Wafer structure of high-speed connector

By using shielding members and grounding terminal pieces in the high-speed connector waffer structure to form a full-packet shielding structure, and using the shrapnel structure to enhance contact density, the problem of insufficient signal shielding effect in the prior art is solved, and stronger signal transmission is achieved performance.

CN119401176AActive Publication Date: 2025-02-07SHENZHEN XIDIAN PRECISION TECH CO LTD

Patent Information

Application Number
CN202510009173.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-03
Publication Date
2025-02-07
Estimated Expiration
2045-01-03

AI Technical Summary

Technical Problem

The existing high-speed connector waffer structure cannot meet the performance requirements of high-speed signal transmission, especially in terms of signal shielding effect.

Method used

Using a shielding member composed of the first shielding piece, the second shielding piece and the connecting piece, the shielding chamber is divided into multiple shielding channels through the grounding terminal piece to form a full-packed shielding structure, and the grounding terminal piece and the connector are enhanced by the shrapnel structure. contact density.

Benefits of technology

It significantly improves the signal shielding effect, forms a stronger all-pack shielding structure, improves signal transmission performance, and ensures contact stress balance through the shrapnel structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a high-speed connector wafer structure, which comprises a plurality of groups of signal terminals, the two ends of each signal terminal are respectively connected with a connector and a PCB (Printed Circuit Board), the high-speed connector wafer structure also comprises a shielding piece consisting of a first shielding sheet, a second shielding sheet and a connecting sheet, the first shielding sheet and the second shielding sheet are fixed through the connecting sheet, and the first shielding sheet and the second shielding sheet are connected through the connecting sheet. A shielding chamber is formed among the first shielding sheet, the second shielding sheet and the connecting sheet; the high-speed connector wafer structure comprises a shielding chamber, a plurality of signal terminals and a plurality of grounding terminal sheets, the plurality of grounding terminal sheets penetrate through the interior of the shielding chamber and divide the shielding chamber into a plurality of shielding channels, and the plurality of signal terminals are respectively located in the plurality of shielding channels. On the basis that the overall shielding effect is achieved through the first shielding sheet, the second shielding sheet and the connecting sheet, the shielding chamber is divided into a plurality of shielding channels through the grounding terminal sheet, a full-wrapping shielding structure is formed, and the shielding effect on the signal terminal is further improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of high-speed connectors, in particular to a high-speed connector wafer structure. Background Art

[0002] With the development of science and technology, the performance requirements for high-speed signal transmission are getting higher and higher. However, the existing structure cannot meet the performance requirements, and a new structure is needed to support the requirements for performance transmission. To this end, we propose a high-speed connector wafer structure. Summary of the invention

[0003] The object of the present invention is to provide a high-speed connector wafer structure to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a high-speed connector wafer structure, comprising a plurality of signal terminals, both ends of which are connected to the connector and the PCB board respectively, and further comprising: A shielding member composed of a first shielding sheet, a second shielding sheet and a connecting sheet, wherein the first shielding sheet and the second shielding sheet are fixed by the connecting sheet, and a shielding chamber is formed between the first shielding sheet, the second shielding sheet and the connecting sheet; A plurality of grounding terminal plates are provided, wherein the plurality of grounding terminal plates penetrate the interior of the shielding room and divide the shielding room into a plurality of shielding channels, and the plurality of signal terminals are respectively located in the plurality of shielding channels.

[0005] Preferably, a spring structure is provided at one end of the ground terminal piece where the signal terminal is connected to the connector, and the spring structure is used to bring the ground terminal piece into close contact with the connector.

[0006] Preferably, the spring structure includes a first spring and a second spring made of elastic material, one end of each of the first spring and the second spring are fixed to the ground terminal sheet at one end where the signal terminal is connected to the connector, and the first spring and the second spring are distributed in a U-shaped structure for clamping a plug inserted between the first spring and the second spring.

[0007] Preferably, two second elastic sheets are provided, and the first elastic sheet is located at the center of the two second elastic sheets.

[0008] Preferably, the first elastic piece and the second elastic piece are respectively provided with outwardly inclined surfaces at one end away from the ground terminal piece.

[0009] Preferably, a plurality of first protrusions are respectively provided on both sides of the grounding terminal piece, and the first shielding piece and the second shielding piece are provided with first through holes matching with the first protrusions, and the first protrusions on both sides of the grounding terminal piece are respectively fixedly inserted into the first through holes on the first shielding piece and the second shield.

[0010] Preferably, it also includes a connecting terminal for contacting the shielding member with the PCB board, the connecting terminal includes a first terminal, a second terminal and a third terminal, the first terminal and the second terminal are respectively fixed to the first shielding plate and the second shielding plate, and the third terminal is fixed to the ground terminal plate.

[0011] Preferably, the first shielding sheet and the connecting sheet are an integral structure, a second protrusion is fixed to the end of the connecting sheet away from the first shielding sheet, a second through hole cooperating with the second protrusion is provided on the second shielding sheet, and the second protrusion is fixedly inserted into the second through hole.

[0012] Preferably, it further comprises a main body rubber, a part of which is clamped between the first shielding sheet and the second shielding sheet, and the signal terminal and the ground terminal sheet are respectively embedded in the main body rubber.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. Compared with the traditional high-speed connector wafer structure, the high-speed connector wafer structure disclosed in the present application has a better shielding effect on the signal. On the basis of the overall shielding effect achieved by the first shielding sheet, the second shielding sheet and the connecting sheet, the shielding room is divided into multiple shielding channels by the grounding terminal sheet to form a full-enclosed shielding structure, which further improves the shielding effect on the signal terminal.

[0014] 2. The first spring sheet and the second spring sheet can clamp the plug after insertion, so that the ground terminal piece and the connector are in closer contact. Spring sheets are provided on both sides of the plug to ensure balanced contact force.

[0015] 3. The first terminal, the second terminal and the third terminal are synchronously connected to the PCB board, thereby improving the shielding effect and making the signal transmission performance of the signal terminal 1 stronger. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the connecting terminal structure of the present invention; Figure 3 This is a schematic diagram of the structure of the shielding room of the present invention; Figure 4 This is a schematic diagram of the shielding channel structure of the present invention; Figure 5 It is a schematic diagram of the structure of the spring piece of the present invention; Figure 6 for Figure 2 A magnified image of the middle A area; Figure 7 for Figure 3 Enlarged view of area B.

[0017] In the figure: 1. signal terminal; 2. first shielding plate; 3. second shielding plate; 4. connecting plate; 5. shielding member; 6. shielding chamber; 7. grounding terminal plate; 8. shielding channel; 9. spring structure; 10. first spring; 11. second spring; 12. inclined surface; 13. first protrusion; 14. first through hole; 15. connecting terminal; 16. first terminal; 17. second terminal; 18. third terminal; 19. second protrusion; 20. second through hole; 21. main rubber. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-4 The present invention provides a technical solution: a high-speed connector wafer structure, comprising a plurality of groups of signal terminals 1, wherein both ends of the signal terminals 1 are respectively connected to the connector and the PCB board, and further comprising: a shielding member 5 composed of a first shielding sheet 2, a second shielding sheet 3 and a connecting sheet 4, wherein the first shielding sheet 2 and the second shielding sheet 3 are fixed by the connecting sheet 4, and a shielding chamber 6 is formed between the first shielding sheet 2, the second shielding sheet 3 and the connecting sheet 4; a plurality of grounding terminal sheets 7, wherein the plurality of grounding terminal sheets 7 penetrate the interior of the shielding chamber 6 and divide the shielding chamber 6 into a plurality of shielding channels 8, wherein the plurality of signal terminals 1 are respectively located in the plurality of shielding channels 8.

[0020] Compared with the traditional high-speed connector wafer structure, the high-speed connector wafer structure disclosed in the present application has a better shielding effect on the signal. On the basis of the overall shielding effect achieved by the first shielding plate 2, the second shielding plate 3 and the connecting plate 4, the shielding chamber 6 is divided into multiple shielding channels 8 by the grounding terminal plate 7, forming a fully enclosed shielding structure, which further improves the shielding effect of the signal terminal 1.

[0021] See also Figure 4 As a preferred embodiment, the ground terminal piece 7 is provided with a spring structure 9 at one end where the signal terminal 1 is connected to the connector, and the spring structure 9 is used to make the ground terminal piece 7 in close contact with the connector.

[0022] See also Figure 5As a preferred embodiment, the spring structure 9 includes a first spring 10 and a second spring 11 made of elastic material, one end of the first spring 10 and the second spring 11 are fixed to the ground terminal sheet 7 at one end where the signal terminal 1 is connected to the connector, and the first spring 10 and the second spring 11 are distributed in a U-shaped structure for clamping a plug inserted between the first spring 10 and the second spring 11.

[0023] The first spring sheet 10 and the second spring sheet 11 can clamp the plug after insertion, so that the ground terminal sheet 7 and the connector are in closer contact. Spring sheets are provided on both sides of the plug to ensure balanced contact force.

[0024] See also Figure 5 As a preferred embodiment, two second spring pieces 11 are provided, and the first spring piece 10 is located at the center of the two second spring pieces 11. The two second spring pieces 11 enhance the elastic force of the spring piece structure 9 and increase the clamping area of ​​the spring piece structure 9 on the plug.

[0025] See also Figure 5 As a preferred embodiment, the first spring piece 10 and the second spring piece 11 are respectively provided with an outward inclined surface 12 at one end away from the ground terminal piece 7 to facilitate the insertion of the plug between the first spring piece 10 and the second spring piece 11.

[0026] See also Figure 7 As a preferred embodiment, a plurality of first protrusions 13 are respectively provided on both sides of the grounding terminal sheet 7, and a first through hole 14 cooperating with the first protrusion 13 is provided on the first shielding sheet 2 and the second shielding sheet 3, and the first protrusions 13 on both sides of the grounding terminal sheet 7 are respectively fixedly inserted into the first through holes 14 on the first shielding sheet 2 and the second shielding sheet.

[0027] The ground terminal piece 7 is fixed to the first shielding piece 2 and the second shielding piece 3 via the first protrusion 13 , thereby improving the stability of the ground terminal piece 7 and making the overall mechanical strength greater.

[0028] See also Figure 6 As a preferred embodiment, it also includes a connecting terminal 15 for contacting the shielding member 5 with the PCB board, the connecting terminal 15 includes a first terminal 16, a second terminal 17 and a third terminal 18, the first terminal 16 and the second terminal 17 are respectively fixed to the first shielding sheet 2 and the second shielding sheet 3, and the third terminal 18 is fixed to the ground terminal sheet 7.

[0029] The first terminal 16 , the second terminal 17 and the third terminal 18 are synchronously connected to the PCB board, thereby improving the shielding effect and making the signal transmission performance of the signal terminal 1 stronger.

[0030] See also Figure 7 As a preferred embodiment, the first shielding sheet 2 and the connecting sheet 4 are an integral structure, a second protrusion 19 is fixed to the end of the connecting sheet 4 away from the first shielding sheet 2, a second through hole 20 cooperating with the second protrusion 19 is provided on the second shielding sheet 3, and the second protrusion 19 is fixedly inserted in the second through hole 20.

[0031] The first shielding sheet 2 and the second shielding sheet 3 are connected via the second protrusion 19, so that the installation and removal of the two are facilitated.

[0032] See also Figure 1 As a preferred embodiment, it also includes a main rubber 21, a part of which is clamped between the first shielding sheet 2 and the second shielding sheet 3, and the signal terminal 1 and the ground terminal sheet 7 are respectively embedded in the main rubber 21.

[0033] The main rubber 21 can support the signal terminal 1 and the ground terminal piece 7, thereby improving the stability of the wafer structure.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-speed connector wafer structure, comprising a plurality of groups of signal terminals (1), wherein two ends of the signal terminals (1) are respectively connected to the connector and the PCB board, characterized in that: Also includes: A shielding member (5) composed of a first shielding sheet (2), a second shielding sheet (3) and a connecting sheet (4), wherein the first shielding sheet (2) and the second shielding sheet (3) are fixed by the connecting sheet (4), and a shielding chamber (6) is formed between the first shielding sheet (2), the second shielding sheet (3) and the connecting sheet (4); A plurality of grounding terminal pieces (7), wherein the plurality of grounding terminal pieces (7) penetrate the interior of the shielding chamber (6) and divide the shielding chamber (6) into a plurality of shielding channels (8), and the plurality of signal terminals (1) are respectively located in the plurality of shielding channels (8).

2. A high-speed connector wafer structure according to claim 1, characterized in that: The grounding terminal piece (7) is provided with a spring structure (9) at one end of the grounding terminal piece (7) which is located at the end where the signal terminal (1) is connected to the connector, and the spring structure (9) is used to bring the grounding terminal piece (7) into close contact with the connector.

3. A high-speed connector wafer structure according to claim 2, characterized in that: The spring sheet structure (9) comprises a first spring sheet (10) and a second spring sheet (11) made of elastic material, one end of each of the first spring sheet (10) and the second spring sheet (11) being fixed to an end of the ground terminal sheet (7) located at a point where the signal terminal (1) is connected to the connector, and the first spring sheet (10) and the second spring sheet (11) are distributed in a U-shaped structure and are used to clamp a plug inserted between the first spring sheet (10) and the second spring sheet (11).

4. A high-speed connector wafer structure according to claim 3, characterized in that: Two second elastic sheets (11) are provided, and the first elastic sheet (10) is located at the center of the two second elastic sheets (11).

5. A high-speed connector wafer structure according to claim 4, characterized in that: An outwardly inclined surface (12) is respectively provided at one end of the first elastic piece (10) and the second elastic piece (11) away from the ground terminal piece (7).

6. The high-speed connector wafer structure according to claim 1, characterized in that: A plurality of first protrusions (13) are respectively provided on both sides of the grounding terminal sheet (7); first through holes (14) cooperating with the first protrusions (13) are provided on the first shielding sheet (2) and the second shielding sheet (3); and the first protrusions (13) on both sides of the grounding terminal sheet (7) are respectively fixedly inserted into the first through holes (14) on the first shielding sheet (2) and the second shielding sheet.

7. The high-speed connector wafer structure according to claim 1, characterized in that: It also comprises a connecting terminal (15) for contacting the shielding member (5) with the PCB board, the connecting terminal (15) comprising a first terminal (16), a second terminal (17) and a third terminal (18), the first terminal (16) and the second terminal (17) being fixed to the first shielding sheet (2) and the second shielding sheet (3) respectively, and the third terminal (18) being fixed to the grounding terminal sheet (7).

8. The high-speed connector wafer structure according to claim 1, characterized in that: The first shielding sheet (2) and the connecting sheet (4) are an integral structure; a second protrusion (19) is fixed to an end of the connecting sheet (4) away from the first shielding sheet (2); a second through hole (20) cooperating with the second protrusion (19) is provided on the second shielding sheet (3); and the second protrusion (19) is fixedly inserted into the second through hole (20).

9. The high-speed connector wafer structure according to claim 1, characterized in that: It also comprises a main body rubber (21), a part of which is clamped between the first shielding sheet (2) and the second shielding sheet (3), and the signal terminal (1) and the grounding terminal sheet (7) are respectively embedded in the main body rubber (21).

Citation Information

Patent Citations

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