A preparation method of a display panel, a display panel and an electronic device

Abstract

The application discloses a display panel preparation method, a display panel and electronic equipment. The preparation method comprises the following steps: providing a display panel, wherein the display panel comprises a liquid crystal layer and two soldered substrates, each soldered substrate comprises a soldering area and a driving area, the liquid crystal layer is arranged between the driving areas of the two soldered substrates, and the soldering areas of the two soldered substrates are arranged correspondingly; and performing multiple first laser pulses on a current soldering point of the soldering area on one side of one soldered substrate away from the other soldered substrate, so that the two soldering areas are partially melted and then fixed under the action of the multiple first laser pulses corresponding to the current soldering point. Thus, the energy accumulated by the multiple first laser pulses collectively melts and fixes the two soldered substrates, reduces the risk of cracks in the soldered substrates, and thus achieves a better soldering effect and improves the anti-falling strength of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel preparation method, display panel and electronic device. BACKGROUND

[0002] With the rise of smart home, smart supermarket and the like, liquid crystal products have entered people's life and work in large quantities, and are widely used in mobile phones, personal digital assistants, computers, televisions and other fields. With the wide application of liquid crystal products, higher requirements are also put forward for liquid crystal products.

[0003] At present, liquid crystal display panels begin to be continuously innovated and developed, and many narrow-frame products are made. The increasingly narrow frame requires extreme design changes to the previous panel structure, resulting in a decrease in the anti-falling strength of the liquid crystal panel. Therefore, how to effectively improve the anti-falling strength of the narrow-frame product is particularly important. SUMMARY

[0004] The main purpose of the present application is to provide a display panel preparation method, display panel and electronic device, aiming at solving the above technical problems existing in the prior art.

[0005] To solve the above problems, the present application provides a display panel preparation method, which comprises: providing a display panel, wherein the display panel comprises a liquid crystal layer and two layers of welding substrates, each layer of the welding substrate comprises a welding area and a driving area, the liquid crystal layer is arranged between the driving areas of the two layers of the welding substrates, and the welding areas of the two layers of the welding substrates are correspondingly arranged; a plurality of first laser pulses are performed on a current welding point in the welding area of one of the welding substrates away from the other welding substrate, so that the two welding areas corresponding to the current welding point are partially melted and fixed under the action of the plurality of first laser pulses.

[0006] In some embodiments, after the step of performing a plurality of first laser pulses on a current welding point in the welding area of one of the welding substrates away from the other welding substrate, the preparation method comprises: adjusting the relative position of the welding laser and the welding area so that the welding laser corresponds to a next welding point, wherein the next welding point and the current welding point correspond to different positions of the welding area; taking the next welding point as the current welding point, and returning to the step of performing a plurality of first laser pulses on the current welding point in the welding area of one of the welding substrates away from the other welding substrate, until a welding track surrounding the liquid crystal layer is formed.

[0007] In some embodiments, after the step of forming the welding track surrounding the liquid crystal layer, the preparation method further comprises: adjusting the relative position of the welding laser and the welding region according to the welding track; during the adjustment of the relative position of the welding laser and the welding region, at least one second laser pulse is applied to the welding point position at a different position in the welding track, wherein the power of the first laser pulse is less than the power of the second laser pulse.

[0008] In some embodiments, the current welding point position and the next welding point position at least partially overlap.

[0009] In some embodiments, the preparation method comprises: adjusting the incident angle of the welding laser incident to a scanning galvanometer to change the shape of the welding laser incident to the current welding point position, wherein the scanning galvanometer is located on the light path of the welding laser.

[0010] In some embodiments, before the step of applying multiple first laser pulses to the current welding point position in the welding region of one of the welding substrates away from the side of the other welding substrate, the preparation method comprises: applying one third laser pulse to a predetermined welding point position of the welding region of one of the welding substrates away from the other welding substrate, so that the two welding regions corresponding to the predetermined welding point position are fixed after being partially melted under the action of the third laser pulse, wherein the predetermined welding point position and the current welding point position correspond to different positions of the welding region, and the power of the first laser pulse is less than the power of the third laser pulse.

[0011] In some embodiments, the power of the third laser pulse is 1.3 to 12 times the power of the first laser pulse.

[0012] In some embodiments, the step of applying multiple first laser pulses to the current welding point position in the welding region of one of the welding substrates away from the side of the other welding substrate, so that the two welding regions corresponding to the current welding point position are fixed after being partially melted under the action of multiple first laser pulses, comprises: applying at least one fourth laser pulse to the current welding point position in the welding region of one of the welding substrates away from the side of the other welding substrate; applying at least one fifth laser pulse to the current welding point position, so that the two welding regions corresponding to the current welding point position are fixed after being partially melted under the action of the fifth laser pulse, wherein the power of the fourth laser pulse is less than the power of the fifth laser pulse.

[0013] To solve the above problems, the present application provides a display panel prepared by the above preparation method.

[0014] To solve the above problems, the electronic device provided by the present application comprises the display panel as described above.

[0015] Compared with the prior art, the preparation method of the display panel provided by the present application comprises: providing a display panel, wherein the display panel comprises a liquid crystal layer and two soldered substrates, each soldered substrate comprises a soldering area and a driving area, the liquid crystal layer is arranged between the driving areas of the two soldered substrates, and the soldering areas of the two soldered substrates are arranged correspondingly; and multiple first laser pulses are applied to a current soldering point in the soldering area of one soldered substrate away from the other soldered substrate, so that the two soldering areas corresponding to the current soldering point are partially melted and then fixed under the action of the multiple first laser pulses. Through the above embodiment, the multiple first laser pulses are applied to the current soldering point in the soldering area of one soldered substrate away from the other soldered substrate, which can make the laser gradually penetrate the soldered substrate compared with the laser pulses with less number and larger energy, and the energy accumulated by the multiple first laser pulses can jointly melt and then fix the two soldered substrates, thereby reducing the risk of cracks in the soldered substrate, achieving better soldering effect, and the two soldering areas corresponding to the current soldering point are partially melted and then fixed under the action of the multiple first laser pulses, which can improve the fixing effect of the two soldered substrates and improve the anti-falling strength of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 is an embodiment flowchart of the preparation method of the display panel provided by the present application;

[0018] Figure 2 is an embodiment structure schematic diagram of the display panel provided by the present application;

[0019] Figure 3 is Figure 2 the top view structure schematic diagram of the display panel shown in the figure;

[0020] Figure 4 is an embodiment structure schematic diagram of the soldered display panel provided by the present application;

[0021] Figure 5 is Figure 1 is an embodiment flowchart after step S102 in the figure;

[0022] Figure 6 is Figure 1An embodiment flowchart of step S102 is shown in the following figure.

[0023] Figure 7 An embodiment structure diagram of the electronic device provided in the present application is shown in the following figure. DETAILED DESCRIPTION

[0024] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0026] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly and specifically limited.

[0027] In this paper, the phrase "embodiment" means that the specific features, structures or properties described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment to other embodiments. The skilled person in the art explicitly and implicitly understands that the embodiments described herein can be combined with other embodiments.

[0028] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents a "or" relationship between the front and rear associated objects.

[0029] In the description of the embodiments of the present application, the term "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more groups (including two groups), and "multiple pieces" refers to two or more pieces (including two pieces).

[0030] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0031] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0032] With the rise of smart homes and smart supermarkets, LCD products have become increasingly prevalent in people's lives and work, finding widespread application in mobile phones, personal digital assistants, computers, and televisions. This widespread use of LCD products has also placed higher demands on them.

[0033] Currently, LCD panels are constantly being innovated and developed, resulting in many narrow bezel products. The increasingly narrow bezels require extreme design changes to the previous panel structure, which leads to a decrease in the drop resistance of the LCD panel. Therefore, it is particularly important to effectively improve the drop resistance of narrow bezel products.

[0034] To address the technical problems existing in related technologies, this application provides a method for manufacturing a display panel, see [link to relevant documentation]. Figure 1 , Figure 1 This is a schematic flowchart of an embodiment of the method for manufacturing a display panel provided in this application, specifically including the following steps S101 to S102.

[0035] Step S101: Provide a display panel.

[0036] Can be combined Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of an embodiment of the display panel 10 provided in this application. Figure 3 yes Figure 2 The diagram shows a top view of the display panel 10.

[0037] The display panel 10 comprises a liquid crystal layer 200 and two layers of welding substrates 100, each layer of the welding substrate 100 comprises a welding area 111 and a driving area 112, the liquid crystal layer 200 is arranged between the driving areas 112 of the two layers of the welding substrates 100, and the welding areas 111 of the two layers of the welding substrates 100 are arranged correspondingly. One of the welding substrates 100 can be a driving substrate, and the other can be a color film substrate. The driving substrate can comprise a substrate and a driving electrode, and the driving electrode is arranged on the substrate and can be used to drive the liquid crystal molecules in the liquid crystal layer 200 to deflect. The color film substrate can be used to filter light of a specific wavelength, thereby adjusting the display of the display panel 10, for example, the color film substrate can comprise a substrate, a color filter and a driving electrode, and the color filter is arranged on the substrate and can comprise red, green and blue color filter areas. The substrate can be made of hard materials such as glass, ceramic, sapphire, etc., so as to bear the driving electrode through the substrate. The welding substrate 100 can be divided into a driving area 112 and a welding area 111, and the driving area 112 can be arranged adjacent to the welding area 111, for example, the driving area 112 can be arranged on one side of the welding area 111, or the welding area 111 can be annular to surround the driving area 112.

[0038] The liquid crystal layer 200 comprises liquid crystal molecules, and the liquid crystal molecules can deflect in the liquid crystal layer 200. In this embodiment, both of the two layers of the welding substrates 100 can comprise driving electrodes, and the driving electrodes are arranged in the driving areas 112 of the welding substrates 100 respectively, and the liquid crystal layer 200 is arranged between the two layers of the driving electrodes, and the liquid crystal molecules in the liquid crystal layer 200 can be driven to deflect by the two layers of the driving electrodes, thereby realizing the purpose of changing the display of the display panel 10. The welding areas 111 of the two layers of the welding substrates 100 can correspond in the spacing direction of the two layers of the welding substrates 100, and when welding is needed, the two layers of the welding substrates 100 can be arranged relatively and spaced apart, for example, the spacing between the two layers of the welding substrates 100 can be between 3 to 5 μm, and the welding areas 111 of the two layers of the welding substrates 100 correspond, and then the welding areas 111 of the two layers of the welding substrates 100 are welded and fixed.

[0039] Step S102: multiple first laser pulses are applied to the current welding point in the welding area of the welding substrate away from the other welding substrate, so that the two welding areas are partially melted and fixed under the action of the multiple first laser pulses corresponding to the current welding point.

[0040] The method can be combined with Figure 4 , Figure 4This is a schematic diagram of an embodiment of the welded display panel 10 provided in this application. A welding laser 400 is emitted from a laser 500 to the driving area 112 of one of the welding substrates 100. The energy of the welding laser 400 melts portions of the two welding areas 111, filling the gap between the two welding substrates 100 and thus fixing them together. The two welding substrates 100 are stacked. When welding the display panel 10, it is first placed on a worktable, with one welding substrate 100 directly in contact with the worktable and the other welding substrate 100 away from it. The laser 500 emits a laser beam onto the welding substrate 100 away from the worktable. The welding area 111 may have multiple preset welding points. The welding point currently hit by the welding laser 400 can be defined as the current welding point 310. The laser energy melts the welding substrate 100 at the current welding point 310. In this embodiment, by applying multiple first laser pulses to the current welding point 310, that is, by having multiple first laser pulses act together on the current welding point 310, the welding substrate 100 corresponding to the current welding point 310 can be gradually melted even with the first laser pulses of relatively low welding power. This results in the two welding areas 111 corresponding to the current welding point 310 being partially melted and fixed after being acted upon by multiple first laser pulses. Furthermore, since the first laser pulses can be adapted to lower power, the weld joint ultimately formed at the current welding point 310 is smaller, making it easier to maintain the integrity of the appearance of the display panel 10.

[0041] Through the above implementation method, multiple first laser pulses are applied to the current welding point 310 in the welding area 111 on the side of one welding substrate 100 away from the other welding substrate 100. Compared with fewer laser pulses with higher energy, this allows the laser to gradually penetrate the welding substrate 100. The energy accumulated by multiple first laser pulses melts and fixes the two welding substrates 100 together, reducing the risk of cracks in the welding substrate 100 and achieving a better welding effect. Furthermore, the two welding areas 111 corresponding to the current welding point 310 are partially melted and fixed under the action of multiple first laser pulses, which can improve the fixing effect of the two welding substrates 100 and enhance the anti-detachment strength of the display panel 10.

[0042] In some embodiments, the preparation method comprises: adjusting the incident angle of the welding laser 400 incident to the scanning galvanometer 600 to change the shape of the welding laser 400 incident to the current welding point 310, wherein the scanning galvanometer 600 is located on the light path of the welding laser 400. The scanning galvanometer 600 can be located between the laser 500 and the display panel 10, the welding laser 400 can be incident to the scanning galvanometer 600 and then emitted from the scanning galvanometer 600 to the display panel 10, and the scanning galvanometer 600 can be used to change the shape of the welding laser 400 located on the display panel 10, for example, the shape of the welding laser 400 can be adjusted to be square, circular, elliptical, etc. through the scanning galvanometer 600. For example, the surface of the scanning galvanometer 600 used to receive the welding laser 400 can be perpendicular to the welding laser 400 in the initial state, and the incident angle of the welding laser 400 incident to the scanning galvanometer 600 can be adjusted by changing the direction of the welding laser 400 or changing the position of the scanning galvanometer 600 to change the shape of the welding laser 400 incident to the current welding point 310, so as to adapt to display panels 10 of different shapes.

[0043] Referring to Figure 5 , Figure 5 is Figure 1 an embodiment flowchart after step S102 in

[0044] Step S501: Adjust the relative position of the welding laser and the welding area so that the welding laser corresponds to the next welding point, wherein the next welding point and the current welding point correspond to different positions of the welding area.

[0045] The relative position of the welding laser 400 and the welding area 111 can be adjusted by moving the display panel 10, or by moving the laser 500, or by setting an optical element between the laser 500 and the display panel 10, and adjusting the position of the welding laser 400 incident to the welding area 111 through the optical element, etc. The next welding point 320 and the current welding point 310 can both be preset welding points in the welding area 111, the next welding point 320 can be adjacent to the current welding point 310, or the next welding point 320 can be spaced from the current welding point 310, or the next welding point 320 can partially overlap the current welding point 310. After the welding operation is completed at the current welding point 310 by the welding laser 400, the relative position of the welding laser 400 and the welding area 111 can be adjusted so that the welding laser 400 is focused at the next welding point 320, so as to perform the welding operation at the next welding point 320 by the welding laser 400.

[0046] Step S502: taking the next welding point as the current welding point, and returning to step S501: performing multiple first laser pulses on the current welding point in the welding area of the one welding substrate away from the other welding substrate, until a welding track surrounding the liquid crystal layer is formed.

[0047] When the welding laser 400 is incident to the next welding point 320, the next welding point 320 corresponds to the welding point where the welding laser 400 is currently incident, and the next welding point 320 at this time becomes the current welding point 310. Then, multiple first laser pulses can be continuously performed on the current welding point 310, so that the two welding areas 111 corresponding to the current welding point 310 are fixed after being partially melted by the multiple first laser pulses. After the welding operation of this welding point is completed, the relative positions of the welding laser 400 and the welding area 111 can be adjusted again, and the welding operation is performed on another welding point. The above steps are repeated until the welding track 300 surrounding the liquid crystal layer 200 is formed. The welding track 300 can be understood as a weld formed by connecting multiple welding points in sequence. The welding track 300 can have a closed loop or an open loop shape, or the welding track 300 can also be multiple welds, and the like. Thus, the welding track 300 surrounding the liquid crystal layer 200 can further improve the fixing effect of the two-layer welding substrate 100 and improve the anti-falling strength of the display panel 10.

[0048] Further, the current welding point 310 and the next welding point 320 at least partially overlap. The current welding point 310 and the next welding point 320 at least partially overlap, so that the welding laser 400 can be adjusted by a small amplitude to correspond to the next welding point 320 from the current welding point 310. Moreover, the current welding point 310 and the next welding point 320 at least partially overlap can make the sealing performance of the finally formed welding track 300 better, so that the display panel 10 has better waterproof effect. The overlap rate of the current welding point 310 and the next welding point 320 can be between one fourth and three fourths of the current welding point 310 or the next welding point 320. Specifically, the overlap rate of the current welding point 310 and the next welding point 320 can be one fourth, one half, or three fourths of the current welding point 310 or the next welding point 320, and the like.

[0049] In some embodiments, after the step of forming the welding track 300 around the liquid crystal layer 200 (step S502), the manufacturing method further comprises: adjusting the relative position of the welding laser 400 and the welding area 111 according to the welding track 300; and during the adjustment of the relative position of the welding laser 400 and the welding area 111, at least one second laser pulse is performed on the welding point positions at different locations in the welding track 300, wherein the power of the first laser pulse is less than the power of the second laser pulse.

[0050] After the initial formation of the welding track 300, the welding point positions at which the welding operation can be finally performed can be taken as the initial starting points, and the relative position of the welding laser 400 and the welding area 111 is adjusted so that the position at which the welding laser 400 is incident to the welding area 111 gradually changes along the welding track 300 and passes through each welding point position on the welding track 300 one by one. Each time the laser is incident to a welding point position, at least one second laser pulse can be performed on the welding point position to reinforce the fixing effect of the two-layer welding substrate 100 by the second laser pulse. Since the power of the first laser pulse is small, the shape of the welding point finally appearing on the surface of the welding substrate 100 can be smaller, which is more conducive to the appearance integrity of the display panel 10, and since the power of the second laser pulse is large, the fixing effect of the two-layer welding substrate 100 can be more reinforced by the second laser pulse, while the risk of the welding effect not being obvious due to insufficient first laser pulse energy can also be alleviated.

[0051] In some embodiments, before the step of applying a plurality of first laser pulses to the current welding point 310 in the welding area 111 of one welding substrate 100 facing away from the other welding substrate 100 (step S102), the preparation method comprises: applying a third laser pulse to a predetermined welding point 330 in the welding area 111 of one welding substrate 100 facing away from the other welding substrate 100, so that the two welding areas 111 corresponding to the predetermined welding point 330 are partially melted and fixed under the action of the third laser pulse, wherein the predetermined welding point 330 and the current welding point 310 correspond to different positions of the welding area 111, and the power of the first laser pulse is less than that of the third laser pulse. The predetermined welding point 330 can be any one or more welding points on the welding area 111, or the predetermined welding point 330 can be a welding point at a corner of the welding track 300. For example, when the display panel 10 is a quadrilateral display panel 10, the welding track 300 can have a quadrilateral shape, so that the welding track 300 can generate four welding points at the corners, each of which can be understood as a predetermined welding point 330. The power of the first laser pulse is less than that of the third laser pulse, which can quickly weld and fix the two layers of welding substrates 100 at the predetermined welding point 330 by the third laser pulse, and when the predetermined welding point 330 is a welding point at a corner of the welding track 300, the predetermined welding point 330 processed by the third laser pulse with higher power can form a larger welding part, which is easier to make the welding track 300 continuous and improve the welding effect.

[0052] Further, the power of the third laser pulse is 1.3 to 12 times the power of the first laser pulse. Specifically, the power of the third laser pulse is 2 to 12 times the power of the first laser pulse, the power of the third laser pulse is 3 to 10 times the power of the first laser pulse, the power of the third laser pulse is 4 to 8 times the power of the first laser pulse, or the power of the third laser pulse is 5 to 12 times the power of the first laser pulse, and the like. For example, the power of the first laser pulse can be 0.5 to 3 w, the frequency of repetition can be 1 MHz, the power of the third laser pulse can be 4 to 6 w, and the frequency of repetition can be 500 kHz to 1000 kHz. The width of the welding point left by the first laser pulse can be less than or equal to 50 μm, and the width of the welding point left by the second laser pulse can be 90 μm to 150 μm.

[0053] Referring to Figure 6 , Figure 6 is Figure 1 an embodiment flowchart of step S102 in

[0054] Step S601: at least one fourth laser pulse is applied to the current welding point in the welding area of the welding substrate away from the other welding substrate.

[0055] The power of the fourth laser pulse can be the same as or similar to the power of the first laser pulse described above. The power of the fourth laser pulse is relatively low. By initially applying the fourth laser pulse to the welding substrate 100 at the current welding point 310, the width of the welding point left on the welding substrate 100 can be small. For example, the power of the fourth laser pulse can be between 0.5w and 3w, and the repetition frequency can be 1MHz, so that the width of the welding point left can be less than or equal to 50μm, etc. In this embodiment, by applying at least one fourth laser pulse to the current welding point 310, i.e. by applying at least one fourth laser pulse to the current welding point 310, at least part of the welding substrate 100 corresponding to the current welding point 310 can be gradually melted by the fourth laser pulse with relatively small welding power. Since the fourth laser pulse can be adapted to have a relatively small power, the welding point formed at the current welding point 310 is smaller and more suitable for the appearance of the display panel 10, etc.

[0056] Step S602: at least one fifth laser pulse is applied to the current welding point, so that the two welding areas corresponding to the current welding point are partially melted and fixed under the action of the fifth laser pulse. The power of the fourth laser pulse is less than the power of the fifth laser pulse.

[0057] The power of the fifth laser pulse is relatively large, so that the welding substrate 100 at the current welding point 310 can be quickly melted by the fifth laser pulse. For example, the power of the fifth laser pulse can be between 4w and 6w, and the repetition frequency can be 500kHz-1000kHz. Since the fourth laser pulse is first applied to the current welding point 310, part of the welding substrate 100 at the current welding point 310 has been melted. When the fifth laser pulse is applied to the current welding point 310, the fifth laser pulse directly acts on the internal welding substrate 100, which alleviates the problem of leaving a large trace of the welding point to the surface of the welding substrate 100 due to the relatively large power of the fifth laser pulse. Thus, the welding efficiency can be improved, and the appearance of the display panel 10 can be more complete, etc.

[0058] In summary, the current welding point 310 in the welding area 111 on the side of one welding substrate 100 away from the other welding substrate 100 is subjected to multiple first laser pulses, which can make the laser gradually penetrate the welding substrate 100, and the two layers of welding substrates 100 are fixed after being melted by the energy accumulated by the multiple first laser pulses, thereby reducing the risk of cracks in the welding substrate 100, achieving better welding effect, and the two welding areas 111 corresponding to the current welding point 310 are partially melted and fixed under the action of the multiple first laser pulses, which can improve the fixing effect of the two layers of welding substrates 100 and improve the anti-falling strength of the display panel 10.

[0059] To solve the technical problems in the related art, the application further provides a display panel prepared by the preparation method of any of the above embodiments.

[0060] To solve the technical problems in the related art, the application further provides an electronic device, which is described below. Figure 7 , Figure 7 is an embodiment structure schematic diagram of the electronic device provided by the application.

[0061] The electronic device 1 comprises the display panel 10 described above. The electronic device 1 comprises a housing 20 and the display panel 10, and the housing 20 is used to carry the display panel 10. It should be noted that the electronic device 1 in the embodiments of the application can be a television, a mobile phone, a smart phone, a tablet computer, an electronic reader, a wearable portable device, a notebook computer, etc. The electronic device 1 can communicate with a data transfer server through the Internet, and the data transfer server can be an instant messaging server, etc. The embodiments of the application do not limit this.

[0062] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application, and they should be covered in the scope of the claims and the specification of the application. In particular, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a display panel, characterized by, The preparation method comprises: providing a display panel, wherein the display panel comprises a liquid crystal layer and two layers of welding substrates, each layer of the welding substrate comprises a welding area and a driving area, the liquid crystal layer is arranged between the driving areas of the two layers of the welding substrates, and the welding areas of the two layers of the welding substrates are arranged correspondingly; a plurality of first laser pulses are performed on a current welding point in the welding area of one of the welding substrates away from the other welding substrate, so that the two welding areas corresponding to the current welding point are partially melted and then fixed under the action of the plurality of first laser pulses; adjusting the relative positions of a welding laser and the welding area, so that the welding laser corresponds to a next welding point, wherein the next welding point and the current welding point correspond to different positions of the welding area; taking the next welding point as the current welding point, and returning to the step of performing a plurality of first laser pulses on the current welding point in the welding area of one of the welding substrates away from the other welding substrate, until a welding track surrounding the liquid crystal layer is formed; Before the step of performing a plurality of first laser pulses on the current welding point in the welding area of one of the welding substrates away from the other welding substrate, the preparation method comprises: performing a third laser pulse on a predetermined welding point of the welding area of one of the welding substrates away from the other welding substrate, so that the two welding areas corresponding to the predetermined welding point are partially melted and then fixed under the action of the third laser pulse, wherein the predetermined welding point and the current welding point correspond to different positions of the welding area; the power of the first laser pulse is less than the power of the third laser pulse, so that the area of the current welding point is less than the area of the predetermined welding point, and welding positions formed by at least part of the plurality of first laser pulses are located inside the welding position formed by the third laser pulse.

2. The production method according to claim 1, characterized by, After the step of forming the welding track surrounding the liquid crystal layer, the preparation method further comprises: adjusting the relative positions of the welding laser and the welding area according to the welding track; in the process of adjusting the relative positions of the welding laser and the welding area, performing at least one second laser pulse on welding points at different positions in the welding track, wherein the power of the first laser pulse is less than the power of the second laser pulse.

3. The method of claim 1, wherein, The current welding point and the next welding point at least partially overlap.

4. The method of claim 1, wherein, The preparation method comprises: adjusting the incident angle of a welding laser to a scanning galvanometer to change the shape of the welding laser incident to the current welding point, wherein the scanning galvanometer is located on the light path of the welding laser.

5. The preparation method according to claim 1, characterized in that, The power of the third laser pulse is 1.3 to 12 times the power of the first laser pulse.

6. The production method according to any one of claims 1 to 4, characterized by, The step of performing multiple first laser pulses on a current welding point in the welding area of one of the welding substrates away from the other welding substrate, so that the two welding areas corresponding to the current welding point are fixed after being partially melted under the action of the multiple first laser pulses, comprises: performing at least one fourth laser pulse on the current welding point in the welding area of one of the welding substrates away from the other welding substrate; performing at least one fifth laser pulse on the current welding point, so that the two welding areas corresponding to the current welding point are fixed after being partially melted under the action of the fifth laser pulse, wherein the power of the fourth laser pulse is less than the power of the fifth laser pulse.

7. A display panel, characterized by, The display panel is prepared by the preparation method according to any one of claims 1 to 6.

8. An electronic device, comprising: The electronic device comprises the display panel according to claim 7. The electronic device comprises the display panel according to claim 7.

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