Laser cutting process control method, device and system and storage medium

Abstract

The invention discloses a laser cutting process control method, device and system and a storage medium. The laser cutting process control method comprises the steps that an optimal machining waveform process library with an optimal machining waveform number as an index is established based on machining process parameters of model plates and the optimal machining waveform number; when laser cutting is carried out, the optimal machining waveform number is automatically selected from the optimal machining waveform process library according to plate parameters and issued to the laser device, and the laser device is controlled to call the optimal machining waveform corresponding to the optimal machining waveform number from the optimal machining waveform library according to the optimal machining waveform number. And controlling the laser to emit light according to the optimal processing waveform. Therefore, an operator can complete the plate cutting and blanking task through simple one-key operation, the optimal machining waveform can be automatically selected when the optimal cutting performance of plates made of specific materials and with specific thicknesses is met, usability is good, the cutting performance is high, and the automatic cutting device has obvious competitive advantages in the market.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting, and in particular to a laser cutting process control method and a device, system and storage medium thereof. Background Art

[0002] Laser cutting equipment irradiates the laser generated by the laser onto the surface of the workpiece, causing the workpiece to reach its melting point or boiling point, and at the same time uses high-pressure gas to blow away the molten or vaporized metal. As the relative position of the laser beam and the workpiece moves, a cut is eventually formed in the material, thereby achieving the purpose of cutting.

[0003] Traditional laser cutting equipment currently has the following shortcomings: 1) It requires very high skills for processing operators, and the processing parameters need to be set based on experience according to the material and thickness of the plate. Only by setting reasonable processing parameters can a satisfactory processing effect be obtained. If the operator's skills do not meet the requirements, the processing quality and processing effect will be greatly reduced. 2) It is also necessary to consider the influence of different factors such as plate material, plate thickness, laser light output power, etc., and be compatible with various usage scenarios and equipment component combinations produced by different suppliers. It can only guarantee that most scenarios can be used normally, but cannot guarantee optimal performance. 3) Usually, a square wave signal of pulse width modulation (PWM) is used to control the laser light output, and only the frequency and duty cycle parameters can be adjusted. For the application scenarios of special laser cutting equipment, only using a square wave signal of a certain frequency and duty cycle for laser cutting may not necessarily achieve optimal performance. Summary of the invention

[0004] The embodiments of the present invention aim to provide a laser cutting process control method and its device, system, and storage medium, which can solve the problems that the current traditional laser cutting equipment has high skill requirements for operators, the cutting performance is not extremely optimized, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0005] In order to solve the above technical problems, a first aspect of the present invention provides a laser cutting process control method, comprising:

[0006] Based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library is established with the optimal processing waveform number as an index;

[0007] When performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform.

[0008] Optionally, the optimal processing waveform number corresponds to an optimal processing waveform, and the optimal processing waveform is obtained after cutting tests on various types of plates based on a processing waveform edited by a user on a laser.

[0009] Optionally, the processing waveform edited by the user on the laser is obtained after cutting tests on various types of plates, including:

[0010] Select the processing waveform editing module provided by the user based on the laser to edit the processing waveform of the laser output power;

[0011] Based on the processing waveform and the expert operation experience library, cutting tests are performed on various types of plates to obtain the optimal processing waveforms for various types of plates.

[0012] Optionally, the step of establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters of the model plate and the optimal processing waveform number includes:

[0013] Each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and processing parameters are respectively combined into an optimal processing waveform process, thereby obtaining a number of optimal processing waveform processes corresponding to various types of plates;

[0014] An optimal processing waveform process library for laser cutting is established with the optimal processing waveform number as an index, and the optimal processing waveform process library is stored in a process card.

[0015] Optionally, the automatically selecting the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and sending it to the laser includes:

[0016] Get the plate type selected by the user in the cutting operation interface;

[0017] Determining plate parameters according to the selected plate type;

[0018] Automatically selecting an optimal processing waveform number from the optimal processing waveform process library based on the plate parameters;

[0019] The optimal processing waveform number is sent to the laser, and the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number.

[0020] Optionally, the optimal processing waveform library is established based on the optimal processing waveform and its corresponding optimal processing waveform number, with the optimal processing waveform number as an index.

[0021] Optionally, the optimal processing waveform library is established based on the optimal processing waveform and its corresponding optimal processing waveform number with the optimal processing waveform number as an index, including:

[0022] Add the optimal processing waveform number to each optimal processing waveform in sequence;

[0023] Each type of plate and its corresponding optimal processing waveform number and optimal processing waveform are respectively composed of an optimal processing waveform, and then a number of optimal processing waveforms corresponding to various types of plates are obtained, and an optimal processing waveform library indexed by the optimal processing waveform number is established, and the optimal processing waveform library is stored in the laser.

[0024] Accordingly, the second aspect of the present invention provides a laser cutting process control device, which is applied to the laser cutting process control method described in the first aspect of the present invention. The laser cutting process control device includes:

[0025] Establishing a module for establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing parameters of the model plate and the optimal processing waveform number;

[0026] The control module is used to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser during laser cutting, control the laser to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and emit light according to the optimal processing waveform.

[0027] Accordingly, the third aspect of the present invention provides a laser cutting process control system, comprising: a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the computer program, when executed by the processor, implements the laser cutting process control method described in the first aspect of the present invention.

[0028] Correspondingly, the fourth aspect embodiment of the present invention provides a storage medium, on which a program of a laser cutting process control method is stored. When the program of the laser cutting process control method is executed by a processor, the laser cutting process control method described in the first aspect embodiment of the present invention is implemented.

[0029] Compared with the prior art, the present invention provides a laser cutting process control method and its device, system, and storage medium. The laser cutting process control method includes establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters and the optimal processing waveform number of the model plate; when performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform. Thus, by establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters and the optimal processing waveform number of the model plate, the laser cutting equipment can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser. The laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the issued optimal processing waveform number to control the light emission, so that the operator can complete the plate cutting and blanking task with a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of the plate of a specific material and a specific thickness is met. It has good ease of use and high cutting performance, and will have obvious competitive advantages in the market. It can solve the problems that the current traditional laser cutting equipment has high operator skill requirements, the cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0031] Figure 1 This is a schematic diagram of a pulse width modulated square wave signal with a frequency of 1Hz and a duty cycle of 50% used by traditional laser cutting equipment;

[0032] Figure 2 This is a schematic diagram of a square pulse width modulation wave signal with a frequency of 2Hz and a duty cycle of 70% used by traditional laser cutting equipment;

[0033] Figure 3 It is a flow chart of a laser cutting process control method provided by the present invention;

[0034] Figure 4 It is a structural schematic diagram of a laser cutting device provided by the present invention;

[0035] Figure 5 It is a structural schematic diagram of a laser provided by the present invention;

[0036] Figure 6 It is a schematic diagram of a processing waveform editing module in a laser provided by the present invention completing editing of a processing waveform of a cycle;

[0037] Figure 7 It is a schematic diagram of a laser light output control module in the present invention automatically completing continuous light output;

[0038] Figure 8 It is a structural schematic diagram of a laser cutting process control device provided by the present invention;

[0039] Fig. 9 It is a structural schematic diagram of a laser cutting process control system provided by the present invention. DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "bottom" etc. used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0041] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification and in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0042] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0043] Laser cutting equipment irradiates the laser generated by the laser onto the surface of the workpiece, causing the workpiece to reach its melting point or boiling point, and at the same time uses high-pressure gas to blow away the molten or vaporized metal. As the relative position of the laser beam and the workpiece moves, a cut is eventually formed in the material, thereby achieving the purpose of cutting.

[0044] Laser cutting replaces traditional mechanical tools with invisible laser beams. It has the characteristics of high precision, fast cutting speed, smooth incision, automatic typesetting to save materials, and low processing cost. It has gradually become the preferred processing solution for metal sheet cutting. During the cutting process using laser cutting equipment, the mechanical part of the laser cutter head has no contact with the workpiece, and will not scratch the surface of the workpiece during work; the laser cutting speed is fast, the incision is smooth and flat, and generally no subsequent processing is required; the cutting heat affected zone is small, the plate deformation is small, and the cutting seam is narrow (0.1mm~0.3mm); the incision has no mechanical stress and no shear burrs; the processing accuracy is high, the repeatability is good, and the material surface is not damaged; CNC programming can process any plane diagram, and can cut a large whole plate without opening a mold, which is economical and time-saving. Laser cutting technology is developing at an unprecedented speed, with broad development prospects and huge application space.

[0045] Traditional laser cutting equipment has very high skill requirements for processing operators. It is necessary to set processing parameters based on experience according to the material and thickness of the plate (such as selecting the light power, the frequency and duty cycle of the laser, which auxiliary cutting gas to use, whether to use positive or negative focus cutting, etc.). Only by setting reasonable processing parameters can a satisfactory processing effect be obtained. If the operating staff's skills do not meet the requirements, the processing quality and processing effect will be greatly reduced. It is of great significance to make the processing parameters of the laser cutting machine fool-proof so that the operator can complete the plate cutting and unloading tasks with a simple one-button operation.

[0046] Traditional laser cutting equipment also needs to consider the influence of different factors such as plate material, plate thickness, laser output power, etc., and is compatible with various usage scenarios and equipment component combinations produced by different suppliers. It can only guarantee normal use in most scenarios, but cannot guarantee optimal performance. Under the conditions of increasingly refined division of labor in modern industrial production, a laser cutting device only processes one or several plates of specific materials and specific thicknesses, but the processing speed must be extremely fast to achieve the goal of minimizing processing costs. Special laser cutting equipment developed for cutting plates of specific materials and specific thicknesses, with extreme performance optimization of cutting speed and cutting effect, will be welcomed by users and have a wide range of application scenarios.

[0047] Traditional laser cutting equipment usually uses a square wave signal of pulse width modulation (PWM) to control the laser light, and only the frequency and duty cycle parameters can be adjusted. That is, the laser light control can only adjust the power amplitude, frequency and duty cycle, and usually uses continuous light or pulse square wave to emit light. Figure 1 The figure shows a pulse width modulated square wave signal with a frequency of 1 Hz and a duty cycle of 50% used in conventional laser cutting equipment. Figure 2The figure shows a schematic diagram of a square pulse width modulated wave signal with a frequency of 2Hz and a duty cycle of 70% used by traditional laser cutting equipment. For the application scenarios of special laser cutting equipment, the performance of laser cutting may not be optimal if only a square wave signal with a certain frequency and duty cycle is used. The processing waveform of the laser output power can be arbitrarily controlled. Through long-term cutting experiments, the processing waveform of the output power used for the optimal cutting performance of a specific material and a specific thickness of plate can be obtained. Automatically selecting the optimal processing waveform in the application scenarios of special laser cutting equipment has become a new topic in the research and development of laser cutting equipment.

[0048] To this end, in view of the above-mentioned shortcomings of the traditional laser cutting equipment that has high requirements for operator skills, the cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled, the present invention provides a laser cutting process control method, by establishing an optimal processing waveform process library with the optimal processing waveform number as the index based on the processing parameters of the model plate and the optimal processing waveform number, so that the laser cutting equipment can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser, and the laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform according to the issued optimal processing waveform number to control the light, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of the plate of a specific material and a specific thickness is met, with good ease of use and high cutting performance, and will have obvious competitive advantages in the market. It can solve the problems that the current traditional laser cutting equipment has high requirements for operator skills, the cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0049] In order to facilitate understanding of the above inventive concept of the present invention, the above inventive concept of the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments.

[0050] In one embodiment, Figure 3 As shown, the present invention provides a laser cutting process control method, comprising:

[0051] S1. Based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library is established with the optimal processing waveform number as the index;

[0052] S2. When performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform.

[0053] In this embodiment, a laser cutting process control method is provided, including establishing an optimal processing waveform process library with an optimal processing waveform number as an index based on the processing process parameters and the optimal processing waveform number of the model plate; when performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform. Thus, by establishing an optimal processing waveform process library with an optimal processing waveform number as an index based on the processing process parameters and the optimal processing waveform number of the model plate, the laser cutting equipment can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser, and the laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the sent optimal processing waveform number to control the light, so that the operator can complete the plate cutting and blanking task through a simple one-button operation, and can automatically select the optimal processing waveform when the optimal cutting performance of the plate of a specific material and a specific thickness is met, the ease of use is good, the cutting performance is high, and it will have obvious competitive advantages in the market. It can solve the problems that traditional laser cutting equipment has high requirements on operator skills, cutting performance has not been optimized, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0054] In one embodiment, Figure 3 As shown, the present invention provides a laser cutting device 100, comprising a laser cutting process control device 10 and a laser 20 connected in communication; wherein:

[0055] The laser 20 is used to provide a processing waveform for editing the laser output power for the user, and to use the processing waveform to perform cutting tests on various types of plates, to obtain a number of optimal processing waveforms corresponding to the various types of plates, and to establish and store an optimal processing waveform library indexed by the optimal processing waveform number according to the multiple optimal processing waveforms and their corresponding optimal processing waveform numbers;

[0056] The laser cutting process control device 10 is used to establish and store an optimal processing waveform process library indexed by the optimal processing waveform number according to the processing process parameters and optimal processing waveform numbers of various types of plates, and to set plate parameters, and automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser 20;

[0057] The laser 20 is also used to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10 to control the light emission and complete the workpiece processing.

[0058] In this embodiment, a laser cutting device is provided, including a laser cutting process control device and a laser connected in communication; the laser is used to provide a processing waveform for editing the laser output power to the user, and use the processing waveform to perform cutting tests on various types of plates to obtain a number of optimal processing waveforms corresponding to various types of plates, and establish an optimal processing waveform library indexed by the optimal processing waveform number based on the several optimal processing waveforms and their corresponding optimal processing waveform numbers and store them; the laser cutting process control device is used to establish an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters and the optimal processing waveform number of various types of plates and store them, and set the plate parameters, and automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser; the laser is also used to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number sent by the laser cutting process control device to control the light output, so as to complete the workpiece processing. The laser cutting equipment of the present invention provides users with the processing waveform for editing the laser light output power on the laser, so that users can edit any processing waveform that controls the laser light output power to meet the laser processing requirements of the workpiece; an optimal processing waveform library is established through several optimal processing waveforms obtained through cutting tests, so that the laser cutting equipment can perform ultimate performance optimization on cutting speed and cutting effect; at the same time, an optimal processing waveform process library is formed by several optimal processing waveforms and their corresponding optimal processing waveform numbers, so that the laser cutting process control device can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser, and the laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number sent by the laser cutting process control device to control the light output, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of plates of specific materials and specific thicknesses is met. As a result, the laser cutting equipment of the present invention has the processing waveform of the laser light that can be edited arbitrarily, and the cutting performance of plates of specific materials and specific thicknesses is extremely optimized. The one-key cutting easy-to-use mode is used for processing, which has good usability and high cutting performance, and will have obvious competitive advantages in the market. It can solve the problems that the current traditional laser cutting equipment has high requirements for operator skills, the cutting performance is not extremely optimized, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0059] In one embodiment, in step S1, an optimal processing waveform process library indexed by the optimal processing waveform number is established based on the processing parameters of the model plate and the optimal processing waveform number.

[0060] Among them, the optimal processing waveform number corresponds to the optimal processing waveform. The optimal processing waveform is obtained after cutting tests on various types of plates based on the processing waveform edited by the user on the laser. Specifically, it includes: selecting the processing waveform of the laser output power edited by the user based on the processing waveform editing module provided by the laser; cutting tests are performed on various types of plates based on the processing waveform and the expert operation experience library to obtain the optimal processing waveforms for various types of plates.

[0061] like Figure 4 As shown, the laser cutting device 100 includes a laser cutting process control device 10 and a laser 20 which are communicatively connected.

[0062] The laser 20 is used to provide users with a processing waveform for editing the laser output power, and use the processing waveform to perform cutting tests on various types of plates to obtain a number of optimal processing waveforms corresponding to the various types of plates, and establish and store an optimal processing waveform library indexed by the optimal processing waveform number based on the several optimal processing waveforms and their corresponding optimal processing waveform numbers.

[0063] The laser cutting process control device 10 is used to establish and store an optimal processing waveform process library indexed by the optimal processing waveform number according to the processing process parameters and optimal processing waveform numbers of various types of plates, and to set plate parameters, and automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser 20.

[0064] Specifically, the laser 20 provides a processing waveform for the user to edit the laser output light power.

[0065] Specifically, Figure 5 As shown, the laser 20 includes a processing waveform editing module 21, which is used to provide users with the processing waveform of the laser output power. The user only needs to use the processing waveform editing module 21 to complete the editing of a cycle of the processing waveform, and does not need to edit more cycles of processing waveforms.

[0066] like Figure 6 As shown in FIG. 1 , it is a schematic diagram of a user using the processing waveform editing module 21 to complete editing of a processing waveform of a cycle. Figure 6 In the process, the user selects a high-performance laser that supports the waveform editing function. The user can use the processing waveform editing module 21 to arbitrarily edit the light-emitting processing waveform within one cycle according to the application scenario and the final cutting effect requirements. There is no need to edit the processing waveforms of more cycles, and the optimal processing waveform number is used as the index to store it in the laser 20.

[0067] By adopting a high-performance laser that supports free waveform editing and setting a processing waveform editing module in the laser, the laser can support the processing waveform editing function. The user only needs to use the processing waveform editing module to simply edit a processing waveform that meets the laser output power within one cycle, so that the laser can control the laser light output according to any processing waveform edited by the user, thereby meeting the laser processing requirements of the workpiece.

[0068] The laser 20 also uses the processing waveform to perform cutting tests on various types of plates to obtain several optimal processing waveforms corresponding to various types of plates, and establishes and stores an optimal processing waveform library indexed by the optimal processing waveform number based on the several optimal processing waveforms and their corresponding optimal processing waveform numbers.

[0069] Specifically, based on the expert operation experience database, the laser 20 uses various processing waveforms edited by the processing waveform editing module 21 to perform cutting tests on various types of plates of specific materials and specific thicknesses, finds the processing waveform that is most suitable for processing the above-mentioned various types of plates, and obtains the optimal processing waveforms for various types of plates. One type of plate only forms a one-to-one correspondence with one optimal processing waveform, thereby forming the optimal processing waveform for the type of plate.

[0070] Specifically, for various types of plates with different materials and thicknesses, the laser 20 uses various processing waveforms edited by the processing waveform editing module 21 of the laser 20 based on the expert operation experience database and according to the plate parameters of various types of plates (including plate material and plate thickness), and conducts a large number of cutting test experiments on various types of plates, records the test experiment result data, and finds the most ideal processing waveform for cutting various types of plates through comparative analysis of a large number of test experiment result data, thereby obtaining several optimal processing waveforms corresponding to various types of plates, and then obtaining several optimal processing waveforms.

[0071] After obtaining several optimal processing waveforms, the laser 20 sequentially adds an optimal processing waveform number to each optimal processing waveform. Each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and optimal cutting parameters are respectively combined into an optimal processing waveform corresponding to the type of plate in the form of a preset optimal processing waveform table, and then several optimal processing waveforms corresponding to various types of plates are obtained, and an optimal processing waveform library indexed by the optimal processing waveform number is established.

[0072] The optimal processing waveform library is stored in the laser 20, and the optimal processing waveform library can be called subsequently according to the optimal processing waveform number as the index, that is, after the laser 20 is powered on, the program in the light output control module 23 automatically reads the optimal processing waveform from the optimal processing waveform library according to the optimal processing waveform number for use.

[0073] The preset optimal processing waveform table format used by the optimal processing waveform library is shown in Table 1. It can be understood that Table 1 only illustrates part of the optimal processing waveform data in the optimal processing waveform library, not all of the optimal processing waveform data in the optimal processing waveform library.

[0074] Table 1 Preset optimal processing waveform table format

[0075]

[0076]

[0077] Based on the expert operation experience library, the laser uses the processing waveform to test the cutting of various types of plates, obtains several optimal processing waveforms corresponding to various types of plates, and establishes the optimal processing waveform library based on several optimal processing waveforms and their corresponding optimal processing waveform numbers and stores them in the laser, so that the expert operation experience library can be reused, reducing the dependence on the operator's skills, and it is simple and easy to use. At the same time, it can also optimize the cutting effect and cutting speed for various specific types of plates, establish the optimal processing waveform library and pre-store it in the laser, so that the optimal processing waveform library is established through the cutting test to obtain the optimal processing waveform library, so that the laser cutting equipment can optimize the cutting speed and cutting effect. The optimal processing waveform can be selected from the optimal processing waveform library to adapt to the application needs of different market scenarios, and a variety of special machine cutting equipment (such as 100mm carbon steel thick plate special machine, 5mm stainless steel thin plate special machine, etc.) can be developed to meet various differentiated market needs, save energy and reduce consumption, and bring good economic benefits.

[0078] like Figure 5 As shown, the laser 20 includes a storage module 22 for storing the processing waveforms edited by the user using the processing waveform editing module 21, and storing an optimal processing waveform library formed by a number of optimal processing waveforms obtained through cutting tests and their corresponding optimal processing waveform numbers.

[0079] Specifically, the processed waveform edited by the user using the processed waveform editing module 21 can be stored in the storage module 22 .

[0080] Based on the expert operation experience library, the laser 20 uses various processing waveforms edited by the processing waveform editing module 21 for various types of plates of different materials and thicknesses, and conducts a large number of cutting test experiments on various types of plates to obtain a number of optimal processing waveforms corresponding to various types of plates. Based on the several optimal processing waveforms and their corresponding optimal processing waveform numbers, an optimal processing waveform library indexed by the optimal processing waveform number is established, which can be stored in the storage module 22.

[0081] The optimal processing waveform library is saved in the storage module 22, and the optimal processing waveform library can be called subsequently according to the optimal processing waveform number as the index, that is, after the laser 20 is powered on, the program in the light output control module 23 automatically reads the optimal processing waveform from the optimal processing waveform library in the storage module 22 according to the optimal processing waveform number for use.

[0082] It can be understood that the storage module 22 of the embodiment of the present invention may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory or other memory technology, a compact disk read-only memory (CD-ROM), a digital versatile disk (DVD) or other optical disk storage, a magnetic cassette, a magnetic tape, a magnetic disk storage or other magnetic storage device; the volatile memory can be a random access memory (RAM), and by way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM) Memory), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), Enhanced Synchronous Dynamic Random Access Memory (ESDRAM), SyncLink Dynamic Random Access Memory (SLDRAM), Direct Rambus Random Access Memory (DRRAM).The storage module 22 described in the embodiments of the present invention is intended to include but is not limited to these and any other suitable types of memories.

[0083] Specifically, in step S1, based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library indexed by the optimal processing waveform number is established, including:

[0084] S11, each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and processing parameters are respectively combined into an optimal processing waveform process, thereby obtaining a plurality of optimal processing waveform processes corresponding to various types of plates;

[0085] S12, establishing an optimal processing waveform process library for laser cutting with the optimal processing waveform number as an index, and storing the optimal processing waveform process library in a process card.

[0086] Specifically, the plate parameters include plate material and plate thickness. Figure 8 As shown, the laser cutting process control device 10 includes a process card 13 .

[0087] After obtaining several optimal processing waveforms, the laser cutting process control device 10 will use each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and processing parameters in the form of a preset optimal processing waveform process table to form an optimal processing waveform process corresponding to the type of plate, and then obtain several optimal processing waveform processes corresponding to various types of plates, establish an optimal processing waveform process library for laser cutting indexed by the optimal processing waveform number, and store the optimal processing waveform process library in the process card 13.

[0088] The preset optimal processing waveform process table format used by the optimal processing waveform process library is shown in Table 2. It can be understood that Table 2 only illustrates some of the optimal processing waveform process data in the optimal processing waveform process library, and is not all of the optimal processing waveform process data in the optimal processing waveform process library.

[0089] Table 2 Preset optimal processing waveform process table form

[0090] Sheet Type Auxiliary gas focus Optimal processing waveform number 100mm Carbon Steel oxygen Negative focus 1 100mm Carbon Steel oxygen Negative focus 2 100mm stainless steel Nitrogen Negative focus 3

[0091] In one embodiment, in step S2, when laser cutting is performed, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform, which specifically includes:

[0092] S21, obtaining the plate type selected by the user in the cutting operation interface;

[0093] S22, determining the plate parameters according to the selected plate type;

[0094] S23, automatically selecting an optimal processing waveform number from an optimal processing waveform process library based on the plate parameters;

[0095] S24, sending the optimal processing waveform number to the laser, and controlling the laser to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number.

[0096] Specifically, the laser cutting process control device 10 includes a cutting system software interface, which includes a CAM (Computer Aided Manufacturing) sub-interface and a one-key cutting button. The CAM sub-interface is used to layout the workpiece, and the one-key cutting button is used to start the cutting system software to complete the workpiece cutting task.

[0097] After completing the layout of the workpiece in the CAM sub-interface, and simply setting the plate parameters such as plate material and plate thickness in the cutting system software interface, click the "One-click Cutting" button in the cutting system software interface, and the cutting system software calls the process card 13. The process card 13 receives the layout data issued by the cutting system software, and automatically selects the processing parameters and the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters of the plate material type and plate thickness, and issues the optimal processing waveform number to the laser 20, so that the laser 20 selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10 to control the light. At the same time, the real-time coordinates of the X / Y / Z axis of the machine tool are calculated in real time according to the layout data issued by the cutting system software, and the processing parameters are automatically selected to control the X / Y / Z axis of the machine tool, the cutting head, and the laser to collaboratively complete the workpiece cutting task. In addition, the process card switches the corresponding optimal processing waveform at different process stages according to the layout data sent by the cutting system software, and sends the corresponding optimal processing waveform number to the laser 20 to complete the control of the light-emitting processing waveform.

[0098] In this embodiment, the laser cutting process control device 10 only needs to simply set the plate parameters including the plate material and plate thickness, and automatically selects the optimal processing waveform number from the preset optimal processing waveform process library according to the plate parameters and sends it to the laser, so that the operator can complete the plate cutting task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of a plate of a specific material and a specific thickness is met. Therefore, the laser cutting equipment of the present invention can be processed in an easy-to-use mode of one-key cutting, with good ease of use and high cutting performance, and will have obvious competitive advantages in the market.

[0099] In one embodiment, the laser 20 is also used to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10 to control the light emission and complete the workpiece processing.

[0100] Specifically, Figure 5 As shown, the laser 20 includes a light emission control module 23, which automatically completes continuous light emission by calling the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10.

[0101] The laser 20 uses a light output control module 23 to control the light output, and has a fast response speed, which is at the microsecond level, and can meet the response speed requirements of plate cutting processing. The edited optimal processing waveform is saved in the laser and is parsed and executed by the program in the light output control module 23. The user only needs to complete the editing of the processing waveform within one cycle. The light output control module 23 automatically completes the continuous light output by calling the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10, and the switching of the processing waveform is completed within the microsecond response time.

[0102] like Figure 7 , which is a schematic diagram of the light emission control module 23 automatically completing continuous light emission.

[0103] For example, the light output control module 23 is an FPGA (Field Programmable Gate Array). The laser 20 uses FPGA to control the light output, which has a fast response speed at the microsecond level, and can meet the response speed requirements of the plate cutting process. The edited optimal processing waveform is stored in the laser and is parsed and executed by the program in the FPGA. The user only needs to complete the editing of the processing waveform within one cycle. The FPGA calls the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10 to automatically complete the continuous light output, and the switching of the processing waveform is completed within the microsecond response time.

[0104] In one embodiment, Figure 5 As shown, the laser 20 includes a laser output module 24 , which is connected to the light output control module 23 and is used to output laser according to the optimal processing waveform under the control of the light output control module 23 .

[0105] The present invention provides a laser cutting process control method, which adopts a high-performance laser supporting free waveform editing, and simply edits any processing waveform within a cycle to control the laser to emit light; based on the expert operation experience library, various types of plates are subjected to mass cutting tests by using various processing waveforms edited by the laser, and the optimal processing waveforms of various types of plates are obtained, and are pre-set and stored in the laser; a processing waveform process database of various profiles is established, which includes processing parameters and processing waveform numbers of various profiles, and is stored in a process card; the cutting system software interface only needs to simply set plate parameters such as plate material and plate thickness, and perform a one-key cutting operation to complete the cutting task of the workpiece, and the process card automatically selects the processing parameters and the optimal processing waveform according to the plate parameters, and controls the machine tool X / Y / Z axis, cutting head, and laser to collaboratively complete the cutting task of the workpiece. Thus, the laser cutting equipment can reuse the expert operation experience library, reduce the dependence on the operator's skills, and is simple and easy to use. At the same time, it is also possible to optimize the cutting effect and cutting speed for various specific types of plates, establish an optimal processing waveform library and pre-store it in the laser, so that the optimal processing waveform can be selected from the optimal processing waveform library to adapt to the application needs of different market scenarios, and develop a variety of special machine cutting equipment (such as 100mm carbon steel thick plate special machine, 5mm stainless steel thin plate special machine, etc.) to meet various differentiated market needs, save energy and reduce consumption, and bring good economic benefits. It can solve the problems that traditional laser cutting equipment has high operator skill requirements, cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0106] Based on the same concept, in one embodiment, Figure 8As shown, the present invention further provides a laser cutting process control device 10, which is applied to the laser cutting process control method described in any of the above embodiments. The laser cutting process control device 10 includes:

[0107] Establishing module 11, for establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing parameters of the model plate and the optimal processing waveform number;

[0108] The control module 12 is used to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser during laser cutting, control the laser to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and emit light according to the optimal processing waveform.

[0109] In this embodiment, a laser cutting process control device is provided, including an establishment module for establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters of the model plate and the optimal processing waveform number; a control module for automatically selecting the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and sending it to the laser during laser cutting, controlling the laser to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and emitting light according to the optimal processing waveform. Thus, by establishing a module based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library with the optimal processing waveform number as the index is established, so that the control module can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser. The laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the issued optimal processing waveform number to control the light emission, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of the plate of a specific material and a specific thickness is met. It has good ease of use and high cutting performance, and will have obvious competitive advantages in the market. It can solve the problems that the current traditional laser cutting equipment has high operator skill requirements, the cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0110] It should be noted that the above-mentioned laser cutting process control device embodiment and the laser cutting process control method embodiment belong to the same concept, and the specific implementation process is detailed in the laser cutting process control method embodiment, and the technical features in the laser cutting process control method embodiment are correspondingly applicable in the above-mentioned laser cutting process control device embodiment, which will not be repeated here.

[0111] Based on the same concept, in one embodiment, Figure 5 As shown, the present invention also provides a laser 20, including a processing waveform editing module 21, a storage module 22, a light output control module 23 and a laser output module 24, wherein:

[0112] A processing waveform editing module 21 is used to provide a user with a processing waveform for editing the laser output power;

[0113] The storage module 22 is used to store the processing waveforms edited by the user using the processing waveform editing module 21, and to store an optimal processing waveform library formed by a plurality of optimal processing waveforms obtained through cutting tests and their corresponding optimal processing waveform numbers;

[0114] The light output control module 23 is used to automatically complete continuous light output by calling the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device 10;

[0115] The laser output module 24 is connected to the light output control module 23 and is used to output laser according to the optimal processing waveform under the control of the light output control module 23 .

[0116] In this embodiment, a laser is provided, including a processing waveform editing module, a storage module, a light output control module and a laser output module, wherein: the processing waveform editing module is used to provide a user with a processing waveform for editing the laser light output power; the storage module is used to store the processing waveform edited by the user using the processing waveform editing module, and an optimal processing waveform library formed by storing a number of optimal processing waveforms obtained through cutting tests and their corresponding optimal processing waveform numbers; the light output control module is used to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number issued by the laser cutting process control device to automatically complete continuous light output; the laser output module is connected to the light output control module, and is used to output laser according to the optimal processing waveform under the control of the light output control module.

[0117] The present invention adopts a high-performance laser that supports free waveform editing, and provides users with a processing waveform for editing the laser light output power on the laser. The user only needs to use the processing waveform editing module to simply edit the processing waveform that meets the laser light output power within one cycle, so that the laser can control the laser light output according to any processing waveform edited by the user, meeting the laser processing requirements of the workpiece; through the cutting test to obtain a number of optimal processing waveforms, an optimal processing waveform library is established, so that the laser cutting equipment can optimize the cutting speed and cutting effect to the extreme performance; the laser can select the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform according to the optimal processing waveform number issued by the laser cutting process control device to control the light output. Thereby, the processing waveform of the laser light output of the present invention can be arbitrarily edited, and the cutting performance of the plate of a specific material and a specific thickness is extremely optimized. It can solve the problem that the current traditional laser cutting equipment has high skill requirements for operators, the cutting performance is not extremely optimized, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0118] In this embodiment, the laser 20 is consistent with the laser 20 described in any of the above-mentioned laser cutting equipment embodiments. The specific structure and function can refer to the laser 20 described in any of the above-mentioned laser cutting equipment embodiments, and will not be repeated here.

[0119] It should be noted that the above-mentioned laser embodiment and the laser cutting process control method embodiment belong to the same concept, and the specific implementation process is detailed in the laser cutting process control method embodiment, and the technical features in the laser cutting process control method embodiment are correspondingly applicable in the above-mentioned laser embodiment, which will not be repeated here.

[0120] Based on the same concept, in one embodiment, the present invention also provides a laser cutting process control system, such as Fig. 9 As shown, the laser cutting process control system 900 includes: a memory 902, a processor 901, and one or more computer programs stored in the memory 902 and executable on the processor 901. The memory 902 and the processor 901 are coupled together via a bus system 903. When the one or more computer programs are executed by the processor 901, the following steps of a laser cutting process control method provided in an embodiment of the present invention are implemented:

[0121] S1. Based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library is established with the optimal processing waveform number as the index;

[0122] S2. When performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform.

[0123] The method disclosed in the above embodiment of the present invention can be applied to the processor 901, or implemented by the processor 901. The processor 901 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware or software instructions in the processor 901. The processor 901 may be a general-purpose processor, a DSP, or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 901 can implement or execute the methods, steps and logic block diagrams disclosed in the embodiments of the present invention. A general-purpose processor may be a microprocessor or any conventional processor, etc. In combination with the steps of the method disclosed in the embodiment of the present invention, it can be directly embodied as a hardware decoding processor to execute, or it can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium, which is located in the memory 902. The processor 901 reads the information in the memory 902 and completes the steps of the above method in combination with its hardware.

[0124] It can be understood that the memory 902 in the embodiment of the present invention may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory or other memory technology, a compact disk read-only memory (CD-ROM), a digital versatile disk (DVD) or other optical disk storage, a magnetic cassette, a magnetic tape, a magnetic disk storage or other magnetic storage device; the volatile memory can be a random access memory (RAM), and by way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM Memory), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), Enhanced Synchronous Dynamic Random Access Memory (ESDRAM), SyncLink Dynamic Random Access Memory (SLDRAM), Direct Rambus Random Access Memory (DRRAM).The memories described in the embodiments of the present invention are intended to include, but are not limited to, these and any other suitable types of memories.

[0125] It should be noted that the above-mentioned laser cutting process control system embodiment and method embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, and the technical features in the method embodiment are correspondingly applicable in the laser cutting process control system embodiment, which will not be repeated here.

[0126] In addition, in an exemplary embodiment, an embodiment of the present invention further provides a storage medium, specifically a computer-readable storage medium, for example, including a memory 902 storing a computer program, wherein one or more programs of a laser cutting process control method are stored on the storage medium, and when the one or more programs of the laser cutting process control method are executed by the processor 901, the following steps of a laser cutting process control method provided in an embodiment of the present invention are implemented:

[0127] S1. Based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library is established with the optimal processing waveform number as the index;

[0128] S2. When performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform.

[0129] It should be noted that the laser cutting process control method program embodiment on the above-mentioned computer-readable storage medium and the method embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, and the technical features in the method embodiment are correspondingly applicable in the embodiment of the above-mentioned computer-readable storage medium, which will not be repeated here.

[0130] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0131] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the above embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting process control method, characterized in that: The laser cutting process control method comprises: Based on the processing parameters of the model plate and the optimal processing waveform number, an optimal processing waveform process library is established with the optimal processing waveform number as an index; When performing laser cutting, the optimal processing waveform number is automatically selected from the optimal processing waveform process library according to the plate parameters and sent to the laser, the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and the laser is controlled to emit light according to the optimal processing waveform.

2. The laser cutting process control method according to claim 1, characterized in that: The optimal processing waveform number corresponds to the optimal processing waveform, and the optimal processing waveform is obtained after cutting tests on various types of plates based on the processing waveform edited by the user on the laser.

3. The laser cutting process control method according to claim 2, characterized in that: The processing waveform edited by the user on the laser is obtained after cutting tests on various types of plates, including: Select the processing waveform editing module provided by the user based on the laser to edit the processing waveform of the laser output power; Based on the processing waveform and the expert operation experience library, cutting tests are performed on various types of plates to obtain the optimal processing waveforms for various types of plates.

4. The laser cutting process control method according to claim 2, characterized in that: The method of establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing process parameters of the model plate and the optimal processing waveform number includes: Each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and processing parameters are respectively combined into an optimal processing waveform process, thereby obtaining a number of optimal processing waveform processes corresponding to various types of plates; An optimal processing waveform process library for laser cutting is established with the optimal processing waveform number as an index, and the optimal processing waveform process library is stored in a process card.

5. The laser cutting process control method according to claim 1, characterized in that: The method of automatically selecting the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and sending it to the laser includes: Get the plate type selected by the user in the cutting operation interface; Determining plate parameters according to the selected plate type; Automatically selecting an optimal processing waveform number from the optimal processing waveform process library based on the plate parameters; The optimal processing waveform number is sent to the laser, and the laser is controlled to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number.

6. The laser cutting process control method according to claim 5, characterized in that: The optimal processing waveform library is established based on the optimal processing waveform and its corresponding optimal processing waveform number, with the optimal processing waveform number as an index.

7. The laser cutting process control method according to claim 6, characterized in that: The optimal processing waveform library is established based on the optimal processing waveform and its corresponding optimal processing waveform number with the optimal processing waveform number as an index, and includes: Add the optimal processing waveform number to each optimal processing waveform in sequence; Each type of plate and its corresponding optimal processing waveform number and optimal processing waveform are respectively composed of an optimal processing waveform, and then a number of optimal processing waveforms corresponding to various types of plates are obtained, and an optimal processing waveform library indexed by the optimal processing waveform number is established, and the optimal processing waveform library is stored in the laser.

8. A laser cutting process control device, characterized in that: The laser cutting process control method applied to any one of claims 1 to 7, wherein the laser cutting process control device comprises: Establishing a module for establishing an optimal processing waveform process library indexed by the optimal processing waveform number based on the processing parameters of the model plate and the optimal processing waveform number; The control module is used to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the laser during laser cutting, control the laser to call the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform library according to the optimal processing waveform number, and emit light according to the optimal processing waveform.

9. A laser cutting process control system, characterized in that: include: A memory, a processor, and a computer program stored in the memory and running on the processor, wherein the computer program, when executed by the processor, implements the laser cutting process control method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium stores a program of a laser cutting process control method, and when the program of the laser cutting process control method is executed by a processor, the laser cutting process control method according to any one of claims 1 to 7 is implemented.

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