Data acquisition system and method based on DIE Tray incoming material patch work station production

Abstract

The invention discloses a data acquisition system and method based on DIE Tray incoming material surface mounting station production, and the system comprises a central processing unit, a label printing module, a label scanning module, and a data processing module. And signal channels of the label printing module, the label scanning module and the data processing module are communicated with a signal channel of the central processing unit. The problem that DIE tray products cannot be traced when being produced by a packaging factory is solved, the problem of offline production of the DIE tray products is solved, and the DIE tray products start system production from a chip mounting work station, so that packaging manual counting is canceled in a chip processing section, the productivity is improved, the efficiency is quickly improved, and the processing cost of chip packaging of the packaging factory is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a data acquisition system and method based on DIE Tray incoming material patch station production. Background Art

[0002] DIE tray incoming material definition: "DIE tray" refers to a chip (DIE) tray, which is usually used to store and transport chips (DIE). In the process of electronic component manufacturing and assembly, chips are usually cut into individual chips (DIE) first, and then these chips are placed in specific trays for subsequent processing, testing or assembly processes. These trays are usually designed to safely protect and position each chip to prevent damage or confusion. Unlike wafer incoming materials, DIE trays do not have wafer IDs and wafer mapping, and cannot use normal traceability systems;

[0003] At present, existing semiconductor packaging factories are unable to collect and trace production data when processing DIE tray products. With the large-scale introduction of DIE tray products, packaging factories have to manually count DIE tray products during production, resulting in serious waste of production capacity.

[0004] The existing system does not support the traceability of DIE tray products, which means that manual counting is required from the patch station, and the system has no data;

[0005] Therefore, we proposed a data acquisition system and method based on the DIE Tray incoming material patch station production. Summary of the invention

[0006] The purpose of the present invention is to provide a data acquisition system and method based on the production of a DIE Tray incoming material patch station, which solves the problems raised in the background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: a data acquisition system based on the production of DIE Tray incoming material patch station, comprising: a central processing unit, a label printing module, a label scanning module and a data processing module;

[0008] The signal channels of the label printing module, label scanning module and data processing module are all interconnected with the signal channel of the central processing unit;

[0009] The central processor is used to send work instructions to each module, process data between modules, and interconnect with processing equipment to realize feedback of processing instructions;

[0010] The label printing module is used to print a corresponding label QR code on the chip tray when the central processor sends an instruction;

[0011] The label scanning module is used to scan and identify the label QR code printed on the chip tray, so as to record the chip on the tray in the file for later tracing;

[0012] The data processing module is used to process the two-dimensional code information scanned by the label scanning module and convert it into an electrical signal to feed back to the central processing unit.

[0013] As a preferred embodiment of the present invention, the label scanning module further includes a picture acquisition submodule, which is a high-definition camera, so as to capture the image of the chip on the incoming pallet to determine whether there is any missing chip.

[0014] As a preferred embodiment of the present invention, the central processor includes a database, and the database is used to store data fed back by each module to facilitate later information tracing.

[0015] As a preferred embodiment of the present invention, the central processor further includes a two-dimensional code generation submodule, and the two-dimensional code generation submodule is used to automatically generate different two-dimensional codes for different chip trays.

[0016] As a preferred embodiment of the present invention, the method comprises the following steps:

[0017] Step 1: First, the central processor will automatically generate a label information according to the incoming chip tray and save the note information;

[0018] Step 2: The central processor will feed back the label information to the label printing module, and the label printing module will print the label QR code on the pallet;

[0019] Step 3: When the chip tray continues to move to the front of the patch equipment, the printed QR code label is identified by the label scanning module, and then fed back to the data processing module for processing and then fed back to the central processor. The central processor archives the identity of the chip to be processed for later traceability.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention solves the problem that a packaging plant cannot trace DIE tray products when producing them, and solves the problem of offline production of DIE tray products. The DIE tray products start system production from a patch station, so that the chip processing section eliminates the manual work of packaging, improves production capacity and efficiency rapidly, and reduces the processing cost of chip packaging in the packaging plant. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 This is the operation diagram of the data acquisition system based on the DIE Tray incoming material patch station production of the present invention

[0024] Figure 2 The present invention is a flow chart of the data collection method based on the DIE Tray incoming material patch station production.

[0025] In the figure:

[0026] 100, central processing unit; 200, label printing module; 300, label scanning module; 400, data processing module. DETAILED DESCRIPTION

[0027] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0028] The following problems exist in the current chip packaging process:

[0029] Production efficiency issues: DIE tray incoming materials mean no incoming material mapping and no wafer ID, which may affect the production efficiency and cost-effectiveness of the packaging factory. When the packaging factory produces DIE tray products, it is difficult to achieve economies of scale, resulting in higher unit costs;

[0030] Production scale limitation: Packaging plants usually need to manually count products starting from the patch station to ensure the quantity of products and control the mixing of materials. Manual counting of DIE tray products by packaging plants will increase the idle time of equipment, thus affecting production capacity and delivery time;

[0031] Identification and traceability issues: There are no incoming material labels or mapping diagrams, so mixed material inspection cannot be performed systematically and manual intervention is required;

[0032] Difficulty of technical development: Trays are made of common materials and have unified standards in the industry. It is impossible to print wafer ID and generate mapping diagrams based on products, and doing so is very costly for customers.

[0033] The present invention proposes a technical solution that can solve the above technical problems, specifically: a data acquisition system based on the production of a DIE Tray incoming material patch station, comprising: a central processor 100, a label printing module 200, a label scanning module 300 and a data processing module 400;

[0034] The signal channels of the label printing module 200, the label scanning module 300 and the data processing module 400 are all interconnected with the signal channel of the central processing unit 100;

[0035] The central processor 100 is used to send working instructions to each module, process data between each module, and interconnect with the processing equipment to realize feedback of processing instructions;

[0036] The central processor 100 further includes a QR code generation submodule, which is used to automatically generate different QR codes for different chip trays;

[0037] The central processor 100 includes a database, which is used to store the data fed back by each module to facilitate later information tracing;

[0038] The label printing module 200 is used to print a corresponding label QR code on the chip tray when the central processor 100 sends an instruction;

[0039] The label scanning module 300 is used to scan and identify the label QR code printed on the chip tray, so as to record the chips on the tray in the file for later tracing;

[0040] The label scanning module 300 also includes a picture acquisition submodule, which is a high-definition camera, so that it can capture the chip image on the incoming pallet to determine whether it is missing;

[0041] The data processing module 400 is used to process the two-dimensional code information scanned by the label scanning module 300 and convert it into an electrical signal to feed back to the central processing unit 100 .

[0042] The data collection method based on the DIE Tray incoming material patch station production is specifically implemented as follows:

[0043] First, the CPU 100 will automatically generate a label QR code information based on the incoming chip tray using the QR code generation submodule, and will save the note information;

[0044] The central processor 100 will feed back the label information to the label printing module 200, and the label printing module 200 will print the label QR code on the pallet;

[0045] When the chip tray continues to move to the front of the patch equipment, the printed QR code label is identified by the label scanning module 300, and then fed back to the data processing module 400 for processing and then fed back to the central processor 100. The central processor 100 archives the identity of the chip to be processed for later traceability. At the same time, the image acquisition submodule will capture the chip image on the incoming material tray to determine whether there is any missing chip.

[0046] In summary, this system can improve the efficiency of chip packaging in the packaging plant, reduce all manual inspections between the patch station and the testing section while ensuring quality, and improve the traceability of DIE tray products in the entire packaging plant.

[0047] The design and invention of this system can be carried out without violating the mixing requirements of each customer.

[0048] The design of this system can be adapted to all product traceability and efficiency improvement of all DIE tray customers.

Claims

1. The data acquisition system based on DIE Tray incoming material patch station production is characterized by: include: A central processing unit (100), a label printing module (200), a label scanning module (300) and a data processing module (400); The signal channels of the label printing module (200), the label scanning module (300) and the data processing module (400) are all interconnected with the signal channel of the central processing unit (100); The central processor (100) is used to send working instructions to each module, process data between each module, and interconnect with processing equipment to realize feedback of processing instructions; The label printing module (200) is used to print a corresponding label QR code on the chip tray when the central processor (100) sends an instruction; The label scanning module (300) is used to scan and identify the label two-dimensional code printed on the chip tray, so as to record the chips on the tray in the file for later tracing; The data processing module (400) is used to process the two-dimensional code information scanned by the label scanning module (300) and convert it into an electrical signal to feed back to the central processing unit (100).

2. The data acquisition system based on DIE Tray incoming material patch station production according to claim 1 is characterized by: The label scanning module (300) further comprises a picture acquisition submodule, which is a high-definition camera, so as to capture the picture of the chip on the incoming pallet and determine whether there is any missing chip.

3. The data acquisition system based on DIE Tray incoming material patch station production according to claim 1 is characterized by: The central processor (100) comprises a database, which is used to store data fed back by each module to facilitate later information tracing.

4. The data acquisition system based on DIE Tray incoming material patch station production according to claim 1 is characterized by: The central processor (100) also includes a two-dimensional code generation submodule, and the two-dimensional code generation submodule is used to automatically generate different two-dimensional codes for different chip trays.

5. The data collection method based on DIE Tray incoming material patch station production according to claim 1 is characterized in that: The method comprises the following steps: Step 1: First, the central processor (100) automatically generates a label information according to the incoming chip tray, and saves the label information; Step 2: The central processor (100) feeds back the label information to the label printing module (200), and the label printing module (200) prints a label QR code on the tray; Step 3: When the chip tray continues to move to the front of the patch equipment, the printed two-dimensional code label is identified by the label scanning module (300), and then fed back to the data processing module (400) for processing and then fed back to the central processor (100). The central processor (100) archives the identity of the chip to be processed for later tracing.

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