Wafer rotating platform, wafer working platform and working method thereof

Abstract

The invention discloses a wafer rotating platform, a wafer working platform and a working method thereof, the wafer rotating platform comprises a wafer bearing table, a wafer supporting assembly, a wafer jacking mechanism and a wafer rotating mechanism, and the wafer bearing table is used for bearing a wafer; the wafer supporting assembly moves in the vertical direction and can protrude out of the wafer bearing table to be used for supporting a wafer. The wafer jacking mechanism is connected with the wafer supporting assembly and drives the wafer supporting assembly to move in the vertical direction. When the wafer supporting assembly protrudes out of the wafer bearing table, the wafer rotating mechanism drives the wafer supporting assembly to rotate around the vertical direction and synchronously drives the wafer to rotate. The wafer can be supported through the wafer supporting assembly, and the wafer can be driven to rotate synchronously after being supported by matching with the wafer rotating mechanism, so that after the wafers are taken out, the orientations of the wafers placed on the subsequent stations are consistent, and normal and orderly proceeding of the subsequent process operation of the wafers is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and in particular to a wafer rotating platform. In addition, the present invention also relates to a wafer operating platform and an operating method thereof. Background Art

[0002] At present, the wafer manufacturing process mainly includes preheating and glue dispensing operations. When the wafer is loaded onto the preheating station, the orientation of the wafer in the material box may be inconsistent. Therefore, after the wafer is loaded onto the preheating station, the orientation of the wafer on the preheating station will be deflected. When the wafer is taken out of the preheating station and then placed in the glue dispensing station, the orientation of the wafer will be deflected again. In addition, since there are multiple preheating stations, glue dispensing stations, etc. and they are located in different positions, this leads to inconsistent directions of the wafer at different stations, affecting the normal operation of the wafer.

[0003] In view of this, it is necessary to design a wafer rotating platform to solve the above problems. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention provides a wafer rotating platform, which can realize the lifting and rotation alignment of the wafer.

[0006] According to a first aspect of the present invention, a wafer rotation platform is provided, comprising:

[0007] A wafer carrying platform, wherein the wafer carrying platform is used to carry a wafer;

[0008] A wafer support assembly, which moves in a vertical direction and can protrude from the wafer carrying platform to support the wafer;

[0009] A wafer lifting mechanism, the wafer lifting mechanism is connected to the wafer supporting assembly and drives the wafer supporting assembly to move in a vertical direction;

[0010] A wafer rotating mechanism drives the wafer supporting assembly to rotate around a vertical direction and simultaneously drives the wafer to rotate when the wafer supporting assembly protrudes from the wafer carrying platform.

[0011] The beneficial effects of the present invention are as follows: the wafer support assembly can be used to support the wafer, and in conjunction with the wafer rotation mechanism, the wafer can be driven to rotate synchronously after being supported, so that after the wafer is taken out, the orientation of the wafers placed on each subsequent workstation is consistent, thereby ensuring that subsequent wafer processing operations are carried out normally and orderly.

[0012] Preferably, the wafer lifting mechanism comprises:

[0013] A first screw transmission assembly, wherein the first screw transmission assembly drives the wafer support assembly to move up and down in a vertical direction;

[0014] A first drive motor is connected to the first screw drive assembly through a drive belt to drive the first screw drive assembly to move.

[0015] Further preferably, the wafer support assembly comprises:

[0016] A chassis, wherein the wafer lifting mechanism is adapted to drive the chassis to move in a vertical direction;

[0017] A fixed outer ring, the fixed outer ring being fixed to the chassis via a plurality of support columns;

[0018] A movable top ring is connected to the fixed outer ring via a bearing, and the movable top ring can protrude from the wafer supporting platform.

[0019] Preferably, the movable top ring comprises:

[0020] The movable top ring comprises:

[0021] A top support member, the top support member being adapted to protrude from the wafer carrying platform and contact the wafer;

[0022] A bottom mounting member connected to the fixed outer ring via a bearing;

[0023] A middle connecting member is used to connect the bottom mounting member and the top supporting member at the same time.

[0024] Further preferably, a vacuum adsorption chamber is provided between the top support member and the fixed outer ring, and the vacuum adsorption chamber is provided with a first vacuum joint connected to an external vacuum device.

[0025] The contact end of the top support member is provided with a plurality of vacuum suction cups for adsorbing the wafer, and the plurality of vacuum suction cups are connected with the vacuum adsorption chamber.

[0026] Preferably, the wafer rotation mechanism comprises:

[0027] A pulley turntable, wherein the pulley turntable is fixedly sleeved on the bottom mounting member;

[0028] A driving assembly is installed on the chassis, and the driving assembly is connected to the pulley turntable through a transmission belt, so as to drive the pulley turntable to rotate, and drive the movable top ring to rotate synchronously through the pulley turntable.

[0029] Further preferably, the driving assembly comprises:

[0030] a second driving motor, wherein a first gear is mounted on an output end of the second driving motor;

[0031] A speed reduction mechanism, wherein the input end of the speed reduction mechanism is connected to the first gear belt transmission, and the output end of the speed reduction mechanism is linked to the pulley turntable and drives the pulley turntable to rotate.

[0032] Preferably, the deceleration mechanism includes a transmission shaft, and a second gear and a third gear installed at both ends of the transmission shaft, the second gear is connected to the first gear through a transmission belt, the third gear is linked to the pulley turntable through a transmission belt, and the diameter of the second gear is greater than the diameter of the first gear.

[0033] A second aspect of the present invention provides a wafer operation platform, comprising:

[0034] The wafer rotation platform described in the first aspect of the present invention;

[0035] A heating module, wherein the heating module is arranged on the wafer carrying platform, and the wafer rotating platform separates the heating module into an inner ring heating plate and an outer ring heating plate, and the inner ring heating plate and the outer ring heating plate are suitable for heating the wafer at the same time;

[0036] The wafer lifting mechanism is suitable for moving in a vertical direction, and the wafer lifting mechanism is suitable for protruding from the heating module and supporting the wafer.

[0037] Preferably, the inner ring heating plate and the outer ring heating plate are fixedly installed on the same horizontal plane via a plurality of support rods.

[0038] Further preferably, the external heating plate is provided with a plurality of vacuum adsorption areas, each group of the vacuum adsorption areas includes a plurality of vacuum flow channels arranged in an alternating manner, the plate surface of the external heating plate is provided with a plurality of vacuum adsorption holes, each of the vacuum adsorption holes is connected to the plurality of vacuum flow channels, and the vacuum flow channels are suitable for connecting to a second vacuum joint so that the air in the vacuum flow channels can be sucked through the second vacuum joint, and each of the vacuum adsorption holes can negatively pressure adsorb the wafer.

[0039] Preferably, the wafer lifting mechanism comprises:

[0040] A wafer carrier, wherein the wafer carrier is suitable for moving in a vertical direction, and the wafer carrier is respectively arranged at the peripheral edge and the center of the wafer, so as to simultaneously support the peripheral edge and the center of the wafer after extending upward from the heating module.

[0041] Further preferably, the wafer lifting mechanism further includes:

[0042] A second screw drive assembly, the second screw drive assembly is arranged on the peripheral side of the wafer and connected to each of the wafer carriers via a bottom plate, and each of the second screw drive assemblies is connected via a transmission belt to enable synchronous movement;

[0043] A third driving motor is connected to the adjacent second screw drive assemblies via a transmission belt to drive each of the second screw drive assemblies to move synchronously in a vertical direction.

[0044] Preferably, each of the second screw transmission assemblies comprises:

[0045] Transmission gears, each of the transmission gears is connected via a transmission belt, and at least one of the transmission gears is connected to an output end of the third drive motor, so that each of the transmission gears can be driven to rotate synchronously via the third drive motor;

[0046] A screw transmission component, the screw transmission component includes a screw and a screw nut, the screw and the screw nut are threadedly connected, and the screw is suitable for being driven to rotate via the transmission gear, and the screw nut moves linearly along the path defined by the screw.

[0047] The third aspect of the present invention provides a wafer operation method, which is applied to the wafer operation platform described in the second aspect of the present invention. The wafer operation method comprises the following steps:

[0048] Transport wafers to the receiving position;

[0049] The wafer lifting mechanism rises to receive the wafer;

[0050] The wafer lifting mechanism descends, so that the wafer gradually approaches the heating module until the wafer temperature reaches a first set temperature;

[0051] The wafer lifting mechanism continues to descend until the wafer reaching the first set temperature is placed on the heating module and is continuously heated to bring the wafer temperature to the second set temperature;

[0052] processing the wafer that has reached the second set temperature;

[0053] The wafer rotating platform lifts up the processed wafer and rotates it to a specified angle;

[0054] Take out and transport the processed wafer at the specified angle to the next station.

[0055] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0056] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0058] Figure 1 It is the overall assembly diagram of the wafer rotating platform of the present invention;

[0059] Figure 2 A three-dimensional diagram of a wafer rotating platform of the present invention;

[0060] Figure 3 It is a structural diagram of the wafer lifting mechanism and its transmission connection of the wafer rotating platform of the present invention;

[0061] Figure 4 A cross-sectional view of a wafer support assembly of a wafer rotating platform of the present invention;

[0062] Figure 5 It is a structural diagram of a wafer rotating mechanism of a wafer rotating platform of the present invention;

[0063] Figure 6 It is an assembly structure diagram of a wafer lifting mechanism and a wafer supporting assembly of a wafer rotating platform of the present invention;

[0064] Figure 7 It is a structural diagram of the wafer working platform of the present invention;

[0065] Figure 8 It is a structural diagram of the wafer heating mechanism of the present invention;

[0066] Fig. 9 is a cross-sectional view of the wafer heating mechanism of the present invention;

[0067] Fig.10 It is a state diagram of the wafer lifting mechanism of the wafer working platform of the present invention when it is raised;

[0068] Fig.11 It is a structural diagram of the second screw transmission assembly of the wafer working platform of the present invention;

[0069] Fig.12 It is a schematic diagram of the wafer working platform after being assembled.

[0070] Description of reference numerals:

[0071] 1. Wafer carrier;

[0072] 2. Wafer support assembly; 21. Chassis; 211. Mounting part; 212. Guide column; 22. Fixed outer ring; 23. Active top ring; 231. Top support member; 2311. Vacuum suction cup; 2322. Air flow channel; 232. Bottom mounting member; 233. Middle connecting member; 24. Vacuum adsorption chamber; 25. Sealing ring; 26. Bearing; 27. Support column; 28. First vacuum joint;

[0073] 3. Wafer lifting mechanism; 31. First screw transmission assembly; 32. First drive motor;

[0074] 4. Wafer rotating mechanism; 41. Turntable with pulley; 42. Driving assembly; 421. Second driving motor; 422. First gear; 423. Second gear; 424. Third gear;

[0075] 5. Heating module; 51. Inner ring heating plate; 52. Outer ring heating plate; 521. Vacuum adsorption area; 522. Vacuum flow channel; 523. Second vacuum joint;

[0076] 6. Wafer lifting mechanism; 61. Wafer carrier; 62. Second screw transmission assembly; 621. Transmission gear; 622. Screw transmission member; 6221. Screw; 6222. Screw nut; 6223. Mounting block; 63. Third drive motor; 64. Bottom plate;

[0077] 7. Idler wheel;

[0078] 8. Transmission belt. DETAILED DESCRIPTION

[0079] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention. In the description of the present invention, it should be understood that, unless otherwise specified, the meaning of "multiple" is two or more.

[0080] First of all, it should be noted that the wafer type carried by the wafer rotation platform and wafer operation platform disclosed in this application is preferably a large-size square wafer, which is mainly aimed at the problems existing in the process of large-size square wafers. However, it should be understood that the solution disclosed in this application is also applicable to the current mainstream wafer shape (small-size round wafer) and its commonly used specifications, but due to the differences in wafer shape and specifications, some functions involved in the solution of this application are not necessary for the current mainstream wafer process.

[0081] Here, the following is a detailed description of the structure involved in the manufacturing process of large-size square wafers in this application. As for the current mainstream wafer types, those skilled in the art can operate according to experience, so the wafer manufacturing process of this type will not be described below.

[0082] See also Figure 1 , Figure 2 and Figure 4 A wafer rotation platform according to a specific embodiment of the present invention includes a wafer carrier 1, a wafer support assembly 2, a wafer lifting mechanism 3 and a wafer rotation mechanism 4. The wafer carrier 1 is used to carry a wafer, and the wafer support assembly 2 can move in a vertical direction and support the wafer when it protrudes from the wafer carrier 1. The wafer lifting mechanism 3 is connected to the wafer support assembly 2, and the wafer lifting mechanism 3 can drive the wafer support assembly 2 to move in a vertical direction to achieve support for the wafer. When the wafer support assembly 2 protrudes from the wafer carrier 1, the wafer rotation mechanism 4 can drive the wafer support assembly 2 to rotate around the vertical direction and simultaneously drive the wafer to rotate, thereby achieving rotational positioning of the wafer.

[0083] Specifically, the wafer lifting mechanism 3 includes a first screw transmission assembly 31 and a first drive motor 32. The first screw transmission assembly 31 can drive the wafer support assembly 2 to move up and down in the vertical direction. The first drive motor 32 is connected to the first screw transmission assembly 31 through a transmission belt 8 to drive the first screw transmission assembly 31 to move.

[0084] In this embodiment, since the wafers carried are mainly large-sized square wafers, in order to provide stable support for the large-sized square wafers, the contact surface between the wafer carrier 1 and the wafer needs to be set to a square shape to adapt to the specifications and shape of the large-sized square wafers, thereby ensuring stable support for the large-sized square wafers.

[0085] See also Figure 1 and Figure 3 When the wafer support assembly 2 contacts the wafer, since the contact surface of the two is mainly located in the middle area of ​​the wafer, in order to provide as stable support as possible for the wafer, the contact surface between the wafer support assembly 2 and the wafer is set to be annular to achieve stable support for the wafer. The wafer support assembly 2 includes a chassis 21, a fixed outer ring 22 and a movable top ring 23, wherein the fixed outer ring 22 is connected to the chassis 21 through a plurality of support columns 27, that is, the chassis 21 can drive the wafer support assembly 2 to move synchronously in the vertical direction. A plurality of mounting portions 211 are also extended from the circumferential side of the chassis 21, and each mounting portion 211 is provided with a guide column 212, and the guide column 212 can ensure that the chassis 21 drives the wafer support assembly 2 to move in the vertical direction without radial deviation.

[0086] In addition, the movable top ring 23 is movably connected to the fixed outer ring 22 via bearings 26. The setting of the bearings 26 (here, two bearings 26 are provided, and both bearings 26 are thin-walled bearings 26) enables the movable top ring 23 to rotate relative to the fixed outer ring 22, and the rotation direction of the movable top ring 23 is rotation around the vertical direction, thereby achieving that when the movable top ring 23 supports the wafer, it can drive the wafer to rotate synchronously.

[0087] Specifically, the movable top ring 23 includes a top support member 231 and a bottom mounting member 232, and the bottom mounting member 232 is fixedly connected to the top support member 231 through a middle connecting member 233. The top support member 231 extends a mounting portion 211 in the radial direction, and the mounting portion 211 cooperates with the fixed outer ring 22 to form an embedded mounting groove. One end of the middle connecting member 233 is embedded in the mounting groove and fixedly connected to the mounting portion 211 by bolts. At the same time, the other end of the middle connecting member 233 is connected to the bottom mounting member 232. The bottom mounting member 232 is set as a stepped structure, the top end of which is connected to the middle connecting member 233, and the bottom end is connected to the pulley turntable 41, so that the rotation of the pulley turntable 41 can drive the various structural members connected thereto to rotate synchronously.

[0088] The top support member 231 can be in direct contact with the wafer, and a plurality of vacuum suction cups 2311 are provided on the contact end between the top support member 231 and the wafer. After the vacuum suction cups 2311 are in contact with the wafer, the wafer can be adsorbed by negative pressure through the plurality of vacuum suction cups 2311 to ensure stable contact between the wafer and the top support member 231.

[0089] More specifically, a vacuum adsorption chamber 24 is formed between the top support member 231 and the fixed outer ring 22, and a sealing ring 25 is provided in the vacuum adsorption chamber 24, through which the air in the vacuum adsorption chamber 24 can be restricted from directly flowing with the outside air. In addition, an air flow channel 2322 is also provided in the top support member 231, and the air flow channel 2322 can connect the vacuum adsorption chamber 24 with the vacuum suction cup 2311. A first vacuum joint 28 is also connected in the vacuum adsorption chamber 24, and the vacuum adsorption chamber 24 can be evacuated through the first vacuum joint 28, and a negative pressure is generated between the contact surface of the vacuum suction cup 2311 and the wafer to stably adsorb the wafer.

[0090] See also Figure 4 The wafer rotating mechanism 4 includes a pulley turntable 41 and a driving assembly 42. The pulley turntable 41 is fixedly mounted on the bottom mounting member 232. The driving assembly 42 is mounted on the chassis 21. The driving assembly 42 is connected to the pulley turntable 41 via a transmission belt 8, thereby driving the pulley to rotate, and the movable top ring 23 is driven to rotate synchronously through the rotation of the pulley turntable 41.

[0091] Specifically, the driving assembly 42 includes a second driving motor 421 and a reduction mechanism, the input end of the reduction mechanism is connected to the first gear 422, and the output end of the reduction mechanism is connected to the pulley turntable 41, so as to drive the pulley turntable to rotate. At the same time, the reduction mechanism also includes a transmission shaft, and a second gear 423 and a third gear 424 installed at both ends of the transmission shaft, and the second gear 423 is connected to the first gear 422 through a transmission belt 8, and the third gear 424 is connected to the pulley turntable 41 through a transmission belt 8, and the diameter of the second gear 423 is greater than the diameter of the first gear 422.

[0092] That is, after the second drive motor 421 outputs driving force to the second gear 423 through the first gear 422, the second gear 423 can be driven to rotate, and because the diameter of the third gear 424 is smaller than the diameter of the second gear 423, when the second gear 423 rotates one circle, the third gear 424 will be driven to rotate multiple circles, and then the third gear 424 outputs power to the pulley turntable 41 to drive the pulley turntable 41 to rotate.

[0093] However, since the cutting angle of the transmission belt 8 introduced and led out between the third gear 424 and the pulley turntable 41 is too large, the transmission area between the transmission belt 8 and the third gear 424 and the pulley turntable 41 is reduced, which in turn affects the stability of the transmission process between the pulley turntable 41 and the third gear 424. Therefore, in order to increase the transmission area between the transmission belt 8 and the pulley turntable 41 and the third gear 424, an idler wheel 7 is provided between the third gear 424 and the pulley turntable 41.

[0094] By setting the idler wheel 7, the transmission belt 8 led out from the third gear 424 can be guided to transmit between the pulley turntable 41 at a smaller cut-in angle, thereby increasing the transmission area between the transmission belt 8 and the pulley turntable 41. At the same time, when the transmission belt 8 is introduced from the pulley turntable 41 into the third gear 424, the introduced transmission belt 8 is also first adjusted by the idler wheel 7 to increase the transmission area between the transmission belt 8 and the third gear 424, thereby ensuring the stability of the transmission between the pulley turntable 41 and the third gear 424.

[0095] See also Figure 6 and Fig.12 A wafer working platform according to a specific embodiment of the present invention comprises a wafer rotating platform, a heating module 5 and a wafer lifting mechanism 6 as described in any of the above embodiments, the heating module 5 is arranged on a wafer carrier 1 and a heat insulation plate is provided on the peripheral side of the heating module 5, and the wafer rotating platform can separate the heating module 5 into an inner ring heating plate 51 and an outer ring heating plate 52, and the inner ring heating plate 51 and the outer ring heating plate 52 can heat the wafer at the same time, and the wafer lifting mechanism 6 can move in a vertical direction and support the wafer after protruding from the heating module 5.

[0096] Specifically, a plurality of support rods are provided at the bottom of the inner ring heating plate 51 and the outer ring heating plate 52, and the inner ring heating plate 51 and the outer ring heating plate 52 can be fixedly installed on the same horizontal plane through the plurality of support rods. Since the wafer is placed on the inner ring heating plate 51 and the outer ring heating plate 52 at the same time, by keeping the two on the same horizontal plane, it can be ensured that after the wafer contacts the inner ring heating plate 51 and the outer ring heating plate 52, there will be no height difference between the contact surfaces of the wafer, thereby ensuring that the inner ring heating plate 51 and the outer ring heating plate 52 can heat the wafer uniformly.

[0097] See also Figures 7 and 8 More specifically, the outer ring heating plate 52 is provided with a plurality of vacuum adsorption areas 521, each of which is arranged around the outer ring heating plate 52, and each of which works independently without interfering with each other. Each group of vacuum adsorption areas 521 includes a plurality of vacuum flow channels 522 arranged in an interlaced manner, and a plurality of vacuum adsorption holes are provided on the surface of the outer ring heating plate 52, each of which is connected to the vacuum flow channel 522, and the vacuum flow channel 522 can also be connected to the second vacuum connector 523, through which the air in the vacuum flow channel 522 can be sucked out, so that the vacuum adsorption hole can negatively adsorb the wafer.

[0098] See also Figure 5 The wafer lifting mechanism 6 includes a wafer carrier 61, which can move in the vertical direction and can effectively support the wafer after protruding from the heating module 5. The wafer carrier 61 is distributed along the edge of the wafer, and at least one wafer carrier 61 is also provided at the center of the wafer. When the wafer carrier 61 protrudes from the heating module 5 and contacts the wafer, the wafer carrier 61 can simultaneously support the peripheral edge of the wafer and the center of the wafer, thereby ensuring stable support for the entire wafer.

[0099] Specifically, the wafer lifting mechanism 6 also includes a second screw transmission assembly 62 and a third drive motor 63. The third drive motor 63 is connected to the adjacent second screw transmission assembly 62 through a transmission belt 8, thereby being able to drive the second screw transmission assembly 62 to move in the vertical direction.

[0100] The second screw drive assembly 62 is arranged on the peripheral side of the wafer and is connected to the wafer carrier 61 via the base plate 64, and multiple second screw drive assemblies 62 are connected via a transmission belt 8 to achieve synchronous movement between the multiple second screw drive assemblies 62, and idler wheels 7 are also provided between the multiple second screw drive assemblies 62, and the idler wheels 7 can ensure that the transmission belt 8 can effectively transmit to each second screw drive assembly 62, thereby avoiding that the transmission area between the transmission belt 8 and each second screw drive assembly 62 is too small, resulting in a decrease in transmission efficiency.

[0101] Each second screw transmission assembly 62 includes a transmission gear 621 and a screw transmission member 622. The transmission gears 621 in adjacent second screw transmission assemblies 62 are connected by a transmission belt 8, and at least one transmission gear 621 is connected to the output end of the third drive motor 63, so that a transmission gear 621 can be driven to rotate by the third drive motor 63, and then the rotating transmission gear 621 can drive other transmission gears 621 to rotate synchronously.

[0102] See also Fig.11 Each screw transmission member 622 includes a screw 6221 and a screw nut 6222, and the screw 6221 and the screw nut 6222 are threadedly connected. When the screw 6221 rotates in situ, the screw nut 6222 arranged thereon does not rotate and can move along the screw 6221; and when the screw 6221 is fixed but the screw nut 6222 arranged thereon rotates, the screw nut 6222 rotates and moves along the direction of the screw 6221. The screw nuts 6222 are connected through the same bottom plate 64 to ensure the synchronous movement of the multiple screw transmission members 622. At the same time, since the wafer support is also arranged on the same bottom plate 64, when the bottom plate 64 moves synchronously, it can drive the wafer support arranged thereon to move synchronously.

[0103] Specifically, since the second screw drive member 622 can respectively support the circumference and the center of the wafer, the second screw drive member 622 supporting the circumference of the wafer uses the same base plate 64 to control its synchronous movement, while the second screw drive member 622 used to support the center of the wafer is connected to the second screw drive assembly 62, the wafer carrier 61 and the guide column 212 through the mounting block 6223, so that the second screw drive assembly 62 can synchronously drive the wafer carrier 61 to move in the vertical direction through the mounting block 6223, and the guide column 212 passes through the mounting block 6223 to limit the second screw drive assembly 62 from causing radial deviation during the movement of the wafer carrier 61.

[0104] In addition, in order to ensure that the bottom plate 64 does not deviate during movement, a plurality of guide posts 212 are provided on the bottom plate 64. The plurality of guide posts 212 penetrate the bottom plate 64 so that each area of ​​the bottom plate 64 can move synchronously along a set direction without deviating.

[0105] See also Figures 9 and 10 A wafer operation method according to a specific embodiment of the present invention is applied to the wafer operation platform described in any of the above embodiments, and the wafer operation method comprises the following steps:

[0106] Transport wafers to the receiving position;

[0107] The wafer lifting mechanism 6 rises to receive the wafer;

[0108] The wafer lifting mechanism 6 descends, so that the wafer gradually approaches the heating module 5 until the wafer temperature reaches the first set temperature;

[0109] The wafer lifting mechanism 6 continues to descend until the wafer reaching the first set temperature is placed on the heating module 5 and continues to heat the wafer to a second set temperature;

[0110] processing the wafer that has reached the second set temperature;

[0111] The wafer rotating platform lifts up the processed wafer and rotates it to a specified angle;

[0112] Take out and transport the processed wafer at the specified angle to the next station.

[0113] The wafer working platform is mainly used to heat the wafer and perform the initial anti-warping operation.

[0114] When heating, the wafer transported by the residence is first received by the wafer lifting mechanism 6, and the wafer is scanned when it enters. At this time, the wafer does not contact the heating module 5. As the wafer lifting mechanism 6 gradually retracts, the distance between the wafer supported by the wafer lifting mechanism 6 and the heating module 5 gradually decreases. Therefore, the temperature generated by the heating module 5 on the wafer gradually increases until the wafer temperature reaches the first set temperature. At this time, the wafer lifting mechanism 6 completes the retraction to the initial position, and the wafer supported by it is also completely placed on the surface of the heating module 5 for direct heating until the wafer temperature reaches the second set temperature, and then the wafer is subjected to subsequent processing steps (glue dispensing, detection operations, etc.). Through the above-mentioned heating operation of the wafer, it can be ensured that the wafer will not cause greater warping due to the sudden increase in temperature during the whole process (the wafer may produce a certain degree of warping during the incoming material or heating process), and even rupture in severe cases, so as to affect the subsequent process of the wafer.

[0115] When the wafer reaches the second set temperature, the whole wafer has softened. Therefore, in this state, the wafer can be initially leveled by performing anti-warping operations on the wafer. Then the orientation of the leveled wafer needs to be adjusted by the wafer rotating platform. Since the orientation of the wafer will be adjusted when the wafer is transported to the wafer operation platform, and the orientation of the wafers of the same batch is not completely consistent when the wafers are initially received, the orientation of the wafer needs to be adjusted to the specified angle before being transported to the next station for operation, so as to ensure that the orientation of the wafer is consistent when it is transported to the next station for operation.

[0116] Therefore, when adjusting the orientation of the wafer, it is first necessary to lift it up through the wafer rotation platform, and then the wafer rotation platform drives the wafer to rotate to the specified angle at the same time, and then the wafer rotation platform retracts to the initial position and places the wafer with the adjusted orientation on the heating module 5, and then the wafer is lifted up to the material receiving position again through the wafer lifting mechanism 6, and finally the wafer is taken out from the receiving position and transported to the next workstation for processing. At this point, all operations of the wafer in the wafer operation platform are completed. The whole process does not require manual intervention, and can realize automatic alignment correction to ensure the accurate orientation of the wafer during operation and improve the work efficiency of the entire operation process.

[0117] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0118] The above description is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content of the specification, and its technical scope must be determined by the scope of the claims.

Claims

1. A wafer rotating platform, characterized in that: include: A wafer carrying platform (1), wherein the wafer carrying platform (1) is used to carry a wafer; A wafer support assembly (2), the wafer support assembly (2) being movable in a vertical direction and being able to protrude from the wafer carrier platform (1) for supporting the wafer; A wafer lifting mechanism (3), the wafer lifting mechanism (3) is connected to the wafer supporting assembly (2) and drives the wafer supporting assembly (2) to move in a vertical direction; A wafer rotating mechanism (4), wherein when the wafer supporting assembly (2) protrudes from the wafer carrying platform (1), the wafer rotating mechanism (4) drives the wafer supporting assembly (2) to rotate around a vertical direction and simultaneously drives the wafer to rotate.

2. The wafer rotating platform according to claim 1, characterized in that: The wafer lifting mechanism (3) comprises: A first screw transmission assembly (31), wherein the first screw transmission assembly (31) drives the wafer support assembly (2) to move up and down in a vertical direction; A first drive motor (32), wherein the first drive motor (32) is connected to the first screw drive assembly (31) via a drive belt (8) to drive the first screw drive assembly (31) to move.

3. The wafer rotating platform according to claim 1, characterized in that: The wafer support assembly (2) comprises: A chassis (21), wherein the wafer lifting mechanism (3) is suitable for driving the chassis (21) to move in a vertical direction; A fixed outer ring (22), wherein the fixed outer ring (22) is fixed to the chassis (21) via a plurality of support columns (27); A movable top ring (23), wherein the movable top ring (23) is connected to the fixed outer ring (22) via a bearing (26), and the movable top ring (23) can protrude from the wafer supporting platform (1).

4. The wafer rotating platform according to claim 3, characterized in that: The movable top ring (23) comprises: A top support member (231), the top support member (231) being adapted to protrude from the wafer carrier platform (1) and to contact the wafer; A bottom mounting member (232), wherein the bottom mounting member (232) is connected to the fixed outer ring (22) via a bearing (26); A middle connecting member (233), wherein the middle connecting member (233) simultaneously connects the bottom mounting member (232) and the top supporting member (231).

5. The wafer rotating platform according to claim 4, characterized in that: A vacuum adsorption chamber (24) is provided between the top support member (231) and the fixed outer ring (22), and the vacuum adsorption chamber (24) is provided with a first vacuum joint (28) connected to an external vacuum device. The contact end of the top support member (231) is provided with a plurality of vacuum suction cups (2311) for adsorbing the wafer, and the plurality of vacuum suction cups (2311) are connected to the vacuum adsorption chamber (24).

6. The wafer rotating platform according to claim 4, characterized in that: The wafer rotating mechanism (4) comprises: A pulley turntable (41), wherein the pulley turntable (41) is fixedly sleeved on the bottom mounting member (232); A driving assembly (42), wherein the driving assembly (42) is mounted on the chassis (21), and the driving assembly (42) is connected to the pulley turntable (41) via a transmission belt (8) so as to drive the pulley turntable (41) to rotate, and drive the movable top ring (23) to rotate synchronously via the pulley turntable (41).

7. The wafer rotating platform according to claim 6, characterized in that: The drive assembly (42) comprises: A second driving motor (421), wherein a first gear (422) is mounted on an output end of the second driving motor (421); A speed reduction mechanism, wherein the input end of the speed reduction mechanism is connected to the first gear (422) by belt transmission, and the output end of the speed reduction mechanism is connected to the pulley turntable (41) and drives the pulley turntable (41) to rotate.

8. The wafer rotating platform according to claim 7, characterized in that: The speed reduction mechanism comprises a transmission shaft, and a second gear (423) and a third gear (424) mounted at both ends of the transmission shaft, the second gear (423) being connected to the first gear (422) via a transmission belt (8), the third gear (424) being connected to the pulley turntable (41) via a transmission belt (8), and the diameter of the second gear (423) being greater than the diameter of the first gear (422).

9. A wafer operation platform, characterized in that: include: The wafer rotation platform according to any one of claims 1 to 8; A heating module (5), the heating module (5) being arranged on the wafer carrier platform (1), the wafer rotating platform dividing the heating module (5) into an inner ring heating plate (51) and an outer ring heating plate (52), the inner ring heating plate (51) and the outer ring heating plate (52) being suitable for heating the wafer simultaneously; A wafer lifting mechanism (6), wherein the wafer lifting mechanism (6) is suitable for moving in a vertical direction, and the wafer lifting mechanism (6) is suitable for protruding from the heating module (5) and supporting the wafer.

10. The wafer operation platform according to claim 9, characterized in that: The inner ring heating plate (51) and the outer ring heating plate (52) are fixedly mounted on the same horizontal plane via a plurality of support rods.

11. The wafer working platform according to claim 9, characterized in that: The outer ring heating plate (52) is provided with a plurality of vacuum adsorption areas (521), each group of the vacuum adsorption areas (521) includes a plurality of vacuum flow channels (522) arranged in an alternating manner, and the plate surface of the outer heating plate is provided with a plurality of vacuum adsorption holes, each of the vacuum adsorption holes is connected to the vacuum flow channel (522), and the vacuum flow channel (522) is suitable for connecting to a second vacuum connector (523) so as to be able to suck the air in the vacuum flow channel (522) through the second vacuum connector (523), and enable each of the vacuum adsorption holes to negatively pressure adsorb the wafer.

12. The wafer operation platform according to claim 9, characterized in that: The wafer lifting mechanism (6) comprises: A wafer carrier (61), wherein the wafer carrier (61) is suitable for moving in a vertical direction, and the wafer carrier (61) is respectively arranged at the peripheral edge and the center of the wafer, so as to simultaneously support the peripheral edge and the center of the wafer after extending upward from the heating module (5).

13. The wafer operation platform according to claim 12, characterized in that: The wafer lifting mechanism (6) further comprises: A second screw drive assembly (62), the second screw drive assembly (62) being arranged on the peripheral side of the wafer and connected to each of the wafer carriers (61) via a base plate (64), and each of the second screw drive assemblies (62) being connected via a transmission belt (8) so as to be able to move synchronously; A third drive motor (63), wherein the third drive motor (63) is connected to the adjacent second screw drive assembly (62) via a drive belt (8) to drive each of the second screw drive assemblies (62) to move synchronously in a vertical direction.

14. The wafer operation platform according to claim 13, characterized in that: Each of the second screw drive assemblies (62) comprises: Transmission gears (621), each of the transmission gears (621) being connected via a transmission belt (8), and at least one of the transmission gears (621) being connected to an output end of the third drive motor (63), so that each of the transmission gears (621) can be driven to rotate synchronously via the third drive motor (63); A screw transmission component (622), the screw transmission component (622) includes a screw (6221) and a screw nut (6222), the screw (6221) and the screw nut (6222) are threadedly connected, and the screw (6221) is suitable for being driven to rotate via the transmission gear (621), and making the screw nut (6222) move linearly along the path defined by the screw (6221).

15. A wafer operation method, characterized in that: Applied to the wafer operation platform according to claims 9 to 14, the wafer operation method comprises the following steps: Transport wafers to the receiving position; The wafer lifting mechanism (6) rises to receive the wafer; The wafer lifting mechanism (6) descends, so that the wafer gradually approaches the heating module (5) until the temperature of the wafer reaches a first set temperature; The wafer lifting mechanism (6) continues to descend until the wafer that has reached the first set temperature is placed on the heating module (5) and is continuously heated to bring the wafer temperature to the second set temperature; processing the wafer that has reached the second set temperature; The wafer rotating platform lifts up the processed wafer and rotates it to a specified angle; Take out and transport the processed wafer at the specified angle to the next station.

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