Resin cutting device for crystal rod orientation

Abstract

An embodiment of the present invention provides a resin cutting device for crystal rod orientation, which belongs to the technical field of silicon carbide processing equipment. The resin cutting device for crystal rod orientation includes a machine, a lifting device, an orienter, a clamping device and a cutting device. The machine has a mounting surface, which is used to place a resin block with a silicon carbide crystal rod bonded thereto. The orienter is located above the mounting surface and is used to detect the crystal rod. The lifting device is mounted on the machine and its own driving end can be extended and retracted in the height direction. The lifting device is used to lift one end of the resin block to change the angle between the axis of the silicon carbide crystal rod and the mounting surface. The cutting device is used to cut from the first end to the second end of the resin block along a preset direction. When the orienter is detecting the crystal axis of the silicon carbide crystal rod, the lifting device stops lifting, the clamping device fixes the resin block, and the cutting device cuts the resin block at this time. Through the cooperation of the lifting device, the clamping device, the orienter and the cutting device, the processing efficiency of polishing the resin after the crystal rod orientation detection can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide processing equipment, and in particular to a resin cutting device for crystal rod orientation. Background Art

[0002] Slicing silicon carbide (SiC) ingots is a crucial step in their processing. Its purpose is to separate the ingot into thin slices (wafers or chips) for further processing and manufacturing into various devices. Orientation detection is a crucial step in SiC ingot processing, especially before ingot slicing. This is because SiC crystals are highly anisotropic, meaning their physical and chemical properties vary significantly with orientation. Therefore, correct orientation detection is crucial to ensuring the quality of subsequent processing.

[0003] In some existing processes for orientation detection of silicon carbide crystal rods, the crystal rod is first bonded to a resin block, and then the inclination angle of the crystal rod is adjusted until the orienter determines the radial direction. The bottom surface of the resin block is then manually polished, and then subsequent slicing operations are performed. This manual process of polishing the resin after the crystal rod orientation detection is low. Summary of the Invention

[0004] The present invention aims to provide a resin cutting device for crystal rod orientation, which can improve the processing efficiency of polishing resin after crystal rod orientation detection.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides a resin cutting device for orienting a crystal ingot, comprising:

[0007] The machine platform has a mounting surface for placing a resin block bonded with a silicon carbide crystal rod, the crystal rod being bonded to a side of the resin block away from the mounting surface, and the resin block having a first end and a second end opposite to each other along its length direction;

[0008] An orienter, which is located above the mounting surface and is used to detect the crystal ingot;

[0009] A lifting device is installed on the machine platform and its driving end can be extended and retracted in the height direction. The lifting device is used to lift one end of the resin block to change the angle between the axis of the silicon carbide ingot and the mounting surface;

[0010] A clamping device is installed on the machine and located on the mounting surface, and is used to clamp and fix the resin block;

[0011] A cutting device is mounted on the machine and located on the mounting surface, and is used to cut the resin block from the first end to the second end along a preset direction, wherein the preset direction is parallel to the mounting surface;

[0012] Among them, the lifting device, the orienter, the clamping device and the cutting device are communicatively connected. When the orienter detects the crystal axis of the silicon carbide crystal rod, the lifting device stops lifting and the clamping device clamps and fixes the resin block.

[0013] In an optional embodiment, the cutting device includes a linear drive member and a cutting assembly. The linear drive member is installed on the machine platform and fixedly connected to the cutting assembly to drive the cutting assembly to move along a preset direction.

[0014] In an optional embodiment, the linear drive component is a lead screw motor, and the lead screw nut of the lead screw motor is fixedly connected to the cutting assembly.

[0015] In an optional embodiment, the cutting assembly includes a drive motor and a cutting member connected to each other, the linear drive member is connected to the drive motor, the drive motor is used to drive the cutting member to rotate for cutting the resin block, and the rotation axis of the cutting member is perpendicular to the mounting surface.

[0016] In an optional embodiment, the maximum height dimension of the cutting piece is smaller than the minimum height dimension of the clamping end of the clamping device when the clamping end is on the resin block.

[0017] In an optional embodiment, the mounting surface is provided with a receiving groove, the resin block is used to be placed in the receiving groove, and a portion of the resin block extends out of the receiving groove.

[0018] In an optional embodiment, the machine platform is provided with a matching hole for the driving end of the jacking device to match, and the matching hole is located below the resin block. The driving end of the jacking device can extend out of the matching hole or retract into the matching hole.

[0019] In an optional embodiment, the clamping device includes two groups of clamping assemblies arranged on both sides of the resin block, the clamping assemblies include a clamping drive member and a clamping member connected to each other, and the clamping members of the two groups of clamping assemblies can approach or move away from each other to clamp or release the resin block, and the minimum height dimension of the clamping member is greater than the maximum height dimension of the cutting member of the cutting device.

[0020] In an optional embodiment, the clamping assembly further includes a guide member, which is fixedly mounted on the mounting surface. The guide member is provided with a guide hole for the clamping member to pass through. The clamping member can move relative to the guide hole. The axis of the guide hole is parallel to the arrangement direction of the two groups of clamping assemblies and is at an angle to the preset direction.

[0021] In an optional embodiment, the clamping member includes a mounting plate and a plurality of clamping portions arranged on the mounting plate at intervals along a preset direction, each guide member is provided with a plurality of guide holes arranged one-to-one corresponding to the plurality of clamping portions, and the mounting plate is connected to the driving end of the clamping driving member.

[0022] A resin cutting device for crystal rod orientation provided by an embodiment of the present invention includes a machine, a lifting device, an orienter, a clamping device, and a cutting device. The machine has a mounting surface for placing a resin block bonded with a silicon carbide crystal rod, the orienter is located above the mounting surface and is used to detect the crystal rod, the lifting device is mounted on the machine and its own driving end can be extended and retracted in the height direction, and the lifting device is used to lift one end of the resin block to change the angle between the axis of the silicon carbide crystal rod and the mounting surface. The cutting device is used to cut from the first end to the second end of the resin block along a preset direction. When the orienter is detecting the crystal axis of the silicon carbide crystal rod, the lifting device stops lifting and the clamping device fixes the resin block. At this time, the cutting device can cut from the first end to the second end of the resin block along the preset direction. Through the cooperation of the lifting device, the clamping device, the orienter, and the cutting device, the processing efficiency of polishing the resin after the crystal rod orientation detection can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic structural diagram of the resin cutting device for orienting a crystal ingot provided in this embodiment when a resin block is installed at a first viewing angle;

[0025] Figure 2 A schematic diagram of the structure of the resin cutting device for orienting a crystal ingot provided in this embodiment from a first viewing angle;

[0026] Figure 3 This is a schematic structural diagram of the resin cutting device for crystal rod orientation provided in this embodiment at a second viewing angle.

[0027] Icons: 1-resin cutting device for orienting crystal rods; 100-machine platform; 101-mounting surface; 103-sinking trough; 200-orientator; 300-lifting device; 400-clamping device; 410-clamping assembly; 411-clamping drive; 412-clamping member; 4121-mounting plate; 4122-clamping part; 413-guide member; 500-cutting device; 510-linear drive member; 520-drive motor; 530-cutting member; 2-resin block; 3-silicon carbide crystal rod. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0031] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0033] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0034] The specific structure of a resin cutting device for crystal rod orientation provided by an embodiment of the present invention and the corresponding technical effects thereof are described in detail below in conjunction with the patent drawings.

[0035] Please refer to Figure 1-Figure 3 An embodiment of the present invention provides a resin cutting device 1 for orienting a crystal ingot, which includes a machine platform 100 , a lifting device 300 , an orienting instrument 200 , a clamping device 400 and a cutting device 500 .

[0036] The machine 100 has a mounting surface 101 for placing a resin block 2 with a silicon carbide ingot 3 bonded thereto. The silicon carbide ingot 3 is bonded to the side of the resin block 2 facing away from the mounting surface 101. The resin block 2 has a first end and a second end that are opposed to each other along its length. It should be noted that the silicon carbide ingot 3 can be understood as a silicon carbide ingot 3 formed by bonding multiple silicon carbide ingots sequentially along their axes.

[0037] Optionally, in this embodiment, in order to ensure that the resin block 2 can stably install the silicon carbide crystal rod 3, the resin block 2 has a mounting groove, the inner wall of the mounting groove is an arc-shaped inner wall adapted to the outer peripheral surface of the silicon carbide crystal rod 3, and the side of the resin block 2 away from the silicon carbide crystal rod 3 is a plane parallel to the mounting surface 101. Therefore, when the resin block 2 with the silicon carbide crystal rod 3 bonded thereto is placed on the mounting surface 101, the axis of the silicon carbide crystal rod 3 is parallel to the mounting surface 101.

[0038] It should be noted that the axis of the silicon carbide crystal rod 3 refers to the structural axis of the silicon carbide crystal rod 3 , and the above-mentioned parallelism should not be limited to being parallel in a strict sense, as long as it is approximately parallel.

[0039] The orienter 200 is located above the mounting surface 101 and is used to detect the crystal ingot. It is easy to understand that before cutting the silicon carbide crystal ingot 3, the crystal axis direction of the silicon carbide crystal ingot 3 needs to be determined by the orienter 200.

[0040] The lifting device 300 is mounted on the machine 100 and its own driving end can be extended and retracted in the height direction. The lifting device 300 is used to lift one end of the resin block 2 to change the angle between the axis of the silicon carbide crystal ingot 3 and the mounting surface 101. In other words, the lifting device 300 can lift the first end or the second end of the resin block 2, thereby changing the tilt angle of the silicon carbide crystal ingot 3. Generally, the crystal axis of the silicon carbide crystal ingot 3 is different from the structural axis of the silicon carbide crystal ingot 3 and forms an angle with the structural axis of the silicon carbide crystal ingot 3. Therefore, the lifting device 300 can be used to lift one end of the resin block 2 to change the tilt angle of the silicon carbide crystal ingot 3 until the orienter 200 detects the crystal axis of the silicon carbide crystal ingot 3, at which time the lifting device 300 stops.

[0041] The clamping device 400 is installed on the machine 100 and is located on the mounting surface 101. The clamping device 400 is used to fix the resin block 2. The cutting device 500 is installed on the machine 100 and is located on the mounting surface 101. The cutting device 500 is used to cut from the first end to the second end of the resin block 2 along a preset direction. The preset direction is parallel to the mounting surface 101. The lifting device 300, the orienter 200, the clamping device 400 and the cutting device 500 are communicatively connected.

[0042] When the orienter 200 is detecting the crystal axis of the silicon carbide crystal rod 3, the lifting device 300 stops lifting and the clamping device 400 fixes the resin block 2. At this time, the cutting device 500 can cut from the first end to the second end of the resin block 2 along the preset direction. After the cutting is completed, the resin block 2 is placed on the plane, and the posture of the silicon carbide crystal rod 3 is still in an inclined state. At this time, the inclination direction of the silicon carbide crystal rod 3 is parallel to the crystal axis direction, so that the slicing device can slice the silicon carbide crystal rod 3. Through the cooperation of the lifting device 300, the clamping device 400, the orienter 200, and the cutting device 500, the processing efficiency of polishing the resin after the crystal rod orientation detection can be improved.

[0043] It can be understood that in some optional embodiments, when the orienter 200 detects the crystal axis of the silicon carbide crystal rod 3, when the orienter 200's own current reaches a preset value, it can be determined that the orienter 200 can apply a constant voltage to the silicon carbide crystal rod 3. By measuring the current value passing through the silicon carbide crystal rod 3, the orienter 200 can obtain current change information. The orienter 200 will set a preset current value. When the detected current value reaches this preset value, the inclination direction of the surface silicon carbide crystal rod 3 is in the correct direction.

[0044] In detail, the cutting assembly includes a linear drive member 510 and a cutting assembly. The linear drive member 510 is installed on the machine 100 and is fixedly connected to the cutting assembly. The linear drive member 510 is used to drive the cutting assembly to move along a preset direction. It can be understood that the cutting assembly is used to move in a preset direction under the drive of the linear drive member 510. During the movement, the cutting assembly starts to cut from the first end to the second end of the resin block 2.

[0045] The linear drive member 510 is fixedly mounted on the machine 100. Optionally, the linear drive member 510 can be a lead screw motor, and the lead screw nut of the lead screw motor is fixedly connected to the cutting assembly. Of course, in other optional embodiments, the linear drive member 510 can also be other types of drive mechanisms, such as a structure including a linear drive motor 520, a transmission gear set, and a transmission rack, wherein the transmission gear set is in transmission connection with the transmission rack and the drive motor 520, and the transmission rack is fixedly connected to the cutting assembly. The linear drive motor 520 drives the cutting assembly to move in a linear direction through the cooperation of the transmission gear set and the transmission rack.

[0046] It should be noted that, in some embodiments, in order to ensure the stability of the movement of the cutting assembly, the cutting device 500 further includes a guide rail, which is fixedly mounted on the machine platform 100 .

[0047] The cutting assembly includes a drive motor 520 and a cutting member 530 connected to each other, and a linear drive member 510 is connected to the drive motor 520. The connection in this embodiment may refer to a direct connection, or an indirect connection may be achieved through other connection structures. For example, the linear drive member 510 may be directly connected to the drive motor 520, or it may be connected to the drive motor 520 through a frame.

[0048] Optionally, the cutting member 530 in this embodiment may be a cutting grinding wheel.

[0049] In order to prevent the cutting piece 530 from interfering with the clamping device 400 when cutting the resin block 2 , the maximum height of the cutting piece 530 is smaller than the minimum height of the clamping end of the clamping device 400 when clamping the resin block 2 .

[0050] Optionally, in some embodiments, the mounting surface 101 is provided with a receiving groove, in which the resin block 2 is placed, with a portion of the resin block 2 extending out of the receiving groove for clamping by the clamping device 400. It will be appreciated that the provision of the receiving groove facilitates the operator in installing the resin block 2 in place, and the resin block 2 can be limited within the receiving groove by the receiving groove to prevent it from easily moving.

[0051] The machine 100 is provided with a mating hole for the driving end of the jacking device 300 to engage. The driving end of the jacking device 300 can extend or retract into the mating hole. The mating hole is located below the resin block 2 and at one end of the resin block 2. It can be understood that when the resin block 2 is placed on the mounting surface 101 and is located above the mating hole, after the resin block 2 is placed on the mounting surface 101, the resin block 2 covers the mating hole. When the driving end of the jacking device 300 extends out of the mating hole, it can lift the resin block 2, leaving one end of the resin block 2 suspended in the air, thereby changing the inclination angle of the silicon carbide crystal rod 3 bonded to the resin block 2. When the driving end of the jacking device 300 is retracted into the mating hole, the side wall of the resin block 2 away from the silicon carbide crystal rod 3 contacts the mounting surface 101.

[0052] In some optional embodiments, a sinking groove 103 is provided at the bottom of the accommodating groove, wherein in the above-mentioned cutting device 500, the screw and the screw nut in the linear driving member 510 are both located in the sinking groove 103, the driving motor 520 is also located in the sinking groove 103, and the cutting member 530 is located in the accommodating groove and at one end of the resin block 2.

[0053] It should be noted that, in some embodiments, when a receiving tank is provided on the machine 100 and a sinking tank 103 is provided at the bottom of the receiving tank, the above-mentioned matching hole is provided on the bottom wall of the sinking tank 103 .

[0054] In some other optional embodiments, only the sinking groove 103 may be provided on the machine 100 , that is, the mounting surface 101 is only provided with the sinking groove 103 . In this case, the cutting piece 530 extends out of the sinking groove 103 .

[0055] In detail, the clamping device 400 includes two groups of clamping components 410 arranged on both sides of the resin block 2, and the clamping components 410 include a clamping drive component 411 and a clamping component 412 connected to each other. The clamping components 412 of the two groups of clamping components 410 can approach or move away from each other to clamp or release the resin block 2. The minimum height dimension of the clamping component 412 is greater than the maximum height dimension of the cutting component 530 of the cutting device 500. That is, the minimum height dimension of the clamping component 412 is greater than the maximum height dimension of the cutting component 530 to avoid interference between the cutting component 530 and the clamping component 412 when cutting the resin block 2.

[0056] The clamping assembly 410 further includes a guide member 413, which is fixedly mounted on the mounting surface 101. The guide member 413 defines a guide hole for the clamping member 412 to pass through. The clamping member 412 can move relative to the guide hole. The axis of the guide hole is parallel to the arrangement direction of the two sets of clamping assemblies 410 and forms an angle with the predetermined direction. It is understood that when the clamping members 412 of the two sets of clamping assemblies 410 approach or move away from each other, the clamping members 412 can move upward relative to the axis of the guide hole. In this embodiment, the axis of the guide hole is perpendicular to the predetermined direction.

[0057] The clamping member 412 includes a mounting plate 4121 and a plurality of clamping portions 4122 spaced apart on the mounting plate 4121 along a preset direction. Each guide member 413 is provided with a plurality of guide holes corresponding one to one with the plurality of clamping portions 4122. The mounting plate 4121 is connected to the driving end of the clamping driving member 411. It can be understood that since each clamping member 412 includes a plurality of clamping portions 4122 spaced apart along a preset direction, when the two groups of clamping assemblies 410 approach each other to clamp the resin block 2, since each clamping assembly 410 has a plurality of clamping portions 4122, the stability of the two groups of clamping assemblies 410 when clamping the resin block 2 can be improved.

[0058] In summary, an embodiment of the present invention provides a resin cutting device 1 for orienting a silicon carbide ingot, comprising a machine 100, a lifting device 300, an orienting tool 200, a clamping device 400, and a cutting device 500. The machine 100 has a mounting surface 101 for placing a resin block 2 bonded with a silicon carbide ingot 3. The orienting tool 200 is located above the mounting surface 101 and is used to inspect the ingot. The lifting device 300 is mounted on the machine 100 and has a drive end that can extend and retract in height. The lifting device 300 is used to lift one end of the resin block 2 to change the angle between the axis of the silicon carbide ingot 3 and the mounting surface 101. The cutting device 500 is used to cut from the first end to the second end of the resin block 2 along a preset direction. When the orienter 200 is detecting the crystal axis of the silicon carbide crystal rod 3, the lifting device 300 stops lifting and the clamping device 400 fixes the resin block 2. At this time, the cutting device 500 can cut from the first end to the second end of the resin block 2 along the preset direction. After the cutting is completed, the resin block 2 is placed on a plane, and the posture of the silicon carbide crystal rod 3 is still in an inclined state. At this time, the inclination direction of the silicon carbide crystal rod 3 is parallel to the crystal axis direction, so that the slicing device can slice the silicon carbide crystal rod 3. Through the cooperation of the lifting device 300, the clamping device 400, the orienter 200, and the cutting device 500, the processing efficiency of polishing the resin after the crystal rod orientation detection can be improved.

[0059] The above description is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with this technical field within the technical scope disclosed in the present invention should be covered by the scope of protection of the present invention.

Claims

1. A resin cutting device for orienting a crystal rod, characterized in that: include: A machine (100), the machine (100) having a mounting surface (101), the mounting surface (101) being used to place a resin block (2) bonded with a silicon carbide crystal rod (3), the crystal rod being bonded to a side of the resin block (2) away from the mounting surface (101), the resin block (2) having a first end and a second end opposite to each other along its length direction; an orienter (200), the orienter (200) being located above the mounting surface (101) and being used to detect the crystal rod; A lifting device (300) is installed on the machine platform (100) and has a driving end that can be extended and retracted in a height direction. The lifting device (300) is used to lift one end of the resin block (2) to change the angle between the axis of the silicon carbide crystal rod (3) and the mounting surface (101); A clamping device (400), the clamping device (400) is installed on the machine platform (100) and is located on the installation surface (101), and the clamping device (400) is used to clamp and fix the resin block (2); a cutting device (500), the cutting device (500) being mounted on the machine platform (100) and located on the mounting surface (101), the cutting device (500) being used for cutting the resin block (2) from the first end to the second end along a preset direction, the preset direction being parallel to the mounting surface (101); The lifting device (300), the orientation instrument (200), the clamping device (400) and the cutting device (500) are communicatively connected. When the orientation instrument (200) detects the crystal axis of the silicon carbide crystal rod (3), the lifting device (300) stops lifting, and the clamping device (400) clamps and fixes the resin block (2).

2. The resin cutting device for orienting a crystal ingot according to claim 1, characterized in that: The cutting device (500) comprises a linear drive member (510) and a cutting assembly. The linear drive member (510) is mounted on the machine platform (100) and fixedly connected to the cutting assembly, and is used to drive the cutting assembly to move along the preset direction.

3. The resin cutting device for orienting a crystal ingot according to claim 2, characterized in that: The linear drive member (510) is a screw motor, and the screw nut of the screw motor is fixedly connected to the cutting assembly.

4. The resin cutting device for orienting a crystal ingot according to claim 2, characterized in that: The cutting assembly comprises a drive motor (520) and a cutting member (530) connected to each other, the linear drive member (510) being connected to the drive motor (520), the drive motor (520) being used to drive the cutting member (530) to rotate for cutting the resin block (2), and the rotation axis of the cutting member (530) being perpendicular to the mounting surface (101).

5. The resin cutting device for orienting a crystal ingot according to claim 4, characterized in that: The maximum height dimension of the cutting piece (530) is smaller than the minimum height dimension of the clamping end of the clamping device (400) when it is on the resin block (2).

6. The resin cutting device for orienting a crystal ingot according to claim 1, characterized in that: The mounting surface (101) is provided with a receiving groove, the resin block (2) is used to be placed in the receiving groove, and a portion of the resin block (2) extends out of the receiving groove.

7. The resin cutting device for orienting a crystal ingot according to claim 1, characterized in that: The machine (100) is provided with a matching hole for the driving end of the lifting device (300) to match, and the matching hole is located below the resin block (2). The driving end of the lifting device (300) can extend out of the matching hole or retract into the matching hole.

8. The resin cutting device for orienting a crystal ingot according to claim 1, characterized in that: The clamping device (400) comprises two groups of clamping assemblies (410) arranged on both sides of the resin block (2), the clamping assemblies (410) comprising a clamping driving member (411) and a clamping member (412) connected to each other, the clamping members (412) of the two groups of the clamping assemblies (410) being able to move closer to or farther away from each other to clamp or release the resin block (2), and the minimum height dimension of the clamping member (412) being greater than the maximum height dimension of the cutting member (530) of the cutting device (500).

9. The resin cutting device for orienting a crystal ingot according to claim 8, characterized in that: The clamping assembly (410) further comprises a guide member (413), the guide member (413) being fixedly mounted on the mounting surface (101), the guide member (413) being provided with a guide hole for the clamping member (412) to pass through, the clamping member (412) being able to move relative to the guide hole, and the axis of the guide hole being parallel to the arrangement direction of the two groups of the clamping assemblies (410) and forming an angle with the preset direction.

10. The resin cutting device for orienting a crystal ingot according to claim 9, characterized in that: The clamping member (412) comprises a mounting plate (4121) and a plurality of clamping portions (4122) arranged at intervals on the mounting plate (4121) along the preset direction; each of the guide members (413) is provided with a plurality of guide holes arranged in a one-to-one correspondence with the plurality of clamping portions (4122); and the mounting plate (4121) is connected to the driving end of the clamping driving member (411).

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