Imprint apparatus and method of use thereof

Abstract

The invention provides an impressing device. The impressing device comprises a first impressing assembly, a second impressing assembly, a first clamping piece and a pressing roller. The first impressing assembly and the second impressing assembly are oppositely arranged, and an accommodating space for accommodating a wafer is formed between the first impressing assembly and the second impressing assembly; the first imprinting assembly and the second imprinting assembly are configured to be capable of rotating relative to the wafer, are used for approaching the wafer, and are respectively provided with imprinting areas matched with the wafer; the first clamping assembly is used for clamping and fixing a wafer; the pressing roller is in abutting contact with the side, away from the second imprinting assembly, of the first imprinting assembly and can roll on the first imprinting assembly. When the pressing roller rolls to a first set position, the two impressing areas are obliquely arranged relative to the wafer, and the ends, close to each other, of the two impressing areas abut against the wafer; and when the compression roller rolls to a second set position, the two impressing areas are parallel relative to the wafer, and the impressing areas are impressed on the wafer. According to the technical scheme, the impressing efficiency of wafer impressing is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer imprinting technology, and in particular to an imprinting device and a method of using the same. Background Art

[0002] Nanoimprint wafer is a nano-processing technology, also known as nanoimprint technology, which is used to prepare wafers with micro-nanoscale pattern structures. This technology forms nanoscale or micron-scale patterns on the wafer surface by imprinting the nanoscale structure on the mold or template onto the wafer surface. Generally speaking, the pattern structure needs to be imprinted on both surfaces of the wafer. In the existing nanoimprint technology, it is usually necessary to first imprint one surface of the wafer and then imprint the second surface of the wafer. This has a low efficiency of imprinting. At the same time, in the process of imprinting the second surface of the wafer, it is also necessary to avoid damaging the already imprinted pattern, which makes the operation difficult when imprinting the wafer. Summary of the invention

[0003] The purpose of the present invention is to provide an imprinting device and a method for using the same, so as to solve the problems of high imprinting efficiency and high operating difficulty of nanoimprint technology in the related art.

[0004] According to a first aspect of an embodiment of the present application, there is provided an imprinting device for imprinting a surface of a wafer, the imprinting device comprising:

[0005] A first stamping assembly and a second stamping assembly are arranged opposite to each other, wherein a receiving space for receiving the wafer is formed between the first stamping assembly and the second stamping assembly; the first stamping assembly and the second stamping assembly are respectively provided with stamping areas cooperating with the wafer; the first stamping assembly and the second stamping assembly are configured to be rotatable relative to the wafer so as to approach the wafer;

[0006] A first clamping assembly, used for clamping and fixing the wafer; and

[0007] a pressing roller, the pressing roller being in pressing contact with a side of the first stamping assembly facing away from the second stamping assembly and being capable of rolling on the first stamping assembly;

[0008] Among them, when the pressure roller rolls to the first set position, the two imprinting areas are inclined relative to the wafer, and the ends of the two imprinting areas close to each other are respectively pressed against the wafer; when the pressure roller rolls to the second set position, the two imprinting areas are parallel to the wafer, and the imprinting areas are imprinted on the wafer.

[0009] Through the above technical solution, through the first imprinting component and the second imprinting component, the imprinting equipment can imprint the two surfaces of the wafer with only one imprint, thereby improving the efficiency of the imprinting equipment in imprinting the wafer. And during the imprinting process, there is no need to consider how to avoid damaging the already imprinted pattern, which reduces the difficulty of operation during wafer imprinting. In addition, the first imprinting component and the second imprinting component can rotate relative to the wafer and approach the wafer, so that during the process of the first imprinting component and the second imprinting component imprinting the wafer, the two imprinting areas will gradually contact the surface of the wafer until they are completely fitted with the surface of the wafer, and the air between the two imprinting areas and the surface of the wafer can be effectively discharged, so that the pattern imprinted on the wafer surface has higher precision, and the poor imprinting caused by bubbles left between the imprinting area and the surface of the wafer is reduced.

[0010] In a specific possible implementation scheme, the stamping device also includes a detection component, which includes a detection piece, a plurality of first detection marks arranged on the first stamping component, and a plurality of second detection marks arranged on the second stamping component, the plurality of second detection marks respectively corresponding one-to-one to the plurality of first detection marks, and the detection piece is used to detect whether the second detection mark is aligned with the first detection mark.

[0011] In a specific embodiment, the first clamping assembly includes a first abutment member and a second abutment member; the first abutment member includes a first manipulator and a first contact piece connected to the first manipulator, and the second abutment member includes a second manipulator and a second contact piece connected to the second manipulator;

[0012] The first contact piece and the second contact piece are arranged opposite to each other, and the first contact piece and the second contact piece respectively have an arc structure for abutting against the wafer.

[0013] In a specific possible implementation manner, the first abutment member is close to the first set position, and the second abutment member is close to the second set position;

[0014] The imprinting device also includes a control unit, which is electrically connected to the first robot and the second robot respectively; the control unit is configured to control the first abutment member to be away from the wafer when the pressure roller rolls to the first set position, and control the second abutment member to be away from the wafer when the pressure roller rolls to a third set position; wherein the third set position is between the first set position and the second set position.

[0015] In a specific implementation scheme, the first stamping assembly includes a frame and a first stamping plate fixed in the frame, the second stamping assembly includes a supporting platform and a second stamping plate arranged on the supporting platform, and the two stamping areas are respectively arranged on the first stamping plate and the second stamping plate.

[0016] In a specific embodiment, the stamping device further includes a first drive motor and a second drive motor.

[0017] The output shaft of the first driving motor is connected to the frame to drive the frame to rotate;

[0018] The output shaft of the second driving motor is connected to the supporting platform to drive the supporting platform to rotate.

[0019] In a specific possible implementation manner, the embossing device further comprises a plurality of ultraviolet lamps for curing the embossed adhesive layer, and a portion of the support platform corresponding to the embossing area on the second embossing component is a transparent structure.

[0020] In a specific possible implementation manner, the wafer includes a wafer body and embossed adhesive layers respectively disposed on two surfaces of the wafer body;

[0021] The embossing device also includes:

[0022] Plasma equipment, used for performing surface treatment on the wafer body;

[0023] A glue barrel, wherein the glue barrel contains embossing glue;

[0024] A second clamping assembly is used to clamp the wafer body and immerse the wafer body in the embossing glue; and

[0025] The vibration component is used to drive the rubber barrel to vibrate.

[0026] According to a second aspect of an embodiment of the present application, a method for using an imprinting device is provided, wherein the imprinting device is the imprinting device described in any one of the above;

[0027] The method comprises:

[0028] Fixing the wafer in the accommodation space between the first imprinting assembly and the second imprinting assembly by the first clamping assembly;

[0029] The pressing roller is driven to roll on the first pressing assembly, and the first pressing assembly and the second pressing assembly are controlled to rotate relative to each other and approach the wafer; wherein,

[0030] When the pressure roller rolls to the first set position, the two imprinting areas are tilted relative to the wafer, and the ends of the two imprinting areas close to each other are respectively pressed against the wafer; when the pressure roller rolls to the second set position, the two imprinting areas are parallel to the wafer, and the imprinting areas are imprinted on the wafer.

[0031] Through the above technical solution, through the first imprinting component and the second imprinting component, the imprinting equipment can imprint the two surfaces of the wafer with only one imprint, thereby improving the efficiency of the imprinting equipment in imprinting the wafer. And during the imprinting process, there is no need to consider how to avoid damaging the already imprinted pattern, which reduces the difficulty of operation during wafer imprinting. In addition, the first imprinting component and the second imprinting component can rotate relative to the wafer and approach the wafer, so that during the process of the first imprinting component and the second imprinting component imprinting the wafer, the two imprinting areas will gradually contact the surface of the wafer until they are completely fitted with the surface of the wafer, and the air between the two imprinting areas and the surface of the wafer can be effectively discharged, so that the pattern imprinted on the wafer surface has higher precision, and the poor imprinting caused by bubbles left between the imprinting area and the surface of the wafer is reduced.

[0032] In a specific embodiment, the first clamping assembly includes a first abutment member and a second abutment member respectively abutting against the wafer to clamp the wafer, the first abutment member is close to the first set position, and the second abutment member is close to the second set position;

[0033] The method further comprises:

[0034] When the pressure roller rolls to the first set position, the first abutment member is controlled to release the clamping of the wafer; when the pressure roller rolls to the third set position, the second abutment member is controlled to release the clamping of the wafer, wherein the third set position is between the first set position and the second set position.

[0035] In a specific implementation scheme, the distance between the third setting position and the first setting position in the horizontal direction satisfies: L=1 / 3D, where D is the diameter of the wafer, and L is the distance between the third setting position and the first setting position in the horizontal direction.

[0036] In a specific implementation scheme, the wafer includes a wafer body; the imprinting device also includes a plasma device, a glue barrel containing imprinting glue, a vibration component for driving the glue barrel to vibrate, and a second clamping component for clamping and moving the wafer body, and the method also includes:

[0037] Spraying plasma onto two surfaces of the wafer by the plasma equipment;

[0038] Clamp the wafer body by the second clamping assembly and immerse the wafer body in the embossing glue in the glue barrel;

[0039] The rubber barrel is driven to vibrate by the vibration component;

[0040] The wafer body immersed in the embossing glue is taken out by the second clamping assembly.

[0041] In a specific implementation scheme, the imprinting device further includes a detection component, the detection component includes a detection member, a plurality of first detection marks arranged on the first imprinting component, and a plurality of second detection marks arranged on the second imprinting component, the plurality of second detection marks respectively corresponding to the plurality of first detection marks one by one,

[0042] The method further includes: controlling the stamping device to adjust the position of the first stamping component and / or the position of the second stamping component until the detection member detects that the second detection mark is aligned with the corresponding first detection mark.

[0043] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings are part of the present invention and are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an improper limitation of the present invention. Obviously, the drawings described below are only some embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the accompanying drawings:

[0045] Figure 1 is a schematic structural diagram of an imprinting device provided in an exemplary embodiment of the present disclosure;

[0046] Figure 2 is a schematic diagram of the use of the imprinting device provided by the exemplary embodiment of the present disclosure, at this time, the pressing roller is about to reach the first set position;

[0047] Figure 3 is a schematic diagram of the use of the imprinting device provided by the exemplary embodiment of the present disclosure, at this time, the pressing roller is in a first set position;

[0048] Figure 4 is a schematic diagram of the use of the imprinting device provided by the exemplary embodiment of the present disclosure, at this time, the pressing roller is between the second set position and the third set position;

[0049] Figure 5is a schematic diagram of the use of the imprinting device provided by the exemplary embodiment of the present disclosure, at this time, the pressing roller is in the second setting position;

[0050] Figure 6 is a flowchart of a method for using an imprint device provided by an exemplary embodiment of the present disclosure;

[0051] Figure 7 is a flowchart of another method for using the imprint device provided by an exemplary embodiment of the present disclosure.

[0052] In the figure: 100-wafer, 101-wafer body, 102-embossing glue layer, 200-first imprinting component, 201-frame, 202-first imprinting plate, 300-second imprinting component, 301-supporting platform, 302-second imprinting plate, 400-accommodating space, 500-embossing area, 600-first contact sheet, 601-second contact sheet, 700-detection piece, 701-first detection mark, 702-second detection mark, 800-ultraviolet lamp, 900-pressure roller.

[0053] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but are intended to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0054] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0055] It should be understood that the "multiple" mentioned herein refers to two or more. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, and A and B exist, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not limit them to be necessarily different. In addition, when the following description involves the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0056] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "inside" and "outside" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "contacted", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Nanoimprint wafer is a nano-processing technology, also known as nanoimprint technology, which is used to prepare wafers with micro-nanoscale pattern structures. The wafer is usually constructed in the shape of a disc, and imprint glue is provided on both surfaces of the wafer. This technology forms a nanoscale or micron-scale pattern on the surface of the wafer by imprinting the nanoscale structure on the mold or template onto the surface of the wafer. Generally speaking, the mold or template is usually an elastic soft film made of a specific material, on which a nanoscale imprint pattern is formed. The imprint pattern contacts and imprints the surface of the wafer, so that a pattern structure is formed on the surface of the wafer. Generally speaking, the pattern structure needs to be imprinted on both surfaces of the wafer. In the existing nanoimprint technology, it is usually necessary to first imprint one surface of the wafer, and then imprint the second surface of the wafer. In this way, the efficiency of imprinting is low. At the same time, in the process of imprinting the second surface of the wafer, it is also necessary to avoid damaging the imprinted pattern, resulting in a high difficulty in operation when the wafer is imprinted.

[0059] like Figures 1 to 5 As shown, an embodiment of the present application provides an imprinting device for imprinting the surface of a wafer 100 , and the imprinting device includes a first imprinting assembly 200 , a second imprinting assembly 300 , a first clamping member and a pressing roller 900 .

[0060] The first imprinting assembly 200 and the second imprinting assembly 300 are arranged opposite to each other, and a receiving space 400 for receiving the wafer 100 is formed between the first imprinting assembly 200 and the second imprinting assembly 300, and the first imprinting assembly 200 and the second imprinting assembly 300 are respectively provided with an imprinting area 500 that cooperates with the wafer 100. Here, the first imprinting assembly 200 and the second imprinting assembly 300 have a mold or a template, and an imprinting area 500 with an imprinting pattern is formed on the mold or the template. In this way, when the wafer 100 needs to be imprinted, the wafer 100 is arranged in the receiving space 400. At this time, the two surfaces of the wafer 100 can face the two imprinting areas 500 (the imprinting area 500 on the first imprinting assembly 200 and the imprinting area 500 on the second imprinting assembly 300) respectively.

[0061] The first imprinting assembly 200 and the second imprinting assembly 300 are configured to be rotatable relative to the wafer 100, so as to be close to the wafer 100. The first imprinting assembly 200 can rotate relative to the wafer 100 with its edge as the axis, so that the first imprinting assembly 200 can be close to the wafer 100, and the second imprinting assembly 300 can rotate relative to the wafer 100 with its edge as the axis, so that the second imprinting assembly 300 can be close to the wafer 100. Figure 2 and Figure 3 And Figure 2 and Figure 3 The drawing direction is referenced. Figure 2 and Figure 3 In the embodiment, the first imprinting assembly 200 can rotate clockwise relative to the wafer 100 with its left edge as the axis to approach the wafer 100, and the second imprinting assembly 300 can rotate counterclockwise relative to the wafer 100 with its left edge as the axis to approach the wafer 100. Figure 4 and Figure 5 And Figure 4 and Figure 5 The drawing direction is referenced. Figure 4 and Figure 5 In the embodiment, the first imprinting assembly 200 can rotate counterclockwise relative to the wafer 100 with its right edge as the axis to approach the wafer 100, and the second imprinting assembly 300 can rotate clockwise relative to the wafer 100 with its right edge as the axis to approach the wafer 100. When the first imprinting assembly 200 and the second imprinting assembly 300 can rotate relative to the wafer 100 and can approach the wafer 100 by rotating, it can ensure that the two imprinting areas 500 are in contact with the two surfaces of the wafer 100 at the same time, and the first imprinting assembly 200 and the second imprinting assembly 300 can realize imprinting on the two surfaces of the wafer 100 at the same time, thereby improving the imprinting efficiency of the wafer 100.

[0062] The first clamping assembly is used to clamp and fix the wafer 100. The first clamping assembly can ensure the stability of the wafer 100 during the process of imprinting the wafer 100. The pressure roller 900 is pressed and contacted with the side of the first imprinting assembly 200 away from the second imprinting assembly 300 and can roll on the first imprinting assembly 200. The pressure roller 900 can roll on the mold or template of the first imprinting assembly 200. The mold and the template are usually made of a soft film with elasticity. During the process of imprinting the wafer 100, when the pressure roller 900 rolls on the mold or the template, the pressure of the pressure roller 900 will drive the mold and the template to deform, and drive the imprinting area 500 on the first imprinting assembly 200 to fit the surface of the wafer 100, so that the two imprinting areas 500 are in closer contact with the two surfaces of the wafer 100, and the gap between the imprinting area 500 and the surface of the wafer 100 is reduced.

[0063] When the pressure roller 900 rolls to the first set position, by rotating the first pressure assembly 200 and the second pressure assembly 300 relative to the wafer 100, the two pressure areas 500 can be tilted relative to the wafer 100 and gradually approach the wafer 100. When the ends of the two pressure areas 500 that are close to each other can be pressed against the wafer 100 respectively, it means that the pressure areas 500 can be in contact with the edge of the surface of the wafer 100. When the pressing roller 900 rolls from the first set position to the second set position, the first imprinting assembly 200 and the second imprinting assembly 300 continue to rotate relative to the wafer 100 and continue to approach the wafer 100, and the two imprinting areas 500 change from being inclined relative to the wafer 100 to being parallel to the wafer 100. At this time, in the process of the first imprinting assembly 200 and the second imprinting assembly 300 rotating relative to the wafer 100 and approaching the wafer 100, the two imprinting areas 500 will gradually contact the surface of the wafer 100 until they are completely adhered to the surface of the wafer 100, thereby achieving imprinting on the surface of the wafer 100. Compared with the two imprinting areas 500 directly contacting and imprinting with the surface of the wafer 100, the two imprinting areas 500 gradually contact the surface of the wafer 100 until they are completely fitted with the surface of the wafer 100. This allows the air between the two imprinting areas 500 and the surface of the wafer 100 to be effectively discharged, and the pattern imprinted on the surface of the wafer 100 is more accurate, reducing poor imprinting caused by bubbles left between the imprinting area 500 and the surface of the wafer 100.

[0064] Reference Figure 2 and Figure 5 ,exist Figure 3 In the embodiment, the pressing roller 900 is in a first setting position, indicated by point A. Figure 5 In the figure, the pressing roller 900 is in the second setting position, which is indicated by point B. The first setting position mentioned above and below may be the position where the pressing roller 900 has just rolled to the edge of the wafer 100. At this time, the edges of the two imprinting areas 500 have just abutted against the wafer 100. When the pressing roller 900 continues to roll, the two imprinting areas 500 will gradually contact the surface of the wafer 100. When the two imprinting areas 500 gradually contact the surface of the wafer 100, the pressing roller 900 makes the two imprinting areas 500 contact the two surfaces of the wafer 100 more closely, reducing the gap between the imprinting areas 500 and the surface of the wafer 100. The second setting position mentioned above and below may be the position where the pressing roller 900 rolls to the edge of the wafer 100 and is about to leave. At this time, the two imprinting areas 500 have already abutted against the surface of the wafer 100 to achieve imprinting on the surface of the wafer 100. At this time, the pressing roller 900 can roll in a direction away from the wafer 100.

[0065] Through the above technical solution, through the first imprinting assembly 200 and the second imprinting assembly 300, the imprinting equipment can imprint the two surfaces of the wafer 100 by only one imprinting, thereby improving the imprinting efficiency of the imprinting equipment on the wafer 100. In addition, during the imprinting process, it is no longer necessary to consider how to avoid damaging the already imprinted pattern, thereby reducing the difficulty of operation when imprinting the wafer 100. In addition, the first imprinting assembly 200 and the second imprinting assembly 300 can rotate relative to the wafer 100 and approach the wafer 100, so that during the process of the first imprinting assembly 200 and the second imprinting assembly 300 imprinting the wafer 100, the two imprinting areas 500 will gradually contact the surface of the wafer 100 until they are completely attached to the surface of the wafer 100, and the air between the two imprinting areas 500 and the surface of the wafer 100 can be effectively discharged, and the pattern imprinted on the surface of the wafer 100 has higher precision, thereby reducing the poor imprinting caused by bubbles left between the imprinting area 500 and the surface of the wafer 100.

[0066] In some embodiments, the stamping device may include a detection component, which includes a detection piece 700, a plurality of first detection marks 701 arranged on the first stamping component 200, and a plurality of second detection marks 702 arranged on the second stamping component 300, the plurality of second detection marks 702 respectively corresponding to the plurality of first detection marks 701, and the detection piece 700 is used to detect whether the second detection mark 702 is aligned with the first detection mark 701. By using the detection component, it can be ensured that the two imprinting areas 500 are aligned in a specific direction. Referring to the figure, when the imprinting device does not imprint the wafer 100, the first imprinting component 200 and the second imprinting component 300 are respectively arranged horizontally, and the wafer 100 needs to be arranged horizontally in the accommodating space 400. At this time, by using the detection component 700, it is detected whether the second detection mark 702 corresponds to the first detection mark 701 in the vertical direction, which can reflect whether the two imprinting areas 500 are aligned in the vertical direction, that is, when the second detection mark 702 is aligned with the first detection mark 701 in the vertical direction, it indicates that the two imprinting areas 500 are aligned in the vertical direction. When the wafer 100 is arranged in the accommodating space 400, the two surfaces of the wafer 100 can be aligned with the two imprinting areas 500 at the same time, ensuring that the two imprinting areas 500 will not have errors with the surface of the wafer 100 during imprinting.

[0067] The detection element 700 here can be an optical detection sensor or a camera, and the first detection mark 701 and the second detection mark 702 can be marks that can respond to light signals. In this way, the positions of the first detection mark 701 and the second detection mark 702 can be detected through the light signals emitted and received by the optical detection sensor, and it is possible to determine whether the second detection mark 702 is aligned with the first detection mark 701; through the camera, the marks can also be photographed, recorded and analyzed, and the positions of the first detection mark 701 and the second detection mark 702 can be detected, and it is possible to determine whether the second detection mark 702 is aligned with the first detection mark 701.

[0068] The first clamping assembly includes a first abutment member and a second abutment member; the first abutment member includes a first manipulator and a first contact piece 600 connected to the first manipulator, and the second abutment member includes a second manipulator and a second contact piece 601 connected to the second manipulator; the first contact piece 600 and the second contact piece 601 are arranged opposite to each other, and the first contact piece 600 and the second contact piece 601 respectively have an arc structure for abutting against the wafer 100. When the wafer 100 is arranged between the first abutment member and the second abutment member, and the first manipulator and the second manipulator respectively drive the first contact piece 600 and the second contact piece 601 to approach each other, the first contact piece 600 and the second contact piece 601 will respectively abut against the wafer 100 to achieve clamping of the wafer 100. For example, you can refer to Figure 1 And Figure 1 The drawing direction is referenced. Figure 1 4 is a schematic diagram of the structure of the imprinting device in the present application. At this time, the imprinting device has not started to imprint the wafer 100. The first abutment member and the second abutment member can clamp and move the wafer 100 to move the wafer 100 into the accommodation space 400. Figures 1 to 5 In the embodiment, the wafer 100 is horizontally arranged, and the first contact piece 600 and the second contact piece 601 abut against the wafer 100 in the left and right directions to clamp the horizontally arranged wafer 100. In addition, the first manipulator and the second manipulator move simultaneously to drive the wafer 100 to move. When the wafer 100 needs to be stamped, the first abutment member and the second abutment member can move the wafer 100 into the accommodation space 400. When the wafer 100 is stamped, the first abutment member and the second abutment member can transfer the wafer 100 from the accommodation space 400.

[0069] In an optional embodiment, the first abutment may be close to the first set position, and the second abutment may be close to the second set position; the imprinting device further comprises a control unit, which is electrically connected to the first manipulator and the second manipulator, respectively. When the pressure roller 900 rolls to the first set position, the ends of the two imprinting areas 500 that are close to each other are respectively pressed against the wafer 100. At this time, the two imprinting areas 500 can play a role in fixing the wafer 100. In order to avoid the first abutment from interfering with the first imprinting assembly 200 and the second imprinting assembly 300, when the pressure roller 900 rolls to the first set position, the first abutment may be controlled to be away from the wafer 100. When the pressure roller 900 continues to roll, for example, when the pressure roller 900 rolls to the third set position between the first set position and the second set position, the details can be referred to. Figure 4 At this time, the pressing roller 900 is in the third set position, represented by point C. At this time, the two imprinting areas 500 have partially adhered to the surface of the wafer 100, and the wafer 100 has been fixed by the imprinting areas 500. At this time, the second abutment member can be controlled to stay away from the wafer 100 to avoid interference between the second abutment member and the first imprinting assembly 200 and the second imprinting assembly 300.

[0070] In some embodiments, the first imprinting assembly 200 may include a frame 201 and a first imprinting plate 202 fixed in the frame 201, the second imprinting assembly 300 includes a supporting platform 301 and a second imprinting plate 302 disposed on the supporting platform 301, and two imprinting areas 500 are disposed on the first imprinting plate 202 and the second imprinting plate 302, respectively. The first imprinting plate 202 and the second imprinting plate 302 here may be molds or templates, and the frame 201 can fix the edge of the first imprinting plate 202, and while ensuring the fixing effect of the first imprinting plate 202, it can also provide a space for the pressure roller 900 to roll on the first imprinting plate 202, and the frame 201 can also limit the pressure roller 900. When the wafer 100 is horizontally arranged and the second imprinting assembly 300 is arranged below the first imprinting assembly 200, at this time, the second imprinting assembly 300 can support and fix the second imprinting plate 302 through the supporting platform 301. Figure 1For reference, at this time, the wafer 100 is set horizontally, and the first imprinting plate 202 can be suspended above the wafer 100 by the frame 201, and the second imprinting plate 302 can be fixed below the wafer 100 through the support platform 301. The imprinting device also includes a first drive motor and a second drive motor, the output shaft of the first drive motor is connected to the frame 201, and is used to drive the frame 201 to rotate; the output shaft of the second drive motor is connected to the support platform 301, and is used to drive the support platform 301 to rotate. Through the rotation of the two drive motors (the first drive motor and the second drive motor), the first imprinting assembly 200 and the second imprinting assembly 300 can rotate relative to the wafer 100, so as to approach the wafer 100. In the present application, the structure that can drive the first imprinting assembly 200 and the second imprinting assembly 300 to rotate relative to the wafer 100 is called a driving structure. In the present application, the driving structure is not specifically limited. The driving structure can be set up with a driving motor as described above, or other structures or elements can be used. In this regard, the present application does not make specific limitations. In the present application, as long as the driving structure can meet the following requirements: it can drive the first imprinting assembly 200 and the second imprinting assembly 300 to rotate relative to the wafer 100, so that the first imprinting assembly 200 and the second imprinting assembly 300 can be close to the wafer 100.

[0071] Below Figures 1 to 5 Take this as an example and refer to Figures 1 to 5 Drawing direction, detailed instructions for use of the imprinting equipment:

[0072] Figure 1 In the embodiment, the imprinting device has not started to imprint the wafer 100. The first clamping assembly clamps and moves the wafer 100 through the first abutment member and the second abutment member to move the wafer 100 into the accommodation space 400. After the imprinting device starts to imprint the wafer 100, the first imprinting assembly 200 can rotate clockwise relative to the wafer 100 with its left edge as the axis, and the second imprinting assembly 300 can rotate counterclockwise relative to the wafer 100 with its left edge as the axis, until the two imprinting areas 500 respectively abut against the wafer 100. At this time, the imprinting device will be Figure 1 The status becomes Figure 2 In the state, then from Figure 2 The status becomes Figure 3 The state in Figure 3 In the process, the pressing roller 900 just rolls to the first set position. Figure 3 When the operation continues in the state of , the first clamping member in the first clamping assembly can contact the wafer 100,

[0073] The first imprinting assembly 200 can rotate counterclockwise with its right edge as the axis relative to the wafer 100 until the imprinting area 500 on the first imprinting assembly 200 is parallel to the wafer 100; the second imprinting assembly 300 can rotate clockwise with its right edge as the axis relative to the wafer 100 until the imprinting area 500 on the first imprinting assembly 200 is parallel to the wafer 100. During the above process, the rotation direction of the first imprinting assembly 200 and the second imprinting assembly 300 changes. During the rotation of the first imprinting assembly 200 and the second imprinting assembly 300, the imprinting areas 500 on the first imprinting assembly 200 and the second imprinting assembly 300 will gradually contact the surface of the wafer 100 from right to left until they are completely in contact with the surface of the wafer 100. During this process, the imprinting equipment will be Figure 3 The status becomes Figure 4 In the state, then from Figure 4 The status becomes Figure 5 The state in Figure 4 In the embodiment, the pressing roller 900 just rolls to the third setting position, at which time the second clamping member in the first clamping assembly can contact the wafer 100. Figure 5 In the process, the pressing roller 900 just rolls to the second set position. Figure 5 , it indicates that an embossed pattern is formed on the surface of the wafer 100. The embossed adhesive is usually a photosensitive adhesive, in which a photosensitizer capable of absorbing light of a specific wavelength is provided. The light of a specific wavelength penetrates into the photosensitive adhesive, which activates the photosensitizer, causing it to undergo cross-linking or photochemical reaction, thereby solidifying the photosensitive adhesive. After the embossed pattern is formed on the surface of the wafer 100, in order to ensure the strength of the embossed pattern, the embossing equipment may further include a plurality of ultraviolet lamps 800, which can generate light of a specific wavelength. When the wafer 100 is embossed, the ultraviolet lamps 800 may irradiate the two embossing areas 500, and the ultraviolet rays can penetrate the first embossing plate 202 and the second embossing plate 302, and quickly solidify the embossed adhesive layer 102. Among them, the portion on the support platform 301 corresponding to the embossing area 500 on the second embossing assembly 300 is a transparent structure. The transparent structure ensures that the ultraviolet rays can penetrate the support platform 301, so that the ultraviolet rays can penetrate the second embossing plate 302 and penetrate into the embossed adhesive.

[0074] The imprinting device may also include a plasma device, a glue barrel, a second clamping component and a vibration component. The plasma device is used to perform surface treatment on the wafer body 101; thus, plasma will be attached to the two surfaces of the wafer body 101 respectively, and the plasma can ensure that when the wafer body 101 is immersed in the imprinting glue, the imprinting glue can be adsorbed onto the wafer body 101. The glue barrel contains the imprinting glue; the second clamping component is used to clamp the wafer body 101 and immerse the wafer body 101 in the imprinting glue; when the wafer body 101 is immersed in the imprinting glue, the imprinting glue is fully attached to the two surfaces of the wafer body 101 due to the plasma on the two surfaces of the wafer body 101, and when the wafer body 101 is taken out of the imprinting glue by the second clamping component, the imprinting glue will be attached to the two surfaces of the wafer body 101 respectively, forming a wafer 100 with no imprinting structure formed on the two surfaces. Plasma can make the embossing glue fully adhere to the two surfaces of the wafer body 101, so as to avoid that when the wafer body 101 is taken out of the embossing glue, the two surfaces of the wafer body 101 are not partially adhered with the embossing glue. The vibration component can drive the glue barrel to vibrate. When the wafer body 101 is immersed in the embossing glue, the vibration of the glue barrel will drive the vibration of the embossing glue, so that the thickness of the embossing glue adhered to the two surfaces of the wafer body 101 is uniform.

[0075] The embodiment of the present application also provides a method for using the imprinting device, which can be specifically described as follows: Figure 6 and Figure 7 , the imprinting device is the imprinting device of any of the above embodiments; the method comprises:

[0076] Step S100: Fixing the wafer 100 in the accommodation space 400 between the first imprinting assembly 200 and the second imprinting assembly 300 by a first clamping assembly;

[0077] Specifically, the wafer 100 can be fixed at positions in the accommodating space 400 corresponding to the two imprinting areas 500 respectively through the first clamping assembly. In this way, when the first imprinting assembly 200 and the second imprinting assembly 300 rotate relative to the wafer 100 and approach the wafer 100, the two imprinting areas 500 can directly correspond to the two surfaces of the wafer 100, thereby achieving simultaneous imprinting of the two surfaces of the wafer 100.

[0078] Step S200: driving the pressing roller 900 to roll on the first pressing assembly 200, and controlling the first pressing assembly 200 and the second pressing assembly 300 to rotate relative to each other and approach the wafer 100;

[0079] Specifically, when the pressure roller 900 rolls to the first set position, the two imprinting areas 500 are tilted relative to the wafer 100, and the ends of the two imprinting areas 500 that are close to each other are respectively pressed against the wafer 100; when the pressure roller 900 rolls to the second set position, the two imprinting areas 500 are parallel to the wafer 100, and the imprinting areas 500 are imprinted on the wafer 100.

[0080] Through the above technical solution, through the first imprinting assembly 200 and the second imprinting assembly 300, the imprinting equipment can imprint the two surfaces of the wafer 100 by only one imprinting, thereby improving the imprinting efficiency of the imprinting equipment on the wafer 100. In addition, during the imprinting process, it is no longer necessary to consider how to avoid damaging the already imprinted pattern, thereby reducing the difficulty of operation when imprinting the wafer 100. In addition, the first imprinting assembly 200 and the second imprinting assembly 300 can rotate relative to the wafer 100 and approach the wafer 100, so that during the process of the first imprinting assembly 200 and the second imprinting assembly 300 imprinting the wafer 100, the two imprinting areas 500 will gradually contact the surface of the wafer 100 until they are completely attached to the surface of the wafer 100, and the air between the two imprinting areas 500 and the surface of the wafer 100 can be effectively discharged, and the pattern imprinted on the surface of the wafer 100 has higher precision, thereby reducing the poor imprinting caused by bubbles left between the imprinting area 500 and the surface of the wafer 100.

[0081] The first clamping assembly may include a first abutment member and a second abutment member respectively abutting against the wafer 100 to clamp the wafer 100, the first abutment member is arranged below the first set position, and the second abutment member is arranged below the second set position; the method may also include step S300: when the pressure roller 900 rolls to the first set position, the first abutment member is controlled to be away from the wafer 100; when the pressure roller 900 rolls to the third set position, the second abutment member is controlled to be away from the wafer 100, wherein the third set position is between the first set position and the second set position.

[0082] For details, please refer to Figure 4At this time, the pressing roller 900 is in the third setting position. When the pressing roller 900 rolls to the first setting position, the ends of the two imprinting regions 500 that are close to each other are pressed against the wafer 100 respectively. At this time, the two imprinting regions 500 can play a role in fixing the wafer 100. In order to avoid the first abutting member from interfering with the first imprinting assembly 200 and the second imprinting assembly 300, when the pressing roller 900 rolls to the first setting position, the first abutting member can be controlled to be away from the wafer 100. When the pressing roller 900 continues to roll, for example, when the pressing roller 900 rolls to the third setting position between the first setting position and the second setting position, the two imprinting regions 500 are partially attached to the surface of the wafer 100, and the wafer 100 is fixed by the imprinting regions 500. At this time, the second abutting member can be controlled to be away from the wafer 100 to avoid the second abutting member from interfering with the first imprinting assembly 200 and the second imprinting assembly 300.

[0083] Specifically, the distance between the third setting position and the first setting position in the horizontal direction satisfies: L=1 / 3D, wherein D is the diameter of the wafer 100 , and L is the distance between the third setting position and the first setting position in the horizontal direction.

[0084] The wafer 100 may include a wafer body 101. In some embodiments, as described above, the imprinting device may further include a plasma device, a glue barrel, a second clamping assembly, and a vibration assembly. In this case, the method of use in the present application further includes: controlling the plasma device to spray plasma toward the two surfaces of the wafer 100; controlling the second clamping assembly to immerse the wafer body 101 in the imprinting glue in the glue barrel; controlling the vibration assembly to drive the glue barrel to vibrate; controlling the second clamping assembly to move upward in the vertical direction to take out the wafer body 101 immersed in the imprinting glue, so that an imprinting glue layer 102 is formed on the two surfaces of the wafer body 101. The plasma device is used to perform surface treatment on the wafer body 101; in this way, plasma will be attached to the two surfaces of the wafer body 101 respectively, and the plasma can ensure that when the wafer body 101 is immersed in the imprinting glue, the imprinting glue can be adsorbed onto the wafer body 101. The rubber barrel contains embossing glue; the second clamping assembly is used to clamp the wafer body 101 and soak the wafer body 101 in the embossing glue; when the wafer body 101 is soaked in the embossing glue, the embossing glue is fully attached to the two surfaces of the wafer body 101 due to the plasma on the two surfaces of the wafer body 101. When the wafer body 101 is taken out of the embossing glue by the second clamping assembly, the two surfaces of the wafer body 101 will be respectively attached with embossing glue, forming a wafer 100 with no embossing structure formed on the two surfaces. Plasma can make the embossing glue fully attached to the two surfaces of the wafer body 101, avoiding that when the wafer body 101 is taken out of the embossing glue, the two surfaces of the wafer body 101 are partially not attached with embossing glue. The vibration assembly can drive the rubber barrel to vibrate. When the wafer body 101 is soaked in the embossing glue, the vibration of the rubber barrel will drive the vibration of the embossing glue, so that the thickness of the embossing glue attached to the two surfaces of the wafer body 101 is uniform.

[0085] The imprinting device also includes a detection component, the detection component includes a detection member 700, a plurality of first detection marks 701 set on the first imprinting component 200 and a plurality of second detection marks 702 set on the second imprinting component 300, and the plurality of second detection marks 702 correspond to the plurality of first detection marks 701 one by one. The method also includes step S400: controlling the imprinting device to adjust the position of the first imprinting component 200 and / or the position of the second imprinting component 300, that is, the position of the first imprinting component 200 can be adjusted, the position of the second imprinting component 300 can also be adjusted, and the positions of the first imprinting component 200 and the second imprinting component 300 can also be adjusted at the same time, until the detection member 700 detects that the second detection mark 702 is aligned with the corresponding first detection mark 701. Through the detection component, it can be ensured that the two imprinting areas 500 are aligned in a specific direction, so that Figure 1 For reference, in Figure 1In the embodiment, when the imprinting device does not imprint the wafer 100, the first imprinting component 200 and the second imprinting component 300 are respectively arranged horizontally, and the wafer 100 needs to be arranged horizontally in the accommodating space 400. At this time, the detection member 700 is used to detect whether the second detection mark 702 corresponds to the first detection mark 701 in the vertical direction, which can reflect whether the two imprinting areas 500 are aligned in the vertical direction, that is, when the second detection mark 702 is aligned with the first detection mark 701 in the vertical direction, it indicates that the two imprinting areas 500 are aligned in the vertical direction. When the wafer 100 is arranged in the accommodating space 400, the two surfaces of the wafer 100 can be aligned with the two imprinting areas 500 at the same time, ensuring that the two imprinting areas 500 will not have errors with the surface of the wafer 100 during imprinting.

[0086] One or more embodiments of this specification are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification should be included in the scope of protection of this disclosure.

[0087] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An imprinting device for imprinting a surface of a wafer, characterized in that: The imprinting device comprises: A first stamping assembly and a second stamping assembly are arranged opposite to each other, wherein a receiving space for receiving the wafer is formed between the first stamping assembly and the second stamping assembly; the first stamping assembly and the second stamping assembly are respectively provided with stamping areas cooperating with the wafer; the first stamping assembly and the second stamping assembly are configured to be rotatable relative to the wafer so as to approach the wafer; A first clamping assembly, used for clamping and fixing the wafer; and a pressing roller, the pressing roller being in pressing contact with a side of the first stamping assembly facing away from the second stamping assembly and being capable of rolling on the first stamping assembly; Among them, when the pressure roller rolls to the first set position, the two imprinting areas are inclined relative to the wafer, and the ends of the two imprinting areas close to each other are respectively pressed against the wafer; when the pressure roller rolls to the second set position, the two imprinting areas are parallel to the wafer, and the imprinting areas are imprinted on the wafer.

2. The embossing device according to claim 1, characterized in that The stamping device also includes a detection component, which includes a detection piece, a plurality of first detection marks arranged on the first stamping component, and a plurality of second detection marks arranged on the second stamping component, wherein the plurality of second detection marks correspond one-to-one to the plurality of first detection marks respectively, and the detection piece is used to detect whether the second detection marks are aligned with the first detection marks.

3. The imprinting device according to claim 1, characterized in that The first clamping assembly includes a first abutment member and a second abutment member; the first abutment member includes a first manipulator and a first contact piece connected to the first manipulator, and the second abutment member includes a second manipulator and a second contact piece connected to the second manipulator; The first contact piece and the second contact piece are arranged opposite to each other, and the first contact piece and the second contact piece respectively have an arc structure for abutting against the wafer.

4. The embossing device according to claim 3, characterized in that The first abutment member is close to the first setting position, and the second abutment member is close to the second setting position; The imprinting device also includes a control unit, which is electrically connected to the first robot and the second robot respectively; the control unit is configured to control the first abutment member to be away from the wafer when the pressure roller rolls to the first set position, and control the second abutment member to be away from the wafer when the pressure roller rolls to a third set position; wherein the third set position is between the first set position and the second set position.

5. The imprinting device according to claim 1, characterized in that The first stamping assembly includes a frame and a first stamping plate fixed in the frame, the second stamping assembly includes a supporting platform and a second stamping plate arranged on the supporting platform, and the two stamping areas are respectively arranged on the first stamping plate and the second stamping plate.

6. The embossing device according to claim 5, characterized in that The imprinting device also includes a first drive motor and a second drive motor, The output shaft of the first driving motor is connected to the frame to drive the frame to rotate; The output shaft of the second driving motor is connected to the supporting platform to drive the supporting platform to rotate.

7. The imprinting device according to claim 5, characterized in that The embossing device further comprises a plurality of ultraviolet lamps for curing the embossing adhesive layer, and the portion of the supporting platform corresponding to the embossing area on the second embossing component is a transparent structure.

8. The embossing device according to any one of claims 1 to 7, characterized in that: The wafer comprises a wafer body and embossed adhesive layers respectively arranged on two surfaces of the wafer body; The embossing device also includes: Plasma equipment, used for performing surface treatment on the wafer body; A glue barrel, wherein the glue barrel contains embossing glue; A second clamping assembly is used to clamp the wafer body and immerse the wafer body in the embossing glue; and The vibration component is used to drive the rubber barrel to vibrate.

9. A method for using an imprinting device, characterized in that: The imprinting device is the imprinting device according to any one of claims 1 to 8; The method comprises: Fixing the wafer in the accommodation space between the first imprinting assembly and the second imprinting assembly by the first clamping assembly; The pressing roller is driven to roll on the first pressing assembly, and the first pressing assembly and the second pressing assembly are controlled to rotate relative to each other and approach the wafer; wherein, When the pressure roller rolls to the first set position, the two imprinting areas are tilted relative to the wafer, and the ends of the two imprinting areas close to each other are respectively pressed against the wafer; when the pressure roller rolls to the second set position, the two imprinting areas are parallel to the wafer, and the imprinting areas are imprinted on the wafer.

10. The method of use according to claim 9, characterized in that: The first clamping assembly comprises a first abutment member and a second abutment member respectively abutting against the wafer to clamp the wafer, the first abutment member is close to the first set position, and the second abutment member is close to the second set position; The method further comprises: When the pressure roller rolls to the first set position, the first abutment member is controlled to release the clamping of the wafer; when the pressure roller rolls to the third set position, the second abutment member is controlled to release the clamping of the wafer, wherein the third set position is between the first set position and the second set position.

11. The method of use according to claim 10, characterized in that: The distance between the third setting position and the first setting position in the horizontal direction satisfies: L=1 / 3D, wherein D is the diameter of the wafer, and L is the distance between the third setting position and the first setting position in the horizontal direction.

12. The method of use according to any one of claims 9 to 11, characterized in that: The wafer includes a wafer body; the imprinting device also includes a plasma device, a glue barrel containing imprinting glue, a vibration component for driving the glue barrel to vibrate, and a second clamping component for clamping and moving the wafer body, and the method also includes: Spraying plasma onto two surfaces of the wafer by the plasma equipment; Clamp the wafer body by the second clamping assembly and immerse the wafer body in the embossing glue in the glue barrel; The rubber barrel is driven to vibrate by the vibration component; The wafer body immersed in the embossing glue is taken out by the second clamping assembly.

13. The method of use according to claim 9, characterized in that: The imprinting device further includes a detection component, the detection component including a detection member, a plurality of first detection marks arranged on the first imprinting component, and a plurality of second detection marks arranged on the second imprinting component, wherein the plurality of second detection marks correspond to the plurality of first detection marks one by one, respectively. The method further includes: controlling the stamping device to adjust the position of the first stamping component and / or the position of the second stamping component until the detection member detects that the second detection mark is aligned with the corresponding first detection mark.

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