Chip packaging structure

Abstract

The present invention discloses a chip packaging structure, including an outer shell, a packaging bottom plate, a packaging top plate, a heat spreader and a cover plate. The packaging bottom plate is provided with a packaging top plate, and a heat conducting plate is embedded through and fixedly connected to the top plate main body. The heat conducting plate is provided on the upper end surface of the chip main body. The packaging top plate is provided with a heat spreader, and the heat generated by the chip main body during operation can be transferred to the heat spreader through the heat conducting plate. The heat spreader is embedded through and fixedly connected to the heat spreader, and a heat dissipation groove corresponding to the position of the heat dissipation plate is provided on the cover plate. The heat dissipation plate is inserted through and sleeved in the heat dissipation groove. The heat generated by the chip main body during operation can be dissipated through the heat dissipation plate. The device can still work for a long time in a high-power environment, thereby improving the reliability of the device. By inserting the heat dissipation plate into the heat dissipation groove on the cover plate, the device has good heat dissipation and dust resistance, meets the sealing requirements of the chip packaging, and reduces the maintenance cost of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging structure. Background Art

[0002] Chip packaging is the process of encapsulating a bare chip die in a shell with a specific shape and pin structure to protect the physical structure of the chip, provide electrical connection and heat dissipation functions. The existing chip packaging structure cannot effectively dissipate heat in the high power range, causing the chip temperature to rise, affecting stability and life.

[0003] A Chinese patent application with authorization publication number CN220341215U discloses a chip packaging structure. The utility model comprises a plastic package; functional pins, including a first pin, a second pin, a third pin, a fourth pin, and a fifth pin, respectively connected to the plastic package; heat dissipation pins, including a seventh pin and an eighth pin, respectively connected to the plastic package; and high-voltage pins, including a sixth pin and a ninth pin, respectively connected to the plastic package. The heat dissipation pins have a greater width than the functional pins. This structure offers excellent heat dissipation while meeting the electrical isolation requirements of both high- and low-voltage products. Compared to traditional chip packaging structures, it can meet packaging requirements for higher power ranges.

[0004] The shortcomings of the above-mentioned existing technical solutions are: multi-chip integrated packaging is currently more common, and multi-chip integrated packaging allows multiple chips to be in a common working environment. In a high-power environment, the heat dissipation structure in the existing technology cannot meet the long-term operation of the chip. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip packaging structure to solve the technical problem that multi-chip integrated packaging is currently more common in the existing technology. Multi-chip integrated packaging enables multiple chips to be in a common working environment. In a high-power environment, the heat dissipation structure in the existing technology cannot meet the long-term operation of the chip.

[0006] The technical problem to be solved by the present invention can be achieved through the following technical solutions:

[0007] A chip packaging structure, comprising:

[0008] The heat distribution mechanism includes symmetrically distributed heat distribution plates, each of which is embedded with and fixedly connected to a heat dissipation plate;

[0009] The package bottom plate and the package top plate are provided. The package bottom plate includes a bottom plate body, on which two pin through slots are evenly distributed and opened, and pins are fixedly connected in the two pin through slots. The chip body is provided on the bottom plate body, and wire bonds are provided at both ends of the chip body. Connection ends are evenly distributed and welded on the lead bonds, and the connection ends are all welded to the pins. The package top plate includes a top plate body, on which a heat conducting plate is embedded and fixedly connected, and the heat conducting plate is provided on the upper end surface of the chip body.

[0010] The shell has symmetrical distribution and installation grooves in the shell, the installation grooves are provided with packaging bottom plates, the packaging top plates are provided with packaging top plates, and the packaging top plates are provided with heat spreaders. The installation grooves have alignment grooves, and both sides of the alignment grooves are evenly distributed and provided with pin grooves 1, and the pin grooves 2 correspond to the pin grooves 1 in position. A cover plate is clamped on the shell, and a heat dissipation groove corresponding to the position of the heat dissipation plate is provided on the cover plate, and the heat dissipation plate is inserted through the heat dissipation grooves.

[0011] As a further solution of the present invention: a connecting strip is fixedly connected to the housing, and a snap-in groove is provided on the connecting strip.

[0012] As a further solution of the present invention: the heat equalizing mechanism also includes a clamping plate, a heat equalizing tube is provided between the clamping plate and the heat equalizing plate, one end of the heat equalizing tube is fixedly connected to the heat equalizing plate, and the other end of the heat equalizing tube is fixedly connected to the clamping plate.

[0013] As a further solution of the present invention: the clamping plate is clamped in the clamping groove, the lower end surface of the heat dissipation plate contacts the upper end surface of the heat conduction plate, and the clamping plate, heat spreader, heat spreader tube and heat dissipation plate are all made of thermal conductive materials.

[0014] As a further solution of the present invention: a heat-conducting block is embedded and fixedly connected to the end surface of the top plate body, the heat-conducting block abuts against the heat spreader, and several heat-conducting blocks are evenly distributed on the top plate body, and the lower ends of the heat-conducting blocks are fixedly connected to heat-conducting pins.

[0015] As a further solution of the present invention: the thermal conductive pins correspond to the pins in position one to one, the thermal conductive pins are sleeved in the pin slot 1 and the pin slot 2, a thermal conductive gasket is provided between the thermal conductive pins and the pins, and the thermal conductive pins and the pins are abutted through the thermal conductive gasket.

[0016] As a further solution of the present invention: a card slot is provided on the shell, a card block is fixedly connected to the cover plate, and the card block of the cover plate is card-engaged with the card slot of the shell.

[0017] As a further solution of the present invention: an alignment block is fixedly connected to an end surface of the packaging base plate away from the chip body, and the alignment block is arranged in the alignment through groove.

[0018] Beneficial effects of the present invention:

[0019] 1. When the present invention is in use, the package base plate is set in the installation groove, the pin through groove two on the package base plate corresponds to the pin through groove one in the installation groove in position, and the pins are fixedly connected in the pin through groove two. The pins can be sleeved in the pin through groove one in the installation groove one by one. By setting the alignment block and the alignment through groove, it is convenient for the package base plate to be aligned in the installation groove, and at the same time, the shaking of the package base plate in the installation groove can be reduced to prevent the pins from bending. The package base plate is provided with a package top plate, and a heat conducting plate is embedded and fixedly connected to the top plate body. The heat conducting plate is provided on the upper end surface of the chip body, and the package top plate is provided with The heat spreader can transfer the heat generated by the chip body when it is working to the heat spreader through the heat conduction plate. The heat spreader is embedded and fixedly connected with a heat sink. The cover is provided with a heat dissipation groove corresponding to the position of the heat sink. The heat sink is inserted into the heat dissipation groove. The heat generated by the chip body when it is working can be dissipated through the heat spreader, so that the device can still work for a long time in a high-power environment, thereby improving the reliability of the device. By inserting the heat sink into the heat dissipation groove on the cover, the device has good heat dissipation and dust resistance, meeting the sealing requirements of the chip package and reducing the maintenance cost of the device.

[0020] 2. When the present invention is in use, the package top plate is set on the package bottom plate, the heat-conducting pins are sleeved in the pin through-slot 1 and the pin through-slot 2, a heat-conducting pad is provided between the heat-conducting pins and the pins, the heat-conducting pins and the pins are abutted by the heat-conducting pad, and the heat-conducting block is abutted against the heat-spreading plate. The heat generated by the pins when working can be transferred to the heat-spreading plate through the heat-conducting block and the heat-conducting pins, and the heat can be dissipated through the heat dissipation plate, thereby further improving the reliability of the device. After the connection terminals and the pins of the chip body are welded, the chip body is made to work and generate heat. The heat condition of the heat-conducting block on the package top plate can be observed by a thermal imager to detect the pins with poor soldering, thereby facilitating the inspection work of the chip body after welding.

[0021] 3. When the present invention is in use, the heat equalizing mechanism is set on the packaging top plate, and the heat dissipating plate of the heat equalizing mechanism is inserted into the heat dissipating groove on the cover plate. The cover plate is clamped with the clamping groove of the shell through the clamping block. The cover plate is aligned with the heat equalizing mechanism and the shell, and the alignment of the packaging bottom plate and the shell makes the overall packaging structure of the chip body easy to disassemble and assemble, and facilitates subsequent maintenance work. The heat equalizing mechanism can make the heat between the chip bodies under different load conditions evenly distributed, improve the reliability of the device, and enable the device to work for a longer time under a high load environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the structure of the present invention after assembly;

[0024] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 3 This is a schematic structural diagram of the connection relationship between the housing, the packaging bottom plate, the packaging top plate and the heat distribution mechanism of the present invention;

[0026] Figure 4 This is a schematic structural diagram of the connection relationship between the housing, the packaging bottom plate, and the packaging top plate of the present invention;

[0027] Figure 5 This is a schematic diagram of the three-dimensional structure of the housing and the connecting strip in the present invention;

[0028] Figure 6 This is a schematic diagram of the three-dimensional structure of the packaging base plate of the present invention Figure 1 ;

[0029] Figure 7 This is a schematic diagram of the three-dimensional structure of the packaging base plate of the present invention Figure 2 ;

[0030] Figure 8 This is a schematic diagram of the three-dimensional structure of the package top plate of the present invention Figure 1 ;

[0031] Figure 9 This is a schematic diagram of the three-dimensional structure of the package top plate of the present invention Figure 2 ;

[0032] Figure 10 This is a schematic diagram of the three-dimensional structure of the heat equalizing mechanism of the present invention;

[0033] Figure 11 It is a schematic diagram of the three-dimensional structure of the cover plate of the present invention.

[0034] In the figure: 1. Shell; 2. Mounting slot; 3. Alignment slot; 4. Pin slot 1; 5. Card slot; 6. Package base plate; 61. Base plate body; 62. Chip body; 63. Wire bonding; 64. Connection end; 65. Pin slot 2; 66. Pin; 67. Alignment block; 7. Package top plate; 71. Top plate body; 72. Heat conducting plate; 73. Heat conducting block; 74. Heat conducting pin; 8. Heat spreading mechanism; 81. Card plate; 82. Heat spreading plate; 83. Heat spreading pipe; 84. Heat dissipation plate; 9. Cover plate; 10. Heat dissipation slot; 11. Card block; 12. Connecting strip; 13. Card slot. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] like Figures 1-11 As shown, a chip packaging structure includes a heat spreader 8, a packaging base plate 6, and a packaging top plate 7. The heat spreader 8 includes symmetrically distributed heat spreaders 82. The heat spreaders 82 are all embedded and fixedly connected with a heat sink 84. The packaging base plate 6 includes a base plate body 61. The base plate body 61 is evenly distributed and has second pin slots 65. The second pin slots 65 are all fixedly connected with pins 66. The base plate body 61 is provided with a chip body 62. Wire bonds 63 are provided at both ends of the chip body 62. Connecting ends 64 are evenly distributed and welded on the lead bonds 63. The connecting ends 64 are all welded to pins 66. The packaging top plate 7 includes a top plate body 71. The top plate body 71 is embedded and fixedly connected with a heat conducting plate 72. The heat conducting plate 72 is provided on the upper end surface of the chip body 62.

[0037] A chip packaging structure also includes a shell 1, in which mounting grooves 2 are symmetrically distributed and opened, a packaging base plate 6 is provided in each mounting groove 2, a packaging top plate 7 is provided on each packaging base plate 6, a heat spreader 82 is provided on each packaging top plate 7, an alignment groove 3 is opened in the mounting groove 2, and pin grooves 4 are evenly distributed and opened on both sides of the alignment groove 3, and the pin grooves 2 65 correspond to the pin grooves 4 in position one by one, a cover plate 9 is clamped on the shell 1, and a heat dissipation groove 10 corresponding to the position of the heat dissipation plate 84 is opened on the cover plate 9, and the heat dissipation plate 84 is penetrated and sleeved in the heat dissipation groove 10.

[0038] A connecting strip 12 is fixedly connected to the outer shell 1, and a snap-in groove 13 is provided on the connecting strip 12. The heat equalizing mechanism 8 also includes a snap-in plate 81. A heat equalizing tube 83 is provided between the snap-in plate 81 and the heat equalizing plate 82. One end of the heat equalizing tube 83 is fixedly connected to the heat equalizing plate 82, and the other end of the heat equalizing tube 83 is fixedly connected to the snap-in plate 81. The snap-in plate 81 is snapped into the snap-in groove 13. The lower end surface of the heat dissipation plate 84 is in contact with the upper end surface of the heat conducting plate 72. The snap-in plate 81, the heat equalizing plate 82, the heat equalizing tube 83 and the heat dissipation plate 84 are all made of heat-conducting materials.

[0039] A heat-conducting block 73 is embedded and fixedly connected to the end surface of the top plate body 71. The heat-conducting block 73 abuts against the heat spreader 82. Several heat-conducting blocks 73 are evenly distributed on the top plate body 71. The lower ends of the heat-conducting blocks 73 are fixedly connected to heat-conducting pins 74. The heat-conducting pins 74 correspond to the pins 66 in position one by one. The heat-conducting pins 74 are sleeved in the pin through-slot 1 4 and the pin through-slot 2 65. A heat-conducting gasket is provided between the heat-conducting pin 74 and the pin 66, and the heat-conducting pin 74 abuts against the pin 66 through the heat-conducting gasket.

[0040] A card slot 5 is formed on the housing 1 , and a card block 11 is fixedly connected to the cover plate 9 . The card block 11 of the cover plate 9 is engaged with the card slot 5 of the housing 1 .

[0041] An alignment block 67 is fixedly connected to one end surface of the package base plate 6 away from the chip body 62. The alignment block 67 is arranged in the alignment groove 3. The arrangement of the alignment block 67 and the alignment groove 3 facilitates the alignment installation of the package base plate 6 in the installation groove 2.

[0042] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in conjunction with specific application scenarios:

[0043] When in use, the package base plate 6 is set in the mounting groove 2, and the pin through groove 2 65 on the package base plate 6 corresponds to the pin through groove 1 4 in the mounting groove 2 in position. The pin through groove 2 65 is fixedly connected with a pin 66, and the pin 66 can be sleeved in the pin through groove 1 4 in the mounting groove 2 one by one. By setting the alignment block 67 and the alignment groove 3, it is convenient for the package base plate 6 to be aligned in the mounting groove 2. At the same time, the shaking of the package base plate 6 in the mounting groove 2 can be reduced to prevent the pin 66 from bending. A package top plate 7 is provided on the package base plate 6, and a heat conducting plate 72 is embedded and fixedly connected to the top plate body 71. The heat conducting plate 72 is provided on the upper end surface of the chip body 62, and the package top plate 7 is provided. The heat spreader 82 can transfer the heat generated by the chip body 62 during operation to the heat spreader 82 through the heat conducting plate 72. A heat sink 84 is embedded and fixedly connected to the heat spreader 82. A heat dissipation groove 10 corresponding to the position of the heat sink 84 is opened on the cover plate 9. The heat sink 84 is inserted into the heat dissipation groove 10. The heat generated by the chip body 62 during operation can be dissipated through the heat sink 84, so that the device can still work for a long time in a high-power environment, thereby improving the reliability of the device. By inserting the heat sink 84 into the heat dissipation groove 10 on the cover plate 9, the device has good heat dissipation and dust resistance, meeting the sealing requirements of the chip package and reducing the maintenance cost of the device.

[0044] The package top plate 7 is set on the package bottom plate 6, and the heat-conducting pin 74 is sleeved in the pin through groove 1 4 and the pin through groove 2 65. A heat-conducting gasket is set between the heat-conducting pin 74 and the pin 66. The heat-conducting pin 74 and the pin 66 are abutted through the heat-conducting gasket. The heat-conducting block 73 is abutted against the heat-spreading plate 82. The heat generated by the pin 66 during operation can be transferred to the heat-spreading plate 82 through the heat-conducting block 73 and the heat-conducting pin 74, and the heat is dissipated through the heat dissipation plate 84, thereby further improving the reliability of the device. After the connection terminal of the chip body 62 and the pin 66 are welded, the chip body 62 is operated to generate heat. The heat condition of the heat-conducting block 73 on the package top plate 7 can be observed by a thermal imager to detect the pin 66 with a poor solder joint, thereby facilitating the inspection work of the chip body 62 after welding.

[0045] The heat equalizing mechanism 8 is set on the packaging top plate 7, and the heat dissipation plate 84 of the heat equalizing mechanism 8 passes through the heat dissipation groove 10 on the cover plate 9. The cover plate 9 is clamped with the clamping slot 5 of the shell 1 through the clamping block 11. The cover plate 9 is clamped with the heat equalizing mechanism 8 and the shell 1, and the alignment of the cover plate 9, the heat equalizing mechanism 8 and the shell 1 is coordinated with the alignment of the packaging bottom plate 6 and the shell 1, so that the overall packaging structure of the chip body 62 is easy to disassemble and assemble, and convenient for subsequent maintenance work. The heat equalizing mechanism 8 can make the heat between the chip bodies 62 under different load states uniform, improve the reliability of the device, and enable the device to work for a longer time under a high load environment.

[0046] The above describes several embodiments of the present invention in detail, but the embodiments of the present invention are not limited to these and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chip packaging structure, characterized in that: include: The heat equalizing mechanism (8) comprises symmetrically distributed heat equalizing plates (82), each of which is penetrated by a heat dissipation plate (84) embedded in and fixedly connected to the heat equalizing plates (82); A packaging base plate (6) and a packaging top plate (7), wherein the packaging base plate (6) comprises a base plate body (61), wherein two pin through slots (65) are evenly distributed and provided on the base plate body (61), wherein pins (66) are fixedly connected in the two pin through slots (65), wherein a chip body (62) is provided on the base plate body (61), wherein wire bonding (63) is provided at both ends of the chip body (62), wherein connecting ends (64) are evenly distributed and welded on the wire bonding (63), wherein the connecting ends (64) are welded to the pins (66), and wherein the packaging top plate (7) comprises a top plate body (71), wherein a heat conducting plate (72) is embedded through and fixedly connected to the top plate body (71), wherein the heat conducting plate (72) is provided on the upper end surface of the chip body (62); A shell (1) is provided, wherein the shell (1) is symmetrically distributed and provided with mounting grooves (2), each of the mounting grooves (2) is provided with a packaging bottom plate (6), each of the packaging bottom plates (6) is provided with a packaging top plate (7), each of the packaging top plates (7) is provided with a heat spreader (82), an alignment groove (3) is provided in the mounting groove (2), both sides of the alignment groove (3) are evenly distributed and provided with a first pin groove (4), the second pin groove (65) and the first pin groove (4) are in one-to-one correspondence in position, a cover plate (9) is clamped on the shell (1), a heat dissipation groove (10) corresponding to the position of the heat dissipation plate (84) is provided on the cover plate (9), and the heat dissipation plate (84) is penetrated and sleeved in the heat dissipation groove (10).

2. The chip packaging structure according to claim 1, wherein: A connecting strip (12) is fixedly connected to the housing (1), and a snap-fitting groove (13) is provided on the connecting strip (12).

3. The chip packaging structure according to claim 1, wherein: The heat equalizing mechanism (8) further comprises a clamping plate (81), a heat equalizing pipe (83) is provided between the clamping plate (81) and the heat equalizing plate (82), one end of the heat equalizing pipe (83) is fixedly connected to the heat equalizing plate (82), and the other end of the heat equalizing pipe (83) is fixedly connected to the clamping plate (81).

4. The chip packaging structure according to claim 3, wherein: The clamping plate (81) is clamped in the clamping groove (13), the lower end surface of the heat dissipation plate (84) contacts the upper end surface of the heat conduction plate (72), and the clamping plate (81), the heat spreader (82), the heat spreader tube (83) and the heat dissipation plate (84) are all made of heat-conducting materials.

5. The chip packaging structure according to claim 1, wherein: A heat conducting block (73) is embedded and fixedly connected to the end surface of the top plate body (71), and the heat conducting block (73) abuts against the heat spreader (82). Several heat conducting blocks (73) are evenly distributed on the top plate body (71), and the lower ends of the heat conducting blocks (73) are fixedly connected to heat conducting pins (74).

6. The chip packaging structure according to claim 5, characterized in that: The heat-conducting pin (74) corresponds to the pin (66) in position. The heat-conducting pin (74) is sleeved in the first pin slot (4) and the second pin slot (65). A heat-conducting pad is provided between the heat-conducting pin (74) and the pin (66). The heat-conducting pin (74) and the pin (66) are in contact with each other through the heat-conducting pad.

7. The chip packaging structure according to claim 1, wherein: A card slot (5) is provided on the housing (1), a card block (11) is fixedly connected to the cover plate (9), and the card block (11) of the cover plate (9) is card-engaged with the card slot (5) of the housing (1).

8. The chip packaging structure according to claim 1, wherein: An alignment block (67) is fixedly connected to an end surface of the packaging base plate (6) away from the chip body (62), and the alignment block (67) is arranged in the alignment groove (3).

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