Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronics. The electronic equipment comprises an antenna branch knot; circuit boards are arranged on at least two outer side walls of the audio device; wherein the circuit board arranged on the first outer side wall of the at least two outer side walls is connected with the antenna branch knot through a first elastic piece, the circuit board arranged on the second outer side wall of the at least two outer side walls is connected with a first connecting circuit board through a second elastic piece, and the first connecting circuit board is electrically connected with a mainboard of the electronic equipment; the circuit board arranged on the second outer side wall is further connected with the first connecting circuit board through a third elastic piece. Or, the circuit board arranged on the third outer side wall of the at least two outer side walls is connected with a second connecting circuit board through a third elastic piece, and the second connecting circuit board is electrically connected with the main board of the electronic equipment.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an electronic device. Background Art

[0002] To meet users' demand for loud, high-quality sound, electronic devices now use higher-specification audio components, such as speakers measuring 15mm*11mm or even 26mm*13mm. However, as audio components grow in size, they are also moving closer to the antenna in the device. This reduces the space available for antenna routing on the printed circuit board (PCB), impacting antenna functionality. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem in the prior art that as the volume of the audio device increases and approaches the antenna position, the PCB routing space of the antenna in the device is reduced, thereby affecting the antenna function.

[0004] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0005] antenna branches;

[0006] An audio device, wherein at least two outer side walls of the audio device are provided with circuit boards;

[0007] The circuit board arranged on the first outer wall of the at least two outer walls is connected to the antenna branch via a first elastic piece, the circuit board arranged on the second outer wall of the at least two outer walls is connected to a first connecting circuit board via a second elastic piece, and the first connecting circuit board is electrically connected to a mainboard of the electronic device;

[0008] The circuit board arranged on the second outer wall is also connected to the first connecting circuit board through a third spring piece; or, the circuit board arranged on the third outer wall among the at least two outer walls is connected to the second connecting circuit board through a third spring piece, and the second connecting circuit board is electrically connected to the mainboard of the electronic device.

[0009] In an embodiment of the present application, an electronic device includes: an antenna branch; an audio device, wherein at least two outer walls of the audio device are provided with circuit boards; wherein the circuit board provided on the first outer wall of the at least two outer walls is connected to the antenna branch via a first spring clip, and the circuit board provided on the second outer wall of the at least two outer walls is connected to a first connecting circuit board via a second spring clip, and the first connecting circuit board is electrically connected to a mainboard of the electronic device; the circuit board provided on the second outer wall is also connected to the first connecting circuit board via a third spring clip; or, the circuit board provided on the third outer wall of the at least two outer walls is connected to a second connecting circuit board via a third spring clip, and the second connecting circuit board is electrically connected to the mainboard of the electronic device. In this way, by utilizing the outer walls of audio devices such as speakers / earpieces to provide circuit boards, the PCB routing space for the antenna can be saved, thereby ensuring that the antenna performance is not affected by the volume of the audio device.

[0010] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below and in part will become apparent from the description below or will be learned through practice of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0012] Figure 1 This is a schematic diagram of the layout structure of antenna branches and audio components in an electronic device according to an embodiment of the present application;

[0013] Figure 2 This is a second schematic diagram of the layout structure of antenna branches and audio components in an electronic device according to an embodiment of the present application;

[0014] Figure 3 This is a schematic diagram of the PCB stacking design structure of the outer wall of the audio device according to an embodiment of the present application. DETAILED DESCRIPTION

[0015] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and are not to be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of this application.

[0016] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, and do not limit the number of objects, for example, the first object can be one or more. In the description of the present invention, unless otherwise specified, the meaning of "more than one" is two or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0017] In the description of the present invention, it should be understood that the terms "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0018] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0019] To make the embodiments of this application clearer, the following first introduces the relevant background technology involved in this application and the purpose of this application:

[0020] The sound quality of electronic devices, such as mobile phones, has always been a particular concern for users, especially for export models, which have a stronger demand for loud, high-quality sound. As a key audio component in electronic devices, the speaker itself is closely related to the user's sound quality experience. Currently, the market typically uses speakers with dimensions of 8mm*9mm or 10mm*12mm. It should be noted that the speaker and earpiece are often combined into one design. For ease of explanation and understanding, the term "speaker" will be used to refer to the audio component below.

[0021] To provide users with higher-quality sound, some manufacturers have adopted higher-specification speakers, such as 15mm*11mm, and some even reach an astonishing 26mm*13mm. As speakers become larger, the devices are also closer to the antenna, which brings two problems:

[0022] 1. The antenna's maximum transmission power can reach 33dBm (2W), which may cause significant interference to devices around the antenna, increasing the risk of interference to the speaker.

[0023] 2. The antenna feed components and switch tuning components are all arranged on the PCB next to them. As the speaker gets closer, the PCB board space keeps shrinking. In extreme cases, there is no space left and the antenna cannot be designed.

[0024] To address these issues, the present applicant has found a solution that allows for placement of the antenna feed without compromising antenna performance while also ensuring sufficient size for the audio components. This solution employs a two-in-one PCB and audio component design. This solution not only addresses the antenna PCB routing space issue, but also provides a shielding layer for the earpiece coil to prevent interference.

[0025] The electronic device provided in the embodiments of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0026] See Figure 1 and Figure 2 , Figure 1 and Figure 2 Schematic diagram of two layout structures of antennas and audio devices in electronic devices provided in the embodiments of the present application. Figure 1 As shown, the electronic equipment includes:

[0027] Antenna branches 10;

[0028] An audio device 20, wherein at least two outer side walls of the audio device 20 are provided with circuit boards;

[0029] The circuit board arranged on the first outer wall 21 of the at least two outer walls is connected to the antenna branch 10 via a first elastic piece 31, and the circuit board arranged on the second outer wall 22 of the at least two outer walls is connected to the first connecting circuit board 41 via a second elastic piece 32. The first connecting circuit board 41 is electrically connected to the mainboard of the electronic device.

[0030] The circuit board arranged on the second outer wall 22 is also connected to the first connecting circuit board 41 through the third spring piece 33; or, the circuit board arranged on the third outer wall 23 of the at least two outer walls is connected to the second connecting circuit board 42 through the third spring piece 33, and the second connecting circuit board 42 is electrically connected to the mainboard of the electronic device.

[0031] In an embodiment of the present application, in order to enable the electronic device to accommodate larger audio devices such as speakers without affecting the antenna performance, it is proposed to use the outer wall of the speaker to layout the circuit board, thereby placing part or all of the antenna PCB traces on the outer wall, which can save PCB trace space and avoid affecting the antenna performance.

[0032] The antenna branch 10 may be an antenna disposed on the top or other location of the electronic device, specifically on the middle frame of the electronic device. The antenna branch 10 may be made of conventional materials such as a flexible printed circuit (FPC), middle frame metal, or die-cast aluminum.

[0033] The audio device 20 may refer to a speaker or receiver, etc., which is usually located near the antenna on the top of the electronic device. For ease of explanation and understanding, the audio device 20 is referred to as the speaker 20 in the following text.

[0034] like Figure 1 and Figure 2 As shown, multiple outer walls of the speaker body 20 are provided with circuit boards, specifically PCB boards. That is, the multiple outer walls of the speaker body 20 can be directly provided with PCB boards, or the PCB boards can be provided only on the outer walls. In a specific implementation, the traditional conventional plastic packaging on the outside of the speaker body 20 can be replaced with a PCB board packaging.

[0035] The speaker 20 body can adopt a large size of 15mm*11mm or 26mm*13mm.

[0036] In an embodiment of the present application, the speaker 20 body can be a rectangular structure, thereby including four outer walls corresponding to the four sides. In specific implementation, two adjacent outer walls or three outer walls can be used to lay out PCB boards, and antenna routing and speaker body routing can be performed on these PCB boards to electrically connect the antenna branch 10 and the speaker 20 to the mainboard of the electronic device through the PCB routing.

[0037] Specifically, if Figure 1 and Figure 2 As shown, a circuit board can be arranged on the first outer side wall 21 of the speaker body 20 near the antenna branch 11, and an antenna feed spring is used to achieve electrical connection between the circuit board and the antenna branch 10. The antenna feed spring is also the first spring 31. It should be noted that the circuit board referred to in the embodiment of the present application can be a commonly used PCB board.

[0038] Alternatively, a circuit board arranged on the other outer side wall of the speaker 20 body, namely the second outer side wall 22, can be connected to another circuit board on this circuit board via another speaker connection spring clip. This speaker connection spring clip, namely the second spring clip 32, can be used to connect the speaker 20 to the electronic device motherboard. This other circuit board, namely the first connection circuit board 41, is a circuit board used to connect to the electronic device motherboard. The first connection circuit board 41 can also be called a motherboard connection FPC or a speaker motherboard connection FPC. The first connection circuit board 41 is preferably made of liquid crystal polymer (LCP), but a conventional FPC can also be used.

[0039] Alternatively, the circuit board arranged on the second outer wall 22 of the speaker body 20 can be further utilized, and the first connection circuit board 41 can be connected to the circuit board via another antenna spring clip, thereby connecting the antenna branch 10 to the RF module of the electronic device mainboard. This antenna spring clip is also the third spring clip 33. In this embodiment, the first outer wall 21 is electrically connected to the second outer wall 22, and the second outer wall 22 can be adjacent to or opposite to the first outer wall 21. When opposite to each other, the first outer wall 21 and the second outer wall 22 can be electrically connected via the wiring of the other adjacent outer wall.

[0040] Alternatively, a circuit board can be arranged on another new outer wall, namely the third outer wall 23, and another new circuit board can be connected to the circuit board via another antenna spring clip. The antenna spring clip is also the third spring clip 33. The other new circuit board is also the second connecting circuit board 42, which is a circuit board used to connect to the motherboard of the electronic device. The second connecting circuit board 42 can also be called an RF connection FPC or a motherboard connection FPC. The second connecting circuit board 42 can preferably be made of LCP material, or a conventional FPC can be used. In this embodiment, the first outer wall 21 is electrically connected to the second outer wall 22, and the second outer wall 22 is adjacent to the first outer wall 21. The first outer wall 21 can be opposite to the third outer wall 23, and the second outer wall 22 is adjacent to the third outer wall 23.

[0041] In this way, electrical connection with the antenna and mainboard of the electronic device can be achieved through routing on the outer side wall of the speaker 20 body, which greatly saves the antenna PCB routing space in the device and ensures the antenna performance.

[0042] Optionally, the circuit board arranged on the second outer wall 22 is also connected to the first connecting circuit board 41 through a third spring clip 33, wherein the first outer wall 21 is opposite to the second outer wall 22, and the fourth outer wall 24 between the first outer wall 21 and the second outer wall 22 is also arranged with a circuit board.

[0043] That is, in some embodiments, such as Figure 1As shown, the antenna and the main board can be connected by spring clips on the circuit boards arranged on the relative first outer wall 21 and the second outer wall 22. Specifically, the circuit board of the first outer wall 21 is electrically connected to the antenna branch 10 via the first spring clip 31, and the first spring clip 31 is used as an antenna feeding spring clip; the circuit board of the second outer wall 22 is electrically connected to the first connecting circuit board 41 via the second spring clip 32 and the third spring clip 33, and the third spring clip 33 is used as an antenna spring clip, and the second spring clip 32 is used as a speaker access spring clip, so that the speaker 20 can be connected to the main board, and the first connecting circuit board 41 is used as a circuit board connected to the main board.

[0044] In some embodiments, the number of second spring clips 32 can be two, and the third spring clip 33 can be disposed on the side of the second outer wall 22 closer to the first spring clip 31 to minimize the antenna routing distance, that is, shorten the RF link to reduce line loss. Of course, the layout positions of the second and third spring clips 32, 33 on the second outer wall 22 can also be flexibly adjusted according to actual needs.

[0045] In addition, it should be noted that the circuit board of the second outer wall 22 is also electrically connected to the circuit board of the first outer wall 21 through the circuit board arranged on the fourth outer wall 24 to achieve electrical connection between the antenna branch 21 and the RF module on the mainboard.

[0046] Figure 1 In the illustrated embodiment, the RF transmission path is: mainboard → first connecting circuit board 41 (mainboard connecting FPC) → third spring clip 33 (antenna spring clip) → first outer wall 21 circuit board → first spring clip 31 (antenna feeding spring clip) → antenna branch 10.

[0047] Through this embodiment, the electrical connection between the antenna, the speaker and the mainboard can be achieved by arranging spring pieces and a connecting circuit board on the two outer side walls, which is conducive to saving the layout space inside the electronic device.

[0048] Furthermore, an antenna matching circuit is arranged on a circuit board arranged on the target outer wall, and the target outer wall includes the first outer wall 21 and / or the fourth outer wall 24 .

[0049] In some embodiments, the antenna matching circuit can be arranged on the circuit board on the outer wall of the speaker 20 body to further save antenna PCB routing space. Specifically, a large number of antenna matching components and tuning switches can be placed on the first outer wall 21 and / or the fourth outer wall 24 to debug the antenna performance.

[0050] Optionally, the circuit board arranged on the third outer wall 23 is connected to the second connection circuit board 42 through a third elastic piece 33 , wherein the first outer wall 21 is opposite to the second outer wall 22 , and the third outer wall 23 is located between the first outer wall 21 and the second outer wall 22 .

[0051] That is, in some embodiments, such as Figure 2 As shown, the antenna and the RF module on the mainboard can be connected by springs on the circuit boards arranged on the adjacent first outer wall 21 and the third outer wall 23, and the speaker 20 can be connected to the mainboard by springs on the circuit board arranged on the second outer wall 22 opposite to the first outer wall 21.

[0052] Specifically, the circuit board of the first outer wall 21 is electrically connected to the antenna branch 10 through the first spring clip 31, and the first spring clip 31 is used here as an antenna feeding spring clip; the circuit board of the third outer wall 23 is electrically connected to the second connecting circuit board 42 through the third spring clip 33, and the circuit board of the second outer wall 22 is electrically connected to the first connecting circuit board 41 through the second spring clip 32, and the third spring clip 33 is used here as an antenna spring clip, which can connect the antenna branch 10 to the RF module on the mainboard, and the second spring clip 32 is used as a speaker access spring clip, which can connect the speaker 20 to the mainboard, and the first connecting circuit board 41 and the second connecting circuit board 42 are both used as circuit boards connected to the mainboard.

[0053] In some embodiments, the number of the second elastic pieces 32 may also be two.

[0054] The third spring clip 33 can be arranged on the side of the second outer wall 22 closer to the first spring clip 31 to shorten the antenna wiring distance as much as possible and reduce line loss. Of course, the layout positions of the second spring clip 32 and the third spring clip 33 on their respective outer walls can also be flexibly adjusted according to actual needs.

[0055] Figure 2 In the illustrated embodiment, the RF transmission path is: mainboard → second connection circuit board 42 (RF connection FPC) → third spring clip 33 (antenna spring clip) → first outer wall 21 circuit board → first spring clip 31 (antenna feed spring clip) → antenna branch 10.

[0056] This embodiment uses springs arranged on two adjacent outer walls to achieve electrical connection between the antenna and the motherboard. Figure 1 The implementation method can further shorten the antenna routing distance, that is, shorten the radio frequency link to reduce line loss.

[0057] Furthermore, an antenna matching circuit is arranged on a circuit board arranged on the target outer wall, and the target outer wall includes the first outer wall 21 and / or the third outer wall 23 .

[0058] That is, in some embodiments, the antenna matching circuit can be arranged on the circuit board on the outer wall of the speaker 20 body to further save antenna PCB routing space. Specifically, a large number of antenna matching components and tuning switches can be placed on the first outer wall 21 and / or the third outer wall 23 to debug the antenna performance.

[0059] Optionally, a microstrip antenna is also arranged on the circuit board arranged on the outer side wall of the target.

[0060] That is, in some embodiments, a microstrip antenna can be added to the outer wall circuit board where the antenna traces are laid out as needed to expand the antenna frequency band and communication function, make full use of the circuit board trace layout space on the outer wall of the speaker 20 body, and further save the antenna PCB trace space in the device.

[0061] Optionally, the bottom surface of the circuit board arranged on the fourth outer wall 24 or the third outer wall 23 is paved with copper to form a shielding layer.

[0062] In some embodiments, a large area of ​​copper can be laid on the bottom surface of the outer wall circuit board, such as the PCB bottom, as a shielding layer to shield the interference caused by the antenna position and prevent the antenna from interfering with the speaker 20 and affecting the sound effect.

[0063] Optionally, the fourth outer wall 24 or the third outer wall 23 is provided with conductive foam, and the fourth outer wall 24 or the third outer wall 23 is connected to the metal middle frame ground of the electronic device through the conductive foam.

[0064] In some embodiments, a conductive foam may be added to the outer wall circuit board connecting the speaker 20 and the main board to connect to the main metal, that is, to connect to the metal middle frame of the electronic device, to achieve grounding.

[0065] Optionally, the circuit board of the target outer side wall adopts a PCB stacked structure, and the target position of the bottom layer of the circuit board arranged on the target outer side wall is paved, and the target position is the position corresponding to the arrangement of the antenna matching circuit and the spring.

[0066] In some embodiments, the circuit board arranged on the outer wall may adopt a PCB stacking design structure, for example, Figure 3 As shown, the outer wall PCB adopts a common 10-layer board design, and the design of each layer is as follows:

[0067] The first layer can be copper-plated as an important means of shielding signal interference, wherein the first layer can also be called the bottom layer of the PCB;

[0068] Layers 2 to 7 are determined based on the specific device layout. Whether to lay copper traces or not can be determined based on the specific device layout.

[0069] The 8th layer is used as the reference ground layer for the RF microstrip line;

[0070] The 9th floor is used as a clear space floor;

[0071] The 10th layer is the device layer, which is used to place devices such as switches and matching devices, microstrip lines, etc.

[0072] The following design principles can also be used for PCB:

[0073] First, the corresponding position of the shrapnel and antenna element placement area on the PCB is only the first layer of ground, which can reduce losses.

[0074] Secondly, the 3rd to 10th layers corresponding to the microstrip line can be paved as reference layers to reduce the microstrip line loss.

[0075] That is, in some embodiments, optionally, the circuit board of the target outer side wall adopts a 10-layer PCB stacked structure, and the 3rd to 10th layers of the circuit board of the target outer side wall are laid as reference layers.

[0076] Third, between PCBs in different orientations, that is, non-adjacent layers, such as between the 5th and 10th layers, via design or LCP connection can be used.

[0077] Furthermore, it should be noted that the material of the RF connection FPC, i.e., the first connection circuit board 41 or the second connection circuit board 42, is not limited and can be made of LCP, a material with lower loss. Due to its upright nature, the PCB on the outer wall of the speaker can directly add traces to serve as a microstrip antenna.

[0078] Compared with the background technology, the above implementation of the embodiment of the present application can replace the PCB with the outer wall of the new audio device when the PCB cannot be laid over, and can also reduce the risk of interference to the speaker. Figure 2 The layout shown can also shorten the RF link, reduce line loss, and make the layout easier to route.

[0079] According to an embodiment of the present application, an electronic device includes: an antenna branch; an audio device, wherein at least two outer walls of the audio device are provided with circuit boards; wherein the circuit board provided on the first outer wall of the at least two outer walls is connected to the antenna branch via a first spring clip, the circuit board provided on the second outer wall of the at least two outer walls is connected to a first connecting circuit board via a second spring clip, and the first connecting circuit board is electrically connected to a mainboard of the electronic device; the circuit board provided on the second outer wall is also connected to the first connecting circuit board via a third spring clip; or the circuit board provided on the third outer wall of the at least two outer walls is connected to a second connecting circuit board via a third spring clip, and the second connecting circuit board is electrically connected to the mainboard of the electronic device. In this way, by utilizing the outer walls of audio devices such as speakers / earpieces to provide circuit boards, the PCB routing space for the antenna can be saved, thereby ensuring that the antenna performance is not affected by the volume of the audio device.

[0080] Other components of the electronic device according to the embodiment of the present invention, such as the radio frequency module and the control module, and operations are known to those skilled in the art and will not be described in detail here.

[0081] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0082] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Antenna branches; An audio device, wherein at least two outer side walls of the audio device are provided with circuit boards; The circuit board arranged on the first outer wall of the at least two outer walls is connected to the antenna branch through a first elastic sheet, the circuit board arranged on the second outer wall of the at least two outer walls is connected to the first connecting circuit board through a second elastic sheet, and the first connecting circuit board is electrically connected to the mainboard of the electronic device; The circuit board arranged on the second outer wall is also connected to the first connecting circuit board through a third spring sheet; or, the circuit board arranged on the third outer wall among the at least two outer walls is connected to the second connecting circuit board through a third spring sheet, and the second connecting circuit board is electrically connected to the mainboard of the electronic device.

2. The electronic device according to claim 1, characterized in that: The circuit board arranged on the second outer wall is also connected to the first connecting circuit board through a third elastic sheet, wherein the first outer wall is opposite to the second outer wall, and a circuit board is also arranged on the fourth outer wall between the first outer wall and the second outer wall.

3. The electronic device according to claim 2, characterized in that: An antenna matching circuit is arranged on a circuit board arranged on the target outer side wall, and the target outer side wall includes the first outer side wall and / or the fourth outer side wall.

4. The electronic device according to claim 1, characterized in that: The circuit board arranged on the third outer side wall is connected to the second connection circuit board through a third elastic sheet, wherein the first outer side wall is opposite to the second outer side wall, and the third outer side wall is located between the first outer side wall and the second outer side wall.

5. The electronic device according to claim 4, characterized in that: An antenna matching circuit is arranged on a circuit board arranged on the target outer side wall, and the target outer side wall includes the first outer side wall and / or the third outer side wall.

6. The electronic device according to claim 3 or 5, characterized in that: A microstrip antenna is also arranged on the circuit board arranged on the outer wall of the target.

7. The electronic device according to claim 2 or 4, characterized in that: The bottom surface of the circuit board arranged on the fourth outer side wall or the third outer side wall is clad with copper to form a shielding layer.

8. The electronic device according to claim 2 or 4, characterized in that: The fourth outer side wall or the third outer side wall is provided with conductive foam, and the fourth outer side wall or the third outer side wall is connected to the ground of the metal middle frame of the electronic device through the conductive foam.

9. The electronic device according to claim 3 or 5, characterized in that: The circuit board of the target outer side wall adopts a printed circuit board PCB stacking structure, and the target position of the bottom layer of the circuit board arranged on the target outer side wall is paved, and the target position is the position corresponding to the arrangement of the antenna matching circuit and the spring.

10. The electronic device according to claim 6, characterized in that: The circuit board of the target outer side wall adopts a 10-layer PCB stacking structure, and the third to tenth layers of the circuit board of the target outer side wall are laid as a reference layer.

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