Thinning control method, system and device and thinning equipment

Abstract

The invention discloses a thinning control method, system and device and thinning equipment. The thinning control method comprises the following steps that size information of a workpiece to be machined in a material box at a material box placing position is obtained, and an adsorption arm used by a feeding and discharging mechanical arm is determined according to the size information; the feeding and discharging manipulator is controlled to use the determined adsorption arm to take a to-be-machined workpiece from the material box and place the to-be-machined workpiece on the visual centering assembly; a first direction moving assembly and a second direction moving assembly of the visual centering assembly are controlled so that the workpiece to be machined can be flatly located at the set centering position; and according to the size information of the to-be-machined part, a transfer manipulator for carrying the to-be-machined part from the visual centering assembly to the wafer bearing table is determined, and a suction cup of the determined transfer manipulator is controlled to coaxially suck the to-be-machined part located at the centering position and then concentrically place the to-be-machined part on the wafer bearing table to complete feeding. The method can be effectively compatible with processing of semiconductor devices of various sizes, so that the application range and the utilization rate of single thinning equipment are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a thinning control method, system, device and thinning equipment. Background Art

[0002] Thinning equipment is commonly used in the processing of semiconductor devices such as wafers.

[0003] The patent document with application publication number CN115338717A discloses a typical thinning device.

[0004] Usually, the material picking component, centering piece, first robot and second robot of a thinning equipment can only adapt to 1 or 2 sizes of wafer processing. However, in actual processing, the sizes of wafers are varied, such as 3 inches, 4 inches, 6 inches, 8 inches, 12 inches, etc. This causes semiconductor processing companies to configure a variety of thinning equipment that can adapt to the processing of wafers of different sizes, which is obviously not conducive to the effective use of thinning equipment. Summary of the invention

[0005] The purpose of the present invention is to solve the above problems existing in the prior art and to provide a thinning control method, system, device and thinning equipment.

[0006] The purpose of the present invention is achieved through the following technical solutions: The thinning control method comprises the following steps: Acquire the size information of the workpiece to be processed in the material box at the material box placement position and determine the suction arm used by the loading and unloading manipulator according to the acquired size information of the workpiece to be processed; Controlling the loading and unloading robot to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component; Controlling the visual centering component to place the workpiece at a set centering position; According to the size information of the workpiece to be processed, the transfer robot that moves the workpiece to be processed from the visual centering component to the wafer table is determined, and the suction cup of the transfer robot is controlled to coaxially adsorb the workpiece to be processed in the centering position and then concentrically place it on the wafer table to complete the loading.

[0007] Preferably, a group of detection sensors for determining the size of the material box is provided at the material box placement position, and the size of the material box at the material box placement position is determined according to the position of the detection sensors detecting the material box, and the size information of the workpiece to be processed in the material box is determined according to the size of the material box.

[0008] Preferably, the loading and unloading manipulator is a double-arm manipulator, and the double-arm manipulator includes two adsorption arms with different adsorption area ranges; Or the loading and unloading robot includes a mobile robot and a plurality of adsorption arms with different adsorption area ranges connected to the mobile robot via a tool quick-change plate.

[0009] Preferably, the visual centering component includes an image acquisition device with a fixed position and an optical axis extending in the vertical direction. When the workpiece to be processed is in the centering position, its axis coincides with the optical axis of the image acquisition device. The workpiece to be processed is placed on the centering platform of the visual centering component. When the workpiece to be processed is not placed, the centering platform is coaxial with the image acquisition device.

[0010] Preferably, there are two transfer robots and the suction cups of the two transfer robots have different adsorption area ranges, the suction cups of the two transfer robots are staggered in height and the two suction cups are arranged in a translation device that drives them to move along the extension direction of the swing arm where they are located.

[0011] Preferably, when the thickness of the workpiece to be processed on the wafer stage is measured by the thickness measuring component, the detection position of the measuring rod of the thickness measuring component is adjusted according to the size information of the workpiece to be processed.

[0012] Preferably, the thickness measuring assembly includes a thickness gauge, which has only one measuring rod and is arranged on a lifting device that drives it to move in a vertical direction. The thickness measuring assembly also includes a stroke detection device for measuring the lifting stroke of the thickness gauge.

[0013] Thinning control system, including: A suction arm determination unit, used to obtain the size information of the workpiece to be processed in the material box at the material box placement position and determine the suction arm used by the loading and unloading manipulator according to the obtained size information of the workpiece to be processed; A material taking unit, used for controlling the loading and unloading robot to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component; A centering unit, used for controlling the visual centering component to place the workpiece at a set centering position; The loading unit is used to determine the transfer robot that transports the workpiece to be processed from the visual centering component to the wafer table according to the size information of the workpiece to be processed, and control the suction cup of the determined transfer robot to coaxially adsorb the workpiece to be processed in the centering position and then transfer it to the wafer table to complete the loading.

[0014] A thinning control device comprises a memory and a processor, wherein the memory stores a program executable by the processor, and when the program is executed, any of the above-mentioned thinning control methods is implemented.

[0015] The thinning equipment includes a material box placement position, a wafer holding table, and also includes: A visual centering component, comprising a first direction moving component, a second direction moving component, a centering stage driven to translate by the first and second directions, and an image acquisition device for determining whether a workpiece to be processed on the centering stage is in a centering position; A loading and unloading robot is configured to take materials from a material box and place them on the centering platform of the visual centering component, wherein the loading and unloading robot comprises at least two suction arms with different suction area ranges, and the loading and unloading robot selects one of the plurality of suction arms to take materials; Multiple transfer robots, each transfer robot is configured to place the workpiece to be processed in the centering position on the centering platform concentrically onto the wafer table through a suction cup, the suction cups configured with different transfer robots have different adsorption area ranges and each suction cup is connected to a translation device that drives it to translate along the extension direction of the swing arm where it is located.

[0016] The advantages of the technical solution of the present invention are mainly reflected in: The present invention changes the conventional method of centering the workpiece to be processed by shrinking in the prior art, and uses visual recognition combined with translation of the workpiece to be processed to center the workpiece to be processed. At the same time, the loading and unloading robots are equipped with a variety of suction arms that can adsorb workpieces of different sizes, and multiple transfer robots are equipped with suction cups that can translate and adsorb workpieces of different sizes. This can effectively meet the processing needs of semiconductor devices of various sizes and can effectively improve the scope of application and utilization rate of a single thinning device.

[0017] The present invention can effectively determine the size information of the workpiece to be processed by arranging a detection sensor at the material box placement position to detect the size of the material box, avoids using a reader or the like to obtain the material box information, can effectively reduce equipment costs and can obtain results more quickly.

[0018] The thickness measuring assembly of the present invention can effectively meet the thickness measurement requirements of different sizes, and a special structure of the thickness measuring assembly can not only meet the thickness measurement requirements of various sizes of workpieces to be processed, but also meet the thickness measurement requirements of various thicknesses of workpieces to be processed by only one thickness gauge, and when the thickness change of the workpiece to be processed exceeds the measuring range of the thickness gauge, the thickness measurement can still be normally realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top view of the thinning device of the present invention; Figure 2 is a side view of the transfer robot of the present invention; Figure 3 is a side view of an embodiment of a thickness measurement assembly of the present invention; Figure 4 is a perspective view of another embodiment of the thickness measuring assembly of the present invention; Figure 5 It is a top view of a detection sensor arranged at the placement position of the material box of the present invention; Figure 6 It is a process schematic diagram of the thinning control method of the present invention. DETAILED DESCRIPTION

[0020] The purpose, advantages and features of the present invention will be illustrated and explained by the non-limiting description of the following preferred embodiments. These embodiments are only typical examples of the application of the technical solution of the present invention, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.

[0021] In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0022] Example 1 The thinning control method disclosed by the present invention is described below in conjunction with the accompanying drawings. The thinning control method is based on a thinning device, which is improved on the basis of the patent document cited in the background technology. Specifically, as shown in the attached drawings, Figure 1 As shown, the thinning device includes a material box placement position 100, a wafer table 200, a dividing table 300, a grinding assembly 400 and a cleaning device 500, which are the same as those in the patent literature cited in the background technology, and are not described in detail here. Of course, the number of the wafer table 200 and the grinding assembly 400 can be only one, and the dividing table 300 can be eliminated.

[0023] As attached Figure 1 As shown, different from the prior art, the thinning device further includes: The visual centering component 600 includes a first direction moving component 610, a second direction moving component 620, a centering stage 630 driven to translate by the first direction moving component 610, and an image acquisition device 640 for determining whether the workpiece on the centering stage 630 is in the centering position.

[0024] The loading and unloading robot 700 is configured to take materials from the material box and place them on the centering platform 630 of the visual centering component 600. The loading and unloading robot 700 includes at least two suction arms with different suction area ranges, and the loading and unloading robot 700 selects one of the multiple suction arms to take materials.

[0025] Multiple transfer robots 800, each of which is configured to place the workpiece to be processed in the centering position on the centering platform 630 concentrically onto the wafer support table 200 through a suction cup 890. The suction cups 890 configured for different transfer robots have different suction area ranges and each suction cup 890 is connected to a translation device 870 that drives it to translate along the extension direction of the swing arm 860 where it is located.

[0026] The thickness measuring assembly 900 is used to measure the thickness of the workpiece to be processed on the wafer stage 200. The measuring rod 911 of the thickness measuring assembly 900 can be translated to adjust the detection position.

[0027] Specifically, the first direction moving component 610 and the second direction moving component 620 can be two linear modules, one of which is vertically arranged on the sliding block of the other linear module, so that the first direction is perpendicular to the second direction. Of course, the first direction moving component and the second direction moving component can also be other feasible structures, which are not limited here. At the same time, the centering platform 630 is arranged on the sliding block of the linear module located above, and the centering platform 630 can be an adsorption platform, and of course it can also not have an adsorption function.

[0028] The image acquisition device 640 can be a known and feasible camera, CCD, etc., and its optical axis extends in the vertical direction. The image acquisition device 640 is suspended in a fixed position and acquires images downward. When the centering stage 630 does not place the workpiece to be processed, it is coaxial with the image acquisition device 640, so that it is easy to quickly determine whether the workpiece to be processed on the centering stage 630 is in the centering position.

[0029] The loading and unloading robot 700 can adopt different structures as needed. For example, in one embodiment, as shown in the attached Figure 1 As shown, the loading and unloading robot 700 is a dual-arm robot, which includes two independent mobile arms that can perform multi-axis movement. A suction arm is provided at the end of each mobile arm. The suction arm is Y-shaped like the prior art, and usually one suction arm has three suction points distributed in an equilateral or isosceles triangle. The circumscribed circle of the three suction points defines the suction area range of the suction arm. The two suction arms connected by the two mobile arms have different sizes and different suction area ranges, that is, one suction arm has a large suction area range, and the other suction arm has a small suction area range. For example, the suction arm with a large suction area range can adsorb 6-inch and 8-inch workpieces to be processed, and the suction arm with a small suction area range can adsorb 3-inch and 4-inch workpieces to be processed.

[0030] In another embodiment, the loading and unloading robot 700 includes a mobile robot and a plurality of adsorption arms with different adsorption area ranges connected to the mobile robot through a tool quick change disk. The mobile robot is, for example, a known 6-axis robot or a 4-axis robot, and the adsorption arm is the same as the adsorption arm in the above example, which will not be described in detail here. The number of the adsorption arms can be at least 2, and the adsorption area ranges of the plurality of adsorption arms are different. The end of the mobile robot is provided with a robot side of a tool quick change disk, and the end of each adsorption arm is provided with a tool side matching the robot side. A plug is provided on one of the robot side and the tool side, and a socket is provided on the other side that is pluggable and connected to the plug. For example, the robot side is provided with a plug, and the tool side is provided with a socket. The plug is connected to an external vacuum air path, and the socket on the tool side is connected to the vacuum air path on the adsorption arm.

[0031] As attached Figure 1 As shown, there are two transfer robots 800 arranged side by side or in parallel, and each transfer robot 800 is used to transfer the workpiece to be processed from the visual centering component to the wafer table 200 and to transfer the workpiece to be processed that has been ground on the wafer table 200 from the wafer table 200 to the cleaning device 500. The specific structure of the two transfer robots 800 can be set as needed. Preferably, as shown in the attached Figure 2 As shown, the transfer robot 800 includes a lifting block 810, and the lifting block 810 is slidably arranged on a bracket 820 through a guide rail. The lifting block 810 is connected to a lifting drive device 830 that drives the lifting thereof. The lifting drive device 830 is, for example, a cylinder, a hydraulic cylinder, a linear module, or a structure composed of a motor and a lead screw. A rotating shaft 840 is rotatably arranged on the lifting block 810, and the rotating shaft 840 is connected to a driving motor 850 that drives the self-rotation thereof and is fixed on the lifting block. The upper end of the rotating shaft 840 is connected to one end of a swing arm 860, and the swing arm 860 is provided with the translation device 870. The translation device 870 is, for example, a linear module or a device with similar functions, which is not limited here. The translation device 870 is connected to a suction cup 890 through an adapter frame 880. The suction cup 890 is connected to the adapter frame 880 in a floating manner up and down through a telescopic rod 801. A buffer elastic member 802 is provided between the suction cup 890 and the adapter frame 880.

[0032] Furthermore, the suction cup 890 of each transfer robot 800 can be moved to a position coaxial with the image acquisition device 640 and can be moved to a position coaxial with the cleaning stage in the cleaning device 500. Preferably, the position of the suction cup 890 on one transfer robot 800 can be made to be able to directly rotate to be coaxial with the image acquisition device 640, while the position of the suction cup 890 on the other transfer robot 800 can be made to be able to directly rotate to be coaxial with the cleaning stage, thereby reducing the number of adjustments of the suction cup 890 during transfer.

[0033] At the same time, the two transfer robot 800 suction cups 890 have different suction area ranges, that is, one suction cup 890 has a larger suction area range, and the other suction cup 890 has a smaller suction area range. When the suction cup 890 is a ceramic suction cup, the diameters of the two suction cups are large and small. Therefore, the suction cup 890 with a larger suction area range can absorb 6-inch and 8-inch workpieces to be processed, while the suction cup 890 with a smaller suction area range can absorb 3-inch and 4-inch workpieces to be processed. At the same time, in order to avoid interference between the two suction cups 890 during operation, the two suction cups 890 are staggered in height.

[0034] The thickness measuring assembly can have two thickness gauges 910 as in the existing structure. In order to meet the thickness measurement needs of workpieces of different sizes, the two thickness gauges 910 of the thickness measuring assembly 900 are connected to a translation driver 930 that drives them to translate. Figure 3 As shown, the translation driver is, for example, a known turntable, and the thickness gauge 910 is arranged on the turntable through a connecting frame 920. The turntable is connected to a lifting device 940 that drives the lift thereof, and the lifting device can be a feasible device such as a cylinder, a hydraulic cylinder or an electric cylinder. Of course, the turntable can also be replaced by a device that can produce linear movement, such as a hydraulic cylinder or an electric cylinder, so that when the thickness measuring component 900 measures the thickness of the workpiece to be processed on the wafer table 200, the detection position of the measuring rod 911 of the thickness measuring component 900 is adjusted according to the size information of the workpiece to be processed. For example, the thinned workpiece to be processed is switched from 4 inches to 8 inches. At this time, since the edge of the 8-inch workpiece to be processed is closer to the edge of the wafer table 200, the detection position of the measuring rod 911 that needs to be mounted on the wafer table 200 and the workpiece to be processed must be adjusted to ensure reliable detection.

[0035] Better, in order to better meet the needs of thickness detection of workpieces with different thicknesses, as shown in the attached Figure 4As shown, the thickness measuring component 900 has one and only one thickness gauge 910, the thickness gauge 910 has one and only one measuring rod 911, and the thickness gauge 910 is arranged on a lifting device 950 that drives it to move in a vertical direction. The thickness measuring component 900 also includes a travel detection device 970 for measuring the lifting travel of the thickness gauge 910.

[0036] The lifting device 950 can be installed on the fixed frame 902 at a fixed position so that the measuring rod 911 of the thickness gauge 910 can be mounted on the workpieces to be processed of different sizes, and at the same time, the grinding wheel of the grinding assembly 400 is not affected. That is, the measuring rod 911 of the thickness gauge 910 can be mounted outside the area where the workpiece to be processed contacts the grinding wheel of the grinding assembly 400 and close to the axis of the wafer stage 200. Of course, the lifting device 950 can be set on the translation driver 930 that drives its translation as described above. The lifting device 950 is preferably a linear module arranged in the vertical direction, and the sliding member of the linear module is connected to a mounting frame 960, and the mounting frame 960 is connected to the thickness gauge 910 and the stroke detection device 970.

[0037] The thickness gauge 910 can be connected to the thickness gauge mounting plate 961 on the mounting frame 960 through the screw holes at the ends thereof. The thickness gauge mounting plate 961 can be a vertical plate or an L-shaped plate.

[0038] The mounting frame 960 also includes a side mounting plate 962 located on the side of the thickness gauge mounting plate 961, and the side mounting plate 962 is connected to the stroke detection device 970. The stroke detection device 970 is a known grating scale displacement sensor, so that the grating scale displacement sensor and the motor of the lifting device 950 form a closed-loop control to ensure accurate control of the up and down movement stroke of the mounting frame 960.

[0039] The side of the lifting device 950 is also provided with a return-to-zero sensor 980, which can be a known proximity switch or a through-beam sensor, etc. Its specific installation position can be designed as needed and is not limited here. In order to facilitate the adjustment of the position of the return-to-zero sensor 980, the side of the linear module is provided with a sensor mounting bar 990, which extends in the vertical direction and is in the shape of a C-shaped groove. The return-to-zero sensor 980 is connected to the sensor mounting bar 990 with an adjustable height through an adapter plate. At the same time, a trigger member 901 matching the return-to-zero sensor 980 is provided on the mounting frame 960. When the return-to-zero sensor 980 detects the trigger member 901, a return-to-zero operation is performed.

[0040] Correspondingly, each time the thinning device is turned on, a zero return operation is performed to determine the coordinate origin of the sliding member of the lifting device 950, and after each grinding is completed, the sliding member returns to the coordinate origin. Afterwards, when there is no workpiece to be processed on the wafer stage 200, the lifting device 950 drives the thickness gauge 910 to move and find the measurement reference point. When the detection result of the thickness gauge 910 is 0, the coordinates of the sliding member at this time are recorded as the reference point coordinates.

[0041] Before the grinding component 400 starts grinding, it is determined whether the thickness of the workpiece to be ground off exceeds the range of the thickness gauge 910 based on the determined initial thickness of the workpiece to be processed, the final thickness to be reached and the range of the thickness gauge 910. If it is determined that the thickness to be ground off does not exceed the range of the thickness gauge 910, then before the grinding component 400 starts grinding, in the process of moving the thickness gauge 910 downward by the lifting device 950, the coordinates to which the sliding member needs to move downward are determined based on the coordinate origin, the initial thickness and the reference point coordinates. The coordinates to which the sliding member needs to move downward are equal to the reference point coordinates minus the initial thickness. When the sliding member moves to the coordinates to which it needs to move downward, the measuring rod 911 of the thickness gauge 910 is mounted on the top surface of the workpiece to be processed on the wafer table 200. At this time, the detection result of the thickness gauge 910 is 0. The grinding device then grinds normally, and the value measured by the thickness gauge 910 is the thickness ground off in real time. When the initial thickness minus the thickness ground off in real time equals the final thickness to be achieved, the grinding is stopped.

[0042] If it is determined that the thickness to be ground off exceeds the range of the thickness gauge 910, the stroke adjustment amount of the thickness gauge 910 is determined according to the initial thickness, the final thickness to be achieved and the range of the thickness gauge 910. The stroke adjustment amount can be obtained by, for example, subtracting the final thickness to be achieved from the initial thickness and then subtracting the range of the thickness gauge 910. The stroke adjustment amount can also be obtained by further subtracting the set value from the initial thickness minus the final thickness to be achieved and then subtracting the range of the thickness gauge 910, thereby more fully ensuring that the thickness gauge 910 can measure effectively. At this time, after the measuring rod 911 of the thickness gauge 910 is mounted on the workpiece to be processed by the lifting device 950 and the detection result of the thickness gauge 910 is 0, during the grinding of the workpiece to be processed on the wafer stage 200, the thickness gauge 910 is driven to move downward synchronously by the lifting device 950 so that the detection result of the thickness gauge 910 remains zero, and when the stroke of the thickness gauge 910 moving downward is equal to the stroke adjustment amount, the thickness gauge 910 is kept at the current position for detection. Thereafter, the result measured by the thickness gauge 910 is added to the stroke adjustment amount and the thickness ground off, so that when the real-time determined thickness ground off is equal to the thickness to be ground off, the grinding can be stopped.

[0043] Further, in order to facilitate the determination of the size information of the workpiece to be processed in the material box at the material box placement position 100, it can be achieved by identifying the size of the material box. Generally, workpieces to be processed of different sizes are stored in material boxes of different sizes. Therefore, as shown in the attached Figure 5 As shown, a plurality of detection sensors 001 can be arranged at the material box placement position 100 to detect the size of the material box. The detection sensor 001 is, for example, a proximity switch. The detection sensor 001 is, for example, a group, and they are arranged at intervals along a straight line. It is assumed that a group of detection sensors 001 is four and they are arranged in sequence from the center to the edge of the material box placement position 100. For the convenience of explanation, the four detection sensors 001 are defined as the first sensor, the second sensor, the third sensor and the fourth sensor in order from the center to the edge. The material box storing 3-inch workpieces to be processed is defined as the first material box, the material box storing 4-inch workpieces to be processed is defined as the second material box, and the material box storing 6-inch workpieces to be processed is defined as the fourth sensor. The material box for storing 8-inch workpieces to be processed is defined as the third material box, and the material box for storing 8-inch workpieces to be processed is defined as the fourth material box; when the first material box is placed in the material box placement position 100, only the first sensor can detect the first material box, when the second material box is placed in the material box placement position 100, only the first sensor and the second sensor can detect the second material box, when the third material box is placed in the material box placement position 100, the first sensor, the second sensor, and the third sensor can all detect the third material box, and when the fourth material box is placed in the material box placement position 100, the first sensor, the second sensor, the third sensor, and the fourth sensor can all detect the fourth material box. Of course, there can be multiple groups of detection sensors 001.

[0044] Correspondingly, the thinning control method comprises the following steps: A material box loaded with the workpieces to be processed is placed at the material box placement position by manual or automated equipment. The automated equipment is, for example, a known overhead crane or AGV trolley of an overhead crane handling system, which is not limited here.

[0045] The size of the material box at the material box placement position 100 is determined according to the position of the detection sensor 001 detecting the material box, and the size information of the workpiece to be processed in the material box is determined according to the size of the material box.

[0046] After obtaining the size information of the workpiece to be processed in the material box at the material box placement position 100, the suction arm used by the loading and unloading robot 700 is determined according to the obtained size information of the workpiece to be processed.

[0047] The loading and unloading robot 700 is controlled to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component 600.

[0048] The visual centering component 600 is controlled to make the workpiece to be processed be in a set centering position; when the workpiece to be processed is in the centering position, its axis coincides with the optical axis of the image acquisition device 640. In order to conveniently control the adjustment amount of the first direction moving component and the second direction moving component, the image of the workpiece to be processed on the centering stage 630 is acquired by the image acquisition device 640, and it is determined whether the center of the workpiece to be processed on the image is at the center of the image. If so, that is, it is determined that the center of the workpiece to be processed on the image is at the center of the image, then it is determined that the axis of the workpiece to be processed coincides with the optical axis, and there is no need to adjust the position of the workpiece to be processed by the first direction moving component and the second direction moving component. When it is determined that the center of the workpiece to be processed on the image deviates from the center of the image, the deviation amount between the center of the workpiece to be processed and the center of the image in the first direction and / or the second direction is determined, and the adjustment amount of the first direction moving component and / or the second direction moving component is determined according to the scale. After the first direction moving component and / or the second direction moving component are adjusted, the image is captured again by the image acquisition device 640 to determine whether the center of the workpiece to be processed on the image is in the center of the image. Repeated adjustment and visual recognition can be performed to ensure that the axis of the workpiece to be processed coincides with the optical axis. The image recognition technology for determining whether the center of the workpiece to be processed is in the center of the image is a known technology and will not be described in detail here.

[0049] After determining the size information of the workpiece to be processed, the transfer robot 800 that moves the workpiece to be processed from the visual centering component 600 to the wafer table 200 can be determined according to the size information of the workpiece to be processed, and the determined transfer robot 800 is controlled to coaxially adsorb the workpiece to be processed in the centering position through the suction cup 890 thereon and place it concentrically on the wafer table 200 to complete the loading, that is, at least through the rotation of the swing arm 860 so that the suction cup 890 thereon and the image acquisition device 640 are in a coaxial state, and then the transfer robot 800 moves down to make the suction cup 890 fit with the workpiece to be processed and adsorb it, then, the transfer robot 800 drives the suction cup 890 to move up and rotate in the opposite direction until it is coaxial with the wafer table 200, and then the transfer robot 800 drives the suction cup 890 to move down to place the adsorbed workpiece to be processed on the wafer table 200, and the suction cup 890 stops adsorbing and is lifted to a predetermined position to wait for the next operation.

[0050] After loading is completed, the indexing table 300 drives the wafer carrier 200 to rotate so that the workpiece to be processed is rotated to the first grinding component 400 for the first grinding. After the first grinding is completed, the indexing table 300 drives the wafer carrier 200 to rotate to the second grinding component 400 for the second grinding. After the second grinding is completed, the workpiece to be processed that has completed grinding is transferred to the cleaning device 500 for cleaning through the determined transfer robot 800. After cleaning is completed, the loading and unloading robot 700 is controlled to transfer the cleaned workpiece to be processed at the cleaning device 500 to the material box through the determined adsorption arm.

[0051] Of course, if there is only one wafer table 200 and one grinding assembly 400, after loading is completed, the grinding assembly 400 performs grinding. After grinding is completed, the workpiece to be processed that has completed grinding is transferred to the cleaning device 500 for cleaning through the determined transfer robot 800. After cleaning is completed, the loading and unloading robot 700 is controlled to transfer the workpiece to be processed that has completed cleaning at the cleaning device 500 to the material box through the determined adsorption arm.

[0052] Example 2 This embodiment discloses a thinning control system, including: A suction arm determination unit, used to obtain the size information of the workpiece to be processed in the material box at the material box placement position 100 and determine the suction arm used by the loading and unloading robot 700 according to the obtained size information of the workpiece to be processed; A material taking unit, used for controlling the loading and unloading robot 700 to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component 600; A centering unit, used to control the visual centering component 600 to place the workpiece at a set centering position; The loading unit is used to determine the transfer robot 800 that transports the workpiece to be processed from the visual centering component 600 to the wafer table 200 according to the size information of the workpiece to be processed, and control the suction cup 890 of the transfer robot 800 to coaxially adsorb the workpiece to be processed located in the centering position and then transfer it to the wafer table 200 to complete the loading.

[0053] Example 3 This embodiment discloses a thinning control device, including a memory and a processor, wherein the memory stores a program executable by the processor, and when the program is executed, any of the above-mentioned thinning control methods is implemented.

[0054] There are many implementation methods of the present invention, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A thinning control method, characterized in that: The steps include: Acquire the size information of the workpiece to be processed in the material box at the material box placement position and determine the suction arm used by the loading and unloading manipulator according to the acquired size information of the workpiece to be processed; Controlling the loading and unloading robot to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component; Controlling the visual centering component to place the workpiece at a set centering position; According to the size information of the workpiece to be processed, the transfer robot that moves the workpiece to be processed from the visual centering component to the wafer table is determined, and the suction cup of the transfer robot is controlled to coaxially adsorb the workpiece to be processed in the centering position and then concentrically place it on the wafer table to complete the loading.

2. The thinning control method according to claim 1, characterized in that: A group of detection sensors for determining the size of the material box is arranged at the material box placement position. The size of the material box at the material box placement position is determined according to the positions of the detection sensors detecting the material box, and the size information of the workpiece to be processed in the material box is determined according to the size of the material box.

3. The thinning control method according to claim 1, characterized in that: The loading and unloading manipulator is a double-arm manipulator, and the double-arm manipulator includes two adsorption arms with different adsorption area ranges; Or the loading and unloading robot includes a mobile robot and a plurality of adsorption arms with different adsorption area ranges connected to the mobile robot via a tool quick-change plate.

4. The thinning control method according to claim 1, characterized in that: The visual centering component includes an image acquisition device with a fixed position and an optical axis extending in the vertical direction. When the workpiece to be processed is in the centering position, its axis coincides with the optical axis of the image acquisition device; The workpiece to be processed is placed on the centering stage of the visual centering component. When the workpiece to be processed is not placed, the centering stage is coaxial with the image acquisition device.

5. The thinning control method according to claim 1, characterized in that: There are two transfer robots, and the suction cups of the two transfer robots have different adsorption area ranges. The suction cups of the two transfer robots are staggered in height and are arranged on a translation device that drives them to move along the extension direction of the swing arm where they are located.

6. The thinning control method according to any one of claims 1 to 5, characterized in that: When the thickness of the workpiece to be processed on the wafer stage is measured by the thickness measuring component, the detection position of the measuring rod of the thickness measuring component is adjusted according to the size information of the workpiece to be processed.

7. The thinning control method according to any one of claims 1 to 5, characterized in that: The thickness measuring component for measuring the thickness of the workpiece to be processed on the wafer support table includes a thickness gauge, the thickness gauge has only one measuring rod and the thickness gauge is arranged on a lifting device that drives it to move in a vertical direction, and the thickness measuring component also includes a stroke detection device for measuring the lifting stroke of the thickness gauge.

8. Thinning control system, characterized in that, include: A suction arm determination unit, used to obtain the size information of the workpiece to be processed in the material box at the material box placement position and determine the suction arm used by the loading and unloading manipulator according to the obtained size information of the workpiece to be processed; A material taking unit, used for controlling the loading and unloading robot to use a determined suction arm to take a workpiece to be processed from the material box and place it on the visual centering component; A centering unit, used for controlling the visual centering component to place the workpiece at a set centering position; The loading unit is used to determine the transfer robot that transports the workpiece to be processed from the visual centering component to the wafer table according to the size information of the workpiece to be processed, and control the suction cup of the determined transfer robot to coaxially adsorb the workpiece to be processed in the centering position and then transfer it to the wafer table to complete the loading.

9. A thinning control device, comprising a memory and a processor, wherein the memory stores a program executable by the processor, characterized in that: When the program is executed, the thinning control method according to any one of claims 1 to 7 is implemented.

10. Thinning equipment, including a material box placement position and a film receiving table, characterized in that: Also includes: A visual centering component, comprising a first direction moving component, a second direction moving component, a centering stage driven to translate by the first direction moving component, and an image acquisition device for determining whether the workpiece on the centering stage is in a centering position, wherein the first direction is perpendicular to the second direction; A loading and unloading robot is configured to take materials from a material box and place them on the centering platform of the visual centering component, wherein the loading and unloading robot comprises at least two suction arms with different suction area ranges, and the loading and unloading robot selects one of the plurality of suction arms to take materials; Multiple transfer robots, each transfer robot is configured to place the workpiece to be processed in the centering position on the centering platform concentrically onto the wafer table through a suction cup, the suction cups configured with different transfer robots have different adsorption area ranges and each suction cup is connected to a translation device that drives it to translate along the extension direction of the swing arm where it is located.

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