Assembly of holder device and electronic module

Abstract

The invention provides an assembly of a holder device and an electronic module, wherein the holder device comprises an outer surface and a Zhaga groove; wherein the Zhaga groove is recessed in the outer surface and is configured to mechanically connect the electronic module to the holder device; wherein the electronic module comprises: a body comprising an electronics compartment; an electronic component disposed in the electronics compartment; a rim arranged in thermal communication with the electronic component and / or electronics compartment; wherein the edge is configured to abut an outer surface of the holder device when the electronic module is mechanically connected to the holder device; wherein the edge is configured to transfer heat from the electronic component and / or electronics compartment into the ambient environment; wherein the edge extends beyond a standardized boundary defined for a Zhaga module adapted for the Zhaga slot.

Description

Technical Field

[0001] The invention relates to an assembly of a holder device and an electronic module, wherein the holder device comprises a Zhaga slot for mechanically connecting the electronic module to the holder device.The invention relates to a holder device, for example a luminaire. Background Art

[0002] The built environment is increasingly equipped with additional modules that provide functionality such as sensing, communication and / or actuation. Such modules may, for example, be connected to luminaires, since lighting infrastructures typically provide a structured location network with access to power and / or data backbones.

[0003] Therefore, in order to facilitate the adoption of such modules, the lighting industry has established standards for modules for sensing and / or communication. One such standard is the Zhaga standard. In particular, Zhaga Book 20 defines the intelligent interface between indoor LED luminaires and modules for sensing and / or communication.

[0004] The mechanical interface defined in the Zhaga Book 20 standard is a dedicated Zhaga slot - with certain standardized dimensions - into which an add-on module can be installed. Therefore, if such a module meets certain dimensions and defined boundaries relative to the Zhaga slot, then the module can also be Zhaga-compatible (i.e., a Zhaga module).

[0005] A problem with the Zhaga slot (i.e. as defined in the Zhaga Book 20) ​​and / or the corresponding Zhaga module (i.e. a Zhaga-compatible add-on module that fits in the Zhaga slot) is that their respective dimensions are limited to the Zhaga standard. Therefore, the limited dimensions of the slot also limit the heat dissipation of the add-on module installed in the slot. This also limits the maximum power of the add-on module.

[0006] While on the one hand the maximum power of add-on modules is limited due to the restricted size of the Zhaga slot, on the other hand there is a clear need to introduce new functionalities to such add-on modules, thereby enabling higher power applications such as, for example, UVC disinfection, Li-Fi communication and / or UVB therapy.

[0007] Therefore, there is a clear need to introduce new functionality to add-on modules for Zhaga slots, while ensuring that their thermal performance remains sufficient to remove the generated heat. Summary of the invention

[0008] An object of the present invention is to provide an improved assembly of a holder device and an electronic module comprising a Zhaga slot, which assembly at least alleviates the above-mentioned problems and disadvantages. In addition, the present invention provides an assembly of a holder device and an electronic module, wherein the holder device comprises an outer surface and a Zhaga slot; wherein the Zhaga slot is recessed in the outer surface and is configured to mechanically connect the electronic module to the holder device; wherein the electronic module comprises: a body comprising an electronic device compartment; an electronic component arranged in the electronic device compartment; an edge arranged to be in thermal communication with the electronic component and / or the electronic device compartment; wherein the edge is configured to abut the outer surface of the holder device when the electronic module is mechanically connected to the holder device; wherein the edge is configured to transfer heat from the electronic component and / or the electronic device compartment to the surrounding environment; wherein the edge extends beyond the standardized boundary defined for Zhaga modules suitable for Zhaga slots.

[0009] Thus, in the proposed assembly, the electronic module is configured to be mechanically connected to a recessed Zhaga slot on the surface of the holder device. Furthermore, the edge of the electronic module transfers heat from the electronic components and / or the electronics compartment to the surrounding environment. This presents an improved heat dissipation and thus enables more (higher power) functionalities of the electronic module installed in the Zhaga slot. However, because the edge extends beyond the standardized boundary defined for Zhaga modules suitable for Zhaga slots, the electronic module is no longer Zhaga compatible. Therefore, the present invention advantageously presents the possibility of introducing new (higher power or thermoacoustic) functionalities to the electronic module by making the electronic module not (or: no longer) Zhaga compatible (in case of the introduction of said edge), but still Zhaga connectable (connectable to a Zhaga slot). Alternatively, said Zhaga slot may be worded as a Zhaga Book 20 slot or a Zhaga F1 luminaire slot.

[0010] It may be intuitive to use most of the volume space of an electronics module for electronics, especially if the electronics module comprises a relatively small form factor, and because the purpose of the electronics module is precisely to provide electronics that implement a desired functionality. However, if such an electronics module is mounted and / or assembled in a Zhaga slot, the amount of heat that can be removed by the Zhaga slot itself may be limited. Modifying the holder device, such as adding a heat sink to the holder device comprising the Zhaga slot, may also be undesirable or cumbersome.

[0011] Thus, in one embodiment of the invention, the volume of the Zhaga slot may be at least three times larger than the volume of the electronics compartment. In various aspects, the volume of the Zhaga slot may be at least four times larger than the volume of the electronics compartment, such as five times larger.

[0012] Such an embodiment may be advantageous because the volume of the electronics compartment of the electronic module is limited relative to the volume of the Zhaga socket into which the electronic module is mounted in the assembly, thereby leaving space in the electronic module and / or the Zhaga socket itself to provide heat dissipation functionality.

[0013] For example, in a related embodiment, the body may include a heat sink structure configured to transfer heat from the electronic component and / or the electronic device compartment to the surrounding environment; wherein the heat sink structure is at least partially arranged outside the electronic device compartment and within the volume of the Zhaga slot.

[0014] In one embodiment, the heat sink structure includes a heat sink and a thermally conductive rod; wherein the heat sink is arranged outside the electronics compartment; wherein the thermally conductive rod extends into the electronics compartment and connects the electronic component to the heat sink.

[0015] Thus, the heat sink structure may provide additional cooling to the electronic module through the restricted volume of the electronics compartment, since the volume of the Zhaga slot is made available. The heat sink structure may be arranged inside the body of the electronic module, and / or may be arranged outside the body and in the Zhaga slot of the holder device. In various aspects, the heat sink structure may alternatively include an active cooling device.

[0016] In one embodiment, the electronic module may include an optical window disposed on the body; wherein the optical window surrounds at least a portion of the electronic device compartment; wherein the optical window enables an optical path between the electronic components and a space outside the holding device; wherein the optical window is integral with the edge. In various aspects, at least a portion of the optical window may be integral with the edge.

[0017] Such an embodiment can be advantageous because the edge and the optical window are integral and thereby enable improved heat transfer from the electronics compartment to the surrounding environment. The optical window also enables the electronics compartment to be optically connected to the outside of the device (e.g., a room, office, or similar interior space) where the device is held.

[0018] In one embodiment, the holder device is a lamp. In one embodiment, the electronic component comprises at least one sensor. In one embodiment, the electronic component comprises at least one wireless communication module. For example, the wireless communication module may be a Li-Fi module or a millimeter wave (mmWave) module. Such a module may generate a large amount of heat. Therefore, in one embodiment, the electronic component comprises a Li-Fi transceiver. Therefore, in one embodiment, the electronic component comprises a millimeter wave radio frequency transceiver. The millimeter wave radio frequency transceiver may, for example, be a 5G transceiver.

[0019] In one embodiment, the electronic component includes at least one semiconductor light source. For example, the semiconductor light source may be an LED light source. In one embodiment, the at least one semiconductor light source may be configured to provide ultraviolet light having at least one main peak in a wavelength range (UVB) from 280nm to 315nm. Such an embodiment may be advantageous because the electronic module may provide a function coupled to the emission of UVB light, such as vitamin D therapy. Therefore, the electronic module may be a vitamin D therapy add-on module for a holder device (such as a lamp, which may otherwise, for example, only emit visible light). In one embodiment, the at least one semiconductor light source may be configured to provide ultraviolet light having at least one main peak in a wavelength range (UVC) from 100nm to 280nm. Such an embodiment may be advantageous because the electronic module may provide a function coupled to the emission of UVC light, such as UVC disinfection (e.g., virus-killing disinfection). Therefore, the electronic module may be a disinfection add-on module for a holder device (such as a lamp, which may otherwise, for example, only emit visible light).

[0020] In one embodiment, the electronic components may generate at least 1.5 Watts of heat energy during operation.

[0021] In one embodiment, the body may include a thermally conductive structure; wherein the thermally conductive structure is configured to connect the edge to the electronic component and / or the electronics compartment; wherein at least a portion of the thermally conductive structure is aligned along an outer contour of the body.

[0022] In one embodiment, the body comprises a shell, wherein the shell is made of a polymer material, wherein the rim is at least partially made of a metallic material.

[0023] In one embodiment, the electronic module may include a connector extending from the body; wherein the connector is configured to deliver power from the holder device to the electronic component, and / or wherein the connector is configured to transmit data between the electronic module and the holder device.

[0024] In one embodiment, a light fixture may include a light engine and a controller; wherein the controller is configured to receive a data signal from the electronic components of the electronic module; wherein the controller is configured to control the light engine to provide lighting based on the data signal.

[0025] In one embodiment, a luminaire may include a light engine and a controller; wherein the controller is configured to transmit a control signal from the controller to an electronic component of the electronic module, wherein the control signal is configured to control a characteristic of the electronic component.

[0026] In one embodiment, the body of the electronic module may include a Zhaga compatible footprint for a Zhaga module that fits into a Zhaga slot.

[0027] In one embodiment, the electronic component may be a sensor bundle comprising a plurality of different sensors. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The invention will now be further elucidated with the aid of the schematic, non-limiting accompanying drawings:

[0029] Figure 1 One embodiment of an assembly according to the invention is schematically depicted;

[0030] Figure 2 One embodiment of an assembly according to the invention is schematically depicted;

[0031] Figure 3 schematically depicts, by way of non-limiting example, a perspective view of an electronic module according to the invention;

[0032] Figure 4 An embodiment of an electronic module according to the invention is schematically depicted, wherein the optical window is integral with the edge. DETAILED DESCRIPTION

[0033] Figure 1 One embodiment of an assembly 100 according to the invention is schematically depicted by way of non-limiting example. Figure 1 A cross-sectional side view is depicted. The assembly 100 comprises a holder device 10 and an electronic module 20. Here, the holder device 10 is a lamp. Figure 1 The luminaire 10 is only partially depicted in the cross-sectional side view of . The holder device may alternatively be, for example, a sensor housing, or a recessed ceiling element, or a surface tile.

[0034] The luminaire 10 comprises an outer surface 11 and a Zhaga slot 12. The Zhaga slot 12 is recessed in the outer surface 11. The Zhaga slot 12 complies with a corresponding Zhaga standard, such as, for example, the Zhaga Book 20 standard. Thus, the dimensions of the Zhaga slot 12 are known and fixed. The Zhaga slot 12 is configured to mechanically connect (or alternatively worded: fit) a module to the luminaire 10. Such a module will also be Zhaga compatible if its dimensions are within the standardized boundaries defined for Zhaga modules suitable for a Zhaga slot.

[0035] The electronic module 20 according to the present invention can be mechanically connected to the luminaire 10 (i.e. the holder device). The electronic module 20 comprises a body 21. The electronic module 20 can be connected to the Zhaga slot 12 via the body 21. Therefore, the size of the body 21 enables the electronic module 20 to be mechanically connected (or: adapted) to the Zhaga slot 12.

[0036] The body 21 comprises an electronics compartment 22. The electronic module 20 further comprises an electronic component 23. The electronic component 23 is thus arranged in said electronics compartment 22 of the body 21.

[0037] In this embodiment, the electronic component 23 is a PCB, which includes at least one semiconductor light source 24 , namely, an ultraviolet LED 24 .

[0038] Alternatively, the electronic component may include a wireless communication module. Such a wireless communication module may generate at least 1.5 watts of heat energy in operation. For example, the electronic component may be a radio frequency receiver, transmitter or transceiver, such as, for example, a millimeter wave radio frequency transceiver, such as a 5G antenna. Alternatively, the electronic component may be a Li-Fi transmitter, a Li-Fi receiver or a Li-Fi transceiver. Further alternatively, the electronic component may include at least one sensor, or may include a sensor beam. Such at least one sensor may be an active sensor, such as a microwave sensor, a radar sensor, an infrared sensor. The sensor may alternatively be a PIR sensor.

[0039] refer to Figure 1 , the ultraviolet LED 24 is configured to provide ultraviolet light in operation, which has at least one main peak in the wavelength range from 280nm to 315nm (i.e., the UV-B range). The electronic module 20 is therefore configured to provide UV-B light 29. As is well known, such UV-B light can be used to provide light therapy that produces vitamin D. The electronic module 20 can therefore be considered as an additional module of the lamp 10, wherein the module is presenting light therapy that produces vitamin D, while the lamp 10 itself can, for example, only include a visible light source arranged to emit visible light in operation. Therefore, the ultraviolet LED can be configured to emit said UV-B light to a human receiving the UV-B light, and the UV-B light includes a light intensity configured to produce vitamin D.

[0040] Additionally or alternatively, the UV LED may be configured to provide UV light in operation having at least one main peak in a wavelength range from 100 nm to 280 nm (i.e., the UVC range). The electronic module may thus be configured to provide UV-C light in operation. As is well known, such UVC light may be used for (virucidal or bactericidal) disinfection. Thus, the electronic module may be considered an additional module of the luminaire, wherein the module is presenting disinfection, while the luminaire 10 itself may, for example, only comprise a visible light source arranged to emit visible light in operation.

[0041] In operation, the UV LED 24 generates a certain amount of heat. If the heat cannot be completely dissipated by the fixed dimensions of the Zhaga slot 12 (i.e., for example, by a corresponding surface area to dissipate the heat), the heat may cause an undesirably high junction temperature in the UV LED 24. A high junction temperature in the UV LED 24 may, for example, lead to limited efficiency, shorter lifetime, and poor operation. For example, for a UV-B LED, a junction temperature above 60 degrees Celsius may already become critical.

[0042] Therefore, due to the standardized and fixed dimensions of the Zhaga socket 12 , the Zhaga socket 12 can only dissipate a certain amount of heat originating from the electronic module 20 .

[0043] Still reference Figure 1 , the electronic components 23 arranged in the electronics compartment 22 of the body 21 of the electronic module 20 may generate heat due to the presence of the ultraviolet LEDs 24. This heat needs to be removed to achieve the function of providing UVB light (and corresponding light therapy). However, as partially mentioned, the size of the Zhaga slot 12 may not be sufficient to remove the heat. In an example, the electronic components 23 may, for example, generate at least 1.5 watts of heat energy.

[0044] Therefore, the electronic module 20 also includes an edge 25. Here, the edge 25 is thermally connected to the electronics compartment that accommodates the electronic component 23. The thermal connection is at least partially conductive. Alternatively, the edge can be thermally connected to the electronic component, such as thermally connected to a PCB. Thus, when the electronic module 20 is mechanically connected to the lamp 10, the edge 25 is adjacent to the outer surface 11 of the lamp 10 (i.e., the holder device). The edge 25 thus transfers heat from the electronics compartment 22 (or the electronic component 23) to the surrounding environment. The surrounding environment is the body of the lamp 10 and / or the atmosphere surrounding the lamp 10.

[0045] More specifically, in the present embodiment, although optionally, the electronic module 20 includes an optical window 26 arranged on the body 21. Thus, the optical window 26 surrounds at least a portion of the electronic device compartment 22, in which the ultraviolet LED 24 is arranged. The optical window 26 is transparent to ultraviolet light, thereby realizing an optical path between the electronic component 23 and the space outside the lamp 10 (i.e., the holder device). Alternatively, the optical window can be translucent to ultraviolet light. Here, by way of non-limiting example, the optical window 26 is integral with the edge 25. This enables improved dissipation of heat.

[0046] The edge 25 may be made of a ceramic material, for example. Alternatively, the edge 25 may be at least partially made of a metallic material. Thus, the body 21 may be made of a polymer material.

[0047] Still reference Figure 1 , the edge 25 extends beyond the standardized boundary defined for Zhaga modules suitable for use in a Zhaga slot 12. Therefore, the electronic module 20 is not Zhaga-compatible and is only Zhaga-connectable. However, even if the electronic module 20 is not (or: no longer) Zhaga-compatible due to the extended edge 25, the electronic module 20 is still able to mechanically connect to the luminaire 10 and provide additional (high-power) functionality, such as providing UV-B light, which would otherwise be impossible without such edge 25.

[0048] In summary, the present invention advantageously presents the possibility to introduce new (higher power or thermoacoustic) functionalities (i.e. for example UVB lighting and / or phototherapy producing Vitamin D) to the electronic module 20 by making the electronic module 20 not (or: no longer) Zhaga compatible (in case of introduction of said edge 25), but still Zhaga connectable (connectable to a Zhaga slot 12).

[0049] In some embodiments, the optical window 26 may further include a solid portion and an aperture portion (or: opening portion) in the solid portion. The solid portion may thus be integral with the edge 25. Alternatively, the solid portion may abut the edge, or be mechanically and thermally connected to the edge according to known manufacturing processes, the mechanical connection and thermal connection enabling conductive heat transfer between the solid portion and the edge.

[0050] Figure 2 One embodiment of an assembly 200 according to the invention is schematically depicted by way of non-limiting example. Figure 2 A cross-sectional side view is depicted. The assembly 200 comprises a holder device 30 and an electronic module 40. Here, the holder device 30 is a lamp. Figure 1 The luminaire 30 is only partially depicted in the cross-sectional side view of . Alternatively, the holder device may be a sensor housing, or a recessed ceiling element, or a surface tile.

[0051] The luminaire 30 comprises an outer surface 31 and a Zhaga slot 32. The Zhaga slot 32 is recessed in the outer surface 31. The Zhaga slot 32 complies with a corresponding Zhaga standard, such as, for example, the Zhaga Book 20 standard. Thus, the dimensions of the Zhaga slot 32 are known and fixed. The Zhaga slot 32 is configured to mechanically connect (or alternatively worded: fit) a module to the luminaire 30. Such a module will also be Zhaga compatible if its dimensions are within the standardized boundaries defined for Zhaga modules that fit into a Zhaga slot.

[0052] By way of non-limiting example, although optionally, the luminaire 30 further comprises a controller 33 and a light engine 34. The light engine 34 comprises a visible light source and is configured to emit visible light in operation. Alternatively, the light engine 34 may be worded as a light module or a light unit. The controller 33 is configured to control the light engine 34.

[0053] The electronic module 40 according to the present invention can be mechanically connected to the luminaire 30 (i.e., the holder device). More specifically, the electronic module 40 includes a body 41. The electronic module 40 can be connected to the Zhaga slot 32 via the body 41. Therefore, the size of the body 41 enables the electronic module 40 to be mechanically connected (or: adapted) to the Zhaga slot 32.

[0054] Here, the electronic module 40 may also be electrically connected to the lamp 30 (i.e., the holder device). More specifically, the electronic module 40 includes a connector 48. The connector 48 may be an (integral) part of the body 41 and / or may extend from the body 41. For example, the connector 48 may be a cable with a plug or a cable with a socket.

[0055] The body 41 comprises an electronics compartment 42. The electronic module 40 further comprises an electronic component 43. The electronic component 43 is thus arranged in said electronics compartment 42 of the body 41.

[0056] The connector 48 is configured to deliver power from the luminaire 30 (i.e., the holder device) to the electronic component 43; and / or the connector 48 is configured to transmit data between the electronic module 40 and the luminaire 30 (i.e., the holder device). In addition, the controller 31 of the luminaire 30 may be configured to receive a data signal from the electronic component 43 of the electronic module 40. The controller 33 may then control the light engine 34 based on the data signal to provide (visible) lighting.

[0057] Alternatively, the controller may be configured to transmit control signals from the controller to the electronic components of the electronic module, wherein the control signals are configured to control a characteristic of the electronic components.

[0058] Still reference Figure 2 In this embodiment, the electronic component 43 is a wireless communication module. The wireless communication module 43 includes a Li-Fi transceiver 44. The Li-Fi transceiver 44 is configured to communicate with a corresponding communication device in a space outside the lamp 30.

[0059] Alternatively, the electronic component may include a radio frequency receiver, transmitter or transceiver, such as, for example, a millimeter wave radio frequency transceiver, such as a 5G antenna. Further alternatively, the electronic component may include at least one semiconductor light source. Further alternatively, the electronic component may include at least one sensor, such as, for example, a microwave sensor or a radar sensor.

[0060] In operation, the Li-Fi transceiver 44 generates a certain amount of heat. If the heat cannot be fully dissipated through the fixed dimensions of the Zhaga slot 32 (i.e., for example, through the corresponding surface area for dissipating the heat), the heat may cause undesirably high temperatures at the wireless communication modules 43, 44.

[0061] Therefore, due to the standardized and fixed dimensions of the Zhaga socket 32 ​​, the Zhaga socket 32 ​​can only dissipate a certain amount of heat originating from the electronic module 40 .

[0062] Still reference Figure 2 , the electronic components 43 arranged in the electronic device compartment 42 of the body 41 of the electronic module 40 may generate heat. This heat needs to be removed to achieve the function of Li-Fi communication. However, as partially mentioned, the size of the Zhaga slot 32 may not be sufficient to remove the heat. In an example, the electronic components 43 may, for example, generate at least 1.5 watts of heat energy.

[0063] Thus, the electronic module 40 also includes an edge 45. Here, the edge 45 is in thermal communication with the electronics compartment 42 housing the electronic components 43. The thermal communication is at least partially conductive. Alternatively, the edge may be in thermal communication with the electronic components, such as in thermal communication with the wireless communication module 43 (or Li-Fi transceiver) itself.

[0064] Thus, when the electronic module 40 is mechanically connected to the luminaire 50, the edge 45 abuts the outer surface 31 of the luminaire 50 (i.e. the holder device). The edge 45 thus transfers heat from the electronics compartment 42 (or the electronic components 43) to the surrounding environment. The surrounding environment is the body of the luminaire 30 and / or the atmosphere surrounding the luminaire 30.

[0065] Here, the edge 45 also extends beyond the standardized boundaries defined for Zhaga modules suitable for use in a Zhaga slot 32. Therefore, the electronic module 40 is not Zhaga-compatible and is only Zhaga-connectable. However, even if the electronic module 40 is not (or: no longer) Zhaga-compatible due to the extended edge 45, the electronic module 40 is still able to mechanically connect to the luminaire 30 and provide additional (high-power) functionality, such as providing Li-Fi communication, which would otherwise be impossible without such an edge 45.

[0066] In summary, the present invention advantageously presents the possibility to introduce new (higher power or thermoacoustic) functionalities (i.e. for example Li-Fi communication) to the electronic module 40, by making the electronic module 40 not (or: no longer) Zhaga compatible (in case of introduction of said edge 45), but still Zhaga connectable (connectable to a Zhaga slot 42).

[0067] In conjunction with the edge 45, thermal performance may be improved even further. That is, as partially mentioned previously, it may be intuitive to use most of the volume space of the additional module for electronics such as the embodied Li-Fi transceiver. However, when the present electronic module 40 is installed and / or assembled in the Zhaga slot 32, the amount of heat that can be removed by the Zhaga slot 32 itself may be limited. Modifying the luminaire 30 itself, such as adding a heat sink to the luminaire 30, may also be undesirable or cumbersome. Therefore, limiting the volume of the electronics compartment 42 may be advantageous.

[0068] Therefore, still refer to Figure 2 , the volume of the Zhaga slot 32 is at least four times larger than the volume of the electronics compartment 42 .

[0069] Such an embodiment can be advantageous because the volume of the electronics compartment 42 of the electronic module 40 is limited relative to the volume of the Zhaga slot 32 into which the electronic module 40 is mounted in the assembly, thereby leaving space in the electronic module 40 (and / or the Zhaga slot 32 itself) to provide heat dissipation functionality.

[0070] More specifically, body 41 may include a heat sink structure 47 configured to transfer heat from electronic component 43 and / or electronics compartment 42 to the surrounding environment. Heat sink structure 47 is at least partially arranged outside electronics compartment 42 and within the volume of Zhaga slot 32.

[0071] The heat sink structure 47 comprises a heat sink 46 and a heat conducting rod 49. The heat sink 46 is arranged outside the electronic device compartment 42. The heat conducting rod 49 extends into the electronic device compartment 42 and connects the electronic component 43 to the heat sink 46. Therefore, the heat sink structure 47 can provide additional cooling to the electronic module 40. In an embodiment, the heat sink structure 47 can be adjacent to the body 41, or more specifically adjacent to at least one wall of the body 41, thereby also enabling conductive heat transfer through the body 41 (the wall), for example, the conductive heat transfer is at least partially towards the edge 45, so that heat is also dissipated in the surrounding environment outside the lamp.

[0072] Figure 3 By way of non-limiting example, schematically depicted Figure 2A perspective view of an electronic module of the embodiment depicted in , but with a UV-B light source instead of a Li-Fi transceiver.

[0073] Figure 4 A side view of an electronic module 400 according to the present invention is schematically depicted by way of non-limiting example. The electronic module 400 can be adapted (or: mechanically connected) into a Zhaga slot that is recessed in the outer surface of a holder device according to the present invention. The electronic module 400 comprises a body 51. The body 51 comprises an electronics compartment 52. The electronics compartment 52 comprises an electronic component 53. Here, the electronic component 53 is a carrier comprising a millimeter wave transceiver 54, or is the millimeter wave transceiver 54 itself. Alternatively, the millimeter wave transceiver can be, for example, an ultraviolet LED light source. The electronic component 53 generates heat. The body 51 also comprises an edge 55. Here, the edge 55 is integral with at least a portion of the remainder of the body 51. The edge 55 is arranged to be thermally connected to the electronic components 53, 54 and the electronics compartment 52. The edge 55 extends beyond the standardized boundary defined for Zhaga modules suitable for Zhaga slots. More specifically, the heat generated by the electronic components 53, 54 and the resulting heat of the electronics compartment 52 will be transferred to the edge 55 via the body 51. The heat can be transferred via the mechanical structure 58 of the body 51 or via the wall of the body 51. For example, the heat generated by the electronic components 53, 54 and the resulting heat of the electronics compartment 52 will be transferred at least partially via the connecting structure 58 connecting the electronic components 53, 54 and the body 51. As mentioned, when adapted into the Zhaga slot of the holder device, the edge 55 is exposed to the surrounding environment, to the atmosphere or to the outer surface of the adjacent luminaire. Therefore, an unobstructed thermal conductive path 59 is established to dissipate the generated heat. Such a configuration and heat

[0074] Still reference Figure 4 The body 51 includes an optical window 56 for allowing millimeter wave radio signals to pass through. Here, the optical window 56 surrounds at least a portion of the electronic device compartment and implements a radio path between the electronic components and the space outside the device. The optical window 56 is integral with the edge 55. This further improves heat transfer, such as a heat conduction path 59.

Claims

1. An assembly of a holder device and an electronic module, wherein the holder device comprises an outer surface and a Zhaga groove; wherein the Zhaga groove is recessed in the outer surface and is configured to mechanically connect the electronic module to the holder device; The electronic module comprises: - a main body comprising the electronics compartment; - electronic components arranged in the electronics compartment; - an edge arranged in thermal communication with said electronic component and / or said electronics compartment; wherein the edge is configured to abut the outer surface of the holder device when the electronic module is mechanically connected to the holder device; wherein the edge is configured to transfer heat from the electronic component and / or the electronics compartment to the surrounding environment; wherein the edge extends beyond a standardized boundary defined for a Zhaga module applicable to the Zhaga slot.

2. The assembly of claim 1, wherein the volume of the Zhaga slot is at least three times larger than the volume of the electronics compartment.

3. The assembly of claim 2, wherein the body comprises a heat sink structure configured to transfer heat from the electronic component and / or the electronics compartment to an ambient environment; Wherein the heat sink structure is at least partially arranged outside the electronics compartment and within the volume of the Zhaga slot.

4. The assembly according to claim 3, wherein the heat sink structure comprises a heat sink and a heat conducting rod; wherein the heat sink is arranged outside the electronic device compartment; Wherein the thermally conductive rod extends into the electronics compartment and connects the electronic component to the heat sink.

5. An assembly according to any one of the preceding claims, wherein the electronic module comprises an optical window arranged on the body; wherein the optical window surrounds at least a portion of the electronics compartment; wherein the optical window enables an optical path between the electronic component and a space outside the holding device; Wherein the optical window is integral with the edge.

6. An assembly according to any preceding claim, wherein the holder device is a luminaire.

7. An assembly according to any preceding claim, wherein the electronic component comprises at least one sensor.

8. An assembly according to any one of the preceding claims, wherein the electronic components comprise at least one wireless communication module.

9. An assembly according to claim 8, wherein the electronic component comprises a Li-Fi transceiver; or The electronic components include a millimeter wave radio frequency transceiver.

10. An assembly according to any preceding claim, wherein the electronic component comprises at least one semiconductor light source.

11. The assembly of claim 10, wherein the at least one semiconductor light source is configured to provide ultraviolet light having at least one main peak in the wavelength range (UVB) from 280 nm to 315 nm.

12. The assembly of claim 10, wherein the at least one semiconductor light source is configured to provide ultraviolet light having at least one main peak in a wavelength range (UVC) from 100 nm to 280 nm.

13. An assembly according to any preceding claim, wherein the electronic component generates at least 1.5 Watts of heat energy in operation.

14. An assembly according to any preceding claim, wherein the body comprises a thermally conductive structure; wherein the thermally conductive structure is configured to connect the edge to the electronic component and / or the electronics compartment; At least a portion of the thermally conductive structure is aligned along an outer contour of the body.

15. An assembly according to any one of the preceding claims, wherein the body comprises a shell, wherein the shell is made of a polymer material, and wherein the rim is at least partially made of a metallic material.

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