Chip transfer method and display panel

Abstract

The invention belongs to the technical field of display, and particularly relates to a chip transfer method and a display panel, and the chip transfer method comprises the steps: providing N different types of magnetic chip transfer bodies and a driving substrate, forming a transfer layer on the driving substrate, the transfer layer comprises N different types of alignment grooves, the alignment grooves of different types are used for being correspondingly matched with the chip transfer bodies of different types, and the corresponding matching relation between the alignment grooves and the chip transfer bodies is that the chip transfer bodies are in one-to-one correspondence with the alignment grooves, and at least half of the chip transfer bodies are embedded into the alignment grooves. According to the invention, the chip transfer body is arranged at the edge of the driving substrate or the transfer layer, and the first magnetic field is applied to the chip transfer body to drive the chip transfer body to move to the alignment groove correspondingly matched with the chip transfer body, so that the complex process of point-to-point accurate alignment between the chip transfer body and the alignment groove is avoided; the transfer difficulty of the chip transfer body is reduced, and the transfer yield and the transfer efficiency of the chip transfer body are improved.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a chip transfer method and a display panel. Background Art

[0002] At present, in the field of display technology, it is necessary to grow a type of light-emitting chip on a growth substrate, and then align the growth substrate with the light-emitting chip and the driving substrate to realize the transfer of a type of light-emitting chip. When the growth substrate is used to transfer the light-emitting chip, the transfer of the light-emitting chip is subject to the production of the light-emitting chip, and the production transfer needs to be carried out continuously, resulting in low transfer efficiency. And in the transfer process, the light-emitting chip and the alignment groove on the driving substrate for accommodating the light-emitting chip need to be precisely positioned point to point, which has the problems of high difficulty in alignment, low transfer efficiency, and low transfer yield. In addition, when transferring multiple types of light-emitting chips, different types of light-emitting chips grown on different growth substrates need to be transferred in batches, so that the driving substrate needs to be precisely positioned with different growth substrates for multiple times, which will further reduce the transfer efficiency of the light-emitting chip. Summary of the invention

[0003] The purpose of the present application is to provide a chip transfer method and a display panel, which can control the transfer of a chip transfer body through a magnetic field to increase the transfer rate of the chip transfer body.

[0004] The present disclosure provides a chip transfer method, the chip transfer method comprising:

[0005] Providing N different types of chip transfer bodies all having magnetic properties, wherein N is a positive integer greater than or equal to 2;

[0006] A driving substrate is provided, and a transfer layer is formed on the driving substrate, wherein the transfer layer comprises N different types of alignment grooves arranged in a horizontal direction, wherein the cross-sectional areas of the alignment grooves of different types are different and are used to correspond to and match the chip transfer bodies of different types, and the corresponding matching relationship between the alignment grooves and the chip transfer bodies is that the chip transfer bodies correspond to the alignment grooves one by one, and at least half of the chip transfer bodies are embedded in the alignment grooves;

[0007] Placing the chip transfer body at the edge of the driving substrate or at the edge of the transfer layer, and applying a first magnetic field to the chip transfer body to drive the chip transfer body to move to a corresponding alignment groove;

[0008] After the chip transfer body moves to the corresponding alignment groove, the chip transfer body is processed to be bound with the driving substrate.

[0009] In an exemplary embodiment of the present disclosure, different types of chip transfer bodies have different masses, wherein the mass of the chip transfer body is positively correlated with the cross-sectional area of ​​the alignment groove that matches the chip transfer body.

[0010] In an exemplary embodiment of the present disclosure, each of the alignment grooves is filled with a transfer liquid, and the density of the transfer liquid is less than the density of each type of the chip transfer body, wherein when the chip transfer body moves to the corresponding matching alignment groove, at least half of the height of the chip transfer body sinks into the transfer liquid.

[0011] In an exemplary embodiment of the present disclosure, the chip transfer body comprises a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; wherein,

[0012] After all the chip transfer bodies move to the corresponding alignment grooves, and before each chip transfer body is processed to be bound to the driving substrate, the chip transfer method further includes: removing the transfer liquid in each alignment groove;

[0013] The step of processing the chip transfer body to bind it to the driving substrate includes: removing the protective layer wrapping the light-emitting chip in each chip transfer body, and then binding the light-emitting chip to the driving substrate.

[0014] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, different types of chip transfer bodies have different sphere diameters, and the mass of the chip transfer body is positively correlated with the sphere diameter, wherein the chip transfer method includes:

[0015] Different types of chip transfer bodies are placed simultaneously on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to all the chip transfer bodies simultaneously to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

[0016] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and the sphere diameters of different types of chip transfer bodies are the same; wherein the chip transfer method comprises:

[0017] First, all the n-th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n-th type chip transfer bodies to drive the n-th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves;

[0018] Then, all the n+1th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves;

[0019] The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

[0020] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and different types of chip transfer bodies have different sphere diameters, wherein the transfer layer is a flat layer that covers the entire surface of the drive substrate, and the chip transfer method includes:

[0021] Firstly, all the n-th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n-th type chip transfer bodies to drive the n-th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves;

[0022] Then, all the n+1th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding alignment grooves;

[0023] The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

[0024] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and different types of chip transfer bodies have different sphere diameters;

[0025] The transfer layer includes N different types of transfer structures that are arranged at intervals in the horizontal direction, each type of the transfer structure correspondingly opens a type of alignment groove, and the outer side surface of each transfer structure is inclined inward from bottom to top;

[0026] The cross-sectional area of ​​the alignment groove is positively correlated with the ball diameter of the chip transfer body that matches it, and the inclination angle of the outer side surface of the transfer structure is positively correlated with the cross-sectional area of ​​the alignment groove formed correspondingly thereto.

[0027] In an exemplary embodiment of the present disclosure, in different types of transfer structures: the horizontal widths of the orthographic projections of the outer side surfaces on the driving substrate are equal, and the vertical heights of the outer side surfaces are unequal; and / or

[0028] The inclination angle of the outer side surface of the transfer structure is less than or equal to 60°; and / or

[0029] The chip transfer method includes: placing different types of chip transfer bodies at the edge of the driving substrate at the same time, and applying a first magnetic field to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

[0030] In an exemplary embodiment of the present disclosure, the chip transfer body includes a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer;

[0031] The alignment groove includes a first groove and a second groove arranged in a vertical direction and connected, the second groove is located on a side of the first groove close to the driving substrate, the first groove is used to accommodate a chip transfer body corresponding to it, the orthographic projection of the end surface of the second groove away from the first groove on the driving substrate is located within the orthographic projection of the first groove on the driving substrate, and is used to accommodate the light-emitting chip with the protective layer removed; wherein,

[0032] The inner wall of the second groove is a vertical wall perpendicular to the driving substrate; or

[0033] The inner wall of the second groove is an inclined surface inclined relative to the vertical direction, and the inclined surface extends from bottom to top in a direction away from the center of the second groove.

[0034] In an exemplary embodiment of the present disclosure, the chip transfer body includes a light-emitting chip and a protective layer, and the light-emitting chip is wrapped in the protective layer; the step of processing the chip transfer body to be bound to the driving substrate includes:

[0035] Determining the positional relationship between the binding end surface of the light-emitting chip in the chip transfer body and the driving substrate;

[0036] When it is determined that the binding end surface of the light-emitting chip in the chip transfer body is in a non-corresponding matching relationship with the driving substrate, a second magnetic field is applied to the chip transfer body to drive the chip transfer body to rotate so that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate;

[0037] After determining that the binding end surface of the light-emitting chip in the chip transfer body is in a corresponding matching relationship with the driving substrate, removing the protective layer so that the light-emitting chip falls onto the driving substrate so that the binding end surface fits the driving substrate;

[0038] The condition that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate is that the binding end surface of the light-emitting chip in the chip transfer body is close to the driving substrate and parallel to the driving substrate.

[0039] The present disclosure provides a display panel, the display panel comprising at least:

[0040] Driver substrate;

[0041] A transfer layer is disposed on the driving substrate, wherein the transfer layer includes N different types of alignment grooves arranged in a horizontal direction, and the cross-sectional areas of the alignment grooves of different types are different;

[0042] At least N different types of chip transfer bodies all having magnetism, the chip transfer bodies corresponding to the alignment grooves one by one, the chip transfer bodies are transferred to the corresponding alignment grooves by the chip transfer method as described above, and are bound to the drive substrate.

[0043] This application scheme has the following beneficial effects:

[0044] The present disclosure forms a plurality of different types of alignment grooves on a driving substrate, and one type of alignment groove corresponds one-to-one to one type of chip transfer body. After the chip transfer body is placed on the edge of the driving substrate or the transfer layer, a first magnetic field is applied to the chip transfer body to move the chip transfer body to the corresponding matching alignment groove. The present disclosure utilizes the one-to-one correspondence between the chip transfer body and the alignment groove to improve the accuracy of the chip transfer body transfer. In addition, the present disclosure utilizes the first magnetic field to drive various types of chip transfer bodies to the corresponding matching alignment grooves, avoiding the complex process of accurately aligning the chip transfer body with the alignment groove point to point, reducing the difficulty of transferring the chip transfer body, and improving the transfer yield and transfer efficiency of the chip transfer body.

[0045] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0046] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0048] Figure 1 Schematic diagram of the chip transfer method in the embodiment of the present disclosure.

[0049] Figure 2It is a schematic diagram of the cross-sectional structure of the chip transfer body in the embodiment of the present disclosure.

[0050] Figure 3 A schematic diagram of a top view of the display panel in an embodiment of the present disclosure.

[0051] Figure 3a for Figure 3 Flow chart for making the driving layer and transfer layer.

[0052] Figure 3b In the embodiment of the present disclosure, the chip transfer body is placed Figure 3 Schematic diagram of the structure on the transfer layer in .

[0053] Figure 3c It is a schematic cross-sectional structure diagram of adjusting the binding end face of the light-emitting chip to be in a corresponding matching relationship with the driving substrate in the embodiment of the present disclosure.

[0054] Figure 3d To remove Figure 3c Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0055] Figure 4 FIG. 4 is another schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present disclosure.

[0056] Figure 4a for Figure 4 Flow chart for making the driving layer and transfer layer.

[0057] Figure 4b In the embodiment of the present disclosure, the chip transfer body is placed Figure 4 Schematic diagram of the structure on the transfer layer in .

[0058] Figure 4c It is another cross-sectional structural schematic diagram of adjusting the binding end surface of the light-emitting chip to be in a corresponding matching relationship with the driving substrate in the embodiment of the present disclosure.

[0059] Figure 4d To remove Figure 4c Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0060] Figure 4e It is a schematic diagram of a cross-sectional structure of the alignment groove in the embodiment of the present disclosure.

[0061] Figure 4f To remove Figure 4e Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0062] Figure 4g Another schematic diagram of the cross-sectional structure of the alignment groove in the embodiment of the present disclosure.

[0063] Figure 5Schematic diagram of the cross-sectional structure of three different types of chip transfer bodies in the embodiments of the present disclosure.

[0064] Figure 6 It is a schematic cross-sectional structure diagram of the height of the transfer liquid discharged when the same chip transfer body is transferred to two different alignment grooves in the embodiment of the present disclosure.

[0065] Figure 7 It is a schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D1 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0066] Figure 8 It is a schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D2 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0067] Fig. 9 It is a schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D3 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0068] Fig.10 It is a schematic diagram of the top view of the structure when each alignment groove is filled with transfer liquid in the embodiment of the present disclosure.

[0069] Fig.10a for Fig.10 Schematic diagram of the cross-sectional structure at AA'.

[0070] Fig.10b for Fig.10 A schematic diagram of the cross-sectional structure when corresponding matching chip transfer bodies are embedded in different types of alignment grooves.

[0071] Fig.10c For the general Fig.10b A schematic cross-sectional structure diagram showing that the binding end face of the light-emitting chip is adjusted to be in a corresponding matching relationship with the driving substrate.

[0072] Fig.10d For the general Fig.10c Schematic diagram of the cross-sectional structure after the transfer liquid is removed.

[0073] Fig.10e To remove Fig.10d Schematic diagram of the cross-sectional structure after the protective layer.

[0074] Fig.11 Schematic diagram of the cross-sectional structure of three different types of transfer structures in the embodiments of the present disclosure.

[0075] Description of reference numerals:

[0076] 1. Display panel;

[0077] 11. driving substrate; 111. substrate; 112. driving layer;

[0078] 12, transfer layer; 121, alignment groove; 1211, first groove; 1212, second groove; 122, transfer structure; 122a, transfer material;

[0079] 13. chip transfer body; 131. light emitting chip; 1311. main body; 1312. connecting electrode; 132. protective layer;

[0080] 14. Transfer fluid;

[0081] X, horizontal direction. DETAILED DESCRIPTION

[0082] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concept of the example embodiments to those skilled in the art.

[0083] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0084] The present disclosure is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be understood as limiting the present disclosure.

[0085] Combination Figures 1 to 3b As shown, the present disclosure provides a chip transfer method, the chip transfer method comprising:

[0086] S1. Provide N different types of chip transfer bodies 13 all having magnetic properties, wherein N is a positive integer greater than or equal to 2.

[0087] S2. Provide a driving substrate 11, and form a transfer layer 12 on the driving substrate 11, the transfer layer 12 includes N different types of alignment grooves 121 arranged in the horizontal direction X, the cross-sectional areas of the different types of alignment grooves 121 are different, and are used to correspond to and match different types of chip transfer bodies 13, the corresponding matching relationship between the alignment grooves 121 and the chip transfer bodies 13 is: the chip transfer bodies 13 correspond to the alignment grooves 121 one by one, and at least half of the chip transfer bodies 13 are embedded in the alignment grooves 121.

[0088] S3, placing the chip transfer body 13 at the edge of the driving substrate 11 or at the edge of the transfer layer 12, and applying a first magnetic field to the chip transfer body 13 to drive the chip transfer body 13 to move to the corresponding alignment groove 121.

[0089] S4 , after the chip transfer body 13 moves to the corresponding alignment groove 121 , the chip transfer body 13 is processed to be bound with the driving substrate 11 .

[0090] It should be noted that if Figure 2 As shown, the chip transfer body 13 in the embodiment of the present disclosure may include a light emitting chip 131 and a protective layer 132, and the light emitting chip 131 is wrapped in the protective layer 132. The light emitting chip 131 may include a main body 1311 and a connecting electrode 1312. The connecting electrode 1312 has magnetic conductivity, and the movement of the light emitting chip 131 can be controlled by applying a magnetic field to the chip transfer body 13. In addition, the connecting electrode 1312 also has electrical conductivity, so that current can be obtained through the connecting electrode 1312 to make the light emitting chip 131 emit light.

[0091] Specifically, the method for forming the chip transfer body 13 may be: placing different types of light-emitting chips 131 to be transferred in a specific liquid, mixing to form a suspension, and using microfluidics technology to solidify or gel the liquid that wraps the light-emitting chip 131 to form a protective layer 132 that wraps the light-emitting chip 131. The chip transfer body 13 after solidification may be a sphere, but is not limited thereto, and the chip transfer body 13 may also be other shapes besides a sphere, depending on actual conditions.

[0092] The specific liquid forming the protective layer 132 can be a liquid with EUV (photolithography) curing or a microfluidic liquid. For example, the specific liquid forming the protective layer 132 in the embodiment of the present disclosure can be formed by gelation or curing of sodium alginate and calcium ions. However, it is not limited to this. The scheme of using other specific liquids other than sodium alginate and calcium ions that will not corrode and cause chip failure to form the protective layer 132 can be included in the embodiment of the present disclosure.

[0093] When the light emitting chip 131 is placed in a specific liquid, a physical method can be used to lower the temperature to below the solidification temperature of the liquid to solidify the liquid. The temperature at which the liquid solidifies will not damage the chip. The embodiment of the present disclosure can protect the light emitting chip 131 by providing a protective layer 132, so as to reduce or avoid the light emitting chip 131 from being damaged and having bad spots during the transfer process, thereby reducing the probability of repairing the light emitting chip 131.

[0094] like Figure 3 As shown in FIG. 4 , in the embodiment of the present disclosure, the driving substrate 11 may include a substrate 111 and a driving layer 112 .

[0095] Specifically, Figure 3a As shown in FIG4 a , a layer of metal material may be coated on the substrate 111 to form a driving layer 112 .

[0096] Furthermore, a layer of transfer material 122a may be coated on the side of the driving layer 112 facing away from the substrate 111 to form a transfer layer 12. The transfer layer 12 is exposed and developed to form N different types of alignment grooves 121 arranged in the horizontal direction X.

[0097] It should be noted that the horizontal direction X refers to the extending direction of the transfer layer 12 .

[0098] The driving layer 112 may include a plurality of driving electrodes, and the driving electrodes correspond to the alignment grooves 121 one by one, and the orthographic projection of the driving electrodes on the transfer layer 12 is located in the alignment grooves 121. Parts of the driving electrodes connected to the connecting electrodes 1312 may be exposed in the alignment grooves 121, and the light-emitting chip 131 obtains voltage from the driving electrodes through the connecting electrodes 1312 to emit light.

[0099] In the disclosed embodiment, the arrangement of different types of alignment grooves 121 on the transfer layer 12 can be: the same type of alignment grooves 121 are arranged at intervals in the column direction, and different types of alignment grooves 121 are arranged at intervals in the row direction. However, it is not limited thereto, and different types of alignment grooves 121 can be arranged regularly or irregularly on the transfer layer 12 according to actual conditions. Among them, one type of alignment groove 121 can only correspond to and match one type of chip transfer body 13 to be transferred, and one alignment groove 121 can only correspond to and match one chip transfer body 13.

[0100] In the present disclosure, the transfer material 122a forming the transfer layer 12 may include a light-shielding material such as a black resin, so that the transfer layer 12 may have a light-shielding property. When the light-emitting chip 131 is working, the transfer layer 12 may block the light irradiated from one light-emitting chip 131 to another light-emitting chip 131, thereby improving or avoiding the light mixing between two adjacent light-emitting chips 131.

[0101] like Figure 3b to Figure 4b As shown, after the transfer layer 12 is formed and the chip transfer body 13 is placed on the edge of the drive substrate 11 or on the edge of the transfer layer 12, a first magnetic field is applied to the chip transfer body 13. The first magnetic field may be a magnetic field in the horizontal direction X, and all the chip transfer bodies 13 placed on the edge of the drive substrate 11 or on the edge of the transfer layer 12 are magnetic and can move under the action of the first magnetic field until the chip transfer body 13 is embedded in the corresponding matching alignment groove 121.

[0102] It should be noted that after the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, at least half of the height of the chip transfer body 13 is embedded in the corresponding matching alignment groove 121. Due to the limitation of the groove side wall of the alignment groove 121, the chip transfer body 13 embedded in the corresponding matching alignment groove 121 can no longer be separated from the alignment groove 121 under the drive of the first magnetic field, and continue to move on the transfer layer 12, that is: after the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, the chip transfer body 13 continues to stay in the alignment groove 121 under the action of the first magnetic field. Correspondingly, under the action of the first magnetic field, the chip transfer body 13 that is not embedded in the corresponding matching alignment groove 121 will continue to move on the transfer layer 12.

[0103] The chip transfer method in the embodiment of the present disclosure can completely distinguish the production and transfer of the light-emitting chip 131, thereby realizing large-scale parallel assembly. In addition, during the transfer process, the protective layer 132 can protect the light-emitting chip 131 to reduce or avoid the damage to the light-emitting chip 131 caused by collision, thereby reducing the probability of repairing the light-emitting chip 131. The present disclosure sets different types of alignment grooves 121 corresponding to different types of chip transfer bodies 13. One type of alignment groove 121 can only be matched with one type of chip transfer body 13. At the same time, the chip transfer body 13 is driven into the corresponding matching alignment groove 121 by using the first magnetic field, thereby avoiding the need to perform point-to-point precise alignment between the light-emitting chip 131 and the alignment groove 121 in the traditional chip transfer process to realize the complex process of transferring the light-emitting chip 131, reducing the transfer difficulty of the light-emitting chip 131, and improving the transfer yield of the light-emitting chip 131 and the transfer efficiency of the light-emitting chip 131.

[0104] In order to improve the transfer efficiency of the light-emitting chip 131, the number of chip transfer bodies 13 placed on the transfer layer 12 in the present disclosure can be greater than the number of corresponding matching alignment grooves 121, so that the time for embedding the corresponding matching chip transfer bodies 13 in various types of alignment grooves 121 can be shortened. After the corresponding matching chip transfer bodies 13 are embedded in each alignment groove 121 on the transfer layer 12, some chip transfer bodies 13 fail to embed in the corresponding matching alignment grooves 121. At this time, the first magnetic field can be applied to the chip transfer bodies 13 again to remove the chip transfer bodies 13 that are not embedded in the corresponding matching alignment grooves 121 from the transfer layer 12. However, it is not limited to this. The number of chip transfer bodies 13 placed on the transfer layer 12 in the present disclosure can also be equal to the number of corresponding matching alignment grooves 121, which can be determined according to actual conditions.

[0105] like Figures 3c to 4c As shown, in the embodiment of the present disclosure, the step of processing the chip transfer body 13 in step S3 to bind it to the driving substrate 11 may include: determining the positional relationship between the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11. When it is determined that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a non-corresponding matching relationship, a second magnetic field is applied to the chip transfer body 13 to drive the chip transfer body 13 to rotate, so that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a matching relationship. After determining that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a corresponding matching relationship, the protective layer 132 is removed so that the light-emitting chip 131 falls on the driving substrate 11 so that the binding end face fits the driving substrate 11.

[0106] It should be noted that the binding end face of the light emitting chip 131 mentioned above refers to a side of the light emitting chip 131 that is in direct contact with the driving substrate 11. Specifically, the binding end face of the light emitting chip 131 may be an end face where the connecting electrode 1312 in the light emitting chip 131 is connected to the corresponding driving electrode in the driving layer 112.

[0107] The condition for the corresponding matching relationship between the binding end face of the light emitting chip 131 and the driving substrate 11 is that the binding end face of the light emitting chip 131 in the chip transfer body 13 is close to the driving substrate 11 and parallel to the driving substrate 11. By making the binding end face of the light emitting chip 131 and the driving substrate 11 in a corresponding matching relationship, the connection between the connecting electrode 1312 and the driving substrate 11 can be facilitated after removing the protective layer 132.

[0108] The second magnetic field in the embodiment of the present disclosure can be a magnetic field in the horizontal direction X or in the vertical direction, which can be determined according to the actual situation. Under the drive of the second magnetic field, the light emitting chip 131 in the chip transfer body 13 can achieve angle adjustment until the binding end surface of the light emitting chip 131 is in a corresponding matching relationship with the driving substrate 11.

[0109] It should be noted that when the chip transfer body 13 is located in the corresponding matching alignment groove 121, there may be a certain distance between the light emitting chip 131 in the chip transfer body 13 and the bottom of the alignment groove 121, such as Figure 3d to Figure 4d As shown, after removing the protective layer 132, the light emitting chip 131 falls to the bottom of the groove due to gravity to be bound to the driving layer 112 at the bottom of the groove. The position of the light emitting chip 131 may be offset during the falling process, resulting in the connection electrode 1312 deviating from the driving electrode when the light emitting chip 131 falls to the bottom of the groove, which in turn causes the light emitting chip 131 to be unable to be bound to the driving substrate 11.

[0110] To solve the above problems, the alignment groove 121 in the embodiment of the present disclosure may include a first groove 1211 and a second groove 1212, the first groove 1211 is connected to the second groove 1212, and the second groove 1212 is located on a side of the first groove 1211 close to the drive substrate 11. The first groove 1211 is used to accommodate the chip transfer body 13 corresponding to it.

[0111] Specifically, when the chip transfer body 13 is located in the corresponding matching alignment groove 121, the orthographic projection of the chip transfer body 13 on the driving substrate 11 can be located within the orthographic projection of the first groove 1211 on the driving substrate 11. However, it is not limited thereto, when the chip transfer body 13 is located in the corresponding matching alignment groove 121, the orthographic projection of the chip transfer body 13 on the driving substrate 11 can also coincide with the orthographic projection of the first groove 1211 on the driving substrate 11, which can be determined according to actual conditions.

[0112] The orthographic projection of the end surface of the second groove 1212 away from the first groove 1211 on the driving substrate 11 is located within the orthographic projection of the first groove 1211 on the driving substrate 11. The second groove 1212 is used to accommodate the light-emitting chip 131 with the protective layer 132 removed. That is, after the chip transfer body 13 removes the protective layer 132, the light-emitting chip 131 falls into the corresponding matching second groove 1212.

[0113] The orthographic projections of the driving electrodes on the driving layers 112 on the transfer layer 12 may be located in the corresponding second grooves 1212 .

[0114] like Figure 4e to Figure 4fAs shown, in some embodiments of the present disclosure, the inner wall of the second groove 1212 can be a vertical wall perpendicular to the driving substrate 11. When the binding end face of the light-emitting chip 131 is in a corresponding matching relationship with the driving substrate 11, the orthographic projection of the second groove 1212 on the driving substrate 11 can completely overlap with the orthographic projection of the light-emitting chip 131 in the corresponding matching chip transfer body 13 on the driving substrate 11. After removing the protective layer 132, the light-emitting chip 131 can be directly embedded in the second groove 1212 to reduce or avoid the light-emitting chip 131 deviating from the second groove 1212 during the falling process, thereby causing the light-emitting chip 131 to be unable to be bound to the driving substrate. That is, by providing the second groove 1212, the problem that the connection electrode 1312 in the light-emitting chip 131 cannot be connected to the corresponding driving electrode due to the light-emitting chip 131 deviating from the second groove 1212 during the falling process can be reduced or avoided, and then the transfer yield of the light-emitting chip 131 can be improved.

[0115] like Figure 4g As shown, in other embodiments of the present disclosure, the inner wall of the second groove 1212 is an inclined plane inclined relative to the vertical direction, and the inclined plane extends from bottom to top in a direction away from the center of the second groove 1212. The vertical direction is a direction perpendicular to the drive substrate 11. "From bottom to top" refers to the direction in which the inner wall of the second groove 1212 is away from the drive substrate 11, so that the cross-sectional area of ​​the second groove 1212 increases in the direction away from the drive substrate 11.

[0116] The orthographic projection of the end surface of the second groove 1212 away from the driving substrate 11 on the driving substrate 11 may coincide with the orthographic projection of the corresponding first groove 1211 on the driving substrate 11 .

[0117] When the binding end face of the light emitting chip 131 is in a corresponding matching relationship with the driving substrate 11, the orthographic projection of the end face of the second groove 1212 close to the driving substrate 11 on the driving substrate 11 completely overlaps with the orthographic projection of the light emitting chip 131 in the corresponding matching chip transfer body 13 on the driving substrate 11.

[0118] After the protective layer 132 is removed, the light-emitting chip 131 slides along the inner wall of the second groove 1212 onto the driving substrate 11, which not only avoids the problem of the light-emitting chip 131 deviating from the second groove 1212 during the falling process, but also reduces the angle of inclination of the light-emitting chip 131 during the falling process, which results in the binding end face of the light-emitting chip 131 being in a non-corresponding matching relationship with the driving substrate 11 after the light-emitting chip 131 falls onto the driving substrate 11, and makes it impossible for the light-emitting chip 131 to be bound to the driving substrate 11.

[0119] However, the present invention is not limited thereto. In the embodiment of the present disclosure, the cross-sectional area of ​​the alignment groove 121 may also be equal everywhere in the depth direction thereof, which may be determined according to actual conditions.

[0120] It should be noted that in the embodiment of the present disclosure, the mass and volume of the chip transfer bodies 13 of the same type are the same, and the mass of the chip transfer bodies 13 of different types is different. The mass of the chip transfer body 13 is positively correlated with the cross-sectional area of ​​the corresponding alignment groove 121. That is, the greater the mass of the chip transfer body 13, the greater the cross-sectional area of ​​the corresponding alignment groove 121.

[0121] In the embodiment of the present disclosure, the chip transfer method of the light-emitting chip 131 can be specifically referred to the following embodiment, wherein the chip transfer body 13 in the embodiment can have three different types (i.e., N=3), and the three types of chip transfer bodies 13 are all spheres, and the spherical diameters of the first type of chip transfer body 13, the second type of chip transfer body 13, and the three types of chip transfer bodies 13 are D1, D2, and D3, respectively.

[0122] Embodiment 1

[0123] like Figure 5 As shown, different types of chip transfer bodies 13 are set to different ball diameters, and satisfy: D1<D2<D3. It should be noted that the mass of the chip transfer body 13 is positively correlated with the ball diameter. The larger the mass of the chip transfer body 13, the larger its ball diameter, and the larger the cross-sectional area of ​​the corresponding alignment groove 121.

[0124] Each alignment groove 121 on the transfer layer 12 is filled with transfer liquid 14, and the density of the transfer liquid 14 is less than the density of each type of chip transfer body 13. When the chip transfer body 13 moves to the corresponding alignment groove 121, at least half of the height of the chip transfer body 13 sinks into the transfer liquid 14 in the corresponding alignment groove 121.

[0125] After the transfer liquid 14 is injected into each receiving groove, different types of chip transfer bodies 13 are placed together on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the first magnetic field is applied to all the chip transfer bodies 13 at the same time to drive each chip transfer body 13 to roll until each alignment groove 121 is embedded with a corresponding matching chip transfer body 13.

[0126] It should be noted that according to the formula Fbuoyancy = G = mg = ρliquid gVdisplaced (G is gravity, m is the mass of the chip transfer body 13, ρliquid is the density of the transfer liquid 14, g is the acceleration of gravity, and Vdisplaced is the volume of the transfer liquid 14 displaced), when the mass of the chip transfer body 13 is constant, the buoyancy it receives is the same, and when the density of the transfer liquid 14 and the acceleration of gravity are equal, the volume of the liquid discharged is equal. When the cross-sectional area of ​​the alignment groove 121 is larger, the height of the transfer liquid 14 discharged from the alignment groove 121 is smaller.

[0127] like Figure 6 As shown, the same type of chip transfer body 13 is placed in two alignment grooves 121 with different cross-sectional areas. The height of the transfer liquid 14 discharged by the chip transfer body 13 in the alignment groove 121 with a larger cross-sectional area is △h1, and the height of the transfer liquid 14 discharged by the chip transfer body 13 in the alignment groove 121 with a smaller cross-sectional area is △h2, △h1<△h2. Therefore, the same type of chip transfer body 13 sinks to a smaller height in the alignment groove 121 with a larger cross-sectional area.

[0128] In addition, in the disclosed embodiment, the maximum cross-sectional area of ​​the n+1th type of chip transfer body 13 is greater than the cross-sectional area of ​​the corresponding matching groove 121 of the nth type of chip transfer body 13. When the nth type of chip transfer body 13 is transferred to the corresponding matching groove 121 of the n+1th type of chip transfer body 13, the depth of the light-emitting chip 131 transfer body 13 sunk into the alignment groove 121 is less than half of its height. The mass of the nth type of chip transfer body 13 is less than the mass of the n+1th type of chip transfer body 13, and 1≤n<N, where n is a positive integer.

[0129] Specifically, when N=3, three types of alignment grooves 121 are formed on the transfer layer 12 , and the transfer liquid 14 is injected into each alignment groove 121 .

[0130] Among them, Figure 7 As shown, a chip transfer body 13 with a spherical diameter of D1 is placed at the edge of a driving substrate 11 or at the edge of a transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D1 moves to a corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; when the chip transfer body 13 with a spherical diameter of D1 moves to two other types of alignment grooves 121 that do not correspond to each other, the depth of the chip transfer body 13 with a spherical diameter of D1 sunk into the alignment groove 121 is less than half of its height.

[0131] like Figure 8As shown, a chip transfer body 13 with a spherical diameter of D2 is placed at the edge of a driving substrate 11 or at the edge of a transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D2 moves into a corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; the maximum cross-sectional area of ​​the chip transfer body 13 with a spherical diameter of D2 is greater than the cross-sectional area of ​​the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D1, so that the chip transfer body 13 with a spherical diameter of D2 cannot sink into the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D1; when the chip transfer body 13 with a spherical diameter of D2 is transferred to the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D3, the depth of the chip transfer body 13 with a spherical diameter of D2 sunk into the alignment groove 121 is less than half of its height.

[0132] like Fig. 9 As shown, a chip transfer body 13 with a spherical diameter of D3 is placed at the edge of a driving substrate 11 or at the edge of a transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D3 moves to a corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; and the chip transfer body 13 with a spherical diameter of D3 cannot sink into the other two non-corresponding alignment grooves 121.

[0133] It can be seen from this that the different types of chip transfer bodies 13 in the embodiments of the present disclosure can only achieve at least half of their height being submerged in the transfer liquid 14 in the corresponding matching alignment grooves 121 .

[0134] Therefore, if Fig.10 as well as Figures 10a to 10e As shown, in the embodiment of the present disclosure, after forming the transfer layer 12 and filling each alignment groove 121 with the transfer liquid 14, different types of chip transfer bodies 13 can be placed on the driving substrate 11 or on the transfer layer 12 at the same time, and driven by the first magnetic field, different types of chip transfer bodies 13 move on the transfer layer 12. When the chip transfer body 13 is not transferred to the corresponding matching alignment groove 121, the chip transfer body 13 can continue to move under the action of the first magnetic field. When the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, the first magnetic field can no longer drive the chip transfer body 13 to move on the transfer layer 12, and then the chip transfer body 13 can stay in the corresponding matching alignment groove 121.

[0135] When a corresponding matching chip transfer body 13 is embedded in each alignment groove 121, if there are still chip transfer bodies 13 on the transfer layer 12 or the driving substrate 11 that have not been transferred to the corresponding matching alignment groove 121, the first magnetic field is applied again to remove the chip transfer bodies 13 that have not been transferred to the corresponding matching alignment groove 121 from the transfer layer 12 or the driving substrate 11.

[0136] Next, the positional relationship between the binding end surface of the light emitting chip 131 and the driving substrate 11 can be determined. Figures 10b to 10c As shown, if the binding end surface of the light-emitting chip 131 is in a non-corresponding matching relationship with the driving substrate 11, a second magnetic field can be applied to the chip transfer body 13 to drive the light-emitting chip 131 to rotate and make the binding end surface of the light-emitting chip 131 in a corresponding matching relationship with the driving substrate 11.

[0137] like Figures 10c to 10e As shown, when the binding end surface of the light emitting chip 131 is in a corresponding matching relationship with the driving substrate 11, the transfer liquid 14 in each alignment groove 121 is removed. Then, the protective layer 132 wrapping the light emitting chip 131 is removed to enable the light emitting chip 131 to be bound to the driving substrate 11.

[0138] It should be noted that the transfer liquid 14 in the embodiment of the present disclosure may be a volatile solution, so that the transfer liquid 14 in the alignment groove 121 may be removed by heating, wherein the volatilization temperature of the transfer liquid 14 will not damage the light-emitting chip 131. However, it is not limited thereto, and the transfer liquid 14 in the alignment groove 121 may be removed by other methods other than heating, which may be determined according to actual conditions.

[0139] In the disclosed embodiment, different types of chip transfer bodies 13 can be placed on the driving substrate 11 or on the transfer layer 12 at the same time for transfer, which simplifies the chip transfer steps and further improves the chip transfer efficiency.

[0140] Embodiment 2

[0141] Different types of chip transfer bodies 13 are set as spheres with the same sphere diameter. Among them, the mass of the nth type of chip transfer body 13 is less than the mass of the n+1th type of chip transfer body 13, and 1≤n<N, n is a positive integer. That is: D1=D2=D3, and the mass of the first type of chip transfer body 13 is less than the mass of the second type of chip transfer body 13, and the mass of the second type of chip transfer body 13 is less than the mass of the third type of chip transfer body 13.

[0142] It should be noted that, the greater the mass of the chip transfer body 13 , the larger the cross-sectional area of ​​the corresponding matching alignment groove 121 .

[0143] The transfer liquid 14 is injected into each alignment groove 121 on the transfer layer 12, and the transfer liquid 14 fills each alignment groove 121, and the density of the transfer liquid 14 is less than the density of the chip transfer body 13. When the chip transfer body 13 moves to the alignment groove 121 that matches it, at least half of the height of the chip transfer body 13 sinks into the transfer liquid 14 in the corresponding alignment groove 121.

[0144] After the transfer liquid 14 is injected into each containing groove, the transfer of different types of chip transfer bodies 13 is achieved in batches according to the order of the mass of the chip transfer bodies 13 from small to large.

[0145] Specifically, the steps after injecting the transfer liquid 14 into each receiving groove may include: first placing all the n-th type chip transfer bodies 13 on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and applying a first magnetic field to each of the n-th type chip transfer bodies 13 to drive the n-th type chip transfer bodies 13 to roll one by one to the corresponding matching alignment grooves 121. Then placing all the n+1-th type chip transfer bodies 13 on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and applying a first magnetic field to each of the n+1-th type chip transfer bodies 13 to drive the n+1-th type chip transfer bodies 13 to roll one by one to the corresponding matching alignment grooves 121, until all the alignment grooves 121 are embedded with corresponding matching chip transfer bodies 13.

[0146] Specifically, when N=3, the first type of chip transfer body 13 is first placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to each first type of chip transfer body 13 to drive the first type of chip transfer body 13 to roll one by one to the corresponding matching alignment groove 121.

[0147] After the first type of chip transfer bodies 13 are embedded in the alignment grooves 121 corresponding to the first type of chip transfer bodies 13, the second type of chip transfer bodies 13 are placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the first magnetic field is applied to each second type of chip transfer body 13 to drive the second type of chip transfer bodies 13 to roll one by one to the alignment grooves 121 corresponding to them.

[0148] When the second type of chip transfer bodies 13 are embedded in the corresponding alignment grooves 121 that match the second type of chip transfer bodies 13, the third type of chip transfer bodies 13 are placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the first magnetic field is applied to each third type of chip transfer body 13 to drive the third type of chip transfer body 13 to roll one by one to the corresponding alignment grooves 121 until the third type of chip transfer bodies 13 are embedded in the corresponding alignment grooves 121 that match the third type of chip transfer bodies 13.

[0149] It should be noted that, in the embodiment of the present disclosure, when the chip transfer body 13 with a smaller mass (nth type) is transferred to the alignment groove 121 corresponding to the chip transfer body 13 with a larger mass (n+1th type), the height of the chip transfer body 13 with a smaller mass sunk into the transfer liquid 14 is less than half of its height. Therefore, the present disclosure adopts a method of transferring the chip transfer bodies 13 in order from small to large in mass, and the chip transfer bodies 13 with a smaller mass can be used to occupy the alignment groove 121 with a smaller cross-sectional area, so as to avoid the chip transfer body 13 with a larger mass from being transferred to the alignment groove 121 corresponding to the chip transfer body 13 with a smaller mass.

[0150] When transferring each type of chip transfer body 13, if the chip transfer bodies 13 are embedded in the corresponding matching alignment grooves 121, and there are still excess chip transfer bodies 13 on the driving substrate 11 or the transfer layer 12, the excess chip transfer bodies 13 can be first removed from the driving substrate 11 and the transfer layer 12, and then the chip transfer body 13 with a larger mass (i.e., the n+1th type) can be transferred.

[0151] The disclosed embodiment sets different types of chip transfer bodies 13 to the same size, and utilizes a protective layer 132 to protect the light-emitting chip 131, thereby reducing or avoiding damage to the light-emitting chip 131 caused by collision and the occurrence of bad spots, thereby reducing the probability of repairing the light-emitting chip 131. At the same time, it can also avoid the need for the traditional chip transfer process to perform point-to-point precise alignment between the light-emitting chip 131 and the alignment groove 121 to achieve the complex process of transferring the light-emitting chip 131, thereby simplifying the process of forming the chip transfer body 13 and saving work time.

[0152] Embodiment 3

[0153] The same type of chip transfer bodies 13 are set to have the same ball diameter, and different types of chip transfer bodies 13 are set to have different ball diameters. The transfer layer 12 in the embodiment of the present disclosure is a flat layer that covers the entire surface of the drive substrate 11 .

[0154] It should be noted that the above-mentioned transfer layer 12 covers the entire surface of the driving substrate 11, which means that the driving substrate 11 is covered by the transfer layer 12 except for the area corresponding to the alignment groove 121. The transfer layer 12 is a flat layer, which means that the side of the transfer layer 12 facing away from the driving substrate 11 is parallel to the driving substrate 11, and the vertical distances from each point on the side of the transfer layer 12 facing away from the driving substrate 11 to the driving substrate 11 are equal.

[0155] The steps after forming the transfer layer 12 may include: firstly placing all the nth type chip transfer bodies 13 at the edge of the transfer layer 12, and applying a first magnetic field to each of the nth type chip transfer bodies 13 to drive the nth type chip transfer bodies 13 to roll one by one to the corresponding alignment grooves 121. Then placing all the n+1th type chip transfer bodies 13 at the edge of the transfer layer 12, and applying a first magnetic field to each of the n+1th type chip transfer bodies 13 to drive the n+1th type chip transfer bodies 13 to roll one by one to the corresponding alignment grooves 121, until all the alignment grooves 121 are embedded with corresponding matching chip transfer bodies 13.

[0156] The mass of the nth type chip transfer body 13 is less than the mass of the n+1th type chip transfer body 13, and 1≤n<N, n is a positive integer. In the present disclosure, the maximum cross-sectional area of ​​the n+1th type chip transfer body 13 is greater than the cross-sectional area of ​​the alignment groove 121 corresponding to the nth type chip transfer body 13, so the depth of the n+1th type chip transfer body 13 falling into the alignment groove 121 corresponding to the nth type chip transfer body 13 is less than half of its height.

[0157] Specifically, when N=3, and D1<D2<D3, the first type of chip transfer body 13 is first placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the first type of chip transfer body 13 moves under the action of the first magnetic field until the first type of chip transfer body 13 is embedded in the corresponding alignment grooves 121. Then, the second type of chip transfer body 13 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the second type of chip transfer body 13 moves under the action of the first magnetic field until the second type of chip transfer body 13 is embedded in the corresponding alignment grooves 121. Next, the third type of chip transfer body 13 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the third type of chip transfer body 13 moves under the action of the first magnetic field until the third type of chip transfer body 13 is embedded in the corresponding alignment grooves 121.

[0158] It should be noted that when each type of chip transfer body 13 is transferred, if the chip transfer bodies 13 are embedded in the corresponding matching alignment grooves 121, and there are still excess chip transfer bodies 13 on the driving substrate 11 or the transfer layer 12, the excess chip transfer bodies 13 can be first removed from the driving substrate 11 and the transfer layer 12, and then the chip transfer body 13 with a larger ball diameter (that is, the n+1th type) can be transferred.

[0159] The embodiment of the present disclosure provides at least two types of alignment grooves 121 that correspond to different types of chip transfer bodies 13, and utilizes the first magnetic field to transfer different types of chip transfer bodies 13 in batches according to the order of ball diameter from large to small, thereby avoiding the complex alignment process, reducing the difficulty of transferring the light-emitting chip 131, and improving the transfer efficiency. At the same time, the present disclosure utilizes the characteristics of one type of alignment groove 121 corresponding to one type of chip transfer body 13, and transfers chip transfer bodies 13 of different volumes in batches, so as to ensure that the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, so as to improve the accuracy of the transfer of the light-emitting chip 131.

[0160] Embodiment 4

[0161] The same type of chip transfer bodies 13 are set to have the same ball diameter, and different types of chip transfer bodies 13 are set to have different ball diameters. The cross-sectional area of ​​the alignment groove 121 is positively correlated with the ball diameter of the chip transfer body 13 that matches it. The larger the ball diameter of the chip transfer body 13, the larger the cross-sectional area of ​​the alignment groove 121 that matches it.

[0162] The transfer layer 12 includes N different types of transfer structures 122 arranged at intervals in the horizontal direction X. Each type of transfer structure 122 corresponds to a type of alignment groove 121. At this time, the groove sidewalls of each alignment groove 121 are respectively formed by surrounding the corresponding transfer structure 122.

[0163] The outer side surface of the transfer structure 122 is inclined inward from bottom to top. Among them, the height of the transfer structure 122 is positively correlated with the cross-sectional area of ​​the alignment groove 121 formed corresponding thereto, and the inclination angle of the outer side surface of the transfer structure 122 is positively correlated with the cross-sectional area of ​​the alignment groove 121 formed corresponding thereto. That is, the larger the ball diameter of the chip transfer body 13, the larger the cross-sectional area of ​​the corresponding alignment groove 121, and the higher the height of the transfer structure 122 forming the alignment groove 121, the larger the inclination angle of the outer side surface of the transfer structure 122.

[0164] The “from bottom to top” mentioned above refers to from the end of the outer side surface of the transfer structure 122 close to the drive substrate 11 to the end of the outer side surface of the transfer structure 122 far from the drive substrate 11. The “inward tilt” mentioned above refers to the outer side surface of the transfer structure 122 tilting toward the center of the transfer structure 122. The tilt angle of the outer side surface of the transfer structure 122 refers to the angle between the outer side surface of the transfer structure 122 and the drive substrate 11.

[0165] In different types of transfer structures 122 , the horizontal widths of the outer side surfaces of the transfer structures 122 projected on the drive substrate 11 may be equal, and the vertical heights of the outer side surfaces of the transfer structures 122 may be unequal, so that the outer side surfaces of different types of transfer structures 122 may form different inclination angles.

[0166] In the embodiment of the present disclosure, the inclination angle of the outer side surface of the transfer structure 122 may be less than or equal to 60°.

[0167] When the transfer structure 122 is sectioned along the height direction of the alignment groove 121 , the cross-sectional shape of the transfer structure 122 may be two triangles or trapezoids symmetrically arranged about the alignment groove 121 , and the outer side surface of the transfer structure 122 may be a plane or an arc surface.

[0168] After forming the transfer layer 12, different types of chip transfer bodies 13 are placed on the edge of the driving substrate 11 at the same time, and the first magnetic field is applied to all the chip transfer bodies 13 at the same time to drive each chip transfer body 13 to roll until each alignment groove 121 is embedded with a corresponding matching chip transfer body 13.

[0169] It should be noted that, under the combined effect of the weight of the chip transfer body 13 and the height of the corresponding transfer structure 122 , various types of chip transfer bodies 13 can only move to the corresponding alignment groove 121 when driven by the first magnetic field.

[0170] Specifically, when N=3, and the ball diameters of the first type chip transfer body 13, the second type chip transfer body 13, and the third type chip transfer body 13 satisfy: D1<D2<D3, three corresponding matching first alignment grooves, second alignment grooves, and third alignment grooves can be formed. The first alignment groove, the second alignment groove, and the third alignment groove are formed by the first transfer structure, the second transfer structure, and the third transfer structure, respectively.

[0171] like Fig.11 As shown, the heights of the first transfer structure, the second transfer structure, and the third transfer structure are L1, L2, and L3, respectively, and satisfy: L1<L2<L3. The inclination angles of the outer sides of the first transfer structure, the second transfer structure, and the third transfer structure are θ1, θ2, and θ3, respectively, and satisfy: θ1<θ2<θ3.

[0172] After forming the transfer layer 12, the first type of chip transfer body 13 is placed on the edge of the drive substrate 11, and a first magnetic field is applied to the chip transfer body 13. Since the inclination angle θ1 of the outer side surface of the first transfer structure is small, the first type of chip transfer body 13 with a smaller ball diameter can move normally into the first alignment groove along the outer side surface of the first transfer structure. The inclination angle θ2 of the outer side surface of the second transfer structure and the inclination angle θ3 of the outer side surface of the third transfer structure are large, and the first type of chip transfer body 13 with a smaller ball diameter has a large resistance when moving along the outer side walls of the second transfer structure and the third transfer structure. Therefore, the first type of chip transfer body 13 cannot move into the second alignment groove or the third alignment groove.

[0173] It should be noted that the relationship between the height of the three types of transfer structures 122 and the ball diameter of the corresponding matching chip transfer body 13 can be: 4 / 3*D1>L1≥D1, 4 / 3*D2>L2≥D2, 4 / 3*D3>L3≥D3. Therefore, after the first type of chip transfer body 13 has been embedded in the first alignment groove, the other first type of chip transfer body 13 can no longer be embedded in the first alignment groove at least half of its height, and under the action of the first magnetic field, the other first type of chip transfer body 13 can continue to roll on the driving substrate 11 and other transfer structures 122.

[0174] In the disclosed embodiment, the cross-sectional area of ​​the first alignment groove is smaller than the maximum cross-sectional area of ​​the second type of chip transfer body 13, and the cross-sectional area of ​​the second alignment groove is smaller than the maximum cross-sectional area of ​​the third type of chip transfer body 13. Therefore, the second type of chip transfer body 13 cannot be embedded in the first alignment groove, and the third type of chip transfer body 13 cannot be embedded in the second alignment groove.

[0175] After forming the transfer layer 12, the second type of chip transfer body 13 is placed at the edge of the drive substrate 11, and the first magnetic field is applied to the chip transfer body 13. The second type of chip transfer body 13 cannot be embedded in the first alignment groove, and the inclination angle θ3 of the outer side surface of the third transfer structure is large, and the second type of chip transfer body 13 with a smaller ball diameter cannot move into the third alignment groove. However, the inclination angle θ1 of the outer side surface of the second transfer structure is small, and the second type of chip transfer body 13 with a smaller ball diameter can move normally along the outer side surface of the second transfer structure into the second alignment groove.

[0176] Similarly, after forming the transfer layer 12, the third type of chip transfer body 13 is placed on the edge of the driving substrate 11, and the first magnetic field is applied to the chip transfer body 13. The third type of chip transfer body 13 can move normally along the outer side surface of the third transfer structure to the second alignment groove, but the third type of chip transfer body 13 cannot be embedded in the first alignment groove and the second alignment groove.

[0177] That is, the embodiment of the present disclosure sets different types of transfer structures 122, and utilizes the differences between the heights of different types of transfer structures 122 and the differences between the inclination angles of the outer surfaces of different types of transfer structures 122, so that the chip transfer body 13 with a smaller ball diameter cannot be moved into the corresponding matching alignment groove 121 of the chip transfer body 13 with a larger ball diameter. By making the maximum cross-sectional area of ​​the chip transfer body 13 with a larger volume larger than the cross-sectional area of ​​the corresponding matching alignment groove 121 of the chip transfer body 13 with a smaller ball diameter, it is prevented that the chip transfer body 13 with a larger ball diameter is embedded into the corresponding matching alignment groove 121 of the chip transfer body 13 with a smaller ball diameter. Subsequently, various types of chip transfer bodies 13 can only be moved into the corresponding matching alignment groove 121 under the action of the first magnetic field, thereby avoiding the complex process of performing point-to-point precise alignment between the light-emitting chip 131 and the alignment groove 121 in the traditional chip transfer process to realize the transfer of the light-emitting chip 131, and reducing the difficulty of transferring the light-emitting chip 131. In addition, the embodiment of the present disclosure can place different types of chip transfer bodies 13 on the driving substrate 11 or on the transfer layer 12 for transfer at the same time, which simplifies the chip transfer steps and thus improves the chip transfer efficiency.

[0178] It should be noted that in the above-mentioned solutions of the third and fourth embodiments, after forming the transfer layer 12 and before placing the chip transfer body 13 at the edge of the transfer layer 12 or at the edge of the drive substrate 11, the step may include: filling each alignment groove 121 with a transfer liquid 14, and the density of the transfer liquid 14 is less than the density of each type of chip transfer body 13. When the chip transfer body 13 moves to the alignment groove 121 that matches it, at least half of the height of the chip transfer body 13 sinks into the transfer liquid 14.

[0179] Among them, when each alignment groove 121 in the fourth embodiment is filled with the transfer liquid 14, the chip transfer body 13 can be transferred to the corresponding matching alignment groove 121 to achieve double protection. That is: the difference in the inclination angle of the outer side surface of different types of transfer structures 122 can be first used to prevent the chip transfer body 13 with a smaller ball diameter from moving to the corresponding matching alignment groove 121 of the chip transfer body 13 with a larger ball diameter. At the same time, the difference in the sinking depth of the same type of chip transfer body 13 in the transfer liquid 14 in different alignment grooves 121 is used to allow the chip transfer body 13 to remain in the corresponding matching alignment groove 121 under the action of the first magnetic field, and then double protection can be provided for the chip transfer body 13 to be transferred to the corresponding matching alignment groove 121, thereby improving the success rate of the transfer of the light-emitting chip 131.

[0180] The embodiment of the present disclosure further provides a display panel 1, which at least includes: a driving substrate 11, a transfer layer 12, and at least N different types of magnetic chip transfer bodies 13. The transfer layer 12 is disposed on the driving substrate 11, and the transfer layer 12 includes N different types of alignment grooves 121 arranged in the horizontal direction X, and the cross-sectional areas of the alignment grooves 121 of different types are different.

[0181] The chip transfer body 13 corresponds to the alignment groove 121 one by one. Moreover, when the chip transfer body 13 in the above chip transfer method does not include the protective layer 132, the chip transfer body 13 in the display panel 1 can be transferred to the corresponding alignment groove 121 by any of the above chip transfer methods, and bound to the drive substrate 11. When the chip transfer body 13 in the above chip transfer method includes the protective layer 132, the protective layer 132 needs to be removed first, and then the chip transfer body 13 after the protective layer 132 is removed is transferred to the corresponding alignment groove 121 by any of the above chip transfer methods, and bound to the drive substrate 11.

[0182] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the feature. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0183] It should be noted that "upper", "lower", "left", "right" and the like are only used for distinction to facilitate description, and do not impose any directional limitation on the embodiments of the present invention. For example, the "upper" may actually be "lower", "left", "right" and other directions. In the present disclosure, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral whole; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium; it may be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0184] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0185] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and cannot be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and specification of the present disclosure shall fall within the scope covered by the patent of the present disclosure.

Claims

1. A chip transfer method, characterized in that: The chip transfer method comprises: Providing N different types of chip transfer bodies all having magnetic properties, wherein N is a positive integer greater than or equal to 2; A driving substrate is provided, and a transfer layer is formed on the driving substrate, wherein the transfer layer comprises N different types of alignment grooves arranged in a horizontal direction, wherein the cross-sectional areas of the alignment grooves of different types are different and are used to correspond to and match the chip transfer bodies of different types, and the corresponding matching relationship between the alignment grooves and the chip transfer bodies is that the chip transfer bodies correspond to the alignment grooves one by one, and at least half of the chip transfer bodies are embedded in the alignment grooves; Placing the chip transfer body at the edge of the driving substrate or at the edge of the transfer layer, and applying a first magnetic field to the chip transfer body to drive the chip transfer body to move to a corresponding alignment groove; After the chip transfer body moves to the corresponding alignment groove, the chip transfer body is processed to be bound with the driving substrate.

2. The chip transfer method according to claim 1, characterized in that: The masses of the chip transfer bodies of different types are different, wherein the mass of the chip transfer body is positively correlated with the cross-sectional area of ​​the alignment groove that matches the chip transfer body.

3. The chip transfer method according to claim 2, characterized in that: Each alignment groove is filled with transfer liquid, and the density of the transfer liquid is less than the density of each type of chip transfer body, wherein when the chip transfer body moves to the corresponding matching alignment groove, at least half of the height of the chip transfer body sinks into the transfer liquid.

4. The chip transfer method according to claim 3, characterized in that: The chip transfer body comprises a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; wherein, After all the chip transfer bodies move to the corresponding alignment grooves, and before each chip transfer body is processed to be bound to the driving substrate, the chip transfer method further includes: removing the transfer liquid in each alignment groove; The step of processing the chip transfer body to bind it to the driving substrate includes: removing the protective layer wrapping the light-emitting chip in each chip transfer body, and then binding the light-emitting chip to the driving substrate.

5. The chip transfer method according to claim 3, characterized in that: The chip transfer body is a sphere, different types of chip transfer bodies have different spherical diameters, and the mass of the chip transfer body is positively correlated with the spherical diameter. The chip transfer method includes: Different types of chip transfer bodies are placed simultaneously on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to all the chip transfer bodies simultaneously to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

6. The chip transfer method according to claim 3, characterized in that: The chip transfer body is a sphere, and the sphere diameters of different types of chip transfer bodies are the same; wherein the chip transfer method comprises: First, all the n-th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n-th type chip transfer bodies to drive the n-th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves; Then, all the n+1th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves; The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

7. The chip transfer method according to any one of claims 1 to 3, characterized in that: The chip transfer body is a sphere, and different types of chip transfer bodies have different sphere diameters, wherein the transfer layer is a flat layer that covers the entire surface of the drive substrate, and the chip transfer method includes: Firstly, all the n-th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n-th type chip transfer bodies to drive the n-th type chip transfer bodies to roll one by one to the corresponding matching alignment grooves; Then, all the n+1th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding alignment grooves; The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

8. The chip transfer method according to any one of claims 1 to 3, characterized in that: The chip transfer body is a sphere, and different types of chip transfer bodies have different sphere diameters; The transfer layer includes N different types of transfer structures that are arranged at intervals in the horizontal direction, each type of the transfer structure correspondingly opens a type of alignment groove, and the outer side surface of each transfer structure is inclined inward from bottom to top; The cross-sectional area of ​​the alignment groove is positively correlated with the ball diameter of the chip transfer body that matches it, and the inclination angle of the outer side surface of the transfer structure is positively correlated with the cross-sectional area of ​​the alignment groove formed correspondingly thereto.

9. The chip transfer method according to claim 8, characterized in that: In different types of transfer structures: the horizontal widths of the orthographic projections of the outer side surfaces on the driving substrate are equal, and the vertical heights of the outer side surfaces are unequal; and / or The inclination angle of the outer side surface of the transfer structure is less than or equal to 60°; and / or The chip transfer method includes: placing different types of chip transfer bodies at the edge of the driving substrate at the same time, and applying a first magnetic field to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

10. The chip transfer method according to claim 1, characterized in that: The chip transfer body comprises a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; The alignment groove includes a first groove and a second groove arranged in a vertical direction and connected, the second groove is located on a side of the first groove close to the driving substrate, the first groove is used to accommodate a chip transfer body corresponding to it, the orthographic projection of the end surface of the second groove away from the first groove on the driving substrate is located within the orthographic projection of the first groove on the driving substrate, and is used to accommodate the light-emitting chip with the protective layer removed; wherein, The inner wall of the second groove is a vertical wall perpendicular to the driving substrate; or The inner wall of the second groove is an inclined surface inclined relative to the vertical direction, and the inclined surface extends from bottom to top in a direction away from the center of the second groove.

11. The chip transfer method according to claim 1, characterized in that: The chip transfer body comprises a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; The step of processing the chip transfer body to bind it to the driving substrate includes: Determining the positional relationship between the binding end surface of the light-emitting chip in the chip transfer body and the driving substrate; When it is determined that the binding end surface of the light-emitting chip in the chip transfer body is in a non-corresponding matching relationship with the driving substrate, a second magnetic field is applied to the chip transfer body to drive the chip transfer body to rotate so that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate; After determining that the binding end surface of the light-emitting chip in the chip transfer body is in a corresponding matching relationship with the driving substrate, removing the protective layer so that the light-emitting chip falls onto the driving substrate so that the binding end surface fits the driving substrate; The condition that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate is that the binding end surface of the light-emitting chip in the chip transfer body is close to the driving substrate and parallel to the driving substrate.

12. A display panel, characterized in that: The display panel at least comprises: Driver substrate; A transfer layer is disposed on the driving substrate, wherein the transfer layer includes N different types of alignment grooves arranged in a horizontal direction, and the cross-sectional areas of the alignment grooves of different types are different; At least N different types of magnetic chip transfer bodies, each corresponding to the alignment grooves, are provided. The chip transfer bodies are transferred to the corresponding alignment grooves by the chip transfer method as claimed in claim 1 and are bound to the drive substrate.

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