Cleaning and degumming machine for photovoltaic silicon wafer

Abstract

The invention relates to the technical field of photovoltaic silicon wafer processing, in particular to a photovoltaic silicon wafer cleaning and degumming machine which comprises a supporting frame and a degumming box, a degumming plate is horizontally and slidably arranged in the middle of the degumming box, a degumming mechanism is arranged in the degumming plate, and a clamping rotating mechanism is fixedly arranged between degumming box fixing plates. A positioning mechanism is fixedly arranged in the glue removing box, and a photovoltaic silicon wafer is fixedly arranged on the upper side face of the rubber guide pipe. According to the photovoltaic silicon wafer glue removing device, photovoltaic silicon wafers of different sizes can be conveniently fixed into the glue removing box through the positioning mechanism, the use range is widened, the photovoltaic silicon wafers are fixed through the rubber guide pipe, the glue removing box is rotated through the clamping rotating mechanism, glue removing cleaning is conducted on the photovoltaic silicon wafers through glue removing brushes on the glue removing disc, the trouble of repeated clamping is saved, and the working efficiency is improved. And a cleaning blind area is also avoided, and the glue removing quality and the glue removing efficiency are improved.

Description

Technical Field

[0001] The invention relates to a cleaning and degumming machine, in particular to a cleaning and degumming machine for photovoltaic silicon wafers, and belongs to the technical field of photovoltaic silicon wafer processing. Background Art

[0002] Photovoltaic silicon wafers, also known as solar cells, are semiconductor materials that use the photoelectric effect to convert solar radiation into electrical energy. They are the core components of photovoltaic cells and are usually made of materials such as monocrystalline silicon, polycrystalline silicon, and amorphous silicon. The main function of photovoltaic silicon wafers is to convert solar energy into electrical energy. Under light, silicon wafers can absorb sunlight and generate electron-hole pairs through the photoelectric effect, thereby forming an electric current. Their excellent electrical properties make them a core component in the manufacture of solar cells. By forming a PN junction on the silicon wafer and adding electrodes, the charge carriers generated by light can be effectively collected and transmitted. Multiple silicon wafers are assembled together and combined with other components to form solar panels or photovoltaic modules. These modules can directly convert sunlight into direct current for home, commercial or industrial use.

[0003] The Chinese invention patent publication number CN 116454012 B discloses "comprising a degumming tilting barrel; the top of the degumming tilting barrel is groove-shaped, and a reduction motor is installed on the top of the degumming tilting barrel, and a rotating shaft is connected to the bottom of the reduction motor, and the rotating shaft is located inside the degumming tilting barrel; a liquid discharge port is provided at the bottom of the degumming tilting barrel, and a liquid discharge valve is installed at the liquid discharge port. The present invention drives the upper and lower movable turntables to rotate synchronously through a transmission rod, and the movable turntable drives two double-rod movable frames to move synchronously inward through a connecting rod, and the photovoltaic silicon wafer is clamped and fixed by the double-rod movable frame, so as to ensure the clamping and fixing effect of the double-rod movable frame on the photovoltaic silicon wafer, so that The photovoltaic silicon wafer clamping and fixing operation is more convenient. The existing photovoltaic silicon wafer cleaning and debonding equipment is used to solve the problem that it is cumbersome to clamp and fix the photovoltaic silicon wafer during use, and it takes a long time to arrange the photovoltaic silicon wafers. "Since the shapes and sizes of photovoltaic silicon wafers are different, the photovoltaic silicon wafers in the above invention can only be of fixed size, so it has certain limitations, and the clamping part is also difficult to remove the glue and clean, so the clamping part needs to be removed and cleaned separately, which wastes a lot of manpower and material resources, resulting in a significant reduction in the quality and efficiency of debonding.

[0004] Therefore, it is urgent to improve the cleaning and degumming machine for photovoltaic silicon wafers to solve the above-mentioned problems. Summary of the invention

[0005] The purpose of the present invention is to provide a photovoltaic silicon wafer cleaning and degumming machine. The positioning mechanism is convenient for fixing photovoltaic silicon wafers of different sizes inside the degumming box, thereby improving the scope of use. The photovoltaic silicon wafers are fixed by rubber guide tubes, and the degumming box is rotated by the engaging rotating mechanism. The degumming brush on the degumming disk removes the glue and cleans the photovoltaic silicon wafers, thereby saving the trouble of repeated clamping, avoiding the occurrence of cleaning blind spots, and improving the quality and efficiency of degumming.

[0006] In order to achieve the above object, the main technical solutions adopted by the present invention include:

[0007] A photovoltaic silicon wafer cleaning and degumming machine comprises a support frame and a degumming box rotatably arranged on the support frame, the degumming box comprises a first degumming cover and a second degumming cover, a degumming plate is horizontally slidably arranged between the first degumming cover and the second degumming cover, the degumming plate comprises a degumming support plate and a first electric telescopic rod fixedly connected to the degumming support plate, a degumming mechanism rotating groove is provided inside the degumming support plate, a degumming mechanism is provided inside the degumming mechanism rotating groove, a transverse flow channel is provided on the degumming mechanism rotating groove, and the transverse flow channel is provided on one side of the degumming mechanism;

[0008] Both sides of the first glue removal cover and the second glue removal cover are fixedly provided with glue removal box fixing plates, a clamping rotation mechanism is fixedly provided between the glue removal box fixing plates, the clamping rotation mechanism is rotatably provided on the support frame, a plurality of second electric telescopic rods are fixedly provided on the clamping rotation mechanism, and the output end of the second electric telescopic rod is fixedly connected to the glue removal box fixing plate;

[0009] A plurality of evenly distributed positioning mechanisms are fixedly arranged inside the degumming box, and the positioning mechanism includes a rubber guide tube. The rubber guide tube and the transverse flow channel are both connected to an air pump. A photovoltaic silicon wafer is fixedly arranged on the upper side of the rubber guide tube. A degumming disk is connected to the bottom of the degumming mechanism, and the bottom of the degumming disk is against the upper side of the photovoltaic silicon wafer.

[0010] Preferably, the transverse flow channel is connected to the rotating groove of the degumming mechanism, a U-shaped support arm is fixedly provided on the degumming support plate, and the output end of the first electric telescopic rod is fixedly connected to the U-shaped support arm;

[0011] A flow channel joint is fixedly arranged inside the U-shaped support arm, the flow channel joint is connected to the inside of the transverse flow channel, and the flow channel joint is connected to the air pump;

[0012] A vertical flow channel is provided on the glue removal support plate at one side of the glue removal mechanism rotating groove away from the transverse flow channel, and the vertical flow channel penetrates the glue removal support plate.

[0013] Preferably, the glue removal mechanism is rotatably arranged inside the glue removal mechanism rotation groove, the glue removal mechanism comprises a glue removal support shaft and a plurality of impellers evenly distributed on the glue removal support shaft, the bottom of the glue removal support shaft is fixedly connected with an upper limit ring, and the bottom of the upper limit ring is connected with a lower limit ring;

[0014] The upper limit ring is rotatably arranged inside the rotating groove of the glue removal mechanism, the lower limit ring is rotatably arranged outside the glue removal plate, the glue removal disc is fixedly arranged at the bottom of the lower limit ring, and a glue removal brush is fixedly arranged on the outer side of the glue removal disc;

[0015] A glue removal rotating groove sealing cover is fixedly arranged at the upper end of the rotating groove of the glue removal mechanism, and the upper end of the glue removal support shaft is rotatably connected to the glue removal rotating groove sealing cover.

[0016] Preferably, both sides of the glue removal box are provided with glue removal box through holes, and sealing plates are fixedly provided on both sides of the glue removal support plate. A rubber sealing strip is fixedly connected to the sealing plate, and the rubber sealing strip is snap-connected with the glue removal box through holes, and the rubber sealing strip is used to seal the glue removal box through holes.

[0017] Preferably, the engaging rotating mechanism comprises an engaging fixing block, and the second electric telescopic rod is fixedly arranged on the upper and lower side surfaces of the engaging fixing block;

[0018] The engaging fixing block is fixedly connected to a rotating support shaft, one of the rotating support shafts is fixedly connected to a manual rotating disk, and the manual rotating disk is fixedly connected to a rotating handle;

[0019] A rotating motor is connected to the other rotating support shaft. The rotating support shaft is fixedly arranged at the output end of the rotating motor. The rotating motor is fixedly arranged on the supporting frame.

[0020] Preferably, the first glue removal cover and the second glue removal cover are both provided with an air extraction hole, and the rubber guide tube is slidably disposed inside the air extraction hole;

[0021] The outer sides of the first glue removal cover and the second glue removal cover are both fixedly provided with air extraction buffer blocks, the rubber guide tube is connected to the air extraction buffer block, and the air extraction buffer block is connected to the air pump through an air extraction air pipe.

[0022] Preferably, a plurality of evenly distributed drainage holes are provided on the inner side of the air extraction hole on the first glue removal cover or the second glue removal cover, and a drainage buffer block is fixedly provided on the outer side surface of the first glue removal cover or the second glue removal cover, and the drainage hole is connected to the drainage buffer block, and the drainage buffer block is connected to an external water pump through a drainage air pipe.

[0023] Preferably, a leather cup is fixedly connected to the upper end of the rubber guide tube, a side surface of the photovoltaic silicon wafer is against the leather cup, a spring is provided between the glue removal box and the leather cup, and the spring is sleeved on the spring.

[0024] Preferably, an ultrasonic generator is fixedly disposed inside the first glue removal cover and the second glue removal cover, and the ultrasonic generator is fixedly disposed on one side of the positioning mechanism.

[0025] Preferably, the support frame is provided with symmetrically distributed rotating support arms, the engaging rotating mechanism is rotatably arranged on the rotating support arms, one side of the support frame is connected with a telescopic rod fixing plate through the telescopic rod support arm, the first electric telescopic rod is fixedly arranged on the telescopic rod fixing plate, and a support column is fixedly arranged at the bottom of the telescopic rod fixing plate.

[0026] The present invention has at least the following beneficial effects:

[0027] 1. The positioning mechanism makes it easy to fix photovoltaic silicon wafers of different sizes inside the degumming box, which increases the scope of use. The photovoltaic silicon wafers are fixed by the rubber guide tube, and the degumming box is rotated by the engaging rotating mechanism. The degumming brush on the degumming disc removes the glue from the photovoltaic silicon wafers, which saves the trouble of repeated clamping and avoids the blind spot of cleaning, thus improving the quality and efficiency of degumming.

[0028] 2. A transverse flow channel connected to the degumming mechanism rotating groove is opened inside the degumming support plate. The degumming mechanism is rotatably arranged inside the degumming mechanism rotating groove. When air is inflated into the degumming mechanism rotating groove through the transverse flow channel, the degumming mechanism rotates under the action of the airflow, and the photovoltaic silicon wafers inside the degumming box are cleaned and degummed. The degumming mechanism has a certain buffering function driven by the airflow, which prevents the photovoltaic silicon wafers from being strongly scratched and improves the quality of the photovoltaic silicon wafers.

[0029] 3. Connect the corresponding number of rubber guide tubes as needed, and then place the photovoltaic silicon wafer directly on the upper side of the leather bowl. Select one or more rubber guide tubes according to the area of ​​the photovoltaic silicon wafer to fix the photovoltaic silicon wafer. The air source on the first degumming cover makes the photovoltaic silicon wafer fall on the leather bowl of the second degumming cover. At the same time, start the air source on the second degumming cover to fix the other side of the photovoltaic silicon wafer on the leather bowl of the second degumming cover. It can be placed directly without clamping the photovoltaic silicon wafer, saving a lot of manpower and material resources and improving the clamping efficiency.

[0030] 4. A vertical flow channel is opened on the degumming support plate on the side of the degumming mechanism rotating groove away from the horizontal flow channel. The vertical flow channel runs through the degumming support plate. After the airflow passes through the degumming mechanism rotating groove, it enters the interior of the degumming box through the vertical flow channel and cleans the upper side of the photovoltaic silicon wafer, mainly to remove the water on the upper side of the photovoltaic silicon wafer to ensure the stability of the upper side when it is clamped again.

[0031] 5. The second electric telescopic rod on the engaging rotation mechanism is fixedly connected to the degumming box fixing plate on the degumming box. Therefore, when the second electric telescopic rod is started, the output end of the second electric telescopic rod moves the first degumming cover or the second degumming cover upward or downward to facilitate the placement of the photovoltaic silicon wafer. At the same time, the degumming box can be rotated as a whole through the engaging rotation mechanism to clean the two sides of the photovoltaic silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0033] Figure 1 A perspective view of the present invention;

[0034] Figure 2 It is a structural diagram of the glue removal box of the present invention;

[0035] Figure 3 The cross-sectional view of the glue removal board of the present invention Figure 1 ;

[0036] Figure 4 The cross-sectional view of the glue removal board of the present invention Figure 2 ;

[0037] Figure 5 It is a structural diagram of the engaging rotating mechanism of the present invention;

[0038] Figure 6 It is a structural diagram of the adhesive removal mechanism of the present invention;

[0039] Figure 7 It is a structural diagram of the positioning mechanism of the present invention;

[0040] Figure 8 It is a structural diagram of the glue removal cover of the present invention;

[0041] Fig. 9 It is a structural diagram of the support frame of the present invention;

[0042] Fig.10 It is a top view of the present invention.

[0043] In the figure, 1, support frame; 101, rotating support arm; 102, telescopic rod support arm; 103, telescopic rod fixing plate; 104, support column; 2, glue removal box; 201, first glue removal cover; 202, second glue removal cover; 203, glue removal box fixing plate; 204, glue removal box through hole; 205, air extraction buffer block; 2051, air extraction air pipe; 206, drainage buffer block; 2061, drainage air pipe; 207, drainage hole; 208, air extraction hole; 3, glue removal plate; 301, glue removal support plate; 302, first electric telescopic rod; 303, glue removal mechanism rotating groove; 304, transverse flow channel; 305, flow channel joint; 306, sealing plate ; 307, rubber sealing strip; 308, glue removal trough sealing cover; 309, U-shaped support arm; 310, vertical flow channel; 4, glue removal mechanism; 401, glue removal support shaft; 402, impeller; 403, lower limit ring; 404, upper limit ring; 405, glue removal disk; 5, locking rotation mechanism; 501, second electric telescopic rod; 502, rotating support shaft; 503, manual rotating disk; 504, rotating handle; 505, locking fixed block; 506, rotating motor; 6, positioning mechanism; 601, rubber guide tube; 602, spring; 603, leather cup; 7, ultrasonic generator; 8, glue removal brush; 10, photovoltaic silicon wafer. DETAILED DESCRIPTION

[0044] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0045] like Figure 1-Figure 10As shown, the photovoltaic silicon wafer cleaning and degumming machine provided in this embodiment includes a support frame 1 and a degumming box 2 rotatably arranged on the support frame 1. The degumming box 2 is rotatably arranged on the support frame 1, and can rotate the degumming box 2 180°, and degumming can be performed on both sides of the photovoltaic silicon wafer 10. The structure is simple and the cleaning efficiency is improved. The degumming box 2 includes a first degumming cover 201 and a second degumming cover 202. A degumming plate 3 is horizontally slidably arranged between the first degumming cover 201 and the second degumming cover 202. The degumming plate 3 includes a degumming support plate 301 and a first electric telescopic rod 302 fixedly connected to the degumming support plate 301. The degumming box 2 includes a first degumming cover 201 and a second degumming cover 202. After the first degumming cover 201 and the second degumming cover 202 are closed, the degumming plate 3 is slid into the interior of the degumming box 2, and the degumming support plate 301 is extended into the interior of the degumming box 2 by the first electric telescopic rod 302, and then the degumming box 2 is in a sealed state. In the state, a degumming mechanism rotating groove 303 is provided inside the degumming support plate 301, a degumming mechanism 4 is provided inside the degumming mechanism rotating groove 303, a transverse flow channel 304 is provided on the degumming mechanism rotating groove 303, the transverse flow channel 304 is provided on one side of the degumming mechanism 4, a transverse flow channel 304 connected with the degumming mechanism rotating groove 303 is provided inside the degumming support plate 301, the degumming mechanism 4 is rotatably arranged inside the degumming mechanism rotating groove 303, when the degumming mechanism rotating groove 303 is inflated through the transverse flow channel 304, the degumming mechanism 4 is rotated by the airflow, and the photovoltaic silicon wafer 10 inside the degumming box 2 is cleaned and degummed;

[0046] Both sides of the first glue removal cover 201 and the second glue removal cover 202 are fixedly provided with glue removal box fixing plates 203, and a locking rotation mechanism 5 is fixedly provided between the glue removal box fixing plates 203. The locking rotation mechanism 5 is rotatably provided on the support frame 1, and a plurality of second electric telescopic rods 501 are fixedly provided on the locking rotation mechanism 5. The output end of the second electric telescopic rod 501 is fixedly connected to the glue removal box fixing plate 203, and the second electric telescopic rod 501 on the locking rotation mechanism 5 is fixedly connected to the glue removal box fixing plate 203 on the glue removal box 2. Therefore, when the second electric telescopic rod 501 is started, the output end of the second electric telescopic rod 501 moves the first glue removal cover 201 or the second glue removal cover 202 upward or downward, so as to facilitate the placement of the photovoltaic silicon wafer 10. At the same time, the glue removal box 2 can be rotated as a whole through the locking rotation mechanism 5 to clean the two sides of the photovoltaic silicon wafer 10.

[0047] A plurality of evenly distributed positioning mechanisms 6 are fixedly arranged inside the degumming box 2, and the positioning mechanism 6 includes a rubber guide tube 601. The rubber guide tube 601 and the transverse flow channel 304 are both connected to an air pump. A photovoltaic silicon wafer 10 is fixedly arranged on the upper side of the rubber guide tube 601. A degumming disk 405 is connected to the bottom of the degumming mechanism 4. The bottom of the degumming disk 405 abuts against the upper side of the photovoltaic silicon wafer 10. The rubber guide tube 601 on the positioning mechanism 6 is connected to an external air pump. Therefore, when the airflow passes through the rubber guide tube 601, the photovoltaic silicon wafer 10 can be fixed on the rubber guide tube 601, and the degumming disk 405 at the bottom of the degumming mechanism 4 is used to remove the glue from the outer side of the photovoltaic silicon wafer 10, thereby improving the stability of the photovoltaic silicon wafer 10.

[0048] Therefore, the positioning mechanism 6 is convenient for fixing photovoltaic silicon wafers 10 of different sizes inside the degumming box 2, thereby increasing the scope of use. Then, the outer side of the photovoltaic silicon wafer 10 is cleaned by the rotating degumming disk 405. The degumming mechanism 4 driven by the airflow has a certain buffering function, thereby preventing the photovoltaic silicon wafer 10 from being strongly scratched, thereby improving the quality of the photovoltaic silicon wafer 10. After the degumming of one side of the photovoltaic silicon wafer 10 is completed, the degumming support plate 301 is pulled out and the degumming box 2 is rotated by the engaging rotating mechanism 5. Then, the other side of the photovoltaic silicon wafer 10 is adsorbed on the rubber guide tube 601, and the other side of the photovoltaic silicon wafer 10 is cleaned. Therefore, the trouble of repeated clamping can be saved, and the blind spot of cleaning can be avoided, thereby improving the quality and efficiency of degumming. In the processing process, it is specifically as follows:

[0049] Clamping and fixing of photovoltaic silicon wafer 10:

[0050] The first and second adhesive removal covers 201 and 202 are both provided with air extraction holes 208, and the rubber guide tube 601 is slidably arranged inside the air extraction holes 208. The outer sides of the first and second adhesive removal covers 201 and 202 are both fixedly provided with air extraction buffer blocks 205, and the rubber guide tube 601 is connected to the air extraction buffer block 205, and the air extraction buffer block 205 is connected to the air pump through the air extraction air pipe 2051. The air pump connected to the air extraction buffer block 205 is started, and the air inside the rubber guide tube 601 is extracted through the air extraction air pipe 2051. The upper end of the rubber guide tube 601 A leather cup 603 is fixedly connected, and one side of the photovoltaic silicon wafer 10 is against the leather cup 603. A spring 602 is arranged between the rubber box 2 and the leather cup 603. The spring 602 is sleeved on the spring 602. The number of corresponding rubber guide tubes 601 is connected as needed, and then the photovoltaic silicon wafer 10 is directly placed on the upper side of the leather cup 603. One or more rubber guide tubes 601 are selected according to the size of the photovoltaic silicon wafer 10 to achieve the purpose of fixing the photovoltaic silicon wafer 10. The photovoltaic silicon wafer 10 is directly placed without clamping the photovoltaic silicon wafer 10, which saves a lot of manpower and material resources and improves the clamping efficiency.

[0051] Glue removal box snap-on:

[0052] The engaging rotating mechanism 5 includes an engaging fixing block 505, a second electric telescopic rod 501 is fixedly arranged on the upper and lower sides of the engaging fixing block 505, and a plurality of second electric telescopic rods 501 are evenly fixed on the engaging fixing block 505, and the degumming box fixing plate 203 on the degumming box 2 is closed or opened at the same time. When the second electric telescopic rod 501 is in a compressed state, the first degumming cover 201 and the second degumming cover 202 are engaged together to form a degumming space. When the second electric telescopic rod 501 is in an extended state, the first degumming cover 201 and the second degumming cover 202 are separated, so as to facilitate the reverse side of the photovoltaic silicon wafer 10 or the replacement of the photovoltaic silicon wafer 10.

[0053] Glue removal:

[0054] Before the first glue removal cover 201 and the second glue removal cover 202 are engaged, the glue removal support plate 301 on the glue removal plate 3 is extended into the interior of the glue removal box 2 through the first electric telescopic rod 302. The glue removal box 2 is provided with a glue removal box through hole 204 on both sides, and a sealing plate 306 is fixedly provided on both sides of the glue removal support plate 301. A rubber sealing strip 307 is fixedly connected to the sealing plate 306. The rubber sealing strip 307 is engaged with the glue removal box through hole 204. The rubber sealing strip 307 is used to seal the glue removal box through hole 204, and the rubber sealing strip 307 on the sealing plate 306 is engaged with the inside of the glue removal box through hole 204, so as to achieve the effect of sealing the glue removal box 2;

[0055] Then, air is inflated into the interior of the degumming mechanism rotating groove 303 through the transverse flow channel 304, and the degumming mechanism 4 is rotatably arranged in the degumming mechanism rotating groove 303. The degumming mechanism 4 includes a degumming support shaft 401 and a plurality of impellers 402 evenly distributed on the degumming support shaft 401. After the airflow enters the interior of the degumming mechanism rotating groove 303 through the transverse flow channel 304, the impeller 402 on the degumming support shaft 401 is driven to rotate. When the degumming support shaft 401 rotates, the degumming disc 405 is driven to rotate. The bottom of the degumming support shaft 401 is fixedly connected to an upper limit ring 404, and the bottom of the upper limit ring 404 is connected to a lower limit ring 40 3. The upper limit ring 404 is rotatably arranged inside the degumming mechanism rotating groove 303, and the lower limit ring 403 is rotatably arranged outside the degumming plate 3. At the same time, when the degumming support shaft 401 rotates, the upper limit ring 404 and the lower limit ring 403 on the degumming support shaft 401 will also rotate at the same time, playing a certain limiting role on the degumming plate 3. A degumming rotating groove sealing cover 308 is fixedly arranged at the upper end of the degumming mechanism rotating groove 303. The upper end of the degumming support shaft 401 is rotatably connected to the degumming rotating groove sealing cover 308. The upper end of the degumming support shaft 401 is rotatably connected to the degumming rotating groove sealing cover 308, thereby ensuring the rotation stability of the degumming mechanism 4;

[0056] The glue removal disc 405 is fixedly arranged at the bottom of the lower limit ring 403, and a glue removal brush 8 is fixedly arranged on the outer side of the glue removal disc 405. When the glue removal disc 405 rotates, the glue removal disc 405 drives the glue removal brush 8 to rotate at the same time, so that the glue removal brush 8 can be used to remove glue from one side of the photovoltaic silicon wafer 10. The glue removal disc 405 is driven to rotate by airflow, so the force effect is weak, which can greatly reduce the phenomenon of the photovoltaic silicon wafer 10 being scratched during the glue removal process.

[0057] At the same time, during the degumming process, a plurality of evenly distributed drainage holes 207 are provided on the inner side of the air extraction hole 208 on the first degumming cover 201 or the second degumming cover 202, and a drainage buffer block 206 is fixedly provided on the outer side of the first degumming cover 201 or the second degumming cover 202, and the drainage holes 207 are connected to the drainage buffer block 206, and the drainage buffer block 206 is connected to an external water pump through a drainage air pipe 2061, and a cleaning liquid is injected into the drainage buffer block 206 through the water pump, and then the cleaning liquid enters the interior of the degumming box 2 through the drainage holes 207, and cleans the photovoltaic silicon wafer 10;

[0058] dry:

[0059] A vertical flow channel 310 is provided on the degumming support plate 301 at one side of the degumming mechanism rotating groove 303 away from the horizontal flow channel 304. The vertical flow channel 310 penetrates the degumming support plate 301. After the airflow passes through the degumming mechanism rotating groove 303, it enters the interior of the degumming box 2 through the vertical flow channel 310 and cleans the upper side of the photovoltaic silicon wafer 10, mainly to remove water stains on the upper side of the photovoltaic silicon wafer 10, and ensure the stability of the upper side when it is clamped again;

[0060] The other side of the photovoltaic silicon wafer 10 is rotated to clean. After the glue removal of one side of the photovoltaic silicon wafer 10 is completed, a rotating support shaft 502 is fixedly connected to the clamping fixed block 505, one of the rotating support shafts 502 is fixedly connected to a manual rotating disk 503, and a rotating handle 504 is fixedly connected to the manual rotating disk 503. The clamping fixed block 505 is connected to the manual rotating disk 503 through the rotating support shaft 502. The entire glue removal box 2 is rotated by the rotating handle 504 on the manual rotating disk 503. Note that when the rotation is required, the first electric telescopic rod 302 should be pulled out of the glue removal box 2 to avoid jamming.

[0061] The other rotating support shaft 502 is connected to a rotating motor 506, which is fixedly arranged at the output end of the rotating motor 506. The rotating motor 506 is fixedly arranged on the support frame 1. The rotating motor 506 on the other rotating support shaft 502 can also be used to rotate the engaging rotating mechanism 5 and rotate the glue removal box 2 as a whole.

[0062] Then, the air source on the first debonding cover 201 is closed to make the photovoltaic silicon wafer 10 fall onto the leather cup 603 of the second debonding cover 202, and at the same time, the air source on the second debonding cover 202 is started to fix the other side of the photovoltaic silicon wafer 10 onto the leather cup 603 of the second debonding cover 202;

[0063] Repeat the above debonding operation to debond the other side of the photovoltaic silicon wafer 10. The structure is simple, there will be no dead corners for debonding, and the debonding quality and efficiency are improved.

[0064] Further, such as Figure 3 As shown, the transverse flow channel 304 is connected with the degumming mechanism rotating groove 303, a U-shaped support arm 309 is fixedly arranged on the degumming support plate 301, the output end of the first electric telescopic rod 302 is fixedly connected to the U-shaped support arm 309, the degumming support plate 301 is fixed to the first electric telescopic rod 302 through the U-shaped support arm 309, so as to improve the stability of the degumming support plate 301, and a flow channel joint 305 is fixedly arranged inside the U-shaped support arm 309, the flow channel joint 305 is connected with the inside of the transverse flow channel 304, the flow channel joint 305 is connected with the air pump, and the flow channel joint 305 is arranged inside the U-shaped support arm 309, which has a simple structure and strong stability, avoids the clutter of the air pipe, and facilitates the arrangement of the air pipe.

[0065] Furthermore, Figure 5 As shown, ultrasonic generators 7 are fixedly installed inside the first glue removal cover 201 and the second glue removal cover 202. The ultrasonic generators 7 are fixedly installed on one side of the positioning mechanism 6. Ultrasonic generators 7 are fixedly installed inside the first glue removal cover 201 and the second glue removal cover 202. The ultrasonic generators 7 are started simultaneously during the glue removal process to further improve the quality and efficiency of glue removal.

[0066] In further, Fig. 9 As shown, the support frame 1 is provided with symmetrically distributed rotating support arms 101, the engaging rotating mechanism 5 is rotatably set on the rotating support arm 101, one side of the support frame 1 is connected with a telescopic rod fixing plate 103 through a telescopic rod support arm 102, the first electric telescopic rod 302 is fixedly set on the telescopic rod fixing plate 103, and a support column 104 is fixedly set on the bottom of the telescopic rod fixing plate 103, the engaging rotating mechanism 5 is rotatably set on the rotating support arm 101 of the support frame 1, so as to improve the stability of the engaging rotating mechanism 5 and the overall stability of the glue removal box 2, the telescopic rod fixing plate 103 is fixedly set on the support frame 1 through the telescopic rod support arm 102, the telescopic rod fixing plate 103 is supported by the support column 104, and the first electric telescopic rod 302 is fixedly set on the telescopic rod fixing plate 103 to improve the overall structural strength.

[0067] like Figure 1-Figure 10As shown, the principle of the photovoltaic silicon wafer cleaning and degumming machine provided in this embodiment is as follows:

[0068] The degumming box 2 is rotatably arranged on the support frame 1, and can rotate the degumming box 2 180°, and degumming can be performed on both sides of the photovoltaic silicon wafer 10. The structure is simple and the cleaning efficiency is improved. The degumming box 2 includes a first degumming cover 201 and a second degumming cover 202. A degumming plate 3 is horizontally slidably arranged between the first degumming cover 201 and the second degumming cover 202. The degumming plate 3 includes a degumming support plate 301 and a first electric telescopic rod 302 fixedly connected to the degumming support plate 301. The degumming box 2 includes a first degumming cover 201 and a second degumming cover 202. After the first degumming cover 201 and the second degumming cover 202 are closed, the degumming plate 3 is slid into the interior of the degumming box 2, and the degumming support plate 301 is extended into the interior of the degumming box 2 by the first electric telescopic rod 302, and the degumming box 2 is in a sealed state. In this state, a degumming mechanism rotating groove 303 is provided inside the degumming support plate 301, a degumming mechanism 4 is arranged inside the degumming mechanism rotating groove 303, a transverse flow channel 304 is provided on the degumming mechanism rotating groove 303, the transverse flow channel 304 is provided on one side of the degumming mechanism 4, a transverse flow channel 304 connected with the degumming mechanism rotating groove 303 is provided inside the degumming support plate 301, the degumming mechanism 4 is rotatably arranged inside the degumming mechanism rotating groove 303, when air is inflated into the degumming mechanism rotating groove 303 through the transverse flow channel 304, the degumming mechanism 4 is rotated by the action of the airflow, and the photovoltaic silicon wafer 10 inside the degumming box 2 is cleaned and degummed.

[0069] For example, certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in names as a way to distinguish components, but use differences in the functions of components as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0070] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or system. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the product or system including the elements.

[0071] The above description shows and describes several preferred embodiments of the present invention, but as mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention concept described herein through the above teachings or the technology or knowledge of the relevant field. Changes and variations made by those skilled in the art do not depart from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A photovoltaic silicon wafer cleaning and degumming machine, comprising a support frame (1) and a degumming box (2) rotatably arranged on the support frame (1), characterized in that: The glue removal box (2) comprises a first glue removal cover (201) and a second glue removal cover (202); a glue removal plate (3) is horizontally slidably arranged between the first glue removal cover (201) and the second glue removal cover (202); the glue removal plate (3) comprises a glue removal support plate (301) and a first electric telescopic rod (302) fixedly connected to the glue removal support plate (301); a glue removal mechanism rotation groove (303) is provided inside the glue removal support plate (301); a glue removal mechanism (4) is provided inside the glue removal mechanism rotation groove (303); a transverse flow channel (304) is provided on the glue removal mechanism rotation groove (303); and the transverse flow channel (304) is provided on one side of the glue removal mechanism (4); Glue removal box fixing plates (203) are fixedly provided on both sides of the first glue removal cover (201) and the second glue removal cover (202); a snap-fit ​​rotating mechanism (5) is fixedly provided between the glue removal box fixing plates (203); the snap-fit ​​rotating mechanism (5) is rotatably provided on the support frame (1); a plurality of second electric telescopic rods (501) are fixedly provided on the snap-fit ​​rotating mechanism (5); and the output ends of the second electric telescopic rods (501) are fixedly connected to the glue removal box fixing plates (203); The interior of the degumming box (2) is fixedly provided with a plurality of evenly distributed positioning mechanisms (6), the positioning mechanism (6) comprising a rubber guide tube (601), the rubber guide tube (601) and the transverse flow channel (304) are both connected to an air pump, a photovoltaic silicon wafer (10) is fixedly provided on the upper side of the rubber guide tube (601), the bottom of the degumming mechanism (4) is connected to a degumming disk (405), and the bottom of the degumming disk (405) is against the upper side of the photovoltaic silicon wafer (10).

2. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The transverse flow channel (304) is connected to the degumming mechanism rotation groove (303); a U-shaped support arm (309) is fixedly provided on the degumming support plate (301); and the output end of the first electric telescopic rod (302) is fixedly connected to the U-shaped support arm (309); A flow channel joint (305) is fixedly provided inside the U-shaped support arm (309), the flow channel joint (305) is connected to the inside of the transverse flow channel (304), and the flow channel joint (305) is connected to the air pump; A vertical flow channel (310) is provided on the glue removal support plate (301) on the side of the glue removal mechanism rotating groove (303) away from the transverse flow channel (304), and the vertical flow channel (310) passes through the glue removal support plate (301).

3. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The degumming mechanism (4) is rotatably arranged inside the degumming mechanism rotation groove (303), and the degumming mechanism (4) comprises a degumming support shaft (401) and a plurality of impellers (402) evenly distributed on the degumming support shaft (401); an upper limit ring (404) is fixedly connected to the bottom of the degumming support shaft (401), and a lower limit ring (403) is connected to the bottom of the upper limit ring (404); The upper limit ring (404) is rotatably arranged inside the degumming mechanism rotation groove (303), the lower limit ring (403) is rotatably arranged outside the degumming plate (3), the degumming disc (405) is fixedly arranged at the bottom of the lower limit ring (403), and a degumming brush (8) is fixedly arranged on the outer side of the degumming disc (405); A glue removal mechanism rotating groove sealing cover (308) is fixedly provided at the upper end of the glue removal mechanism rotating groove (303), and the upper end of the glue removal support shaft (401) is rotatably connected to the glue removal rotating groove sealing cover (308).

4. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: Both sides of the degumming box (2) are provided with degumming box through holes (204), and both sides of the degumming support plate (301) are fixedly provided with sealing plates (306), and the sealing plates (306) are fixedly connected with rubber sealing strips (307), and the rubber sealing strips (307) are engaged with the degumming box through holes (204), and the rubber sealing strips (307) are used to seal the degumming box through holes (204).

5. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The engaging rotation mechanism (5) comprises an engaging fixing block (505), and the second electric telescopic rod (501) is fixedly arranged on the upper and lower side surfaces of the engaging fixing block (505); The engaging fixing block (505) is fixedly connected to a rotating support shaft (502), one of the rotating support shafts (502) is fixedly connected to a manual rotating disk (503), and the manual rotating disk (503) is fixedly connected to a rotating handle (504); A rotating motor (506) is connected to the other rotating support shaft (502), the rotating support shaft (502) is fixedly arranged at the output end of the rotating motor (506), and the rotating motor (506) is fixedly arranged on the support frame (1).

6. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The first glue removal cover (201) and the second glue removal cover (202) are both provided with an air extraction hole (208), and the rubber guide tube (601) is slidably arranged inside the air extraction hole (208); The outer sides of the first glue removal cover (201) and the second glue removal cover (202) are both fixedly provided with an air extraction buffer block (205); the rubber guide tube (601) is connected to the air extraction buffer block (205); and the air extraction buffer block (205) is connected to the air pump via an air extraction air pipe (2051).

7. The photovoltaic silicon wafer cleaning and degumming machine according to claim 6, characterized in that: A plurality of evenly distributed drainage holes (207) are provided on the inner side of the air extraction hole (208) on the first glue removal cover (201) or the second glue removal cover (202); a drainage buffer block (206) is fixedly provided on the outer side surface of the first glue removal cover (201) or the second glue removal cover (202); the drainage holes (207) are communicated with the drainage buffer block (206); and the drainage buffer block (206) is connected to an external water pump via a drainage air pipe (2061).

8. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The upper end of the rubber guide tube (601) is fixedly connected to a leather cup (603), one side of the photovoltaic silicon wafer (10) is against the leather cup (603), and a spring (602) is provided between the glue removal box (2) and the leather cup (603), and the spring (602) is sleeved on the spring (602).

9. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: An ultrasonic generator (7) is fixedly arranged inside the first glue removal cover (201) and the second glue removal cover (202), and the ultrasonic generator (7) is fixedly arranged on one side of the positioning mechanism (6).

10. The photovoltaic silicon wafer cleaning and degumming machine according to claim 1, characterized in that: The support frame (1) is provided with symmetrically distributed rotating support arms (101), the engaging rotating mechanism (5) is rotatably provided on the rotating support arms (101), one side of the support frame (1) is connected to a telescopic rod fixing plate (103) via a telescopic rod support arm (102), the first electric telescopic rod (302) is fixedly provided on the telescopic rod fixing plate (103), and a support column (104) is fixedly provided at the bottom of the telescopic rod fixing plate (103).

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