therefore, the present invention has the effect of horizontally circulating the plating liquid to avoid impact damage to the film to be plated.

[0027] In addition, the plating liquid injected into the tank shell 10 by the plurality of liquid spray boxes 40 can circulate back to the liquid inlet 41 of the plurality of liquid spray boxes 40 through the plurality of reflux ports 21 of the bottom partition 20 and the plurality of overflow ports 31 of the side partition 30 and circulate repeatedly; wherein, the plurality of reflux covers 50 arranged at each reflux port 21 between the two side partitions 30 can suppress the plating liquid from generating a reflux vortex, eliminate the vortex suction force, and prevent the film 70 to be plated from being damaged by the ups and downs thereof; therefore, the present invention also has the effect of eliminating the reflux vortex suction force of the plating liquid to prevent the film to be plated from being damaged by the impact thereof.

[0028] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A plating tank structure for horizontally circulating injection of plating solution, characterized in that: include: Tank shell; A bottom baffle plate is arranged inside the tank shell, and the bottom baffle plate has a plurality of reflux ports; as well as Two side baffles are arranged inside the tank shell in cooperation with the bottom baffle. Each of the side baffles is provided with a plurality of overflow ports and a plurality of liquid spray boxes. The outer side surface of each liquid spray box has a liquid inlet, and the inner side surface of each liquid spray box has a plurality of liquid spray holes.

2. The electroplating tank structure for horizontally circulating injection of electroplating solution according to claim 1 is characterized in that: The bottom baffle plate is provided with a plurality of return flow covers at each return flow opening between each of the side baffle plates, and the vertical surface of each return flow cover has a plurality of return flow holes.

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