A wafer grinding device and a wafer edge finding and positioning method

Abstract

The present invention relates to the field of chip manufacturing technology, and provides a wafer grinding device and a wafer edge finding and positioning method. By setting a wafer eccentric positioning component, the wafer to be processed is placed on a positioning suction cup for rotation, and the image recognition device is used to determine that the line connecting the center of the wafer and the center of the wafer feeding suction cup is parallel to the X-axis direction, so as to achieve alignment in the Y-axis direction. Then, the control unit controls the handling component to transfer the wafer along the X-axis direction to the wafer feeding suction cup, so as to achieve compensation in the X-axis direction, and further achieve eccentric calibration of the wafer. Compared with the existing mechanical positioning, vacuum adsorption is carried out only after the positioning is completed or not adsorbed at all, resulting in a large variation. At the same time, the detection devices such as the opposed sensors have a large gap in accuracy compared with the camera due to the size of their light spots, and there are also machining errors in mechanical positioning. Compared with the prior art, it has higher positioning accuracy, which is also beneficial to improving the accuracy of subsequent processing technologies.

Description

Technical Field

[0001] The present invention relates to the technical field of chip cutting, and in particular to a wafer grinding device and a wafer edge finding and positioning method. Background Art

[0002] In the manufacturing process of semiconductor devices, a metal layer is masked or the back of a wafer is thinned by a wafer grinding device. In order to ensure the grinding accuracy, the wafer needs to be positioned and calibrated first. When the existing grinding device performs positioning and calibration, it mainly relies on a mechanical device for positioning, that is, it is composed of structures such as a motor, a gear drive, and a positioning connecting piece. A plurality of positioning pieces are arranged around the adsorption block on the turntable bottom plate, and the positioning pieces are slidably connected to the bottom plate, and the turntable is arranged below the bottom plate; a plurality of connecting components are rotatably connected to the turntable, and one side of each connecting component away from the turntable is rotatably connected to one of the positioning pieces to drive the positioning piece to slide toward or away from the side close to the adsorption block, so as to achieve positioning. In addition, the wafer compensation device can also use a light sensing method to confirm the boundary position of the wafer. This method relies on installing sensors such as opposed light and lasers, adsorbing the wafer on the adsorption block, rotating the wafer, rotating the wafer to one end point of the notch or flat edge, remembering the position at this time, and then rotating to the other end point of the flat edge. The characteristic position of the notch and flat edge is judged by calculating the midpoint of the two position coordinates. At the same time, the light sensing method often requires mechanical positioning to assist in positioning the center of the circle.

[0003] Both of the above two positioning and calibration methods have certain problems: Mechanical positioning can often only achieve the positioning of the center of the circle. However, with the change of technology, customers have gradually started to have requirements for the recognition of features such as notches and flat edges. Mechanical positioning is often difficult to accurately position features such as notches and flat edges, and it is difficult to feedback the position of the current feature. And using the light sensing method to confirm the boundary position of the wafer, this method requires setting light sensors on both the upper and lower sides around the wafer, which will cause great interference to the handling process of the wafer, and often the light beam is too large and there is a certain deviation when detecting in place, so the accuracy is not particularly high. At the same time, the light sensing method often requires mechanical positioning to assist in positioning the center of the circle, and the positioning and calibration process is relatively cumbersome. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer grinding device and a wafer edge finding and positioning method to solve the problems of low positioning and calibration accuracy and cumbersome calibration of the existing wafer grinding device.

[0005] In a first aspect, an embodiment of the present invention provides a wafer grinding device, including: a loading component, a cleaning component, and a wafer eccentric positioning component. The wafer eccentric positioning component includes:

[0006] A wafer feeding suction cup for placing the to-be-processed wafer after eccentric positioning;

[0007] A positioning suction cup for placing a wafer to be processed conveyed from a loading platform, and the positioning suction cup is driven to rotate by a rotation driving mechanism;

[0008] An image recognition device arranged on a workbench for acquiring image information of the wafer to be processed to determine an offset between the center of the wafer to be processed and the wafer placing suction cup in the Y-axis direction;

[0009] A control unit electrically connected to the positioning suction cup, the rotation driving mechanism and the image recognition device, for controlling the rotation driving mechanism to work according to the offset between the center of the wafer to be processed and the wafer placing suction cup in the Y-axis direction, so that the line connecting the center of the wafer to be processed and the center of the wafer placing suction cup is parallel to the X-axis direction, and driving the edge finding mark on the wafer placing suction cup to rotate to the same angle according to the angle of the line connecting the center of the wafer to be processed and the position of the edge finding mark within the field of view of the image recognition device relative to the X-axis direction.

[0010] Optionally, the wafer grinding equipment further includes: a handling assembly arranged on the workbench; the handling assembly is connected to the X-axis driving mechanism on the workbench through a Z-axis driving mechanism;

[0011] The control unit is electrically connected to the X-axis driving mechanism, the Z-axis driving mechanism and the handling assembly, and is used for controlling the handling assembly to transfer the wafer to be processed from the positioning suction cup to the wafer placing suction cup along the X-axis direction after determining that the line connecting the center of the wafer to be processed and the center of the wafer placing suction cup is parallel to the X-axis direction, so as to perform subsequent grinding processes.

[0012] Optionally, the workbench includes: a bench body and a sliding guide rail installed on the bench body; both the bench body and the sliding guide rail extend along the X-axis direction, the Z-axis driving mechanism and the handling assembly are both slidably connected to the sliding guide rail through a Z-axis arm, and the Z-axis arm is driven to move along the X-axis direction by the X-axis driving mechanism.

[0013] Optionally, the rotation driving mechanism is arranged below the positioning suction cup, the rotation driving mechanism is connected to a rotary joint through a belt, and the upper end of the rotary joint is connected to the positioning suction cup through a rotating shaft, so as to drive the rotation of the positioning suction cup through the rotation driving mechanism.

[0014] Optionally, the wafer grinding equipment further includes: a rough grinding station and a fine grinding station. The rough grinding station and the wafer loading suction cup are located on the same side of the workbench, and the fine grinding station is located on the other side of the workbench. The wafer to be processed after eccentric positioning and edge finding sequentially passes through the rough grinding station and the fine grinding station to perform rough grinding and fine grinding processes respectively.

[0015] Optionally, the wafer grinding equipment further includes: a polishing station; the polishing station is located on the same side of the workbench as the fine grinding station, and is used for performing polishing treatment after the wafer is finely ground.

[0016] Optionally, the wafer grinding equipment further includes: a transfer assembly and a wafer backside cleaning station. The transfer assembly is arranged on one side of the wafer loading suction cup and the wafer backside cleaning station, and is used for transferring the polished wafer to the wafer backside cleaning station for backside cleaning.

[0017] Optionally, the wafer grinding equipment further includes: a backlight source; the backlight source is arranged on the side of the positioning suction cup away from the wafer loading suction cup, and is used for supplementing light when the image recognition device acquires the image information of the wafer to be processed.

[0018] In a second aspect, an embodiment of the present invention further provides a wafer edge finding and positioning method, based on a wafer grinding equipment, the wafer grinding equipment includes a control unit and a wafer loading suction cup, a positioning suction cup, an image recognition device and a handling assembly respectively electrically connected to the control unit. The image recognition device is arranged on the workbench and is used for acquiring the image information of the wafer to be processed. The handling assembly is used for transferring the wafer to be processed from the positioning suction cup to the wafer loading suction cup along the X-axis direction. The wafer edge finding and positioning method includes:

[0019] S100, placing the wafer to be processed on the positioning suction cup and adsorbing and fixing it;

[0020] S200, obtaining the position change of the wafer radius relative to the calibration point through the image recognition device, fitting the coordinate positions of the current wafer center, flat edge or notch, so as to determine the offset between the center of the wafer to be processed and the center of the wafer loading suction cup; wherein, the calibration point is the center position of the calibration wafer when it is placed at the center of the positioning suction cup;

[0021] S300, according to the offset between the center of the wafer to be processed and the center of the wafer loading suction cup, controlling the rotation of the positioning suction cup so that the connection line between the center of the wafer to be processed and the center of the wafer loading suction cup is parallel to the X-axis direction, and according to the angle of the connection line between the center of the wafer to be processed and the edge finding mark within the field of view of the image recognition device relative to the X-axis direction, driving the edge finding mark on the wafer loading suction cup to rotate to the same angle;

[0022] S400. Determine the offset in the X-axis direction between the center of the wafer to be processed and the center of the wafer loading chuck, and control the handling component to move the wafer to be processed from the positioning chuck to the wafer loading chuck according to the offset.

[0023] Optionally, while step S200 is being performed, the following steps are also included:

[0024] S201. Control the handling component to move above the wafer to be processed;

[0025] S202. Control the positioning chuck to rotate and use the image recognition device to grasp the edge-finding mark of the wafer to be processed, so as to determine the position angle of the edge-finding mark relative to the center of the wafer to be processed.

[0026] The embodiments of the present invention have at least the following technical effects:

[0027] The wafer grinding equipment provided by the embodiments of the present invention places the wafer to be processed on the positioning chuck for rotation by setting a wafer eccentric positioning component, and uses the image recognition device to determine that the line connecting the center of the wafer and the center of the wafer loading chuck is parallel to the X-axis direction, thereby achieving alignment in the Y-axis direction. Then, the control unit controls the handling component to transfer the wafer in the X-axis direction to the wafer loading chuck, thereby achieving compensation in the X-axis direction, and further realizing eccentric calibration of the wafer. Compared with the existing mechanical positioning, which only performs vacuum adsorption or no adsorption after positioning is completed, there is a large variation. At the same time, detection devices such as opposed sensors have a large gap in accuracy compared with cameras due to the size of their light spots, and mechanical positioning also has mechanical processing errors. Therefore, the embodiments of the present invention have higher accuracy than the prior art, which is also beneficial to improving the accuracy of subsequent processing processes. Description of the Drawings

[0028] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic diagram of the overall structure of a wafer grinding equipment provided by an embodiment of the present invention;

[0030] Figure 2 It is a schematic diagram of the workbench and auxiliary structure of a wafer grinding equipment provided by an embodiment of the present invention;

[0031] Figure 3Schematic diagram of the connection structure of the positioning suction cup of a wafer grinding device provided by an embodiment of the present invention;

[0032] Figure 4 Schematic diagram of the relative position relationship between the positioning suction cup and the wafer loading suction cup of a wafer grinding device provided by an embodiment of the present invention;

[0033] Figure 5 Schematic diagram of the rotation drive structure of the positioning suction cup of a wafer grinding device provided by an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of the connection between the control unit and each component of a wafer grinding device provided by an embodiment of the present invention;

[0035] Figure 7 Schematic flowchart of a wafer edge finding and positioning method provided by an embodiment of the present invention.

[0036] Reference numerals: 1 - First loading platform; 2 - Second loading platform; 3 - Wafer backside cleaning station; 4 - Wafer eccentric positioning assembly; 5 - Transfer assembly; 6 - Wafer loading suction cup; 7 - Coarse grinding station; 8 - Fine grinding station; 9 - Polishing station; 10 - Handling assembly; 11 - Manipulator assembly; 12 - Image recognition device; 13 - X-axis drive mechanism; 14 - Z-axis drive mechanism; 15 - Handling suction cup; 16 - Positioning suction cup; 17 - Backlight source; 18 - Rotation drive mechanism; 19 - Rotary joint; 20 - Loading suction cup drive mechanism; 21 - Control unit. Detailed implementation manners

[0037] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] Those skilled in the art of the present technology can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as that generally understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in a general dictionary should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted in an idealized or overly formal sense unless specifically defined as here.

[0039] Those skilled in the art can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the", and "said" used herein may also include the plural forms. It should be further understood that the term "comprising" used in the specification of the present invention means the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or their groups. The phrase "and / or" used herein includes all or any unit of one or more related listed items and all combinations.

[0040] Combined with Figures 1 to 6 As shown, an embodiment of the present invention provides a wafer grinding device, including: a loading component, a cleaning component, and a wafer eccentric positioning component 4. The wafer eccentric positioning component 4 includes: a wafer loading suction cup 6, a positioning suction cup 16, an image recognition device 12, and a control unit 21.

[0041] Specifically, the positioning suction cup 16 is used to place the wafer to be processed conveyed from any one of the loading platforms ( Figure 1 Two loading platforms are schematically shown therein, namely the first loading platform 1 and the second loading platform 2). The wafer to be processed is conveyed to the positioning suction cup 16 by the manipulator component 11. The positioning suction cup 16 is driven by a rotation driving mechanism 18 to rotate to adjust the position in the Y-axis direction, that is, the positioning suction cup 16 can rotate itself, while the wafer loading suction cup 6 is used to place the wafer to be processed after eccentric positioning.

[0042] The image recognition device 12 is arranged on the workbench ( Figure 2 Shown as a reference numeral in the figure). The workbench is located in the middle of the entire wafer grinding device and is used to load positioning and calibration components such as the handling component 10 and the image recognition device 12. Among them, the image recognition device 12 is used to obtain the image information of the wafer to be processed to determine the offset amount of the center of the wafer to be processed and the wafer loading suction cup along the Y-axis direction. Optionally, the image recognition device 12 can also move along the X-axis direction and the Z-axis direction, so as to better capture clear wafer image information and adapt to wafer image information of different sizes.

[0043] The control unit 21 is electrically connected to the positioning suction cup 16, the rotation driving mechanism 18, and the image recognition device 12, and is used to control the rotation driving mechanism 18 to work according to the offset amount of the center of the wafer to be processed and the wafer loading suction cup along the Y-axis direction, so that the connection line between the center of the wafer to be processed and the center of the wafer loading suction cup 6 is parallel to the X-axis direction, which is convenient for subsequent eccentric correction adjustment of the wafer from the positioning suction cup 16 to the wafer loading suction cup 6 through compensation in the X-axis direction.

[0044] Specifically, after the wafer to be processed is placed on the positioning chuck 16, the rotary drive mechanism 18 adsorbs and drives the wafer to be processed to rotate six times respectively, each time rotating 60 degrees. After each rotation is completed, the image recognition device 12 will take a photo, remember several corresponding points on the edge contour of the current wafer to be processed in the shooting perspective of the image recognition device 12, compare the position changes of these points in the six photos respectively, fit the centers of several radius circles at the current angle, so as to deduce the center of the wafer to be processed, and compare the offset of the position of the center of the wafer to be processed with the position of the calibrated center.

[0045] During the six photos, the feature of having an edge-finding mark (flat edge or notch) will appear in several of the images. According to the current calculated connection line between the center of the wafer to be processed and the position of the flat edge or notch feature in the camera's field of view, the position of the flat edge or notch is deduced, and the angle of this connection line relative to the X-axis is stored. The angle of the notch or flat edge feature on the wafer loading chuck 6 is also the current angle, and the angle offset of the notch or flat edge is compensated by the rotation of the wafer loading platform itself (the rotation of the wafer loading platform itself is driven by the loading chuck drive mechanism 20), that is, the offset of the center on the Y-axis is compensated by the rotation of the positioning chuck 16, and the offset of the center on the X-axis is compensated by the X-axis transfer.

[0046] Optionally, the wafer grinding equipment further includes: a handling component 10, which is arranged on the workbench; the handling component 10 is connected to the X-axis drive mechanism 13 on the workbench through the Z-axis drive mechanism 14, so that the X-axis drive mechanism 13 drives the Z-axis drive mechanism 14 and the handling component 10 to move along the X-axis direction together. The Z-axis drive mechanism 14 can independently drive the handling component 10 to move along the Z-axis direction, so as to realize the lifting of the handling component 10. Optionally, the handling component 10 includes a handling chuck 15, which is used to adsorb and grasp the wafer, and realizes the lifting through the Z-axis drive mechanism 14, and at the same time realizes the transfer of the wafer from the positioning chuck 16 to the wafer loading chuck 6 through the X-axis drive mechanism 13.

[0047] Further, the control unit 21 is electrically connected to the X-axis drive mechanism 13, the Z-axis drive mechanism 14 and the handling component 10, and is used to control the handling component 10 to transfer the wafer to be processed from the positioning chuck 16 to the wafer loading chuck 6 along the X-axis direction after determining that the connection line between the center of the wafer to be processed and the center of the wafer loading chuck 6 is parallel to the X-axis direction, so as to perform the subsequent grinding process.

[0048] The wafer grinding equipment provided by the embodiments of the present invention sets a wafer eccentric positioning component 4, so as to place the wafer to be processed on the positioning suction cup 16 for rotation, and determine that the line connecting the center of the wafer and the center of the wafer feeding suction cup 6 is parallel to the X-axis direction through the image recognition device 12, so as to achieve alignment in the Y-axis direction. Then, the control unit 21 controls the handling component 10 to transfer the wafer along the X-axis direction to the wafer feeding suction cup 6, so as to achieve compensation in the X-axis direction, and further achieve eccentric calibration of the wafer. Compared with the existing mechanical positioning, vacuum adsorption is carried out only after positioning is completed, or there is no adsorption, resulting in a large variation. At the same time, detection devices such as opposed sensors have a large gap in accuracy compared with cameras due to the size of their light spots, and mechanical positioning also has mechanical processing errors. Therefore, the embodiments of the present invention have higher accuracy compared with the prior art, which is also beneficial to improving the accuracy of subsequent processing techniques.

[0049] In some embodiments, as Figure 2 shown, the workbench includes: a frame body and a sliding guide rail installed on the frame body; the frame body is fixed on the base of the grinding equipment, and both the frame body and the sliding guide rail extend along the X-axis direction. The Z-axis driving mechanism 14 and the handling component 10 are both slidably connected to the sliding guide rail through the Z-axis arm, and the Z-axis arm is driven to move along the X-axis direction by the X-axis driving mechanism 13.

[0050] In some embodiments, as Figure 3 shown, the rotation driving mechanism 18 is arranged below the positioning suction cup 16. The rotation driving mechanism 18 is connected to the rotary joint 19 through a belt, and the upper end of the rotary joint 19 is connected to the positioning suction cup 16 through a rotating shaft, so as to drive the rotation of the positioning suction cup 16 through the rotation driving mechanism 18.

[0051] In some embodiments, continue to refer to Figure 1 , the wafer grinding equipment further includes: a rough grinding station 7 and a fine grinding station 8. The rough grinding station 7 and the wafer feeding suction cup 6 are located on the same side of the workbench, and the fine grinding station 8 is located on the other side of the workbench. The wafer to be processed after eccentric positioning and edge finding sequentially passes through the rough grinding station 7 and the fine grinding station 8 for rough grinding and fine grinding processes respectively, which is beneficial to improving the grinding accuracy and masking efficiency of the wafer.

[0052] Optionally, continue to refer to Figure 1 , the wafer grinding equipment further includes: a polishing station 9; the polishing station 9 and the fine grinding station 8 are located on the same side of the workbench, and are used for polishing the wafer after fine grinding to reduce burrs or impurities on the wafer surface.

[0053] Optionally, continue to refer to Figure 1, the wafer grinding equipment further includes: a transfer component 5 and a wafer backside cleaning station 3. The transfer component 5 is arranged on one side of the wafer loading chuck 6 and the wafer backside cleaning station 3, and is used to transfer the polished wafer to the wafer backside cleaning station 3 for backside cleaning.

[0054] Specifically, the polished wafer will return to the position where the wafer loading chuck 6 is located (the wafer loading chuck 6 will first rotate clockwise at the bottom, rotating 90 degrees three times respectively, and rotating to the Figure 1 intermediate rough grinding station 7, the fine grinding station 8, and the polishing station 9, and then rotate counterclockwise by 270 degrees, that is, return to the Figure 1 current position of the wafer loading chuck 6). At this time, the transfer component 5 is used to transfer the polished wafer to the wafer backside cleaning station 3 for backside cleaning.

[0055] Optionally, the wafer grinding equipment further includes: a backlight source 17; the backlight source 17 is arranged on the side of the positioning chuck 16 away from the wafer loading chuck 6, and is used to supplement light when the image recognition device 12 acquires the image information of the wafer to be processed.

[0056] Based on the same inventive concept, as Figure 7 shown, an embodiment of the present invention further provides a wafer edge finding and positioning method, based on a wafer grinding equipment. The wafer grinding equipment can refer to the content of the foregoing embodiments, and mainly includes a control unit 21 and a wafer loading chuck 6, a positioning chuck 16, an image recognition device 12, and a handling component 10 that are electrically connected to the control unit 21 respectively. The image recognition device 12 is arranged on the workbench and is used to acquire the image information of the wafer to be processed. The handling component 10 is used to transfer the wafer to be processed from the positioning chuck 16 to the wafer loading chuck 6 along the X-axis direction. The wafer edge finding and positioning method includes the following steps:

[0057] S100, place the wafer to be processed on the positioning chuck 16 and adsorb and fix it;

[0058] S200, obtain the position change of the wafer radius relative to the calibration point through the image recognition device 12, so as to determine the offset between the center of the wafer to be processed and the center of the wafer loading chuck; wherein, the calibration point is the center position of the calibration wafer when it is placed at the center of the positioning chuck 16.

[0059] S300. According to the offset between the center of the wafer to be processed and the center of the wafer feeding chuck, control the rotation of the positioning chuck 16 so that the line connecting the center of the wafer to be processed and the center of the wafer feeding chuck 6 is parallel to the X-axis direction, and drive the edge-finding mark on the wafer feeding chuck to rotate to the same angle according to the angle of the line connecting the center of the wafer to be processed and the position of the edge-finding mark within the field of view of the image recognition device relative to the X-axis direction.

[0060] S400. Determine the offset between the center of the wafer to be processed and the center of the wafer feeding chuck 6 along the X-axis direction, and control the handling component 10 to move the wafer to be processed from the positioning chuck 16 to the wafer feeding chuck 6 according to the offset.

[0061] Optionally, while step S200 is being performed, the following steps are further included:

[0062] S201. Control the handling component 10 to move above the wafer to be processed;

[0063] S202. Control the rotation of the positioning chuck 16 and use the image recognition device 12 to grasp the edge-finding mark of the wafer to be processed to determine the position angle of the edge-finding mark relative to the center of the wafer to be processed.

[0064] Optionally, the edge-finding mark can be a notch or a flat edge on the edge of the wafer. The edge-finding mark is mainly used for aligning the wafer direction. Edge-finding positioning is performed through the position angle of the edge-finding mark relative to the center of the wafer to be processed. During the processing of the wafer, sensors can be used to uniformly align with the edge-finding mark, thereby ensuring the consistency of the processing technology.

[0065] In this embodiment, while the centers of the wafer to be processed and the wafer feeding chuck are aligned along the X-axis direction, the processes of wafer edge-finding and the handling component can be carried out simultaneously, greatly improving the positioning efficiency of the wafer.

[0066] Those skilled in the art of this technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present invention can be alternated, changed, combined, or deleted. Further, the other steps, measures, and solutions in the various operations, methods, and processes discussed in the present invention can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and solutions in the prior art that are the same as those disclosed in the present invention can also be alternated, changed, rearranged, decomposed, combined, or deleted.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0068] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0069] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0070] In the description of this specification, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples. It should be understood that although the steps in the flowchart of the drawings are shown in sequence according to the indication of the arrows, these steps are not necessarily executed in the sequence indicated by the arrows. Unless otherwise clearly stated in this article, the execution of these steps is not strictly limited in order and may be executed in other orders. Moreover, at least a part of the steps in the flowchart of the drawings may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but may be executed at different times, and their execution order is not necessarily sequential, but may be executed alternately or in turn with at least a part of other steps or sub-steps or stages of other steps.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer grinding device, comprising: A loading component, a cleaning component, and a wafer eccentric positioning component, characterized in that the wafer eccentric positioning component includes: A wafer loading suction cup for placing the wafer to be processed after eccentric positioning; A positioning suction cup for placing the wafer to be processed conveyed from the loading platform, and the positioning suction cup is driven to rotate by a rotation driving mechanism; An image recognition device arranged on the workbench for acquiring image information of the wafer to be processed to determine the offset of the center of the wafer to be processed along the Y-axis direction from the wafer loading suction cup; A control unit electrically connected to the positioning suction cup, the rotation driving mechanism, and the image recognition device, for controlling the operation of the rotation driving mechanism according to the offset of the center of the wafer to be processed along the Y-axis direction from the wafer loading suction cup, so that the line connecting the center of the wafer to be processed and the center of the wafer loading suction cup is parallel to the X-axis direction, and driving the edge-finding mark on the wafer loading suction cup to rotate to the same angle according to the angle of the line connecting the center of the wafer to be processed and the position of the edge-finding mark within the field of view of the image recognition device relative to the X-axis direction; A handling component arranged on the workbench; the handling component is connected to the X-axis driving mechanism on the workbench through a Z-axis driving mechanism; the control unit is electrically connected to the X-axis driving mechanism, the Z-axis driving mechanism, and the handling component, and is used for controlling the handling component to transfer the wafer to be processed from the positioning suction cup to the wafer loading suction cup along the X-axis direction after determining that the line connecting the center of the wafer to be processed and the center of the wafer loading suction cup is parallel to the X-axis direction, so as to perform subsequent grinding processes; When the centers of the wafer to be processed and the wafer loading suction cup are aligned along the X-axis direction, the edge-finding process of the wafer and the moving process of the handling component along the X-axis direction are carried out simultaneously.

2. The wafer grinding equipment according to claim 1, wherein The workbench includes: a frame body and a sliding guide rail installed on the frame body; both the frame body and the sliding guide rail extend along the X-axis direction, the Z-axis driving mechanism and the handling component are both slidably connected to the sliding guide rail through a Z-axis arm, and the Z-axis arm is driven to move along the X-axis direction by the X-axis driving mechanism.

3. The wafer grinding device according to claim 1, wherein The rotation driving mechanism is arranged below the positioning suction cup, the rotation driving mechanism is connected to a rotary joint through a belt, and the upper end of the rotary joint is connected to the positioning suction cup through a rotating shaft, so as to drive the rotation of the positioning suction cup through the rotation driving mechanism.

4. The wafer grinding equipment according to claim 1, wherein, It further includes: A rough grinding station and a fine grinding station, the rough grinding station and the wafer loading suction cup are on the same side of the workbench, and the fine grinding station is on the other side of the workbench; The wafer to be processed after eccentric positioning and edge-finding sequentially passes through the rough grinding station and the fine grinding station to perform rough grinding and fine grinding processes respectively.

5. The wafer grinding device according to claim 4, characterized in that, It further includes: A polishing station; the polishing station and the fine grinding station are on the same side of the workbench, and are used for performing polishing treatment after the wafer is finely ground.

6. The wafer grinding device according to claim 5, wherein, It further includes: A transfer component and a wafer backside cleaning station. The transfer component is arranged on one side of the wafer loading chuck and the wafer backside cleaning station, and is used to transfer the polished wafer to the wafer backside cleaning station for backside cleaning.

7. The wafer grinding equipment according to claim 1, characterized in that, It further includes: A backlight source; the backlight source is arranged on the side of the positioning chuck away from the wafer loading chuck, and is used to supplement light when the image recognition device acquires the image information of the wafer to be processed.

8. A wafer edge finding and positioning method, based on the wafer grinding equipment according to any one of claims 1 to 7, characterized in that, The wafer edge finding and positioning method includes: S100, placing the wafer to be processed on the positioning chuck and adsorbing and fixing it; S200, obtaining the position change of the wafer radius relative to the calibration point through the image recognition device, so as to determine the offset between the center of the wafer to be processed and the center of the wafer loading chuck; wherein, the calibration point is the center position of the calibration wafer when it is placed at the center of the positioning chuck; S300, according to the offset between the center of the wafer to be processed and the center of the wafer loading chuck, controlling the rotation of the positioning chuck so that the line connecting the center of the wafer to be processed and the center of the wafer loading chuck is parallel to the X-axis direction, and according to the angle of the line connecting the center of the wafer to be processed and the edge finding mark within the field of view of the image recognition device relative to the X-axis direction, driving the edge finding mark on the wafer loading chuck to rotate to the same angle; S400, determining the offset between the center of the wafer to be processed and the center of the wafer loading chuck along the X-axis direction, and controlling the handling component to move the wafer to be processed from the positioning chuck to the wafer loading chuck according to the offset; While step S200 is being carried out, it further includes: S201, controlling the handling component to move above the wafer to be processed; S202, controlling the rotation of the positioning chuck and grasping the edge finding mark of the wafer to be processed through the image recognition device to determine the position angle of the edge finding mark relative to the center of the wafer to be processed.

Images