Glass substrate capable of reducing stress and manufacturing method thereof

Abstract

The invention discloses a stress-reducing glass substrate and a manufacturing method thereof. The glass substrate is provided with at least two packaging substrate units, a packaging area is arranged in each packaging substrate unit, and TGV holes are formed in the packaging areas; the outer side of the boundary line of each packaging substrate unit is provided with a first sacrifice hole array and a plurality of stress release grooves surrounding each packaging substrate unit, and the inner side of the boundary line of each packaging substrate unit is provided with a second sacrifice hole array surrounding the packaging area; each hole of the stress release groove and the first sacrifice hole array is a through hole formed in the thickness direction of the glass substrate in a penetrating manner or a blind hole formed in a concave manner; each hole of the second sacrifice hole array is a through hole penetrating through the thickness direction of the glass substrate; the TGV holes, the stress release grooves, the holes of the first sacrificial hole array and the holes of the second sacrificial hole array are filled with metal materials, and the metal materials of the holes of the second sacrificial hole array are connected in series to form an electrical test link. The problem of residual stress in the TGV can be solved, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of advanced semiconductor packaging, and in particular to a glass substrate for reducing stress and a manufacturing method thereof. Background Art

[0002] Through glass via (TGV) is an electrical interconnection structure that vertically passes through a glass substrate, similar to through silicon via (TSV), and has the ability of three-dimensional interconnection. TGV three-dimensional interconnection technology is a new technology that can replace organic through-hole interconnection due to its excellent electrical and optical properties, good mechanical stability and low cost. TGV has broad application prospects in advanced packaging, integrated passive devices and optoelectronic device integration, and is considered to be a key technology for the next generation of advanced packaging.

[0003] However, the current TGV technology is not yet mature. The performance of the raw materials for forming holes is limited, the metallization of the glass substrate and the difficulty of electroplating holes with high aspect ratios (depth of through-holes / diameter of through-holes), as well as the problems of combining metal copper and ABF and other layer materials with the glass substrate have not been solved. These problems will affect the production of the product and its ultimate reliability. In addition, the TGV three-dimensional interconnection structure is complex, and the thermal stress caused by the mismatch of thermal expansion coefficients between various materials such as glass substrates, copper and ABF will also affect the performance and reliability of devices and packages. Especially in the process of cutting the whole board into units, the internal stress balance of the TGV is broken, and the stress is instantly released to the cutting edge, causing the glass to crack and the product to be scrapped.

[0004] Therefore, it is necessary to develop a new glass substrate structure to solve the problem of residual stress inside TGV, improve product yield, and meet market demand. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems in the above-mentioned technology to a certain extent. To this end, the purpose of the present invention is to provide a glass substrate with reduced stress and a method for manufacturing the same, which can solve the problem of residual stress inside TGV and improve product yield.

[0006] To achieve the above-mentioned object, the present invention provides a glass substrate for reducing stress in a first aspect, wherein the glass substrate has at least two packaging substrate units;

[0007] Each of the packaging substrate units has a packaging area, and a TGV hole is provided in the packaging area;

[0008] A first sacrificial hole array and a plurality of stress release grooves surrounding each of the packaging substrate units are provided on the outer side of the boundary line of each of the packaging substrate units, and a second sacrificial hole array surrounding the packaging area is provided on the inner side of the boundary line of each of the packaging substrate units; the stress release grooves and each hole of the first sacrificial hole array are through holes or recessed blind holes penetrating along the thickness direction of the glass substrate; each hole of the second sacrificial hole array is a through hole penetrating along the thickness direction of the glass substrate;

[0009] The TGV hole, the stress relief groove, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array are filled with metal material, and the metal material of each hole in the second sacrificial hole array is connected in series to form an electrical test link.

[0010] According to a stress-reducing glass substrate of the present invention, after packaging is completed, when each packaging substrate unit is cut, the stress release groove of the glass substrate can release the stress in the cutting process, avoid TGV interface and glass crack phenomenon caused by excessive stress, and protect the four corners of the product from being damaged by the cutting tool; the first sacrificial hole array and the second sacrificial hole array can effectively inhibit the spread of cracks on the edge of the board, and limit the cracks to the sacrificial hole array area, so as to protect the inside of the packaging area from being damaged, and at the same time, the electrical test link of the second sacrificial hole array can perform a conduction test to preliminarily determine whether the product is qualified; in addition, the bonding force between the metal material and the added layer materials such as ABF is relatively strong, and part of the sacrificial hole array can play the role of rivets, thereby enhancing the bonding force between the glass substrate and ABF around the product and avoiding TGV interface stratification; thereby, the product yield can be improved to meet market demand.

[0011] In addition, the stress-reducing glass substrate proposed in the present invention may also have the following additional technical features:

[0012] Optionally, the packaging substrate unit is rectangular, and the plurality of stress release grooves have bending grooves that are attached to outer right-angled surfaces of each packaging substrate unit.

[0013] Furthermore, the plurality of stress release grooves include a strip groove located between two adjacent bending grooves, and the strip groove is attached to the outer side surface of each packaging substrate unit.

[0014] Optionally, holes of the first sacrificial hole array are arranged in an array between two adjacent stress release grooves of each packaging substrate unit.

[0015] Optionally, a metal disk is made at the opening of each hole of the first sacrificial hole array.

[0016] Optionally, the second sacrificial hole array has at least three turns to form an electrical test link with at least three turns.

[0017] Optionally, the aperture of each hole of the first sacrificial hole array and the aperture of each hole of the second sacrificial hole array are both the same as the aperture of the TGV hole, and are both smaller than the width of the stress release groove.

[0018] Optionally, the glass substrate has a plurality of packaging substrate units distributed in an array, and at least two adjacent packaging substrate units located in the same column are divided into segmentation modules, or at least two adjacent packaging substrate units located in the same row are divided into segmentation modules; the outer side of the edge line of each segmentation module is provided with the first sacrificial hole array and the plurality of stress release grooves surrounding each segmentation module, and the inner side of the edge line of each segmentation module is provided with the second sacrificial hole array.

[0019] Optionally, the glass substrate has a first surface and a second surface opposite to each other, the first surface and the second surface are both covered with a dielectric layer, and the dielectric layer is provided with at least one metal wiring layer in the packaging area.

[0020] To achieve the above object, the second aspect of the present invention provides a method for manufacturing the above-mentioned glass substrate with reduced stress, comprising the following steps:

[0021] Providing a glass substrate, and manufacturing the stress release groove on the glass substrate;

[0022] Fabricating the TGV hole, the first sacrificial hole array, and the second sacrificial hole array on the glass substrate;

[0023] Filling metal material in the stress relief groove, the TGV hole, each hole of the first sacrificial hole array, and each hole of the second sacrificial hole array;

[0024] Fabricating an inner layer circuit on the packaging area of ​​each packaging substrate unit, connecting the metal materials of each hole in the second sacrificial hole array in series to fabricate the electrical test link, and fabricating a metal disk at the opening of each hole in the first sacrificial hole array;

[0025] Adding wiring layers on the inner layer circuits in the packaging area to produce a rewiring structure.

[0026] According to a method for manufacturing a glass substrate with reduced stress of the present invention, the glass substrate structure manufactured by the method can release the stress caused by the mismatch of thermal expansion coefficients of the materials, protect the four corners of the finished product from being damaged by the cutting tool, and the sacrificial hole array can prevent the edge cracks from spreading to the internal graphics. At the same time, the conductivity of the electrical test chain can preliminarily judge the reliability of the product, improve the product yield, and meet the market demand.

[0027] Optionally, laser cutting is performed on the glass substrate to produce the stress release groove.

[0028] Optionally, laser-induced deep etching is performed on the glass substrate to produce the TGV holes, the first sacrificial hole array, and the second sacrificial hole array.

[0029] Optionally, the step of filling metal material in the stress relief groove, the TGV hole, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array comprises:

[0030] forming a seed layer on the first and second surfaces opposite to each other of the glass substrate, the inner wall of the TGV hole, the inner wall of the stress release groove, the inner wall of each hole of the first sacrificial hole array, and the inner wall of each hole of the second sacrificial hole array;

[0031] A metal conductive layer is formed on the seed layer of the TGV hole, the stress release groove, each hole of the first sacrificial hole array, and each hole of the second sacrificial hole array.

[0032] Optionally, the metal conductive layer is formed on the seed layer of the TGV hole, the stress release groove, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array by a subtractive method or a modified semi-additive method, and an inner layer circuit is made on the packaging area, the metal materials of each hole in the second sacrificial hole array are connected in series to produce the electrical test link, and a metal disk is made at the opening of each hole of the first sacrificial hole array. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is the stress distribution diagram of the glass substrate;

[0034] Figure 2 is a top view of a glass substrate having a stress release groove according to an embodiment of the present invention;

[0035] Figure 3 A top view of a glass substrate with reduced stress according to an embodiment of the present invention;

[0036] Figure 4 for Figure 3 A partial enlarged view of

[0037] Figure 5 This is a process flow chart of a method for manufacturing a glass substrate with reduced stress according to an embodiment of the present invention;

[0038] Figures 6A-6G It is a cross-sectional schematic diagram of a single packaging substrate unit in each step of the method for manufacturing a glass substrate with reduced stress in an embodiment of the present invention;

[0039] Figure 7 A top view of a single packaging substrate unit of a glass substrate with reduced stress according to an embodiment of the present invention;

[0040] Figures 8A-8G A schematic cross-sectional view of a single package substrate unit in various steps of manufacturing a redistribution structure on a stress-reducing glass substrate according to an embodiment of the present invention;

[0041] Description of labels:

[0042] Segmentation module 10;

[0043] Package substrate unit 100, package area 110, TGV hole 111;

[0044] A first sacrificial hole array 200;

[0045] Stress release groove 300, bending groove 310, strip groove 320;

[0046] A second sacrificial hole array 400;

[0047] Metal material 500, seed layer 510, metal conductive layer 520;

[0048] Rewiring structure 600 . DETAILED DESCRIPTION

[0049] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0050] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0051] Please refer to Figure 1 ,exist Figure 1 (a) shows that the residual stress in the TGV of the existing glass substrate is distributed in all directions, and the maximum stress is at the interface between the TGV and the build-up material and the four corners of the glass substrate. Excessive horizontal stress will lead to TGV interface delamination and cracks in the corners of the glass substrate. Especially in the process of cutting the whole plate into units, the internal stress balance of the TGV is broken, and the stress is instantly released to the cutting edge, causing the glass to crack and the product to be scrapped.

[0052] To this end, the present application provides a stress-reducing glass substrate, which has at least two packaging substrate units 100; each packaging substrate unit 100 has a packaging area 110, and a TGV hole 111 is provided in the packaging area 110; the outer side of the boundary line of each packaging substrate unit 100 is provided with a first sacrificial hole array 200 and a plurality of stress release grooves 300 surrounding each packaging substrate unit 100, and the inner side of the boundary line of each packaging substrate unit 100 is provided with a second sacrificial hole array 400 surrounding the packaging area 110; the stress release groove 300 and each hole of the first sacrificial hole array 200 are through holes or recessed blind holes arranged along the thickness direction of the glass substrate; each hole of the second sacrificial hole array 400 is a through hole arranged along the thickness direction of the glass substrate; the TGV hole 111, the stress release groove 300, each hole of the first sacrificial hole array 200 and each hole of the second sacrificial hole array 400 are all filled with metal material 500, and the metal materials of each hole in the second sacrificial hole array 400 are connected in series to form an electrical test link.

[0053] Therefore, if Figure 1 As shown in (b), the simulation results show that the stress release groove 300 can effectively release the surface stress caused by the mismatch of thermal expansion coefficients between the added layer material and the glass substrate; at the same time, due to the existence of the stress release groove 300, the four corners of the unit do not directly contact the tool during the subsequent cutting of the finished product, thereby protecting the four corners from being damaged by the tool. When there are glass-based cracks caused by factors such as mismatch of material thermal expansion coefficients and defects on the edge of the unit after cutting, the first sacrificial hole array 200 and the second sacrificial hole array 400 can prevent the cracks from spreading and limit the cracks to the sacrificial hole array area, thereby protecting the internal structure of the unit from being damaged. At the same time, an electrical test link is made in the second sacrificial hole array 400 area of ​​the glass substrate. After the finished product is completed, a window is opened to expose the electrical test link, and then it is cut into unit finished products. A conduction test is performed to preliminarily determine whether the product is qualified.

[0054] Based on this, please refer to Figures 2 to 4In a specific embodiment of the present invention, a glass substrate for reducing stress is provided, by arranging a first sacrificial hole array 200 and a plurality of stress release grooves 300 surrounding the packaging substrate unit 100 on the outer side of the boundary line of the packaging substrate unit 100, and arranging a second sacrificial hole array 400 surrounding the packaging area 110 on the inner side of the boundary line of the packaging substrate unit 100; that is, a stress release groove and a sacrificial hole array of a certain length and width are opened around the Unit. The size of the stress release groove varies according to the size of the Unit. Among them, the stress release groove 300 and each hole of the first sacrificial hole array 200 are through holes or recessed blind holes that are arranged along the thickness direction of the glass substrate; more specifically, in the present embodiment, the stress release groove 300 and each hole of the first sacrificial hole array 200 are through holes that are arranged along the thickness direction of the glass substrate, and each hole of the second sacrificial hole array 400 is a through hole that is arranged along the thickness direction of the glass substrate.

[0055] Then, the TGV hole 111, the stress relief groove 300, each hole of the first sacrificial hole array 200 and each hole of the second sacrificial hole array 400 are filled with metal material 500, and the metal materials of each hole in the second sacrificial hole array 400 are connected in series to form an electrical test link. In this way, the TGV hole 111 can form a conductive through hole.

[0056] As an example, the package substrate unit 100 is rectangular, and the plurality of stress release grooves 300 have bending grooves 310 that fit the outer right-angle surface of each package substrate unit 100. It can be understood that the shape of the stress release groove 300 is designed to match the outer contour of the package substrate unit 100. Figure 3 As shown, the package substrate unit 100 is rectangular, and bending grooves 310 that fit the outer right-angle surfaces are provided at the four right angles of the rectangle.

[0057] Furthermore, the plurality of stress release grooves 300 have a strip groove 320 located between two adjacent bending grooves 310, and the strip groove 320 is attached to the outer surface of each packaging substrate unit 100. In other words, the strip grooves 320 are symmetrically arranged on the four sides of the rectangular packaging substrate unit 100; this can better ensure that the four corners of the unit do not directly contact the tool during the subsequent finished product cutting, thereby protecting the four corners from being damaged by the tool.

[0058] Combination Figure 4, regarding the arrangement of the sacrificial hole array, in this embodiment, the holes of the first sacrificial hole array 200 are arranged in an array between two adjacent stress release grooves 300 of each packaging substrate unit 100; that is, the first sacrificial hole array 200 is arranged in an array around the four outer sides of the rectangular packaging substrate unit 100, wherein the array is interrupted at the position corresponding to the stress release groove 300. The second sacrificial hole array 400 is arranged around the packaging area 110, and is also arranged adjacent to the boundary line of the packaging substrate unit 100. In this embodiment, the second sacrificial holes 400 on the four inner sides of the rectangular packaging substrate unit 100 are all centered on the boundary line, and are mirror-symmetrical with the first sacrificial hole array 200 on the outer side; and the array of the second sacrificial hole array 400 is continuous on the inner side of the boundary line.

[0059] As an example, the aperture of each hole of the first sacrificial hole array 200 and the aperture of each hole of the second sacrificial hole array 400 are the same as the aperture of the TGV hole 111, and are both smaller than the width of the stress release groove 300. This facilitates the uniform production of the holes and can better prevent crack propagation.

[0060] More specifically, the first sacrificial hole array 200 is a sacrificial hole array having at least three circles arranged around the rectangular package substrate unit 100; similarly, the second sacrificial hole array 400 is also a sacrificial hole array having at least three circles arranged; thus, at least three circles of electrical test links can be formed on the second sacrificial hole array 400. Of course, in other examples, the number of circles of the sacrificial hole array can vary according to the size of the package area 110.

[0061] More specifically, when the three-circle electrical test link of the second sacrificial hole array 400 is used to preliminarily judge whether a product is qualified, the judgment criteria are as shown in Table 1.

[0062] Table 1. Judgment of the test results of the electrical test link conduction in the sacrificial hole array area

[0063]

[0064] As an example, a metal plate is made at the opening of each hole of the first sacrificial hole array 200. The metal plate can act as a rivet to further enhance the bonding force between the glass substrate and the build-up layer material such as ABF.

[0065] In addition, if Figure 3 and Figure 4As shown, as an example, the glass substrate has a plurality of packaging substrate units 100 distributed in an array, at least two adjacent packaging substrate units 100 located in the same column are divided into segmentation modules 10, or at least two adjacent packaging substrate units 100 located in the same row are divided into segmentation modules 10; the outer side of the edge line of each segmentation module 10 is provided with a first sacrificial hole array 200 and a plurality of stress release grooves 300 surrounding each segmentation module 10, and the inner side of the edge line of each segmentation module 10 is provided with a second sacrificial hole array. It can be understood that after the provided glass substrate is manufactured as a finished product, the large module can be cut first, and then each packaging substrate unit 100 can be segmented to cut into unit finished products. For the segmentation of the large module, the above-mentioned first sacrificial hole array 200, stress release groove 300 and second sacrificial hole array 400 are also provided on the edge line of the segmentation module 10 of the glass substrate. Thus, the stress release groove 300 can effectively release the surface stress caused by the mismatch of thermal expansion coefficients between the build-up material and the glass substrate; at the same time, due to the presence of the stress release groove 300, the four corners of the segmentation module 10 do not directly contact the tool during cutting, thereby protecting the four corners from being damaged by the tool. When there are glass-based cracks caused by factors such as mismatch of material thermal expansion coefficients and defects on the edge of the segmentation module after cutting, the first sacrificial hole array 200 and the second sacrificial hole array 400 can prevent the cracks from spreading and limit the cracks to the sacrificial hole array area, thereby protecting the internal structure of the segmentation module 10 from being damaged.

[0066] Specifically, if Figure 3 As shown, in this embodiment, two adjacent package substrate units 100 located in the same column are divided into segmentation modules 10; when cutting, the segmentation modules 10 are cut first, and then each package substrate unit 100 is cut. Among them, the layout position and number of circles of the stress release groove 300, the first sacrificial hole array 200 and the second sacrificial hole array 400 of each segmentation module 10 are the same as those of each package substrate unit 100 described above, and the difference is that the second sacrificial hole array 400 on the segmentation module 10 is not designed for an electrical test link.

[0067] As an example, the glass substrate has a first surface and a second surface opposite to each other. Figure 3 Based on the glass substrate shown, the glass substrate can be packaged, for example, the first surface and the second surface are covered with a dielectric layer, and the dielectric layer is provided with at least one metal wiring layer in the packaging area 110, so that a redistribution structure can be produced. After the redistribution structure is produced, solder mask processing and chip packaging and other existing board-level packaging operations can be performed.

[0068] On the other hand, the method for manufacturing the above-mentioned stress-reducing glass substrate can be found in Figure 5 , which is shown as a process flow chart of the manufacturing method, comprising the following steps:

[0069] S1: providing a glass substrate, and manufacturing the stress release groove on the glass substrate;

[0070] S2: manufacturing the TGV hole, the first sacrificial hole array and the second sacrificial hole array on the glass substrate;

[0071] S3: filling metal material in the stress release groove, the TGV hole, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array;

[0072] S4: making inner layer circuits on the packaging area of ​​each packaging substrate unit, connecting metal materials of each hole in the second sacrificial hole array in series to make the electrical test link, and making metal plates at the openings of each hole in the first sacrificial hole array;

[0073] S5: Adding wiring layers on the inner layer circuits in the packaging area to produce a rewiring structure.

[0074] The method firstly makes the above-mentioned stress release groove 300 at the corresponding position of the glass substrate, and then continues to make the above-mentioned TGV hole 111, the first sacrificial hole array 200 and the second sacrificial hole array 400 at the corresponding position on the glass substrate; then fill the stress release groove 300, the TGV hole 111, each hole of the first sacrificial hole array 200 and each hole of the second sacrificial hole array 400 with metal material 500; then, make inner layer circuits on the packaging area 110 of each packaging substrate unit 100, connect the metal materials of each hole in the second sacrificial hole array 400 in series to make an electrical test link, and make metal plates at the openings of each hole of the first sacrificial hole array 200; finally, add layers of wiring on the inner layer circuits in the packaging area 110 to make a rewiring structure 600.

[0075] As a result, the produced glass substrate structure can release the stress caused by the mismatch of material thermal expansion coefficients and protect the four corners of the finished product from damage by cutting tools. The sacrificial hole array can prevent edge cracks from spreading to internal graphics. At the same time, the conductivity of the electrical test chain can preliminarily judge the product reliability, improve product yield, and meet market demand.

[0076] For more information, see Figures 6A-6G A cross-sectional schematic diagram of a single package substrate unit showing each step of the method for manufacturing the stress-reducing glass substrate is shown.

[0077] like Fig. 6AAs shown, first, a glass substrate is provided, wherein the thickness of the glass substrate is between 0.2-1.6 mm, and the length and width are greater than 50×50 mm. The glass substrate has high heat resistance, extremely low Df (Dissipation factor), and high Young's modulus. Compared with traditional organic substrates, the glass substrate is not limited in size and has the advantages of low cost, strong mechanical stability, and excellent high-frequency electrical properties. Next, a groove is cut out of the glass substrate using a nanosecond laser, a picosecond laser, or a femtosecond laser. After laser-induced hole formation, the entire plate is etched together to produce a stress release groove 300; wherein the production position of the stress release groove 300 is as shown in Figure 2 As shown. Finally, the above-mentioned glass substrate is laser induced and deeply etched to obtain the TGV hole 111 and the sacrificial hole array (the first sacrificial hole array 200 and the second sacrificial hole array 300). The aperture of each hole in the sacrificial hole array is consistent with the TGV hole (100μm), and the spacing is consistent with the TGV minimum spacing (200μm). The principle of laser induction is to use a pulsed laser to act on the glass surface to produce a denatured area. The etching rate of the denatured area in the hydrofluoric acid system or the alkaline system is faster than that of the undenatured area. Based on this phenomenon, through holes and blind holes can be made on the glass. This technology has a fast hole forming rate, uniform quality, good hole diameter consistency, and no cracks around the hole. Due to the difference in etching rates between the denatured and non-denatured areas, this technology can control the verticality of the hole wall by adjusting the laser parameters. Since the etching solution etches the glass isotropically, the final stress release groove is 0.3mm wide and 6mm long. The production positions of the TGV hole 111 and the sacrificial hole array are shown as follows Figure 3 and Figure 4 As shown, three circles of sacrificial hole arrays can be formed inside and outside the edge of the unit and array graphics at the same time.

[0078] Afterwards, the metal material 500 is filled into the stress release groove 300 , the TGV hole 111 , each hole of the first sacrificial hole array 200 , and each hole of the second sacrificial hole array 400 .

[0079] Specifically, first Figure 6B As shown, the glass substrate is metallized, that is, a seed layer 510 is formed on the first and second opposite surfaces of the glass substrate and the inner wall of the TGV hole 111, the inner wall of the stress release groove 300, the inner wall of each hole of the first sacrificial hole array 200 and the inner wall of each hole of the second sacrificial hole array 400.

[0080] More specifically, the above-mentioned glass substrate is metallized by physical vapor deposition (PVD) to provide a seed layer 510 for subsequent electroplating. The specific method is: under vacuum conditions, glow discharge is generated between the cathode and the anode, the gas molecules between the electrodes are ionized and charged, and the positive ions are accelerated by the negative potential of the cathode to collide with the target material, sputtering the atoms on the target material, and the sputtered atoms are then deposited on the substrate of the anode to form a metal film. The process includes degassing → plasma etching → sputtering titanium → sputtering copper. The degassing temperature is 60-150°C, the time is 30-3000s, the gas used for plasma etching is one or more of oxygen, carbon tetrafluoride, and argon, the power is 500-5000w, and the processing time is 1-8min. In addition to PVD, glass substrate metallization technology also includes metal oxide sintering, Polymer+chemical copper deposition, etc., and the appropriate metallization method should be selected according to the product design.

[0081] Then as Figure 6C-6G As shown, after the above PVD sputtering is completed, the metal material 500 is filled in the stress release groove 300, the TGV hole 111, each hole of the first sacrificial hole array 200 and each hole of the second sacrificial hole array 400 by using the subtractive method; and the inner layer circuit is made on the packaging area 110 of each packaging substrate unit 100, the metal material of each hole in the second sacrificial hole array 400 is connected in series to make an electrical test link, and a metal plate is made at the opening of each hole of the first sacrificial hole array 200. Of course, in other examples, it can also be achieved by using a modified semi-additive method (mSAP) of applying a dry film for exposure and development after PVD metallization, electroplating and filling holes + patterning, and then film stripping, flash etching of copper + etching of titanium.

[0082] In this embodiment, if Figure 6C As shown, a metal conductive layer 520 is formed on the surface of the seed layer 510, and the metal conductive layer 520 fills the TGV hole 111, the stress release groove 300, each hole of the first sacrificial hole array 200 and each hole of the second sacrificial hole array 400 and covers the seed layer 510 on the first surface and the second surface. That is to say, after the above-mentioned PVD sputtering is completed, the hole filling electroplating is performed on the glass substrate to fill the stress release groove 300, each hole of the sacrificial hole array and the glass through hole with metal copper, and the final copper layer thickness is about 15μm. The electroplating method adopts one of VCP, SPP, horizontal electroplating and the like.

[0083] Subsequently, inner layer circuits are fabricated on the packaging area 110 of each packaging substrate unit 100 , metal materials of each hole in the second sacrificial hole array 400 are connected in series to fabricate an electrical test link, and metal plates are fabricated at the openings of each hole in the first sacrificial hole array 200 .

[0084] Specifically, if Fig.6D As shown, a dry film is first formed on the metal conductive layer 520. A vacuum laminating machine can be used to double-side dry film on both sides of the glass substrate. The dry film is composed of three parts: polyethylene film (PE), photoresist film and polyester film (PET), and has the function of blocking electroplating and etching. Ultraviolet irradiation can cause the dry film to polymerize, and the material can remain on the surface of the substrate to form an anti-corrosion and anti-plating layer after polymerization and curing. Then, as Fig. 6E and 6F As shown, the dry film is exposed and developed, and the metal conductive layer 520 and the seed layer 510 exposed after development are etched. That is to say, exposure and development are performed after the above-mentioned dry film is attached. The effect of exposure is to cure the dry film to form an anti-corrosion and anti-plating layer. According to the different types of dry films used, the exposure machine can select one or more of g-line, i-line, and h-line for combined use. The light source used by the exposure machine is a pick lamp, a high-pressure mercury lamp, an iodine gallium lamp and other light sources. The effect of development is to remove the dry film in the unexposed area to expose the circuit pattern. The developer can be sodium hydroxide, sodium carbonate, sodium bicarbonate, etc. Etching is to etch and remove the electroplated copper layer, sputtered copper layer and sputtered titanium layer in the development area in turn to produce the core layer pattern. The copper layer etching solution adopts a sulfuric acid hydrogen peroxide system, and the titanium layer etching solution is a mixture of various aqueous solutions such as fluoride (HF, etc.), oxidizing acid (HNO3, H2O2, etc.), non-oxidizing salt (NaHCO3, etc.), alkali metal hydroxide (NaOH, KOH), etc. Titanium layer etching can also be done by dry etching using techniques such as ion milling, reactive ion etching, and plasma etching. Figure 6G As shown, the dry film is removed to form the inner layer circuit, the electrical test link and the metal plate on each package substrate unit 100. The dry film can be removed from the copper surface using a strong alkaline solution.

[0085] like Figure 7 As shown, only the second sacrificial hole array 400 area inside the unit (package substrate unit 100) is made into an electrical test chain for subsequent finished product testing. The remaining sacrificial hole array areas are only made into copper plates to act as rivets to enhance the bonding strength between the glass substrate and the build-up materials such as ABF.

[0086] Finally, based on the above-mentioned glass substrate, wiring layers can be added on the inner layer circuit of the packaging area 111 to produce a rewiring structure 600. In this embodiment, the rewiring structure 600 is made by adding layers using ABF film, and the number of added layers is selected according to actual conditions. Figures 8A-8G As shown, the first redistribution layer of the redistribution structure 600 is produced on the inner layer circuit of the packaging area 111 by attaching ABF film → laser drilling → chemical Desmear removal + copper PTH → dry film attachment → exposure → development → electroplating → film removal → etching on both sides of the glass substrate.

[0087] Specifically, first, Fig. 8A As shown, ABF films are formed on both the first surface and the second surface of the glass substrate. ABF film pasting is to press ABF films on the upper and lower surfaces of the glass substrate. ABF material has low thermal expansion coefficient, low dielectric loss, easy processing of fine circuits, good mechanical properties and good durability.

[0088] Then, if Figure 8B As shown, laser drilling is performed on the ABF film in the encapsulation area 110 of the glass substrate to obtain a blind hole. The blind hole diameter is ≤60μm, and the disk diameter is ≤80μm. Here, one of a UV laser drilling machine, a CO2 laser drilling machine, an excimer laser, and an ultrafast laser drilling machine can be used. The laser used is one of a continuous laser, a quasi-continuous laser, a nanosecond laser, a picosecond laser, and a femtosecond laser.

[0089] Then, if Figure 8C As shown, chemical copper deposition is performed. After the above drilling is completed, chemical copper plating is used to form a copper layer, which is orange-red and has a thickness of 5-15μm. The overall gloss is required to be uniform, the backlight level is ≥9, and the board surface cannot have severe oxidation, fiber filaments, fingerprints, etc. The main components of the plating solution are copper sulfate, potassium sodium tartrate, sodium hydroxide, formaldehyde, ethylenediaminetetraacetic acid, triethanolamine, sodium carbonate, deionized water, etc.

[0090] Finally, if Figure 8D-8G As shown, after copper plating, dry film is attached on the copper layer formed by chemical copper plating → exposure and development → electroplating (graphic electroplating is performed after the above exposure and development, and the circuit can meet the 8 / 8μm line width spacing. The electroplating method adopts one of VCP, SPP, and horizontal electroplating) → film stripping and etching (after the graphic electroplating is completed, the dry film is removed, and the non-graphic area copper layer is etched away); after completing this series of processes, the production of a layer of graphic circuits on the ABF film is completed (that is, the production of the first rewiring layer of the rewiring structure 600). Subsequently, a second rewiring layer can be added on the first rewiring layer of the rewiring structure 600. Among them, the specific number of layers of the rewiring layer of the rewiring structure 600 can be designed according to the actual application needs. The way of adding layers is to repeat the above Figures 8A-8G The process involved is to produce the added layer circuit.

[0091] At this point, the manufacturing of the glass substrate with reduced stress is completed, so as to provide a glass substrate that can solve the problem of residual stress inside the TGV and improve the product yield.

[0092] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0093] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0094] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0095] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0097] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A glass substrate with reduced stress, characterized in that: The glass substrate has at least two packaging substrate units; Each of the packaging substrate units has a packaging area, and a TGV hole is provided in the packaging area; A first sacrificial hole array and a plurality of stress release grooves are provided on the outer side of the boundary line of each packaging substrate unit surrounding each packaging substrate unit, and a second sacrificial hole array is provided on the inner side of the boundary line of each packaging substrate unit surrounding the packaging area; The stress release groove and each hole of the first sacrificial hole array are through holes or recessed blind holes arranged along the thickness direction of the glass substrate; each hole of the second sacrificial hole array is a through hole arranged along the thickness direction of the glass substrate; The TGV hole, the stress relief groove, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array are filled with metal material, and the metal material of each hole in the second sacrificial hole array is connected in series to form an electrical test link.

2. The stress-reduced glass substrate according to claim 1, wherein: The packaging substrate unit is rectangular in shape, and the plurality of stress release grooves include bending grooves that are attached to outer right-angled surfaces of the packaging substrate units.

3. The stress-reduced glass substrate according to claim 2, wherein: The plurality of stress release grooves include a strip groove located between two adjacent bending grooves, and the strip groove is attached to the outer side surface of each packaging substrate unit.

4. The stress-reduced glass substrate according to claim 1, wherein: The holes of the first sacrificial hole array are arranged in an array between two adjacent stress release grooves of each packaging substrate unit.

5. The stress-reduced glass substrate according to claim 1, wherein: A metal plate is made at the opening of each hole of the first sacrificial hole array.

6. The stress-reduced glass substrate according to claim 1, wherein: The second sacrificial hole array has at least three turns to form an electrical test link with at least three turns.

7. The stress-reduced glass substrate according to claim 1, wherein: The aperture of each hole of the first sacrificial hole array and the aperture of each hole of the second sacrificial hole array are both the same as the aperture of the TGV hole, and are both smaller than the width of the stress release groove.

8. The stress-reduced glass substrate according to any one of claims 1 to 7, wherein: The glass substrate has a plurality of packaging substrate units distributed in an array, and at least two adjacent packaging substrate units located in the same column are divided into segmentation modules, or at least two adjacent packaging substrate units located in the same row are divided into segmentation modules; the first sacrificial hole array and a plurality of stress release grooves surrounding each segmentation module are provided on the outer side of the edge line of each segmentation module, and the second sacrificial hole array is provided on the inner side of the edge line of each segmentation module.

9. The stress-reduced glass substrate according to claim 1, wherein: The glass substrate has a first surface and a second surface opposite to each other. The first surface and the second surface are both covered with a dielectric layer. The dielectric layer is provided with at least one metal wiring layer in the packaging area.

10. A method for manufacturing a glass substrate with reduced stress according to any one of claims 1 to 9, characterized in that: The following steps are involved: Providing a glass substrate, and manufacturing the stress release groove on the glass substrate; Fabricating the TGV hole, the first sacrificial hole array, and the second sacrificial hole array on the glass substrate; Filling metal material in the stress relief groove, the TGV hole, each hole of the first sacrificial hole array, and each hole of the second sacrificial hole array; Fabricating an inner layer circuit on the packaging area of ​​each packaging substrate unit, connecting the metal materials of each hole in the second sacrificial hole array in series to fabricate the electrical test link, and fabricating a metal disk at the opening of each hole in the first sacrificial hole array; Adding wiring layers on the inner layer circuits in the packaging area to produce a rewiring structure.

11. The method for manufacturing a glass substrate with reduced stress according to claim 10, wherein: Laser cutting is performed on the glass substrate to form the stress release groove.

12. The method for manufacturing a glass substrate with reduced stress according to claim 10, wherein: Laser-induced deep etching is performed on the glass substrate to produce the TGV holes, the first sacrificial hole array, and the second sacrificial hole array.

13. The method for manufacturing a glass substrate with reduced stress according to claim 10, wherein: The step of filling the stress release groove, the TGV hole, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array with metal material comprises: forming a seed layer on the first and second surfaces opposite to each other of the glass substrate, the inner wall of the TGV hole, the inner wall of the stress release groove, the inner wall of each hole of the first sacrificial hole array, and the inner wall of each hole of the second sacrificial hole array; A metal conductive layer is formed on the seed layer of the TGV hole, the stress release groove, each hole of the first sacrificial hole array, and each hole of the second sacrificial hole array.

14. The method for manufacturing a glass substrate with reduced stress according to claim 13, wherein: The metal conductive layer is formed on the seed layer of the TGV hole, the stress release groove, each hole of the first sacrificial hole array and each hole of the second sacrificial hole array by adopting a subtractive method or a modified semi-additive method, and an inner layer circuit is made on the packaging area, the metal materials of each hole in the second sacrificial hole array are connected in series to produce the electrical test link, and a metal disk is made at the opening of each hole of the first sacrificial hole array.

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