A heat dissipation device for industrial control computers

By installing a heatsink that directly contacts the CPU on the industrial computer and setting up an external cooling fan, the problems of low heat dissipation efficiency, susceptibility to environmental influences, and inconvenient maintenance of industrial computers are solved, achieving efficient heat dissipation, dust and water resistance, reduced maintenance costs, and improved equipment stability.

CN119414937BActive Publication Date: 2026-03-10ENNOCONN SUZHOU TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

Existing industrial computer cooling technologies suffer from low efficiency, susceptibility to environmental factors, high costs, and inconvenient maintenance. In particular, built-in fans are prone to introducing dust and moisture, affecting equipment stability and lifespan.

Method used

Design a heat dissipation device that installs a heat sink on an industrial computer that is in direct contact with the CPU, and sets an external cooling fan at the other end of the heat sink. Combined with a detachable fixing mechanism, it prevents dust and moisture from entering and is compatible with various sizes of industrial computers.

Benefits of technology

It improves heat dissipation efficiency, protects internal components, extends equipment life, reduces maintenance costs, and enhances equipment stability and applicability.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a heat dissipation device for industrial control computers (ICSCs), aiming to solve the problems of low efficiency, susceptibility to dust and moisture intrusion, high cost, and difficult maintenance of existing heat dissipation technologies. The device includes an ICSC body, a heat conduction mechanism, an active heat dissipation mechanism, and a fixing mechanism. The heat conduction mechanism directly contacts the CPU through a heat sink, a heat transfer plate, and a heat-conducting plate, transferring heat to the outside of the ICSC. The active heat dissipation mechanism includes an external cooling fan, corresponding to the heat sink, with the fan blades driven by a motor to effectively dissipate heat while preventing dust and moisture from entering. The fixing mechanism allows the external cooling fan to be detachable and adaptable to various ICSC sizes. This device improves heat dissipation efficiency by using a heat sink in direct contact with the CPU and an external fan for cooling, preventing dust and moisture from directly entering the ICSC, reducing maintenance costs, and enhancing the reliability and stability of the equipment, thus having broad industrial application prospects.
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Description

TECHNICAL FIELD

[0001] The application relates to a heat dissipation device for an industrial personal computer. BACKGROUND

[0002] In the rapid development of industrial automation and intelligence, the stability and reliability of the industrial personal computer as the core equipment are crucial to the operation of the entire system. Heat dissipation design is one of the key factors to ensure the performance of the industrial personal computer, and is directly related to the operation efficiency and service life of the equipment.

[0003] At present, the heat dissipation technology of the industrial personal computer mainly depends on the following ways: 1. The heat is dissipated naturally through the heat dissipation fins. This method does not require additional energy, but the heat dissipation efficiency is limited by the environmental temperature and air flow; 2. The air flow is forced to flow through the built-in fan to improve the heat dissipation efficiency, but there is a risk of dust and water vapor intrusion, and the noise is large; 3. The working medium in the heat pipe is evaporated and condensed to realize the rapid transfer of heat, but the cost is high and the structure is complex; 4. The gap between the heat generating element and the heat dissipation fin is filled with a heat conducting pad to reduce the thermal resistance, but the performance of the heat conducting pad is affected by temperature and compression performance; 5. The layout and installation position of the heat dissipation element are optimized to improve the heat dissipation efficiency, but it is limited by the internal space and structure design of the industrial personal computer.

[0004] In view of the above problems, the application provides a new heat dissipation device design idea, which aims to install heat dissipation fins directly contacting the CPU on the industrial personal computer, and set external heat dissipation fans at the other end of the heat dissipation fins, so as to improve the heat dissipation efficiency, prevent dust and water vapor from entering the internal of the industrial personal computer, and at the same time maintain the detachability and applicability of the external heat dissipation fans, so as to adapt to industrial personal computers of various specifications. This design idea improves the heat dissipation efficiency, and also considers the convenience of maintenance and cost control, so as to achieve better industrial application effect. SUMMARY

[0005] The purpose of the application is to solve the problems raised in the background art, and the application provides a heat dissipation device for an industrial personal computer.

[0006] In order to achieve the above purpose, the application specifically adopts the following technical scheme:

[0007] A heat dissipation device for an industrial personal computer, comprising an industrial personal computer body, a heat conduction mechanism, an active heat dissipation mechanism and a fixing mechanism, wherein:

[0008] A plurality of insertion slots arranged in an array are formed on one side of the industrial personal computer body;

[0009] The heat conduction mechanism comprises a heat dissipation plate, a plurality of plug-in plates and a plurality of heat conduction plates, the plurality of plug-in plates are movably inserted into the plurality of plug-in slots respectively, the heat dissipation plate is fixed on one end of the same side of the plurality of plug-in plates and is attached to the outer side of the industrial computer body, and the plurality of heat conduction plates are installed on the other end of the plurality of plug-in plates and are attached to the CPU inside the industrial computer body.

[0010] The active heat dissipation mechanism is located outside the industrial computer body and corresponds to the heat dissipation plate.

[0011] The fixing mechanism is used to fix the active heat dissipation mechanism and the industrial computer body.

[0012] Further, the active heat dissipation mechanism comprises an installation frame corresponding to the heat dissipation plate, a heat dissipation fan blade is rotatably installed in the installation frame, a motor with an output end fixed to the rotating shaft of the heat dissipation fan blade is installed on the installation frame, a wire is electrically connected to the motor, and a power supply plug is installed at one end of the wire. The heat dissipation fan blade is driven to rotate by the motor to blow the heat dissipation plate and remove heat.

[0013] Further, dustproof nets are fixedly installed on both open ends of the installation frame by screws, the motor is fixed on one of the dustproof nets away from the heat dissipation plate, and a protective cover is fixed on the dustproof net to cover the outside of the motor.

[0014] Further, the dustproof net has magnetism, and a filter screen is magnetically connected to one of the dustproof nets away from the heat dissipation plate.

[0015] Further, the number of the fixing mechanism is two and they are located on the opposite sides of the installation frame, and the two fixing mechanisms are used to clamp the left and right sides of the industrial computer body. The fixing mechanism is composed of two corresponding fixing members, the four fixing members are distributed in a rectangular shape, the fixing member comprises an installation rod fixed on one side of the installation frame and parallel to the installation frame, a T-shaped sliding groove is formed on the installation rod along the length direction, a fixing rod perpendicular to the installation rod is slidably installed in the T-shaped sliding groove, an adjusting member for adjusting the position of the fixing rod is arranged on the installation rod, two fixed clamping plates are installed on one side of the fixing rod, one of the fixed clamping plates is adjustably installed on the fixing rod, and the two fixed clamping plates are used to clamp the upper and lower sides of the industrial computer body.

[0016] Further, the adjusting member comprises a lead screw rotatably installed on the inner walls of both ends of the T-shaped sliding groove, one end of the lead screw movably penetrates one end of the installation rod away from the installation frame and is fixed with a knob, and the fixing rod is threadedly sleeved on the lead screw.

[0017] Further, the fixing rod movably inserts an adjusting rod on the end away from the mounting rod, one of the fixing clamping plates is fixedly installed on the adjusting rod, a fixing nail is threadedly inserted on the fixing rod, and one end of the fixing nail abuts against the outer side wall of the adjusting rod.

[0018] Further, the two corresponding lead screws are fixedly sleeved with connecting wheels, a connecting belt is sleeved between the two connecting wheels, and a connecting rod is fixedly connected between the two corresponding adjusting rods.

[0019] Further, one side of the heat-conducting plate is provided with a clamping groove, the clamping groove is arranged along the length direction of the heat-conducting plate, and both ends of the clamping groove penetrate through both ends of the heat-conducting plate, and the plug-in plate is movably clamped in the clamping groove.

[0020] Further, the heat-dissipating plate is fixed with a plurality of heat-dissipating wing plates which are uniformly distributed on the side away from the plug-in plate.

[0021] Compared with the prior art, the present application has the following beneficial effects:

[0022] The heat sink directly contacts the CPU, so that heat can be more effectively conducted from the heat source to the heat sink, and then dissipated by the external fan, thereby improving the heat dissipation efficiency.

[0023] The design of the external fan avoids the direct entry of dust and water vapor into the industrial computer, protects the internal components, and prolongs the service life of the equipment. Since dust and water vapor are not easy to enter the industrial computer, the maintenance work caused by dust accumulation is reduced, and the maintenance cost is reduced.

[0024] The present application improves the reliability and stability of the equipment by improving the heat dissipation efficiency and preventing dust and water vapor from entering, and reduces equipment failures caused by overheating.

[0025] The detachable and modular design of the present application makes the heat dissipation device suitable for different specifications of industrial computers, increases its application range and flexibility, and the design of the external heat dissipation fan and the fixing mechanism makes the heat dissipation device easy to install and maintain, thereby improving the maintainability of the industrial computer. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic view of the three-dimensional structure of the present application;

[0027] Figure 2 is a schematic view of the three-dimensional structure of the present application; Figure 1

[0028] Figure 3 is a schematic view of the three-dimensional structure of the present application; Figure 1 ​​

[0029] Figure 4 Enlarged view of structure A in the present application Figure 3 Enlarged view of structure A in the present application

[0030] Figure 5 Enlarged view of structure B in the present application Figure 3 Enlarged view of structure B in the present application

[0031] Figure 6 Schematic diagram of the perspective structure of part of the present application Figure 1 Schematic diagram of the perspective structure of part of the present application

[0032] Figure 7 Schematic diagram of the perspective structure of the industrial computer body and the heat conduction mechanism in the present application

[0033] Figure 8 Schematic diagram of the perspective structure of the active heat dissipation mechanism and the fixing mechanism in the present application

[0034] Figure 9 Exploded view of the active heat dissipation mechanism in the present application

[0035] Figure 10 Schematic diagram of the perspective structure of the fixing mechanism in the present application

[0036] In the figure: 1, industrial computer body; 11, slot; 2, heat conduction mechanism; 21, heat dissipation plate; 211, heat dissipation wing plate; 22, plug-in board; 23, heat conduction plate; 231, clamping groove; 3, active heat dissipation mechanism; 31, mounting frame; 311, screw; 312, dustproof net; 313, protective cover; 314, filter screen; 32, heat dissipation fan blade; 33, motor; 34, wire; 35, power supply plug; 4, fixing mechanism; 41, mounting rod; 42, T-shaped sliding groove; 43, fixing rod; 431, adjusting rod; 432, fixing nail; 433, linkage rod; 44, adjusting piece; 441, screw rod; 442, knob; 443, linkage wheel; 444, linkage belt; 45, fixing clamping plate. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0038] The embodiment provides a heat dissipation device applied to an industrial computer, and mainly aims to solve the problems of low natural heat dissipation efficiency, easy introduction of dust and water vapor by a fan, high cost of a heat pipe and a heat conduction pad, and limited heat dissipation layout optimization space of existing heat dissipation technologies, and the problem of heat dissipation effect reduction of the industrial computer with a built-in fan due to dust accumulation on a filter screen in long-term operation, and the problem of influence on equipment performance and service life. Figures 1-10 The embodiment will be described in detail as follows: Embodiment

[0039] The embodiment discloses a heat dissipation device applied to an industrial computer, and aims to solve the problems of low efficiency, environmental influence, high cost and inconvenient maintenance in traditional heat dissipation technologies.

[0040] A plurality of insertion slots 11 in an array distribution are formed on one side of the industrial computer body 1, and provide a structural basis for installation of the heat conduction mechanism 2.

[0041] The heat conduction mechanism 2 comprises a heat dissipation plate 21, a plurality of insertion plates 22 and a plurality of heat conduction plates 23, the plurality of insertion plates 22 are respectively movably inserted into the plurality of insertion slots 11, so that the heat conduction mechanism 2 can be tightly combined with the industrial computer body 1, the heat dissipation plate 21 is fixed on one end of the same side of the plurality of insertion plates 22 and is attached to the outside of the industrial computer body 1, forming an effective heat conduction path, and the plurality of heat conduction plates 23 are respectively installed on the other end of the plurality of insertion plates 22 and are attached to the CPUs inside the industrial computer body 1, so as to realize rapid heat conduction.

[0042] The active heat dissipation mechanism 3 is located outside the industrial computer body 1 and corresponds to the heat dissipation plate 21, and the heat dissipation efficiency is improved.

[0043] The fixing mechanism 4 is used for fixing the active heat dissipation mechanism 3 and the industrial computer body 1, ensuring the stability of the active heat dissipation mechanism 3 and the heat dissipation effect.

[0044] The beneficial effects of the heat dissipation device mainly lie in the following aspects: first, the rapid conduction of heat is realized through the heat conduction plate 23 in direct contact with the CPU, improving the heat dissipation efficiency; second, the external active heat dissipation mechanism 3 effectively prevents dust and water vapor from entering the industrial computer, protecting the internal components and prolonging the service life of the equipment; third, the design of the fixing mechanism 4 makes the heat dissipation device detachable, facilitating installation and maintenance and reducing maintenance costs; finally, the heat dissipation device is suitable for various specifications of industrial computers and has wide applicability. In summary, the heat dissipation device provided in this embodiment not only improves the heat dissipation performance of the industrial computer but also enhances the stability and reliability of the equipment, having significant industrial application value.

[0045] Please refer to Figure 2 , Figure 3 , Figure 6 and Figure 9 , specifically, the active heat dissipation mechanism 3 includes a mounting frame 31 corresponding to the heat dissipation plate 21, and the heat dissipation fan 32 is rotatably mounted inside the mounting frame 31 and can rotate around its rotating shaft to generate airflow. The mounting frame 31 is provided with a motor 33 having an output end fixed to the rotating shaft of the heat dissipation fan 32, ensuring that the rotating power of the motor 33 can be effectively transmitted to the heat dissipation fan 32. The motor 33 is electrically connected with a wire 34, and one end of the wire 34 is provided with a power supply plug 35, so that the motor 33 can obtain electric energy from an external power source. The heat dissipation fan 32 is driven to rotate by the motor 33 to blow air on the heat dissipation plate 21 to carry away heat. When the motor 33 is connected to the power supply and started, it drives the heat dissipation fan 32 to rotate and generate airflow to align with the heat dissipation plate 21, rapidly carrying away the heat accumulated on the heat dissipation plate 21 by blowing.

[0046] This design not only improves the heat dissipation efficiency, but also effectively avoids the direct entry of dust and water vapor into the industrial computer, reduces the risk of damage to internal components, and reduces maintenance costs, as the motor 33 and the heat dissipation fan 32 are designed outside the industrial computer body 1. At the same time, since the rotation of the heat dissipation fan 32 is directly driven by the motor 33, this design also improves the response speed and control accuracy of the heat dissipation device, making the heat dissipation process more stable and reliable.

[0047] In this embodiment, a dust screen 312 is fixedly installed on both open ends of the mounting frame 31 by screws 311, and the motor 33 is fixed on one of the dust screens 312 away from the heat dissipation plate 21. The dust screen 312 is fixed with a protective cover 313 covering the outside of the motor 33, which effectively prevents dust from entering and protects the motor 33 and the heat dissipation fan 32, thereby prolonging the service life of the heat dissipation device.

[0048] Through this design, the active heat dissipation mechanism 3 not only improves the heat dissipation efficiency, but also effectively prevents the invasion of dust and water vapor through the setting of the dust screen 312 and the protective cover 313, protecting the core components of the heat dissipation device. This design improves the stability and reliability of the industrial computer, reduces maintenance costs, and due to its modularity and detachability, the heat dissipation device can adapt to various specifications of industrial computers, with wide applicability.

[0049] In this embodiment, the design and operation mode of the fixing mechanism 4 show its innovation in ensuring the stability of the heat dissipation device. Specifically, please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 and Figure 10 , the number of fixing mechanisms 4 is two and they are located on the opposite sides of the mounting frame 31. This layout allows the fixing mechanism 4 to effectively clamp the left and right sides of the industrial computer body 1, ensuring stable installation of the heat dissipation device on the industrial computer.

[0050] The fixing mechanism 4 is composed of two corresponding fixing pieces, which are distributed in a rectangular shape, ensuring uniform contact between the fixing mechanism 4 and the industrial computer body 1, avoiding stress concentration caused by uneven contact. The fixing piece includes a mounting rod 41 fixed on one side of the mounting frame 31 and parallel to the mounting frame 31. A T-shaped sliding groove 42 is formed on the mounting rod 41 along the length direction. A fixing rod 43 perpendicular to the mounting rod 41 is slidably installed inside the T-shaped sliding groove 42. An adjusting piece 44 is provided on the mounting rod 41 to adjust the position of the fixing rod 43, providing a flexible adjustment mechanism. Two fixed clamping plates 45 are installed on one side of the fixing rod 43, one of which is adjustably installed on the fixing rod 43. The two fixed clamping plates 45 are used together to clamp the upper and lower sides of the industrial computer body 1, ensuring the close fit between the active heat dissipation mechanism 3 and the industrial computer body 1.

[0051] Through this design, the fixing mechanism 4 not only provides stable fixation, but also through the design of the adjusting piece 44 and the T-shaped sliding groove 42, the fixing mechanism 4 can adapt to different sizes of industrial computer body 1, with good compatibility and flexibility. This fixing method reduces the risk of physical damage to the industrial computer body 1, and also simplifies the installation and disassembly process of the heat dissipation device, reducing maintenance difficulty and cost.

[0052] Further, the adjusting member 44 comprises a screw rod 441 rotatably installed on the inner wall of both ends of the T-shaped sliding groove 42, one end of the screw rod 441 movably penetrates through the fixing rod 41 away from the one end of the fixing frame 31 and is fixed with a knob 442, and the fixing rod 43 is threadedly sleeved on the screw rod 441, such a layout enables the operator to rotate the screw rod 441 through the knob 442, thereby realizing the accurate adjustment of the position of the fixing rod 43;

[0053] The fixing rod 43 is threadedly sleeved on the screw rod 441, such a threaded connection not only provides stable structural support, but also allows the fixing rod 43 to be finely adjusted in the axial direction of the screw rod 441, by rotating the knob 442, the screw rod 441 rotates accordingly, driving the fixing rod 43 to move in the axial direction of the thread, so that the clamping position of the fixing clamp plate 45 on the industrial computer body 1 can be finely adjusted, ensuring the close fit between the heat dissipation device and industrial computer bodies 1 of different sizes;

[0054] Such a design not only improves the adjustment accuracy and flexibility of the fixing mechanism 4, but also makes the adjustment process simple and fast through the operation of the knob 442, without the need for additional tools, greatly simplifying the installation and adjustment process. In addition, the threaded connection design also increases the stability and reliability of the fixing mechanism 4, ensuring stable installation of the heat dissipation device in various environments.

[0055] Furthermore, the fixing rod 43 movably inserts an adjusting rod 431 at the end away from the fixing rod 41, and one of the fixing clamp plates 45 is fixedly installed on the adjusting rod 431, which enables one of the fixing clamp plates 45 to adjust its position with the movement of the adjusting rod 431, thereby realizing clamping on both sides of the industrial computer body 1. The fixing rod 43 is threadedly inserted with a fixing nail 432, one end of the fixing nail 432 abuts against the outer side wall of the adjusting rod 431. Such a threaded connection can fix the adjusting rod 431 with the fixing rod 43, thereby ensuring effective clamping of the industrial computer body 1 and enabling clamping and fixing of industrial computer bodies 1 of different sizes;

[0056] Such a design of the fixing mechanism 4 has multiple benefits. First, through the cooperation of the screw rod 441 and the knob 442 in the adjusting member 44, the operator can easily adjust the position of the fixing rod 43, realizing quick installation and disassembly. Second, the adjustability of the fixing mechanism 4 enables the heat dissipation device to adapt to industrial computers of different specifications, improving its versatility and applicability. In addition, the clamping action of the fixing clamp plate 45 ensures the stability of the heat dissipation device on the industrial computer, reducing the risk of displacement due to vibration or impact. Embodiment

[0057] Embodiment two is a further optimization of embodiment one to enhance its dustproofness and maintenance convenience. Specifically, please refer to Figure 9, the dustproof net 312 is magnetic, and one of the dustproof nets 312 away from the heat dissipation plate 21 is magnetically connected with the filter screen 314, which improves the fixing of the filter screen 314 on the dustproof net 312 through magnetic adsorption, simplifies the installation and removal process, and enhances the dustproof effect. Through the setting of the filter screen 314, dust can be more effectively intercepted and collected to prevent dust from entering the motor 33 and the heat dissipation fan blade 32, thereby protecting the motor 33 and the heat dissipation fan blade 32 from erosion by dust and prolonging their service life. The magnetic connection of the filter screen 314 also facilitates replacement and cleaning, making maintenance more convenient and efficient.

[0058] Through this optimized design, embodiment two not only improves the dustproof performance of the heat dissipation device, but also simplifies the maintenance process, reduces maintenance costs, and improves the reliability and stability of the heat dissipation device. This design ensures the heat dissipation efficiency while considering the convenience of actual operation, making the heat dissipation device more suitable for maintenance needs in industrial environments and embodying its practical value and innovation in industrial applications. Embodiment

[0059] Embodiment three is a further optimization of embodiment one to enhance the convenience of adjustment and the synchronization of the fixing mechanism 4. Specifically, please refer to Figure 10 , the corresponding two lead screws 441 are fixedly sleeved with connecting wheels 443, and the connecting belt 444 is sleeved between the two connecting wheels 443. The function is to transmit power between the connecting wheels 443 of the two lead screws 441 to ensure that the position adjustment of the fixing rod 43 is more coordinated and consistent. Turning one of the knobs 442 can achieve simultaneous rotation of the two lead screws 441.

[0060] In addition, the corresponding two adjusting rods 431 are fixedly connected with a connecting rod 433. The function of this connecting rod 433 is to further strengthen the mechanical connection between the two adjusting rods 431 to ensure that the two lower fixing clamps 45 can move synchronously during adjustment, thereby uniformly clamping the industrial computer body 1.

[0061] Through this optimized design, not only the adjustment accuracy and operation convenience of the heat dissipation device are improved, but also the synchronous adjustment of the fixing mechanism 4 is achieved through the introduction of the connecting wheels 443, the connecting belt 444, and the connecting rod 433, avoiding uneven clamping force or device damage caused by inconsistent adjustment. This design also simplifies the adjustment process and reduces the complexity of operation, making the heat dissipation device more suitable for different specifications of industrial computers and improving its versatility and practicality. Embodiment

[0062] Embodiment four is a further optimization of embodiment one. Specifically, please refer to Figure 3 and Figure 6, one side of the heat-conducting plate 23 is configured with a clamping groove 231, the clamping groove 231 is arranged along the length direction of the heat-conducting plate 23, and both ends of the clamping groove 231 penetrate through both ends of the heat-conducting plate 23 respectively, and the plug-in plate 22 is movably clamped in the inside of the clamping groove 231, this structure not only enhances the connection stability between the heat-conducting plate 23 and the plug-in plate 22, but also facilitates the installation and adjustment of the plug-in plate 22, and improves the installation efficiency of the heat dissipation device;

[0063] By setting the clamping groove 231 on the heat-conducting plate 23, we realize the quick installation and fixation of the plug-in plate 22, such design simplifies the assembly process of the heat dissipation device, reduces the installation difficulty, and also ensures the stability of the heat dissipation device during the operation of the industrial computer, in addition, the design of the clamping groove 231 also allows the fine adjustment of the position of the plug-in plate 22 to adapt to industrial computers of different sizes, improving the applicability and flexibility of the heat dissipation device. Embodiment

[0064] Embodiment five is a further optimization of embodiment one, please refer to Figure 7 , the heat dissipation plate 21 is fixed with a plurality of evenly distributed heat dissipation wing plates 211 on the side away from the plug-in plate 22, the design of these heat dissipation wing plates 211 aims to increase the surface area of the heat dissipation plate 21, thereby improving the heat dissipation efficiency;

[0065] The heat dissipation wing plates 211 are evenly distributed on one side of the heat dissipation plate 21, such layout helps the uniformity of air flow, so that heat can be more effectively transferred from the heat dissipation plate 21 to the surrounding air, the heat dissipation wing plates 211 can be designed in different shapes and sizes to optimize the heat dissipation effect, and their number and distribution can also be adjusted according to actual heat dissipation requirements and space limitations;

[0066] Through this optimization design, the heat dissipation capacity of the heat dissipation device has been significantly improved, the addition of the heat dissipation wing plates 211 not only improves the heat dissipation efficiency, but also enhances the aesthetics of the heat dissipation device, in addition, the design of the heat dissipation wing plates 211 also helps to reduce the performance degradation of the equipment due to local overheating, thereby improving the stability and reliability of the industrial computer body 1.

[0067] When the device is installed in detail:

[0068] First, ensure that the industrial computer body 1 is in a state of power failure, and prepare all components of the heat dissipation device, including the heat conduction mechanism 2, the active heat dissipation mechanism 3 and the fixing mechanism 4, then, the plugboard 22 of the heat conduction mechanism 2 is easily slid into the slot 11 on the side of the industrial computer body 1, and it is ensured that they are stably combined, the heat dissipation plate 21 is fixed at one end of the plugboard 22, and tightly adheres to the outside of the industrial computer, while the heat conduction plate 23 is installed at the other end, and is clamped at the other end of the plugboard 22 through the clamping groove 231, the heat conduction plate 23 is in the correct position by sliding the heat conduction plate 23, and uniformly covers the CPU, so as to quickly conduct heat;

[0069] Subsequently, the active heat dissipation mechanism 3 is placed outside the industrial computer body 1, corresponding to the heat dissipation plate 21, and the wire 34 of the motor 33 is connected to the power supply plug 35, so as to obtain electric energy from the external power supply, the motor 33 drives the heat dissipation fan blade 32 to rotate, generates airflow, and quickly carries away the heat on the heat dissipation plate 21, in order to enhance the dustproof effect, the dustproof net 312 is fixed at both ends of the installation frame 31, and the filter screen 314 is magnetically connected on one of the dustproof nets 312, so that the installation and disassembly are facilitated, and the dustproof performance is improved, the protective cover 313 is fixed on the dustproof net 312, and the motor 33 and the heat dissipation fan blade 32 are protected from dust erosion;

[0070] The installation of the fixing mechanism 4 ensures the close cooperation of the heat dissipation device with the industrial computer body 1, the position of the fixing rod 43 is finely adjusted through the knob 442, so as to adapt to industrial computer bodies 1 of different sizes, and the fixing clamping plate 45 is used for clamping the upper and lower sides of the industrial computer body 1, so as to ensure that the heat dissipation device is stably installed.

[0071] It should be particularly pointed out that the specific model specifications of the industrial computer body 1 and the motor 33 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the art, so it will not be described in detail, and the principles of these components are clear to those skilled in the art, and will not be described in detail here.

[0072] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A heat dissipation device applied to an industrial computer, comprising an industrial computer body (1), a heat conduction mechanism (2), an active heat dissipation mechanism (3) and a fixing mechanism (4), characterized in that, Wherein: One side of the industrial computer body (1) is penetrated by a plurality of arrayed slots (11); The heat conduction mechanism (2) includes a heat dissipation plate (21), a plurality of plug-in plates (22) and a plurality of heat conduction plates (23), the plurality of plug-in plates (22) are respectively movably inserted in the plurality of slots (11), the heat dissipation plate (21) is fixed on one end of the same side of the plurality of plug-in plates (22) and is attached to the outside of the industrial computer body (1), and the plurality of heat conduction plates (23) are respectively installed on the other end of the plurality of plug-in plates (22) and are attached to the CPU inside the industrial computer body (1); The active heat dissipation mechanism (3) is located outside the industrial computer body (1) and corresponds to the heat dissipation plate (21); The fixing mechanism (4) is used for fixing the active heat dissipation mechanism (3) and the industrial computer body (1); The active heat dissipation mechanism (3) includes a mounting frame (31) corresponding to the heat dissipation plate (21), a heat dissipation fan blade (32) is rotatably installed in the mounting frame (31), a motor (33) with a fixed rotating shaft is installed on the mounting frame (31), an electric wire (34) is electrically connected to the motor (33), and a power supply plug (35) is installed at one end of the electric wire (34); the heat dissipation fan blade (32) is driven to rotate by the motor (33) to blow the heat dissipation plate (21) to remove heat; The mounting frame (31) is fixedly installed with a dust screen (312) on both open ends through a screw (311), the motor (33) is fixed on the dust screen (312) away from the heat dissipation plate (21), and a protective cover (313) is fixed on the dust screen (312) to cover the outside of the motor (33); The fixing mechanism (4) is two in number and is located on the opposite sides of the mounting frame (31), and the two fixing mechanisms (4) are used for clamping the left and right sides of the industrial computer body (1); the fixing mechanism (4) is composed of two corresponding fixing members, the four fixing members are arranged in a rectangular shape, the fixing member includes a mounting rod (41) fixed on one side of the mounting frame (31) and parallel to the mounting frame (31), a T-shaped sliding groove (42) is formed on the mounting rod (41) along the length direction, a fixing rod (43) perpendicular to the mounting rod (41) is slidably installed in the T-shaped sliding groove (42), an adjusting member (44) for adjusting the position of the fixing rod (43) is arranged on the mounting rod (41), two fixed clamping plates (45) are installed on one side of the fixing rod (43), one of the fixed clamping plates (45) is adjustably installed on the fixing rod (43), and the two fixed clamping plates (45) are used for clamping the upper and lower sides of the industrial computer body (1). The adjusting piece (44) comprises a screw rod (441) rotatably installed on the inner wall of both ends of the T-shaped sliding groove (42), one end of the screw rod (441) movably penetrates through one end of the mounting rod (41) away from the mounting frame (31) and is fixed with a knob (442), and the fixing rod (43) is threadedly sleeved on the screw rod (441); One end of the fixing rod (43) away from the mounting rod (41) movably inserts an adjusting rod (431), one of the fixing clamping plates (45) is fixedly installed on the adjusting rod (431), the fixing rod (43) is threadedly inserted with a fixing nail (432), and one end of the fixing nail (432) abuts against the outer side wall of the adjusting rod (431); One side of the heat conduction plate (23) is provided with a clamping groove (231), the clamping groove (231) is arranged along the length direction of the heat conduction plate (23), and both ends of the clamping groove (231) penetrate through both ends of the heat conduction plate (23), and the plug-in plate (22) is movably clamped in the clamping groove (231).

2. The heat dissipation device applied to the industrial computer according to claim 1, characterized in that: The dustproof net (312) has magnetism, and one of the dustproof nets (312) away from the heat dissipation plate (21) is magnetically connected with a filter screen (314).

3. The heat dissipation device for industrial computer according to claim 1, wherein: Corresponding two screw rods (441) are fixedly sleeved with a linkage wheel (443), two linkage wheels (443) are sleeved with a linkage belt (444), and corresponding two adjusting rods (431) are fixedly connected with a linkage rod (433).

4. The heat dissipation device for industrial computer according to claim 1, wherein: The heat dissipation plate (21) is fixed with a plurality of uniformly distributed heat dissipation wing plates (211) on the side away from the plug-in plate (22).

Citation Information

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