A flexible LED lamp strip manufacturing method
By simplifying the production process of flexible LED light strips, forming light-emitting units and support strips, and assembling LED chips, the problems of low production efficiency and high cost are solved, and efficient and environmentally friendly light strip manufacturing is achieved.
Patent Information
- Application Number
- CN202411601300.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2044-11-11
AI Technical Summary
The existing flexible LED light strip production process is complex, with low production efficiency, high cost, and generates a large amount of wastewater.
The base tape is punched out for the first time to form the light-emitting unit and the connection part, combined with the upper insulating film punching and hot pressing or bonding, the base tape is punched out for the second time to form the support bar, and finally the LED chip is assembled, which simplifies the process and reduces the generation of wastewater.
Improve production efficiency, reduce production costs, reduce sewage discharge, and enhance the tensile capacity of light strips.
Smart Images

Figure CN119403042B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of lighting, and in particular relates to a method for manufacturing a flexible LED light strip. Background Art
[0002] Existing flexible LED light strips typically utilize flexible printed circuits (FPCs) and LEDs. These FPCs are typically manufactured using a printed circuit manufacturing process, which includes multiple steps including exposure, development, etching, film stripping, ink application, and antioxidant treatment. This process then forms a circuit pattern. This complex production process makes it difficult to further improve production efficiency, resulting in high production costs. Furthermore, these multiple production steps generate significant amounts of wastewater, necessitating dedicated wastewater treatment facilities, further increasing production costs. Summary of the Invention
[0003] To address the deficiencies in the prior art, the present invention provides a method for manufacturing a flexible LED light strip, which has a simple process, can effectively improve production efficiency, reduce production costs, and avoid generating wastewater.
[0004] In order to achieve the purpose of the present invention, the following scheme is proposed:
[0005] A method for manufacturing a flexible LED light strip comprises the following steps:
[0006] S1: The base strip is punched for the first time. The base strip is a strip of conductive metal. A first frame and a second frame are formed on both sides of the base strip by punching, and rectangular frames are formed between the first and second frames. N consecutive adjacent rectangular frames form a light-emitting unit. Connecting lines are integrally formed between adjacent rectangular frames within the same light-emitting unit. A first connecting portion is formed between the rectangular frame at one end of the light-emitting unit and the first frame, and a second connecting portion is formed between the rectangular frame at the other end of the light-emitting unit and the second frame.
[0007] S2: Punching the upper insulating film to form two rows of strip holes on both sides of the upper insulating film. Along the length direction of the upper insulating film, the distance between adjacent strip holes is consistent with the length of the light-emitting unit. A plurality of through holes are punched on the upper insulating film, and the through holes correspond to the ends of the rectangular frame one by one.
[0008] S3: Combine, lay the upper insulating film on the top surface of the base tape by hot pressing or bonding, and the strip holes are correspondingly arranged between adjacent light-emitting units, and two rows of strip holes are respectively located on the top surface of the first frame and the second frame, and the tops of the opposite ends of the rectangular frame are respectively provided with through holes;
[0009] S4: The base strip is punched a second time, and the ends of the rectangular frame corresponding to the through holes are cut, so that the rectangular frame forms first and second support bars that are parallel to each other and spaced apart, with both ends of the first and second support bars exposed within the corresponding through holes; within the same light-emitting unit, the first support bar of the rectangular frame is connected to the second support bar of the adjacent rectangular frame via a connecting line; the first support bar and the second support bar located at both ends of the light-emitting unit and not connected to the connecting line are connected to the first frame or the second frame via the first connecting portion or the second connecting portion;
[0010] S5: Assembling LED chips. LED chips are arranged at positions corresponding to the through holes on the base strip, and the LED chips are connected to the same end of the first support bar and the second support bar at the same time.
[0011] The beneficial effects of the present invention are:
[0012] 1. Compared with the traditional flexible circuit board process, this solution has fewer steps, simpler process, higher production efficiency, can greatly reduce the generation of sewage, and effectively reduce production costs.
[0013] 2. A first frame and a second frame are formed on both sides of the base strip, which can effectively improve the tensile strength of the light strip after plastic sealing. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.
[0015] Figure 1 A flow chart of the method of the present application is shown.
[0016] Figure 2 The schematic diagram shows the local structure after the upper insulating film is punched.
[0017] Figure 3 A schematic diagram of the local structure formed by the first stamping of the base strip is shown.
[0018] Figure 4 A schematic diagram of the local structure formed by the second stamping of the base strip is shown.
[0019] Figure 5 Shown Figure 4 A partial enlarged view of point A in the middle.
[0020] Figure 6 A partial schematic diagram showing a preferred structure formed by the second punching of the base strip.
[0021] Markings in the figure: first frame -11, second frame -12, rectangular frame -13, first connecting part -131, second connecting part -132, first supporting bar -133, second supporting bar -134, connecting piece -135, connecting line -14, strip hole -21, through hole -22, through hole -23, LED chip -3, resistor -4. DETAILED DESCRIPTION
[0022] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.
[0023] like Figure 1 As shown, a method for manufacturing a flexible LED light strip includes the following steps:
[0024] S1: The first punching of the base tape, which is a strip of conductive metal and made of copper or aluminum. Figure 3 As shown, a first frame 11 and a second frame 12 are formed on both sides of the base band by stamping, and a rectangular frame 13 is formed between the first frame 11 and the second frame 12. The interval setting here refers to the interval setting between the rectangular frame 13 and the first frame 11 and the second frame 12; a plurality of rectangular frames 13 are arranged at intervals along the length direction of the base band, and the interval here refers to the interval between adjacent rectangular frames 13; wherein, N consecutive adjacent rectangular frames 13 form a light-emitting unit, and N is greater than 2; a connecting line 14 is formed integrally between adjacent rectangular frames 13 in the same light-emitting unit. A first connecting portion 131 is integrally stamped between the rectangular frame 13 at one end of the light-emitting unit and the first frame 11, and a second connecting portion 132 is integrally stamped between the rectangular frame 13 at the other end of the light-emitting unit and the second frame 12. The waste generated by this stamping mainly includes two parts: Figure 3 The dark grey shadow shows a portion of the waste material generated by forming the hollow structure in the middle of the rectangular frame 13. Figure 3 The remaining waste material, shown in medium-light gray, is located between the first and second frames 11, 12, and outside the rectangular frames 13, first and second connecting portions 131, 132, and connecting traces 14. This waste material is mostly continuous, facilitating its separation from the base tape. After the base tape waste material is removed, the light-emitting unit is connected between the first and second frames 11, 12 via the first and second connecting portions 131, 132. Furthermore, the rectangular frames 13 within the same light-emitting unit are interconnected via connecting traces 14, ensuring the stability of each rectangular frame 13 on the base tape and facilitating the subsequent installation of the upper insulating film.
[0025] S2: upper insulating film stamping, e.g. Figure 2As shown, two rows of strip holes 21 are punched on both sides of the upper insulating film. Along the length direction of the upper insulating film, the distance between adjacent strip holes 21 is consistent with the length of the light-emitting unit, and a number of through holes 22 are punched on the upper insulating film. The through holes 22 correspond one-to-one to the ends of the rectangular frame 13.
[0026] S3: Combine, lay the upper insulating film on the top surface of the base tape by hot pressing or bonding, the strip holes 21 are correspondingly arranged between adjacent light-emitting units, and the two rows of strip holes 21 are respectively located on the top surfaces of the first frame 11 and the second frame 12, and the tops of the opposite ends of the rectangular frame 13 correspond to through holes 22.
[0027] S4: Second stamping of the base tape, such as Figure 4 and Figure 5 As shown, the ends of the rectangular frame 13 corresponding to the through-holes 22 are cut, forming first and second support bars 133, 134, which are parallel and spaced apart. Both ends of the first and second support bars 133, 134 are exposed within the corresponding through-holes 22 and are used to accommodate the LED chips 3. Within the same light-emitting unit, the first support bar 133 of the rectangular frame 13 is connected to the second support bar 134 of the adjacent rectangular frame 13 via the connecting wire 14. The first and second support bars 133, 134 at both ends of the light-emitting unit that are not connected to the connecting wire 14 are connected to the first frame 11 or the second frame 12 via the first connecting portion 131 or the second connecting portion 132. In this embodiment, the first support bar 133 at one end of the light-emitting unit that is not connected to the connecting wire 14 is connected to the first frame 11 via the first connecting portion 131; while the second support bar 134 at the other end of the light-emitting unit that is not connected to the connecting wire 14 is connected to the second frame 12 via the second connecting portion 132. This solution is combined with an upper insulating film and then separately provided with a stamping process to form independent first support bars 133 and second support bars 134. The purpose is to use the upper insulating film to fix the first frame 11, the second frame 12, the rectangular frame 13 and the connecting line 14. More importantly, the first support bars 133 and the second support bars 134 formed by separation are immediately fixed during forming to prevent the first support bars 133 and the second support bars 134 from deformation and displacement, thereby improving the position accuracy of the two.
[0028] S5: Assemble the LED chips 3. The positions corresponding to the through holes 22 on the base tape are all provided with LED chips 3. The LED chips 3 can be located within the periphery of the through holes 22, or can cover the through holes 22, or can be located on the bottom surface of the base tape at positions corresponding to the through holes 22. It can be seen that the purpose of opening the through holes 22 in step S2 is not only to place the LED chips 3, but also to facilitate the discharge of the waste generated when the rectangular frame 13 is cut in step S4, to prevent the waste from adhering to the upper insulating film. Figure 5As shown, the LED chip 3 is connected to the same end of the first support bar 133 and the second support bar 134 at the same time. Specifically, the LED chip 3 is connected to the first support bar 133 and the second support bar 134 by welding.
[0029] Compared with the traditional flexible circuit board process, the flexible LED light strip produced using the above solution has fewer steps, a simpler process, higher production efficiency, can greatly reduce the generation of sewage, and effectively reduce production costs.
[0030] Preferably, Figure 5 As shown, the distance between the first support bar 133 and the second support bar 134 is greater than the width of the inner hole of the rectangular frame 13, so as to ensure that both ends of the first support bar 133 and the second support bar 134 have sufficient area to support the LED chip 3, and make the middle section width of the first support bar 133 and the second support bar 134 smaller, which can effectively reduce the residual stress generated during stamping.
[0031] Preferably, in step S1, when the base tape is first stamped, Figure 5 As shown, in the same light-emitting unit, one of the opposite ends of a group of adjacent rectangular frames 13 is integrally stamped with a connecting piece 135, and the two connecting pieces 135 are spaced apart from each other. After adopting this process design, not only a mounting position for the resistor 4 is provided, but also Figure 3 The light grey waste shown in the figure forms a continuous strip structure, which is easy to tear off as a whole, so as to facilitate the removal of waste;
[0032] Step S2, when the upper insulating film is punched, a through hole 23 is formed on the upper insulating film to expose the connecting piece 135;
[0033] In step S5, when assembling the LED chip 3, the resistor 4 is assembled onto the two connecting pieces 135 arranged in pairs, that is, the two rectangular frames 13 provided with the connecting pieces 135 are connected through the resistor 4, so that a resistor 4 is provided in each light-emitting unit; as a specific connection scheme, the rectangular frame 13 is connected to the resistor 4 through the first support bar 133 or the second support bar 134, and the first support bar 133 or the second support bar 134 connected to the resistor 4 is not provided with a connecting line 14.
[0034] As a preferred structure, the first support bar 133 and the second support bar 134 are parallel or perpendicular to the length direction of the base tape. Figure 4 As shown, when the first support bar 133 and the second support bar 134 are parallel to the length direction of the base strip, the light strip of this structure is a single-row LED light strip. Figure 6As shown, in step S1, when the base strip is punched for the first time, the first support bar 133 and the second support bar 134 are perpendicular to the length direction of the base strip, so that the light strip is a double-row LED light strip, so as to increase the arrangement density of the LED chips 3 and improve the brightness of the light strip.
[0035] Preferably, the method for manufacturing a flexible LED light strip further includes step S6 of laying a lower insulating film on the bottom surface of the base strip; and step S5 of assembling the LED chip 3, wherein the LED chip 3 is positioned on the top surface of the upper insulating film, and the LED chip 3 completely covers the through hole 22, thereby sealing the base strip and completely enclosing the base strip between the upper insulating film, the lower insulating film, and the LED chip 3, thereby improving the leakage protection and sealing effect of the light strip. If, during step S5, the LED chip 3 is positioned on the bottom surface of the base strip corresponding to the through hole 22, a receiving hole needs to be provided in the lower insulating film to facilitate connection of the LED chip 3 to the base strip.
[0036] More preferably, the method for manufacturing a flexible LED light strip further includes step S7, plastic sealing, in which the base strip, the upper insulating film and the lower insulating film are sealed in a transparent protective cover by injection molding to achieve the purpose of waterproofing and dustproofing.
[0037] Preferably, Figure 2 As shown, both ends of the strip hole 21 on one side of the upper insulating film are marked with a symbol "+", and both ends of the strip hole 21 on the other side are marked with a symbol "-". In this embodiment, the strip hole 21 marked with the symbol "+" is located on the top surface of the first frame 11, and the strip hole 21 marked with the symbol "-" is located on the top surface of the second frame 12, indicating that the first frame 11 is used to connect the positive power supply and the second frame 12 is used to connect the negative power supply; when using the light strip, the light strip can be cut at the interval between adjacent light-emitting units according to the required length. After the light strip is cut, the ends of the first frame 11 and the second frame 12 will be exposed in the strip hole 21 to facilitate connection of the power supply.
[0038] The above description is only a preferred embodiment of the present invention and is not intended to be the only one or to limit the present invention. It should be understood by those skilled in the art that various changes or equivalent replacements made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.
Claims
1. A method for manufacturing a flexible LED light strip, characterized in that: The following steps are involved: S1: The base strip is punched for the first time. The base strip is a strip-shaped conductive metal. A first frame (11) and a second frame (12) are formed on both sides of the base strip by punching, and a rectangular frame (13) is formed between the first frame (11) and the second frame (12). N consecutive adjacent rectangular frames (13) form a light-emitting unit. A connecting line (14) is formed integrally between adjacent rectangular frames (13) in the same light-emitting unit. A first connecting portion (131) is formed between the rectangular frame (13) at one end of the light-emitting unit and the first frame (11), and a second connecting portion (132) is formed between the rectangular frame (13) at the other end of the light-emitting unit and the second frame (12). S2: punching the upper insulating film to form two rows of strip holes (21) on both sides of the upper insulating film. Along the length direction of the upper insulating film, the distance between adjacent strip holes (21) is consistent with the length of the light-emitting unit. A plurality of through holes (22) are punched on the upper insulating film. The through holes (22) correspond to the ends of the rectangular frame (13) one by one. S3: Combining, laying the upper insulating film on the top surface of the base tape by hot pressing or bonding, the strip holes (21) are correspondingly arranged between adjacent light-emitting units, and two rows of strip holes (21) are respectively located on the top surface of the first frame (11) and the second frame (12), and the tops of the opposite ends of the rectangular frame (13) are respectively provided with through holes (22); S4: the base strip is punched for the second time, and the end of the rectangular frame (13) corresponding to the through hole (22) is cut, so that the rectangular frame (13) forms a first support bar (133) and a second support bar (134) that are parallel to each other and spaced apart, and both ends of the first support bar (133) and the second support bar (134) are exposed within the range of the corresponding through hole (22); in the same light-emitting unit, the first support bar (133) of the rectangular frame (13) is connected to the second support bar (134) of the adjacent rectangular frame (13) through the connecting line (14); the first support bar (133) and the second support bar (134) located at both ends of the light-emitting unit and not connected to the connecting line (14) are connected to the first frame (11) or the second frame (12) through the first connecting portion (131) or the second connecting portion (132); S5: Assembling the LED chips (3), the LED chips (3) are all provided at positions corresponding to the through holes (22) on the base tape, and the LED chips (3) are simultaneously connected to the same end of the first support bar (133) and the second support bar (134).
2. The method for manufacturing a flexible LED light strip according to claim 1, wherein: The distance between the first support bar (133) and the second support bar (134) is greater than the width of the inner hole of the rectangular frame (13).
3. The method for manufacturing a flexible LED light strip according to claim 1, wherein: Step S1, when the baseband is punched for the first time, within the same light-emitting unit, a group of adjacent rectangular frames (13) are integrally punched at opposite ends to form connecting pieces (135), and the two connecting pieces (135) are spaced apart from each other; Step S2, when the upper insulating film is punched, a through hole (23) is formed on the upper insulating film for exposing the connecting piece (135); Step S5: When assembling the LED chip (3), assemble the resistor (4) onto the two connecting pieces (135) arranged in pairs.
4. A method for manufacturing a flexible LED light strip according to any one of claims 1 to 3, characterized in that: The first support bar (133) and the second support bar (134) are parallel or perpendicular to the length direction of the base tape.
5. A method for manufacturing a flexible LED light strip according to any one of claim 4, characterized in that: The method further includes step S6 of laying a lower insulating film on the bottom surface of the base tape; and step S5 of assembling the LED chip (3), wherein the LED chip (3) is arranged on the top surface of the upper insulating film, and the LED chip (3) completely covers the through hole (22).
6. A method for manufacturing a flexible LED light strip according to any one of claim 5, characterized in that: The method further includes step S7, plastic sealing, in which the base tape, the upper insulating film and the lower insulating film are sealed in a transparent protective cover by injection molding.
7. A method for manufacturing a flexible LED light strip according to any one of claim 1, characterized in that: The base tape is made of copper or aluminum.
8. A method for manufacturing a flexible LED light strip according to any one of claim 1, characterized in that: Both ends of the strip-shaped hole (21) on one side of the upper insulating film are marked with a symbol "+", and both ends of the strip-shaped hole (21) on the other side are marked with a symbol "-".
Citation Information
Patent Citations
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