Height-adaptive double-sided radio frequency chip performance test fixture

Abstract

The invention provides a height-adaptive double-sided radio frequency chip performance test fixture. The height-adaptive double-sided radio frequency chip performance test fixture comprises an upper test assembly and a lower test assembly, the upper test assembly comprises an upper seat, an upper mounting groove, an upper connecting groove and an upper limiting frame. Through unique upper and lower test assembly structures, such as cooperative operation of each part in a groove and assistance of an elastic gasket, accurate alignment and stable compression of front and back test probes during double-sided chip test are ensured, the problems of alignment precision and compression strength are solved, and meanwhile, the test efficiency is improved for poor chip flatness, inclination and substrate height difference. Slidable conductor connecting blocks and elastic gaskets in the upper test assembly and the lower test assembly can be adjusted in a self-adaptive mode, good contact is guaranteed, the error test rate is reduced, and the test consistency and accuracy are improved. Through the principles of thread transmission and the like in the height adjusting assembly and in cooperation with various limiting and buffering structures, accurate and stable height adjustment is achieved, the clamp is adaptive to chip specifications of different thicknesses, the universality and the use flexibility of the clamp are enhanced, and the cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of chip testing, and in particular to a double-sided radio frequency chip performance testing fixture with an adaptive height. Background Art

[0002] Due to the rapid development and breakthrough of semiconductor technology, RF highly integrated circuits are widely used because of their small size and light weight. The original modular RF transceiver components or multi-channel amplifier phase shifters and other RF devices, and the digital-to-analog conversion part are also packaged into RF chips through semiconductor technology. Due to the large number of chip functions, a single-layer layout can no longer meet the requirements. Under this premise, multi-layer stacking or single-layer double-sided chips are born, which have very obvious advantages in terms of volume and cost of use, greatly reducing the volume and weight of the whole equipment, reducing the power consumption of the whole machine, and having higher reliability. At the same time, many process assembly steps can be reduced. The stacked chip is a double-sided structure, that is, there are test points on both the front and back sides. The antenna can be directly mounted on the top of the stacked double-sided chip, which has great advantages in space and cost, and the reliability is also very high. It is the current mainstream development of RF components, but it also brings the following problems; 1. The stacked double-sided chip test has two sides, front and back, and the alignment accuracy and clamping force required during the test are very high. The fixtures currently on the market cannot solve this problem. Second, due to process reasons, the stacked double-sided chips have poor flatness from top to bottom and may be tilted. The double-sided fixtures currently on the market do not have the function of automatically adapting to tilt and height difference, resulting in poor contact and poor test consistency, with a test mismeasurement rate of 50%; 3. The chip substrate has height differences, which makes it impossible for the existing probe fixture to make good contact with the uneven substrate; Therefore, a double-sided RF chip performance test fixture with adaptive height is proposed. Summary of the invention

[0003] In view of this, the present invention hopes to provide a double-sided RF chip performance test fixture with adaptive height to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0004] The technical solution of the embodiment of the present invention is implemented as follows: a double-sided radio frequency chip performance test fixture with an adaptive height, comprising an upper test component and a lower test component; The upper test assembly comprises an upper seat, an upper mounting groove, an upper connecting groove, an upper limit groove, a first conductor connecting block, a second conductor connecting block, an upper elastic conductive gasket and an upper limit frame; an upper mounting groove is provided at the center of the upper surface of the upper seat, an upper connecting groove is provided in the middle of the inner side wall of the upper mounting groove, upper limit grooves are provided at the front and rear of both sides of the inner bottom wall of the upper connecting groove, the inner side wall of the upper limit groove is slidably connected with the first conductor connecting block, the second conductor connecting block is provided at the bottom center of the first conductor connecting block, the bottom of the second conductor connecting block passes through the center of the inner bottom wall of the upper limit groove, the inner side wall of the upper connecting groove is fittedly connected with an upper elastic conductive gasket, the outer side of the upper surface center of the first conductor connecting block is fittedly connected to the lower surface of the upper elastic conductive gasket, the inner bottom wall of the upper mounting groove is fixedly connected with the upper limit frame, and the upper surface of the upper elastic conductive gasket is fittedly connected to the lower surface of the upper limit frame; The lower test assembly comprises a lower seat, a lower mounting groove, a lower connecting groove, a lower limiting groove, a third conductor connecting block, a fourth conductor connecting block, a lower elastic conductive gasket and a lower limiting frame; a lower mounting groove is provided at the center of the lower surface of the lower seat, a lower connecting groove is provided in the middle of the inner top wall of the lower mounting groove, lower limiting grooves are provided at the front and rear of the inner top wall of the lower connecting groove, the inner side wall of the lower limiting groove is slidably connected with the third conductor connecting block, a fourth conductor connecting block is provided at the top center of the third conductor connecting block, the top of the fourth conductor connecting block passes through the center of the inner top wall of the lower limiting groove, the inner side wall of the lower connecting groove is fitted and connected with the lower elastic conductive gasket, the outer side of the lower surface center of the third conductor connecting block is fitted and connected to the upper surface of the lower elastic conductive gasket, the inner bottom wall of the lower mounting groove is fixedly connected with the lower limiting frame, and the lower surface of the lower elastic conductive gasket is fitted and connected to the upper surface of the lower limiting frame.

[0005] Further preferably, an upper test groove is opened at the center of the lower surface of the upper seat, the inner wall of the upper test groove is fixedly connected to the upper test seat, the bottom of the second conductor connecting block passes through the top of the upper test seat, and a plurality of upper test probes are arranged in the middle of the lower surface of the upper test seat and the bottom of the second conductor connecting block.

[0006] Further preferably, a lower test groove is opened on the upper surface of the lower seat, the inner side wall of the lower test groove is fixedly connected with the lower test seat, the top of the fourth conductor connecting block passes through the bottom of the lower test seat, and a plurality of lower test probes are arranged on the middle part of the inner bottom wall of the lower test seat and the top of the fourth conductor connecting block, and a chip limiting frame is fixedly connected to the outer side of the inner bottom wall of the lower test seat.

[0007] Further preferably, a height adjustment assembly is arranged on the top of the upper test assembly; the height adjustment assembly comprises an upper connecting seat, a threaded hole, a threaded cylinder, an adjusting knob, a limiting slide groove, a limiting slide column, an adjusting seat, a limiting slide hole, a first spring, a limiting head, a circular groove, a limiting pin and a connecting hole; A threaded hole is provided at the center of the upper surface of the upper connecting seat, and the inner side wall of the threaded hole is rotatably connected to a threaded cylinder, and the top of the threaded cylinder is fixedly connected to an adjusting knob, and a limited sliding groove is provided at the bottom of the upper connecting seat, and limited sliding columns are provided at the four corners of the inner top wall of the limited sliding groove, and the inner side wall of the limited sliding groove is slidably connected to the adjusting seat, and the four corners of the upper surface of the adjusting seat are provided with limited sliding holes, and the outer side wall of the limited sliding column is slidably connected to the inner side wall of the limited sliding hole, and the lower part of the outer side wall of the limited sliding column is sleeved with a first spring, and the first spring The top of the spring is fitted and connected to the bottom of the adjusting seat near the outside of the limiting sliding hole, the bottom of the limiting sliding column is welded with a limiting head, the bottom of the first spring is fitted and connected to the upper surface of the limiting head near the outside of the limiting sliding column, a circular groove is opened at the center of the upper surface of the adjusting seat, the outer bottom of the threaded tube is rotatably connected to the inner side wall of the circular groove, the front and rear parts of both sides of the lower surface of the adjusting seat are fixedly connected to the limiting pins, and the four corners of the upper surface of the upper seat are provided with connecting holes, and the outer side wall of the limiting pin is slidably connected to the inner side wall of the connecting hole.

[0008] Further preferably, upper limit holes are opened on both sides of the front and rear portions of the lower surface of the adjustment seat, lower limit holes are opened on both sides of the front and rear portions of the upper surface of the upper seat, the inner bottom wall of the lower limit hole is fit-connected with a second spring, and the top of the second spring is fit-connected to the inner top wall of the upper limit hole.

[0009] Further preferably, the outer side wall of the lower seat is fixedly connected to a lower connecting seat, the bottom of the lower connecting seat is fixedly connected to a test box, and the bottom of the test box is fixedly connected to a base.

[0010] Further preferably, the rear portion of the upper surface of the lower connecting seat is hinged to the rear portion of the lower surface of the upper connecting seat through a pin.

[0011] Further preferably, lower test connectors are provided at the front and rear of both sides of the test box.

[0012] Further preferably, brackets are fixedly connected to both sides of the upper connecting seat, and upper test connectors are provided at the front and rear of both sides of the bracket.

[0013] Further preferably, a lock buckle is installed in the middle of the front surface of the upper connecting seat.

[0014] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution: 1. The present invention uses a unique upper and lower test assembly structure, such as the coordinated operation of various components in the groove and the assistance of elastic gaskets, to ensure that the test probes on both sides of the double-sided chip are accurately aligned and stably pressed during the double-sided chip test, thereby solving the problems of alignment accuracy and pressing force. At the same time, in view of the poor flatness, tilt and height difference of the chip, the slidable conductor connection blocks and elastic gaskets in the upper and lower test assemblies can be adaptively adjusted to ensure good contact, reduce the false detection rate, and improve the test consistency and accuracy; 2. The present invention uses the principles of threaded transmission and other principles through a height adjustment component, and cooperates with a variety of limit and buffer structures to achieve precise and stable height adjustment, adapt to chip specifications of different thicknesses, enhance the versatility and flexibility of the fixture, and reduce costs.

[0015] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is the overall structure diagram of the present invention; Figure 2 This is a structural diagram of the upper connecting seat of the present invention; Figure 3 This is a structural diagram of the height adjustment component of the present invention; Figure 4 For the present invention Figure 3 Another perspective structure diagram; Figure 5 This is a structural diagram of the upper test assembly of the present invention; Figure 6 For the present invention Figure 5 Another perspective structure diagram; Figure 7 This is a structural diagram of the split lower test component of the present invention; Figure 8 For the present invention Figure 7 Another perspective structure diagram.

[0018] Figure numerals: 1, upper test assembly; 10, upper seat; 11, upper mounting groove; 12, upper connection groove; 13, upper limit groove; 14, first conductor connection block; 15, second conductor connection block; 16, upper elastic conductive gasket; 17, upper limit frame; 18, upper test groove; 19, upper test seat; 20, upper test probe; 2, lower test assembly; 21, lower seat; 22, lower mounting groove; 23, lower connection groove; 24, lower limit groove; 25, third conductor connection block; 26, fourth conductor connection block; 27, lower elastic conductive gasket; 28, lower limit frame; 29, lower test groove; 30, lower test Test seat; 31. lower test probe; 32. chip limit frame; 33. lower connecting seat; 34. test box; 35. base; 36. pin; 37. lower test joint; 38. bracket; 39. upper test joint; 4. height adjustment assembly; 40. upper connecting seat; 41. threaded hole; 42. threaded cylinder; 43. adjustment knob; 44. limit slide groove; 45. limit slide column; 46. adjustment seat; 47. limit slide hole; 48. first spring; 49. limit head; 50. circular groove; 51. limit pin; 52. connecting hole; 53. upper limit hole; 54. lower limit hole; 55. second spring; 56. lock. DETAILED DESCRIPTION

[0019] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0020] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0021] Embodiment 1 like Figure 1-Figure 8 As shown, an embodiment of the present invention provides a double-sided radio frequency chip performance test fixture with an adaptive height, comprising an upper test component 1 and a lower test component 2; The upper test assembly 1 includes an upper seat 10, an upper mounting groove 11, an upper connecting groove 12, an upper limit groove 13, a first conductor connecting block 14, a second conductor connecting block 15, an upper elastic conductive gasket 16 and an upper limit frame 17; an upper mounting groove 11 is provided at the center of the upper surface of the upper seat 10, an upper connecting groove 12 is provided in the middle of the inner side wall of the upper mounting groove 11, upper limit grooves 13 are provided at the front and rear of both sides of the inner bottom wall of the upper connecting groove 12, the inner side wall of the upper limit groove 13 is slidably connected to the first conductor connecting block 14, and a first conductor connecting block 14 is provided at the bottom center A second conductor connection block 15 is arranged, the bottom of the second conductor connection block 15 passes through the center of the inner bottom wall of the upper limit groove 13, the inner side wall of the upper connection groove 12 is fitted with an upper elastic conductive gasket 16, the outer side of the upper surface center of the first conductor connection block 14 is fitted with the lower surface of the upper elastic conductive gasket 16, the inner bottom wall of the upper mounting groove 11 is fixedly connected with an upper limit frame 17, and the upper surface of the upper elastic conductive gasket 16 is fitted with the lower surface of the upper limit frame 17; an upper mounting groove 11 is opened at the center of the upper surface of the upper seat 10, and this groove is the upper limit for the installation of subsequent components The frame 17 provides space and positioning basis, an upper connecting groove 12 is opened in the middle of the inner side wall of the upper mounting groove 11, which is used to accommodate the upper elastic conductive gasket 16, and upper limit grooves 13 are opened at the front and rear of the inner bottom wall of the upper connecting groove 12 on both sides, and the inner side wall of the upper limit groove 13 is slidably connected with a first conductor connecting block 14, so that the first conductor connecting block 14 can slide within a certain range in the upper limit groove 13 to adapt to different situations, and a second conductor connecting block 15 is arranged at the bottom center of the first conductor connecting block 14, and the bottom of the second conductor connecting block 15 runs through At the center of the inner bottom wall of the upper positioning groove 13, this structure is beneficial to signal conduction and adaptation to the chip surface conditions during the test process. The inner wall of the upper connecting groove 12 is fitted with an upper elastic conductive gasket 16. The outer side of the upper surface center of the first conductor connecting block 14 is fitted with the lower surface of the upper elastic conductive gasket 16. The upper elastic conductive gasket 16 can produce elastic deformation according to contact pressure, etc., to play a role in buffering, adapting to chip surface differences and maintaining contact stability. The upper positioning frame 17 is used to limit the position of the upper elastic conductive gasket 16 to ensure the stability and reliability of the structure.

[0022] The lower test assembly 2 includes a lower seat 21, a lower mounting groove 22, a lower connecting groove 23, a lower limiting groove 24, a third conductor connecting block 25, a fourth conductor connecting block 26, a lower elastic conductive gasket 27 and a lower limiting frame 28; a lower mounting groove 22 is provided at the center of the lower surface of the lower seat 21, a lower connecting groove 23 is provided in the middle of the inner top wall of the lower mounting groove 22, lower limiting grooves 24 are provided at the front and rear of the inner top wall of the lower connecting groove 23, and the inner side wall of the lower limiting groove 24 is slidably connected to the third conductor connecting block 25 A fourth conductor connection block 26 is provided at the top center of the third conductor connection block 25, the top of the fourth conductor connection block 26 passes through the center of the inner top wall of the lower limiting groove 24, the inner side wall of the lower connection groove 23 is fitted and connected with a lower elastic conductive gasket 27, the outer side of the lower surface center of the third conductor connection block 25 is fitted and connected to the upper surface of the lower elastic conductive gasket 27, the inner bottom wall of the lower installation groove 22 is fixedly connected with a lower limiting frame 28, and the lower surface of the lower elastic conductive gasket 27 is fitted and connected to the upper surface of the lower limiting frame 28; A fourth conductor connection block 26 is provided at the top center of the third conductor connection block 25. The top of the fourth conductor connection block 26 passes through the center of the inner top wall of the lower limiting groove 24, which is convenient for signal transmission and adapting to the lower surface of the chip. The inner side wall of the lower connection groove 23 is bonded and connected with a lower elastic conductive gasket 27. The outer side of the lower surface center of the third conductor connection block 25 is bonded and connected to the upper surface of the lower elastic conductive gasket 27. The lower elastic conductive gasket 27 adapts to the unevenness and pressure changes of the lower surface of the chip. The lower limiting frame 28 limits and supports the lower elastic conductive gasket 27.

[0023] In one embodiment, specifically: an upper test groove 18 is opened at the center of the lower surface of the upper seat 10, and the inner wall of the upper test groove 18 is fixedly connected to the upper test seat 19, the bottom of the second conductor connection block 15 passes through the top of the upper test seat 19, and a plurality of upper test probes 20 are arranged in the middle of the lower surface of the upper test seat 19 and the bottom of the second conductor connection block 15; the bottom of the second conductor connection block 15 passes through the top of the upper test seat 19 and passes through a certain distance from the bottom of the upper test seat 19, and a plurality of upper test probes 20 are arranged in the middle of the lower surface of the upper test seat 19 and the bottom of the second conductor connection block 15, and the upper test probes 20 are used to contact the test points on the upper surface of the chip to realize signal input and output and perform chip performance testing.

[0024] In one embodiment, specifically: a lower test groove 29 is opened on the upper surface of the lower seat 21, and a lower test seat 30 is fixedly connected to the inner wall of the lower test groove 29, the top of the fourth conductor connection block 26 passes through the bottom of the lower test seat 30, and a plurality of lower test probes 31 are arranged in the middle of the inner bottom wall of the lower test seat 30 and the top of the fourth conductor connection block 26, and a chip limiting frame 32 is fixedly connected to the outer side of the inner bottom wall of the lower test seat 30; the top of the fourth conductor connection block 26 passes through the bottom of the lower test seat 30 and passes through a certain distance from the top of the lower test seat 30, and a plurality of lower test probes 31 are arranged in the middle of the inner bottom wall of the lower test seat 30 and the top of the fourth conductor connection block 26, and the lower test probes 31 contact with the test points on the lower surface of the chip for testing, and a chip limiting frame 32 is fixedly connected to the outer side of the inner bottom wall of the lower test seat 30, and the chip limiting frame 32 is used to position the chip when placing the chip to ensure that the chip can be accurately in the test position so that the test points on the lower surface of the chip correspond correctly to the lower test probes 31.

[0025] In one embodiment, specifically: a height adjustment component 4 is arranged on the top of the upper test component 1; the height adjustment component 4 includes an upper connecting seat 40, a threaded hole 41, a threaded cylinder 42, an adjusting knob 43, a limiting slide groove 44, a limiting slide column 45, an adjusting seat 46, a limiting slide hole 47, a first spring 48, a limiting head 49, a circular groove 50, a limiting nail 51 and a connecting hole 52; A threaded hole 41 is provided at the center of the upper surface of the upper connecting seat 40, and a threaded cylinder 42 is rotatably connected to the inner side wall of the threaded hole 41, and an adjusting knob 43 is fixedly connected to the top of the threaded cylinder 42. A limited sliding groove 44 is provided at the bottom of the upper connecting seat 40, and a limited sliding column 45 is provided at the four corners of the inner top wall of the limited sliding groove 44. An adjusting seat 46 is slidably connected to the inner side wall of the limited sliding groove 44. A limited sliding hole 47 is provided at the four corners of the upper surface of the adjusting seat 46, and the outer side wall of the limited sliding column 45 is slidably connected to the inner side wall of the limited sliding hole 47. A first spring 48 is sleeved on the lower part of the outer side wall of the limited sliding column 45. The first spring 48 The top of the adjusting seat 46 is fitted and connected to the bottom of the adjusting seat 46 near the outer side of the limiting sliding hole 47, the bottom of the limiting sliding column 45 is welded with a limiting head 49, the bottom of the first spring 48 is fitted and connected to the upper surface of the limiting head 49 near the outer side of the limiting sliding column 45, a circular groove 50 is opened at the center of the upper surface of the adjusting seat 46, the outer bottom of the threaded tube 42 is rotatably connected to the inner side wall of the circular groove 50, the front and rear parts of both sides of the lower surface of the adjusting seat 46 are fixedly connected to the limiting nails 51, the four corners of the upper surface of the upper seat 10 are provided with connecting holes 52, and the outer side wall of the limiting nail 51 is slidably connected to the inner side wall of the connecting hole 52; The top of the threaded tube 42 is fixedly connected with an adjusting knob 43, and rotating the adjusting knob 43 can drive the threaded tube 42 to rotate. A limited sliding groove 44 is provided at the bottom of the upper connecting seat 40, and limited sliding columns 45 are provided at the four corners of the inner top wall of the limited sliding groove 44. The inner side wall of the limited sliding groove 44 is slidably connected with an adjusting seat 46, and limited sliding holes 47 are provided at the four corners of the upper surface of the adjusting seat 46. The outer side wall of the limited sliding column 45 is slidably connected to the inner side wall of the limited sliding hole 47. This structure limits the movement direction of the adjusting seat 46, so that it can only move up and down along the limited sliding groove 44, and maintains the position during the movement. Stable; the first spring 48 plays a role of buffering and auxiliary positioning, providing elastic force when the adjusting seat 46 moves; the outer bottom of the threaded cylinder 42 is rotatably connected to the inner wall of the circular groove 50. This connection method enables the threaded cylinder 42 to drive the adjusting seat 46 to move up and down when it rotates; the front and rear parts of both sides of the lower surface of the adjusting seat 46 are fixedly connected to the limiting pins 51, and the four corners of the upper surface of the upper seat 10 are provided with connecting holes 52. The outer wall of the limiting pin 51 is slidably connected to the inner wall of the connecting hole 52, which further enhances the stability of the connection between the adjusting seat 46 and the upper seat 10 and the accuracy of the movement.

[0026] In one embodiment, specifically: upper limit holes 53 are provided on both sides of the front and rear of the lower surface of the adjustment seat 46, lower limit holes 54 are provided on both sides of the front and rear of the upper surface of the upper seat 10, the inner bottom wall of the lower limit hole 54 is fitted with a second spring 55, and the top of the second spring 55 is fitted with the inner top wall of the upper limit hole 53. The upper limit hole 53, the lower limit hole 54 and the second spring 55 play an auxiliary limiting and buffering role during the height adjustment process to prevent excessive adjustment or damage to components due to unexpected circumstances, and also help to maintain the relative stability of the structure during the test.

[0027] In one embodiment, specifically: the outer wall of the lower seat 21 is fixedly connected to a lower connecting seat 33, the bottom of the lower connecting seat 33 is fixedly connected to a test box 34, the bottom of the test box 34 is fixedly connected to a base 35, the lower connecting seat 33 acts as a bridge connecting the lower seat 21 with other components, the test box 34 fixedly connected to the bottom of the lower connecting seat 33 is used to accommodate some test circuits, control equipment, etc., and works together with the entire test fixture, the base 35 fixedly connected to the bottom of the test box 34 provides a stable support foundation for the entire test fixture, ensuring that the fixture will not shake or shift during the test process.

[0028] In one embodiment, specifically: the rear portion of the upper surface of the lower connecting seat 33 is hinged to the rear portion of the lower surface of the upper connecting seat 40 through a pin shaft 36. This hinged structure enables the upper connecting seat 40 to rotate relative to the lower connecting seat 33, making it convenient to open the fixture to place the chip before testing, and to open the fixture to take out the chip after the test is completed.

[0029] In one embodiment, specifically: lower test connectors 37 are provided on both sides of the front and rear of the test box 34, and the lower test connectors 37 are used to connect external test equipment or transmit test signals, and work together with the lower test probes 31 on the lower test seat 30 to realize the transmission of test signals for chip performance.

[0030] In one embodiment, specifically: brackets 38 are fixedly connected to both sides of the upper connecting seat 40, and upper test connectors 39 are provided at the front and rear of both sides of the brackets 38. The upper test connectors 39 are also used to connect external test equipment or transmit test signals, and cooperate with the upper test probes 20 on the upper test seat 19 to complete signal interaction during the chip performance test.

[0031] In one embodiment, specifically: a lock 56 is installed in the middle of the front surface of the upper connecting seat 40, and the lock 56 can lock the upper connecting seat 40 and the lower connecting seat 33 together after the clamp is closed, preventing the clamp from opening due to unexpected circumstances during the test, thereby ensuring the safety and stability of the test.

[0032] Embodiment 2 This embodiment provides a use process of a double-sided RF chip performance test fixture with an adaptive height: The RF chip to be tested is accurately placed on the lower test seat 30 of the lower test component 2. The chip limit frame 32 fixed on the outer side of the inner bottom wall of the lower test seat 30 can position the chip to ensure that the chip can be accurately in the test position, so that the test point on the chip corresponds to the lower test probe 31 of the lower test seat 30, and prepare for the subsequent good contact test. The clamp is closed by rotating the upper connecting seat 40 along the pin shaft 36, and the relative position relationship between the upper test component 1 and the RF chip is observed. If it is found that the distance between the two is not appropriate in the initial state, which may affect the subsequent accurate contact between the upper test probe 20 and the test point on the upper surface of the chip and the lower test probe 31 and the test point on the lower surface of the chip, the height needs to be adjusted; The height of the upper test assembly 1 is adjusted by turning the adjusting knob 43 in the height adjustment assembly 4. Specifically, the adjusting knob 43 is fixedly connected to the threaded cylinder 42. When the adjusting knob 43 is turned, the threaded cylinder 42 rotates in the threaded hole 41 of the upper connecting seat 40. Since the outer bottom of the threaded cylinder 42 is rotatably connected to the circular groove 50 of the adjusting seat 46, during the rotation of the threaded cylinder 42, the adjusting seat 46 will be driven to move up and down relative to the upper connecting seat 40. During the movement of the adjusting seat 46, the limiting sliding holes 47 at its four corners cooperate with the limiting sliding column 45 penetrating the limiting sliding groove 44 at the bottom of the upper connecting seat 40. The outer wall of the limiting sliding column 45 slides in the limiting sliding hole 47 to ensure the directional stability of the movement of the adjusting seat 46. At the same time, the lower part of the outer wall of the limiting sliding column 45 is sleeved The first spring 48 will expand and contract with the movement of the adjustment seat 46, playing a role of buffering and auxiliary positioning. The limiting nails 51 fixedly connected to the front and rear of both sides of the lower surface of the adjustment seat 46 slide in the connecting holes 52 of the upper seat 10, further ensuring the smooth movement of the adjustment seat 46. In addition, the upper limit holes 53 opened on the front and rear sides of the lower surface of the adjustment seat 46 and the lower limit holes 54 opened on the front and rear sides of the upper surface of the upper seat 10 and the second spring 55 therebetween also play a certain limiting and buffering role in the height adjustment process to prevent excessive adjustment or abnormal shaking; continue to turn the adjustment knob 43 until the upper test assembly 1 reaches a suitable height, so that the upper test probe 20 can accurately correspond to the test point on the upper surface of the chip and can maintain a good contact state after closing the fixture; After completing the height adjustment, the clamp is closed by rotating the upper connection seat 40 along the pin shaft 36, so that the upper test component 1 moves downward to contact the chip placed on the lower test component 2. When the upper test seat 19 at the center of the lower surface of the upper seat 10 is pressed down along with the upper test component 1, the multiple upper test probes 20 arranged in the middle of the lower surface of the upper test seat 19 and the bottom of the second conductor connection block 15 will contact the test points on the upper surface of the chip; in this contact process, the structure in the upper mounting groove 11 plays an adaptive role, and the first conductor connection block 14 slidingly connected in the upper limit groove 13 can be adjusted according to the chip. The position of the chip is adjusted by sliding in the groove according to the flatness and height difference of the chip surface, and the second conductor connection block 15 at the bottom center can accurately transmit the signal to the upper test probe 20 connected thereto; at the same time, the upper elastic conductive gasket 16 connected to the inner wall of the upper connection groove 12 will produce elastic deformation according to the contact pressure and the chip surface conditions. On the one hand, it ensures that the upper test probe 20 maintains good and stable contact with the test point on the chip surface through elastic force, and on the other hand, it can adapt to the possible inclination or height difference of the chip surface, so as to avoid test errors caused by poor contact; At the same time, the lower test seat 30 on the upper surface of the lower seat 21 also maintains good contact with the test points on the lower surface of the chip through the multiple lower test probes 31 arranged in the middle of its inner bottom wall and the top of the fourth conductor connection block 26. The chip limit frame 32 fixed on the outer side of the inner bottom wall of the lower test seat 30 not only plays a positioning role when the chip is placed, but also helps to maintain the stable position of the chip during the test contact process, ensuring the accurate contact between the lower test probe 31 and the test point on the lower surface of the chip; the structure in the lower mounting groove 22 also plays an adaptive role, the third conductor connection block 25 can slide in the lower limit groove 24 to adapt to the situation of the lower surface of the chip, and the lower elastic conductive gasket 27 will produce elastic deformation according to the contact pressure, ensuring the good contact and signal conduction between the lower test probe 31 and the test point on the lower surface of the chip; When the upper and lower test components have achieved good contact with the chip, the test signal can be input into the chip and the signal fed back by the chip can be received through the lower test connectors 37 on both sides of the test box 34 connected by the lower connecting seat 33 and the upper test connectors 39 on the brackets 38 on both sides of the upper connecting seat 40, thereby officially starting the test of the RF chip performance. During the test, due to the special structural design of the upper and lower test components, even if the chip has certain flatness problems, substrate height differences, etc., the accuracy and stability of the test can still be guaranteed to avoid mismeasurement caused by poor contact.

[0033] After the test is completed, the clamp is opened by rotating the upper connecting seat 40 along the pin shaft 36, and the tested chip is taken out from the lower test seat 30, and the test process of the next chip can be carried out. During the separation process, the upper elastic conductive gasket 16 and the lower elastic conductive gasket 27 will return to their initial state, thereby pushing the second conductor connecting block 15 and the fourth conductor connecting block to reset and prepare for the next test.

[0034] Through the above test process, the adaptive height RF chip performance test fixture can effectively solve the problems faced by stacked double-sided chips during the test process, such as alignment accuracy, loose force, adaptability to tilt and height difference, and realize accurate and stable testing of RF chip performance.

[0035] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A double-sided RF chip performance test fixture with adaptive height, characterized by: It comprises an upper test component (1) and a lower test component (2); The upper test assembly (1) comprises an upper seat (10), an upper mounting groove (11), an upper connecting groove (12), an upper limit groove (13), a first conductor connection block (14), a second conductor connection block (15), an upper elastic conductive gasket (16) and an upper limit frame (17); an upper mounting groove (11) is provided at the center of the upper surface of the upper seat (10), an upper connecting groove (12) is provided in the middle of the inner side wall of the upper mounting groove (11), upper limit grooves (13) are provided at the front and rear of both sides of the inner bottom wall of the upper connecting groove (12), and the inner side wall of the upper limit groove (13) is slidably connected to the first conductor connection block (14). A block (14), a second conductor connection block (15) is arranged at the bottom center of the first conductor connection block (14), the bottom of the second conductor connection block (15) passes through the center of the inner bottom wall of the upper limit groove (13), the inner side wall of the upper connection groove (12) is fitted and connected with an upper elastic conductive gasket (16), the outer side of the center of the upper surface of the first conductor connection block (14) is fitted and connected to the lower surface of the upper elastic conductive gasket (16), the inner bottom wall of the upper installation groove (11) is fixedly connected with an upper limit frame (17), and the upper surface of the upper elastic conductive gasket (16) is fitted and connected to the lower surface of the upper limit frame (17); The lower test assembly (2) comprises a lower seat (21), a lower mounting groove (22), a lower connecting groove (23), a lower limiting groove (24), a third conductor connecting block (25), a fourth conductor connecting block (26), a lower elastic conductive gasket (27) and a lower limiting frame (28); a lower mounting groove (22) is provided at the center of the lower surface of the lower seat (21); a lower connecting groove (23) is provided at the middle of the inner top wall of the lower mounting groove (22); lower limiting grooves (24) are provided at the front and rear of the inner top wall of the lower connecting groove (23); and the inner side wall of the lower limiting groove (24) is slidably connected to the third conductor connecting block. (25), a fourth conductor connection block (26) is arranged at the top center of the third conductor connection block (25), the top of the fourth conductor connection block (26) passes through the center of the inner top wall of the lower limit groove (24), the inner side wall of the lower connection groove (23) is fitted and connected with a lower elastic conductive gasket (27), the outer side of the lower surface center of the third conductor connection block (25) is fitted and connected to the upper surface of the lower elastic conductive gasket (27), the inner bottom wall of the lower mounting groove (22) is fixedly connected with a lower limit frame (28), and the lower surface of the lower elastic conductive gasket (27) is fitted and connected to the upper surface of the lower limit frame (28).

2. The double-sided RF chip performance test fixture with adaptive height according to claim 1, characterized in that: An upper test groove (18) is provided at the center of the lower surface of the upper seat (10); an upper test seat (19) is fixedly connected to the inner wall of the upper test groove (18); the bottom of the second conductor connection block (15) passes through the top of the upper test seat (19); and a plurality of upper test probes (20) are provided in the middle of the lower surface of the upper test seat (19) and at the bottom of the second conductor connection block (15).

3. The double-sided RF chip performance test fixture with adaptive height according to claim 1, characterized in that: A lower test groove (29) is provided on the upper surface of the lower seat (21); a lower test seat (30) is fixedly connected to the inner side wall of the lower test groove (29); the top of the fourth conductor connection block (26) passes through the bottom of the lower test seat (30); a plurality of lower test probes (31) are provided in the middle of the inner bottom wall of the lower test seat (30) and the top of the fourth conductor connection block (26); and a chip limiting frame (32) is fixedly connected to the outer side of the inner bottom wall of the lower test seat (30).

4. The double-sided RF chip performance test fixture with adaptive height according to claim 1, characterized in that: A height adjustment component (4) is arranged on the top of the upper test component (1); the height adjustment component (4) comprises an upper connecting seat (40), a threaded hole (41), a threaded cylinder (42), an adjustment knob (43), a limiting slide groove (44), a limiting slide column (45), an adjustment seat (46), a limiting slide hole (47), a first spring (48), a limiting head (49), a circular groove (50), a limiting pin (51) and a connecting hole (52); A threaded hole (41) is provided at the center of the upper surface of the upper connecting seat (40); a threaded tube (42) is rotatably connected to the inner side wall of the threaded hole (41); an adjusting knob (43) is fixedly connected to the top of the threaded tube (42); a limiting slide groove (44) is provided at the bottom of the upper connecting seat (40); limiting slide columns (45) are provided at four corners of the inner top wall of the limiting slide groove (44); an adjusting seat (46) is slidably connected to the inner side wall of the limiting slide groove (44); a limiting slide hole (47) is provided at four corners of the upper surface of the adjusting seat (46); an outer side wall of the limiting slide column (45) is slidably connected to the inner side wall of the limiting slide hole (47); a first spring (48) is sleeved on the lower part of the outer side wall of the limiting slide column (45); the first spring The top of the spring (48) is fitted and connected to the bottom of the adjustment seat (46) near the outer side of the limiting sliding hole (47), the bottom of the limiting sliding column (45) is welded to the limiting head (49), the bottom of the first spring (48) is fitted and connected to the upper surface of the limiting head (49) near the outer side of the limiting sliding column (45), a circular groove (50) is opened at the center of the upper surface of the adjustment seat (46), the outer bottom of the threaded tube (42) is rotatably connected to the inner side wall of the circular groove (50), the front and rear parts of both sides of the lower surface of the adjustment seat (46) are fixedly connected to the limiting pins (51), the four corners of the upper surface of the upper seat (10) are opened, and the outer side wall of the limiting pin (51) is slidably connected to the inner side wall of the connecting hole (52).

5. The double-sided RF chip performance test fixture with adaptive height according to claim 4, characterized in that: Upper limit holes (53) are provided on both sides of the front and rear of the lower surface of the adjustment seat (46), and lower limit holes (54) are provided on both sides of the front and rear of the upper surface of the upper seat (10). A second spring (55) is fittedly connected to the inner bottom wall of the lower limit hole (54), and the top of the second spring (55) is fittedly connected to the inner top wall of the upper limit hole (53).

6. The double-sided RF chip performance test fixture with adaptive height according to claim 1, characterized in that: The outer side wall of the lower seat (21) is fixedly connected to a lower connecting seat (33), the bottom of the lower connecting seat (33) is fixedly connected to a test box (34), and the bottom of the test box (34) is fixedly connected to a base (35).

7. The double-sided RF chip performance test fixture with adaptive height according to claim 6, characterized in that: The rear portion of the upper surface of the lower connecting seat (33) is hinged to the rear portion of the lower surface of the upper connecting seat (40) via a pin shaft (36).

8. The self-adaptive height double-sided RF chip performance test fixture according to claim 6, characterized in that: Lower test joints (37) are provided at the front and rear portions of both sides of the test box (34).

9. The double-sided RF chip performance test fixture with adaptive height according to claim 4, characterized in that: Brackets (38) are fixedly connected to both sides of the upper connection seat (40), and upper test connectors (39) are provided at the front and rear of both sides of the bracket (38).

10. The double-sided RF chip performance test fixture with adaptive height according to claim 9, characterized in that: A lock buckle (56) is installed in the middle of the front surface of the upper connecting seat (40).

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