An assembly line and assembly method for a TCU controller

Abstract

This invention discloses an assembly line and method for TCU controllers, comprising a top cover production system for adding components to a top cover, a PCBA board production system for adding components to a PCBA board, a bottom cover production system for adding components to a bottom cover, a first assembly system for assembling the PCBA board and the bottom cover, and a second assembly system for assembling the bottom cover and the top cover. Each of the production and assembly systems is equipped with upper and lower conveyor lines for product carrier turnover. Lifting modules are connected at both ends of the two conveyor lines, and each workstation is equipped with a lifting module to lift the product carrier. This invention realizes the assembly operation of TCU controllers, improves the degree of automation in assembly, further improves production efficiency, and reduces production costs.

Description

[Technical Field]

[0001] This invention belongs to the field of TCU controller manufacturing technology, and in particular relates to a TCU controller assembly line and assembly method. [Background Technology]

[0002] The TCU controller is assembled from a bottom cover, a PCBA board, and a top cover. The bottom cover requires the assembly of components such as ground planes, while the PCBA board requires the assembly of components such as shielding covers, cables, antennas, fans, and heat sinks. The top cover requires the affixing of labels and foam. The entire assembly process involves many steps and is quite complex. If each workstation produces the TCU controller separately, it will not only be inefficient but also require a large number of machines and occupy a huge amount of space. In order to achieve automated production of TCU controllers, it is necessary to design and lay out the entire production line to improve production efficiency.

[0003] Therefore, it is necessary to provide an assembly line and assembly method for a TCU controller to solve the above-mentioned technical problems. [Summary of the Invention]

[0004] The main objective of this invention is to provide an assembly line for a TCU controller, which realizes the assembly of TCU controllers, improves the degree of automation in assembly, and further improves production efficiency and reduces production costs.

[0005] The present invention achieves the above objectives through the following technical solution: an assembly line and assembly method for a TCU controller, comprising a top cover production system for adding parts to a top cover, a PCBA board production system for adding components to a PCBA board, a bottom cover production system for adding parts to a bottom cover, a first assembly system for assembling the PCBA board and the bottom cover, and a second assembly system for assembling the bottom cover and the top cover. Each of the production system and the assembly system is equipped with upper and lower conveyor lines for turning over the product carrier. The two conveyor lines are connected end to end with lifting modules. Each workstation is equipped with a lifting module for lifting the product carrier.

[0006] The top cover production system includes a labeling machine, a foam applicator, and a discharge machine arranged sequentially along the conveying direction of the conveyor line;

[0007] The PCBA board production system includes a shield assembly machine, a cable assembly machine, an antenna assembly machine, and a fan assembly machine arranged sequentially along the conveyor line direction; the cable assembly machine includes a cable assembly device for assembling cables onto the PCBA board, a cable pressing device for pressing the female ends of cables onto the PCBA board, and a cable inspection device for inspecting the assembled cables; the antenna assembly machine includes an antenna feeding device, an antenna assembly device for assembling antennas onto the PCBA board, an antenna soldering device for soldering antenna pins onto the PCBA board, and an antenna inspection device for inspecting the soldered antennas.

[0008] The bottom cover production system includes a bottom cover assembly device that assembles the base plate onto the bottom cover, a base plate hot-melt assembly device that heat-melts and fixes the base plate onto the bottom cover, and a snap fastener pressing machine that presses the snap fasteners onto the bottom cover, arranged sequentially along the conveying direction of the conveyor line.

[0009] The first assembly system includes a combination fixture for assembling PCBA boards and bottom covers sequentially along the conveying direction of the conveyor line to obtain a TCU controller semi-finished product; a cable hot-melt assembly device for hot-melting cables on the PCBA board and connecting them to the FPC board to achieve electrical connection; a fan locking screw device for locking the fan assembled on the PCBA board to the bottom cover; an antenna hot-melt assembly device for hot-melting and fixing the antenna assembled on the PCBA board to the bottom cover; a heat sink assembly device for assembling a heat sink onto the PCBA board; a heat sink locking screw device for locking the heat sink on the PCBA board to the bottom cover; a spot soldering device for spot soldering the ground plane on the PCBA board; a ground plane soldering device for soldering the ground plane to the PCBA board; and a detection device for detecting the assembled finished product.

[0010] The second assembly system includes a screw-locking assembly device for assembling the bottom cover and the top cover.

[0011] Furthermore, the labeling machine includes a top cover feeding module disposed on one side of the conveyor line, a top cover feeding module disposed on the other side of the conveyor line, and a first conveying and pasting device for transporting the top cover and the label and pasting the label on the top cover; the foam applicator includes a foam feeding module disposed on one side of the conveyor line, a top cover flipping module disposed on the other side of the conveyor line, and a second conveying and pasting device for transporting the foam and the top cover and pasting the foam on the top cover.

[0012] Furthermore, the shielding cover assembly machine includes a shielding cover feeding device disposed on one side of the conveyor line, a PCBA board feeding device disposed on the other side of the conveyor line, a first flipping receiving mechanism disposed next to the PCBA board feeding device, and a conveying and assembly device for conveying the shielding cover and the PCBA board.

[0013] The first flipping and receiving mechanism includes a flipping positioning plate for positioning PCBA boards, a first rotating shaft fixed to the back of the flipping positioning plate, a first motor for driving the first rotating shaft to rotate, a first receiving plate for receiving the PCBA boards after the flipping positioning plate has been flipped, a first driving component for driving the first receiving plate to move up and down and horizontally, and a first pressure sensor disposed on the first receiving plate.

[0014] Furthermore, the cable assembly device includes a cable mounting frame disposed above the conveyor line, a cable positioning plate that is three-dimensionally floating on the cable mounting frame and positions the cable, and a pressure bar that presses the cable onto the PCBA board via the cable positioning plate. The cable positioning plate is provided with cable conforming holes that conform to the cable routing.

[0015] The cable pressing device includes a first XY axis drive module, a first support plate that moves in the XY direction driven by the first XY axis drive module, a first cylinder fixed on the first support plate, a torque sensor that moves up and down driven by the first cylinder, and a pressing pin fixed at the lower end of the torque sensor.

[0016] Furthermore, the antenna assembly device includes an antenna positioning mechanism for positioning the antenna, an antenna relay platform for temporarily placing the PCBA board, a first transport mechanism for transporting the PCBA board, and a first CCD camera; the antenna positioning mechanism includes two movable mounting plates movably disposed above the product carrier and located on the front and rear sides of the product carrier, two second motors that drive the two movable mounting plates to move closer or further apart from each other, a plurality of second cylinders disposed on the movable mounting plates, and a first gripper driven by the second cylinders to clamp the antenna end and correct the antenna.

[0017] Furthermore, the snap-fit ​​press-fit machine includes a snap-fit ​​feeding device, a snap-fit ​​press-fit device for pressing snaps onto the back of the bottom cover, and a first conveying device for conveying snaps and the bottom cover.

[0018] The snap-fit ​​device includes a bottom cover positioning plate for positioning the bottom cover, a flipping drive assembly for driving the bottom cover positioning plate to flip so as to realize the flipping of the front and back of the bottom cover, a pressing module disposed on one side of the bottom cover positioning plate, a bottom cover detection module disposed on the other side of the bottom cover positioning plate, and a receiving and conveying mechanism for receiving the bottom cover after the bottom cover positioning plate has been flipped and for conveying the bottom cover between the pressing module, the bottom cover positioning plate, and the bottom cover detection module.

[0019] Furthermore, the structure of the grounding plate hot-melt assembly device, the cable hot-melt assembly device, and the antenna hot-melt assembly device all include a first pressing component for pressing the product, a hot-melt assembly mechanism for hot-melt cable, grounding plate, or antenna assembled with the product, and a second CCD camera for detecting and locating the hot-melt connection position.

[0020] The hot melt assembly mechanism includes a first YZ axis drive module and a hot melt clamping head disposed at the movable end of the first YZ axis drive module for hot melting the cable.

[0021] Furthermore, both the radiator screw-locking device and the fan screw-locking device include a first screw feeding mechanism on one side of the conveyor line and a screw-locking mechanism disposed above the conveyor line; the spot soldering device is provided with a third YZ axis drive module, an L-shaped support plate driven by the third YZ axis drive module to move in the YZ direction, and several spot soldering heads movably disposed on the horizontal end of the L-shaped support plate; the ground plane soldering device is provided with a fourth YZ axis drive module and a soldering head driven by the fourth YZ axis drive module to move along the YZ direction and solder the pins of the ground plane to the PCBA board.

[0022] Furthermore, the radiator assembly device includes a radiator feeding mechanism, a radiator dispensing mechanism for dispensing adhesive onto the radiator, a second flipping and receiving mechanism for flipping the TCU controller semi-finished product from both sides, and a second conveying mechanism for the TCU controller semi-finished product and the radiator; the structure of the second flipping and receiving mechanism is the same as that of the first flipping and receiving mechanism.

[0023] Furthermore, the screw fastening assembly device includes a turntable, a clamping module pressed against the upper surface of the TCU controller, a positioning carrier disposed on the turntable and positioning the TCU controller, a plurality of screw fastening modules disposed around the outer periphery of the turntable, and a second screw feeding mechanism disposed next to the screw fastening modules.

[0024] The screw-locking module includes an XYZ axis drive module, a third support plate that moves in the XYZ direction driven by the XYZ axis drive module, a second screwdriver fixed on the third support plate, a second screw suction nozzle sleeved on the outer periphery of the lower end of the second screwdriver, a fourth cylinder that drives the second screw suction nozzle to move up and down, and a fourth CCD camera fixed on the second support plate.

[0025] Another major objective of this invention is to provide a method for assembling a TCU controller, which can complete the entire assembly process of the TCU controller using the above-mentioned TCU controller assembly production line, reducing manual intervention and improving production efficiency.

[0026] A method for assembling a TCU controller includes the following steps: Based on the aforementioned assembly line for a TCU controller, the method is characterized by including the following steps:

[0027] S1. Attaching labels and foam to the top cover: Two labels and two foams are attached to the top cover in sequence on the label attaching machine and the foam attaching machine, and the discharge machine transfers the well-attached top cover to the AGV trolley.

[0028] S2. Assemble components on the PCAB board:

[0029] S21. On the shielding cover assembly machine, the two shielding covers are respectively assembled onto the front and back sides of the PCBA board;

[0030] S22. The cables are assembled onto the PCBA board on the multiple cable assembly devices, the female ends of the cables are pressed onto the PCBA board on the cable pressing device, and the appearance and position of the cable pressing are inspected on the cable inspection device to see if they are qualified.

[0031] S23. Position the antenna onto the product carrier on the antenna loading device, assemble the antenna onto the PCBA board on the antenna assembly device, solder different pins of the antenna onto the PCBA board on the multiple antenna welding devices, and detect whether the welding position is qualified on the antenna detection device.

[0032] S24. Assemble the fan onto the PCBA board on the fan assembly machine, and transfer the assembled product to the AGV trolley.

[0033] S3. Assemble the base plate and clips on the bottom cover:

[0034] S31. The mounting plate is assembled on the bottom surface of the bottom cover on the bottom cover assembly device, and the mounting plate is heat-fused and fixed on the bottom cover on multiple mounting plate heat-fusion assembly devices.

[0035] S32. Press the two clips onto the bottom surface of the cover using the clip pressing machine;

[0036] S4. Assemble the bottom cover and PCBA board to obtain the TCU controller semi-finished product:

[0037] S41. The assembled PCBA board is transported from the AGV to the assembly fixture, and the PCBA board is fastened to the bottom cover on the assembly fixture.

[0038] S42. On the cable hot-melt assembly device, one of the cables on the PCBA board is hot-melted and connected to the FPC board;

[0039] S43. Secure the fan and the bottom cover to the fan locking screw device using multiple screws;

[0040] S44. The antennas are heat-fused and fixedly assembled with the bottom cover on the plurality of antenna heat-fusion assembly devices respectively;

[0041] S45. Assemble the heat sink onto the PCBA board on the heat sink assembly device, and tighten the heat sink and the bottom cover with multiple screws on the heat sink screw locking device.

[0042] S46. Apply solder paste to the position of the ground plane to be soldered on the PCBA board on the soldering device, and complete the soldering of the ground plane to the PCBA board on the ground plane soldering device. The detection device detects the obtained TCU controller semi-finished product, and the good product after detection is transferred to the AGV trolley.

[0043] S5. Assemble the TCU controller semi-finished product and the top cover to obtain the TCU controller:

[0044] S51. The AGV trolley transports the pasted top cover and the inspected TCU controller semi-finished product to the screw-locking assembly device. The TCU controller semi-finished product and the top cover are locked together with multiple screws to obtain the TCU controller, thus completing the assembly of the TCU controller.

[0045] Compared with the prior art, the beneficial effects of the TCU controller assembly line and assembly method of the present invention are as follows: the entire production line integrates a top cover production system for assembling parts on the top cover, a PCBA board production system for adding components to the PCAB board, a bottom cover production system for adding parts to the bottom cover, a first assembly system for assembling the bottom cover and the PCBA board, and a second assembly system for assembling the bottom cover and the top cover. The entire production line realizes the assembly operation of the TCU controller, and the transfer between the various systems is realized through AGV carts, which improves the automation level of assembly and further improves production efficiency. [Attached Image Description]

[0046] Figure 1 This is a schematic diagram of the assembly line for the TCU controller according to an embodiment of the present invention;

[0047] Figure 2 This is a three-dimensional structural diagram of the labeling machine according to an embodiment of the present invention;

[0048] Figure 3 This is a three-dimensional structural diagram of the top cover feeding module according to an embodiment of the present invention;

[0049] Figure 4 This is a three-dimensional structural diagram of the foam pasting machine according to an embodiment of the present invention;

[0050] Figure 5 This is a three-dimensional structural diagram of the top cover flipping module according to an embodiment of the present invention;

[0051] Figure 6 This is a three-dimensional structural diagram of the second conveying and pasting device according to an embodiment of the present invention;

[0052] Figure 7 This is a three-dimensional structural diagram of the discharge machine according to an embodiment of the present invention;

[0053] Figure 8 This is a three-dimensional structural diagram of the shielding cover assembly machine according to an embodiment of the present invention;

[0054] Figure 9 This is a three-dimensional structural diagram of the first flipping receiving mechanism according to an embodiment of the present invention;

[0055] Figure 10 This is a three-dimensional structural diagram of the cable assembly device according to an embodiment of the present invention;

[0056] Figure 11 This is a three-dimensional structural diagram of the cable assembly device according to an embodiment of the present invention;

[0057] Figure 12 This is a three-dimensional structural diagram of the cable pressing device according to an embodiment of the present invention;

[0058] Figure 13 This is a three-dimensional structural diagram of the cable testing device according to an embodiment of the present invention;

[0059] Figure 14 This is a three-dimensional structural diagram of the antenna loading device according to an embodiment of the present invention;

[0060] Figure 15 This is a three-dimensional structural diagram of the antenna handling mechanism according to an embodiment of the present invention;

[0061] Figure 16 This is a three-dimensional structural diagram of the product carrier after the antenna is placed in an embodiment of the present invention;

[0062] Figure 17 This is a three-dimensional structural diagram of the antenna assembly device according to an embodiment of the present invention;

[0063] Figure 18 This is a three-dimensional structural diagram of the antenna positioning mechanism according to an embodiment of the present invention;

[0064] Figure 19 This is a three-dimensional structural diagram of the antenna welding device and the antenna detection device according to an embodiment of the present invention;

[0065] Figure 20 This is a three-dimensional structural diagram of the fan assembly machine according to an embodiment of the present invention;

[0066] Figure 21 This is a three-dimensional structural diagram of the bottom cover assembly device according to an embodiment of the present invention;

[0067] Figure 22 This is a three-dimensional structural diagram of the snap-fit ​​press-fit machine according to an embodiment of the present invention;

[0068] Figure 23This is a three-dimensional structural diagram of the snap-fit ​​device according to an embodiment of the present invention;

[0069] Figure 24 This is a three-dimensional structural diagram of the receiving and conveying mechanism according to an embodiment of the present invention;

[0070] Figure 25 This is a three-dimensional structural diagram of the buckle positioning component according to an embodiment of the present invention;

[0071] Figure 26 This is a three-dimensional structural diagram of the first conveying device according to an embodiment of the present invention;

[0072] Figure 27 This is a three-dimensional structural diagram of the combined tooling according to an embodiment of the present invention;

[0073] Figure 28 This is a three-dimensional structural schematic diagram of the cable hot-melt assembly device according to an embodiment of the present invention;

[0074] Figure 29 This is a three-dimensional structural diagram of the fan screw locking device according to an embodiment of the present invention;

[0075] Figure 30 This is a three-dimensional structural diagram of the radiator assembly device according to an embodiment of the present invention;

[0076] Figure 31 This is a three-dimensional structural diagram of the second conveying mechanism according to an embodiment of the present invention;

[0077] Figure 32 This is a three-dimensional structural diagram of the spot soldering device according to an embodiment of the present invention;

[0078] Figure 33 This is a three-dimensional structural schematic diagram of the grounding plate welding device according to an embodiment of the present invention;

[0079] Figure 34 This is a top view of the detection device according to an embodiment of the present invention;

[0080] Figure 35 This is a three-dimensional structural diagram of the screw-locking assembly device according to an embodiment of the present invention;

[0081] Figure 36 This is a three-dimensional structural diagram of the screw-locking module according to an embodiment of the present invention;

[0082] The numbers in the image represent:

[0083] Assembly line for 100-TCU controller; product carrier 800, first antenna 901, second antenna 902;

[0084] 200-Top cover production system, 1-Labeling machine, 11-Top cover feeding module, 111-Elevator, 112-Conveying assembly, 12-Top cover feeding module, 121-Discharging roller, 122-First guide pressing assembly, 123-Peeling assembly, 124-Second receiving plate, 125-Second guide pressing assembly, 126-Receiving roller, 13-First conveying and pasting device, 2-Foam applicator, 21-Foam feeding module, 22-Top cover flipping module 221-Support frame, 222-Horizontal axis, 223-First positioning plate, 224-Flipping drive, 225-First positioning assembly, 23-Second handling and pasting device, 231-First adsorption assembly, 232-Second adsorption assembly, 233-Fifth CCD camera, 234-Spreading assembly, 2341-Spreading claw, 2342-Driver, 3-Discharge machine, 31-Top cover unloading module, 32-Defective product conveyor line, 33-Adsorption and handling module;

[0085] 300 - PCBA board production system; 4 - Shielding cover assembly machine; 41 - Shielding cover feeding device; 42 - PCBA board feeding device; 43 - First flipping receiving mechanism; 431 - Flipping positioning plate; 432 - First rotating shaft; 433 - First motor; 434 - First receiving plate; 435 - First drive assembly; 436 - First pressure sensor; 44 - Handling and assembly device; 5 - Cable assembly machine; 51 - Cable assembly device; 511 - Cable mounting bracket; 512 - Cable positioning plate; 5121 - Cable contour hole; 513 - Pressure bar; 514 - Three-dimensional floating structure, 5141-First linear bearing, 5142-First moving rod, 5143-Second linear bearing, 5144-Second moving rod, 5145-Third linear bearing, 5146-Third moving rod, 52-Cable pressing device, 521-First XY axis drive module, 522-First support plate, 523-First cylinder, 524-Torque sensor, 525-Pressing needle, 53-Cable detection device, 531-2D camera, 532-First 3D camera, 533-Second XY axis drive module, 6-Antenna assembly machine, 61- Antenna feeding device, 611-antenna feeding mechanism, 6111-first feeding mechanism, 6112-second feeding mechanism, 6113-third feeding mechanism, 612-antenna handling mechanism, 6121-antenna handling module, 61211-antenna adsorption assembly, 61212-first gripping assembly, 61213-second gripping assembly, 6122-sixth CCD camera, 62-antenna assembly device, 621-antenna positioning mechanism, 6211-moving mounting plate, 6212-second motor, 6213-second cylinder, 6214-first gripper. 622-Antenna repeater, 623-First transport mechanism, 624-First CCD camera, 63-Antenna welding device, 631-Welding positioning plate, 6311-Positioning through hole, 632-Welding torch, 64-Antenna detection device, 641-Seventh CCD camera, 7-Fan assembly machine, 71-Fan assembly fixture, 711-Clamping assembly, 7111-Contouring clamping plate, 7112-Eleventh cylinder, 712-Positioning assembly, 7121-Twelfth cylinder, 7122-Third support plate, 7123-Force control motor, 7124-Positioning claw;

[0086] 400-Bottom Cover Production System, 8-Bottom Cover Assembly Device, 81-Bottom Cover Feeding Mechanism, 82-Ground Plate Feeding Mechanism, 83-Second Handling Device, 84-Bottom Cover Assembly Platform, 9-Ground Plate Hot Melt Assembly Device, 10-Snap-on Press-fit Machine, 101-Snap-on Feeding Device, 102-Snap-on Press-fit Device, 1021-Bottom Cover Positioning Plate, 1022-Tilting Drive Assembly, 1023-Pressure Module, 10231-Z-Axis Drive Motor, 10232-Fourth Support Plate, 10234-Pressure Structure, 1024-Bottom Cover Detection Module, 10241-Positioning Platform, 10242-Second 3D Camera, 10243-XY-Axis Drive Assembly, 1025-Receiving Conveyor Mechanism, 10251-X-axis linear motor, 10252-Fifth support plate, 10253-Snap-on positioning assembly, 102531-Sixth support plate, 102532-Seventh support plate, 102533-Snap-on carrier, 102534-Modible clamping block, 102535-Fifth cylinder, 102536-Contouring positioning groove, 10254-Second positioning plate, 10255-Pushing assembly, 10256-Second pressure sensor, 103-First conveying device, 1031-Bottom cover adsorption assembly, 1032-Snap-on clamping assembly, 10321-Sixth cylinder, 10322-Eighth support plate, 10323-Seventh cylinder, 10324-Second gripper;

[0087] 500 - First assembly system, 20 - Combined tooling, 201 - Contouring upper cover, 202 - Contouring lower cover, 203 - Vacuum tube, 30 - Cable hot-melt assembly device, 301 - First clamping assembly, 3011 - Clamping component, 3012 - Eighth cylinder, 302 - Hot-melt assembly mechanism, 3021 - First YZ axis drive module, 3022 - Hot-melt clamping head, 3023 - Second CCD camera, 40 - Fan screw-locking device, 401 - First screw feeding mechanism, 402 - Screw-locking mechanism, 4021 - Second YZ axis drive module, 4022 - Second support plate, 4023 - First screwdriver, 4024 - First screw suction nozzle, 4025 - Third cylinder, 4026 - Third CCD camera, 50 - Antenna hot-melt assembly device 60-Radiator assembly device, 601-Radiator feeding mechanism, 602-Radiator dispensing mechanism, 603-Second flipping receiving mechanism, 604-Second conveying mechanism, 6041-Clamping module, 6042-Ninth cylinder, 6043-Ninth support plate, 6044-Tenth cylinder, 6045-Third gripper, 70-Radiator screw locking device, 80-Soldering device, 801-Third YZ axis drive module, 802-L-shaped support plate, 803-Soldering head, 90-Ground plate welding device, 901-Fourth YZ axis drive module, 902-Welding head, 110-Detection device, 1101-Defective product conveyor line, 1102-Good product conveyor line, 1103-Third conveying mechanism, 1104-X-ray detection module;

[0088] 600 - Second assembly system, 120 - Screw fastening assembly device, 1201 - Turntable, 1202 - Positioning carrier, 1203 - Screw fastening module, 12031 - XYZ axis drive module, 12032 - Third support plate, 12033 - Second screwdriver, 12034 - Second screw suction nozzle, 12035 - Fourth cylinder, 12036 - Fourth CCD camera, 1204 - Second screw feeding mechanism, 1205 - Clamping module.

Detailed Implementation Methods

[0089] Please refer to Figures 1-36This embodiment is an assembly line for a TCU controller. The TCU controller assembly line 100 includes a top cover production system 200 for adding parts to the top cover, a PCBA board production system 300 for adding components to the PCBA board, a bottom cover production system 400 for adding parts to the bottom cover, a first assembly system 500 for assembling the PCBA board and the bottom cover, and a second assembly system 600 for assembling the bottom cover and the top cover. Each of the production systems and assembly systems is equipped with upper and lower conveyor lines for product carrier turnover. Lifting modules are connected end-to-end between the two conveyor lines, and each workstation is equipped with a lifting module to lift the product carrier. The top cover production system... PCBA board production system 300 includes a labeling machine 1, a foam applicator 2, and a discharge machine 3 arranged sequentially along the conveying direction of the conveyor line; PCBA board production system 300 includes a shielding cover assembly machine 4, a cable assembly machine 5, an antenna assembly machine 6, and a fan assembly machine 7 arranged sequentially along the conveying direction of the conveyor line; the cable assembly machine 5 includes a cable assembly device 51 for assembling cables onto the PCBA board, a cable pressing device 52 for pressing the female ends of the cables onto the PCBA board, and a cable testing device 53 for testing the assembled cables, arranged sequentially along the conveying direction of the conveyor line; the antenna assembly machine 6 includes an antenna feeding device 61 and an antenna assembly device 62 arranged sequentially along the conveying direction of the conveyor line, and a fan assembly device 7 for assembling antennas onto the PCBA board. The system includes a wire assembly device 62, an antenna welding device 63 for soldering antenna pins to the PCBA board, and an antenna testing device 64 for testing the soldered antenna; the bottom cover production system 400 includes a bottom cover assembly device 8 for assembling ground planes onto the bottom cover, a ground plane hot-melt assembly device 9 for hot-melting and fixing ground planes onto the bottom cover, and a snap-fit ​​press-fit machine 10 for pressing snaps onto the bottom cover, all arranged sequentially along the conveyor line direction; the first assembly system 500 includes a combination fixture 20 for assembling PCBA boards and bottom covers to obtain TCU controller semi-finished products, all arranged sequentially along the conveyor line direction, and a cable hot-melt assembly for hot-melting cables on the PCBA board and connecting them to the FPC board to achieve electrical connection. The assembly system 600 includes a fan locking screw device 30 for securing the fan assembled on the PCBA board to the bottom cover, a fan locking screw device 40 for hot-melting and fixing the antenna assembled on the PCBA board to the bottom cover, an antenna hot-melt assembly device 50 for assembling the heat sink onto the PCBA board, a heat sink assembly device 60 for assembling the heat sink onto the PCBA board, a heat sink locking screw device 70 for locking the heat sink onto the bottom cover, a spot soldering device 80 for spot soldering the ground plane on the PCBA board, a ground plane soldering device 90 for soldering the ground plane onto the PCBA board, and an inspection device 110 for inspecting the assembled finished product; the second assembly system 600 includes a locking screw assembly device 120 for assembling the bottom cover and the top cover.

[0090] Labeling machine 1 includes a top cover feeding module 11 located on one side of the conveyor line, a top cover feeding module 12 located on the other side of the conveyor line, and a first conveying and pasting device 13 for transporting the top cover and the label and pasting the label onto the top cover. Foam applicator 2 includes a foam feeding module 21 located on one side of the conveyor line, a top cover flipping module 22 located on the other side of the conveyor line, and a second conveying and pasting device 23 for transporting the foam and the top cover and pasting the foam onto the top cover. Discharge machine 3 includes a top cover unloading module 31, a defective product conveyor line 32, and an adsorption and transporting module 33 for transporting the pasted top covers to the top cover unloading module 31 or the defective product conveyor line 32. Both the top cover feeding module 11 and the top cover unloading module 31 include a lifting platform 111 for conveying product trays and a horizontally arranged conveying assembly 112 connected to the lifting platform 111. Both the top cover feeding module 12 and the foam feeding module 21 include a feeding roller 121, a first guide and clamping assembly 122 for guiding and pressing the material roll, a peeling assembly 123 for peeling the label or foam from the release paper, a second receiving plate 124 located at the front end of the peeling assembly 123 for receiving the label or foam, a second guide and clamping assembly 125 located below the peeling assembly 123 for guiding and pressing the release paper, and a receiving roller 126 located beside the second guide and clamping assembly 125 for collecting the release paper. In this embodiment, two labels of different sizes need to be pasted on the same top cover; therefore, two top cover feeding modules 12 are required. Two foams of different shapes need to be attached to the same top cover: the first foam is circular and the second foam is square. Therefore, two foam feeding modules 21 are needed to attach the circular and square foams. The first foam is attached to the horizontal surface of the top cover, and the second foam is attached to the inclined surface of the top cover. Thus, the first and second foams are attached to different surfaces of the top cover. Since the second conveying and attaching device 23 can only move up and down, it is necessary to flip one side of the inclined surface of the top cover upwards to make it horizontal before the second conveying and attaching device 23 attaches the second foam to the top cover. The top cover flipping module 22 includes a support frame 221, a horizontal shaft 222 rotatably mounted on the support frame 221, a first positioning plate 223 fixed on the horizontal shaft 222, and a flipping drive 224 that drives the first positioning plate 223 to flip. The first positioning plate 223 is provided with a first positioning component 225 for positioning the top cover. The flipping drive 224 drives the first positioning plate 223 to flip the top cover, thereby turning the inclined side of the top cover upwards into a horizontal plane. Then, the second conveying and pasting device 23 pastes the second foam onto the top cover. The top cover flipping module 22 is not limited to use on the foam pasting machine 2. If there is also a situation where labeling is done on an inclined plane, it can also be applied to the label pasting machine 1.Both the first handling and pasting device 13 and the second handling and pasting device 23 include a first adsorption component 231 for adsorbing labels or foam at the end of the robot arm, a second adsorption component 232 for adsorbing top covers, and a fifth CCD camera 233 for photographing the materials. The adsorption and handling module 33 has a second adsorption component 232 for adsorbing top covers at the moving end of the robot arm. Since each top cover is used to adsorb two labels and two foams, there are two first adsorption components 231. Because the foam is ring-shaped, to ensure accurate positioning, the second handling and pasting device 23 also has a spreading component 234 in the first adsorption component 231 to spread the foam and keep it ring-shaped. The spreading component 234 includes several spreading claws 2341 for spreading the foam and a driving component 2342 for driving the spreading claws 2341 to open. The label adsorption component 131, foam adsorption component 231, first top cover adsorption component 132, second top cover adsorption component 232 and third top cover adsorption component 331 are all structured by using a cylinder to drive the adsorption block to adsorb materials. The adsorption block is provided with adsorption holes and the materials are adsorbed by vacuum.

[0091] The workflow of the top cover production system 200 is as follows: The second adsorption component 232 of the first transport and pasting device 13 picks up a top cover from the conveying component 112 of the top cover feeding module 11. Then, the first adsorption component 231 of the first transport and pasting device 13 picks up two labels from the two top cover feeding modules 12 in sequence. The first transport and pasting device 13 first places the picked-up top cover onto the product carrier. The fifth CCD camera 233 positions the label and determines the label pasting position. The two labels are pasted onto the top cover in sequence. After pasting, the lifting module drives the product carrier to descend, and the product carrier drives the top cover to move onto the foam pasting machine 2. The lifting module drives the product carrier to rise. At the same time, the first adsorption component 231 of the second transport and pasting device 23 moves to the two foam feeding modules 21 and picks up two foams respectively. Since the first foam is pasted on the horizontal surface of the top cover and the second foam is pasted on the inclined surface of the top cover, the second adsorption component 232 of the second transport and pasting device 23... The top cover is adsorbed and moved to the top cover flipping module 22. The first positioning component 225 surrounds the outer periphery of the top cover to position it. The second conveying and pasting device 23 first pastes the first foam onto the top cover. The flipping drive component 224 drives the first positioning plate 223 to flip the top cover, thereby flipping one side of the top cover upward to become a horizontal surface. Then, the second conveying and pasting device 23 pastes the second foam onto the top cover. The second adsorption component 232 adsorbs the top cover and places it on the product carrier. The fifth CCD camera 233 takes a picture of the top cover for inspection. The lifting module descends to place the product carrier on the conveyor line and is conveyed to the discharge machine 3. If it is a good product, the adsorption and conveying module 33 moves the top cover to the top cover unloading module 31. If it is a defective product, the adsorption and conveying module 33 moves the top cover to the defective product conveyor line 32. The product carrier is conveyed to the lower conveyor line via the lifting module, and then to the upper conveyor line via the lifting module, ready for the next round of labeling and foam pasting operations.

[0092] The shielding cover assembly machine 4 includes a shielding cover feeding device 41 located on one side of the conveyor line, a PCBA board feeding device 42 located on the other side of the conveyor line, a first flipping and receiving mechanism 43 located beside the PCBA board feeding device 42, and a transporting and assembling device 44 for transporting shielding covers and PCBA boards. The shielding cover feeding device 41 and the PCBA board feeding device 42 have the same structure as the top cover feeding module 11, except that the structure of the material tray is slightly different. The positioning structure inside the material tray is changed according to different products, which will not be described in detail here. In this embodiment, since each PCBA board needs to assemble two shielding covers, two shielding cover feeding devices 41 are provided along the conveying direction of the conveyor line to improve efficiency. The two shielding covers are assembled on the front and back sides of the PCBA board, respectively. Therefore, the first flipping and receiving mechanism 43 is provided to flip the PCBA board. First, one shielding cover is assembled on the front side of the PCBA board. After the first flipping and receiving mechanism 43 flips the PCBA board, the other shielding cover is assembled on the back side of the PCBA board. Both sides of the PCBA board are provided with conformal fitting structures for positioning the shielding cover. The transport and assembly device 44 places the shielding cover in the correct position and then presses it down to complete the assembly of the shielding cover. The first flipping and receiving mechanism 43 includes a flipping positioning plate 431 for positioning the PCBA board, a first rotating shaft 432 fixed to the back of the flipping positioning plate 431, a first motor 433 for driving the first rotating shaft 432 to rotate, a first receiving plate 434 for receiving the PCBA board after the flipping positioning plate 431 has been flipped, a first driving component 435 for driving the first receiving plate 434 to move up and down and horizontally, and a first pressure sensor 436 disposed on the first receiving plate 434. Both the flipping positioning plate 431 and the first receiving plate 434 are provided with a first positioning structure for positioning the PCBA board. The first positioning structure includes a positioning pin and a suction hole. The transport and assembly device 44 has the same structure as the first transport and pasting device 13, and will not be described again here.

[0093] Because different components are assembled on the PCBA board, the cables will take different routes during antenna assembly to avoid other components. Therefore, multiple antennas on the PCBA board will have different routes. In this embodiment, four cables of different lengths and routes need to be assembled on the back of the PCBA board. To improve the cable assembly efficiency, four cable assembly devices 51 are provided along the conveyor line direction, and each cable assembly device 51 assembles one cable. The cable assembly device 51 includes a cable mounting frame 511 set above the conveyor line, a cable positioning plate 512 three-dimensionally floating on the cable mounting frame 511 and positioning the cable, and a pressure rod 513 pressing the cable onto the PCBA board via the cable positioning plate 512. The cable mounting bracket 511 is equipped with a three-dimensional floating structure 514 that allows the cable positioning plate 512 to float in three dimensions. The three-dimensional floating structure 514 includes a pair of first moving rods 5142, which are mounted at both ends of the cable mounting bracket 511 via first linear bearings 5141 and float in the Z direction; a pair of second moving rods 5144, which are mounted on the first moving rods 5142 via second linear bearings 5143 and float in the X direction; and a pair of third moving rods 5146, which are mounted on the second moving rods 5144 via third linear bearings 5145 and float in the Y direction. The cable positioning plate 512 is fixed at both ends to the third moving rods 5146, and the cable positioning plate 512 has cable-contouring holes 5121 that conform to the cable's direction. The cable-contouring holes 5121 on the cable positioning plate 512 limit the direction of the conductors, facilitating the smooth installation of the cable from the cable-contouring holes 5121 onto the PCBA board, thereby improving the efficiency of cable assembly.

[0094] In this embodiment, since four cables are assembled, and the female ends of the cables need to be pressed onto the male ends of the PCBA board to achieve electrical conductivity between the cables and the PCBA board, two cable pressing devices 52 are provided along the conveying direction of the conveyor line to press different cables respectively, in order to improve the pressing efficiency. The cable pressing device 52 includes a first XY axis drive module 521, a first support plate 522 driven by the first XY axis drive module 521 to move in the XY direction, a first cylinder 523 fixed on the first support plate 522, a torque sensor 524 driven by the first cylinder 523 to move up and down, and a pressing pin 525 fixed to the lower end of the torque sensor 524. The bottom of the pressing pin 525 is contoured to the upper surface of the female end of the cable. In this embodiment, the upper surface of the female end of the cable is flat, so the pressing pin 525 is rod-shaped with a flat bottom.

[0095] The cable inspection device 53 includes a 2D camera 531 for detecting whether the appearance and position of the cable pressing are qualified, a first 3D camera 532 for detecting whether the pressing height of the female ends of the cable 500 is qualified, and a second XY axis drive module 533 for driving the 2D camera 531 and the first 3D camera 532 to move along the XY direction.

[0096] The front of the PCBA board requires the assembly of three pairs of antennas, totaling six antennas. These six antennas are assembled at the ends and sides of the PCBA board. After assembly, the antennas need to be soldered onto the PCBA board. Since the PCBA board is facing upwards after the cable assembly system is pressed, the antenna loading device 61 first transports the antennas to the product carrier. Then, the antenna assembly device 62 places the PCBA board onto the antennas to complete the assembly, with all antenna pins facing upwards. The antenna soldering device 63 then solders all antenna pins to the back of the PCBA board. Therefore, the product carrier 800 is simultaneously equipped with a first positioning structure 801 for positioning the PCBA board, a second positioning structure 802 for positioning the six antennas, and positioning structures for positioning other states of the product, which are not limited here. The antenna includes a larger first antenna 901, a smaller second antenna 902, and a third antenna. The first antenna 901, second antenna 902, and third antenna are arranged in pairs. Therefore, two antenna loading devices 61 are arranged along the conveyor line direction, and each antenna loading device 61 completes the loading of the first antenna 901, the second antenna 901, and the third antenna. The third antenna is located beside the first antenna 901 and at both ends of the second positioning structure 802.

[0097] The antenna feeding device 61 includes an antenna feeding mechanism 611 and an antenna transport mechanism 612. Because the three types of antennas have different external structures, three antenna feeding mechanisms 611 are used: a first feeding mechanism 6111 for the first antenna, a second feeding mechanism 6112 for the second antenna, and a third feeding mechanism 6113 for the third antenna. The first feeding mechanism 6111 has the same structure as the shielding cover feeding device 41 and the PCBA board feeding device 42, except that the structure of the tray is slightly different. The positioning structure within the tray is modified according to different products, which will not be described in detail here. The second feeding mechanism 6112 and the third feeding mechanism 6113 both use vibratory feeder feeding, which is a conventional feeding method and will not be described in detail here. The antenna handling device 612 includes an antenna handling module 6121 disposed at the end of a robotic arm to handle the antenna and a sixth CCD camera 6122 for detecting the antenna position. The antenna handling module 6121 includes an antenna adsorption component 61211 for adsorbing the first antenna, a first clamping component 61212 for clamping the second antenna, and a second clamping component 61213 for clamping the third antenna.

[0098] The antenna assembly device 62 includes an antenna positioning mechanism 621 for positioning the antenna 600, an antenna relay platform 622 for temporarily placing the PCBA board, a first transport mechanism 623 for transporting the PCBA board 300, and a first CCD camera 624. The antenna positioning mechanism 621 includes two movable mounting plates 6211 movably mounted above the product carrier and located on the front and rear sides of the product carrier, two second motors 6212 that drive the two movable mounting plates 6211 to move closer or further apart, several second cylinders 6213 mounted on the movable mounting plates 6211, and first grippers 6214 driven by the second cylinders 6213 to clamp the antenna end and correct the antenna. Multiple pairs of first grippers 6214 simultaneously clamp the antenna end and correct the antenna, so that when the first transport mechanism 623 places the PCBA board above the antenna, the three pairs of antennas can be smoothly assembled onto the PCBA board. At this time, the antenna pins are all inserted into the soldering holes of the PCBA board, and the antenna soldering device 63 solders the pins onto the PCBA board. The antenna repeater 62 is equipped with a first positioning structure for positioning the PCBA board. The first transport mechanism 623 has the same structure as the adsorption transport module 33, and will not be described in detail here.

[0099] Since each antenna has multiple pins, and a total of six antennas need to be soldered, three antenna soldering devices 63 are installed along the conveyor line to improve soldering efficiency. Each device solders different pins of the antennas. Each antenna soldering device 63 includes a soldering positioning plate 631 positioned above the product carrier to determine the soldering location, and a soldering gun 632 positioned above the soldering positioning plate 631 to solder the antennas onto the PCBA board. The soldering positioning plate 631 has several positioning through holes 6311 corresponding to the soldering location and into which the soldering gun 632 extends. Because the three antenna soldering devices 63 solder different pins of the antennas, the position and shape of the positioning through holes 6311 on the soldering positioning plate 631 of each device are adapted to different pins; this is not limited here. A ring of silicone is provided on the back of the soldering positioning plate 631 outside the positioning through holes 6311 to ensure soft contact between the silicone and the PCBA board when the soldering positioning plate 631 is pressed against it, preventing damage to the PCBA board. The antenna detection device 64 is equipped with a seventh CCD camera 641 for detecting solder on the PCBA board.

[0100] The fan assembly machine 7 is equipped with a fan assembly fixture 71 for assembling fans. The fan assembly fixture 71 includes a second clamping component 711 for clamping the PCBA board and a second positioning component 712 for positioning and assembling the fan onto one end of the PCBA board. The second clamping component 711 includes a conforming clamping plate 7111 that is pressed against the surface of the PCBA board and whose lower surface conforms to the surface of the PCBA board, and an eleventh cylinder 7112 that drives the conforming clamping plate 7111 to move up and down. The second positioning component 712 includes a twelfth cylinder 7121, a tenth support plate 7122 that is driven by the twelfth cylinder 7121 to move up and down, a force-controlled motor 7123 fixed on the tenth support plate 7122, and a positioning claw 7124 provided at the end of the force-controlled motor 7123. The positioning claw 7124 is provided with a clearance opening to avoid the antenna. The working principle of the fan assembly machine 7 is as follows: The fan is manually placed on one end of the PCBA board. The eleventh cylinder 7112 drives the contour clamping plate 7111 to descend and press against the other end of the PCBA board. The twelfth cylinder 7121 drives the third support plate 7122 to descend. The force-controlled motor 7123 drives the positioning jaws 7124 to position and assemble the fan onto one end of the PCBA board. The force-controlled motor 7123 can precisely control the clamping force of the positioning jaws 7124, improving the accuracy of fan installation.

[0101] The production process of the PCBA board production system 300 is as follows: The conveying and assembly device 44 moves to the shielding cover feeding device 41, sequentially adsorbs two shielding covers, and then moves to the PCBA board feeding device 42 to adsorb a PCBA board. Next, it moves to the first flipping and receiving mechanism 43 and places the PCBA board face up onto the flipping positioning plate 431. The conveying and assembly device 44 assembles one of the shielding covers onto the front of the PCBA board. The first motor 433 drives the rotating shaft 432 to rotate, causing the flipping positioning plate 431 to flip 180°. Simultaneously, the first drive assembly 435 moves the receiving plate 434 directly below the flipping positioning plate 431 to receive the PCBA board that has been flipped 180° from the flipping positioning plate 431. The BA board, with its back side facing up, is positioned onto the receiving plate 434. The transport and assembly device 44 assembles another shielding cover onto the back of the PCBA board. Simultaneously, the pressure sensor 436 detects the pressure during assembly to ensure the shielding cover can be smoothly assembled onto the back of the PCBA board. The transport and assembly device 44 transports the PCBA board onto the product carrier. The lifting module lowers the product carrier, which is located on the conveyor line and flows into the first cable assembly device 51. The lifting module lifts the product carrier, and the cable positioning plate 512 is fine-tuned so that the cable contour hole 5121 of the cable positioning plate 5122 aligns with the position on the PCBA board below where the cable needs to be assembled. The first cable is placed into the cable contour hole 5121, and a pressure rod is used... The pressure pins 513 press the cable downwards, causing multiple sections of the cable to engage with the clips on the PCBA board. The lifting module lowers the product carrier, which then flows onto the conveyor line and into the three subsequent cable assembly devices 51. Using the same method, the second, third, and fourth cables are sequentially assembled into their corresponding positions on the PCBA board. After all four cables are assembled, the product carrier carries the PCBA board to the first cable pressing device 52. The lifting module lifts the product carrier, and the first XY axis drive module 521 moves the pressing pins 525 to press the female ends of the cables into the male ends of the PCBA board. The torque sensor 524 controls the pressure of the pressing pins 525 to ensure the cable ends... The female connector is successfully pressed into the male connector of the PCBA board. After both cable pressing devices 52 have completed pressing, the lifting module lowers the product carrier. The product carrier is located on the conveyor line and flows into the cable inspection device 53. The 2D camera 531 inspects the appearance and position of the cable pressing, and the first 3D camera 532 inspects the height of the female connector pressing at both ends of the cable. After inspection, the cable flows into the first antenna loading device 61. The antenna handling mechanism 612 sequentially picks up or clamps an antenna from the first feeding mechanism 6111, the second feeding mechanism 6112, and the third feeding mechanism 6113 and places it onto the second positioning structure on the product carrier. The product carrier then moves to the second loading device 61.Antenna transport mechanism 612 places the other three antennas onto the second positioning structure on the product carrier. The lifting module lowers the product carrier, which is located on the conveyor line and flows into the antenna assembly device 62. The lifting module lifts the product carrier but positions it below the movable mounting plate 6211. The first transport mechanism 623 transports the PCBA board from the product carrier to the antenna repeater 622. Two second motors 6212 drive the movable mounting plate 6211 closer. The second cylinder 6213 drives the first gripper 6214 to clamp the antenna end and align the antenna. The first transport mechanism 623 then transports the PCBA board from the antenna repeater 622 above the antenna. The three pairs of antennas can then be successfully assembled onto the PCBA board. At this point, the antenna pins are inserted into the solder holes on the PCBA board. Inside, the lifting module lowers the product carrier, while the first CCD camera 624 checks whether the antenna pins are inserted into the soldering holes on the PCBA board. The product carrier flows to the first antenna soldering device 63, where the lifting module lifts it and brings it into contact with the soldering positioning plate 631. The silicone on the underside of the soldering positioning plate 631 makes soft contact with the PCBA board. The soldering gun 632 moves to the positioning through hole 6311 and solders the antenna pins to the PCBA board. The product carrier then flows through the next two antenna soldering devices 63, using the same actions to complete the assembly and soldering of the antenna to the PCBA board. After soldering, the seventh CCD camera 641 checks the solder on the PCBA board. After inspection, the product carrier is transported to the fan assembly machine 7, where the fan is manually assembled on the fan assembly fixture 71.

[0102] The bottom cover assembly device 8 includes a bottom cover feeding mechanism 81, a mating plate feeding mechanism 82, a second conveying device 83 for transporting the bottom cover and mating plates, and a bottom cover assembly platform 84. The bottom cover feeding mechanism 81 and the mating plate feeding mechanism 82 have the same structure as the PCBA board feeding device 42 and the shielding cover feeding device 41, respectively, except that the structure of the material tray is slightly different. The positioning structure within the material tray is modified according to different products, which will not be described in detail here. The second conveying device 83 has the same structure as the first conveying and pasting device 13, which will not be described in detail here. The bottom cover assembly platform 84 includes a bottom cover positioning plate for positioning the bottom cover. A third pressure sensor is installed below the bottom cover positioning plate. The second conveying device 83 first transports the bottom cover to the bottom cover positioning plate, and then transports the two mating plates to the bottom cover, pressing them down to assemble the mating plates onto the bottom surface of the bottom cover. After assembly, the second conveying device 83 transports the bottom cover with the assembled mating plates to the conveyor line, and then to the mating plate hot-melt assembly device 9, where the mating plates are hot-melted and fixed to the bottom cover. Since there are many locations on the grounding plate that require heat fusion, four grounding plate heat fusion assembly devices 9 are installed along the conveyor line to perform heat fusion on different locations of the grounding plate. The grounding plate heat fusion assembly device 9 has the same structure as the cable heat fusion assembly device 30, except that it heats the grounding plate and assembles it on the bottom cover after heat fusion, which will not be described in detail here.

[0103] In addition to assembling two base plates on the bottom cover, two clips also need to be assembled. The clip pressing machine 10 includes a clip feeding device 101, a clip pressing device 102 for pressing the clips onto the back of the bottom cover, and a first conveying device 103 for conveying the clips and the bottom cover. The clip feeding device 101 uses a vibratory feeder, which is a conventional feeding method and will not be described in detail here. The first handling device 103 includes a bottom cover adsorption assembly 1031 disposed at the movable end of the robotic arm and a buckle gripping assembly 1032 for gripping the buckles. Since each bottom cover grips two buckles, two buckle gripping assemblies 1032 are provided. The bottom cover adsorption assembly 1031 has the same structure as the first top cover adsorption assembly 132, and will not be described again here. The buckle gripping assembly 1032 includes a sixth cylinder 10321, an eighth support plate 10322 driven by a fourth cylinder to move up and down, a seventh cylinder 10323 disposed on the eighth support plate 10322, and a pair of second grippers 10324 driven by a second cylinder to open or clamp. Since two buckles are assembled on each bottom cover, two buckle gripping assemblies 1032 are provided.

[0104] The snap-fit ​​pressing device 102 includes a bottom cover positioning plate 1021 for positioning the bottom cover, a flipping drive assembly 1022 for driving the bottom cover positioning plate 1021 to flip, thereby realizing the flipping of the front and back of the bottom cover, a pressing module 1023 disposed on one side of the bottom cover positioning plate 1021, a bottom cover detection module 1024 disposed on the other side of the bottom cover positioning plate 1021, and a receiving and conveying mechanism 1025 for receiving the bottom cover after the bottom cover positioning plate 1021 has been flipped and for conveying the bottom cover between the pressing module 1023, the bottom cover positioning plate 1021, and the bottom cover detection module 1024. The bottom cover positioning plate 1021 is provided with a third positioning structure for positioning the bottom cover. The flipping drive assembly 1022 includes a rotary motor and a second rotary shaft driven by the rotary motor to rotate. The output shaft end of the rotary motor and the second rotary shaft are connected by a synchronous belt pulley to achieve rotary transmission. The pressing module 1023 includes a Z-axis drive motor 10231, a fourth support plate 10232 driven by the Z-axis drive motor 10231 to move up and down, a guide positioning rod fixed below the fourth support plate 10232, and a pressing structure 10234 disposed below the fourth support plate 10232. The pressing structure 10234 is provided with several pressing rods or several pressing blocks. The specific shape of the pressing rods or pressing blocks is set according to the shape of the bottom cover and is not limited here. The bottom cover detection module 1024 includes a positioning platform 10241 for placing the pressed product, a second 3D camera 10242 disposed below the positioning platform 10241, and an XY axis drive assembly 10243 for driving the second 3D camera 10242 to move in the XY direction. The receiving and conveying mechanism 1025 includes an X-axis linear motor 10251, a fifth support plate 10252 driven by the X-axis linear motor 10251 to move left and right, a snap-fit ​​positioning assembly 10253 disposed above the fifth support plate 10252, and a second positioning plate 10254 disposed above the snap-fit ​​positioning assembly 10253 and used to receive the bottom cover of the bottom cover positioning plate 1021. The fifth support plate 10252 is provided with a pushing assembly 10255 for pushing the second positioning plate 10254 upward. The pressing module 2 is located above the second positioning plate 10254. The snap-fit ​​positioning assembly 10253 is provided with a second pressure sensor 10256 for detecting pressure and stroke during the pressing process. The snap-fit ​​positioning assembly 10253 includes a sixth support plate 102531 located directly above the fifth support plate 10252, a seventh support plate 102532 located above the sixth support plate 102531, snap-fit ​​carriers 102533 located at both ends of the seventh support plate 102532, two movable clamping blocks 102534 located on the front and rear sides of the snap-fit ​​carriers 102533 and positioning the front and rear sides of the snap-fit, and a fifth cylinder 102535 for driving the two movable clamping blocks 102534 to open or clamp.The buckle carrier 102533 is provided with a contour positioning groove 102536 that conforms to the shape of the buckle. The fifth cylinder 102535 is fixed on the sixth support plate 102531. The second pressure sensor 10256 is located between the sixth support plate 102531 and the seventh support plate 102532. When the pressing module 1023 is pressed on the bottom cover, the second pressure sensor 10256 detects the pressure and stroke of its downward press to ensure that the buckle is successfully pressed on the bottom cover.

[0105] The production process of the bottom cover production system 400 is as follows: The second conveying device 83 picks up the bottom cover and the base plate from the bottom cover feeding mechanism 81 and the base plate feeding mechanism 82 respectively. First, the bottom cover is placed on the bottom cover assembly platform 84. Then, the two base plates are transported to the bottom cover and pressed down to assemble the base plates onto the bottom cover. The pressure during pressing is detected by the third pressure sensor. After assembly, the second conveying device 83 transports the bottom cover with the base plates to the conveyor line and conveys it to the first base plate hot melt assembly device 9. The base plates are hot melted and fixed to the bottom cover. The bottom cover is then conveyed to the next three base plate hot melt assembly devices 9 in sequence. The base plates are hot melted and fixed to the bottom cover at different positions. The product carrier drives the bottom cover to the snap-fit ​​pressing machine 10. The two snap-fit ​​clamping components 1032 of the first conveying device 103 each clamp one snap from the snap-fit ​​feeding device 101 and clamp the PCBA board from the product carrier. The snap is placed on the receiving conveyor. On the latching carrier 102533 of the structure 1025, the bottom cover is placed face up on the bottom cover positioning plate 1021. The flipping drive assembly 1022 drives the bottom cover positioning plate 1021 to flip 180°, thereby flipping the bottom cover face up and back up. At the same time, the receiving conveying mechanism 1025 moves the latch to the bottom cover positioning plate 1021. The pushing assembly 10255 pushes the second positioning plate 10254 upward to receive the flipped bottom cover. The bottom cover is positioned face up. The buckle is positioned on the second positioning plate 10254. At this time, the buckle is positioned on the back of the bottom cover to be pressed. The Z-axis drive motor 10231 of the pressing module 1023 drives the fourth support plate 10232 to move downward and drive the pressing structure 10234 to press the bottom cover, thereby pressing the buckle on the back of the bottom cover. After pressing, the receiving conveying mechanism 1025 drives the bottom cover to move onto the bottom cover detection module 1024, and the second 3D camera 10242 takes pictures to detect the pressing position.

[0106] After the bottom cover is assembled with the grounding plate and placed face down in the positioning slot of the product carrier, it is conveyed to the assembly fixture 20 via a conveyor line. The assembled PCBA board is pushed onto the assembly fixture 20 by an AVG trolley. The bottom cover is manually removed from the positioning slot of the product carrier and flipped over. The PCBA board is then assembled onto the front of the bottom cover in a vacuum environment. After assembly, it is placed into another positioning slot of the carrier. The assembly fixture 20 is equipped with a contoured upper cover 201 for positioning the PCBA board and a contoured lower cover 202 for positioning the bottom cover. A vacuum tube 203 is connected to the contoured upper cover 201. During assembly, the PCBA board is placed on the contoured upper cover 201, and the bottom cover is positioned on the contoured lower cover 202. The contoured upper cover 201 and the contoured lower cover 202 are interlocked. At this time, the structure of the PCBA board and the structure of the bottom cover are mutually contoured and positioned. At the same time, a vacuum is drawn inside, and the assembly of the PCBA board and the bottom cover is completed to obtain the TCU controller semi-finished product.

[0107] Since one of the cables on the PCBA board needs to be connected to the FPC board inside the PCBA board, a cable hot-melt assembly device 30 is provided to fix the cable to the FPC board after hot-melt assembly. The cable hot-melt assembly device 30 includes a first clamping component 301 that clamps the FPC board, a hot-melt assembly mechanism 302 that hot-melts the cable and connects it to the FPC board, and a second CCD camera 3023 that detects and positions the hot-melt connection. The first clamping component 301 includes a clamping member 3011 that clamps the side of the hot-melt position and an eighth cylinder 3012 that drives the clamping member 3011 to move up and down. Depending on the shape of the position to be hot-melted, the clamping member 3011 can be a clamping rod or a clamping plate, which is not limited here. The hot melt assembly mechanism 302 includes a first YZ axis drive module 3021 and a hot melt clamping head 3022 disposed at the movable end of the first YZ axis drive module 3021 for hot melting the cable. The hot melt clamping head 3022 heats the cable to melt it and presses it down to fix the cable on the FPC.

[0108] The fan screw-locking device 40 includes a first screw feeding mechanism 401 disposed on one side of the conveyor line and a screw-locking mechanism 402 disposed above the conveyor line. The screw-locking mechanism 402 includes a second YZ axis drive module 4021 and a second support plate 4022 driven by the second YZ axis drive module 4021 to move in the YZ direction. The second support plate 4022 is provided with a first screwdriver 4023 for tightening screws, a first screw suction nozzle 4024 sleeved on the lower end of the first screwdriver 4023 for picking up screws, a third cylinder 4025 for driving the first screw suction nozzle 4024 to move up and down, and a third CCD camera 4026 for detecting and positioning screw holes.

[0109] The bottom cover is equipped with multiple contoured posts. After the antenna is heat-fused, it is pressed down and positioned on the contoured posts, completing the fixed assembly of the antenna and the bottom cover. Since there are three pairs of antennas, a total of six, assembled on the PCBA board, there are many heat-fusion positions. Therefore, four antenna heat-fusion assembly devices 50 are set along the conveyor line direction to heat-fuse different positions of the antenna. The structure of the four antenna heat-fusion assembly devices 50 is the same as that of the cable heat-fusion assembly device 30, except that the heat-fusion positions are different. Therefore, the difference lies in the slightly different structure of the clamping component. The structure of the clamping component is designed to adapt to the different positions to be heat-fused, and is not limited here.

[0110] The radiator assembly device 60 includes a radiator feeding mechanism 601, a radiator dispensing mechanism 602 for dispensing adhesive onto the radiator, a second flipping and receiving mechanism 603 for flipping the TCU controller semi-finished product between its front and back sides, and a second conveying mechanism 604 for transporting the TCU controller semi-finished product and the radiator. Since the radiator fins are placed inside the housing during loading, the radiator dispensing mechanism 602 is provided to bond the fins to the housing. To improve dispensing efficiency, two radiator dispensing mechanisms 602 are provided. Each radiator dispensing mechanism 602 includes a positioning device for positioning the radiator, a transfer device for transferring the radiator to the positioning device, and a dispensing device. The second flipping and receiving mechanism 603 has the same structure as the first flipping and receiving mechanism 43, and will not be described further here. The second handling mechanism 604 includes a gripping module 6041 located at the end of the robotic arm for gripping a heat sink or a semi-finished TCU controller. The gripping module 6041 includes a ninth cylinder 6042, a ninth support plate 6043 driven by the ninth cylinder 6042 to move up and down, a tenth cylinder 6044 fixed on the ninth support plate 6043, and a third gripper 6045 driven by the tenth cylinder 6044 to open or clamp. The third gripper 6045 clamps the heat sink or TCU controller semi-finished product on both the front and rear sides.

[0111] The heat sink screw-locking device 70 has the same structure as the fan screw-locking device 40, and will not be described again here. The heat sink screw-locking device 70 tightens four screws according to the method described above. The spot soldering device 80 is equipped with a third YZ axis drive module 801, an L-shaped support plate 802 driven by the third YZ axis drive module 801 to move in the YZ direction, and several spot soldering heads 803 movably disposed on the horizontal end of the L-shaped support plate 802. The presence of multiple spot soldering heads 803 can improve production efficiency. Two ground planes are assembled on the bottom cover, with multiple pins that need to be soldered to the PCBA board. To improve soldering efficiency, four ground plane soldering devices 90 are provided along the conveyor line direction. The ground plane soldering device 90 is equipped with a fourth YZ axis drive module 901 and a soldering head 902 driven by the fourth YZ axis drive module 901 to move in the YZ direction and solder the pins of the ground plane to the PCBA board. The inspection device 110 includes a defective product conveyor line 1101, a good product conveyor line 1102, and a third transport mechanism 1103 for transporting products. The good product conveyor line 1102 is equipped with an X-ray inspection module 1104 for inspecting the welding, hot melting, and other processing conditions of the products. The clamping structure on the third transport mechanism 1103 is the same as that of the clamping module 6041, and will not be described in detail here.

[0112] The production process of the first assembly system 500 is as follows: The PCBA board is transported to the assembly fixture 20 by an AGV trolley. The PCBA board is placed on the contoured upper cover 201, and the bottom cover is positioned on the contoured lower cover 202. The contoured upper cover 201 and the contoured lower cover 202 are snapped together. At this time, the structure of the PCBA board and the structure of the bottom cover are mutually contoured and positioned. At the same time, a vacuum is drawn inside to complete the assembly of the PCBA board and the bottom cover, resulting in a TCU controller semi-finished product. The TCU controller semi-finished product is then transported to the cable hot melt assembly device 30. Above, the first clamping assembly 301 clamps against the side of the hot-melt position. The first YZ axis drive module 3021 drives the hot-melt clamping head 3022 to move and heat the cable to melt it, and then presses it down to fix the cable to the FPC. After the cable is melted, the TCU controller semi-finished product is conveyed to the fan screw-locking device 40. The second YZ axis drive module 4021 drives the second support plate 4022 to move the first screw suction nozzle 4024 to the screw-locking mechanism 402 to pick up the screw. The third CCD camera 4026... The screw hole position is detected. The second YZ axis drive module 4021 drives the second support plate 4022, which in turn moves the first screw suction nozzle 4024 and the first screwdriver 4023 to directly above the screw hole. The third cylinder 4025 drives the first screw suction nozzle 4024 to place the screw into the screw hole. At the same time, the first screwdriver 4023 tightens the screw in the screw hole. The fan needs to tighten three screws in total. Following the above steps, after the first screw suction nozzle 4024 picks up the screw, it moves to different screw holes to tighten them. Two screws are sufficient to lock the fan to the bottom cover. After the fan is screwed in, the TCU controller semi-finished product is transported to the first antenna hot-melt assembly device 50. The first clamping component 301 is pressed against the side of the hot-melt position. The first YZ axis drive module 3021 drives the hot-melt clamping head 3022 to move and heat the antenna to make the antenna hot-melt, and presses it down to fix the antenna to the bottom cover. It then enters the next three antenna hot-melt assembly devices 50 in sequence to complete the hot-melt of other positions of the antenna and fix the antenna to the bottom cover.The TCU controller semi-finished product is conveyed to the heat sink assembly device 60. The second conveying mechanism 604 clamps the TCU controller semi-finished product and positions it on the second flipping receiving mechanism 603. The TCU controller semi-finished product is positioned face up on the second flipping receiving mechanism 603. The second flipping receiving mechanism 603 flips the TCU controller semi-finished product, and the TCU controller semi-finished product is positioned face down on the first receiving plate 434 of the second flipping receiving mechanism 603. At the same time as the flipping action, the second conveying mechanism 604 clamps the heat sink and puts it into the heat sink dispensing mechanism 602 for dispensing. After the heat sink is dispensed, the second conveying mechanism 604 clamps the heat sink onto the product carrier. Then, the second conveying mechanism 604 places the TCU controller semi-finished product on the first receiving plate 434. The finished product is clamped onto the product carrier, assembling the heat sink and TCU controller semi-finished product. The lifting module lowers the product carrier, which then carries the TCU controller semi-finished product into the heat sink screw-locking device 70. The heat sink screw-locking device 70 tightens four screws using the same method as the fan screw-locking device, completing the locking of the heat sink and bottom cover. The TCU controller semi-finished product flows into the soldering device 80, where the soldering tip 803 applies solder paste to the areas to be soldered. After soldering, it enters the four ground plane soldering devices 90, where multiple pins of the ground plane are soldered to the PCBA board. The third conveying mechanism 1103 transports defective products to the defective product conveyor line 1101 and good products to the good product conveyor line 1102. The X-ray inspection module 1104 performs quality inspection on the good products.

[0113] The screw fastening assembly device 120 includes a turntable 1201, a positioning carrier 1202 mounted on the turntable 1201 and positioning the TCU controller, a clamping module 1205 pressing against the upper surface of the TCU controller, several screw fastening modules 1203 arranged around the outer periphery of the turntable 1201, and a second screw feeding mechanism 1204 arranged beside the screw fastening modules 1203. The second screw feeding mechanism 1204 uses a vibratory feeder feeding method, which is a conventional feeding method and will not be described in detail here. The screw-locking module 1203 includes an XYZ axis drive module 12031, a third support plate 12032 driven by the XYZ axis drive module 12031 to move in the XYZ direction, a second screwdriver 12033 fixed on the third support plate 12032, a second screw suction nozzle 12034 sleeved on the outer periphery of the lower end of the second screwdriver 12033, a fourth cylinder 12035 driving the second screw suction nozzle 12034 to move up and down, and a fourth CCD camera 12036 fixed on the second support plate 12033. A fourth CCD camera 12036 is also provided on the outer periphery of the turntable 1201. All of these are used to detect whether a screw is locked or whether the screw is locked properly.

[0114] The production process of the second assembly system 600 is as follows: the TCU controller semi-finished product and the top cover are transported to the screw fastening assembly device 120 by AGV trolley. The TCU controller semi-finished product and the top cover are positioned in the positioning carrier 1202. The clamping module 1205 is pressed on the top cover. Several screw fastening modules 1203 fasten screws to fix the TCU controller semi-finished product and the top cover at different positions. The TCU controller assembly is completed.

[0115] In this embodiment, based on the above-described assembly line for a TCU controller, a method for assembling a TCU controller is provided, which includes the following steps:

[0116] S1. Attaching labels and foam to the top cover: On the label attaching machine 1 and foam attaching machine 2, attach two labels and two foams to the top cover in sequence. The discharge machine transfers the well-attached top cover to the AGV trolley.

[0117] S2. Assemble components on the PCAB board:

[0118] S21. On the shielding cover assembly machine 4, assemble the two shielding covers onto the front and back sides of the PCBA board respectively;

[0119] S22. The cables are assembled onto the PCBA board on multiple cable assembly devices 51 respectively, the female ends of the cables are pressed onto the PCBA board on the cable pressing device 52, and the appearance and position of the cable pressing are inspected on the cable inspection device 53 to see if they are qualified.

[0120] S23. Position the antenna onto the product carrier on the antenna loading device 61, assemble the antenna onto the PCBA board on the antenna assembly device 62, solder different pins of the antenna onto the PCBA board on the multiple antenna soldering devices 63 respectively, and check whether the soldering position is qualified on the antenna detection device 64.

[0121] S24. Assemble the fan onto the PCBA board on the fan assembly machine 7, and transfer the assembled good product to the AGV trolley;

[0122] S3. Assemble the base plate and clips on the bottom cover:

[0123] S31. The mounting plate is assembled on the bottom surface of the bottom cover on the bottom cover assembly device 8, and the mounting plate is heat-fused and fixed on the bottom cover on multiple mounting plate heat-fusion assembly devices 9.

[0124] S32. Press the two clips onto the bottom surface of the cover using the clip pressing machine 10;

[0125] S4. Assemble the bottom cover and PCBA board to obtain the TCU controller semi-finished product:

[0126] S41, the AGV trolley transports the assembled PCBA board to the assembly tooling, and the PCBA board is fastened to the bottom cover on the assembly tooling 20;

[0127] S42. On the cable hot-melt assembly device 30, one of the cables on the PCBA board is hot-melted and connected to the FPC board;

[0128] S43. Secure the fan and the bottom cover together with multiple screws on the fan locking screw device 40;

[0129] S44. The antennas are heat-fused and fixedly assembled with the bottom cover on the multiple antenna heat-fusion assembly devices 50 respectively.

[0130] S45. The heat sink is assembled onto the PCBA board on the heat sink assembly device 60, and the heat sink and the bottom cover are locked together by multiple screws on the heat sink screw locking device 70.

[0131] S46. Apply solder paste to the position of the ground plane to be soldered on the PCBA board on the soldering device 80, and complete the soldering of the ground plane to the PCBA board on the ground plane soldering device 90. The detection device 110 detects the obtained TCU controller semi-finished product and transfers the good product after detection to the AGV trolley.

[0132] S5. Assemble the TCU controller semi-finished product and the top cover to obtain the TCU controller:

[0133] S51, the AGV trolley transports the pasted top cover and the inspected TCU controller semi-finished product to the screw fastening assembly device 120. The TCU controller semi-finished product and the top cover are fastened together with multiple screws to obtain the TCU controller, thus completing the assembly of the TCU controller.

[0134] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. An assembly line for a TCU controller, characterized in that: It includes a top cover production system for adding parts to the top cover, a PCBA board production system for adding components to the PCBA board, a bottom cover production system for adding parts to the bottom cover, a first assembly system for assembling the PCBA board and the bottom cover, and a second assembly system for assembling the bottom cover and the top cover. Each of the production systems and assembly systems is equipped with upper and lower conveyor lines to enable the turnover of product carriers. The two conveyor lines are connected end to end with lifting modules. Each workstation is equipped with a lifting module to lift the product carrier. The top cover production system includes a labeling machine, a foam applicator, and a discharge machine arranged sequentially along the conveying direction of the conveyor line; The PCBA board production system includes a shield assembly machine, a cable assembly machine, an antenna assembly machine, and a fan assembly machine arranged sequentially along the conveyor line direction; the cable assembly machine includes a cable assembly device for assembling cables onto the PCBA board, a cable pressing device for pressing the female ends of cables onto the PCBA board, and a cable inspection device for inspecting the assembled cables; the antenna assembly machine includes an antenna feeding device, an antenna assembly device for assembling antennas onto the PCBA board, an antenna soldering device for soldering antenna pins onto the PCBA board, and an antenna inspection device for inspecting the soldered antennas. The bottom cover production system includes a bottom cover assembly device that assembles the base plate onto the bottom cover, a base plate hot-melt assembly device that heat-melts and fixes the base plate onto the bottom cover, and a snap fastener pressing machine that presses the snap fasteners onto the bottom cover, arranged sequentially along the conveying direction of the conveyor line. The first assembly system includes a combination fixture for assembling PCBA boards and bottom covers sequentially along the conveying direction of the conveyor line to obtain a TCU controller semi-finished product; a cable hot-melt assembly device for hot-melting cables on the PCBA board and connecting them to the FPC board to achieve electrical connection; a fan locking screw device for locking the fan assembled on the PCBA board to the bottom cover; an antenna hot-melt assembly device for hot-melting and fixing the antenna assembled on the PCBA board to the bottom cover; a heat sink assembly device for assembling a heat sink onto the PCBA board; a heat sink locking screw device for locking the heat sink on the PCBA board to the bottom cover; a spot soldering device for spot soldering the ground plane on the PCBA board; a ground plane soldering device for soldering the ground plane to the PCBA board; and a detection device for detecting the assembled finished product. The second assembly system includes a screw-locking assembly device for assembling the bottom cover and the top cover.

2. The assembly line for a TCU controller as described in claim 1, characterized in that: The labeling machine includes a top cover feeding module on one side of the conveyor line, a top cover feeding module on the other side of the conveyor line, and a first conveying and pasting device for transporting the top cover and the label and pasting the label on the top cover; the foam applicator includes a foam feeding module on one side of the conveyor line, a top cover flipping module on the other side of the conveyor line, and a second conveying and pasting device for transporting the foam and the top cover and pasting the foam on the top cover.

3. The assembly line for a TCU controller as described in claim 1, characterized in that: The shielding cover assembly machine includes a shielding cover feeding device on one side of the conveyor line, a PCBA board feeding device on the other side of the conveyor line, a first flipping receiving mechanism on the side of the PCBA board feeding device, and a conveying and assembly device for transporting the shielding cover and the PCBA board. The first flipping and receiving mechanism includes a flipping positioning plate for positioning PCBA boards, a first rotating shaft fixed to the back of the flipping positioning plate, a first motor for driving the first rotating shaft to rotate, a first receiving plate for receiving the PCBA boards after the flipping positioning plate has been flipped, a first driving component for driving the first receiving plate to move up and down and horizontally, and a first pressure sensor disposed on the first receiving plate.

4. The assembly line for a TCU controller as described in claim 1, characterized in that: The cable assembly device includes a cable mounting frame disposed above the conveyor line, a cable positioning plate that is three-dimensionally floating on the cable mounting frame and positions the cable, and a pressure bar that presses the cable onto the PCBA board via the cable positioning plate. The cable positioning plate is provided with cable conforming holes that conform to the cable routing. The cable pressing device includes a first XY axis drive module, a first support plate that moves in the XY direction driven by the first XY axis drive module, a first cylinder fixed on the first support plate, a torque sensor that moves up and down driven by the first cylinder, and a pressing pin fixed at the lower end of the torque sensor.

5. The assembly line for a TCU controller as described in claim 1, characterized in that: The antenna assembly device includes an antenna positioning mechanism for positioning the antenna, an antenna relay platform for temporarily placing PCBA boards, a first transport mechanism for transporting PCBA boards, and a first CCD camera; the antenna positioning mechanism includes two movable mounting plates movably disposed above the product carrier and located on the front and rear sides of the product carrier, two second motors that drive the two movable mounting plates to move closer or further apart from each other, a plurality of second cylinders disposed on the movable mounting plates, and a first gripper driven by the second cylinders to clamp the antenna end and correct the antenna.

6. The assembly line for a TCU controller as described in claim 1, characterized in that: The snap-fitting machine includes a snap-fitting feeding device, a snap-fitting device for pressing snaps onto the back of the bottom cover, and a first conveying device for conveying snaps and the bottom cover. The snap-fit ​​device includes a bottom cover positioning plate for positioning the bottom cover, a flipping drive assembly for driving the bottom cover positioning plate to flip so as to realize the flipping of the front and back of the bottom cover, a pressing module disposed on one side of the bottom cover positioning plate, a bottom cover detection module disposed on the other side of the bottom cover positioning plate, and a receiving and conveying mechanism for receiving the bottom cover after the bottom cover positioning plate has been flipped and for conveying the bottom cover between the pressing module, the bottom cover positioning plate, and the bottom cover detection module.

7. The assembly line for a TCU controller as described in claim 1, characterized in that: The structure of the grounding plate hot-melt assembly device, the cable hot-melt assembly device, and the antenna hot-melt assembly device all include a first pressing component for pressing the product, a hot-melt assembly mechanism for hot-melt cable, grounding plate, or antenna assembled with the product, and a second CCD camera for detecting and locating the hot-melt connection position. The hot melt assembly mechanism includes a first YZ axis drive module and a hot melt clamping head disposed at the movable end of the first YZ axis drive module for hot melting the cable.

8. The assembly line for a TCU controller as described in claim 1, characterized in that: Both the radiator screw-locking device and the fan screw-locking device include a first screw feeding mechanism on one side of the conveyor line and a screw-locking mechanism disposed above the conveyor line; the spot soldering device is provided with a third YZ axis drive module, an L-shaped support plate driven by the third YZ axis drive module to move in the YZ direction, and several spot soldering heads movably disposed on the horizontal end of the L-shaped support plate; the ground plane soldering device is provided with a fourth YZ axis drive module and a soldering head driven by the fourth YZ axis drive module to move along the YZ direction and solder the pins of the ground plane to the PCBA board.

9. The assembly line for a TCU controller as described in claim 3, characterized in that: The radiator assembly device includes a radiator feeding mechanism, a radiator dispensing mechanism for dispensing adhesive onto the radiator, a second flipping and receiving mechanism for flipping the TCU controller semi-finished product from both sides, and a second conveying mechanism for the TCU controller semi-finished product and the radiator; the structure of the second flipping and receiving mechanism is the same as that of the first flipping and receiving mechanism.

10. The assembly line for a TCU controller as described in claim 1, characterized in that: The screw fastening assembly device includes a turntable, a clamping module pressed against the upper surface of the TCU controller, a positioning carrier set on the turntable and positioning the TCU controller, a plurality of screw fastening modules arranged around the outer periphery of the turntable, and a second screw feeding mechanism set next to the screw fastening modules. The screw-locking module includes an XYZ axis drive module, a third support plate that moves in the XYZ direction driven by the XYZ axis drive module, a second screwdriver fixed on the third support plate, a second screw suction nozzle sleeved on the outer periphery of the lower end of the second screwdriver, a fourth cylinder that drives the second screw suction nozzle to move up and down, and a fourth CCD camera fixed on the second support plate.

11. A method for assembling a TCU controller, based on an assembly line for a TCU controller as described in any one of claims 1 to 10, characterized in that: It includes the following steps: S1. Attaching labels and foam to the top cover: Two labels and two foams are attached to the top cover in sequence on the label attaching machine and the foam attaching machine, and the discharge machine transfers the well-attached top cover to the AGV trolley. S2. Assemble components on the PCAB board: S21. On the shielding cover assembly machine, the two shielding covers are respectively assembled onto the front and back sides of the PCBA board; S22. The cables are assembled onto the PCBA board on the multiple cable assembly devices, the female ends of the cables are pressed onto the PCBA board on the cable pressing device, and the appearance and position of the cable pressing are inspected on the cable inspection device to see if they are qualified. S23. Position the antenna onto the product carrier on the antenna loading device, assemble the antenna onto the PCBA board on the antenna assembly device, solder different pins of the antenna onto the PCBA board on the multiple antenna welding devices, and detect whether the welding position is qualified on the antenna detection device. S24. Assemble the fan onto the PCBA board on the fan assembly machine, and transfer the assembled product to the AGV trolley. S3. Assemble the base plate and clips on the bottom cover: S31. The mounting plate is assembled on the bottom surface of the bottom cover on the bottom cover assembly device, and the mounting plate is heat-fused and fixed on the bottom cover on multiple mounting plate heat-fusion assembly devices. S32. Press the two clips onto the bottom surface of the cover using the clip pressing machine; S4. Assemble the bottom cover and PCBA board to obtain the TCU controller semi-finished product: S41. The assembled PCBA board is transported from the AGV to the assembly fixture, and the PCBA board is fastened to the bottom cover on the assembly fixture. S42. On the cable hot-melt assembly device, one of the cables on the PCBA board is hot-melted and connected to the FPC board; S43. Secure the fan and the bottom cover to the fan locking screw device using multiple screws; S44. The antennas are heat-fused and fixedly assembled with the bottom cover on the plurality of antenna heat-fusion assembly devices respectively; S45. Assemble the heat sink onto the PCBA board on the heat sink assembly device, and tighten the heat sink and the bottom cover with multiple screws on the heat sink screw locking device. S46. Apply solder paste to the position of the ground plane to be soldered on the PCBA board on the soldering device, and complete the soldering of the ground plane to the PCBA board on the ground plane soldering device. The detection device detects the obtained TCU controller semi-finished product, and the good product after detection is transferred to the AGV trolley. S5. Assemble the TCU controller semi-finished product and the top cover to obtain the TCU controller: S51. The AGV trolley transports the pasted top cover and the inspected TCU controller semi-finished product to the screw-locking assembly device. The TCU controller semi-finished product and the top cover are locked together with multiple screws to obtain the TCU controller, thus completing the assembly of the TCU controller.

Images