Electric heating plate and manufacturing method thereof

Abstract

The invention provides an electric hot plate and a manufacturing method thereof. The electric heating plate comprises a plate body, a cover plate, an electric heating tube, a temperature measuring structure and two electrode structures. Wherein the interior of the tray body is hollow, the top of the tray body is open, the electric heating tube is arranged in the tray body, the cover plate covers the top of the tray body, and the bottom of the tray body is used for placing a wafer; the temperature measuring structure is arranged on the cover plate; the two electrode structures are arranged on the cover plate and connected with the two terminals of the electric heating tube in a one-to-one correspondence mode. The electric heating pipe is arranged in the disc body, the cover plate seals the top of the disc body, the wafer is installed at the bottom of the disc body, the temperature measuring structure is arranged on the cover plate, temperature measurement can be conveniently conducted on the electric heating plate, the two electrode structures are connected with the two ends of the electric heating pipe in a one-to-one correspondence mode, and the electric heating plate can be heated after the electric heating pipe is powered on; the electric heating plate is simple in structure and convenient to implement, and the manufacturing cost of the electric heating plate is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of electric heaters, and in particular to an electric heating plate and a manufacturing method thereof. Background Art

[0002] Semiconductor process equipment such as thin film deposition equipment, coating and developing equipment, etching equipment, annealing equipment, etc. all need to heat the wafer, so various types of electric heating plates are needed. The electric heating plate is a device that uses electric heating alloy wire as the heating material, mica soft plate as the insulating material, and is wrapped with a thin metal plate (aluminum plate, stainless steel plate, etc.) for heating. However, in order to meet the different needs of semiconductor process equipment, the existing electric heating plate has a complex structure, which increases the production cost of the electric heating plate. Summary of the invention

[0003] In view of this, the present invention proposes an electric heating plate, aiming to solve the problem of complex structure of the electric heating plate in the prior art. The present invention also proposes a method for manufacturing the electric heating plate.

[0004] In one aspect, the present invention proposes an electric heating plate, which includes: a disk body, a cover plate, an electric heating tube, a temperature measuring structure and two electrode structures; wherein the interior of the disk body is hollow and the top is open, the electric heating tube is arranged inside the disk body, the cover plate is arranged on the top of the disk body, and the bottom of the disk body is used for placing wafers; the temperature measuring structure is arranged on the cover plate; the two electrode structures are both arranged on the cover plate and are connected to the two terminals of the electric heating tube in a one-to-one correspondence.

[0005] Furthermore, in the above-mentioned electric heating plate, the cover plate is provided with a through hole corresponding to each electrode structure; each electrode structure includes: an insulating sleeve, a terminal and a protective sleeve; wherein the insulating sleeve is arranged at the through hole corresponding to the cover plate, and one end of the insulating sleeve is placed inside the plate body, and the terminal is arranged at the end of the insulating sleeve outside the plate body; one terminal of the electric heating tube is passed through the insulating sleeve and connected to the terminal; the protective sleeve is arranged on the cover plate and is sleeved on the outside of the insulating sleeve.

[0006] Furthermore, in the above-mentioned electric heating plate, the temperature measuring structure includes: an insert; wherein the cover plate is provided with an installation blind hole at a position corresponding to the temperature measuring structure; the insert is arranged at the cover plate corresponding to the installation blind hole, and the insert is used to insert the temperature measuring device.

[0007] Furthermore, the above-mentioned electric heating plate also includes: a plurality of stop pins; wherein each stop pin is arranged at intervals on the bottom surface of the disk body to limit the wafer; a plurality of grooves are opened at intervals on the bottom surface of the disk body, and each groove extends to the outer peripheral surface of the disk body so that the side of the groove is open.

[0008] Furthermore, in the above electric heating plate, a heat spreader is provided on the bottom surface of the plate.

[0009] Furthermore, in the above electric heating plate, a reflective film is arranged on a side of the cover plate facing the plate body, and a heat insulating layer is arranged on the reflective film.

[0010] In the present invention, the electric heating tube is placed inside the disk, the cover plate closes the top of the disk, the wafer is installed at the bottom of the disk, and the temperature measuring structure is arranged on the cover plate, so as to measure the temperature of the electric heating plate. The two electrode structures are connected to the two ends of the electric heating tube in a one-to-one correspondence. When the electric heating tube is energized, the electric heating plate can be heated, and then the wafer can be heated. The electric heating plate has a simple structure and is easy to implement, which saves the manufacturing cost of the electric heating plate and solves the problem of complex structure of the electric heating plate in the prior art.

[0011] On the other hand, the present invention also proposes a method for manufacturing any of the above-mentioned electric heating plates, the method comprising the following steps: a manufacturing step, placing an electric heating tube in a disk body, and covering the top of the disk body with a cover plate; a processing step, setting a temperature measuring structure and two electrode structures on the cover plate to form an electric heating plate; a testing step, testing the performance of the electric heating plate, and if the performance of the electric heating plate meets the preset requirements, determining that the electric heating plate is qualified.

[0012] Furthermore, in the manufacturing method of the above-mentioned electric heating plate, in the manufacturing step, the plate body and the cover plate are both made of aluminum, and the cover plate and the plate body are connected by casting aluminum or welding; in the processing step, the temperature measuring structure and the two electrode structures are welded to the cover plate.

[0013] Furthermore, in the manufacturing method of the above-mentioned electric heating plate, in the testing step, the performance of the electric heating plate includes: insulation resistance, electrical aging performance and heating performance; when the insulation resistance of the electric heating plate is tested, the electric heating plate is placed in a heating box at a preset temperature and dried for a preset time, then the electric heating plate is taken out and cooled to room temperature, and the insulation resistance of the electric heating plate after cooling is tested, and when the insulation resistance is greater than or equal to the preset resistance value, it is determined that the insulation resistance of the electric heating plate is qualified; when the electrical aging performance of the electric heating plate is tested, the electric heating plate is heated and cooled within a preset temperature range, and after multiple cycles, the insulation resistance and heating resistance of the electric heating plate are tested to see if they change, as well as the welding resistance of the electric heating plate. Whether there is leakage at the point, when the insulation resistance and heating resistance of the heating plate have not changed and the solder joint of the heating plate has not leaked, the electrical aging performance of the heating plate is determined to be qualified; when the heating performance of the heating plate is tested, a plurality of metal legs are arranged on the heating plate, and each metal leg is placed on a metal workbench, a temperature measuring device is installed on the temperature measuring structure of the heating plate, the two electrode structures are connected to the power supply, and a plurality of heating powers are adjusted to test the temperature response of the heating plate. When the temperature response of the heating plate meets the design requirements, the heating performance of the heating plate is determined to be qualified; when the working environment of the heating plate is in a vacuum negative pressure state, the heating performance of the heating plate is tested in a vacuum chamber.

[0014] Furthermore, in the manufacturing method of the above-mentioned electric heating plate, the operating temperature of the electric heating plate is from room temperature to 350°C and the insulation resistance is greater than 200MΩ; the heating rate of the electric heating plate is 10-20°C / min; the maximum value of the temperature distribution deviation of the heating surface of the electric heating plate is less than or equal to ±1% of the full heating range; the maximum heating power of the electric heating plate is less than or equal to 2000W.

[0015] In the present invention, an electric heating tube is placed in a disk body, and a cover plate is arranged on the top of the disk body, and then a temperature measuring structure and two electrode structures are arranged on the cover plate to form an electric heating plate. The performance of the electric heating plate is tested. If the performance of the electric heating plate meets the preset requirements, the electric heating plate is determined to be qualified. The method is simple to operate, easy to implement, can save the production cost of the electric heating plate, and can also reduce the power consumption of the electric heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0017] Figure 1 A schematic diagram of the structure of an electric heating plate provided in an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the cross-sectional structure of an electric heating plate provided in an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of the structure of the stop pins and grooves in the electric heating plate provided in an embodiment of the present invention;

[0020] Figure 4 The present invention provides a flowchart of a method for manufacturing a heating plate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to be able to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] Heating plate embodiment:

[0023] See also Figures 1 to 3, the figure shows the preferred structure of the electric heating plate in this embodiment. As shown in the figure, the electric heating plate includes: a plate body 1, a cover plate 2, an electric heating tube 3, a temperature measurement structure 4 and two electrode structures 5. The inside of the plate body 1 is hollow, and the top of the plate body 1 ( Figure 1 The upper part shown in FIG. 1 is open, and the bottom of the tray 1 ( Figure 1 The lower part shown in the figure is in a closed state. Specifically, the cross section of the disc body 1 can be circular. Of course, it can also be designed into other shapes according to actual needs, and this embodiment does not impose any restrictions on this. The disc body 1 has a preset thickness, and the preset thickness can be determined according to actual conditions, and this embodiment does not impose any restrictions on this. Among them, the thickness direction of the disc body 1 is Figure 1 Top-to-bottom orientation shown.

[0024] The electric heating tube 3 is arranged inside the disk body 1. Specifically, a serpentine space is arranged inside the disk body 1, and the electric heating tube 3 is placed in the serpentine space.

[0025] The cover plate 2 is disposed on the top of the tray body 1 , so that the cover plate 2 seals the top of the tray body 1 .

[0026] See also Figure 3 The bottom of the tray 1 is used to place the wafer. Specifically, the wafer is placed on the bottom surface of the bottom of the tray 1. When used specifically, Figure 2 According to actual needs, the bottom of the tray body 1 can be facing upwards and the cover plate 2 can be facing downwards, and the wafer can be placed on the bottom surface of the bottom of the tray body 1 .

[0027] Preferably, the electric heating plate further comprises: a plurality of stop pins 6. The stop pins 6 are arranged at intervals on the bottom surface of the plate body 1, and the stop pins 6 are used to limit the wafer, prevent the wafer from moving, and improve the stability of the wafer.

[0028] See also Figure 3, the bottom surface of the bottom of the disk body 1 is provided with a plurality of grooves 7 at intervals, each groove 7 extends toward the outer circumference of the disk body 1 until it is extended to communicate with the outside, so that the side of the groove 7 is in an open state, and the groove 7 is convenient for picking up the wafer, and the wafer can be removed from the groove 7. Specifically, each groove 7 is opened from the bottom surface of the disk body 1 and extends toward the top of the disk body 1, and each groove 7 extends toward the outer circumference of the disk body 1 until it extends to the outer circumference of the disk body 1 and communicates with the outside, so that the side of the groove 7 is in an open state. In other words, each groove 7 is open at the bottom surface of the disk body 1 and at the outer circumference of the disk body 1, and each groove 7 has a bottom wall 73, two side walls 71 arranged in parallel, and a connecting wall 72, wherein the bottom wall 73 is parallel to the bottom surface of the disk body 1, and the connecting wall 72 is arranged opposite to the outer circumference of the disk body 1. The two side walls 71 are perpendicular to the bottom wall 73, and the bottom wall 73 is sandwiched between the two side walls 71. The connecting wall 72 is also sandwiched between the two side walls 71 and perpendicular to the bottom wall 73. Preferably, each groove 7 is a duckbill groove.

[0029] In specific implementation, each groove 7 has a preset groove depth, wherein the groove depth is the depth of the groove 7 in the thickness direction of the disk body 1, and the preset groove depth can be determined according to actual conditions, and this embodiment does not impose any restrictions on this. In this embodiment, the groove depth of each groove 7 is 1.5 mm.

[0030] In a specific implementation, each groove 7 has a preset width and a preset length, wherein the preset width is the distance between the two side walls 71, and the preset length is the distance between the connecting wall 72 and the outer peripheral surface of the disk body 1. The preset width and the preset length can be determined according to actual conditions, and this embodiment does not impose any restrictions on this. In this embodiment, the width of each groove 7 is 18 mm, and the length is 15 mm.

[0031] In this embodiment, there are three stop pins 6 and three grooves 7. The three stop pins 6 and the three grooves 7 are arranged at intervals in the circumferential direction on the bottom surface of the disk body 1, and a groove 7 is arranged between two adjacent stop pins 6. The central angle between each stop pin 6 and the adjacent groove 7 is 60 degrees.

[0032] During specific implementation, the material of the disk body 1 and the cover plate 2 can be determined according to actual needs, and this embodiment does not impose any restrictions on this. Preferably, the material of the disk body 1 and the cover plate 2 are both aluminum, so that the electric heating plate is an aluminum electric heating plate. The manufacturing technology of the aluminum electric heating plate can be cast aluminum technology or welding technology, and this embodiment does not impose any restrictions on this. Among them, the cast aluminum technology is to wrap the electric heating tube 3 in an aluminum plate using a casting technology. Specifically, the cast aluminum technology includes cast aluminum and post-processing to ensure that the size, surface roughness and pinhole degree of the electric heating plate meet the use requirements of semiconductor vacuum equipment. Cast aluminum technology can use one or more of the elements of precision refining, rapid smelting, vacuum smelting, vacuum suction casting, etc.; the cast blank is ground, polished and CNC processed to ensure the outer dimensions and surface roughness of the electric heating plate, the surface is visually free of scratches, scratches, depressions, and the anode layer is uniform.

[0033] The welding technology is to weld the disc body 1 and the cover plate 2, and seal the electric heating tube 3 therein. When the disc body 1 and the cover plate 2 are welded, the electric heating tube 3 is placed in the serpentine cavity of the disc body 1, and the cover plate 2 is installed. The cover plate 2 and the disc body 1 are welded together by surfacing argon arc welding technology. The cover plate 2 and the disc body 1 are completely welded through, without any poor welding phenomena such as false welding, cracks, and perforations.

[0034] When current flows through the electric heating tube 3 in the aluminum electric heating plate, the heat generated will evenly heat the entire aluminum electric heating plate, ensuring that the wafer thereon is at the required process temperature.

[0035] The temperature measuring structure 4 is arranged on the cover plate 2. Specifically, a temperature measuring device is installed on the temperature measuring structure 4, and the temperature of the electric heating plate can be measured by the temperature measuring device.

[0036] The two electrode structures 5 are both disposed on the cover plate 2 , and the two electrode structures 5 are connected to the two terminals of the electric heating tube 3 in a one-to-one correspondence.

[0037] Preferably, the operating temperature of the electric heating plate is below 350° C. and does not exceed 380° C. at most, and the insulation resistance is greater than 200 MΩ.

[0038] The heating rate of the electric heating plate is 10-20°C / min, and the maximum value of the temperature distribution deviation of the heating surface of the electric heating plate is less than or equal to ±1% of the heating full range.

[0039] The maximum heating power of the heating plate is less than or equal to 2000W, and the working life is greater than or equal to 20,000 hours to ensure the safety and reliability of the heating plate.

[0040] In specific implementation, the diameter of the heating plate can range from 6 to 12 inches, the thickness of the heating plate can range from 16 to 32 mm, and the heating plate can be an aluminum heating plate to meet the heating requirements of semiconductor equipment for 6, 8, and 12-inch wafers under atmospheric pressure or vacuum negative pressure.

[0041] It can be seen that in this embodiment, the electric heating tube 3 is placed inside the disk body 1, the cover plate 2 closes the top of the disk body 1, the wafer is installed at the bottom of the disk body 1, and the temperature measuring structure 4 is arranged on the cover plate 2, which is convenient for measuring the temperature of the electric heating plate. The two electrode structures 5 are connected to the two ends of the electric heating tube 3 in a one-to-one manner. When the electric heating tube 3 is energized, the electric heating plate can be heated, and then the wafer can be heated. The electric heating plate has a simple structure and is easy to implement, which saves the production cost of the electric heating plate and solves the problem of complex structure of the electric heating plate in the prior art.

[0042] See also Figure 1 In the above embodiment, the cover plate 2 is provided with a through hole at a position corresponding to each electrode structure 5, and two through holes are provided on the cover plate 2, and the two electrode structures 5 correspond to the two through holes one by one.

[0043] Each electrode structure 5 includes: an insulating sleeve 51, a terminal 52 and a protective sleeve 53. The insulating sleeve 51 is arranged at the corresponding through hole of the cover plate 2, and one end of the insulating sleeve 51 is placed in the disk body 1. Specifically, the insulating sleeve 51 is connected to the cover plate 2. In addition, the insulating sleeve 51 is placed at the corresponding through hole, and the insulating sleeve 51 is connected to the through hole, so that the insulating sleeve 51 can be connected to the inside of the disk body 1 through the through hole. The first end of the insulating sleeve 51 passes through the cover plate 2 and is placed in the disk body 1, and the second end of the insulating sleeve 51 is placed outside the disk body 1.

[0044] The terminal 52 is arranged at the end of the insulating sleeve 51 outside the disk body 1, that is, the terminal 52 is connected to the second end of the insulating sleeve 51. One terminal of the electric heating tube 3 is passed through the insulating sleeve 51 and connected to the terminal 52. Specifically, each end of the heating wire in the electric heating tube 3 passes through the corresponding insulating sleeve 51 and is connected to the terminal 52.

[0045] The protective sleeve 53 is arranged on the cover plate 2, and is sleeved on the outside of the insulating sleeve 51. The protective sleeve 53 is used to prevent the electric heating tube 3 and its terminal 52 from being deformed and damaged. The function of the insulating sleeve 51 is to prevent the electric heating tube 3 from contacting the protective sleeve 53 and causing electricity.

[0046] Preferably, the protection sleeve 53 is connected to the cover plate 2 by welding, more preferably by argon arc welding.

[0047] In a specific implementation, the insulating sleeve 51 may be a ceramic insulating sleeve, and the protective sleeve 53 may be an aluminum sleeve.

[0048] It can be seen that, in this embodiment, each electrode structure 5 has a simple structure and is easy to implement.

[0049] See also Figure 1 and Figure 2In the above embodiment, the temperature measuring structure 4 includes: an insert 41. A blind hole for installation is provided on one side of the cover plate 2 away from the disk body 1 at a position corresponding to the temperature measuring structure 4. The insert 41 is arranged at a position of the cover plate 2 corresponding to the blind hole for installation, and the insert 41 is used to insert a temperature measuring device. Specifically, the insert 41 is connected to the cover plate 2, and the insert 41 is placed at the blind hole for installation, and the insert 41 is connected to the blind hole for installation. The insert 41 can be an aluminum hollow tube, and the temperature measuring device can be a thermocouple, and a thermocouple is inserted into the insert 41 for temperature measurement.

[0050] Preferably, the insert tube 41 is connected to the cover plate 2 by welding, more preferably by argon arc welding.

[0051] In specific implementation, the length of the insert 41 and the two protective sleeves 53 placed outside the cover plate 2 should be able to pass through the vacuum chamber of the semiconductor device so as to be connected to the external heating power supply and the temperature measuring thermocouple. The specific length can be determined according to the structural parameters of the semiconductor device, and this embodiment does not impose any restrictions on this.

[0052] The manufacturing technology of the electric heating plate is either aluminum casting technology or welding technology, and the two protective sleeves 53 and the insert 41 are both welded on the cover plate 2 by argon arc welding. The two protective sleeves 53 and the insert 41 are parallel, and the verticality deviation of the two protective sleeves 53 and the insert 41 is less than or equal to 1mm.

[0053] When the electric heating plate is performing argon arc welding, specifically the argon arc welding between the cover plate 2 and the disk body 1, the argon arc welding between the two protective sleeves 53 and the cover plate 2, and the argon arc welding between the insert 41 and the cover plate 2, the angle and progress of the fiber material and the welding gun are controlled to increase the precipitation of hydrogen and reduce the number of pinholes to ensure that there are no sand holes and cracks. During the welding process, the total number of hydrogen precipitation pinholes is less than or equal to 1 / cm2, so that the pinhole density is better than the standard to meet the requirements of the semiconductor equipment for the sealing of the electric heating plate when working under vacuum negative pressure. A helium detector is used to detect that there is no leakage at the welding point. The weld should be flat, without desoldering, leaking welding, cracking, pores, etc. After welding is completed, the weld and the surface should be refined, cleaned and surface treated again on the machine tool.

[0054] See also Figure 1 and Figure 2 In the above embodiments, a heat spreader 8 is disposed on the bottom surface of the disk body 1, and the heat spreader 8 may be a graphene heat spreader to accelerate the temperature rise of the electric heating plate.

[0055] A reflective film 9 is provided on one side of the cover plate 2 facing the dish body 1, and a heat insulating layer 10 is provided on the reflective film 9. Specifically, the heat insulating layer 10 is provided on the side of the reflective film 9 facing the dish body 1. Preferably, the reflective film 9 is an aluminum reflective film, and the heat insulating layer 10 is a slag wool heat insulating layer. The reflective film 9 and the heat insulating layer 10 are sequentially stacked on the side of the cover plate 2 facing the dish body 1, and then, after the cover plate 2 is connected to the dish body 1, the reflective film 9 and the heat insulating layer 10 are placed in the dish body 1. The reflective film 9 is used to accumulate the heat passing through the heat insulating layer 10, accelerate the rise of the surface temperature of the electric heating plate, and reduce energy consumption.

[0056] In summary, in this embodiment, the electric heating tube 3 is placed inside the disk body 1, the cover plate 2 closes the top of the disk body 1, the wafer is installed at the bottom of the disk body 1, and the temperature measuring structure 4 is arranged on the cover plate 2 to facilitate the temperature measurement of the electric heating plate. The two electrode structures 5 are connected to the two ends of the electric heating tube 3 in a one-to-one manner. When the electric heating tube 3 is energized, the electric heating plate can be heated, and then the wafer can be heated. The electric heating plate has a simple structure and is easy to implement, which saves the production cost of the electric heating plate and has low power consumption.

[0057] Method for making electric heating plate:

[0058] This embodiment also proposes a method for making a heating plate, see Figure 4 The manufacturing method of the electric heating plate comprises the following steps:

[0059] Production step S1, placing the electric heating tube in the plate body, and covering the top of the plate body.

[0060] Specifically, the specific implementation process of the electric heating plate can refer to the above description, and this embodiment will not be repeated here.

[0061] See also Figure 1 to Figure 2 The electric heating tube 3 is placed in the serpentine cavity in the disk body 1, and the cover plate 2 seals the top of the disk body 1.

[0062] The disk body 1 and the cover plate 2 are both made of aluminum, and the cover plate 2 is connected to the disk body 1 by casting aluminum or welding. Among them, the cast aluminum technology is to wrap the electric heating tube in an aluminum plate by casting technology. Specifically, the cast aluminum technology includes casting aluminum and post-processing to ensure that the size, surface roughness and pinhole degree of the electric heating plate meet the use requirements of semiconductor vacuum equipment. The cast aluminum technology can adopt one or more of the elements of precision refining, rapid smelting, vacuum smelting, vacuum suction casting, etc. The cast blank is ground, polished and CNC processed to ensure the outer dimensions and surface roughness of the electric heating plate, and the surface is visually free of scratches, scratches, depressions, and the anode layer is uniform. The welding technology is to weld the disk body 1 and the cover plate 2 to enclose the electric heating tube 3 therein. When the disc body 1 and the cover plate 2 are welded, the electric heating tube 3 is placed in the serpentine cavity of the disc body 1, and the cover plate 2 is installed. The cover plate 2 and the disc body 1 are welded together using surfacing argon arc welding technology. The cover plate 2 and the disc body 1 are completely welded through without any poor welding phenomena such as false welds, cracks, and perforations.

[0063] Processing step S2, setting the temperature measuring structure and two electrode structures on the cover plate to form an electric heating plate.

[0064] Specifically, see Figure 1 to Figure 2 The temperature measuring structure 4 and the two electrode structures 5 are welded to the cover plate 2 to form an electric heating plate.

[0065] In test step S3, the performance of the electric heating plate is tested. If the performance of the electric heating plate meets the preset requirements, the electric heating plate is determined to be qualified.

[0066] Specifically, the performance of the electric heating plate includes: insulation resistance, electrical aging performance and heating performance. When all the performances of the electric heating plate meet the preset requirements, the electric heating plate is determined to be qualified.

[0067] When testing the insulation resistance of the heating plate, place the clean heating plate in a heating box at a preset temperature and dry it for a preset time, then take the heating plate out of the heating box and cool it to room temperature, detect the insulation resistance of the heating plate after cooling, and when the insulation resistance is greater than or equal to the preset resistance value, determine that the insulation resistance of the heating plate is qualified. Specifically, the preset temperature and the preset time can be determined according to actual conditions, and this embodiment does not impose any restrictions on this. In this embodiment, the preset temperature is 250°C, and the preset time is 3 to 5 hours, that is, the clean heating plate is placed in a heating box at 250°C and dried for 3 to 5 hours. The preset resistance value is 200MΩ, that is, the insulation resistance is greater than or equal to 200MΩ, and it is determined that the insulation resistance of the heating plate is qualified.

[0068] When the electrical aging performance of the heating plate is tested, the heating plate is heated and cooled within a preset temperature range, and after multiple cycles, that is, after the heating plate is repeatedly heated and cooled for several times within the preset temperature range, it is detected whether the insulation resistance and heating resistance of the heating plate change and whether the solder joints of the heating plate leak. When the insulation resistance and heating resistance of the heating plate do not change and the solder joints of the heating plate do not leak, the electrical aging performance of the heating plate is determined to be qualified.

[0069] During specific implementation, the preset temperature range can be determined according to actual conditions, and this embodiment does not impose any limitation on this.

[0070] When testing the heating performance of the heating plate, multiple metal legs are set on the heating plate, and each metal leg is placed on a metal workbench. A temperature measuring device is installed on the temperature measuring structure of the heating plate, and the two electrode structures are connected to a power supply. Multiple heating powers are adjusted and the temperature response of the heating plate is tested. When the temperature response of the heating plate meets the design requirements, the heating performance of the heating plate is determined to be qualified.

[0071] Specifically, each metal leg can be an aluminum leg, and the total thermal resistance of the aluminum leg (mainly determined by the gap between the aluminum electric heating plate and the metal table) must ensure that the temperature at the contact point with the metal work table drops below 50°C. The temperature measuring device can be a thermocouple, which is inserted into the insert, and the two terminals are connected to the power supply. Adjust multiple different heating powers to test the temperature response of the electric heating plate.

[0072] In this embodiment, there may be three metal legs.

[0073] When the working environment of the heating plate is in a vacuum negative pressure state, the heating performance of the heating plate is tested in a vacuum chamber, that is, the heating performance of the heating plate is tested in a vacuum chamber, and the above heating performance test process is repeated.

[0074] In specific implementation, when determining whether the electric heating plate is qualified, in addition to the above-mentioned performance meeting the preset requirements, it is also necessary to ensure that the appearance and specifications of the electric heating plate meet the design requirements. When the heating plate meets the above requirements, the heating plate is determined to be qualified.

[0075] The working temperature of the heating plate is from room temperature to 350℃, and the insulation resistance is greater than 200MΩ.

[0076] The heating rate of the electric heating plate is 10-20°C / min. Specifically, the heating rate of the electric heating plate is 10-20°C / min by adopting a programmable processor and a thermocouple closed-loop control in the insert tube of the cover plate, so as to realize the heating-maintaining-cooling process control of various semiconductor processes and improve the adaptability.

[0077] The maximum value of the temperature distribution deviation of the heating surface of the electric heating plate is less than or equal to ±1% of the full heating range.

[0078] The maximum heating power of the heating plate is less than or equal to 2000W, and the working life is greater than or equal to 20,000 hours to ensure the safety and reliability of the heating plate.

[0079] In specific implementation, the diameter of the heating plate can range from 6 to 12 inches, the thickness of the heating plate can range from 16 to 32 mm, and the heating plate can be an aluminum heating plate to meet the heating requirements of semiconductor equipment for 6, 8, and 12-inch wafers under atmospheric pressure or vacuum negative pressure.

[0080] It can be seen that in this embodiment, the electric heating tube is placed in the disk body, and the cover plate is set on the top of the disk body, and then the temperature measuring structure and the two electrode structures are set on the cover plate to form an electric heating plate, and the performance of the electric heating plate is tested. If the performance of the electric heating plate meets the preset requirements, the electric heating plate is determined to be qualified. This method is simple to operate, easy to implement, can save the production cost of the electric heating plate, and can also reduce the power consumption of the electric heating plate.

[0081] It should be noted that the principles of the electric heating plate and the method for making the electric heating plate in the present invention are the same, and the relevant parts can be referenced to each other.

[0082] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0083] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0084] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An electric heating plate, characterized in that: include: A disk body (1), a cover plate (2), an electric heating tube (3), a temperature measuring structure (4) and two electrode structures (5); wherein: The interior of the disk body (1) is hollow and the top is open, the electric heating pipe (3) is arranged inside the disk body (1), the cover plate (2) is covered on the top of the disk body (1), and the bottom of the disk body (1) is used to place wafers; The temperature measuring structure (4) is arranged on the cover plate (2); The two electrode structures (5) are both arranged on the cover plate (2) and are connected to the two terminals of the electric heating tube (3) in a one-to-one correspondence.

2. The electric heating plate according to claim 1, characterized in that: The cover plate (2) is provided with a through hole at a position corresponding to each electrode structure (5); Each of the electrode structures (5) comprises: an insulating sleeve (51), a terminal (52) and a protective sleeve (53); wherein the insulating sleeve (51) is arranged at a corresponding through hole of the cover plate (2), and one end of the insulating sleeve (51) is placed inside the disk body (1), and the terminal (52) is arranged at the end of the insulating sleeve (51) placed outside the disk body (1); One terminal of the electric heating tube (3) is passed through the insulating sleeve (51) and connected to the terminal (52); The protective sleeve (53) is arranged on the cover plate (2) and sleeved on the outside of the insulating sleeve (51).

3. The electric heating plate according to claim 1, characterized in that: The temperature measurement structure (4) comprises: an intubation tube (41); wherein: The cover plate (2) is provided with a mounting blind hole at a position corresponding to the temperature measuring structure (4); The insert pipe (41) is arranged on the cover plate (2) at a position corresponding to the mounting blind hole, and the insert pipe (41) is used for inserting a temperature measuring device.

4. The electric heating plate according to claim 1, characterized in that: Also includes: A plurality of stop pins (6); wherein, The stop pins (6) are arranged at intervals on the bottom surface of the disk (1) to limit the position of the wafer; The bottom surface of the disk body (1) is provided with a plurality of grooves (7) at intervals, and each of the grooves (7) extends toward the outer peripheral surface of the disk body (1) so that the side of the groove (7) is in an open state.

5. The electric heating plate according to claim 1, characterized in that: The bottom surface of the disk body (1) is provided with a heat spreader (8).

6. The electric heating plate according to claim 1, characterized in that: A reflective film (9) is provided on the side of the cover plate (2) facing the disk body (1), and a heat insulating layer (10) is provided on the reflective film (9).

7. A method for manufacturing an electric heating plate as claimed in any one of claims 1 to 6, characterized in that: The steps include: The manufacturing step is to place the electric heating tube in the plate body and to cover the top of the plate body; A processing step of arranging a temperature measuring structure and two electrode structures on the cover plate to form an electric heating plate; The testing step is to test the performance of the electric heating plate. If the performance of the electric heating plate meets the preset requirements, the electric heating plate is determined to be qualified.

8. The method according to claim 7, characterized in that: In the manufacturing step, the disc body and the cover plate are both made of aluminum, and the cover plate and the disc body are connected by aluminum casting or welding; In the processing step, the temperature measuring structure and the two electrode structures are welded to the cover plate.

9. The manufacturing method according to claim 8, characterized in that: In the test steps, The performance of the electric heating plate includes: insulation resistance, electrical aging performance and heating performance; When the insulation resistance of the electric heating plate is tested, the electric heating plate is placed in a heating box at a preset temperature and dried for a preset time, then the electric heating plate is taken out and cooled to room temperature, and the insulation resistance of the electric heating plate after cooling is detected. When the insulation resistance is greater than or equal to the preset resistance value, the insulation resistance of the electric heating plate is determined to be qualified; When the electrical aging performance of the electric heating plate is tested, the electric heating plate is heated and cooled within a preset temperature range, and after multiple cycles, the insulation resistance and heating resistance of the electric heating plate are detected to see if they change, and the solder joints of the electric heating plate are detected to see if they leak. When the insulation resistance and heating resistance of the electric heating plate do not change, and the solder joints of the electric heating plate do not leak, the electrical aging performance of the electric heating plate is determined to be qualified. When testing the heating performance of the electric heating plate, a plurality of metal legs are arranged on the electric heating plate, and each of the metal legs is placed on a metal workbench, a temperature measuring device is installed on the temperature measuring structure of the electric heating plate, two electrode structures are connected to a power source, and a plurality of heating powers are adjusted to test the temperature response of the electric heating plate. When the temperature response of the electric heating plate meets the design requirements, it is determined that the heating performance of the electric heating plate is qualified; When the working environment of the electric heating plate is in a vacuum negative pressure state, the heating performance of the electric heating plate is tested in a vacuum chamber.

10. The manufacturing method according to claim 7, characterized in that: The working temperature of the electric heating plate is from room temperature to 350°C and the insulation resistance is greater than 200MΩ; The heating rate of the electric heating plate is 10-20°C / min; The maximum value of the temperature distribution deviation of the heating surface of the electric heating plate is less than or equal to ±1% of the heating full scale; The maximum heating power of the electric heating plate is less than or equal to 2000W.

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