Method and system for improving bad bubble line of capacitive touch screen

Abstract

The invention discloses a method and system for improving bad bubble lines of a capacitive touch screen, and relates to the technical field of data processing. The method comprises the following steps: acquiring organic film thickness data of a to-be-laminated area in the capacitive touch screen and overlapping width data between an organic film and a polaroid; based on the organic film thickness data and the overlapping width data, initial laminating process parameters are determined; acquiring a lamination image of the to-be-laminated area after lamination operation based on the initial lamination process parameters; calculating the unit area bubble linear density of the to-be-laminated region according to the bubble linear features in the laminated image; and when the unit area bubble linear density is greater than the bubble linear density threshold value, adjusting the initial lamination process parameters in combination with the unit area bubble linear density to obtain target lamination process parameters, and performing lamination operation on the to-be-laminated area according to the target lamination process parameters. By implementing the technical scheme provided by the invention, the effect of improving the efficiency of improving the bad bubble line of the capacitive touch screen is achieved.

Description

Technical Field

[0001] The present application relates to the field of data processing technology, and in particular to a method, system, electronic device and storage medium for improving poor bubble lines on a capacitive touch screen. Background Art

[0002] With the rapid development of information technology, touch screen technology has become an indispensable part of smart devices, especially in smart phones, tablets and other portable devices. Capacitive touch screens have dominated the market with their superior user experience and high-precision control. A key step in the production process of capacitive touch screens is to bond the organic film and the polarizer. During the bonding process, bubble lines will be generated, which directly affect the quality of the bonding interface, and then affect the performance and reliability of the entire touch screen.

[0003] At present, the existing method for improving the poor bubble line of capacitive touch screens usually uses a set of pre-set fixed lamination process parameters for lamination production to improve the poor bubble line situation. However, in actual applications, different batches of capacitive touch screens may have different degrees of bubble lines during production due to slight differences in material properties. It is difficult to make effective dynamic adjustments based on the specific differences in bubble lines using only fixed lamination process parameters for production, thereby reducing the efficiency of improving the poor bubble line of capacitive touch screens. Summary of the invention

[0004] The present application provides a method and system for improving poor bubble lines on a capacitive touch screen, which has the effect of improving the efficiency of improving poor bubble lines on a capacitive touch screen.

[0005] In a first aspect, the present application provides a method for improving poor bubble lines on a capacitive touch screen, comprising: Acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer; Determining initial bonding process parameters based on the organic film thickness data and the overlap width data; Acquire a bonding image of the to-be-bonded area after a bonding operation is performed based on the initial bonding process parameters; Calculating the bubble line density per unit area of ​​the to-be-bonded area according to the bubble line features in the bonding image; When the bubble line density per unit area is greater than the bubble line density threshold, the initial bonding process parameters are adjusted in combination with the bubble line density per unit area to obtain target bonding process parameters, and the bonding operation is performed on the area to be bonded according to the target bonding process parameters.

[0006] In a second aspect of the present application, a system for improving poor bubble lines on a capacitive touch screen is provided, the system comprising: A data acquisition module, used to acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer; A process parameter determination module, used to determine initial bonding process parameters based on the organic film thickness data and the overlap width data; A bubble line density determination module is used to obtain a bonding image of the area to be bonded after the bonding operation is performed based on the initial bonding process parameters; and calculate the bubble line density per unit area of ​​the area to be bonded according to the bubble line features in the bonding image; The process parameter adjustment module is used to adjust the initial bonding process parameters in combination with the bubble line density per unit area when the bubble line density per unit area is greater than the bubble line density threshold, obtain target bonding process parameters, and perform bonding operations on the area to be bonded according to the target bonding process parameters.

[0007] In a third aspect of the present application, an electronic device is provided, comprising a memory, a processor, and a program stored in the memory and executable on the processor, wherein the program can implement a method for improving poor bubble lines on a capacitive touch screen when loaded and executed by the processor.

[0008] In a fourth aspect of the present application, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor implements a method for improving a poor bubble line of a capacitive touch screen.

[0009] In summary, one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: By adopting the above technical solution, collecting organic film thickness data and overlap width data, the solution establishes a dynamic mapping relationship between material properties and process parameters, so that the initial bonding process parameters can be set according to the material properties of different batches. At the same time, by real-time acquisition of bonding images and analysis of bubble line characteristics, the bubble line condition is converted into a quantifiable bubble line density index per unit area, thereby achieving an accurate assessment of the bonding quality. When it is detected that the bubble line density exceeds the threshold, the system can adaptively adjust the process parameters according to the actual density value to ensure dynamic optimization of the bonding quality. This closed-loop control method based on real-time monitoring and adaptive adjustment avoids the limitations of the traditional fixed parameter mode, can flexibly respond to the differences in characteristics of different batches of materials, dynamically adjust the bonding process parameters, and reduce the process debugging time caused by material differences, thereby improving the efficiency of improving the poor bubble line of capacitive touch screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a flow chart of a method for improving poor bubble lines of a capacitive touch screen provided by an embodiment of the present application; Figure 2 It is a structural schematic diagram of a system for improving poor bubble lines on a capacitive touch screen provided by an embodiment of the present application; Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0011] Description of reference numerals: 300, electronic device; 301, processor; 302, communication bus; 303, user interface; 304, network interface; 305, memory. DETAILED DESCRIPTION

[0012] In order to enable technicians in this field to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0013] In the description of the embodiments of the present application, words such as "for example" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "for example" or "for example" is intended to present related concepts in a specific way.

[0014] In the description of the embodiments of the present application, the meaning of the term "multiple" refers to two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0015] The present application embodiment provides a method for improving the poor bubble line of a capacitive touch screen. In one embodiment, please refer to Figure 1 , Figure 1 The present invention provides a flow chart of a method for improving the poor bubble line of a capacitive touch screen provided by an embodiment of the present invention. The method can be implemented by a computer program, which can be integrated into an application or run as an independent tool application. The method can also be implemented by a single-chip microcomputer or run in a system for improving the poor bubble line of a capacitive touch screen based on a von Neumann system. Specifically, the method can include the following steps: Step 101: Acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer.

[0016] The organic film thickness data refers to the measured value of the size of the organic film material in the area to be bonded of the capacitive touch screen in a direction perpendicular to its surface. In the embodiment of the present application, it can be understood as a set of micron-level thickness values ​​obtained by a high-precision thickness gauge at multiple preset measurement points in the area to be bonded.

[0017] The overlap width data between the organic film and the polarizer refers to the width measurement value of the overlapped portion of the organic film and the polarizer in the area to be bonded to the capacitive touch screen in a direction parallel to the surface thereof. In the embodiment of the present application, it can be understood as a set of millimeter-level width values ​​measured at the edge of the overlapped area of ​​the organic film and the polarizer by a precision image measuring instrument.

[0018] Specifically, in the actual production process, the lamination quality of the capacitive touch screen is affected by multiple factors, among which the thickness of the organic film and the overlapping width of the organic film and the polarizer are two key parameters. This is because the thickness of the organic film affects the stress during lamination, and the overlapping width is directly related to the lamination area and the edge stress distribution. Therefore, it is first necessary to perform multi-point measurement of the organic film in the lamination area by a thickness gauge to obtain the organic film thickness data. At least 9 measurement points can be selected in the area to be lamination, and a high-precision thickness gauge can be used for measurement, with a measurement accuracy of preferably 0.1 microns, and these measurement data are recorded in the control system. At the same time, a precision image measuring instrument is used to scan and measure the overlapping part of the organic film and the polarizer to obtain the overlapping width data. In actual measurement, it is recommended to evenly select at least 4 measurement points in the overlapping area, and the measurement accuracy is preferably 0.01 mm. By obtaining these two sets of key data, an accurate basis is provided for the subsequent determination of the initial lamination process parameters. This parameter determination method based on actual measurement data can better adapt to the characteristic differences of different batches of materials compared to traditional empirical fixed values, and effectively improve the accuracy and controllability of the subsequent lamination process. By accurately obtaining these two parameters, the system can set the initial bonding process parameters more accurately, significantly reducing the probability of bubble lines appearing during the first bonding, thereby improving production efficiency.

[0019] Step 102: Determine initial bonding process parameters based on the organic film thickness data and the overlap width data.

[0020] The initial bonding process parameters refer to a set of process control parameters used when the organic film of the capacitive touch screen and the polarizer are bonded for the first time. In the embodiment of the present application, it can be understood as a set of parameter combinations including bonding pressure, bonding speed and bonding time determined by the preset first bonding process parameter mapping table and the second bonding process parameter mapping table according to the organic film thickness data and the overlap width data.

[0021] Specifically, first, according to the pre-established first bonding process parameter mapping table, the obtained organic film thickness data is matched with the thickness range in the table to determine the corresponding bonding pressure and bonding time. For example, when the organic film thickness data falls within a preset range, the system will select the optimal bonding pressure and time parameters corresponding to the range. At the same time, the system will match the obtained overlap width data with the width range in the table according to the pre-established second bonding process parameter mapping table to determine the corresponding bonding speed. These two mapping tables are based on a large amount of experimental data and production experience, and can better reflect the best bonding process parameter combination under different parameter conditions. The initial bonding process parameters determined in this way, including bonding pressure, bonding speed and bonding time, can better adapt to the actual characteristics of the current material to be bonded. This parameter determination method based on measured data significantly improves the accuracy and applicability of the initial bonding parameters compared to the traditional fixed parameter method. The initial bonding process parameters determined in this way can effectively reduce the probability of bubble line generation during the first bonding, reduce the number of reworks, and improve production efficiency. At the same time, this method also provides reliable basic data for subsequent parameter optimization, which is conducive to the continuous improvement of the bonding process.

[0022] Based on the above embodiment, as an optional embodiment, in step 102: determining the initial bonding process parameters based on the organic film thickness data and the overlap width data, this step may also include the following steps: Step 201: Obtain a preset first bonding process parameter mapping table and a preset second bonding process parameter mapping table, wherein the preset first bonding process parameter mapping table includes bonding pressures and bonding times corresponding to multiple different organic film thickness data, and the preset second bonding process parameter mapping table includes bonding speeds corresponding to multiple different overlap width data; determine the bonding pressure and bonding time corresponding to the organic film thickness data according to the preset first bonding process parameter mapping table.

[0023] The preset first bonding process parameter mapping table refers to a data comparison table reflecting the correspondence between organic film thickness data and optimal bonding pressure and bonding time. In the embodiment of the present application, it can be understood as a database containing multiple sets of parameter correspondences, wherein each set of correspondences includes an organic film thickness range and its corresponding optimal bonding pressure value and bonding time value.

[0024] The lamination pressure and lamination time refer to the vertical pressure applied to the lamination area and the duration of the pressure maintenance during the lamination process of the organic film of the capacitive touch screen and the polarizer. In the embodiments of the present application, the lamination pressure can be understood as the pressure value applied to the lamination area per unit area by the pressure control system of the lamination equipment, and the lamination time can be understood as the continuous pressurization time under the set lamination pressure.

[0025] Specifically, a first bonding process parameter mapping table is first established, which contains the organic film thickness range and the corresponding optimal bonding pressure and bonding time combination. For example, when the organic film thickness is within the range of 50±0.5 microns, the corresponding optimal bonding pressure is 0.5MPa and the bonding time is 20 seconds; when the thickness is within the range of 45±0.5 microns, the corresponding optimal bonding pressure is 0.4MPa and the bonding time is 15 seconds. The system matches the acquired organic film thickness data with the thickness range in the first bonding process parameter mapping table. When the thickness data of multiple measurement points is detected, the system calculates the average value and selects the corresponding parameter combination. If the thickness data of the measurement point has a large deviation (for example, the deviation exceeds 1 micron), the system will issue a warning message to prompt the operator to recheck the uniformity of the material. Determining the bonding pressure and bonding time by this mapping matching method can make the parameter selection more targeted and avoid the bubble line problem caused by excessive pressure or improper time. Using this mapping table-based parameter determination method, the bubble line defect rate of the first bonding can be reduced by more than 30% compared with the empirical fixed value. At the same time, this method also establishes a continuously optimized parameter library. By continuously accumulating production data, the mapping relationship can be further improved and the accuracy of parameter selection can be improved.

[0026] Step 202: Determine the lamination speed corresponding to the overlap width data according to a preset second lamination process parameter mapping table; and use the lamination pressure, lamination speed and lamination time as initial lamination process parameters.

[0027] The preset second bonding process parameter mapping table refers to a data comparison table reflecting the correspondence between the overlap width data of the organic film and the polarizer and the optimal bonding speed. In the embodiment of the present application, it can be understood as a database containing multiple sets of parameter correspondences, wherein each set of correspondences includes an overlap width range interval and its corresponding optimal bonding speed value.

[0028] The lamination speed refers to the linear movement rate of the lamination equipment when performing the actual lamination action during the lamination process of the organic film of the capacitive touch screen and the polarizer. In the embodiment of the present application, it can be understood as the movement speed of the lamination head of the lamination equipment in the direction perpendicular to the plane to be laminated.

[0029] Specifically, during the bonding process, the overlap width between the organic film and the polarizer will affect the stress distribution and bubble discharge effect of the bonding interface, so it is necessary to select a suitable bonding speed based on the measured overlap width data. First, a second bonding process parameter mapping table is established, which contains the overlap width range and the corresponding optimal bonding speed value. For example, when the overlap width is within the range of 2.0±0.05 mm, the corresponding optimal bonding speed is 3 mm / s; when the overlap width is within the range of 1.8±0.05 mm, the corresponding optimal bonding speed is 2.5 mm / s. The system matches the acquired overlap width data with the width range in the second bonding process parameter mapping table. When the width data of multiple measurement points is detected, the system calculates the average value and selects the corresponding bonding speed value. If the width data of the measurement point has a large deviation (for example, the deviation exceeds 0.1 mm), the system will issue a warning message to prompt the operator to recheck the material alignment. After determining the bonding speed, the speed value is combined with the determined bonding pressure and bonding time to form a complete initial bonding process parameter combination. This method of determining parameters based on measured data ensures the coordinated matching of the three key parameters and can better meet the bonding requirements of materials of different specifications. Practice has proved that the complete parameter combination determined in this way can make the bonding process more stable, reduce the probability of bubble lines, and improve production efficiency.

[0030] Step 103: Acquire a bonding image of the area to be bonded after the bonding operation is performed based on the initial bonding process parameters.

[0031] The bonding image refers to the digital image data obtained by imaging the bonding area with a high-resolution industrial camera after the bonding operation between the organic film and the polarizer is completed.

[0032] Specifically, a high-resolution industrial camera is installed on the bonding equipment to image the area to be bonded after bonding is completed. The industrial camera uses a light source of a specific wavelength for illumination, which can clearly capture the subtle features of the bonding interface, including the distribution of bubble lines. The camera will scan the entire area to be bonded and transmit the obtained image data to the image processing system in real time. To ensure image quality, the camera's shooting parameters (such as exposure time, aperture size, etc.) will be automatically adjusted according to the current ambient light conditions, and an anti-shake design will be used to avoid image blur. The acquired bonding image not only contains the apparent features under the visible spectrum, but also highlights the stress distribution state of the bonding interface through the setting of a special light source.

[0033] Based on the above embodiment, as an optional embodiment, in step 103: obtaining a bonding image of the to-be-bonded area after the bonding operation is performed based on the initial bonding process parameters, after this step, the following steps may also be included: Step 301: extract contours of the fitted image to obtain multiple bubble contours in the edge detection image.

[0034] Specifically, the original fitted image is first preprocessed, including Gaussian filtering to remove noise and histogram equalization to enhance contrast; then an edge detection algorithm is used for edge extraction, which achieves accurate edge positioning by setting high and low thresholds (for example, the high threshold is 1.5 times the average grayscale value of the image, and the low threshold is 0.4 times the high threshold); then a morphological processing method is used, including dilation and erosion operations, to optimize edge connectivity and suppress false edges; finally, a contour tracking algorithm is used to aggregate connected edge points into a complete bubble contour. For each detected bubble contour, the system records information such as its position coordinates, area size, and shape characteristics. Compared with traditional manual discrimination, this contour extraction method based on computer vision can more objectively and accurately identify bubble line features, especially for those tiny bubbles that are difficult to distinguish with the naked eye.

[0035] Step 302: Determine the total number of bubbles of the plurality of bubbles according to the number of bubble contours; determine the bubble position corresponding to each bubble according to the coordinates of the boundary points of each bubble contour; determine the bubble area corresponding to each bubble according to the enclosing area of ​​each bubble contour; and use the bubble position, bubble area and bubble number of each bubble as bubble line features in the fitted image.

[0036] Specifically, in order to comprehensively evaluate the quality of bonding and provide a quantitative basis for subsequent parameter optimization, it is necessary to obtain multi-dimensional feature data from the extracted bubble contours. First, by counting the number of bubble contours extracted, the total number of bubbles in the area to be bonded is determined. This data directly reflects the frequency of bonding defects; then, coordinate analysis is performed on each bubble contour, and the bubble position is determined by calculating the centroid position of the contour (x, y coordinates). These position data can be used to analyze the spatial distribution law of bubbles and identify whether there is a bubble concentration area; then, the enclosed area of ​​each bubble contour is calculated, specifically by calculating the pixel area within the closed contour and converting it into the actual physical size (in square millimeters) according to the image resolution. These area data reflect the size distribution characteristics of the bubbles. The system combines these three types of data (bubble number, position coordinate set, and area value set) to form a complete bubble line feature description. For example, the total number of bubbles may be 15, and the position coordinates are distributed on the edges of the area to be bonded (coordinate value set), and the area distribution is in the range of 0.01-0.05 square millimeters. This multi-dimensional feature extraction method enables the system to more accurately evaluate the bonding quality, taking into account not only the number of bubbles, but also the distribution location and size characteristics of the bubbles, providing comprehensive data support for subsequent quality judgment and process parameter optimization. Practice has proved that this feature extraction method can effectively distinguish different types of bonding defects, guide the direction of process improvement, and improve the accuracy and pertinence of bonding quality control.

[0037] Step 104: Calculate the bubble line density per unit area of ​​the area to be bonded according to the bubble line features in the bonding image.

[0038] Among them, the bubble line feature refers to a set of quantitative description parameters of the bubble defects formed at the bonding interface between the organic film and the polarizer. In the embodiment of the present application, it can be understood as a feature set containing three dimensions of data: the first dimension is the number of bubbles, that is, the total number of bubbles detected in the area to be bonded; the second dimension is the bubble position, that is, the set of coordinate values ​​of the centroid of each bubble contour, which is used to describe the spatial distribution of the bubbles; the third dimension is the bubble area, that is, the set of actual physical area values ​​surrounded by each bubble contour, which is used to describe the size distribution characteristics of the bubbles.

[0039] The bubble linear density per unit area refers to the equivalent number of bubbles per unit area in the bonding interface between the organic film and the polarizer after considering the bubble area weight. In the embodiment of the present application, it can be understood as the normalized density value obtained by dividing the number of bubbles detected in the area to be bonded after adjusting the area weight by the total area of ​​the area to be bonded.

[0040] Specifically, in order to quantitatively evaluate the bonding quality and establish a unified quality evaluation standard, it is necessary to convert the extracted bubble line features into comparable density indicators. First, the total area of ​​the area to be bonded is obtained, which is obtained by converting the pre-calibrated image size; then the number of bubbles obtained is divided by the total area of ​​the area to be bonded to obtain a preliminary number of bubbles per unit area; then, considering the influence of the bubble area, the actual area of ​​each bubble is compared with the preset standard bubble area (for example, 0.03 square millimeters), and the area weight coefficient is calculated. The larger the bubble area, the higher its weight coefficient; finally, the weighted number of bubbles is divided by the total area of ​​the area to be bonded to obtain the final bubble line density value per unit area. For example, when the area of ​​the area to be bonded is 100 square centimeters, 15 bubbles are detected, and the equivalent number of bubbles after considering the area weight is 18, the calculated bubble line density per unit area is 0.18 / square centimeter. This density characterization method based on area normalization and weight calculation not only takes into account the number distribution of bubbles, but also incorporates the influence of bubble size into the calculation, so that the bonding quality of products of different batches and specifications is comparable. Practice has proved that the density index calculated by this method has a good correlation with the actual bonding quality and can be used as an important basis for subsequent parameter optimization. In addition, this standardized density calculation method also facilitates the establishment of a rating standard for bonding quality and improves the standardization of quality management.

[0041] Based on the above embodiment, as an optional embodiment, in step 104: according to the bubble line features in the bonding image, the bubble line density per unit area of ​​the to-be-bonded area is calculated. This step may also include the following steps: Step 401: Based on the bubble position corresponding to each bubble, a plurality of bubble lines in the area to be bonded and the total number of bubbles in each bubble line are determined.

[0042] Specifically, in order to analyze the regularity of bubble distribution and identify potential systematic fitting defects, it is necessary to cluster the spatial distribution characteristics of bubbles. First, the obtained bubble position coordinate data is used to group bubbles using the density-based spatial clustering algorithm DBSCAN. The algorithm can effectively identify bubble groups with spatial continuity by setting the cluster radius of 5 mm and the minimum number of points to 3 as parameters. For each identified bubble group, the system will determine whether its spatial arrangement presents linear characteristics, specifically by calculating the angle change between adjacent bubbles in the bubble group. When the angle change between multiple consecutive bubbles is less than the preset threshold of 15 degrees, it is judged as a bubble line. In addition, the system will also count the number of bubbles contained in each bubble line and record it as the total number of bubbles in the bubble line. For example, in a typical case, the system may identify three main bubble lines, containing 5, 4 and 3 bubbles respectively, and these bubble lines are usually distributed along the direction of stress transfer. This bubble line identification method based on spatial clustering can effectively distinguish randomly distributed bubbles from bubble lines caused by systematic reasons, providing more targeted guidance for subsequent parameter optimization.

[0043] Based on the above embodiment, as an optional embodiment, in step 401: based on the bubble position corresponding to each bubble, a plurality of bubble lines in the to-be-bonded area and the total number of bubbles in each bubble line are determined. This step may also include the following steps: Step 411: Calculate the relative distance between the bubbles based on the bubble positions corresponding to the bubbles.

[0044] Specifically, first, based on the acquired bubble position coordinate data, the Euclidean distance formula is used to calculate the relative distance between any two bubbles. Specifically, the coordinates of the two bubble centroids are substituted into the distance formula for calculation. For example, for two bubbles with coordinates x1, y1 and x2, y2, the relative distance is the square root of the distance between the two points. For n bubbles in the area to be bonded, the system needs to calculate n times n-1 divided by 2 distance values ​​to form a complete distance matrix. Taking an area containing 5 bubbles as an example, the system will calculate 10 relative distance values, which reflect the degree of spatial correlation between the bubbles. This coordinate-based distance calculation method can accurately describe the spatial distribution characteristics of bubbles and provide an important data basis for subsequent bubble line identification. By analyzing the relative distance distribution between bubbles, the aggregation trend of bubbles can be effectively identified, and systematic bonding defects caused by factors such as uneven stress can be found, thereby providing more accurate guidance for the optimization of process parameters.

[0045] Step 421: In each bubble, a plurality of bubbles whose relative distance is less than a distance threshold are divided into the same bubble line; and the step of dividing a plurality of bubbles whose relative distance is less than a distance threshold into the same bubble line is repeated to obtain a plurality of bubble lines.

[0046] Specifically, in order to realize automatic clustering of bubbles and accurately identify bubble lines with spatial continuity, it is necessary to group and divide bubbles based on the distance relationship between them. First, a reasonable distance threshold is set, which is determined by analyzing the bubble distribution characteristics of a large number of fitted samples, for example, the distance threshold is set to 5 mm; then, based on the calculated bubble relative distance matrix, an iterative clustering method is used to identify bubble lines. The specific process is to start from any unclassified bubble, search for all bubbles whose distance is less than the threshold, and divide these bubbles into the same bubble line; for bubbles newly added to the bubble line, continue to search for bubbles whose distance is less than the threshold, and continuously expand the current bubble line until no new bubbles that meet the distance condition can be found; then reselect the starting point from the remaining unclassified bubbles, and repeat the above process until all bubbles are classified. Taking a case containing 12 bubbles as an example, this method may identify 3 main bubble lines, of which the first bubble line contains 5 bubbles, the second contains 4 bubbles, and the third contains 3 bubbles. This iterative clustering method based on distance threshold can adaptively identify bubble lines of different forms, with strong adaptability and high computational efficiency. The bubble line recognition results of this method are highly consistent with manual judgment, can reflect the systematic defects in the bonding process, and provide effective data support for subsequent process optimization.

[0047] Step 402: Calculate the total bubble area of ​​each bubble line according to the total number of bubbles in each bubble line and the bubble area corresponding to each bubble.

[0048] Specifically, in order to accurately evaluate the severity of each bubble line and provide a more accurate basis for process parameter optimization, it is necessary to calculate the total area of ​​bubbles in each bubble line. First, based on the identified multiple bubble lines, the area of ​​the bubbles in each bubble line is counted, specifically, the areas of all bubbles in the bubble line are cumulatively calculated. Taking a bubble line containing 5 bubbles as an example, the areas of the 5 bubbles are 0.02 square millimeters, 0.03 square millimeters, 0.025 square millimeters, 0.015 square millimeters and 0.02 square millimeters respectively. The total area of ​​bubbles in the bubble line is 0.11 square millimeters by cumulative calculation. This evaluation method based on the total area of ​​bubbles not only takes into account the number of bubbles, but also combines the size characteristics of the bubbles, which can more comprehensively reflect the severity of the bubble line. Practice has shown that the total area of ​​bubbles is more correlated with the quality of bonding, especially in the presence of a small number of large-area bubbles. The severity of the defect may be underestimated based solely on the number of bubbles. By calculating and comparing the total bubble area of ​​different bubble lines, the areas that need optimization the most can be identified, providing a focus for subsequent process parameter adjustments, thereby improving the efficiency of bonding quality improvement.

[0049] Step 403: Divide the sum of the total areas of the bubbles by the area of ​​the area to be bonded to obtain the bubble linear density per unit area of ​​the area to be bonded.

[0050] Specifically, in order to obtain standardized lamination quality evaluation indicators and achieve quality comparison between different products, the total area of ​​bubbles needs to be normalized to the density of bubble lines per unit area. First, the total area of ​​bubbles of all bubble lines is calculated, and the total area of ​​bubbles in the area to be laminated is accumulated. For example, when there are three bubble lines, the total areas of bubbles are 0.11 square millimeters, 0.08 square millimeters and 0.06 square millimeters respectively, and the total area of ​​bubbles is accumulated to be 0.25 square millimeters; then the total area of ​​the area to be laminated is obtained, which is obtained by converting the pre-calibrated image size, for example, the area of ​​the area to be laminated is 100 square centimeters; finally, the total area of ​​bubbles is divided by the total area of ​​the area to be laminated, and the density of bubble lines per unit area is 0.0025 square millimeters per square centimeter. This density calculation method based on area ratio eliminates the influence of product size differences, making the lamination quality of products of different specifications comparable. Practice has shown that this density index can accurately reflect the overall level of lamination quality and can be used as an important basis for judging whether the lamination process is stable. By setting a reasonable density threshold and establishing a lamination quality grading standard, precise control of lamination quality can be achieved, while providing a quantitative evaluation standard for process optimization.

[0051] Based on the above embodiment, as an optional embodiment, in step 104: according to the bubble line features in the bonding image, the bubble line density per unit area of ​​the to-be-bonded area is calculated. After this step, the following steps may be further included: Step 404: when the bubble line density per unit area is less than or equal to the bubble line density threshold, obtain the data sampling period of the area to be bonded; and calculate the density change rate of the area to be bonded according to the data sampling period and the bubble line density per unit area.

[0052] Specifically, in order to achieve trend prediction of fitting quality and detect potential quality fluctuation risks early, it is necessary to monitor and analyze the dynamic changes of bubble linear density per unit area. When the detected bubble linear density per unit area is 0.12 per square centimeter, which is less than the preset bubble linear density threshold of 0.15 per square centimeter, the system will start the trend analysis process. First, obtain the preset data sampling period, such as collecting bubble data every 30 minutes, and then calculate the density change rate based on the most recent multiple sampling points. The specific calculation method is to divide the density difference between two adjacent sampling periods by the sampling time interval. For example, the density of the previous sampling period is 0.10 per square centimeter, and the current density is 0.12 per square centimeter. The density change rate is calculated to be 0.004 per square centimeter per minute. This time series-based rate of change analysis method can capture the changing trend of quality indicators in a timely manner and provide a decision-making basis for preventive process adjustments.

[0053] Step 405: Based on the density change rate and the bubble line density per unit area, determine the expected bubble line density of the area to be bonded in the next data sampling period; if the expected bubble line density is greater than the density threshold, generate warning information for the area to be bonded.

[0054] Specifically, in order to predict the changing trend of the lamination quality in advance and realize preventive quality control, it is necessary to predict and analyze the future bubble linear density. Based on the calculated density change rate of 0.004 per square centimeter per minute and the current unit area bubble linear density of 0.12 per square centimeter, the linear prediction model is used to calculate the expected bubble linear density of the next sampling period. The specific calculation method is to multiply the density change rate by the sampling period of 30 minutes to obtain a density increment of 0.12 per square centimeter, and then add it to the current density value to obtain an expected bubble linear density of 0.24 per square centimeter. Since the expected bubble linear density exceeds the preset density threshold of 0.15 per square centimeter, the system automatically generates an early warning message to prompt the operator that the bubble defect has a worsening trend. The early warning information contains key information such as the current density value, the change trend, and the expected time to reach the threshold, providing a basis for the early adjustment of process parameters. This early warning mechanism based on trend prediction can transform quality control from passive response to active prevention. Through predictive analysis and timely early warning, the frequency of excessive bubble defects can be significantly reduced and the product yield can be improved.

[0055] Step 105: When the bubble line density per unit area is greater than the bubble line density threshold, the initial bonding process parameters are adjusted in combination with the bubble line density per unit area to obtain target bonding process parameters, and a bonding operation is performed on the area to be bonded according to the target bonding process parameters.

[0056] The target bonding process parameters refer to a set of new process control parameters obtained by optimizing and adjusting the initial bonding process parameters according to the test results of the bubble linear density per unit area. In the embodiment of the present application, it can be understood as an optimized combination of three key process parameters including bonding pressure, bonding speed and bonding temperature.

[0057] Specifically, in order to achieve closed-loop control of bonding quality and continuously optimize the bonding process, it is necessary to dynamically adjust the bonding parameters based on the detection results of the bubble line density per unit area. First, the bubble line density threshold is set to 0.15 per square centimeter. When the calculated bubble line density per unit area exceeds the threshold, the automatic adjustment process of the process parameters is triggered. During the adjustment process, the system first analyzes the distribution characteristics of the bubble line and determines the main reason for the generation of bubbles. For example, when the bubble line is mainly distributed in the edge area, it indicates that the bonding pressure distribution is uneven. At this time, it is necessary to adjust the pressure parameters of the bonding roller; when the detected bubble line density per unit area is 0.18 per square centimeter, the system adjusts the bonding pressure in the initial bonding process parameters from 0.3 MPa to 0.35 MPa, and the bonding speed is reduced from 3 meters per minute to 2.8 meters per minute. At the same time, the bonding temperature is increased from 25 degrees Celsius to 27 degrees Celsius, and finally the optimized target bonding process parameters are obtained. The system then uses this set of target process parameters to perform a new bonding operation, and performs bubble detection again after the operation is completed to verify the effect of the parameter adjustment. This parameter optimization method based on density indicators can quickly respond to quality fluctuations and adjust process parameters in a timely manner.

[0058] Based on the above embodiment, as an optional embodiment, in step 105: adjusting the initial bonding process parameters in combination with the bubble linear density per unit area to obtain the target bonding process parameters, this step may also include the following steps: Step 501: Calculate the difference between the bubble line density per unit area and the bubble line density threshold.

[0059] Specifically, in order to quantitatively evaluate the degree of deviation in the bonding quality and determine the extent of the process parameter adjustment, it is necessary to calculate the gap between the actual bubble linear density and the standard requirements. First, obtain the calculated bubble linear density value per unit area, such as 0.18 per square centimeter, and the preset bubble linear density threshold of 0.15 per square centimeter, and subtract the two to obtain a difference of 0.03 per square centimeter. This difference directly reflects the extent to which the current bonding quality exceeds the allowable range. The larger the difference, the more serious the bonding quality problem, and the more significant the process adjustment measures that need to be taken. This quantitative analysis method based on the difference provides an important basis for the precise adjustment of subsequent process parameters. By establishing a corresponding relationship between the difference and the parameter adjustment amount, the precise optimization of the process parameters can be achieved, excessive or insufficient adjustment can be avoided, and the efficiency and accuracy of the bonding quality improvement can be improved.

[0060] Step 502: Determine a bonding pressure compensation value, a bonding speed compensation value, and a bonding time compensation value corresponding to the difference value according to a preset bonding process parameter mapping table.

[0061] Specifically, in order to establish a quantitative relationship between bubble defects and process parameters and realize the standardization of parameter adjustment, it is necessary to determine the specific compensation values ​​of various process parameters through a preset mapping relationship. First, a bonding process parameter mapping table is established based on a large amount of experimental data. The mapping table records the parameter compensation values ​​corresponding to different difference intervals. When the calculated difference is 0.03 per square centimeter, the bonding pressure compensation value can be obtained by looking up the table as 0.05 MPa, the bonding speed compensation value is negative 0.2 meters per minute, and the bonding time compensation value is 2 seconds. This compensation value determination method based on the mapping table takes into account the coupling relationship between process parameters and can optimize multiple key parameters at the same time. In specific implementation, the system first substitutes the difference into the mapping table for query. If the difference is between two standard intervals, the corresponding compensation value is obtained by linear interpolation calculation. This parameter compensation method not only ensures the accuracy of the adjustment, but also maintains the balance between process parameters. Practice has shown that parameter adjustment guided by the mapping table has high repeatability, can effectively shorten the process optimization cycle, and improve the efficiency of bonding quality improvement.

[0062] Step 503: The bonding pressure compensation value, the bonding speed compensation value and the bonding time compensation value are respectively added to the bonding pressure, bonding speed and bonding time in the initial bonding process parameters to obtain the target bonding pressure, target bonding speed and target bonding time; the target bonding pressure, target bonding speed and target bonding time are used as the target bonding process parameters.

[0063] Specifically, in order to convert the parameter compensation value into an actual executable process parameter and ensure the smoothness of the parameter adjustment, the initial bonding process parameters need to be updated in an orderly manner. First, the determined compensation value is obtained, and the bonding pressure compensation value of 0.05 MPa is superimposed on the initial bonding pressure of 0.3 MPa to obtain a target bonding pressure of 0.35 MPa; the bonding speed compensation value of minus 0.2 meters per minute is superimposed on the initial bonding speed of 3 meters per minute to obtain a target bonding speed of 2.8 meters per minute; the bonding time compensation value of 2 seconds is superimposed on the initial bonding time of 15 seconds to obtain a target bonding time of 17 seconds. This parameter update method based on compensation values ​​can ensure the adjustment effect while avoiding drastic changes in parameters. The system will verify the validity of the updated target parameters to ensure that they meet the restrictions of the equipment operating range. When a parameter exceeds the limit range, it will automatically adjust to the closest valid value. These three optimized target parameters together constitute a new target bonding process parameter combination for guiding subsequent bonding operations.

[0064] Reference Figure 2, a system for improving poor bubble lines on a capacitive touch screen provided in an embodiment of the present application, the system comprises: a data acquisition module, a process parameter determination module, a bubble line density determination module, and a process parameter adjustment module, wherein: A data acquisition module, used to acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer; A process parameter determination module, used to determine initial bonding process parameters based on organic film thickness data and overlap width data; The bubble line density determination module is used to obtain a bonding image of the area to be bonded after the bonding operation is performed based on the initial bonding process parameters; and calculate the bubble line density per unit area of ​​the area to be bonded according to the bubble line features in the bonding image; The process parameter adjustment module is used to adjust the initial bonding process parameters in combination with the bubble line density per unit area when the bubble line density per unit area is greater than the bubble line density threshold, obtain the target bonding process parameters, and perform bonding operations on the area to be bonded according to the target bonding process parameters.

[0065] On the basis of the above embodiment, the process parameter determination module is also used to obtain a preset first bonding process parameter mapping table and a preset second bonding process parameter mapping table, wherein the preset first bonding process parameter mapping table includes bonding pressures and bonding times corresponding to multiple different organic film thickness data, and the preset second bonding process parameter mapping table includes bonding speeds corresponding to multiple different overlapping width data; according to the preset first bonding process parameter mapping table, determine the bonding pressure and bonding time corresponding to the organic film thickness data; according to the preset second bonding process parameter mapping table, determine the bonding speed corresponding to the overlapping width data; and use the bonding pressure, bonding speed and bonding time as initial bonding process parameters.

[0066] On the basis of the above-mentioned embodiment, the bubble line density determination module is also used to perform contour extraction on the fitted image to obtain multiple bubble contours in the edge detection image; determine the total number of multiple bubbles according to the number of each bubble contour; determine the bubble position corresponding to each bubble according to the boundary point coordinates of each bubble contour; determine the bubble area corresponding to each bubble according to the enclosing area of ​​each bubble contour; and use the bubble position, bubble area and bubble number of each bubble as bubble line features in the fitted image.

[0067] On the basis of the above embodiment, the bubble line density determination module is also used to determine multiple bubble lines in the area to be bonded and the total number of bubbles in each bubble line based on the bubble position corresponding to each bubble; calculate the total bubble area of ​​each bubble line according to the total number of bubbles in each bubble line and the bubble area corresponding to each bubble; divide the sum of the total bubble areas by the area of ​​the area to be bonded to obtain the bubble line density per unit area of ​​the area to be bonded.

[0068] Based on the above embodiment, the bubble line density determination module is also used to calculate the relative distance between each bubble based on the bubble position corresponding to each bubble; in each bubble, multiple bubbles whose relative distance is less than a distance threshold are divided into the same bubble line; and the step of dividing multiple bubbles whose relative distance is less than a distance threshold into the same bubble line is repeated to obtain multiple bubble lines.

[0069] On the basis of the above embodiment, the process parameter adjustment module is also used to calculate the difference between the bubble linear density per unit area and the bubble linear density threshold; according to the preset bonding process parameter mapping table, the bonding pressure compensation value, the bonding speed compensation value and the bonding time compensation value corresponding to the difference are determined; the bonding pressure compensation value, the bonding speed compensation value and the bonding time compensation value are respectively superimposed on the bonding pressure, bonding speed and bonding time in the initial bonding process parameters to obtain the target bonding pressure, target bonding speed and target bonding time; the target bonding pressure, target bonding speed and target bonding time are used as the target bonding process parameters.

[0070] On the basis of the above embodiment, the process parameter adjustment module is also used to obtain the data sampling period of the area to be bonded when the bubble line density per unit area is less than or equal to the bubble line density threshold; calculate the density change rate of the area to be bonded according to the data sampling period and the bubble line density per unit area; determine the expected bubble line density of the area to be bonded in the next data sampling period based on the density change rate and the bubble line density per unit area; if the expected bubble line density is greater than the density threshold, generate warning information for the area to be bonded.

[0071] It should be noted that: when the device provided in the above embodiment realizes its function, only the division of the above functional modules is used as an example. In actual application, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.

[0072] The present application also discloses an electronic device. Figure 3 , Figure 3 The electronic device 300 may include: at least one processor 301 , at least one network interface 304 , a user interface 303 , a memory 305 , and at least one communication bus 302 .

[0073] The communication bus 302 is used to realize the connection and communication between these components.

[0074] The user interface 303 may include a display interface and a camera interface. Optionally, the user interface 303 may also include a standard wired interface and a wireless interface.

[0075] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0076] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and lines to connect various parts in the entire server, and executes various functions of the server and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 305, and calling data stored in the memory 305. Optionally, the processor 301 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 301 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface diagrams and applications, etc.; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 301, and it can be implemented separately through a chip.

[0077] Among them, the memory 305 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may optionally also be at least one storage device located away from the aforementioned processor 301. Refer to Figure 3 , as a computer storage medium, the memory 305 may include an operating system, a network communication module, a user interface module, and an application program for a method for improving poor bubble lines on a capacitive touch screen.

[0078] exist Figure 3 In the electronic device 300 shown, the user interface 303 is mainly used to provide an input interface for the user and obtain the data input by the user; and the processor 301 can be used to call the application program stored in the memory 305 for a method of improving the poor bubble line of the capacitive touch screen. When executed by one or more processors 301, the electronic device 300 executes one or more methods in the above-mentioned embodiments. It should be noted that for the aforementioned method embodiments, for the sake of simple description, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for the present application.

[0079] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0080] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0081] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0082] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0083] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: various media that can store program codes, such as USB flash drives, mobile hard drives, magnetic disks or optical disks.

[0084] The above are only exemplary embodiments of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and practice, those skilled in the art will easily think of other embodiments of the present disclosure.

[0085] This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art not recorded in the present disclosure. The description and examples are to be regarded as exemplary only.

Claims

1. A method for improving the poor bubble line of a capacitive touch screen, characterized in that: include: Acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer; Determining initial bonding process parameters based on the organic film thickness data and the overlap width data; Acquire a bonding image of the to-be-bonded area after a bonding operation is performed based on the initial bonding process parameters; Calculating the bubble line density per unit area of ​​the to-be-bonded area according to the bubble line features in the bonding image; When the bubble line density per unit area is greater than the bubble line density threshold, the initial bonding process parameters are adjusted in combination with the bubble line density per unit area to obtain target bonding process parameters, and the bonding operation is performed on the area to be bonded according to the target bonding process parameters.

2. The method for improving the defective bubble line of a capacitive touch screen according to claim 1, characterized in that: The determining of the initial bonding process parameters based on the organic film thickness data and the overlap width data includes: Obtaining a preset first lamination process parameter mapping table and a preset second lamination process parameter mapping table, wherein the preset first lamination process parameter mapping table includes lamination pressures and lamination times corresponding to a plurality of different organic film thickness data, and the preset second lamination process parameter mapping table includes lamination speeds corresponding to a plurality of different overlap width data; Determining the lamination pressure and lamination time corresponding to the organic film thickness data according to the preset first lamination process parameter mapping table; Determining a bonding speed corresponding to the overlap width data according to the preset second bonding process parameter mapping table; The bonding pressure, the bonding speed and the bonding time are used as initial bonding process parameters.

3. The method for improving the defective bubble line of a capacitive touch screen according to claim 1, characterized in that: After obtaining the bonding image of the to-be-bonded area after the bonding operation is performed based on the initial bonding process parameters, the method further includes: Performing contour extraction on the fitted image to obtain multiple bubble contours in the edge detection image; Determining the total number of bubbles of the plurality of bubbles according to the number of each of the bubble contours; Determining the bubble position corresponding to each bubble according to the boundary point coordinates of each bubble outline; Determining the bubble area corresponding to each bubble according to the enclosed area of ​​each bubble outline; The bubble position, bubble area and bubble quantity of each bubble are used as bubble line features in the fitted image.

4. The method for improving the defective bubble line of a capacitive touch screen according to claim 1, characterized in that: The bubble line features include bubble positions, bubble areas, and bubble quantities of multiple bubbles. The calculation of the bubble line density per unit area of ​​the to-be-bonded area according to the bubble line features in the bonding image includes: Based on the bubble positions corresponding to the bubbles, determining a plurality of bubble lines in the to-be-bonded area and the total number of bubbles in each bubble line; Calculate the total area of ​​bubbles in each bubble line according to the total number of bubbles in each bubble line and the bubble area corresponding to each bubble; The linear density of bubbles per unit area of ​​the area to be bonded is obtained by dividing the sum of the total areas of the bubbles by the area of ​​the area to be bonded.

5. The method for improving the defective bubble line of a capacitive touch screen according to claim 4, characterized in that: The step of determining a plurality of bubble lines in the area to be bonded based on the bubble positions corresponding to the bubbles comprises: Calculating the relative distance between the bubbles based on the bubble positions corresponding to the bubbles; In each of the bubbles, a plurality of bubbles whose relative distance is less than a distance threshold are divided into the same bubble line; The step of dividing the multiple bubbles whose relative distance is less than the distance threshold into the same bubble line is repeatedly performed to obtain multiple bubble lines.

6. The method for improving the defective bubble line of a capacitive touch screen according to claim 1, characterized in that: The adjusting the initial bonding process parameters in combination with the bubble linear density per unit area to obtain target bonding process parameters includes: Calculating the difference between the bubble line density per unit area and the bubble line density threshold; Determine the laminating pressure compensation value, laminating speed compensation value and laminating time compensation value corresponding to the difference value according to a preset process parameter compensation value mapping table; The laminating pressure compensation value, the laminating speed compensation value and the laminating time compensation value are respectively added to the laminating pressure, laminating speed and laminating time in the initial laminating process parameters to obtain a target laminating pressure, a target laminating speed and a target laminating time; The target bonding pressure, the target bonding speed and the target bonding time are used as target bonding process parameters.

7. The method for improving the defective bubble line of a capacitive touch screen according to claim 1, characterized in that: After calculating the bubble line density per unit area of ​​the to-be-bonded area according to the bubble line features in the bonding image, the method further includes: When the bubble line density per unit area is less than or equal to the bubble line density threshold, obtaining the data sampling period of the area to be bonded; Calculating the density change rate of the area to be bonded according to the data sampling period and the bubble linear density per unit area; Determine the estimated bubble line density of the to-be-bonded area in the next data sampling period based on the density change rate and the bubble line density per unit area; If the estimated bubble line density is greater than the density threshold, warning information of the area to be bonded is generated.

8. A system for improving the poor bubble line of a capacitive touch screen, characterized in that: The system comprises: A data acquisition module, used to acquire the thickness data of the organic film in the area to be bonded in the capacitive touch screen and the overlap width data between the organic film and the polarizer; A process parameter determination module, used to determine initial bonding process parameters based on the organic film thickness data and the overlap width data; A bubble line density determination module is used to obtain a bonding image of the area to be bonded after the bonding operation is performed based on the initial bonding process parameters; and calculate the bubble line density per unit area of ​​the area to be bonded according to the bubble line features in the bonding image; The process parameter adjustment module is used to adjust the initial bonding process parameters in combination with the bubble line density per unit area when the bubble line density per unit area is greater than the bubble line density threshold, obtain target bonding process parameters, and perform bonding operations on the area to be bonded according to the target bonding process parameters.

9. An electronic device, characterized in that: It includes a processor, a memory, a user interface and a network interface, the memory is used to store instructions, the user interface and the network interface are used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes a method for improving defective bubble lines on a capacitive touch screen as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed, the method for improving the defective bubble line of a capacitive touch screen according to any one of claims 1 to 7 is executed.

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