Silicon wafer taking mechanism and silicon wafer taking method

Abstract

The invention provides a silicon wafer taking mechanism which comprises a first conveying part and a second conveying part, the second conveying part is located behind the first conveying part, and the first conveying part and the second conveying part convey silicon wafers in the same conveying direction; the first conveying part receives silicon wafers in a material basket arranged above the feeding end of the first conveying part at a first conveying speed, and outputs the silicon wafers to the second conveying part at a second conveying speed after acceleration; the second conveying part receives the silicon wafers output by the first conveying part at a second conveying speed. The first conveying part is low in conveying speed when bearing the silicon wafers, and when the silicon wafers fall to the first conveying part, relative slippage is not easy to generate between the silicon wafers and the conveying bearing surface of the first conveying part, so that belt marks cannot be generated on the surfaces of the silicon wafers. In addition, after the first conveying part obtains the silicon wafers, the silicon wafers are accelerated and then conveyed to the second conveying part at a high speed, the second conveying part conveys the silicon wafers to a subsequent conveying line, and the wafer taking speed of the silicon wafer taking mechanism can be increased.

Description

Technical Field

[0001] The present application relates to the field of silicon wafer processing, and in particular to a silicon wafer taking mechanism and a silicon wafer taking method. Background Art

[0002] During the production process of photovoltaic modules, silicon wafers need to be taken out from the basket one by one and transported to the downstream.

[0003] The existing silicon wafer fetching mechanism includes a conveying part, and the fetching end of the conveying part is located below the material basket. By controlling the material basket to descend, the silicon wafer falls to the fetching end of the conveying part, and the fetched silicon wafer is continuously conveyed to the rear channel through the conveying part.

[0004] When the wafer picking speed of the conveyor is increased to match the downstream conveyor speed, the silicon wafers are stationary in the basket due to the high speed of the conveyor. When the silicon wafers fall on the wafer picking end of the fast-speed conveyor, they are very easy to slip, resulting in belt marks. The belt marks will affect the quality of the silicon wafers and even make them scrapped. Summary of the invention

[0005] In view of the above technical problems existing in the existing silicon wafer taking mechanism, the present application provides a new silicon wafer taking mechanism, and its detailed technical solution is as follows:

[0006] A silicon wafer taking mechanism comprises a first conveying part and a second conveying part, wherein:

[0007] The second conveying part is located behind the first conveying part, and the feeding end of the second conveying part is connected with the discharging end of the first conveying part, and the first conveying part and the second conveying part convey the silicon wafers in the same conveying direction;

[0008] The first conveyor is configured to receive silicon wafers in a basket disposed above a feeding end of the first conveyor at a first conveying speed, and to output the silicon wafers to the second conveyor at a second conveying speed after acceleration;

[0009] The second conveyor is configured to receive the silicon wafer outputted by the first conveyor at a second conveying speed.

[0010] The silicon wafer fetching mechanism of the present application is configured as a segmented mechanism including a first conveying part and a second conveying part, and the material end of the second conveying part is docked with the material discharge end of the first conveying part. In this way, during the fetching process, the conveying speeds of the first conveying part and the second conveying part can be configured so that the first conveying part receives the silicon wafer at zero or a lower conveying speed. Therefore, when the silicon wafer falls to the first conveying part, it is not easy for the silicon wafer and the conveying bearing surface of the first conveying part to have relative slippage, and no belt marks will be produced on the surface of the silicon wafer. After the first conveying part obtains the silicon wafer, it accelerates and conveys the silicon wafer to the second conveying part at a higher speed, and then the second conveying part conveys the silicon wafer to the subsequent conveying line, thereby improving the fetching speed of the silicon wafer fetching mechanism of the present application.

[0011] In some embodiments, the second conveying unit is further configured to convey the silicon wafer backward at a second conveying speed.

[0012] In some embodiments, the second conveyor is further configured to output the silicon wafer to the third conveyor at a third conveying speed after deceleration, and the third conveyor is configured to convey the silicon wafer at the third conveying speed.

[0013] The third conveyor can be a back-end conveyor line or a transition conveyor line between the second conveyor and the back-end conveyor line. The third conveyor is used to convey the silicon wafers toward the back-end processing station (such as the inspection station) at a uniform speed. If the second conveying speed of the second conveyor when receiving the silicon wafer is set to be equal to the conveying speed of the third conveyor, the second conveyor keeps conveying the silicon wafer toward the third conveyor at the second conveying speed, which can ensure that the silicon wafer smoothly transitions from the second conveyor to the third conveyor. Of course, in order to increase the wafer picking speed of the first conveyor, the second conveying speed can be set to be greater than the conveying speed of the third conveyor. At this time, the second conveyor needs to decelerate after receiving the silicon wafer, so that the silicon wafer transitions to the third conveyor at a third conveying speed equal to the conveying speed of the third conveyor, so as to ensure that the silicon wafer smoothly transitions from the second conveyor to the third conveyor.

[0014] In some embodiments, the length of the first conveying portion along the conveying direction does not exceed: the sum of the length of the silicon wafer along the conveying direction and the spacing between adjacent silicon wafers; and / or the length of the second conveying portion along the conveying direction does not exceed: the sum of the length of the silicon wafer along the conveying direction and the spacing between adjacent silicon wafers; the spacing between adjacent silicon wafers is the distance between two adjacent silicon wafers when the silicon wafer to be inspected is conveyed to the back-end inspection area.

[0015] By setting the conveying length of the first conveying part as above, there is only one silicon wafer on the first conveying part at the same time, so as to prevent the silicon wafers in the basket from falling onto the first conveying part while the first conveying part is carrying the silicon wafers and conveying them to the second conveying part, thereby interfering with the conveying of the silicon wafers already on the first conveying part.

[0016] By setting the conveying length of the second conveying section as above, there is only one silicon wafer on the second conveying section at the same time. When the second conveying section needs to be decelerated, only the only silicon wafer on the second conveying section is decelerated to reduce the interference caused by multiple silicon wafers, thereby ensuring that the spacing between the silicon wafers conveyed by the second conveying section is uniform and meets the predetermined requirements.

[0017] In some embodiments, the silicon wafer picking mechanism also includes a tidying component arranged on both sides of the second conveying portion, and the tidying component is configured to tidy the silicon wafers on the second conveying portion so that the edges on both sides of the silicon wafers passing through the second conveying portion are parallel to the conveying direction.

[0018] By arranging the aligning components on both sides of the second conveying part, the silicon wafers on the second conveying part are aligned, thereby ensuring that the edges on both sides of the silicon wafers are parallel to the conveying direction.

[0019] In some embodiments, the first conveying section includes a first support seat and a second support seat which are arranged in parallel and symmetrically, and a first conveyor belt and a second conveyor belt are respectively provided on the first support seat and the second support seat, and the first conveyor belt and the second conveyor belt cooperate to receive the silicon wafers in the material basket at a first conveying speed, and output the silicon wafers to the second conveying section at a second conveying speed after acceleration; the second conveying section includes a mounting bracket, and a third conveyor belt and a fourth conveyor belt are respectively provided on the mounting bracket, and the third conveyor belt and the fourth conveyor belt cooperate to receive the silicon wafers output by the first conveying section at the second conveying speed.

[0020] Two parallel conveyor belts are used to support and transport silicon wafers, which ensures stable transportation of silicon wafers and provides sufficient installation space for other components (such as adsorption mechanisms).

[0021] In some embodiments, one end of the first support seat and the second support seat close to the second conveying portion is fixedly mounted on the mounting bracket.

[0022] The installation and fixation of the first supporting seat and the second supporting seat are realized, and the docking of the first conveying part and the second conveying part is ensured.

[0023] In some embodiments, the first support base, the second support base and the mounting bracket are an integrally formed structure.

[0024] In some embodiments, the first conveying unit further includes a first adsorption structure, and the first adsorption structure is configured to adsorb the silicon wafer onto a conveying surface of the first conveying unit.

[0025] By arranging the first adsorption structure on the first conveying part, the silicon wafer on the first conveying part is adsorbed, so as to prevent the silicon wafer from slipping and forming belt marks when the first conveying part is accelerated.

[0026] In some embodiments, the first adsorption structure is a suction cup, the suction cup is located between the first conveyor belt and the second conveyor belt, and the adsorption surface of the suction cup is lower than the conveying surface of the first conveying part.

[0027] The suction cup implements non-contact adsorption of the silicon wafer, which will not hinder the transportation of the silicon wafer while ensuring the adsorption effect.

[0028] In some embodiments, the first adsorption structure includes a first adsorption unit and a second adsorption unit. The first adsorption unit is extended along the conveying direction close to the first conveyor belt, and the second adsorption unit is extended along the conveying direction close to the second conveyor belt. The first adsorption unit and the second adsorption unit have the same structure. The first adsorption unit includes a first guide seat, which is installed on a first support seat. A first air cavity is formed between the first guide seat and the first support seat. A first air flow guide gap connected to the first air cavity is formed between the first guide seat and the first support seat. A first air supply port is provided on the first guide seat. Compressed gas enters the first air cavity through the first air supply port, and then flows out from the first air cavity through the first air cavity. The negative pressure generated based on the Bernoulli effect causes the silicon wafer to be non-contactly adsorbed on the conveying surface of the first conveying part.

[0029] The first adsorption unit and the second adsorption unit adsorb the silicon wafer on the conveying surface of the first conveying part in a non-contact manner through the negative pressure generated by the Bernoulli effect, and the conveying of the silicon wafer is not hindered while ensuring the adsorption effect.

[0030] In some embodiments, the second conveying unit further includes a second adsorption structure, and the second adsorption structure is configured to adsorb the silicon wafer onto a conveying surface of the second conveying unit.

[0031] By arranging the second adsorption structure on the second conveying part, the adsorption of the silicon wafer on the second conveying part is achieved, thereby preventing the silicon wafer from slipping and forming belt marks when the second conveying part is decelerated.

[0032] In some embodiments, the second adsorption structure is a suction cup, which is mounted on the mounting bracket and located between the third conveyor belt and the fourth conveyor belt, and the adsorption surface of the suction cup is lower than the conveying surface of the second conveying part.

[0033] The suction cup implements non-contact adsorption of the silicon wafer, which will not hinder the transportation of the silicon wafer while ensuring the adsorption effect.

[0034] In some embodiments, the second conveying part also includes a third support seat and a fourth support seat which are arranged in parallel and symmetrically on the mounting bracket, and a third conveyor belt and a fourth conveyor belt are respectively provided on the third support seat and the fourth support seat, and the third conveyor belt and the fourth conveyor belt cooperate to receive the silicon wafers output by the first conveying part at a second conveying speed; the second adsorption structure includes a third adsorption unit and a fourth adsorption unit, the third adsorption unit is extended along the conveying direction close to the third conveyor belt, and the fourth adsorption unit is extended along the conveying direction close to the fourth conveyor belt, and the third adsorption unit and the fourth adsorption unit have the same structure; the third adsorption unit includes a third guide seat, and the third guide seat is installed on the third support seat, an air cavity is formed between the third guide seat and the third support seat, and a third airflow guide slot connected to the air cavity is formed between the third guide seat and the third support seat, and a third air supply port is provided on the third guide seat, and compressed gas enters the third air cavity through the third air supply port, and then flows out from the third air cavity through the third air flow guide slot to non-contactly adsorb the silicon wafer on the conveying surface of the second conveying part based on the negative pressure generated by the Bernoulli effect.

[0035] The third adsorption unit and the fourth adsorption unit adsorb the silicon wafer on the conveying surface of the second conveying part in a non-contact manner through the negative pressure generated by the Bernoulli effect, and the conveying of the silicon wafer is not hindered while ensuring the adsorption effect.

[0036] In some embodiments, the first conveying portion and the second conveying portion are on the same straight line, and the first conveying portion and the second conveying portion are independently driven by a first driving device and a second driving device respectively.

[0037] The first conveying unit and the second conveying unit are independently driven by different driving devices, so that the conveying speeds of the first conveying unit and the second conveying unit can be independently controlled.

[0038] The present application also provides a silicon wafer picking method, which is implemented by the silicon wafer picking mechanism described in any of the above items, and the silicon wafer picking method includes: controlling the first conveying part to receive the silicon wafers in the material basket arranged above the feeding end of the first conveying part at a first conveying speed; controlling the first conveying part to accelerate and then output the silicon wafers to the second conveying part at a second conveying speed, and at the same time, controlling the second conveying part to receive the silicon wafers output by the first conveying part at the second conveying speed.

[0039] In the silicon wafer fetching method provided by the present application, since the conveying speed of the first conveying part when receiving the silicon wafer is zero or low, when the silicon wafer falls to the first conveying part, it is not easy for the silicon wafer and the conveying bearing surface of the first conveying part to have relative slippage, so no belt mark will be produced on the surface of the silicon wafer. In addition, after the first conveying part obtains the silicon wafer, it accelerates the silicon wafer and conveys the silicon wafer to the second conveying part at a higher speed, and the second conveying part conveys the silicon wafer to the subsequent conveying line, which can effectively improve the fetching speed of the silicon wafer fetching mechanism.

[0040] In some embodiments, after the second conveying unit receives the silicon wafer outputted by the first conveying unit, the second conveying unit is controlled to convey the silicon wafer backward at a second conveying speed.

[0041] In some embodiments, after the second conveyor receives the silicon wafer outputted by the first conveyor, the second conveyor is controlled to decelerate and output the silicon wafer to the third conveyor at a third conveying speed, and the third conveyor is controlled to convey the silicon wafer at the third conveying speed.

[0042] The third conveyor can be a back-end conveyor line or a transition conveyor line between the second conveyor and the back-end conveyor line. The third conveyor is used to convey the silicon wafers toward the back-end processing station (such as the inspection station) at a uniform speed. If the second conveying speed of the second conveyor when receiving the silicon wafer is set to be equal to the conveying speed of the third conveyor, the second conveyor keeps conveying the silicon wafer toward the third conveyor at the second conveying speed, which can ensure that the silicon wafer smoothly transitions from the second conveyor to the third conveyor. Of course, in order to increase the wafer picking speed of the first conveyor, the second conveying speed can be set to be greater than the conveying speed of the third conveyor. At this time, the second conveyor needs to decelerate after receiving the silicon wafer, so that the silicon wafer transitions to the third conveyor at a third conveying speed equal to the conveying speed of the third conveyor, so as to ensure that the silicon wafer smoothly transitions from the second conveyor to the third conveyor. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A schematic diagram of a silicon wafer taking mechanism in an embodiment of the present application;

[0044] Figure 2 Schematic diagram of the structure of the silicon wafer taking mechanism in the embodiment of the present application;

[0045] Figure 3 It is a structural schematic diagram of the first conveying unit in an embodiment of the present application at a viewing angle;

[0046] Figure 4 is a schematic diagram of a half-section structure of the first conveying unit in the embodiment of the present application at another viewing angle;

[0047] Figure 5 It is a structural schematic diagram of the second conveying unit in an embodiment of the present application at a viewing angle;

[0048] Figure 6 Schematic diagram of the cross-sectional structure of the third support seat and the third adsorption unit in the embodiment of the present application;

[0049] Figure 7 It is a schematic structural diagram of the third adsorption unit in an embodiment of the present application at a viewing angle;

[0050] Figure 8is a schematic structural diagram of the third adsorption unit in the embodiment of the present application from another viewing angle;

[0051] Fig. 9 Schematic diagram of the distance between two adjacent silicon wafers;

[0052] Figures 1 to 9 Included:

[0053] First conveying unit 1:

[0054] A first support seat 11;

[0055] A second support seat 12;

[0056] A first conveyor belt 13;

[0057] A second conveyor belt 14;

[0058] The first adsorption unit 15: a first air guide seat 151, a first air flow guiding slot 152, a first air supply port 153, and a first air inlet connector 154;

[0059] The second adsorption unit 16: a second air guide seat 161, a second air flow guiding slot 162, and a second air supply port 163;

[0060] Second conveying unit 2:

[0061] Mounting bracket 21;

[0062] The third conveyor belt 22;

[0063] Fourth conveyor belt 23;

[0064] A third support seat 24;

[0065] Fourth support seat 25;

[0066] The third adsorption unit 26: a third air guide seat 261, a third air flow guiding slot 262, a third air supply port 263, a third air cavity 264, and a third air inlet connector 265;

[0067] The fourth adsorption unit 27: a fourth air guide seat 271, a fourth air flow guiding slot 272, and a fourth air supply port 273;

[0068] Material basket 100 and silicon wafer 200. DETAILED DESCRIPTION

[0069] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0070] The existing silicon wafer fetching mechanism includes a conveying part, and the fetching end of the conveying part is located below the material basket. By controlling the material basket to descend, the silicon wafer falls to the fetching end of the conveying part, and the fetched silicon wafer continues to be conveyed to the back-end through the conveying part. When the fetching speed of the conveying part is increased to adapt to the back-end conveying speed, due to the fast rotation speed of the conveying part, the silicon wafer is in a stationary state in the material basket. When the silicon wafer falls on the fetching end of the conveying part with a fast rotation speed, it is very easy to slip, thereby generating belt marks. The generation of belt marks will affect the quality of the silicon wafer and even make the silicon wafer scrapped.

[0071] To this end, the present application provides a segmented structure of a silicon wafer taking mechanism, which does not produce belt marks on the surface of the silicon wafer when taking the wafer from the basket. Figure 1 and Figure 2 As shown, the silicon wafer fetching mechanism in the embodiment of the present application includes a first conveying unit 1 and a second conveying unit 2, wherein:

[0072] The second conveying part 2 is located behind the first conveying part 1, and the feeding end of the second conveying part 2 is connected to the discharging end of the first conveying part 1. The first conveying part 1 and the second conveying part 2 are conveyed in the same direction (such as Figure 1 The silicon wafer is transported in the X-axis direction.

[0073] The first conveyor part 1 is configured to receive the silicon wafers 200 in the basket 100 disposed above the feeding end of the first conveyor part 1 at a first conveying speed, and output the silicon wafers to the second conveyor part at a second conveying speed after acceleration.

[0074] Optionally, the basket 100 is mounted on a lifting mechanism, the silicon wafers 200 are stacked in the basket in a vertical direction, the feeding end of the first conveying unit 1 is inserted into the bottom of the basket 100, and the lifting mechanism drives the basket 100 to descend in a stepping drive manner. Each time the basket 100 descends, the silicon wafer 200 at the bottom falls onto the feeding end of the first conveying unit 1. The specific value of the first conveying speed can be selected and set according to the silicon wafer 200 to be taken, so as to ensure that the silicon wafer 200 does not slip or produce belt marks when it falls on the feeding end of the first conveying unit 1. Of course, the first conveying speed can also be set to zero, that is, the first conveying unit 1 receives the silicon wafer 200 falling from the basket in a stationary state.

[0075] The second conveyor 2 is configured to receive the silicon wafers outputted from the first conveyor 1 at a second conveying speed. That is, after the first conveyor 1 is accelerated, it conveys the silicon wafers to the second conveyor 2 at the second conveying speed. At the same time, the second conveyor 2 also receives the silicon wafers outputted from the first conveyor 1 at the second conveying speed, so that the silicon wafers can be smoothly transferred from the first conveyor 1 to the second conveyor 2, and the silicon wafers can be prevented from slipping during the transition and leaving belt marks.

[0076] It can be seen that the silicon wafer fetching mechanism in the embodiment of the present application is arranged as a segmented mechanism including a first conveying part 1 and a second conveying part 2, and the feed end of the second conveying part 2 is butted against the discharge end of the first conveying part 1. In this way, during the fetching process, the conveying speeds of the first conveying part 1 and the second conveying part 2 can be set. The first conveying part 1 is made to receive the silicon wafer at a lower conveying speed. Therefore, when the silicon wafer falls to the first conveying part 1, it is not easy for the silicon wafer to slip relative to the conveying bearing surface of the first conveying part 1, and no belt marks will be produced on the surface of the silicon wafer. In addition, in the segmented structure of the silicon wafer fetching mechanism proposed in the present application, the feed end of the second conveying part 2 is butted against the discharge end of the first conveying part 1, and the silicon wafer can be transferred between the first conveying part 1 and the second conveying part 2 without stopping, which helps to improve the fetching efficiency of the silicon wafer fetching mechanism.

[0077] After the first conveyor 1 obtains the silicon wafer, it accelerates and conveys the silicon wafer to the second conveyor 2 at a higher speed. Then the second conveyor 2 conveys the silicon wafer to the subsequent conveyor line, thereby improving the wafer picking speed of the silicon wafer picking mechanism in the embodiment of the present application.

[0078] After receiving the silicon wafer, the second conveyor 2 conveys the silicon wafer to the third conveyor of the back-end. The third conveyor can be a back-end conveyor line in the back-end silicon wafer processing equipment, or a transition conveyor line between the second conveyor and the back-end conveyor. The third conveyor is used to uniformly convey the silicon wafer received from the second conveyor 2 toward the back-end processing station (such as the inspection station).

[0079] In order to ensure that the silicon wafers output by the second conveyor part 2 can be smoothly transferred to the third conveyor part, optionally, the second conveying speed of the second conveyor part 2 when receiving the silicon wafers is set to be equal to the conveying speed of the third conveyor part. In this way, after receiving the silicon wafers, the second conveyor part 2 can keep conveying the silicon wafers backward at the second conveying speed, so that the silicon wafers are transferred to the third conveyor part at the second conveying speed, preventing the silicon wafers from slipping during the transition and leaving belt marks.

[0080] Of course, in order to increase the wafer picking speed of the first conveyor 1, the second conveyor speed can also be set to be greater than the conveyor speed of the third conveyor. At this time, the second conveyor 2 is configured to output the silicon wafer to the third conveyor at the third conveyor speed after deceleration, and the third conveyor speed is equal to the conveyor speed of the third conveyor. In other words, the second conveyor 2 needs to decelerate after receiving the silicon wafer, so that the silicon wafer is transferred to the third conveyor at the third conveyor speed equal to the conveyor speed of the third conveyor. Only in this way can the silicon wafer be smoothly transferred from the second conveyor to the third conveyor, and the silicon wafer is prevented from slipping during the transition and leaving belt marks.

[0081] Optionally, the first conveying part 1 and the second conveying part 2 are on the same straight line, and the first conveying part 1 and the second conveying part 2 are independently driven by a first driving device and a second driving device respectively.

[0082] The first conveying unit 1 and the second conveying unit 2 are independently driven by different driving devices, so that the conveying speeds of the first conveying unit 1 and the second conveying unit 2 can be independently controlled.

[0083] As known to those skilled in the art, when the third conveyor transports the silicon wafers to the subsequent processing station, the wafer spacing A between adjacent silicon wafers (i.e., Fig. 9 The distance between the centers of the two silicon wafers 200 shown in FIG. 1 needs to be uniform and meet predetermined requirements, such as matching the length of a subsequent processing station to ensure that only one silicon wafer is at the processing station at the same time.

[0084] In view of this, optionally, the length of the first conveyor 1 along the conveying direction is set to not exceed: the sum of the length of the silicon wafer along the conveying direction and the inter-wafer spacing between adjacent silicon wafers. With such a setting, it is possible to achieve that only one silicon wafer exists on the first conveyor 1 at the same time, and to avoid the silicon wafers in the basket falling to the first conveyor while the first conveyor carries the silicon wafers and conveys them to the second conveyor, thereby interfering with the conveying of the silicon wafers already on the first conveyor. In other words, each silicon wafer undergoes exactly the same acceleration process, thereby ensuring that the inter-wafer spacing between adjacent silicon wafers is the same.

[0085] Similarly, when the second conveyor 2 needs to decelerate the conveying of silicon wafers, the length of the second conveyor 2 along the conveying direction can also be set to not exceed: the sum of the length of the wafer along the conveying direction and the inter-wafer spacing between adjacent silicon wafers. In this way, there is only one silicon wafer on the second conveyor at the same time. When the second conveyor needs to decelerate, only the only silicon wafer on the second conveyor is decelerated to reduce the interference caused by multiple silicon wafers, thereby ensuring that the inter-wafer spacing of the silicon wafers conveyed by the second conveyor is uniform and meets the predetermined requirements.

[0086] Optionally, the silicon wafer picking mechanism in the embodiment of the present application also includes a tidying component arranged on both sides of the second conveying part 2, and the tidying component is configured to tidy the silicon wafers located on the second conveying part 2 so that the edges on both sides of the silicon wafers passing through the second conveying part 2 are parallel to the conveying direction.

[0087] The regularization component can adopt various types of existing regularization components, such as the regularization component including the first regularization plate and the second regularization plate arranged on both sides of the second conveying part 2 and parallel to the conveying direction. When the silicon wafer passes between the first regularization plate and the second regularization plate, the first regularization plate and the second regularization plate move closer to the middle piece, wherein the first regularization plate contacts the first side edge of the silicon wafer, and the second regularization plate contacts the second side edge of the silicon wafer, thereby implementing regularization of the two side edges of the silicon wafer. In order not to hinder the conveying of the silicon wafer, rollers are arranged on the first regularization rod and the second regularization rod.

[0088] like Figures 2 to 5 As shown, optionally, the first conveying part 1 includes a first supporting seat 11 and a second supporting seat 12 which are arranged in parallel and symmetrically, and a first conveying belt 13 and a second conveying belt 14 are respectively provided on the first supporting seat 11 and the second supporting seat 12. The first conveying belt 13 and the second conveying belt 14 cooperate to receive the silicon wafers in the material basket at a first conveying speed, and output the silicon wafers to the second conveying part 2 at a second conveying speed after acceleration.

[0089] The second conveying part 2 includes a mounting bracket 21 , on which a third conveying belt 22 and a fourth conveying belt 23 are respectively provided. The third conveying belt 22 and the fourth conveying belt 23 cooperate to receive the silicon wafers outputted from the first conveying part 1 at a second conveying speed.

[0090] Optionally, one end of the first support seat 11 and the second support seat 12 close to the second conveying unit 2 is fixedly mounted on the mounting bracket 21. In this way, the first support seat 11 and the second support seat 12 are installed and fixed, and the first conveying unit 1 and the second conveying unit 2 can be stably docked.

[0091] Optionally, the first support seat 11, the second support seat 12 and the mounting bracket 21 are an integrally formed structure. The integrally formed structure can improve the flatness between the conveying surfaces of the first conveying part 1 and the second conveying part 2.

[0092] As mentioned above, after receiving the silicon wafer, the first conveyor 1 needs to accelerate the conveying of the silicon wafer. In order to prevent the silicon wafer from slipping and forming belt marks during the accelerated conveying process, the first conveyor 1 optionally further includes a first adsorption structure, which is configured to adsorb the silicon wafer on the conveying surface of the first conveyor 1.

[0093] like Figure 3 to Figure 4 As shown, optionally, the first adsorption structure includes a first adsorption unit 15 and a second adsorption unit 16, wherein the first adsorption unit 15 is close to the first conveyor belt 13 and extends along the conveying direction, and the second adsorption unit 16 is close to the second conveyor belt 14 and extends along the conveying direction.

[0094] Optionally, the first adsorption unit 15 and the second adsorption unit 16 have the same structure and are symmetrically arranged.

[0095] The first adsorption unit 15 includes a first flow guide seat 151, which is mounted on the first support seat 11, a first air cavity (not shown in the figure) is formed between the first flow guide seat 151 and the first support seat 11, a first air flow guide slot 152 connected to the first air cavity is formed between the first flow guide seat 151 and the first support seat 11, and a first air supply port 153 is also provided on the first flow guide seat 151. Compressed gas enters the first air cavity through the first air supply port 153, and then flows out of the first air flow guide slot 152 at a high speed through the first air cavity, thereby non-contactingly adsorbing the silicon wafer on the conveying surface of the first conveying part 1 with the negative pressure generated based on the Bernoulli effect. Optionally, the first air supply port 153 is connected to a first air inlet connector 154 for docking with a compressed gas pipeline.

[0096] The second adsorption unit 16 includes a second flow guide seat 161, which is mounted on the second support seat 12, a second air cavity (not shown in the figure) is formed between the second flow guide seat 161 and the second support seat 12, a second air flow guide slot 162 connected to the second air cavity is formed between the second flow guide seat 161 and the second support seat 12, and a second air supply port 163 is also provided on the second flow guide seat 161. Compressed gas enters the second air cavity through the second air supply port 163, and then flows out of the second air flow guide slot 162 at a high speed through the second air cavity, thereby non-contactingly adsorbing the silicon wafer on the conveying surface of the first conveying part 1 with the negative pressure generated based on the Bernoulli effect. Optionally, the second air supply port 163 is connected to a second air inlet connector that is connected to the compressed gas pipeline.

[0097] The first adsorption unit 15 and the second adsorption unit 16 adsorb the silicon wafer on the conveying surface of the first conveying part 1 in a non-contact manner through the negative pressure generated by the Bernoulli effect, and the conveying of the silicon wafer is not hindered while ensuring the adsorption effect.

[0098] Figure 3 to Figure 4 In the illustrated embodiment, the first guide seat 151 of the first adsorption unit 15 is installed on the outside of the first support seat 11, and accordingly, the airflow outlet of the first airflow guide slot 152 of the first adsorption unit 15 is tilted upward and toward the outside of the first conveyor belt 13. The second guide seat 161 of the second adsorption unit 16 is installed on the outside of the second support seat 12, and accordingly, the second airflow guide slot 162 of the second adsorption unit 16 is tilted upward and toward the outside of the second conveyor belt 14.

[0099] Of course, the first guide seat 151 of the first adsorption unit 15 can also be installed on the inner side of the first support seat 11, and accordingly, the airflow outlet of the first airflow guide slot 152 of the first adsorption unit 15 is tilted upward and toward the inner side of the first conveyor belt 13. Similarly, the second guide seat 161 of the second adsorption unit 16 can also be installed on the inner side of the second support seat 12, and accordingly, the second airflow guide slot 162 of the second adsorption unit 16 is tilted upward and toward the inner side of the second conveyor belt 14.

[0100] The first adsorption structure may also be a suction cup disposed between the first conveyor belt 13 and the second conveyor belt 14. Preferably, the suction cup is a Bernoulli suction cup.

[0101] As described in the above embodiments, optionally, after receiving the silicon wafer, the second conveyor 2 needs to implement decelerated conveying of the silicon wafer. In order to prevent the silicon wafer from slipping and forming belt marks during the decelerated conveying process, the second conveyor 2 optionally further includes a second adsorption structure, which is configured to adsorb the silicon wafer on the conveying surface of the second conveyor 2.

[0102] Optional, such as Figures 4 to 8 As shown, the second conveying part 2 also includes a third support seat 24 and a fourth support seat 25 which are parallelly and symmetrically arranged on the mounting bracket 21, and a third conveying belt 22 and a fourth conveying belt 23 are respectively provided on the third support seat 24 and the fourth support seat 25. The third conveying belt 22 and the fourth conveying belt 23 cooperate to receive the silicon wafers output by the first conveying part 1 at a second conveying speed.

[0103] The second adsorption structure includes a third adsorption unit 26 and a fourth adsorption unit 27. The third adsorption unit 26 is close to the third conveyor belt 22 and extends along the conveying direction. The fourth adsorption unit 27 is close to the fourth conveyor belt 23 and extends along the conveying direction.

[0104] The third adsorption unit 26 and the fourth adsorption unit 27 have the same structure and are symmetrically arranged. Specifically:

[0105] The third adsorption unit 26 includes a third flow guide seat 261, which is mounted on the third support seat 24, a third air cavity 264 is formed between the third flow guide seat 261 and the third support seat 24, a third air flow guide slot 262 connected to the third air cavity 264 is formed between the third flow guide seat 261 and the third support seat 24, and a third air supply port 263 is provided on the third flow guide seat 261. Compressed gas enters the air cavity through the third air supply port 263, and then flows out of the third air flow guide slot 262 through the air cavity, so that the silicon wafer is non-contactly adsorbed on the conveying surface of the second conveying part 2 with the negative pressure generated based on the Bernoulli effect. Optionally, a third air inlet connector 265 that is connected to the compressed gas pipeline is provided in the third air supply port 263.

[0106] The fourth adsorption unit 27 includes a fourth flow guide seat 271, which is mounted on the fourth support seat 25, a fourth air cavity is formed between the fourth flow guide seat 271 and the fourth support seat 25, a fourth air flow guide slot 272 connected to the fourth air cavity is formed between the fourth flow guide seat 271 and the fourth support seat 25, and a fourth air supply port 273 is provided on the fourth flow guide seat 271. Compressed gas enters the fourth air cavity through the fourth air supply port 273, and then flows out from the fourth air flow guide slot 272 through the fourth air cavity, thereby non-contact adsorption of the silicon wafer on the conveying surface of the second conveying part 2 by the negative pressure generated based on the Bernoulli effect. Optionally, a fourth air inlet connector that is connected to the compressed gas pipeline is provided in the fourth air supply port 273.

[0107] The third adsorption unit 26 and the fourth adsorption unit 27 adsorb the silicon wafer on the conveying surface of the second conveying part 2 in a non-contact manner through the negative pressure generated by the Bernoulli effect, and the conveying of the silicon wafer is not hindered while ensuring the adsorption effect.

[0108] Figures 4 to 8 In the illustrated embodiment, the third guide seat 261 of the third adsorption unit 26 is installed on the inner side of the third support seat 24, and accordingly, the airflow outlet of the third airflow guide slot 262 of the third adsorption unit 26 is tilted upward and toward the inner side of the third conveyor belt 22. The fourth guide seat 271 of the fourth adsorption unit 27 is installed on the inner side of the fourth support seat 25, and accordingly, the airflow outlet of the fourth airflow guide slot 272 of the fourth adsorption unit 27 is tilted upward and toward the inner side of the fourth conveyor belt 23.

[0109] Of course, the third guide seat 261 of the third adsorption unit 26 and the fourth guide seat 271 of the fourth adsorption unit 27 can also be installed on the outside of the third support seat 24 and the fourth support seat 25 respectively according to the setting method of the first adsorption unit and the second adsorption unit in the previous embodiment, so that the airflow blowing outlet of the third airflow guide slot 262 of the third adsorption unit 26 is inclined upward and toward the outside of the third conveyor belt 22, and the airflow blowing outlet of the fourth airflow guide slot 272 of the fourth adsorption unit 27 is inclined upward and toward the outside of the fourth conveyor belt 23.

[0110] The second adsorption structure may also be a suction cup disposed between the third conveyor belt 22 and the fourth conveyor belt 23. Preferably, the suction cup is a Bernoulli suction cup.

[0111] The embodiment of the present application further provides a silicon wafer taking method, which is implemented by the silicon wafer taking mechanism provided by any of the above embodiments, and the silicon wafer taking method includes:

[0112] The first conveying part is controlled to receive the silicon wafers in the material basket arranged above the feeding end of the first conveying part at a first conveying speed.

[0113] After the first conveying part is accelerated, the silicon wafer is output to the second conveying part at a second conveying speed. Meanwhile, the second conveying part is controlled to receive the silicon wafer output from the first conveying part at the second conveying speed.

[0114] Since the conveying speed of the first conveyor unit when receiving the silicon wafer is zero or low, when the silicon wafer falls to the first conveyor unit, it is not easy to cause relative slip between the silicon wafer and the conveying bearing surface of the first conveyor unit, so no belt mark will be generated on the surface of the silicon wafer. In addition, after the first conveyor unit obtains the silicon wafer, it accelerates the silicon wafer and conveys the silicon wafer to the second conveyor unit at a higher speed, and the second conveyor unit conveys the silicon wafer to the subsequent conveyor line, which can effectively improve the wafer taking speed of the silicon wafer taking mechanism.

[0115] After receiving the silicon wafer, the second conveyor conveys the silicon wafer to the third conveyor of the back-end. The third conveyor can be a back-end conveyor line in the back-end silicon wafer processing equipment, or a transition conveyor line between the second conveyor and the back-end conveyor. The third conveyor is used to uniformly convey the silicon wafer received from the second conveyor toward the back-end processing station (such as the inspection station).

[0116] In order to ensure that the silicon wafers output by the second conveying part can be smoothly transferred to the third conveying part, optionally, after the second conveying part receives the silicon wafers output by the first conveying part, the second conveying part is controlled to convey the silicon wafers backward at a second conveying speed.

[0117] That is to say, the second conveying speed of the second conveying unit when receiving the silicon wafer is set to be equal to the conveying speed of the third conveying unit. In this way, after receiving the silicon wafer, the second conveying unit can continue to convey the silicon wafer backward at the second conveying speed, so that the silicon wafer can be transferred to the third conveying unit at the second conveying speed.

[0118] Of course, in order to increase the wafer taking speed of the first conveying unit, the second conveying speed may also be set to be greater than the conveying speed of the third conveying unit. In view of this, optionally, after the second conveying unit receives the silicon wafer outputted by the first conveying unit, the second conveying unit is controlled to decelerate and output the silicon wafer to the third conveying unit at the third conveying speed, and the third conveying unit is controlled to transport the silicon wafer at the third conveying speed.

[0119] That is to say, the second conveyor part needs to slow down after receiving the silicon wafers, so that the silicon wafers are transferred to the third conveyor part at a third conveying speed equal to the conveying speed of the third conveyor part, so as to ensure that the silicon wafers are smoothly transferred from the second conveyor part to the third conveyor part.

[0120] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A silicon wafer taking mechanism, characterized in that: The silicon wafer taking mechanism comprises a first conveying part and a second conveying part, wherein: The second conveying part is located behind the first conveying part, and the feeding end of the second conveying part is connected with the discharging end of the first conveying part, and the first conveying part and the second conveying part convey the silicon wafers in the same conveying direction; The first conveying part is configured to receive silicon wafers in a basket disposed above a feeding end of the first conveying part at a first conveying speed, and to output the silicon wafers to the second conveying part at a second conveying speed after acceleration; The second conveyor is configured to receive the silicon wafer outputted by the first conveyor at the second conveying speed.

2. The silicon wafer taking mechanism according to claim 1, characterized in that: The second conveying unit is further configured to convey the silicon wafer backward at a second conveying speed; or, The second conveying unit is further configured to output the silicon wafers to the third conveying unit at a third conveying speed after deceleration, and the third conveying unit is configured to convey the silicon wafers at the third conveying speed.

3. The silicon wafer taking mechanism according to claim 1, characterized in that: The length of the first conveying portion along the conveying direction does not exceed: the sum of the length of the silicon wafer along the conveying direction and the inter-slice distance between adjacent silicon wafers; and / or the length of the second conveying portion along the conveying direction does not exceed: the sum of the length of the silicon wafer along the conveying direction and the inter-slice distance between adjacent silicon wafers; The inter-wafer spacing between adjacent silicon wafers is the distance between two adjacent silicon wafers when the silicon wafer to be inspected is transported to the back-end inspection area.

4. The silicon wafer taking mechanism according to claim 1, characterized in that: The silicon wafer taking mechanism also includes a tidying component arranged on both sides of the second conveying part, and the tidying component is configured to tidy the silicon wafers on the second conveying part so that the edges on both sides of the silicon wafers passing through the second conveying part are parallel to the conveying direction.

5. The silicon wafer taking mechanism according to claim 1, characterized in that: The first conveying part comprises a first supporting seat and a second supporting seat which are arranged in parallel and symmetrically, and a first conveying belt and a second conveying belt are respectively arranged on the first supporting seat and the second supporting seat, and the first conveying belt and the second conveying belt cooperate to receive the silicon wafers in the material basket at the first conveying speed, and output the silicon wafers to the second conveying part at the second conveying speed after being accelerated; The second conveying part includes a mounting bracket, on which a third conveying belt and a fourth conveying belt are respectively provided. The third conveying belt and the fourth conveying belt cooperate to receive the silicon wafers outputted by the first conveying part at the second conveying speed.

6. The silicon wafer taking mechanism according to claim 5, characterized in that: One end of the first supporting seat and the second supporting seat close to the second conveying portion is fixedly mounted on the mounting bracket.

7. The silicon wafer taking mechanism according to claim 5, characterized in that: The first conveying portion further includes a first adsorption structure, and the first adsorption structure is configured to adsorb the silicon wafer onto a conveying surface of the first conveying portion.

8. The silicon wafer taking mechanism according to claim 7, characterized in that: The first adsorption structure is a suction cup, and the suction cup is located between the first conveyor belt and the second conveyor belt, and the adsorption surface of the suction cup is lower than the conveying surface of the first conveying part.

9. The silicon wafer taking mechanism according to claim 7, characterized in that: The first adsorption structure includes a first adsorption unit and a second adsorption unit, the first adsorption unit is arranged close to the first conveyor belt and extends along the conveying direction, the second adsorption unit is arranged close to the second conveyor belt and extends along the conveying direction, and the first adsorption unit and the second adsorption unit have the same structure; The first adsorption unit includes a first guide seat, which is installed on the first support seat, a first air cavity is formed between the first guide seat and the first support seat, a first air flow guide slot connected to the first air cavity is formed between the first guide seat and the first support seat, and a first air supply port is provided on the first guide seat, compressed gas enters the first air cavity through the first air supply port, and then flows out from the first air flow guide slot through the first air cavity to non-contactly adsorb the silicon wafer on the conveying surface of the first conveying part based on the negative pressure generated by the Bernoulli effect.

10. The silicon wafer taking mechanism according to claim 5, characterized in that: The second conveying portion further includes a second adsorption structure, and the second adsorption structure is configured to adsorb the silicon wafer onto a conveying surface of the second conveying portion.

11. The silicon wafer taking mechanism according to claim 10, characterized in that: The second adsorption structure is a suction cup, which is mounted on the mounting bracket and located between the third conveyor belt and the fourth conveyor belt. The adsorption surface of the suction cup is lower than the conveying surface of the second conveying part.

12. The silicon wafer taking mechanism according to claim 10, characterized in that: The second conveying unit further comprises a third support seat and a fourth support seat which are arranged in parallel and symmetrically on the mounting bracket, and a third conveying belt and a fourth conveying belt are respectively arranged on the third support seat and the fourth support seat, and the third conveying belt and the fourth conveying belt cooperate to receive the silicon wafers outputted by the first conveying unit at the second conveying speed; The second adsorption structure comprises a third adsorption unit and a fourth adsorption unit, the third adsorption unit is arranged close to the third conveyor belt and extends along the conveying direction, the fourth adsorption unit is arranged close to the fourth conveyor belt and extends along the conveying direction, and the third adsorption unit and the fourth adsorption unit have the same structure; The third adsorption unit includes a third guide seat, which is installed on the third support seat, a third air cavity is formed between the third guide seat and the third support seat, a third air flow guide slot connected to the third air cavity is formed between the third guide seat and the third support seat, and a third air supply port is provided on the third guide seat, compressed gas enters the third air cavity through the third air supply port, and then flows out from the third air flow guide slot through the third air cavity to non-contact adsorb the silicon wafer on the conveying surface of the second conveying part based on the negative pressure generated by the Bernoulli effect.

13. A method for removing a silicon wafer, characterized in that: The silicon wafer taking-out mechanism according to any one of claims 1 to 12 is implemented, and the silicon wafer taking-out method comprises: Controlling the first conveying part to receive the silicon wafers in the basket disposed above the feeding end of the first conveying part at a first conveying speed; The first conveying unit is controlled to accelerate and output the silicon wafers to the second conveying unit at a second conveying speed. Meanwhile, the second conveying unit is controlled to receive the silicon wafers output by the first conveying unit at the second conveying speed.

14. The silicon wafer removal method according to claim 13, characterized in that: When the second conveying unit receives the silicon wafer outputted by the first conveying unit, controlling the second conveying unit to convey the silicon wafer backward at a second conveying speed; or, When the second conveying unit receives the silicon wafer outputted by the first conveying unit, the second conveying unit is controlled to decelerate and output the silicon wafer to the third conveying unit at a third conveying speed, and the third conveying unit is controlled to convey the silicon wafer at the third conveying speed.

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