Gluing and developing system for photoetching

Abstract

The invention provides a photoresist coating and developing system for photoetching. The photoresist coating and developing system for photoetching comprises a coating system, a pumping system and an intelligent adjusting module, wherein the coating system is used for coating a substrate with photoresist; the pumping system is used for providing stable and continuous photoresist supply for the coating system, and the pumping system can automatically adjust pumping parameters according to photosensitive characteristics of different photoresists, so that the utilization rate of chemical materials is improved; and the intelligent adjustment module is used for monitoring the running state of the equipment in real time and performing parameter adjustment, so that the operation difficulty and the maintenance cost are greatly reduced.

Description

Technical Field

[0001] The invention relates to the technical field of photolithography coating and development, and in particular to a coating and development system for photolithography. Background Art

[0002] In existing photolithography equipment, the coating and developing process is one of the key steps. The traditional coating and developing system usually includes a coating unit and a developing unit, wherein the coating unit is responsible for evenly coating the photosensitive material on the surface of the silicon wafer, and the developing unit is responsible for developing the pattern after exposure. For example, U.S. Patent US 6572810B2 discloses a coating and developing device, which achieves high-quality coating and developing effects through a rotating coating head and a precisely controlled chemical pumping system. However, this system has some limitations, such as low coating efficiency and low chemical material utilization. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a photolithography coating and developing system, which is specifically achieved through the following technical solutions:

[0004] A photolithography coating and developing system comprises a coating system, a pumping system, and an intelligent adjustment module, wherein:

[0005] The coating system is used to coat the photoresist on the substrate;

[0006] The pumping system is used to provide a stable and continuous supply of photoresist to the coating system, and the pumping system can automatically adjust the pumping parameters according to the photosensitivity characteristics of different photoresists;

[0007] The intelligent adjustment module is used to monitor the operating status of the equipment in real time and adjust parameters.

[0008] Optionally or preferably, the coating system includes a nozzle, a nozzle control system, a pipeline system, and a cleaning system;

[0009] The nozzle is responsible for spraying the photoresist onto a silicon wafer or other substrate in a precisely controlled amount and form; the nozzle is a micro-nano structure;

[0010] The nozzle control system is used to accurately control the movement speed, spraying amount and spraying mode of the nozzle;

[0011] The pipeline system is connected to the nozzle and the pumping system;

[0012] The cleaning system is used to clean the residues accumulated in the nozzle and the pipeline system during the spraying process. The cleaning system includes a cleaning liquid storage tank and a cleaning pipeline connected to the nozzle.

[0013] Optionally or preferably, the pumping system comprises a photoresist supply bottle, a buffer tank, a delivery pump, and a filter;

[0014] The photoresist supply bottle is used to store the photoresist to be coated;

[0015] The buffer tank is arranged between the photoresist supply bottle and the liquid discharge glue pump, the top of the buffer tank is provided with a liquid inlet and a liquid discharge port, and the bottom is provided with a photoresist outlet; the liquid inlet is connected with the photoresist supply bottle through a liquid inlet pipeline, so that the photoresist flows into the buffer tank; the liquid discharge port is connected with the liquid discharge glue pump through a liquid discharge pipeline, and is used to extract air in the buffer tank;

[0016] The transport pump is used to provide power for the pumping system. The transport pump promotes the photoresist to enter the buffer tank by pumping, and extracts the air and the photoresist containing bubbles in the buffer tank.

[0017] The filter is arranged between the photoresist supply bottle and the coating system to remove impurities and particles in the photoresist.

[0018] Optionally or preferably, the intelligent adjustment module includes a sensor group, a data acquisition unit, a signal processing unit, and an adaptive adjustment unit;

[0019] The sensor group includes a plurality of sensors distributed in the coating system and the pumping system, and the sensor group is used to collect parameters including but not limited to the flow rate, pressure and temperature of the photoresist, and transmit the collected information to the data acquisition unit in the form of electrical signals;

[0020] The data acquisition unit is used to receive the electrical signal transmitted by the sensor group, convert it into a digital signal for storage, and transmit the digital signal to the signal processing unit;

[0021] The signal processing unit further processes and analyzes the received digital signal to extract useful information. Specifically, the processing method includes but is not limited to filtering, amplification, conversion and other operations to better understand and utilize the data;

[0022] The adaptive adjustment unit adjusts the coating process and the pumping process in real time according to the information provided by the signal processing unit to ensure that the coating quality meets the requirements.

[0023] Optionally or preferably, the intelligent adjustment module also includes a user interface; the user interface is used to display the adjustment results of the intelligent adjustment module and the real-time parameters of each system; through the user interface, the operator can easily perform parameter settings, mode selection and other operations, and understand the progress and results of the coating process in real time.

[0024] Optionally or preferably, the intelligent adjustment module also includes a safety protection module. When an abnormal situation is detected, the safety protection module can control the coating system and the pumping system to stop running and issue an alarm to avoid potential safety risks.

[0025] Based on the above technical solution, the present invention provides a photolithography coating and developing system, which can produce the following technical effects:

[0026] (1) The coating efficiency of the present invention is high and the production cycle is short;

[0027] (2) The chemical material utilization rate of the present invention is high, and the production cost is reduced;

[0028] (3) The present invention has strong adaptability to different types of photosensitive materials;

[0029] (4) The present invention is easy to maintain and has low operating difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1 It is a schematic diagram of the system structure of the present invention. DETAILED DESCRIPTION

[0032] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In a preferred implementation:

[0035] like Figure 1 As shown:

[0036] This embodiment provides a photolithography coating and developing system, a coating system, a pumping system, and an intelligent adjustment module, wherein:

[0037] The coating system is used to coat the photoresist on the substrate;

[0038] The pumping system is used to provide a stable and continuous supply of photoresist to the coating system, and the pumping system can automatically adjust the pumping parameters according to the photosensitivity characteristics of different photoresists, thereby improving the utilization rate of chemical materials;

[0039] The intelligent adjustment module is used to monitor the operating status of the equipment in real time and adjust parameters, which greatly reduces the operating difficulty and maintenance cost.

[0040] In this embodiment, the coating system includes a nozzle, a nozzle control system, a pipeline system, and a cleaning system;

[0041] The nozzle is responsible for spraying the photoresist onto a silicon wafer or other substrate in a precisely controlled amount and form; the nozzle is a micro-nano structure, which can significantly increase the coating speed while ensuring coating uniformity;

[0042] The nozzle control system is used to accurately control the movement speed, spraying amount and spraying mode of the nozzle;

[0043] The pipeline system is connected to the nozzle and the pumping system;

[0044] The cleaning system is used to clean the residues accumulated in the nozzle and the pipeline system during the spraying process. The cleaning system includes a cleaning liquid storage tank and a cleaning pipeline connected to the nozzle.

[0045] In this embodiment, the pumping system includes a photoresist supply bottle, a buffer tank, a transport pump, and a filter;

[0046] The photoresist supply bottle is used to store the photoresist to be coated;

[0047] The buffer tank is arranged between the photoresist supply bottle and the liquid discharge glue pump, the top of the buffer tank is provided with a liquid inlet and a liquid discharge port, and the bottom is provided with a photoresist outlet; the liquid inlet is connected with the photoresist supply bottle through a liquid inlet pipeline, so that the photoresist flows into the buffer tank; the liquid discharge port is connected with the liquid discharge glue pump through a liquid discharge pipeline, and is used to extract the air in the buffer tank. This design helps to reduce or avoid the possibility of bubbles in the photoresist, thereby reducing wafer defects;

[0048] The transport pump is used to provide power for the pumping system. The transport pump promotes the photoresist to enter the buffer tank by pumping, and extracts the air and the photoresist containing bubbles in the buffer tank to avoid the waste of photoresist and prevent wafer defects caused by bubbles.

[0049] The filter is arranged between the photoresist supply bottle and the coating system to remove impurities and particles in the photoresist and ensure the purity of the photoresist and the coating quality.

[0050] In this embodiment, the intelligent adjustment module includes a sensor group, a data acquisition unit, a signal processing unit, and an adaptive adjustment unit;

[0051] The sensor group includes a plurality of sensors distributed in the coating system and the pumping system, and the sensor group is used to collect parameters including but not limited to the flow rate, pressure and temperature of the photoresist, and transmit the collected information to the data acquisition unit in the form of electrical signals;

[0052] The data acquisition unit is used to receive the electrical signal transmitted by the sensor group, convert it into a digital signal for storage, and transmit the digital signal to the signal processing unit;

[0053] The signal processing unit further processes and analyzes the received digital signal to extract useful information. Specifically, the processing method includes but is not limited to filtering, amplification, conversion and other operations to better understand and utilize the data;

[0054] The adaptive adjustment unit adjusts the coating process and the pumping process in real time according to the information provided by the signal processing unit to ensure that the coating quality meets the requirements.

[0055] In this embodiment, the intelligent adjustment module also includes a user interface; the user interface is used to display the adjustment results of the intelligent adjustment module and the real-time parameters of each system; through the user interface, the operator can easily perform parameter settings, mode selection and other operations, and understand the progress and results of the coating process in real time.

[0056] In this embodiment, the intelligent adjustment module also includes a safety protection module. When an abnormal situation is detected, the safety protection module can control the coating system and the pumping system to stop running and issue an alarm to avoid potential safety risks.

[0057] The working principle of this embodiment is as follows:

[0058] First, place the silicon wafer to be processed on the coating table, and start the coating system to perform the coating operation. During the coating process, the real-time adjustment of the intelligent adjustment module ensures that the photosensitive material can quickly and evenly cover the entire silicon wafer surface. Subsequently, the system automatically switches to the development mode, at which time the optimized chemical pumping control system starts to work, and accurately controls the flow rate and flow rate of the developer according to the preset program to ensure the stability and consistency of the development process. Throughout the process, the intelligent adjustment module continuously monitors the operating status of the equipment and immediately issues an alarm when any abnormality is detected. In this way, the present invention realizes an efficient, low-cost and easy-to-maintain coating and development process.

[0059] The structures, functions and connection forms disclosed in this article can be implemented in other ways. For example, the embodiments described above are only illustrative, and there may be other installation methods, such as multiple components can be combined or integrated into another component; in addition, each functional component in each embodiment of this article can be integrated into one functional component, or each functional component can exist physically separately, or two or more functional components can be integrated into one functional component.

[0060] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.

Claims

1. A photolithography coating and developing system, characterized in that: It includes coating system, pumping system and intelligent adjustment module, among which: The coating system is used to coat the photoresist on the substrate; The pumping system is used to provide a stable and continuous supply of photoresist to the coating system, and the pumping system can automatically adjust the pumping parameters according to the photosensitivity characteristics of different photoresists; The intelligent adjustment module is used to monitor the operating status of the equipment in real time and adjust parameters.

2. A photolithography coating and developing system according to claim 1, characterized in that: The coating system includes a nozzle, a nozzle control system, a pipeline system, and a cleaning system; The nozzle is responsible for spraying the photoresist onto a silicon wafer or other substrate in a precisely controlled amount and form; the nozzle is a micro-nano structure; The nozzle control system is used to accurately control the movement speed, spraying amount and spraying mode of the nozzle; The pipeline system is connected to the nozzle and the pumping system; The cleaning system is used to clean the residues accumulated in the nozzle and the pipeline system during the spraying process. The cleaning system includes a cleaning liquid storage tank and a cleaning pipeline connected to the nozzle.

3. A photolithography coating and developing system according to claim 1, characterized in that: The pumping system includes a photoresist supply bottle, a buffer tank, a transport pump, and a filter; The photoresist supply bottle is used to store the photoresist to be coated; The buffer tank is arranged between the photoresist supply bottle and the liquid discharge glue pump, the top of the buffer tank is provided with a liquid inlet and a liquid discharge port, and the bottom is provided with a photoresist outlet; the liquid inlet is connected with the photoresist supply bottle through a liquid inlet pipeline, so that the photoresist flows into the buffer tank; the liquid discharge port is connected with the liquid discharge glue pump through a liquid discharge pipeline, and is used to extract air in the buffer tank; The transport pump is used to provide power for the pumping system. The transport pump promotes the photoresist to enter the buffer tank by pumping, and extracts the air and the photoresist containing bubbles in the buffer tank. The filter is arranged between the photoresist supply bottle and the coating system to remove impurities and particles in the photoresist.

4. A photolithography coating and developing system according to claim 1, characterized in that: The intelligent adjustment module includes a sensor group, a data acquisition unit, a signal processing unit, and an adaptive adjustment unit; The sensor group includes a plurality of sensors distributed in the coating system and the pumping system, and the sensor group is used to collect parameters including but not limited to the flow rate, pressure and temperature of the photoresist, and transmit the collected information to the data acquisition unit in the form of electrical signals; The data acquisition unit is used to receive the electrical signal transmitted by the sensor group, convert it into a digital signal for storage, and transmit the digital signal to the signal processing unit; The signal processing unit further processes and analyzes the received digital signal to extract useful information. Specifically, the processing method includes but is not limited to filtering, amplification, conversion and other operations to better understand and utilize the data; The adaptive adjustment unit adjusts the coating process and the pumping process in real time according to the information provided by the signal processing unit to ensure that the coating quality meets the requirements.

5. A photolithography coating and developing system according to claim 1 or 4, characterized in that: The intelligent adjustment module also includes a user interface; the user interface is used to display the adjustment results of the intelligent adjustment module and the real-time parameters of each system; through the user interface, the operator can easily perform operations such as parameter setting and mode selection, and understand the progress and results of the coating process in real time.

6. A photolithography coating and developing system according to claim 1 or 4, characterized in that: The intelligent adjustment module also includes a safety protection module. When an abnormal situation is detected, the safety protection module can control the coating system and the pumping system to stop running and issue an alarm to avoid potential safety risks.

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