Glass-based LED display panel and preparation method thereof

Abstract

The invention relates to the technical field of circuit boards, solves the problem that a glass substrate of a glass-based LED display panel in the prior art is difficult to maintain, and provides a glass-based LED display panel and a preparation method thereof.The glass-based LED display panel comprises the glass substrate which comprises a substrate surface, and a conductive circuit and a plurality of light-emitting chips are arranged on the substrate surface; the optical adhesive film comprises a first optical adhesive layer and an optical film layer which are stacked, the first optical adhesive layer comprises different thermal expansion materials, and the different thermal expansion materials in the first optical adhesive layer can expand by heating the glass substrate through heating temperatures and heating durations corresponding to the thermal expansion materials in different numerical ranges; therefore, the binding force between the first optical adhesive layer and the substrate surface is reduced until the first optical adhesive layer and the substrate surface can be relatively stripped; the optical adhesive film is attached to the surface of the substrate through the first optical adhesive layer. The problem that the glass substrate of the glass-based LED display panel is difficult to maintain can be solved.

Description

[0001] This invention is a divisional application of the invention patent application filed on December 29, 2023, with the invention name “Glass-based LED display panel, preparation method and maintenance method thereof” and application number 202311868553.4. Technical Field

[0002] The present invention relates to the technical field of circuit boards, and in particular to a glass-based LED display panel and a preparation method thereof. Background Art

[0003] At present, the packaging of traditional LED substrates generally adopts two methods. Method 1: Molding packaging, which adopts epoxy resin curing packaging. Method 2: Laminating packaging, which adopts semi-cured adhesive film to bond and cure packaging. For method 1, it has at least two technical defects: First, the molding process needs to apply a large pressure, which may easily cause the glass substrate to break during the pressure application process; Second, due to the obvious shrinkage phenomenon in the epoxy resin curing process, the glass substrate warps and generates stress, which leads to the breakage of the glass substrate. For method 2, it has at least one technical defect: First, after laminating, the semi-cured adhesive film cannot be removed, or during the removal process, tearing off the semi-cured adhesive film may easily cause the glass substrate to crack due to stress, resulting in the inability to perform subsequent repairs on the faulty LED chips on the glass-based LED display panel.

[0004] Therefore, the difficulty in repairing the glass substrate of the existing glass-based LED display panel is a problem that needs to be solved urgently. Summary of the invention

[0005] The present invention aims to solve the problem that the glass substrate of the glass-based LED display panel in the prior art is difficult to repair. To achieve one purpose of the present invention, a glass-based LED display panel is provided, comprising:

[0006] A glass substrate, comprising a substrate surface, on which a conductive circuit and a plurality of light-emitting chips are arranged;

[0007] An optical adhesive film, comprising a stacked first optical adhesive layer and an optical film layer, wherein the first optical adhesive layer comprises different heat expansion materials, and the different heat expansion materials in the first optical adhesive layer can expand by heating the glass substrate at heating temperatures and heating times in different numerical ranges corresponding to the heat expansion materials, thereby reducing the bonding force between the first optical adhesive layer and the substrate surface to the extent that the two can be relatively peeled off;

[0008] The optical adhesive film is adhered to the substrate surface through the first optical adhesive layer.

[0009] Furthermore, the light-emitting chip is Mini LED or Micro LED.

[0010] Furthermore, the thermal expansion material includes at least one of vermiculite and thermal expansion microspheres, the first optical adhesive layer uses acrylic optical adhesive as a base material, vermiculite and / or thermal expansion microspheres are mixed inside the acrylic optical adhesive, the diameter of the vermiculite is set to 20 to 100 μm, the diameter of the thermal expansion microspheres is set to 20 to 40 μm, the shell of the thermal expansion microspheres is thermoplastic plastic, and alkane gas is sealed inside.

[0011] Furthermore, the optical adhesive film also includes a second optical adhesive layer arranged between the first optical adhesive layer and the optical film layer, the second optical adhesive layer uses acrylic optical adhesive as a base material, and inorganic or organic diffusion powder is mixed inside the acrylic optical adhesive, the mass percentage of the diffusion powder in the acrylic optical adhesive is 5 to 20wt%, and the particle size of the diffusion powder is 1.5 to 3μm.

[0012] Furthermore, the acrylic optical adhesive is mixed with diffusion powder that meets the mass percentage and particle size values.

[0013] Furthermore, the glass-based LED display panel also includes a bottom black ink layer arranged on the substrate surface and a carbon black layer arranged between the optical film layer and the second optical adhesive layer, and the first optical adhesive layer is attached to the bottom black ink layer.

[0014] Furthermore, the optical film layer is made of a polymer film, and the surface of the optical film layer is treated with AG or / and HC and has a glossiness of 60° ≤10%.

[0015] To achieve another object of the present invention, a method for preparing a glass-based LED display panel is provided, which is applied to the above-mentioned glass-based LED display panel and comprises the following steps:

[0016] S110: providing a glass substrate on which a conductive circuit and a plurality of light-emitting chips are arranged;

[0017] S130: preparing an optical adhesive film, which includes: S131: providing an optical film layer with a transmittance of 30-90%; S133: arranging a first optical adhesive layer including a thermal expansion material on a first side of the optical film layer;

[0018] S150: Adhere the first optical adhesive layer of the optical adhesive film to the substrate surface to cover the conductive circuits and the plurality of light-emitting chips arranged on the substrate surface.

[0019] Furthermore, step S132 is included between step S131 and step S133, and step S132 includes: coating a second optical adhesive layer on the optical film layer;

[0020] The S133 includes: coating the first optical adhesive layer on the second optical adhesive layer, so that the first optical adhesive layer is arranged on the first side of the optical film layer;

[0021] The S130 further includes: S135: when performing AG treatment on the surface of the optical film layer, coating a thermosetting anti-glare layer on the side of the optical film layer facing away from the first optical adhesive.

[0022] Furthermore, the step S132 also includes: first coating a carbon black layer on the optical film layer, and then coating a second optical adhesive layer on the carbon black layer.

[0023] The beneficial effects of the present invention are:

[0024] A glass-based LED display panel and a preparation method thereof, comprising: a glass substrate, comprising a substrate surface, on which a conductive circuit and a plurality of light-emitting chips are arranged; an optical adhesive film, comprising a stacked first optical adhesive layer and an optical film layer, wherein the first optical adhesive layer comprises different thermal expansion materials, and the different thermal expansion materials in the first optical adhesive layer can expand by heating the glass substrate at heating temperatures and heating times corresponding to different numerical ranges of the thermal expansion materials, thereby reducing the bonding force between the first optical adhesive layer and the substrate surface to the point where the two can be relatively peeled off; and the optical adhesive film is attached to the substrate surface through the first optical adhesive layer. In the present invention, when at least one light-emitting chip of a glass-based LED display panel fails and needs to be repaired, the glass substrate is heated to expand the thermal expansion material of the first optical adhesive layer, thereby reducing the bonding force between the first optical adhesive layer and the substrate surface to the point where the two can be relatively peeled off, thereby achieving repair of the glass-based LED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0026] Figure 1 A schematic diagram of the layer structure of an embodiment of a glass-based LED display panel provided by an embodiment of the present invention, omitting the thermosetting anti-glare layer;

[0027] Figure 2 This is another embodiment of the glass-based LED display panel provided by the embodiment of the present invention and the layer structure diagram of the glass substrate is omitted;

[0028] Figure 3 Schematic diagram of a process for preparing a glass-based LED display panel provided by an embodiment of the invention

[0029] Figure 4 A schematic diagram of a process flow diagram of a method for repairing a glass-based LED display panel provided by an embodiment of the invention. Description of reference numerals:

[0030] 1-glass substrate; 2-first optical adhesive layer; 3-second optical adhesive layer; 4-optical film layer; 5-thermosetting anti-glare layer; 6-thermal expansion material; 7-diffusion powder; 8-light-emitting chip. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other and are all within the protection scope of the present invention.

[0032] refer to Figure 1As an object of the present invention, a glass-based LED display panel is provided. In one embodiment, the glass-based LED display panel includes a glass substrate 1 and an optical adhesive film, and the optical adhesive film includes a stacked first optical adhesive layer 2 and an optical film layer 4. The optical adhesive film includes various adhesive layers and film layers located in the light emitting direction of the light-emitting chip and can be independently prepared by the following preparation method. Among them, the glass substrate 1 includes a substrate surface, on which a conductive circuit and a plurality of light-emitting chips 8 are arranged. The light-emitting chip 8 can specifically be a Mini LED or a Micro LED. The first optical adhesive layer 2 includes a thermal expansion material 6. It should be noted that the thermal expansion material 6 is uniformly distributed in the first optical adhesive layer 2. The optical film layer 4 has a transmittance of 30 to 90%. The first optical adhesive layer 2 is attached to the substrate surface so that the optical adhesive film is attached to the substrate surface, so that the optical film layer 4 is located on the side of the first optical adhesive layer 2 that is opposite to the substrate surface. It should be noted that the various layers of the optical adhesive film described herein can be directly or indirectly connected to each other when there is no conflict or impracticability. In addition, the first optical adhesive layer attached to the substrate surface includes directly attached to the substrate surface or indirectly attached to the substrate surface by attaching, for example, a bottom black ink layer on the substrate surface. Specifically, in this embodiment, the first optical adhesive layer 2 and the optical film layer 4 can be directly or indirectly disposed on the adjacent substrate surface and the side of the first optical adhesive layer 2, respectively. Therefore, the glass-based LED display panel of the present invention is configured to attach an optical adhesive film having a parallel stacked first optical adhesive layer 2 and an optical film layer 4 above the substrate surface of the glass substrate 1. On the one hand, since epoxy resin curing encapsulation is not used, it can prevent the unfavorable situation that the glass substrate 1 is broken due to the application of a large pressure during the molding process using epoxy resin in the prior art, and the glass substrate 1 will not be warped and broken due to the obvious shrinkage phenomenon of epoxy resin curing, thereby ensuring that the glass substrate 1 is not easy to break; on the other hand, since the first optical adhesive layer attached to the glass substrate 1 The adhesive layer 2 contains a thermal expansion material 6, so that if at least one light-emitting chip 8 of the glass-based LED display panel fails and needs to be repaired later, the glass substrate 1 is heated to expand the thermal expansion material 6, so that the bonding force between the first optical adhesive layer 2 and the substrate surface can be reduced to the point where the two can be relatively peeled off, thereby allowing the optical adhesive film to be relatively peeled off relative to the glass substrate. This avoids the unfavorable situation in which the glass substrate 1 is easily cracked due to force when the semi-cured adhesive film is torn off in traditional film packaging, resulting in the failure of the light-emitting chip 8 being unable to be repaired, thereby ensuring that the glass-based LED display panel is easy to repair later.

[0033] Specifically, the heat expansion material 6 includes at least one of vermiculite and heat expansion microspheres. The first optical adhesive layer 2 uses acrylic optical adhesive as a base material. In addition, inorganic or organic diffusion powder can be mixed in the acrylic optical adhesive to play a role in light uniformity. Vermiculite and / or heat expansion microspheres are mixed inside the acrylic optical adhesive. The vermiculite and / or heat expansion microspheres are evenly distributed in the acrylic optical adhesive. The diameter of the vermiculite is set to 20 to 100 μm, and the diameter of the heat expansion microspheres is set to 20 to 40 μm. Due to the characteristics of the vermiculite itself, when, for example, the glass substrate 1 is heated and heat is transferred to the first optical adhesive layer 2 to heat the vermiculite, its volume will expand. The shell of the heat expansion microsphere is a thermoplastic plastic, and an alkane gas is sealed inside. Similarly, when, for example, the glass substrate 1 is heated, the shell of the heat expansion microsphere becomes soft due to the heat, and the alkane gas inside expands due to the heat. Therefore, both vermiculite and heat-expandable microspheres can expand in volume when heated, thereby reducing or even eliminating the bonding force between the first optical adhesive layer 2 and the glass substrate 1, so that the first optical adhesive layer 2 can be separated from the glass substrate 1 while minimizing the risk of cracking of the glass substrate 1 due to uneven force.

[0034] Preferably, combined with reference Figure 2 , the optical adhesive film also includes a second optical adhesive layer 3 arranged between the first optical adhesive layer 2 and the optical film layer 4. It should be noted that the second optical adhesive layer 3 does not have the above-mentioned thermal expansion material 6, thereby preventing the glass substrate 1 from being heated and causing the thermal expansion material 6 in the second optical adhesive layer 3 to expand and apply force to press the first optical adhesive layer 2 against the glass substrate 1, resulting in the first optical adhesive layer 2 being difficult to separate from the glass substrate 1. The second optical adhesive layer 3 uses acrylic optical adhesive as a base material, and inorganic or organic diffusion powder 7 can be mixed inside the acrylic optical adhesive. The mass percentage of the diffusion powder 7 in the acrylic optical adhesive is 5 to 20wt%, and the particle size of the diffusion powder 7 is 1.5 to 3μm. By mixing the diffusion powder 7 that meets the mass percentage and particle size value inside the acrylic optical adhesive, for example, the RGB three-color Mini LED and MicroLED light can be homogenized, so that the light intensity of each monochromatic light at each angle remains relatively consistent.

[0035] The total thickness of the first optical adhesive layer 2 and the second optical adhesive layer 3 is 150 to 300 μm, the thickness of the first optical adhesive layer 2 is ≥40 μm and the thickness of the second optical adhesive layer 3 is >0 μm. After repeated experimental tests by the applicant, when the thickness of the first optical adhesive layer 2 and the second optical adhesive layer 3 meet the above-mentioned specific numerical range, the first optical adhesive layer 2 can be easily separated from the glass substrate 1 by the pulling force, and the two optical adhesive layers can be ensured to be separated from the glass substrate 1 together without being separated from each other.

[0036] Specifically, the glass-based LED display panel also includes, for example, an ink-colored base black ink layer (not shown) arranged on the substrate surface by laminating, and a carbon black layer (not shown) arranged between the optical film layer 4 and the second optical adhesive layer 3. In this way, by setting the base black ink layer, the ink color of the glass substrate 1 can be adjusted relatively directly, and by setting the carbon black layer, the ink color of the glass substrate 1 can be adjusted relatively indirectly.

[0037] Specifically, the optical film layer 4 uses a polymer film such as PET, PI, PC, etc., and different transmittances of 30 to 90% can be obtained by adding different pigments or pigment mass percentages in the optical film layer 4. The surface of the optical film layer 4 is treated with AG or / and HC and the 60° glossiness is ≤10%. When the surface of the optical film layer 4 is treated with AG or HC, a thermosetting anti-glare layer or a hardness-enhancing layer can be obtained on the side of the optical film layer 4 facing away from the first optical adhesive layer 2. Moreover, when the surface of the optical film layer 4 is treated with AG and HC at the same time, a hardness-enhancing layer and a thermosetting anti-glare layer can be obtained on the optical film layer 4 in sequence, and the thermosetting anti-glare layer is located at the outermost layer. In this way, the surface hardness of the optical film layer 4 can be improved, the surface glossiness can be adjusted, and the glossiness can be controlled.

[0038] As another object of the present invention, in combination with reference 3, the present invention further provides a method for preparing a glass-based LED display panel. In the absence of conflict, the preparation method described below is applied to the above glass-based LED display panel embodiments, and the relevant repeated contents are not repeated here. The preparation method comprises the following steps:

[0039] S110: Provide a glass substrate 1 on which conductive circuits and a plurality of light-emitting chips 8 are arranged.

[0040] S130: preparing an optical adhesive film, which includes: S131: providing an optical film layer 4 with a transmittance of 30-90%; S133: arranging a first optical adhesive layer 2 including a thermal expansion material on a first side of the optical film layer 4;

[0041] Specifically, the optical film layer 4 is used as a substrate, and the first optical adhesive layer 2 can be arranged on the first side of the optical film layer 4 by directly coating on the first side of the optical film layer 4 or indirectly coating on the second optical adhesive layer 3 (further detailed description will be given below) located on the first side of the optical film layer 4. By using an optical film layer 4 with a transmittance of 30 to 90%, an optical film layer 4 with a suitable transmittance can be selected according to actual needs to adapt to light-emitting chips 8 with different luminous colors or luminous brightness. It is known that there is no sequential relationship between S110 and S130. In addition, in the present invention, the sequence numbers of each step are only an exemplary preparation or maintenance sequence. In the absence of conflict, each step can be selectively combined and the sequence can be adjusted. It can be understood that the first optical adhesive layer 2 can be directly attached to the substrate surface or attached to the bottom black ink layer located on the substrate surface. The thermal expansion material 6 in the first optical adhesive layer 2 can provide an expansion force to reduce the bonding force between the first optical adhesive layer 2 and the glass substrate 1 when the glass substrate 1 is heated, which not only facilitates the separation of the first optical adhesive layer 2 and the optical adhesive film as a whole from the glass substrate 1, but also minimizes the cracks of the glass substrate 1.

[0042] S150: Adhere the first optical adhesive layer 2 of the optical adhesive film to the substrate surface to cover the conductive circuits and multiple light-emitting chips arranged on the substrate surface.

[0043] By using the method for preparing a glass-based LED display panel of the present invention, the glass-based LED display panel of the present invention can be obtained, so that the glass-based LED display panel directly obtained by the preparation method also has the above-mentioned beneficial technical effects. In addition, the preparation method also has the advantages of strong operability and compact steps and processes.

[0044] Preferably, the preparation method further comprises:

[0045] Step S132 is included between step S131 and step S133. Step S132 includes: coating a second optical adhesive layer 3 on the optical film layer 4;

[0046] In addition, step S132 may have another implementation method, which includes: first coating a carbon black layer on the optical film layer 4, and then coating a second optical adhesive layer on the carbon black layer.

[0047] S133 includes: coating the first optical adhesive layer 2 on the second optical adhesive layer 3, so that the first optical adhesive layer 2 is arranged on the first side of the optical film layer 4;

[0048] Step S130 includes: S135: performing AG treatment or / and HC treatment on the surface of the optical film layer 4;

[0049] Specifically, when the surface of the optical film layer 4 is subjected to AG treatment, a thermosetting anti-glare layer 5 can be coated on the side of the optical film layer 4 facing away from the first optical adhesive layer 2. Therefore, the arrangement of the thermosetting anti-glare layer 5 can change the light direction of the light-emitting chip 8 by, for example, diffuse reflection, thereby achieving an anti-glare effect, avoiding flash points and blooming on the glass-based LED display panel, and ensuring the high quality of the glass-based LED display panel.

[0050] In addition, the above step S150 may have another implementation, which includes: first coating a bottom black ink layer on the substrate surface, and then attaching the first optical adhesive layer 2 to the bottom black ink layer to cover the conductive circuits and multiple light-emitting chips arranged on the substrate surface.

[0051] As described above, as a further improvement on the preparation method of the glass-based LED display panel, corresponding steps are taken to correspondingly obtain at least one of the second optical adhesive layer 3, the carbon black layer, the bottom black ink layer, the thermosetting anti-glare layer and the hardness enhancement layer, so that the prepared glass-based LED display panel can obtain the beneficial effects of the corresponding layer. For details, please refer to the previous text and will not be repeated here.

[0052] As another object of the present invention, in conjunction with reference Figure 4 The present invention also provides a method for repairing a glass-based LED display panel. In the absence of conflicts, the repair method described below is applied to the glass-based LED display panels of the above glass-based LED display panel embodiments and the glass-based LED display panels prepared by the above preparation method embodiments. The repetitive contents are not repeated here. Since it is difficult to avoid the glass-based LED display panel needing repair due to a faulty light-emitting chip 8, when there is at least one faulty light-emitting chip 8 that cannot work properly among the multiple light-emitting chips 8, the repair method includes the following steps:

[0053] S210: heating the glass substrate 1 to expand the heat-expandable material 6 in the first optical adhesive layer 2 of the optical adhesive film until the bonding force between the first optical adhesive layer 2 and the substrate surface is reduced to the point where the two can be relatively peeled off. The specific method of heating the glass substrate 1 may be to heat the packaging surface side, i.e., the light emitting surface side, using a heating platform or an oven;

[0054] S220: peeling the first optical adhesive layer 2 and the optical film layer 4 together from the glass substrate 1;

[0055] S230: taking out the faulty light emitting chip and replacing it with a new light emitting chip 8 by, for example, using SMT technology;

[0056] S240: attaching a new optical adhesive film on the substrate surface;

[0057] It is known that the optical adhesive film in step S240 can refer to the relevant description of the preparation method of the optical adhesive film mentioned above, which will not be repeated here. In addition, the maintenance method of the present invention can also be based on actual needs. After replacing and installing the new light-emitting chip 8, according to the actual needs of display effect, light output intensity, etc., the relevant steps in the above-mentioned preparation method embodiments of the optical adhesive film can be used to obtain an optical adhesive film including a first optical adhesive layer and an optical film layer, and further including at least one of the second optical adhesive layer 3, a carbon black layer, a thermosetting anti-glare layer and a hardness improvement layer. Accordingly, regardless of any type of optical adhesive film that the glass-based LED display panel has before maintenance, the heat expansion material 6 in the first optical adhesive layer 2 can be expanded by heating the glass substrate 1, so that the bonding force between the first optical adhesive layer 2 and the substrate surface can be reduced to the point where various optical adhesive films can be relatively peeled off relative to the glass substrate, thereby ensuring that the glass-based LED display panel is reliably repaired.

[0058] In summary, the repair method of the glass-based LED display panel of the present invention heats the glass substrate 1 to expand the thermal expansion material 6 in the first optical adhesive layer 2 of the optical film layer, so that the bonding force between the first optical adhesive layer 2 and the substrate surface can be reduced to the point where the two can be relatively peeled off, thereby replacing the faulty light-emitting chip 8 with a new light-emitting chip 8 without causing the glass substrate 1 to crack due to stress, thereby achieving the purpose of easily repairing the glass-based LED display panel.

[0059] Preferably, heating the glass substrate 1 in step S210 includes: when the thermal expansion material 6 in the first optical adhesive layer 2 is vermiculite, heating is performed at a heating temperature of 150 to 300° C. and a heating time of 10 to 15 minutes; when the thermal expansion material 6 in the first optical adhesive layer 2 is thermal expansion microspheres, heating is performed at a heating temperature of 120 to 180° C. and a heating time of 10 to 15 minutes; when the thermal expansion material 6 in the first optical adhesive layer 2 is a mixture of vermiculite and thermal expansion microspheres, heating is performed at a heating temperature of 150 to 180° C. and a heating time of 10 to 15 minutes. Through repeated experimental tests by the applicant, the above-mentioned numerical range is adopted for the heating temperature and heating time of the heating according to the different thermal expansion materials in the first optical adhesive layer 2. In particular, when the first optical adhesive layer contains both vermiculite and thermal expansion microspheres, 150-300°C and 120-180°C are intersected to obtain 150-180°C, and different suitable temperatures are selected from 150-180°C according to the different proportions of vermiculite and thermal expansion microspheres in the first optical adhesive layer. In addition, the suitable temperature and the specific values ​​of the above-mentioned heating temperatures and heating times can be obtained based on the numerical range obtained by the present invention and experimental means known to those skilled in the art. Therefore, when the corresponding heating temperature and heating time are adopted, the glass substrate 1 can be prevented from being overheated and damaged, and it can also ensure that substantially all the thermal expansion materials 6 in the first optical adhesive layer 2 are expanded, thereby sufficiently reducing the bonding force between the first optical adhesive layer 2 and the substrate surface or / and the bottom black ink layer coated on the substrate surface, thereby facilitating their relative peeling.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Glass-based LED display panel, characterized in that: include: A glass substrate, comprising a substrate surface, on which a conductive circuit and a plurality of light-emitting chips are arranged; An optical adhesive film, comprising a stacked first optical adhesive layer and an optical film layer, wherein the first optical adhesive layer comprises different heat expansion materials, and the different heat expansion materials in the first optical adhesive layer can expand by heating the glass substrate at heating temperatures and heating times in different numerical ranges corresponding to the heat expansion materials, thereby reducing the bonding force between the first optical adhesive layer and the substrate surface to the extent that the two can be relatively peeled off; The optical adhesive film is adhered to the substrate surface through the first optical adhesive layer.

2. The glass-based LED display panel according to claim 1, characterized in that: The light-emitting chip is Mini LED or Micro LED.

3. The glass-based LED display panel according to claim 1, characterized in that: The thermal expansion material includes at least one of vermiculite and thermal expansion microspheres. The first optical adhesive layer uses acrylic optical adhesive as a substrate. Vermiculite and / or thermal expansion microspheres are mixed inside the acrylic optical adhesive. The diameter of the vermiculite is set to 20 to 100 μm, and the diameter of the thermal expansion microspheres is set to 20 to 40 μm. The shell of the thermal expansion microspheres is thermoplastic plastic and alkane gas is sealed inside.

4. The glass-based LED display panel according to claim 1, characterized in that: The optical adhesive film also includes a second optical adhesive layer arranged between the first optical adhesive layer and the optical film layer. The second optical adhesive layer uses acrylic optical adhesive as a base material, and inorganic or organic diffusion powder is mixed inside the acrylic optical adhesive. The mass percentage of the diffusion powder in the acrylic optical adhesive is 5 to 20wt%, and the particle size of the diffusion powder is 1.5 to 3μm.

5. The glass-based LED display panel according to claim 4, characterized in that: The acrylic optical adhesive is mixed with diffusion powder that meets the mass percentage and particle size values.

6. The glass-based LED display panel according to claim 4, characterized in that: The glass-based LED display panel further includes a bottom black ink layer arranged on the substrate surface and a carbon black layer arranged between the optical film layer and the second optical adhesive layer, and the first optical adhesive layer is attached to the bottom black ink layer.

7. The glass-based LED display panel according to claim 1, characterized in that: The optical film layer is made of a polymer film, the surface of the optical film layer is treated with AG or / and HC, and the glossiness at 60° is ≤10%.

8. A method for preparing a glass-based LED display panel, applied to the glass-based LED display panel according to any one of claims 1 to 7, characterized in that: The steps include: S110: providing a glass substrate on which a conductive circuit and a plurality of light-emitting chips are arranged; S130: preparing an optical adhesive film, which includes: S131: providing an optical film layer with a transmittance of 30-90%; S133: arranging a first optical adhesive layer including a thermal expansion material on a first side of the optical film layer; S150: Adhere the first optical adhesive layer of the optical adhesive film to the substrate surface to cover the conductive circuits and the plurality of light-emitting chips arranged on the substrate surface.

9. The method for preparing a glass-based LED display panel according to claim 8, characterized in that: Step S132 is included between step S131 and step S133, and step S132 includes: coating a second optical adhesive layer on the optical film layer; The S133 includes: coating the first optical adhesive layer on the second optical adhesive layer, so that the first optical adhesive layer is arranged on the first side of the optical film layer; The S130 further includes: S135: when performing AG treatment on the surface of the optical film layer, coating a thermosetting anti-glare layer on the side of the optical film layer facing away from the first optical adhesive.

10. The method for preparing a glass-based LED display panel according to claim 9, characterized in that: The step S132 further includes: first coating a carbon black layer on the optical film layer, and then coating a second optical adhesive layer on the carbon black layer.

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