Power electronic device package with dual one-sided cooling water jackets

Abstract

A package (100) includes a frame (140) having a cooling fluid passage (155) therethrough. The frame has at least one opening (147) in the first side wall next to the cooling fluid passage and at least one opening (149) in the second side wall next to the cooling fluid passage. A first power electronics module (200A) covers the at least one opening in the first sidewall, where a surface of a substrate in the first power electronics module is exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall, and a second power electronics module (200A) covers the at least one opening in the second sidewall, wherein a surface of a substrate in the second electronics module is exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.

Description

[0001] Related Applications

[0002] This application claims priority to and the benefit of U.S. patent application No. 18 / 055,123, filed on November 14, 2022, which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to cooling systems for power electronics assemblies. Background Art

[0004] In many applications (e.g., in electric drive vehicles), effective thermal management of power electronics components or packages is required to increase power density and improve reliability. For example, electric vehicles and hybrid electric vehicles utilize high voltage battery packs or fuel cells that deliver high power DC current to drive vehicle motors, electric traction systems, and other vehicle systems. Among other things, these vehicles may include power electronics components (e.g., inverters) to convert DC current provided by, for example, the battery pack into AC current for use by the vehicle's electric motor and other electrical devices and systems. Power electronics components may include heat generating semiconductor devices, such as insulated gate bipolar transistors (IGBTs) and fast recovery diodes (FRDs). The compact packaging of power electronics components creates thermal management challenges that need to be addressed for power-intensive systems. Summary of the invention

[0005] In a general aspect, a package includes a frame having a first sidewall and a second sidewall opposite the first sidewall, the frame having at least one opening in the first sidewall and at least one opening in the second sidewall. A first power electronic device module covers the at least one opening in the first sidewall, wherein a surface of a substrate in the first power electronic device module is exposed to an interior of the frame through the at least one opening in the first sidewall, and a second power electronic device module covers the at least one opening in the second sidewall, wherein a surface of a substrate in the second power electronic device module is exposed to an interior of the frame through the at least one opening in the second sidewall. The first sidewall, the surface of the substrate of the first power electronic device module, the second sidewall, and the surface of the substrate of the second power electronic device module together define a cooling fluid channel through the frame.

[0006] In a general aspect, a package includes a frame having a cooling fluid channel passing through the frame. The cooling fluid channel is formed between a first side wall and a second side wall, the second side wall being opposite to the first side wall. The frame includes a first plurality of openings and a second plurality of openings, the first plurality of openings being arranged in a first row in the first side wall beside the cooling fluid channel, and the second plurality of openings being arranged in a second row in the second side wall beside the cooling fluid channel opposite to the first side wall. A first plurality of power electronic device modules are arranged above the first plurality of openings in the first side wall beside the first side wall, wherein each of the first plurality of openings exposes a surface of a substrate in a corresponding one of the first plurality of power electronic device modules to the cooling fluid channel in the frame. A second plurality of power electronic device modules are arranged above the second plurality of openings in the second side wall beside the second side wall, wherein each of the second plurality of openings exposes a surface of a substrate in a corresponding one of the second plurality of power electronic device modules to the cooling fluid channel in the frame.

[0007] In a general aspect, a method includes forming a cooling fluid channel between a first sidewall and a second sidewall in a frame. The frame includes at least one opening in the first sidewall next to the cooling fluid channel and at least one opening in the second sidewall next to the cooling fluid channel. The method also includes: arranging a first power electronic device module to cover the at least one opening in the first sidewall, wherein a surface of a substrate in the first power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall; and arranging a second power electronic device module to cover the at least one opening in the second sidewall, wherein a surface of a substrate in the second power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.

[0008] In a general aspect, a package includes a frame having a cooling fluid channel passing through the frame. The cooling fluid channel is formed between a first side wall and a second side wall, the second side wall being opposite to the first side wall. The frame has at least one opening in the first side wall beside the cooling fluid channel and at least one opening in the second side wall beside the cooling fluid channel. A first power electronic device module covers the at least one opening in the first side wall, wherein a surface of a substrate in the first power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the first side wall, and a second power electronic device module covers the at least one opening in the second side wall, wherein a surface of a substrate in the second electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the second side wall. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A The removal of heat from multiple power electronics modules through a single cooling fluid flow in accordance with the principles of the present disclosure is schematically illustrated.

[0010] Figure 1B An example integrated power electronics package according to the principles of the present disclosure is illustrated in perspective view.

[0011] Figure 1C Illustrated Figure 1B Exploded view of the integrated power electronics package.

[0012] Figure 1D , Figure 1E and Figure 1F They are exemplified Figure 1B Side view, bottom view and end view of an integrated power electronic device package.

[0013] Figure 2A Illustrated in combination Figure 1B An example power electronics module in an integrated power electronics package.

[0014] Figure 2B A pin fin is illustrated.

[0015] Figure 2C A pin-shaped fin including a frustum is illustrated.

[0016] Figure 3A An example arrangement of pin fins associated with a pair of power electronics modules disposed on opposite sides of a frame in an integrated power electronics package is illustrated.

[0017] Figure 3B Another example arrangement associated with pairs of power electronics modules disposed on opposing sides of a frame in an integrated power electronics package is illustrated.

[0018] Figure 4 Example methods for fabricating the integrated power electronics packages disclosed herein are illustrated.

[0019] In the drawings that are not necessarily drawn to scale, similar reference symbols and / or alphanumeric identifiers may indicate similar and / or similar parts (elements, structures, etc.) in different views. The drawings illustrate various specific implementations discussed in the present disclosure by way of example and not limitation. Reference symbols and / or alphanumeric identifiers shown in one drawing may not be repeated for the same and / or similar elements in the related views in other drawings. Reference symbols and / or alphanumeric identifiers repeated in multiple figures may not be specifically discussed with respect to each of the figures in these figures, but are provided for the convenience of cross-references between related views. In addition, not all similar elements in the drawings are specifically referenced with reference symbols and / or alphanumeric identifiers when multiple instances of the element are shown. DETAILED DESCRIPTION

[0020] The present disclosure relates to thermal management systems for power electronics packages. A power electronics package (eg, an integrated power module package) may be modular and may include multiple power electronics modules (or sub-packages).

[0021] A power electronics module (or subpackage) may, for example, include power electronics (e.g., silicon controlled rectifiers (SCRs), insulated gate bipolar transistors (IGBTs), field effect transistors (FETs), etc.) to provide AC power to a load. The power electronics may be silicon-based or based on wide bandgap (WBG) semiconductors. The power electronics may generate heat, which must be removed in order to keep the device at an acceptable operating temperature. For high power density applications (e.g., power density equal to or greater than 240 kW), the requirements for effective heat removal may be stringent.

[0022] In an example implementation, a power electronics module may include at least a semiconductor die (e.g., an IGBT and / or an FRD). The semiconductor die may be mounted on a top surface of a substrate (e.g., a printed circuit board, a direct bonded metal (DBM) substrate, a direct bonded copper (DBC) substrate, etc.). One or more semiconductor dies may be packaged (e.g., encapsulated in a molding compound), for example, as a single-sided direct cooled (SSDC) power electronics module, with signal pins and power terminals extending from the module. The power electronics module may have a width (WM) and a height (HM) along the surface of the substrate, and a thickness (TM) perpendicular (substantially perpendicular) to the substrate (in the direction of the semiconductor die mounted on the top surface of the substrate). In an example implementation, for an IGBT power electronics module, the height HM and the width WM may be measured in centimeters, while the thickness TM may be in the range of a few millimeters or less.

[0023] Heat generated by one or more semiconductor dies flows vertically through the substrate to be dissipated from the bottom surface of the substrate. In some cases, a heat sink (e.g., a base plate or a base plate with fins) may be attached to the bottom surface of the substrate to help disperse the heat generated in the power electronics module. The base plate with fins may include pin fins (i.e., fins shaped like pins). The power electronics module may further be configured with forced air and liquid cooling options to remove the heat generated in the power electronics module.

[0024] In an example implementation, the integrated power electronic device package can be modular and can include multiple power electronic device modules (or sub-packages) in a single package for use in various applications (e.g., three-phase inverters, DC / DC converters, choppers, half-bridges or full-bridges, and power supply applications, etc.). For example, an integrated power electronic device package for many automotive applications can integrate six IGBT modules in a 6-pack configuration. Multiple power electronic device modules (or sub-packages) (e.g., six IGBT modules) can be placed electrically in parallel.

[0025] In an example implementation, the integrated power electronic device package may include (or be integrated with) a thermal management system. The thermal management system may utilize a cooling fluid (e.g., water or a water-glycol mixture) to remove heat generated in the integrated power electronic device package. The thermal management system may include a manifold or jacket (e.g., a tube or a container) that includes a cooling fluid passage or channel. A plurality of power electronic device modules of the integrated power electronic device package may be disposed on one side of the cooling fluid channel that contacts the cooling fluid. In an example implementation, the manifold or jacket may have a rectangular cylindrical shape having a length L between an input end and an output end, and having a width W and a height H in a cross section perpendicular to the length. The manifold or jacket including the cooling fluid channel may be formed in a three-dimensional rectangular frame (hollow rectangular frame), wherein the input port and the output port are disposed in opposite end plates of the frame. The frame may include a window (e.g., a rectangular opening) in the side wall of the frame. The power electronic device module may be placed above the window to seal the window (e.g., using a leak-proof joint) and thereby confine the cooling fluid to the cooling fluid channel within the three-dimensional rectangular frame.

[0026] A flow of cooling fluid may enter the manifold through an inlet port, pass over a plurality of power electronics modules placed along cooling fluid channels in the manifold to remove heat generated by the power electronics modules, and exit the manifold through an output port. The flow of cooling fluid may be driven by a recirculation pump (not shown).

[0027] In some example implementations, the integrated power electronic device package may include a plurality of power electronic device modules sequentially placed in a row. The width of the plurality of power electronic device modules sequentially placed in a row in the integrated power electronic device package may extend sequentially module by module, for example, along the direction of the row, while the height and thickness of the power electronic device modules may be perpendicular to the direction of the row.

[0028] A plurality of power electronic device modules sequentially placed in a row may be supported on the frame. The frame may extend in the direction of the row and have a window (opening) that exposes the front surface of the substrate (on which the semiconductor die is mounted in the power electronic device module) to the interior of the frame (i.e., the cooling fluid channel). A base plate (e.g., a base plate with pin fins) attached to the bottom surface of the substrate may protrude (at least the pin fins) beyond the window on one side of the frame.

[0029] In an example implementation, the frame may be a first frame and the enclosed cooling fluid channel may be a first cooling channel. The integrated power electronic device package may include a second frame enclosing a second cooling channel (parallel to the first cooling channel). A base plate (e.g., a base plate with pin-shaped fins) attached to the bottom surface of the substrate may be exposed to the cooling fluid in the second cooling channel through a window in the second frame. In other words, one side of the power electronic device module may be cooled by the cooling fluid flowing in the first cooling channel, and the opposite side of the power electronic device module may be cooled by the cooling fluid flowing in the first cooling channel. The cooling fluids flowing in the first cooling channel and the second cooling channel may be combined with each other at the inlet port and the outlet port at the beginning and end of the first frame and the second frame.

[0030] The power terminals and signal pins of each of the multiple power electronics modules placed in the manifold may extend outside of the manifold / integrated power electronics package.

[0031] Figure 1A is a schematic diagram illustrating the removal of heat from a plurality of power electronic device modules by a cooling fluid flow flowing in a top cooling channel and a bottom cooling channel across the plurality of power electronic device modules. The power electronic device modules may be, for example, single-side direct cooling (SSDC) power electronic device modules having a surface (e.g., a substrate surface) for dissipating heat generated by devices in the power electronic device module to an exterior of the module.

[0032] like Figure 1A As shown, a plurality of power electronic device modules (eg, power electronic device module 200A, Figure 1C) may be sequentially arranged in rows (eg, row R1 and row R2) on either side of the cooling fluid channel 155. A plurality of power electronic device modules (eg, power electronic device module 200A, Figure 2A ) may have a substrate surface (e.g., substrate 220) exposed to cooling fluid channels 155 for heat removal. According to the principles of the present disclosure, a single cooling fluid stream may flow sequentially over heat generating (dissipating) surfaces (e.g., substrate 220) of multiple power electronic device modules in a straight flow path through cooling fluid channels 155 without bifurcation or branching of the flow path.

[0033] Figure 1B Shown is a perspective side view of an example integrated power electronics package 100 in accordance with the principles of the present disclosure. Figure 1C Shows Figure 1B Exploded view of the integrated power electronics package. Figure 1D , Figure 1E and Figure 1F Shows Figure 1B Top, bottom, and side views of an integrated power electronic device package.

[0034] Figure 2A It shows that Figure 1B An example power electronic device module 200A for use in an integrated power electronic device package 100 of the present invention. The power electronic device module 200A may, for example, include a power semiconductor die (e.g., an IGBT) (not shown) mounted on a top surface of a substrate (e.g., substrate 220) and packaged (encapsulated) in an encapsulant 210 (e.g., as an SSDC package). The power electronic device module 200A may include an encapsulated portion (encapsulant 210) having a width WM, a height HM, and a thickness TM. Power terminals 212 and signal terminals 214 of the power electronic device module 200A may extend from the encapsulated portion (encapsulant 210). A heat sink (e.g., baseplate 230) may be attached to a rear surface (e.g., surface S) of a substrate 220 (e.g., a thermally conductive substrate) to help disperse heat generated by a power semiconductor device mounted on a top surface (not shown) of the substrate 220. In an example implementation, the array of fins (eg, pin-fins 232 ) can extend outwardly (eg, vertically) from the base plate 230 .

[0035] refer to Figures 1B to 1E In an example implementation, the integrated power electronics package 100 may be six groups of six individual power electronics modules (eg, power electronics module 200A).

[0036] Figure 1BAn integrated power electronic device package 100 is shown having a rectangular box-like shape between two end plates (e.g., end plates 120) attached to opposite ends of a hollow frame (e.g., frame 140). The two end plates may be aligned, for example, along a plane that is substantially perpendicular to a cooling fluid channel 155 in the frame 140 (e.g., along the longitudinal direction of the fluid channel). The two end plates (e.g., end plates 120) may have ports (e.g., input ports 124 and output ports 122) for allowing a cooling fluid flow to flow through the cooling fluid channel 155 in the frame. The two end plates (e.g., end plates 120, end plates 121) may have an O-ring and groove arrangement (e.g., O-ring 126) so that the attachment of the two end plates to the opposite ends of the hollow frame can be sealed.

[0037] In an example implementation, a plurality of individual power electronics modules (eg, power electronics module 200A) may be arranged along both sides of frame 140 (eg, in rows R1 and R2). Figure 1A In the illustrated view, only the power terminals (e.g., power terminals 212) and signal terminals (e.g., signal terminals 214) of the power electronic device module (e.g., power electronic device module 200A) included in the integrated power electronic device package 100 are visible. The body of the power electronic device module 200A (e.g., in row R1) is shown in FIG. Figure 1A are not visible in the view shown because they may be hidden by a cover of the integrated power electronic device package 100 (e.g., Figure 1C Also, under the cover plate 112 shown. Figure 1A Only the top beam (eg, beam 141 ) of the frame 140 is visible in FIG. The top beam (eg, beam 141 ) blocks the view of the main body of the power electronic device module 200A included in the frame 140 (eg, in row R1 or row R2 ).

[0038] In some example implementations, various structural components (e.g., beams, cover plates, end plates, etc.) of the integrated power electronic device package 100 can be assembled using, for example, nut-bolt assemblies (e.g., nut-bolt assemblies 130). In some example implementations, various structural components of the integrated power electronic device package 100 can also be assembled using adhesives, O-ring and groove arrangements, or other coupling members ( Figure 1A assemble by using the PCB (not shown).

[0039] Figure 1C An exploded view of the various structural components of the integrated power electronics package 100 is shown.

[0040] like Figure 1CAs shown, the manifold or jacket formed by the frame 140 may include cooling fluid channels (cooling fluid channels 155) that may carry a cooling fluid flow to remove heat from a plurality of power electronic device modules (e.g., six power electronic device modules 200A) included in the integrated power electronic device package 100. The six power electronic device modules may be arranged in rows (e.g., rows R1 and R2) on both sides of the manifold or jacket formed by the frame 140 (i.e., three modules on each side).

[0041] like Figure 1C As shown, the frame 140 may have a six-sided hollow rectangular box-like structure, wherein two sides are formed by longitudinal beams (e.g., beams 141 and 142) extending in the x-direction with a length L, two sides are formed by side walls (e.g., side wall S1) in the xz plane, and two sides are formed by vertical end columns (e.g., end columns 144, 143) extending in the z-direction with a height H.

[0042] In some implementations, the cooling fluid channel 115 can be at least partially defined by the frame 140 and the sidewalls of the power modules 200A coupled to the frame 140. In some implementations, the cooling fluid channel 115 can be at least partially defined by the frame 140 and the pair of power modules 200A on opposite sides of the frame 140. In some implementations, fewer power modules can be included in the device.

[0043] Beams 141 and 142 may be kept spaced apart (in the y direction) by vertical posts (e.g., end posts 144, 143) having a height H. End posts 144 and 143 may be attached to beams 141 and 142 at the ends of the length L of frame 140 that separate the frame. In addition, vertical side posts (e.g., side posts 145 and 146) may be attached to beams 141 and 142 along the length L of frame 140 to define an area for an opening or window (e.g., window 147) in a side wall (e.g., side wall S1) of frame 140. The window (e.g., window 147) may open to the interior of frame 140, which includes a cooling fluid channel (cooling fluid channel 155). In addition, the end posts (e.g., end posts 143 and 144) may include an opening (e.g., slot 150) that provides access from a direction along the length of frame 140 (e.g., the x direction) to the interior of the frame.

[0044] In some implementations, slot 150 can have a rectangular profile.A plurality of slots similar to slot 150 can be defined within frame 140.

[0045] In an example implementation, the frame 140 may have a modular structure. For example, the frame 140 may include modules M1, M2, M3, etc. arranged in a row. A cooling fluid passage (cooling fluid passage 155) may pass through each of these modules in sequence. The modules (e.g., modules M1, M2, M3, etc.) may be interconnected by slots (e.g., slot 150) through which a cooling fluid passage (cooling fluid passage 155) may pass from one module to the next (e.g., module M1 to module M2, etc.).

[0046] Each module (e.g., module M1) may include a window (e.g., window 147) formed in a side wall (e.g., side wall S1) on one side of the frame and a corresponding window (e.g., window 149) formed in another side wall (e.g., side wall S2 parallel to side wall S1) on the opposite side of the frame. Window 147 and window 149 may be aligned with each other (e.g., aligned to be parallel to each other).

[0047] Each individual power electronic device module (e.g., power electronic device module 200A) disposed along two sides of the frame 140 (e.g., in rows R1 and R2) may cover (close) and seal a corresponding opening or window (e.g., window 147) in a side wall (e.g., side wall S1) of the frame 140. In an example implementation, an O-ring and groove arrangement (e.g., O-ring and groove arrangement 148) may be disposed around a perimeter P of the opening or window (e.g., window 147). The O-ring and groove arrangement between the power electronic device module (e.g., power electronic device module 200A) and the side wall (e.g., side wall S1) of the frame 140 may be used to seal the opening or window (e.g., window 147) to confine the cooling fluid to the cooling fluid channels (cooling fluid channels 155, 156) within the three-dimensional hollow rectangular frame (e.g., frame 140). Figure 1B ).

[0048] Figure 1C Also shown are covers (e.g., cover 112, cover 114), which may be applied to the sides of the frame 140 (e.g., side wall S1) to cover and protect power electronic device modules (e.g., power electronic device module 200A) disposed along two side walls of the frame 140 (e.g., in rows R1 and R2).

[0049] The cover plates 112 , 114 may be aligned, for example, along a plane that is substantially parallel to the cooling fluid passages 155 in the frame 140 (eg, along a longitudinal direction of the fluid passages).

[0050] Figure 1D For example, Figure 1A A side view of an integrated power electronic device package 100 is shown. Figure 1CIn the view shown, only the power terminals 212 and signal terminals 214 of the power electronic device module (e.g., power electronic device module 200A) included in the integrated power electronic device package 100 are visible. Other details of the body and frame 140 of the power electronic device module 200A (arranged, for example, in row R1) are shown in FIG. Figure 1A Not visible in the view shown as they may be hidden beneath cover plate 112 .

[0051] Figure 1E For example, Figure 1A A bottom view of the integrated power electronic device package 100 is shown. Figure 1D In the view shown, only the power terminals 212 of the power electronic device modules (e.g., power electronic device module 200A) included in the integrated power electronic device package 100 are visible. Other details of the body and frame 140 of the power electronic device module 200A (arranged, for example, in rows R1 and R2) are shown in FIG. Figure 1A Not visible in the view shown as they may be hidden beneath the beams 142 of the frame 140 .

[0052] Figure 1F For example, Figure 1A An end view of the integrated power electronic device package 100 (eg, Figure 1B ). This view shows the interior of the frame 140 as seen through an end port (e.g., input port 124) provided on an end plate (e.g., end plate 120) for allowing a cooling fluid to flow through the frame 140. Specifically, this view shows that the fin array (e.g., Figure 2A The pin fins 232 in FIG. 1 may extend outwardly from a base plate of the power electronics module (disposed on either side of the frame 140 ) to the cooling fluid channels 155 ( Figure 1B ) for allowing cooling fluid to flow from the input port through the frame 140 to the output port.

[0053] In some implementations, openings (eg, lumens) associated with the input port 124 and / or the output port 122 define at least some portion of the cooling fluid passage 115. In some implementations, the input port 124 and / or the output port 122 define at least some portion of the cooling fluid passage 115.

[0054] Pin fins (on the baseplate attached to the substrate of the power electronics module) that protrude into the flow of cooling fluid through the frame 140 provide additional surface contact area for transferring heat from the baseplate to the cooling fluid.

[0055] In an example implementation, pin-fins (on the substrate of the power electronics module) that protrude into the flow of cooling fluid through the frame 140 may have a fluid dynamic shape. The fluid dynamic shape of the pin-fins may be designed to promote laminar flow (e.g., non-turbulent flow) of the cooling fluid across the substrate (e.g., substrate 230) and through the pin-fin arrays of the power electronics module on either side of the cooling fluid channels 155 disposed in the frame 140.

[0056] In some example implementations, the hydrodynamic shape of the pin-fins can be a fish-like (or teardrop-like) shape.

[0057] Figure 2B (It was previously Figure 2A 2 (an exploded view of a portion of a view of an example power electronics module shown) shows pin fins (e.g., pin fins 232) in a fish-like or teardrop-like shape disposed on a base plate (e.g., base plate 230) attached to a substrate (substrate 220) of the power electronics module. Figure 2B As shown, pin-fin 232 may have a fish-like (or teardrop-like) shape with a head portion 232H and a tail portion 232T. Pin-fin 232 may have a flat top surface (eg, surface PS) at a vertical pin height (eg, pin height PH) above substrate 230 .

[0058] The flow direction of the cooling fluid (in the cooling fluid channel 155) across the base plate, over and through the pin fins (eg, pin fins 232) is in the direction of Figure 2B In an example implementation, the base plate 230 attached to the substrate 220 of the power electronics module can be oriented so that the head portion (e.g., head portion 232H) of the pin-fins (e.g., pin-fins 232) first enters the flow of the cooling fluid (such that the flow of the cooling fluid is in a direction from the head portion 232H to the tail portion 232T).

[0059] In some example implementations, the hydrodynamic shape of the pin fin may include a truncated conical portion (ie, a frustum).The pin fin may include a cylindrical shaft with a portion tapered to form a truncated conical portion (ie, a frustum) at one end of the cylindrical shaft.

[0060] Figure 2C An exploded view of a portion of a baseplate (e.g., baseplate 330) having pin fins (e.g., pin fin 242) that include frustums (i.e., truncated conical shapes) is shown. The baseplate may be attached to a substrate (substrate 220) of a power electronics module. Figure 2CAs shown, pin fin 242 may include a cylindrical shaft 242C that tapers to a frustum 242F. Pin fin 242 may have a flat top surface (e.g., surface PS) on top of frustum 242F at a vertical pin height (e.g., pin height PH) above substrate 330. A slot (e.g., slot 242S) may be formed (e.g., cut) in the top surface of frustum 242F.

[0061] In an example assembly of the integrated power electronic device package 100, the power electronic device module (e.g., the power electronic device module 200A) can be positioned so that the top surfaces (e.g., the surface PS) of the pin-fins (e.g., the pin-fin 232 or the pin-fin 242) associated with a pair of power electronic device modules disposed on opposite sides of the frame 140 are close in distance and may even contact each other in the frame 140 (e.g., Figure 3A and Figure 3B as shown).

[0062] For example, Figure 3A A cross-sectional view (in the zy plane) of an arrangement of pin fins (e.g., pin fin 232) associated with a pair of power electronics modules (e.g., power electronics module 200A) disposed on opposite sides of a frame 140 in an integrated power electronics package 100 is shown. For visual clarity, Figure 3A Elements of the frame 140 are omitted and only elements of the opposing power electronics module (eg, power electronics module 200A) are shown. Figure 3A As shown, the top surfaces (e.g., surface PS) of the fish-shaped or teardrop-shaped pin-fins (e.g., pin-fin 232) extending from the substrate (substrate 230) of the opposing power electronic device module (e.g., power electronic device module 200A) are close in distance along the y-axis and may even touch each other.

[0063] Figure 3B Another example implementation of an arrangement of pin fins (eg, pin fins 242 ) extending from a substrate (substrate 330 ) of an opposing power electronics module (eg, power electronics module 200A) in the integrated power electronics package 100 is shown.

[0064] Figure 3B A cross-sectional view of the integrated power electronics package 100 in the zx plane is shown. Figure 3BThree pairs of power electronic modules (e.g., power electronic module 200A) are shown arranged in rows (e.g., row R1 and row R2) on opposite sides of a frame 140. A base plate 330 attached to a power electronic module (e.g., power electronic module 200A) may include pin fins (e.g., pin fin 242) having a cylindrical axis 242C that tapers to a frustum 242F. The pin fins of the base plate of the power electronic module (e.g., power electronic module 200A) extend into a cooling fluid channel 155 in the frame 140. The pin fins (e.g., pin fin 242) extending from the base plate (base plate 330) of an opposing power electronic module (e.g., power electronic module 200A) may be aligned so that the ends of the pin fins are close in distance along the z-axis and may even touch each other. For example, as shown in FIG. Figure 3B As shown, top surfaces (eg, surface PS) of frustums (eg, frustum 242F) of opposing pin-fins may contact each other.

[0065] In an example implementation, the package includes a frame having a first sidewall and a second sidewall opposite the first sidewall. The frame has at least one opening in the first sidewall and at least one opening in the second sidewall. The frame can be made of metal, plastic, or a composite material.

[0066] The first power electronic device module covers (e.g., closes, seals) the at least one opening in the first side wall with the surface of the substrate in the first power electronic device module. The surface of the substrate in the first power electronic device module is exposed to the interior of the frame through the at least one opening in the first side wall. In addition, the second power electronic device module covers (e.g., closes, seals) the at least one opening in the second side wall with the surface of the substrate in the second power electronic device module. The surface of the substrate in the second power electronic device module is exposed to the interior of the frame through the at least one opening in the second side wall.

[0067] The first side wall, the surface of the substrate of the first power electronic device module, the second side wall and the surface of the substrate of the second power electronic device module together define a cooling fluid channel passing through the frame. A cooling fluid flow can flow through the surface of the substrate of the first power electronic device module and the surface of the substrate of the second power electronic device module in the cooling fluid channel to remove heat from the power electronic device modules.

[0068] In some example implementations, the package includes a frame having a cooling fluid passage through the frame. The cooling fluid passage is formed between a first sidewall and a second sidewall, the second sidewall being opposite the first sidewall. The frame includes a first plurality of openings and a second plurality of openings, the first plurality of openings being disposed in a first row in the first sidewall next to the cooling fluid passage, and the second plurality of openings being disposed in a second row in the second sidewall opposite the first sidewall next to the cooling fluid passage.

[0069] In the package, a first plurality of power electronic device modules may be disposed beside the first sidewall above the first plurality of openings in the first sidewall, wherein each of the first plurality of openings exposes a surface of a substrate in a corresponding one of the first plurality of power electronic device modules to the cooling fluid channel in the frame. In addition, a second plurality of power electronic device modules may be disposed beside the second sidewall above the second plurality of openings in the second sidewall, wherein each of the second plurality of openings exposes a surface of a substrate in a corresponding one of the second plurality of power electronic device modules to the cooling fluid channel in the frame.

[0070] In some example implementations, the package includes a frame having a cooling fluid channel passing through the frame. The cooling fluid channel is formed between a first side wall and a second side wall, the second side wall being opposite to the first side wall. The frame has at least one opening in the first side wall beside the cooling fluid channel and at least one opening in the second side wall beside the cooling fluid channel.

[0071] The package also includes: a first power electronic device module, which covers the at least one opening in the first side wall, wherein the surface of the substrate in the first power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the first side wall, and a second power electronic device module, which covers the at least one opening in the second side wall, wherein the surface of the substrate in the second power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the second side wall.

[0072] Figure 4 An example method 400 for fabricating the integrated power electronics package 100 is shown.

[0073] Method 400 includes forming a cooling fluid channel (410) between a first side wall and a second side wall in a frame. The frame has at least one opening in the first side wall next to the cooling fluid channel and at least one opening in the second side wall next to the cooling fluid channel. The method also includes: arranging a first power electronic device module to cover the at least one opening in the first side wall, wherein a surface of a substrate in the first power electronic device module is exposed to the cooling fluid channel (420) in the frame through the at least one opening in the first side wall; and arranging a second power electronic device module to cover the at least one opening in the second side wall, wherein a surface of a substrate in the second power electronic device module is exposed to the cooling fluid channel (430) in the frame through the at least one opening in the second side wall. For example, the first power electronic device module and the second power electronic device module may be SSDC packages.

[0074] Forming a cooling fluid passage through the hollow frame may include disposing an inlet port on a first end of the hollow frame and disposing an outlet port on a second end of the hollow frame opposite the first end.

[0075] Disposing at least one power electronic device module above the at least one opening or window 420 may include sealing the opening or window through the substrate surface of the power electronic device module. Sealing the opening or window may involve disposing an O-ring and groove arrangement around the perimeter of the opening or window on at least one side wall of the rectangular cylindrical structure. In some specific implementations, an adhesive (sealant) disposed around the perimeter of the opening or window on at least one side wall of the rectangular cylindrical structure may be used to seal the opening.

[0076] Disposing at least one power electronics module above the at least one opening or window 420 may also include attaching a heat sink or substrate to a substrate surface of the power electronics module. In addition, attaching the heat sink or substrate to the substrate surface of the power electronics module may include exposing the substrate to cooling fluid channels in the hollow frame. In example implementations, the substrate may include at least one pin fin extending from the substrate. In some example implementations, the at least one pin fin may have a teardrop shape. In some example implementations, the at least one pin fin may include a truncated cone portion.

[0077] In an example implementation, wherein at least one side wall of the rectangular cylindrical structure is a first side wall, at least one opening or window is a first window, and at least one power electronic device module is a first power electronic device module, method 400 may further include positioning a second power electronic device module on a second window in a second side wall opposite to the first window in the first side wall, such that a substrate surface of the second power electronic device module covers the second window and is exposed to a cooling fluid channel in the hollow frame.

[0078] In some example implementations, method 400 may further include aligning the pin-fins on the substrate of the first power electronic device module with the pin-fins on the substrate of the second power electronic device module such that top end surfaces of the two pin-fins contact each other.

[0079] In some example implementations, method 400 may further include aligning pin fins on a substrate of a first power electronic device module with pin fins on a substrate of a second power electronic device module such that top end surfaces of the two pin fins are separated by a distance no greater than 5% to 10% of the pin height.

[0080] Various specific implementations described herein are given only by way of example and are only for the purpose of illustration.It should also be understood that for the purpose of this disclosure, when an element such as a layer, a zone, a part or a substrate is mentioned on another element, mechanically connected to another element, electrically connected to another element, coupled to another element, or electrically coupled to another element, the element may be directly on another element, connected to another element, or coupled to another element, or one or more intermediate elements may be present.On the contrary, when an element is mentioned directly on another element or layer, directly connected to another element or layer, or directly coupled to another element or layer, there is no intermediate element or layer.Although the term may not be used in the entire specific embodiment directly on ..., directly connected to ..., or directly connected to ..., the element shown as being directly located on an element, directly connected or directly connected can be mentioned in this manner.The claims of the present application may be revised to narrate the exemplary relationship described in the specification and / or shown in the accompanying drawings.

[0081] As used in this specification, unless the context indicates otherwise, the singular may include the plural. In addition to the orientations shown in the drawings, spatially relative terms (e.g., above, above, above, below, below, below, below, etc.) are intended to cover different orientations of the device in use or operation. In some embodiments, the relative terms above and below may include vertically above and vertically below, respectively. In some embodiments, the term adjacent may include lateral adjacent or horizontal adjacent.

[0082] Some implementations may be implemented using various semiconductor processing and / or packaging techniques. Some implementations may be implemented using various types of semiconductor processing techniques associated with semiconductor substrates including, but not limited to, for example, silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), etc.

[0083] Although certain features of the specific implementations described have been described as described herein, many modifications, alternatives, variations, and equivalents will now occur to those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover all such modifications and variations that fall within the scope of the embodiments. It should be understood that these modifications and variations are presented only by way of example and not limitation, and that various changes in form and detail may be made. In addition to mutually exclusive combinations, any part of the apparatus and / or method described herein may be combined in any combination. The embodiments described herein may include various combinations and / or sub-combinations of the functions, components, and / or features of the different embodiments described.

Claims

1. A package (100), comprising: a frame (140) having a first side wall and a second side wall opposite the first side wall, the frame having at least one opening (147) in the first side wall and at least one opening (149) in the second side wall; A first power electronic device module (200A), the first power electronic device module covering at least one opening in the first side wall, wherein a surface of a substrate (220) in the first power electronic device module is exposed to the interior of the frame through the at least one opening in the first side wall; and a second power electronic device module (200A), the second power electronic device module covering at least one opening in the second side wall, wherein a surface of a substrate (220) in the second power electronic device module is exposed to the interior of the frame through the at least one opening in the second side wall, The first side wall, the surface of the substrate of the first power electronic device module, the second side wall and the surface of the substrate of the second power electronic device module jointly define a cooling fluid channel (155) passing through the frame.

2. The package according to claim 1, wherein: The surface of the substrate in the first power electronic device module is a first surface of the substrate, and the first power electronic device module is a single-sided direct cooling (SSDC) package including a power semiconductor device mounted on a second surface of the substrate opposite to the first surface of the substrate.

3. The package according to claim 1, further comprising: an inlet port disposed at a first end of the frame; and An outlet port is disposed at a second end of the frame opposite the first end.

4. The package according to claim 1, wherein: The surface of the substrate in the first power electronics module covering the at least one opening seals the at least one opening in the first sidewall beside the cooling fluid channel.

5. The package according to claim 4, wherein: An O-ring and groove arrangement is disposed around a perimeter of at least one opening in the first side wall to seal the at least one opening. 6 . The package of claim 4 , an adhesive sealant disposed around a perimeter of at least one opening in the first sidewall to seal the at least one opening.

7. The package according to claim 1, wherein: A baseplate is attached to the surface of the substrate of the first power electronics module exposed to the cooling fluid channel in the frame, and the baseplate includes at least one pin fin extending from the baseplate into the cooling fluid channel.

8. The package according to claim 7, wherein: The at least one pin-fin has a teardrop-like shape or comprises a truncated conical portion.

9. The package according to claim 1, wherein: The first power electronic device module includes a first substrate having at least a first pin fin extending from the first substrate into the cooling fluid channel, and the second power electronic device module includes a second substrate having at least a second pin fin extending from the second substrate into the cooling fluid channel, and wherein the first substrate and the second substrate are aligned such that a top end surface of the first pin fin contacts a top end surface of the second pin fin.

10. The package according to claim 1, wherein: The first power electronic device module includes a first substrate having at least a first pin fin extending from the first substrate into the cooling fluid channel, and the second power electronic device module includes a second substrate having at least a second pin fin extending from the second substrate into the cooling fluid channel, and wherein the first substrate and the second substrate are aligned such that the top end surfaces of the first pin fins are separated by a distance no greater than 10% of the pin height.

11. A package (100), comprising: A frame (140), the frame having a cooling fluid passage (155) passing through the frame, the cooling fluid passage being formed between a first side wall and a second side wall, the second side wall being opposite to the first side wall, the frame comprising a first plurality of openings (147) and a second plurality of openings (149), the first plurality of openings being arranged in a first row (R2) in the first side wall beside the cooling fluid passage, and the second plurality of openings being arranged in a second row (R1) in the second side wall opposite to the first side wall beside the cooling fluid passage; a first plurality of power electronic device modules (200A) disposed adjacent to the first sidewall above the first plurality of openings in the first sidewall, wherein each of the first plurality of openings exposes a surface of a substrate (220) in a corresponding one of the first plurality of power electronic device modules to the cooling fluid channel in the frame; and A second plurality of power electronic device modules (200A) are arranged beside the second side wall above the second plurality of openings in the second side wall, each of the second plurality of openings exposing a surface of a substrate in a corresponding one of the second plurality of power electronic device modules to the cooling fluid channel in the frame.

12. The package according to claim 11, wherein: A base plate with pin fins is attached to the surface of the substrate in each of the first plurality of power electronic device modules exposed to the cooling fluid channels in the frame and the surface of the substrate in each of the second plurality of power electronic device modules exposed to the cooling fluid channels in the frame.

13. The package according to claim 11, wherein: Each of the first plurality of power electronic device modules and each of the second plurality of power electronic device modules is a single-sided direct cooling (SSDC) package including a power semiconductor device mounted on a surface of the substrate opposite the surface of the substrate exposed to the cooling fluid channel in the frame.

14. The package according to claim 11, wherein: The first plurality of power electronics modules and the second plurality of power electronics modules each include three single-sided direct cooling (SSDC) packages.

15. A method comprising: forming a cooling fluid channel between a first side wall and a second side wall in a frame, the frame having at least one opening in the first side wall beside the cooling fluid channel and at least one opening in the second side wall beside the cooling fluid channel (410); Disposing a first power electronic device module to cover at least one opening in the first side wall, wherein a surface of a substrate in the first power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the first side wall (420); as well as A second power electronic device module is arranged to cover the at least one opening in the second side wall, wherein a surface of a substrate in the second power electronic device module is exposed to the cooling fluid channel (430) in the frame through the at least one opening in the second side wall.

16. The method according to claim 15, wherein: Forming the cooling fluid passage includes disposing an inlet port at a first end of the frame and disposing an outlet port at a second end of the frame opposite the first end.

17. The method according to claim 16, wherein: Providing the first power electronics module to cover the at least one opening in the first sidewall includes sealing the at least one opening in the first sidewall through a surface of a substrate in the first power electronics module.

18. The method according to claim 17, wherein: Sealing at least one opening in the first sidewall through a surface of a substrate in the first power electronic module includes disposing an O-ring and groove arrangement around a perimeter of the at least one opening in the first sidewall beside the cooling fluid channel.

19. The method according to claim 17, wherein: Sealing at least one opening in the first sidewall through a surface of a substrate in the first power electronics module includes disposing an adhesive around a perimeter of the at least one opening in the first sidewall alongside the cooling fluid channel.

20. The method according to claim 15, wherein: Positioning the first power electronic device module to cover at least one opening in the first side wall includes attaching a baseplate to a surface of a substrate in the first power electronic device module and exposing the baseplate to the cooling fluid channel in the frame, and wherein the baseplate includes at least one pin fin extending from the baseplate into the cooling fluid channel.

21. The method according to claim 20, wherein: The at least one pin-fin has a teardrop-like shape or comprises a truncated conical portion.

22. The method according to claim 15, wherein: The first power electronic device module includes a first substrate having at least a first pin fin extending from the first substrate into the cooling fluid channel, and the second power electronic device module includes a second substrate having at least a second pin fin extending from the second substrate into the cooling fluid channel, and wherein the method further includes aligning the first power electronic device module and the second power electronic device module so that a top surface of at least the first pin fin contacts a top surface of at least the second pin fin.

23. The method according to claim 15, wherein: The first power electronic device module includes a first substrate having at least a first pin fin extending from the first substrate into the cooling fluid channel, and the second power electronic device module includes a second substrate having at least a second pin fin extending from the second substrate into the cooling fluid channel, and wherein the method further includes aligning the first power electronic device module and the second power electronic device module such that a top surface of the at least first pin fin and a top surface of the at least second pin fin are separated by a distance no greater than 10% of a pin height.

24. A package, comprising: a frame (140), the frame having a cooling fluid passage (155) passing through the frame, the cooling fluid passage being formed between a first side wall and a second side wall, the second side wall being opposite to the first side wall, the frame having at least one opening (147) in the first side wall beside the cooling fluid passage and at least one opening (149) in the second side wall beside the cooling fluid passage; a first power electronic device module (200A), the first power electronic device module covering at least one opening in the first side wall, wherein a surface of a substrate (220) in the first power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the first side wall; and A second power electronic device module (200A), the second power electronic device module covers at least one opening in the second side wall, wherein a surface of a substrate (220) in the second power electronic device module is exposed to the cooling fluid channel in the frame through the at least one opening in the second side wall.

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