Testing device for to-be-tested photoelectric device

Abstract

The invention provides a testing device for a to-be-tested photoelectric device. The testing device comprises a photoelectric testing system used for light-to-electricity testing of a photoelectric device; the electro-optical test system is used for electro-optical test of the photoelectric device; the mounting plate is used for mounting the photoelectric test system and the electro-optical test system; the photoelectric testing system and the electro-optical testing system are integrated on the mounting plate, corresponding testing systems can be correspondingly selected for different types of photoelectric devices according to testing requirements, the photoelectric testing system and the electro-optical testing system do not need to be built on site, and therefore the testing efficiency of the photoelectric devices is improved.

Description

Technical Field

[0001] The present application relates to the technical field of optoelectronic device testing, and in particular to a testing device for an optoelectronic device to be tested. Background Art

[0002] Optoelectronic devices are various functional devices made using the photoelectric effect, including light-emitting diodes, laser diodes, photocouplers, etc.

[0003] In order to ensure the performance of optoelectronic devices, it is necessary to conduct tests on the optoelectronic devices such as photoelectric conversion efficiency and response performance. When conducting on-site tests on optoelectronic devices, it is often necessary to build a test system on site, and the test efficiency is low. In addition, it is often necessary to conduct electric-to-optical tests or optical-to-electrical tests on different types of optoelectronic devices in turn. When conducting electric-to-optical tests, it is necessary to build an electric-to-optical test system, and when conducting optical-to-electrical tests, it is necessary to build an optical-to-electrical test system. The process of building two sets of test systems on site is complicated, which further reduces the test efficiency. Summary of the invention

[0004] In view of this, the purpose of the present application is to propose a testing device for an optoelectronic device to be tested, so as to solve the problem that one or two testing systems need to be temporarily built when performing on-site testing on optoelectronic devices, resulting in low testing efficiency.

[0005] Based on the above purpose, the present application provides a testing device for an optoelectronic device to be tested, comprising:

[0006] Photoelectric test system, used for light-to-electricity testing of optoelectronic devices;

[0007] Electro-optical test system, used for electro-optical testing of optoelectronic devices;

[0008] The mounting plate is used for mounting the optoelectronic test system and the electro-optical test system.

[0009] Optionally, the photoelectric testing system includes a light source module, a first optical attenuator module and a test module, the light source module and the first optical attenuator module are connected via optical fiber, the first optical attenuator module is connected to the photoelectric device to be tested via optical fiber, the photoelectric device to be tested is mounted on the test module and electrically connected to the test module, and the test module is used to test current information of the photoelectric device to be tested.

[0010] Optionally, the light source module includes a tunable laser diode, a single-mode laser diode, a first PCB board and a first driving circuit. The tunable laser diode, the single-mode laser diode and the first driving circuit are all arranged on the first PCB board. The tunable laser diode is driven by the first driving circuit to emit light. The single-mode laser diode is connected to an external driving device through an independent interface. The tunable laser diode and the single-mode laser diode are both encapsulated in an optical fiber connector.

[0011] Optionally, the electro-optical test system includes a second optical attenuator module and a light detector module, the optoelectronic device to be tested is mounted on the test module and electrically connected to the test module, the optoelectronic device to be tested receives current from the test module, the optoelectronic device to be tested is connected to the second optical attenuator module via optical fiber, and the second optical attenuator module is connected to the light detector module via optical fiber.

[0012] Optionally, the optical detector module includes an optical detector, a second PCB board and a second driving circuit, the optical detector and the second driving circuit are both arranged on the second PCB board, the optical detector is driven by the second driving circuit, and the optical detector is encapsulated in the optical fiber connector.

[0013] Optionally, a heat dissipation system for dissipating heat from the photoelectric device to be tested is further included, wherein the heat dissipation system includes: a semiconductor cooling plate, located below the photoelectric device to be tested and abutting against its housing;

[0014] A heat-conducting mounting seat, wherein the mounting plate is provided with a mounting groove penetrating the mounting plate, the heat-conducting mounting seat is located in the mounting groove, and the heat-conducting mounting seat is connected to the lower surface of the semiconductor cooling plate;

[0015] A heat sink is mounted on the lower surface of the mounting plate and connected to the thermally conductive mounting seat;

[0016] A fan is mounted on the mounting plate and aligned with the heat sink;

[0017] The temperature detector is mounted on the heat-conducting mounting seat and abuts against the housing of the photoelectric device to be tested, and is electrically connected to the controller on the test module to achieve intelligent temperature control.

[0018] Optionally, opposite vertical plates are provided on both sides of the mounting plate, the light source module and the light detector module are respectively mounted on the vertical plates, and the test module is located in the middle of the mounting plate.

[0019] Optionally, the vertical plate on which the light source module is installed can be moved along the side direction of the mounting plate so that the tunable laser diode or the single-mode laser diode is aligned with the first optical attenuator module, and the vertical plate can be moved toward or away from the mounting plate to tension the optical fiber between the tunable laser diode and the first optical attenuator or the optical fiber between the single-mode laser diode and the first optical attenuator.

[0020] Optionally, the first optical attenuator module includes a first optical attenuator and a first base, and the first base and the thermal conductive mounting base can be raised and lowered to adapt to the first optical attenuator and the optoelectronic device to be tested at different heights, so that the optical fiber between the tunable laser diode or the single-mode laser diode, the first optical attenuator and the optoelectronic device to be tested is located at the same horizontal height.

[0021] Optionally, the second optical attenuator module includes a second optical attenuator and a second base, and the second base can be raised and lowered to adapt to second optical attenuators of different heights, so that the optical detector, the second optical attenuator and the optical fiber between the optoelectronic device to be tested are at the same horizontal height.

[0022] From the above, it can be seen that the present application provides a test device for an optoelectronic device to be tested, including a mounting board, a photoelectric test system and an electro-optical test system. The photoelectric test system and the electro-optical test system are integrated on the mounting board. Different types of optoelectronic devices can select corresponding test systems according to test requirements. There is no need to build the photoelectric test system and the electro-optical test system on site, thereby improving the test efficiency of the optoelectronic devices. The entire device has the advantages of small size, portability, easy testing and strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of an embodiment of the present application;

[0025] Figure 2 A schematic diagram showing an optoelectronic test system and an electro-optical test system for an embodiment of the present application;

[0026] Figure 3 A schematic diagram showing a first vertical plate and a second vertical plate according to an embodiment of the present application;

[0027] Figure 4 This is a schematic diagram showing a heat dissipation system according to an embodiment of the present application.

[0028] Figure numerals: 1. optoelectronic test system; 11. light source module; 111. tunable laser diode; 112. single-mode laser diode; 113. first PCB board; 12. first optical attenuator module; 121. first optical attenuator; 122. first base; 13. test module; 2. electro-optical test system; 21. second optical attenuator module; 211. second optical attenuator; 212. second base; 22. optical detector module; 221. optical detector; 222. second PCB board; 3. mounting plate; 4. vertical plate; 41. first vertical plate; 42. second vertical plate; 421. slide groove; 422. threaded hole; 423. tightening bolt; 5. threaded rod assembly; 51. threaded rod; 52. nut; 6. heat dissipation system; 61. semiconductor cooling plate; 62. thermal conductive mounting seat; 63. heat sink; 64. fan; 65. temperature detector. DETAILED DESCRIPTION

[0029] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0030] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] As mentioned in the background, optoelectronic devices are various functional devices made using the photoelectric effect, including light emitting diodes, laser diodes, optocouplers, etc.

[0032] In order to ensure the performance of optoelectronic devices, it is necessary to conduct tests on the optoelectronic devices such as photoelectric conversion efficiency and response performance. When conducting on-site testing of optoelectronic devices, it is often necessary to build a test system on site, and the test efficiency is low. In addition, optoelectronic devices include photoelectric-to-electrical devices and electro-optical-to-optical devices, and it is often necessary to test the photoelectric-to-electrical devices and electro-optical-to-optical devices in sequence. Photoelectric-to-electrical devices require photoelectric-to-electrical testing, and a photoelectric-to-electrical testing system needs to be built when conducting photoelectric-to-electrical testing. Electro-optical devices require electro-optical testing, and a electro-optical testing system needs to be built when conducting electro-optical testing. Building two sets of test systems is more troublesome and complicated, which further reduces the test efficiency.

[0033] The following is combined with Figure 1-4 The embodiments of the present application will be described in detail.

[0034] like Figure 1 and Figure 2 As shown, the present application provides a testing device for an optoelectronic device to be tested, comprising:

[0035] Photoelectric test system 1, used for light-to-electricity testing of optoelectronic devices;

[0036] Electro-optical test system 2, used for electro-optical conversion testing of optoelectronic devices;

[0037] The mounting plate 3 is used for mounting the optoelectronic test system 1 and the electro-optical test system 2 .

[0038] Specifically, the optoelectronic test system 1 and the electro-optical test system 2 are generally straight-link links, and the mounting plate 3 is a long strip mounting plate 3. The shape of the mounting plate 3 is adapted to the optoelectronic test system 1 and the electro-optical test system 2, which is convenient for the installation of the optoelectronic test system 1 and the electro-optical test system 2. The optoelectronic test system 1 and the electro-optical test system 2 are relatively arranged and distributed in sequence along the length direction of the mounting plate 3. The common module is placed at a relatively central position of the mounting plate 3, which is convenient for the optoelectronic test system 1 and the electro-optical test system 2 to share, thereby making full use of the space on the mounting plate 3. The layout is reasonable and compact, which is conducive to reducing the volume of the entire device and is easy to carry.

[0039] In this embodiment, the photoelectric test system 1 and the electro-optical test system 2 are integrated on the mounting plate 3. Different types of photoelectric devices can select corresponding test systems according to test requirements. There is no need to build the photoelectric test system 1 and the electro-optical test system 2 on site, thereby improving the test efficiency of the photoelectric devices. The entire device has the advantages of small size, portability, easy testing and strong versatility.

[0040] In some embodiments, Figure 1 and Figure 2As shown, the photoelectric testing system 1 includes a light source module 11, a first optical attenuator module 12 and a testing module 13. The light source module 11 and the first optical attenuator module 12 are connected via optical fiber. The first optical attenuator module 12 is connected to the photoelectric device to be tested via optical fiber. The photoelectric device to be tested is mounted on the testing module 13 and electrically connected to the testing module 13. The testing module 13 is used to test the current information of the photoelectric device to be tested.

[0041] Specifically, the light source module 11, the first optical attenuator module 12 and the test module 13 are all installed on the mounting plate 3, the light source module 11 is located at one end of the mounting plate 3, the test module 13 is located in the middle of the mounting plate 3, and the first optical attenuator module 12 is located between the light source module 11 and the test module 13. Different modules are arranged in sequence along the length direction of the mounting plate 3 according to the working order of different modules, so that the layout is compact and reasonable.

[0042] In the embodiment of the present application, the light emitted by the light source module 11 is transmitted to the first optical attenuator module 12 through the optical fiber. The first optical attenuator module 12 transmits the light to the photoelectric device to be tested through the optical fiber. The photoelectric device to be tested converts the light into current and transmits it to the test module 13. The test module 13 tests the current information of the photoelectric device to be tested, thereby evaluating the performance of the photoelectric device to be tested according to the input light source information and the output current information. The test process is simple and the test efficiency is relatively high. In addition, the first optical attenuator module 12 in the present embodiment can prevent the photoelectric device to be tested from being damaged by the strong light from the light source module 11, thereby improving the reliability of the entire test system. The light source module 11, the first optical attenuator module 12 and the photoelectric device to be tested are connected by optical fiber, and there is no need to arrange a dark box environment on site, thereby improving the stability of light transmission and the test efficiency. The light source module 11, the first optical attenuator module 12 and the test module 13 are arranged in sequence, which is conducive to the straight line arrangement of the optical fiber line, avoiding the bending of the optical fiber, thereby affecting the light transmission.

[0043] In some embodiments, Figure 1 and Figure 2 As shown, the light source module 11 includes a tunable laser diode 111, a single-mode laser diode 112, a first PCB board 113 and a first driving circuit. The tunable laser diode 111, the single-mode laser diode 112 and the first driving circuit are all arranged on the first PCB board 113. The tunable laser diode is driven by the first driving circuit to emit light. The single-mode laser diode 112 is connected to an external driving device through an independent interface. The tunable laser diode 111 and the single-mode laser diode 112 are both encapsulated in an optical fiber connector.

[0044] In addition, opposite vertical plates 4 are provided on both sides of the mounting plate 3 , and the light source module 11 is mounted on one of the vertical plates 4 .

[0045] Specifically, the vertical plate 4 is used to install the first PCB board 113. The vertical plate 4 and the first PCB board 113 are arranged opposite to each other. Two optical fiber connectors are installed on the side of the first PCB board 113 away from the vertical plate 4. A tunable laser diode 111 is encapsulated in one of the optical fiber connectors, and a single-mode laser diode 112 is encapsulated in the other optical fiber connector. The light emitted by the tunable laser diode 111 and the single-mode laser diode 112 is transmitted to the first optical attenuator module 12 through the optical fiber connector.

[0046] Furthermore, the optical fiber connectors are vertically mounted on the first PCB board 113, so that the optical fiber connector on the first PCB board 113 is positioned opposite to the optical fiber connector on one side of the first optical attenuator module 12, and the optical fiber connector on the other side of the first optical attenuator module 12 is positioned opposite to the optical fiber connector on the optoelectronic device to be tested, so that the optical fiber is arranged in parallel along the length direction of the mounting plate 3 to avoid the bending of the optical fiber affecting the light transmission.

[0047] In this embodiment, the light source module 11 includes a tunable laser diode 111 and a single-mode laser diode 112. The tunable laser diode 111 can generate strong light ranging from a single-photon signal to tens of thousands of photons as a light source by adjusting the pulse width and output amplitude of the driving circuit. When the light intensity generated by the tunable laser diode 111 still cannot meet the demand, the single-mode laser diode 112 can be connected through an arbitrary waveform generator to replace the tunable laser diode 111 as the light source input; in addition, the tunable laser diode 111 and the single-mode laser diode 112 are both encapsulated in the optical fiber connector to avoid light leakage and avoid affecting the final test results.

[0048] In some embodiments, Figure 2 and Figure 3 As shown, the vertical plate 4 on which the light source module 11 is installed can move along the side direction of the mounting plate 3 so that the tunable laser diode 111 or the single-mode laser diode 112 is aligned with the first optical attenuator module 12, and the vertical plate 4 can move toward or away from the mounting plate 3 to tension the optical fiber between the tunable laser diode 111 and the first optical attenuator 12 or the optical fiber between the single-mode laser diode 112 and the first optical attenuator 12.

[0049] Specifically, Figure 2 and Figure 3As shown, the vertical plate 4 includes a first vertical plate 41 and a second vertical plate 42 connected to the first vertical plate 41, the first vertical plate 41 is located above the second vertical plate 42, the first vertical plate 41 is used to install the first PCB board 113, the second vertical plate 42 is located on one side of the mounting plate 3, and is connected to the vertical side wall of the mounting plate 3 through a threaded rod assembly 5. The first vertical plate 41 and the second vertical plate 42 are slidably connected, and a slide groove 421 is opened on the top of the second vertical plate 42 along the length direction of the second vertical plate 42, and the first vertical plate 41 slides in the slide groove 421. A threaded hole 422 is also opened on the top of the second vertical plate 42, and the threaded hole 422 is connected to the slide groove 421 and is vertically arranged. A tightening bolt 423 is provided in the threaded hole 422, and the tightening bolt 423 tightens the first vertical plate 41 to achieve the fixation of the first vertical plate 41 and the second vertical plate 42. The above structure can realize that the second vertical plate 42 equipped with the light source module 11 can move along the side direction of the mounting plate 3, so that the tunable laser diode 111 or the single-mode laser diode 112 is aligned with the first optical attenuator module 12.

[0050] Furthermore, the threaded rod assembly 5 is provided in two groups, and the threaded rod assembly 5 includes a threaded rod 51 and a nut 52. The threaded rod 51 passes through the second vertical plate 42 and is fixedly connected to the side wall of the mounting plate 3. The second vertical plate 42 can move on the threaded rod 51. Two nuts 52 are provided, which are respectively located on both sides of the second vertical plate 42 and are used to fix the second vertical plate 42. The above structure can realize the movement of the first vertical plate 41 and the second vertical plate 42 in the direction close to or away from the mounting plate 3.

[0051] In this embodiment, the first vertical plate 41 is used to install the first PCB board 113, the second vertical plate 42 is connected to the mounting plate 3, the first vertical plate 41 is slidably connected to the second vertical plate 42, and the first vertical plate 41 moves along the length direction of the second vertical plate 42, that is, the first vertical plate 41 moves along the side of the mounting plate 3, so that the tunable laser diode 111 or the single-mode laser diode 112 is aligned with the first optical attenuator module 12, avoiding the bending of the optical fiber and affecting the light transmission efficiency. The second vertical plate 42 moves toward or away from the mounting plate 3 through the threaded rod assembly 5, and the first vertical plate 41 moves toward or away from the mounting plate 3 driven by the second vertical plate 42, so that the optical fiber between the light source module 11 and the first optical attenuator module 12 is located at the same horizontal height, further avoiding the bending of the optical fiber and affecting the light transmission efficiency.

[0052] In some embodiments, Figure 1 and Figure 2As shown, the electro-optical test system 2 includes a second optical attenuator module 21 and a light detector module 22. The optoelectronic device to be tested is mounted on the test module 13 and electrically connected to the test module 13. The optoelectronic device to be tested receives current from the test module 13. The optoelectronic device to be tested is connected to the second optical attenuator module 21 via an optical fiber, and the second optical attenuator module 21 is connected to the light detector module 22 via an optical fiber.

[0053] Specifically, the optical detector module 22 is mounted on the vertical plate 4 opposite to the first vertical plate 41 , and the second optical attenuator module 21 is located between the test module 13 and the optical detector module 22 .

[0054] In the embodiment of the present application, the test module 13 provides current for the photoelectric device to be tested, and the photoelectric device to be tested emits light after receiving the current. The light is transmitted to the second optical attenuator module 21 through the optical fiber. The second optical attenuator module 21 transmits the light to the light detector module 22 through the optical fiber. The light detector module 22 tests the light information from the photoelectric device to be tested, thereby evaluating the performance of the photoelectric device to be tested based on the input current information and the output light source information. The test process is simple and the test efficiency is relatively high. In addition, the second optical attenuator module 21 in the present embodiment can prevent the light detector module 22 from being damaged by the strong light from the photoelectric device to be tested, thereby improving the reliability of the entire test system. The photoelectric device to be tested, the second optical attenuator module 21 and the light detector module 22 are connected by optical fiber, and there is no need to arrange a dark box environment on site, thereby improving the stability of light transmission and the test efficiency.

[0055] In some embodiments, the optical detector module 22 includes an optical detector 221, a second PCB board 222 and a second driving circuit. The optical detector 221 and the second driving circuit are both arranged on the second PCB board 222. The optical detector 221 is driven by the second driving circuit, and the optical detector 221 is encapsulated in the optical fiber connector.

[0056] Specifically, the second PCB board 222 is opposite to the vertical board 4, the second PCB board 222 is connected to the vertical board 4, the optical fiber connector is installed on the side of the second PCB board 222 away from the vertical board 4, and the optical fiber connector is vertically installed on the second PCB board 222, so that the optical fiber connector on the second PCB board 222 is opposite to the optical fiber connector on one side of the second optical attenuator module 21, and the optical fiber connector on the other side of the second optical attenuator module 21 is opposite to the optical fiber connector on the optoelectronic device to be tested, so that the optical fiber is arranged in parallel along the length direction of the mounting plate 3 to avoid the bending of the optical fiber affecting the light transmission.

[0057] Furthermore, the vertical plate 4 on which the optical detector module 22 is installed can move along the side direction of the mounting plate 3 so that the optical detector 221 is aligned with the first optical attenuator module 12, and the vertical plate 4 can move toward or away from the mounting plate 3 to tension the optical fiber between the optical detector module 22 and the second optical attenuator module 21. The structure of the vertical plate 4 on which the optical detector module 22 is installed is the same as the structure of the vertical plate 4 on which the power module is installed to achieve the movement of the optical detector module 22.

[0058] In this embodiment, the second PCB board 222 provides an installation position for the light detector module 22 and the second driving circuit. The second driving circuit drives the light detector module 22 to run the test. The test process of the light detector module 22 is simple and the test efficiency is high.

[0059] In some embodiments, Figure 2 and Figure 4 As shown, a testing device for an optoelectronic device to be tested also includes a heat dissipation system 6 for dissipating heat from the optoelectronic device to be tested, wherein the heat dissipation system 6 includes: a semiconductor cooling sheet 61, which is located below the optoelectronic device to be tested and abuts against its housing;

[0060] A heat-conducting mounting seat 62, wherein the mounting plate 3 is provided with a mounting groove penetrating the mounting plate 3, the heat-conducting mounting seat 62 is located in the mounting groove, and the heat-conducting mounting seat 62 is connected to the lower surface of the semiconductor cooling plate 61;

[0061] A heat sink 63 is mounted on the lower surface of the mounting plate 3 and connected to the heat-conducting mounting seat 62;

[0062] A fan 64 is mounted on the mounting plate 3 and aligned with the heat sink 63;

[0063] The temperature detector 65 is mounted on the heat-conducting mounting seat 62 and abuts against the housing of the optoelectronic device to be tested, and is electrically connected to the controller on the test module 13 to achieve intelligent temperature control.

[0064] In this embodiment, the photoelectric device to be tested is very sensitive to temperature changes due to the influence of the semiconductor material used to manufacture the photoelectric device to be tested. If the heat cannot be effectively dissipated during the operation of the device, the device temperature will rise, thereby reducing the performance and life of the device. The temperature compensation algorithm is generally corrected inside the existing photoelectric device. When the temperature rises, the corresponding input voltage is increased according to the temperature compensation coefficient to ensure the performance of the device. However, this method does not reduce the shell temperature of the device and has a greater impact on the service life of the device. In this embodiment, a heat dissipation system 6 is provided to intelligently dissipate the heat of the shell of the photoelectric device to be tested, so that the shell of the photoelectric device to be tested is kept at a constant temperature.

[0065] When the temperature of the photoelectric device to be tested rises, the temperature detector 65 detects the shell temperature of the photoelectric device. When the shell temperature is higher than the preset temperature, the semiconductor refrigeration chip 61 works to absorb heat and conducts the heat of the photoelectric device shell to the thermal mounting seat 62, and dissipates the heat through the heat sink 63 and the fan 64 at the bottom; when the shell temperature of the device is lower than the preset temperature due to heat dissipation, the semiconductor refrigeration chip 61 releases a certain amount of heat in the reverse direction, and the fan 64 stops working, so that the device temperature rises and finally stabilizes near the optimal operating temperature. The temperature control is accurate and efficient.

[0066] In some embodiments, Figure 2 and Figure 4 As shown, the first optical attenuator module 12 includes a first optical attenuator 121 and a first base 122. The first base 122 and the thermal conductive mounting seat 62 can both be raised and lowered to adapt to the first optical attenuator 121 and the optoelectronic device to be tested at different heights, so that the optical fiber between the tunable laser diode 111 or the single-mode laser diode 112, the first optical attenuator 121 and the optoelectronic device to be tested are located at the same horizontal height.

[0067] Specifically, the first base 122 is raised and lowered by a pneumatic cylinder assembly or a hydraulic cylinder assembly, and the thermal conductive mounting seat 62 can also be raised and lowered by a pneumatic cylinder assembly or a hydraulic cylinder assembly. The pneumatic cylinder assembly or the hydraulic cylinder assembly can be installed on the heat sink 63, and a thermal conductive spring is also connected between the thermal conductive mounting seat 62 and the heat sink 63.

[0068] In this embodiment, since the height of the tunable laser diode 111 or the single-mode laser diode 112 is constant, the first optical attenuator 121 and the optoelectronic device to be tested have different heights due to different models and types, so that the optical fiber between the tunable laser diode 111 or the single-mode laser diode 112, the first optical attenuator 121 and the optoelectronic device to be tested is not located at the same horizontal height, affecting light transmission. Therefore, the first base 122 and the thermal conductive mounting seat 62 can be raised and lowered to solve the above problem and ensure the normal operation of light transmission. The pneumatic cylinder assembly or the hydraulic cylinder assembly has the advantages of high adjustment efficiency and accurate adjustment accuracy, which can improve the lifting efficiency of the first base 122 and the thermal conductive mounting seat 62, and facilitate the accurate adjustment of the optical fiber between the tunable laser diode 111 or the single-mode laser diode 112, the first optical attenuator 121 and the optoelectronic device to be tested to the same horizontal height.

[0069] In some embodiments, the second optical attenuator module 21 includes a second optical attenuator 211 and a second base 212, and the second base 212 can be raised and lowered to adapt to second optical attenuators 211 of different heights, so that the optical detector 221, the second optical attenuator 211 and the optical fiber between the optoelectronic device to be tested are located at the same horizontal height.

[0070] Specifically, the second base 212 is lifted and lowered by a pneumatic cylinder assembly or a hydraulic cylinder assembly.

[0071] In the embodiment of the present application, the second base 212 can be raised and lowered to adapt to the second optical attenuators 211 of different heights, so that the optical detector 221, the optical fiber between the second optical attenuator 211 and the photoelectric device to be tested are located at the same horizontal height. The pneumatic cylinder assembly or the hydraulic cylinder assembly has the advantages of high adjustment efficiency and accurate adjustment accuracy, which can improve the lifting efficiency of the second base 212 and facilitate accurate adjustment of the optical detector 221, the optical fiber between the second optical attenuator 211 and the photoelectric device to be tested to the same horizontal height.

[0072] In summary, the device in the present invention integrates the optoelectronic test system 1 and the electro-optical test system 2, which can be applied to various optoelectronic devices to be tested, and there is no need to build the test device on site, thereby improving the test efficiency; the optoelectronic test system 1 and the electro-optical test system 2 in the present invention have a reasonable and compact layout, which reduces the volume of the entire device and is convenient to carry; the optical connections in the optoelectronic test system 1 and the electro-optical test system 2 in the present invention are all through optical fibers, and there is no need to build a dark box environment on site, so the test is convenient and stable. In addition, the positions and heights of multiple modules in the optoelectronic test system 1 and the electro-optical test system 2 are adjustable to avoid bending of the optical fiber, and the optical transmission performance is stable; the present invention also provides an intelligent heat dissipation system 6 to facilitate the shell temperature of the optoelectronic device to be tested to remain constant, thereby improving the stability of the performance of the optoelectronic device to be tested and ensuring the accuracy of the test data.

[0073] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0074] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0075] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0076] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A testing device for an optoelectronic device to be tested, characterized in that: include: Photoelectric testing system (1), used for light-to-electricity testing of photoelectric devices; An electro-optical test system (2), used for electro-optical conversion testing of optoelectronic devices; A mounting plate (3) is used for mounting the optoelectronic test system (1) and the electro-optical test system (2).

2. A testing device for an optoelectronic device to be tested according to claim 1, characterized in that: The photoelectric test system (1) comprises a light source module (11), a first optical attenuator module (12) and a test module (13); the light source module (11) and the first optical attenuator module (12) are connected via an optical fiber; the first optical attenuator module (12) and a photoelectric device to be tested are connected via an optical fiber; the photoelectric device to be tested is mounted on the test module (13) and is electrically connected to the test module (13); the test module (13) is used to test current information of the photoelectric device to be tested.

3. A testing device for an optoelectronic device to be tested according to claim 2, characterized in that: The light source module (11) comprises a tunable laser diode (111), a single-mode laser diode (112), a first PCB board (113) and a first drive circuit; the tunable laser diode (111), the single-mode laser diode (112) and the first drive circuit are all arranged on the first PCB board (113); the tunable laser diode is driven by the first drive circuit to emit light; the single-mode laser diode (112) is connected to an external drive device via an independent interface; and the tunable laser diode (111) and the single-mode laser diode (112) are both encapsulated in an optical fiber connector.

4. A testing device for an optoelectronic device to be tested according to claim 2, characterized in that: The electro-optical test system (2) comprises a second optical attenuator module (21) and a light detector module (22); the photoelectric device to be tested is mounted on the test module (13) and electrically connected to the test module (13); the photoelectric device to be tested receives current from the test module (13); the photoelectric device to be tested is connected to the second optical attenuator module (21) via an optical fiber; and the second optical attenuator module (21) is connected to the light detector module (22) via an optical fiber.

5. A testing device for an optoelectronic device to be tested according to claim 4, characterized in that: The optical detector module (22) comprises an optical detector (221), a second PCB board (222) and a second drive circuit; the optical detector (221) and the second drive circuit are both arranged on the second PCB board (222); the optical detector (221) is driven to operate by the second drive circuit; and the optical detector (221) is encapsulated in an optical fiber connector.

6. A testing device for an optoelectronic device to be tested according to claim 3, characterized in that: It also includes a heat dissipation system (6) for dissipating heat from the photoelectric device to be tested, the heat dissipation system (6) including: a semiconductor cooling plate (61) located below the photoelectric device to be tested and abutting against its housing; A heat-conducting mounting seat (62), wherein the mounting plate (3) is provided with a mounting groove penetrating the mounting plate (3), the heat-conducting mounting seat (62) is located in the mounting groove, and the heat-conducting mounting seat (62) is connected to the lower surface of the semiconductor cooling plate (61); A heat sink (63) mounted on the lower surface of the mounting plate (3) and connected to the heat-conducting mounting seat (62); A fan (64) is mounted on the mounting plate (3) and aligned with the heat sink (63); A temperature detector (65) is mounted on the heat-conducting mounting seat (62) and abuts against the housing of the photoelectric device to be tested, and is electrically connected to a controller on the test module (13) to achieve intelligent temperature control.

7. A testing device for an optoelectronic device to be tested according to claim 5, characterized in that: Vertical plates (4) are arranged opposite to each other on both sides of the mounting plate (3); the light source module (11) and the light detector module (22) are respectively mounted on the vertical plates (4); and the test module (13) is located in the middle of the mounting plate (3).

8. A testing device for an optoelectronic device to be tested according to claim 7, characterized in that: The vertical plate (4) on which the light source module (11) is mounted can move along the side direction of the mounting plate (3) so that the tunable laser diode (111) or the single-mode laser diode (112) is aligned with the first optical attenuator module (12), and the vertical plate (4) can move in a direction approaching or away from the mounting plate (3) so as to tension the optical fiber between the tunable laser diode (111) and the first optical attenuator (121) or the optical fiber between the single-mode laser diode (112) and the first optical attenuator (121).

9. A testing device for an optoelectronic device to be tested according to claim 6, characterized in that: The first optical attenuator (121) module comprises a first optical attenuator (121) and a first base (122); the first base (122) and the heat-conducting mounting seat (62) can both be raised and lowered to adapt to the first optical attenuator (121) and the photoelectric device to be tested at different heights, so that the optical fiber between the tunable laser diode (111) or the single-mode laser diode (112), the first optical attenuator (121) and the photoelectric device to be tested is located at the same horizontal height.

10. A testing device for an optoelectronic device to be tested according to claim 4, characterized in that: The second optical attenuator module (21) comprises a second optical attenuator (211) and a second base (212); the second base (212) can be raised and lowered to adapt to second optical attenuators (211) of different heights, so that the optical detector (221), the second optical attenuator (211) and the optical fiber between the optoelectronic device to be tested are located at the same horizontal height.

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