Semiconductor package heating simulation unit for confirming heat distribution of burn-in board and heat distribution acquisition method of burn-in board using same

Abstract

The invention provides a semiconductor package heating simulation unit for confirming heat distribution of a burn-in board and a method for acquiring heat distribution of the burn-in board by using the unit, and the semiconductor package heating simulation unit comprises a circuit board, the burn-in board is provided with an input / output terminal corresponding to a conductive part of a socket of the burn-in board, and a power supply terminal and a signal terminal which are connected with the input / output terminal. A heater formed to generate heat by a power supply input from the power supply terminal; and a temperature sensor formed to measure a temperature according to heat generation of the heater and output temperature information on the temperature through the signal terminal.

Description

Technical Field

[0001] The present invention relates to a semiconductor package heating simulation unit for confirming the heat distribution of a burn-in board and a method for obtaining the heat distribution of the burn-in board using the unit. Background Art

[0002] Generally, a semiconductor package completed through a semiconductor manufacturing process is checked through a testing (inspection) process to see whether its operating characteristics are correctly achieved, and then shipped when it is classified as a non-defective product.

[0003] During this inspection, the semiconductor package is tested by connecting it to a socket to check if there are any problems with the electrical operation. Sometimes the inspection is performed in an environment that heats the semiconductor package and applies temperature stress to it.

[0004] The heating environment of the semiconductor package must not cause excessive temperature stress to the semiconductor package. To this end, it is necessary to obtain information about the environment and improve the environment based on this information.

[0005] The above-mentioned background technology is technical information possessed by the inventor in order to derive the embodiments of the present invention, or technical information obtained in the derivation process, and may not necessarily be known technology disclosed to the public before the present application. Summary of the invention

[0006] Technical issues

[0007] An object of the present invention is to provide a semiconductor package heat generation simulation unit for confirming the heat distribution of a burn-in board and a method for obtaining the heat distribution of a burn-in board using the unit, which allows simulating the heat distribution generated from the semiconductor package in a test environment for the semiconductor package contained in the burn-in board.

[0008] Another object of the present invention is to provide a semiconductor package heating simulation unit for confirming the heat distribution of the aging board and a method for obtaining the heat distribution of the aging board using the unit, which can obtain the heat distribution of the aging board without changing the structure of the actual test semiconductor package.

[0009] Means of solving the problem

[0010] To achieve the above-mentioned problem, a semiconductor package heating simulation unit for confirming the heat distribution of an aging board according to one aspect of the present invention may include: a circuit board, comprising: input / output terminals corresponding to the conductive parts of the socket of the aging board, and power terminals and signal terminals connected to the input / output terminals; a heater, formed to generate heat by power input by the power terminals; and a temperature sensor, formed to measure a temperature according to the heat generated by the heater, and output temperature information about the temperature through the signal terminal.

[0011] Here, a molding member coupled to the circuit board in a state of surrounding the heater and the temperature sensor may be further included.

[0012] Here, the circuit board may have a size corresponding to a semiconductor package to be tested in the socket.

[0013] Here, the heater may include a planar heat generating body having a size corresponding to the circuit board.

[0014] Here, the heater may include an opening portion exposing the signal terminal.

[0015] Here, the temperature sensor is arranged in the open portion in a state of being connected to the signal terminal.

[0016] According to another aspect of the present invention, the method for acquiring the heat distribution of the aging board may include: a step of configuring a semiconductor package heating simulation unit in the socket of the aging board; a step of supplying power to the input / output terminal through the socket; and a step of receiving temperature information related to the temperature measured by the heater according to the heat generated by the heater through the input / output terminal and the socket.

[0017] Here, the method may further include outputting the temperature information on a screen according to the sockets of the burn-in board.

[0018] Effects of the Invention

[0019] According to the semiconductor package heating simulation unit for confirming the heat distribution of the aging board of the present invention constructed as described above and the heat distribution acquisition method of the aging board using the unit, by connecting a heater and a temperature sensor to a circuit board electrically connected to a socket of the aging board, the temperature information generated by the heat generation of the heater can be measured by the temperature sensor and output to the outside, thereby simulating the heat distribution generated in the semiconductor package during the testing of the semiconductor package accommodated in the aging board.

[0020] Furthermore, since the heat simulation unit replaces the semiconductor package actually being tested and acts as a semiconductor package, it can be used as is when confirming the heat distribution of sockets, test boards, etc. that are usually used to test semiconductor packages. Therefore, there is no need to change existing equipment or facilities or install new equipment to confirm the heat distribution. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 1 is a cross-sectional view showing a semiconductor package heat generation simulation unit 100 for confirming heat distribution of a burn-in board according to an embodiment of the present invention.

[0022] Figure 2 yes Figure 1 FIG. 1 is an exploded perspective view of a semiconductor package heat generation simulation unit 100 .

[0023] Figure 3 FIG. 4 is a flow chart for illustrating a method for obtaining heat distribution of a burn-in board according to another embodiment of the present invention.

[0024] Figure 4 Is to show about Figure 3 FIG. 1 is a perspective view showing a state in which a semiconductor package heating simulation unit 100 is arranged on a burn-in board BB in a step (S1).

[0025] Figure 5 Is to show about Figure 3 In another step (S7), an image graph of the temperature information of the aging board is output on a screen. DETAILED DESCRIPTION

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0027] The present invention is not limited to the embodiments disclosed below, and various changes can be applied, and can be implemented in different forms. This embodiment is only provided to make the disclosure of the present invention complete and to fully explain the scope of the invention to people with general knowledge. Therefore, it should be understood that the present invention is not limited to the embodiments disclosed below, and not only includes structures of embodiments that replace or add structures different from any of the embodiments, but also includes all changes, equivalents and even substitutes included in the technical concept and scope of the present invention.

[0028] It should be understood that the drawings are only used to facilitate the understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the drawings, but should include all changes, equivalents and even substitutes included in the concept and technical scope of the present invention. The size or thickness of the constituent elements in the drawings may be excessively enlarged or reduced for ease of understanding, etc., but the protection scope of the present invention shall not be limited thereby.

[0029] The terms used in this specification are used only to illustrate specific implementation examples or embodiments and are not intended to limit the present invention. Then, when no other meaning is clear in the context, the singular expression includes the plural expression. In the specification, the terms "including to", "consisting of to" and the like are intended to specify the existence of the features, numbers, steps, actions, constituent elements, parts or combinations thereof recorded in the specification. That is, the terms "including to", "consisting of to" and the like in the specification should be understood as not excluding in advance the existence or additional possibility of one or more other features or numbers, steps, actions, constituent elements, parts or combinations thereof.

[0030] Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited to the terms. The terms are used only for the purpose of distinguishing one component from other components.

[0031] When a component is mentioned to be "connected" or "interconnected" to other components, it may be directly connected or interconnected to the other components, but it should be understood that other components may exist in between. Conversely, when a component is mentioned to be "directly connected" or "directly interconnected" to other components, it should be understood that other components do not exist in between.

[0032] When it is mentioned that a certain component is “on” or “under” other components, it should be understood that it is not only disposed directly above the other components but also that other components may be present in between.

[0033] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meanings as generally understood by persons having ordinary knowledge in the technical field to which the present invention belongs. The same terms defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and should not be interpreted as ideal or overly formal meanings when not clearly defined in this application.

[0034] Figure 1 1 is a cross-sectional view showing a semiconductor package heat generation simulation unit 100 for confirming heat distribution of a burn-in board according to an embodiment of the present invention, Figure 2 yes Figure 1 FIG. 1 is an exploded perspective view of a semiconductor package heat generation simulation unit 100 .

[0035] 1. Referring to these drawings, a semiconductor package heat generation simulation unit 100 may include a circuit board 110, a heater 130, a temperature sensor 150, and a molding member 170.

[0036] The circuit board 110 may have a substrate body 111 with a conductive circuit printed on an insulating material. The substrate body 111 may have a substantially square plate shape. An input / output terminal 113 is formed on the bottom surface of the substrate body 111. A power terminal 115 and a signal terminal 117 may be formed on the top surface of the substrate body 111.

[0037] The heater 130 may be a planar heating element having a size corresponding to the circuit board 110. Specifically, the heater 130 may have a substrate 131 stacked on the upper side of the circuit board 110. The substrate 131 is an insulator and may have an area slightly smaller than the substrate body 111. The substrate 131 may be formed with an opening 133. The opening 133, for example, is a hollow portion formed in the center of the substrate 131 for exposing the signal terminal 117. The heater 130 may also have a resistance wire 135 and an input terminal 137. The resistance wire 135 generates heat by the power input by the input terminal 137. The resistance wire 135 may be formed of a metal material (e.g., SUS). An insulating film may be arranged on the lower side and upper side of the resistance wire 135. The insulating film may form the substrate 131.

[0038] The temperature sensor 150 is a structure that measures the temperature generated by the heater 130 and outputs temperature information related to the temperature. The temperature sensor 150 can be arranged in the open portion 133 in a state connected to the signal terminal 117. The temperature information is output through the signal terminal 117. In addition to outputting the temperature information, the signal terminal 117 can also supply power to the temperature sensor 150.

[0039] The molding 170 is a structure coupled to the circuit board 110 to surround the heater 130 and the temperature sensor 150. The molding 170 may be formed by hardening an insulating molten resin. The molding 170 protects the heater 130 and the temperature sensor 150 from the external environment and limits the heat loss generated by the heater 130. Therefore, the temperature sensor 150 can more reliably obtain the temperature information.

[0040] Will refer to Figures 3 to 5 A method of obtaining the heat distribution of a burn-in board using the semiconductor package heat simulation unit 100 is described.

[0041] Figure 3 FIG. 4 is a flow chart for illustrating a method for obtaining heat distribution of a burn-in board according to another embodiment of the present invention.

[0042] Referring further to the drawings, in order to obtain heat distribution, the semiconductor package heat generation simulation unit 100 is first arranged on a burn-in board (S1).

[0043] The test board (control unit) supplies power to the input / output terminal 113 through the socket of the burn-in board ( S3 ). The power is supplied to the heater 130 through the power terminal 115 , and to the temperature sensor 150 through the signal terminal 117 .

[0044] The resistance wire 135 of the heater 130 generates heat by the input power. Therefore, the temperature sensor 150 measures the temperature of the heat generated by the heating of the heater 130 and outputs temperature information related thereto. The temperature information is output through the signal terminal 117 and the socket. Thus, the control unit receives the temperature information (S5).

[0045] The control unit may visually output the temperature information (S7). The temperature information may be represented by numbers or colors.

[0046] Figure 4 Is to show about Figure 3 FIG. 1 is a perspective view showing a state in which a semiconductor package heating simulation unit 100 is arranged on a burn-in board BB in a step (S1).

[0047] Further references Figure 4 A plurality of socket housings SH are arranged in a grid shape on the burn-in board BB. The socket housing SH is formed to accommodate semiconductor packages. A socket is arranged at the bottom of the socket housing SH. The socket has a conductive portion and is electrically connected to the test board.

[0048] The semiconductor package heating simulation unit 100 is arranged in the socket housing SH instead of the semiconductor package in the actual test. Thus, the semiconductor package heating simulation unit 100 is accommodated in the socket housing SH and connected to the socket.

[0049] To this end, the input / output terminal 113 is formed to correspond to the conductive portion of the socket. In addition, the circuit board 110 may have a size (width) corresponding to the semiconductor package.

[0050] With this structure, existing facilities (burn-in board BB, test board, etc.) for testing burn-in of semiconductor packages can be used for heat generation simulation using the semiconductor package heat generation simulation unit 100 without any change.

[0051] Figure 5 Is to show about Figure 3 Another step (S7) is to output a graphical representation of the temperature information of the aging board on a screen. Figure 5 In FIG. 1 , for simplicity, only the temperature information of a portion of the socket housing SH of the aging board BB is shown.

[0052] Further references Figure 5 , when the semiconductor package heat generation simulation unit 100 is inserted into each socket housing SH, the temperature information of each socket housing (socket) is obtained.

[0053] The temperature information may be arranged in a grid corresponding to each socket, or may be displayed on the screen in a grid arrangement. As shown in the example, the temperature information may be distinguished by the depth of color.

[0054] Based on this heat distribution, the aging test equipment of the semiconductor package can be improved so that the semiconductor package can be tested under the appropriate heat distribution.

[0055] Industrial Applicability

[0056] The present invention has industrial applicability in the field of semiconductor test board manufacturing.

Claims

1. A semiconductor package heat simulation unit for confirming the heat distribution of a burn-in board, wherein: include: The circuit board comprises: input / output terminals corresponding to the conductive parts of the socket of the burn-in board, and power terminals and signal terminals connected to the input / output terminals; a heater formed to generate heat by power input through the power terminal; as well as The temperature sensor is formed to measure a temperature according to the heat generation of the heater and output temperature information about the temperature through the signal terminal.

2. The semiconductor package heat generation simulation unit for confirming the heat distribution of the burn-in board according to claim 1, wherein: The invention also includes a molding member coupled to the circuit board in a state of surrounding the heater and the temperature sensor.

3. The semiconductor package heat generation simulation unit for confirming the heat distribution of the burn-in board according to claim 1, wherein: The circuit board has a size corresponding to a semiconductor package to be tested in the socket.

4. The semiconductor package heat generation simulation unit for confirming the heat distribution of the burn-in board according to claim 1, wherein: The heater includes a planar heating element having a size corresponding to that of the circuit board.

5. The semiconductor package heat generation simulation unit for confirming the heat distribution of the burn-in board according to claim 1, wherein: The heater includes an opening portion exposing the signal terminal.

6. The semiconductor package heat generation simulation unit for confirming the heat distribution of the burn-in board according to claim 5, wherein: The temperature sensor is disposed in the open portion in a state of being connected to the signal terminal.

7. A method for obtaining heat distribution of an aging board, wherein: include: The step of configuring the semiconductor package heating simulation unit according to claim 1 on the socket of the burn-in board; A step of supplying power to the input / output terminal via the socket; as well as and receiving, through the input / output terminal and the socket, temperature information related to a temperature measured by the heater according to heat generation of the heater.

8. The method for obtaining heat distribution of a burn-in board according to claim 7, wherein: The process also includes outputting the temperature information on a screen according to the socket of the aging board.

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