Surface-mounted electronic component

Abstract

The invention discloses a surface-mounted electronic component, which comprises an insulating substrate, an internal conductor, an external conductor and an end, the internal conductor and the external conductor are located in the insulating base body, at least part of the end is exposed outside the insulating base body to be used for surface mounting, and the external conductor is connected between the internal conductor and the end; the external conductor comprises a connecting assembly, a horizontal assembly and an infolding assembly, the connecting assembly is connected to the end head through a connecting end face, the infolding assembly is connected with the internal conductor, and the horizontal assembly is connected between the connecting assembly and the infolding assembly; the size of the horizontal assembly in the first direction is d1, the size of the connecting end face of the connecting assembly in the first direction is d3, and d3 is larger than or equal to 1.1 * d1; wherein the first direction is a direction perpendicular to the top surface and the bottom surface of the insulating substrate.

Description

Technical Field

[0001] The invention relates to a patch type electronic component. Background Art

[0002] The structure of chip-type electronic components usually includes a substrate, an internal electrode, an extraction electrode, and an external electrode. Among them: the substrate is formed by an insulating medium and plays a role in skeleton support; the internal electrode is a conductor located inside the substrate; the extraction electrode is a conductor connected between the internal electrode and the external electrode (also called "external conductor"); the external electrode is a conductor used for patch (also called "end"). Inside the substrate, adjacent electrode layers are connected through connection holes.

[0003] For this type of SMD electronic components, when the lead-out electrodes connect the internal coil and the terminal, the weak connection parts are more likely to be disconnected by external forces, affecting the product connection performance. Existing SMD electronic components have no clear regulations on the parameters of the connection parts, which leads to gaps in the connection parts due to unreasonable design parameters during the molding process of some designs, or the connection parts shrink and disconnect directly during the firing process, bringing the risk of open circuit or short circuit. Summary of the invention

[0004] In view of this, the present invention proposes a surface-mount electronic component, which improves the line solidification ability of the connection part during the molding process by constraining the relevant structural parameters of the lead-out terminal electrode and the terminal connection part, and enhances the connection stability when the lead-out terminal electrode connects the internal coil and the terminal.

[0005] A patch-type electronic component comprises: an insulating substrate, an internal conductor, an external conductor and a terminal; the internal conductor and the external conductor are located in the insulating substrate, the terminal is at least partially exposed outside the insulating substrate for patching, and the external conductor is connected between the internal conductor and the terminal; the external conductor comprises a connecting component, a horizontal component and an inner folding component, wherein the connecting component is connected to the terminal through a connecting end face, the inner folding component is connected to the internal conductor, and the horizontal component is connected between the connecting component and the inner folding component; the dimension of the horizontal component in the first direction is d1, the dimension of the connecting end face of the connecting component in the first direction is d3, and d3≥1.1*d1; wherein the first direction is a direction perpendicular to the top and bottom surfaces of the insulating substrate.

[0006] Furthermore, d3≤5*d1.

[0007] Furthermore, the dimension of the intersection of the outer side surface of the connecting component and the end head to the inner side surface of the connecting component along the second direction is d2, and d1≤d2≤5*d1; wherein, the second direction is a direction perpendicular to the left end surface and the right end surface of the insulating substrate, wherein the left end surface and the right end surface respectively expose the vertical part of the end head, and the horizontal part of the end head is exposed to the bottom surface of the insulating substrate; the connecting end surface of the connecting component is connected to the vertical part of the end head.

[0008] Furthermore, the external conductor includes a first external conductor and a second external conductor having the same structure, and the end includes a first end and a second end having the same structure; the first end and the second end are symmetrically arranged on the insulating base, and the vertical parts of the two are respectively located at the left and right ends of the insulating base, and the horizontal parts of the two are respectively located at the left and right side areas of the bottom of the insulating base; the two ends of the internal conductor are respectively connected to the first external conductor and the second external conductor, the first external conductor is connected between the internal conductor and the first end, and the second external conductor is connected between the internal conductor and the second end.

[0009] Furthermore, the first external conductor and the second external conductor are respectively close to the front and the rear of the insulating base in the insulating base; and the internal conductor is located between the first external conductor and the second external conductor.

[0010] Furthermore, the connecting component of the external conductor extends obliquely upward from the end toward the top of the insulating base and is connected to the first end of the horizontal component; the horizontal component extends along the second direction, and its second end is connected to the inner folding component; the inner folding component extends from the second end of the horizontal component downward toward the bottom of the insulating base, and then extends inward to form an inner fold, and the inner folding end is connected to the internal conductor.

[0011] Furthermore, the connecting component includes a straight line obliquely upward extending portion and an arc-shaped transition portion, wherein the straight line obliquely upward extending portion is connected to the end head, and the arc-shaped transition portion is connected between the straight line obliquely upward extending portion and the horizontal component.

[0012] Furthermore, the connecting component includes a curved obliquely upward extending portion and an arc-shaped transition portion, wherein the curved obliquely upward extending portion is connected to the end, and the arc-shaped transition portion is connected between the curved obliquely upward extending portion and the horizontal component.

[0013] Furthermore, the curved obliquely upward extending portion includes an arc-shaped portion, and a bending direction of the arc-shaped portion is opposite to a bending direction of the arc-shaped transition portion.

[0014] Further, the outer side surface of the arc-shaped transition portion protrudes outwardly from the outer side surface of the inner conductor when viewed along a third direction; or, the outer side surface of the inner conductor protrudes outwardly from the outer side surface of the arc-shaped transition portion when viewed along the third direction; or, the outer side surface of the arc-shaped transition portion overlaps with the outer side surface of the inner conductor when viewed along the third direction; wherein the third direction is a direction perpendicular to the front and back of the insulating substrate.

[0015] The beneficial effects of the technical solution of the present invention are embodied in that: the present invention increases the contact area between the external conductor and the terminal connection portion by widening d3, thereby increasing the solidification stability of the connection portion, reducing the risk of cracking of the connection position due to liquid flushing pressure during the molding process, thereby reducing the risk of open circuit, and simultaneously improving the current resistance capability.

[0016] In a further technical solution of the present invention, since the connection assembly of the external conductor is tilted upward, the size d2 of the external conductor is not directly equal to the size d1. Through such a connection design, the stability of the connection part is further enhanced.

[0017] In a further technical solution of the present invention, the inward folding component of the external conductor first extends downward toward the bottom of the insulating base from the second end of the horizontal component, and then extends inward to form an inward fold. Such a design can ensure that the winding direction of the conductor in the insulating base is consistent, thereby increasing the number of turns of the conductor in the same layer, which is beneficial to improving the inductance and Q value of the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional schematic diagram of the L-shaped terminal device of Example 1 of the present invention.

[0019] Figure 2 yes Figure 1 The L-shaped terminal device shown is a schematic diagram of layer-by-layer decomposition along the Y-axis direction.

[0020] Figure 3 yes Figure 1 A perspective view of the L-shaped terminal device along the Y-axis direction is shown.

[0021] Figure 4 It is a perspective view of the L-shaped terminal device of Example 2 of the present invention along the Y-axis direction.

[0022] Figure 5 It is a perspective view of the L-shaped terminal device of Example 3 of the present invention along the Y-axis direction.

[0023] Figure 6 It is a perspective view of the L-shaped terminal device of Example 4 of the present invention along the Y-axis direction.

[0024] Figure 7It is a perspective view of the L-shaped terminal device of Example 5 of the present invention along the Y-axis direction.

[0025] Figure 8 is a schematic diagram of an exemplary external conductor structure. DETAILED DESCRIPTION

[0026] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods and examples. The purpose of providing the examples is only for illustration, not for any limitation. In addition, the spatial orientation words such as "upper", "lower", "left", "right", "top", "bottom" and the like used in the description of the technical solution of the present invention are used to facilitate the description of the relative position relationship between the components constituting the product, and do not represent that the product has only the swing direction shown in the figure. In actual use, as the product swing direction is different (for example, rotated 90 degrees or other directions), the spatial related descriptions used to describe its swing direction should also be interpreted in a similar manner. In addition, the words "first", "second" and the like are only used to distinguish components. It should be understood that these components should not be limited by such words. They themselves do not mean that these elements have the aforementioned ordinal numbers, nor do they represent the arrangement order of a certain component and another component or the order in the manufacturing method.

[0027] A specific embodiment of the present invention provides a chip-type electronic component, including: an insulating substrate, an internal conductor, an external conductor and a terminal; wherein the internal conductor and the external conductor are located in the insulating substrate, the terminal (i.e., the terminal electrode) is at least partially exposed outside the insulating substrate for patching, and the external conductor is connected between the internal conductor and the terminal; the external conductor includes a connecting component, a horizontal component and an inner folding component, wherein the connecting component is connected to the terminal through a connecting end face, the inner folding component is connected to the internal conductor, and the horizontal component is connected between the connecting component and the inner folding component. Specifically, the external conductor of the chip-type electronic component includes a first external conductor and a second external conductor having the same structure, which are arranged in opposite directions in the insulating substrate; at the same time, the terminal of the chip-type electronic component also includes a first terminal and a second terminal having the same structure, which are symmetrically arranged on the insulating substrate. The chip-type electronic component in the embodiment of the present invention can be, for example, an inductor device with an L-shaped terminal electrode, and its three-dimensional schematic diagram is as shown in FIG. Figure 1As shown, the L-shaped terminal includes a vertical portion and a horizontal portion connected at right angles to each other. The vertical portion of the first terminal and the vertical portion of the second terminal are respectively located at the left and right ends of the insulating substrate, and the outer side surfaces are respectively exposed on the left and right end surfaces of the insulating substrate; the horizontal portions of the first terminal and the second terminal are respectively located at the left and right side areas of the bottom of the insulating substrate, and the outer side surfaces are respectively exposed on the left and right sides of the bottom surface of the insulating substrate. The two ends of the internal conductor are respectively connected to the first external conductor and the second external conductor, the first external conductor is connected between one end of the internal conductor and the vertical portion of the first terminal, and the second external conductor is connected between the other end of the internal conductor and the vertical portion of the second terminal.

[0028] In order to facilitate the subsequent description, Figure 1 A three-axis coordinate system is used to define the direction, where: the XY plane is parallel to the top and bottom surfaces of the device, the XZ plane is parallel to the front and back of the device, and the YZ plane is parallel to the left and right end surfaces of the device. Based on this, the direction perpendicular to the left and right end surfaces can be defined as the X-axis direction, the direction perpendicular to the front and back is the Y-axis direction, and the direction perpendicular to the top and bottom surfaces is the Z-axis direction. The device can be roughly divided into three parts in the Y-axis direction: the front substrate 2-1, the middle part 1, and the rear substrate 2-2, where the internal conductor and the external conductor are located in the middle part 1.

[0029] In order to facilitate the description of the conductor structure of the device, Figure 1 The device shown is decomposed layer by layer along the Y-axis direction, as shown in FIG. Figure 2 As shown, the insulating substrate is sequentially layered into a front substrate 2-1, an intermediate substrate 1-1, an intermediate substrate 1-2, an intermediate substrate 1-3, an intermediate substrate 1-4 and a rear substrate 2-2, wherein the first external conductor 3-1 and the second external conductor 3-2 are respectively located on the intermediate substrate 1-1 and the intermediate substrate 1-4, and the intermediate substrates 1-2 and 1-3 are respectively provided with internal conductors 4-1 and 4-2. That is, the first external conductor 3-1 and the second external conductor 3-2 are respectively close to the front and the back of the insulating substrate in the insulating substrate; and the internal conductor is located between the first external conductor and the second external conductor. It should be understood that Figure 2 This is only for example, and the internal conductor is not limited to the two layers shown in the figure. One end of the first external conductor 3-1 is connected to the first terminal 6-1, and the other end is connected to one end of the internal conductor 4-1 through a connection hole (indicated by a connection line 7-1); the other end of the internal conductor 4-1 is connected to one end of the internal conductor 4-2 through a connection hole (indicated by a connection line 7-2), and the other end of the internal conductor 4-2 is connected to one end of the second external conductor 3-2 through a connection hole (indicated by a connection line 7-3); the other end of the second external conductor 3-2 is connected to the second terminal 6-2. In this way, it can be formed. Figure 3 The coil body 8 is shown.

[0030] In some specific embodiments, Figure 8 As shown, the external conductor includes a connecting component 11, a horizontal component 12 and an inner folding component 13. The connecting component 11 extends obliquely upward from the end toward the top of the insulating substrate and is connected to the first end of the horizontal component 12; the horizontal component extends along the X-axis direction, and its second end is connected to the inner folding component 13; the inner folding component 13 extends downward from the second end of the horizontal component toward the bottom of the insulating substrate, and then extends inward to form an inner fold. The inner folding end is connected to the internal conductor. The inner folding design ensures that the winding direction of the conductor is consistent, so that the number of turns of the conductor in the same layer can be increased, which is beneficial to the improvement of the inductance and Q value of the component. Since the first external conductor and the second external conductor have the same structure, the above structural description of the external conductor is applicable to the first external conductor and the second external conductor. Figure 3 The connecting component 11 - 1 of the first external conductor is the gray filled part in the figure, and the connecting component 11 - 2 of the second external conductor is the gray filled part in the figure.

[0031] Continue to refer Figure 3 , the dimension of the horizontal component of the external conductor in the Z-axis direction is d1, the dimension of the connecting end face where the connecting component is connected to the inner side surface 10 of the terminal in the Z-axis direction is d3, and the dimension of the intersection B of the outer side surface 9-1 of the connecting component and the terminal to the inner side surface 9-2 of the connecting component along the X-axis direction is d2, and: 1.1*d1≤d3≤5*d1, d1≤d2≤5*d1. When d3<1.1*d1, the connection between the connecting component and the external conductor is relatively weak, and it is easy to be disconnected, causing the risk of open circuit. The present invention can increase the connection area of ​​the connection part by widening the d3 dimension, and further widen the d2 dimension by designing the connecting component obliquely upward, thereby increasing the solidification stability of this part, reducing the risk of cracking the connection position due to the liquid flushing pressure during the molding process, thereby reducing the risk of open circuit, and simultaneously improving the current resistance.

[0032] In the embodiment of the present invention, by widening the size of d3 to 1.1*d1≤d3≤5*d1, the area of ​​the connection part can be increased and the current resistance can be improved, while the area of ​​the coil is taken into account, such as: d3=2*d1; when d3>5*d1, the area of ​​the connection part is too large, affecting the area of ​​the internal conductor, which can easily lead to the degradation of the electrical performance of the internal conductor.

[0033] The principle of d2 size setting is the same as above, but the d2 relationship is: d1≤d2≤5*d1.

[0034] It should be understood that the connection assembly of the external conductor is not limited to Figure 2 and Figure 3 The design shown can also be modified in other ways, such as Figure 4 , Figure 5 and Figure 6That is, the connecting component may include a straight-line obliquely upward extending portion and an arc-shaped transition portion, such as Figures 2 to 5 , wherein the straight-line obliquely upward extending portion is connected to the end, and the arc-shaped transition portion is connected between the straight-line obliquely upward extending portion and the horizontal component.

[0035] In another specific embodiment, the connecting component may include a curved upwardly extending portion and an arc-shaped transition portion, such as Figure 6 , wherein the curved obliquely upward extending portion is connected to the end, and the arcuate transition portion is connected between the curved obliquely upward extending portion and the horizontal component. More preferably, the curved obliquely upward extending portion includes an arcuate portion, and the bending direction of the arcuate portion is opposite to the bending direction of the arcuate transition portion.

[0036] In other embodiments, the connection component can also be configured as follows: Figure 7 The rounded shape shown has one end connected to the end head and the other end connected to the horizontal component.

[0037] In addition, the outer side surface of the arc-shaped transition portion of the connecting component protrudes outwardly from the outer side surface of the inner conductor in the Y-axis direction. Figure 5 Or, the outer side of the inner conductor protrudes outwardly from the outer side of the arc-shaped transition portion in the Y-axis direction, such as Figure 4 Or, the outer side surface of the arc-shaped transition portion overlaps with the outer side surface of the inner conductor in the Y-axis direction, such as Figure 3 .

[0038] The conductors (including internal conductors, external conductors, and terminals) of the surface-mount electronic components of the present invention are not limited to the process routes of screen printing → lamination / etching patterns / plating → laser opening / drilling → cutting. In addition, there is no restriction on the product dimensions.

[0039] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art of the present invention, several equivalent substitutions or obvious variations can be made without departing from the concept of the present invention, and the performance or use is the same, which should be regarded as belonging to the protection scope of the present invention.

Claims

1. A surface-mount electronic component, characterized in that: include: Insulating substrate, inner conductor, outer conductor and terminal; The inner conductor and the outer conductor are located in the insulating substrate, the end is at least partially exposed outside the insulating substrate for patching, and the outer conductor is connected between the inner conductor and the end; The external conductor includes a connecting component, a horizontal component and an inner folding component, wherein the connecting component is connected to the end via a connecting end face, the inner folding component is connected to the internal conductor, and the horizontal component is connected between the connecting component and the inner folding component; the dimension of the horizontal component in the first direction is d1, the dimension of the connecting end face of the connecting component in the first direction is d3, and d3≥1.1*d1; wherein the first direction is a direction perpendicular to the top and bottom surfaces of the insulating substrate.

2. The surface-mount electronic component according to claim 1, characterized in that: d3≤5*d1.

3. The surface-mount electronic component according to claim 1, characterized in that: The dimension from the intersection of the outer side surface of the connecting component and the end to the inner side surface of the connecting component along the second direction is d2, and d1≤d2≤5*d1; wherein, the second direction is a direction perpendicular to the left end surface and the right end surface of the insulating substrate, wherein the left end surface and the right end surface respectively expose the vertical part of the end head, and the horizontal part of the end head is exposed to the bottom surface of the insulating substrate; the connecting end surface of the connecting component is connected to the vertical part of the end head.

4. The surface-mount electronic component according to claim 3, characterized in that: The external conductor includes a first external conductor and a second external conductor having the same structure, and the terminal includes a first terminal and a second terminal having the same structure; the first terminal and the second terminal are symmetrically arranged on the insulating base, and the vertical parts of the two are respectively located at the left and right ends of the insulating base, and the horizontal parts of the two are respectively located at the left and right side areas of the bottom of the insulating base; Two ends of the inner conductor are connected to the first outer conductor and the second outer conductor respectively. The first outer conductor is connected between the inner conductor and the first end, and the second outer conductor is connected between the inner conductor and the second end.

5. The surface-mount electronic component according to claim 4, characterized in that: The first external conductor and the second external conductor are located in the insulating base, respectively, close to the front and rear of the insulating base; the internal conductor is located between the first external conductor and the second external conductor.

6. The surface-mount electronic component according to claim 3, characterized in that: The connecting component of the external conductor extends obliquely upward from the end toward the top of the insulating base and is connected to the first end of the horizontal component; the horizontal component extends along the second direction, and its second end is connected to the inner folding component; the inner folding component extends from the second end of the horizontal component downward toward the bottom of the insulating base, and then extends inward to form an inner fold, and the inner folding end is connected to the internal conductor.

7. The surface-mount electronic component according to claim 6, characterized in that: The connecting component includes a straight-line obliquely upward extending portion and an arc-shaped transition portion, wherein the straight-line obliquely upward extending portion is connected to the end head, and the arc-shaped transition portion is connected between the straight-line obliquely upward extending portion and the horizontal component.

8. The surface-mount electronic component according to claim 6, characterized in that: The connecting component includes a curved obliquely upward extending portion and an arc-shaped transition portion, wherein the curved obliquely upward extending portion is connected to the end head, and the arc-shaped transition portion is connected between the curved obliquely upward extending portion and the horizontal component.

9. The surface-mount electronic component according to claim 8, characterized in that: The curved obliquely upward extending portion includes an arc-shaped portion, and a bending direction of the arc-shaped portion is opposite to a bending direction of the arc-shaped transition portion.

10. The surface-mount electronic component according to claim 7 or 8, characterized in that: The outer side surface of the arcuate transition portion protrudes outwardly from the outer side surface of the inner conductor when viewed along a third direction; or, the outer side surface of the inner conductor protrudes outwardly from the outer side surface of the arcuate transition portion when viewed along the third direction; or, the outer side surface of the arcuate transition portion overlaps with the outer side surface of the inner conductor when viewed along the third direction; wherein the third direction is a direction perpendicular to the front and back of the insulating substrate.

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