Chip optical detection equipment

Abstract

The invention provides chip optical detection equipment which comprises a tray conveying mechanism, a tray overturning mechanism, a sorting mechanism and two visual detection modules, the tray conveying mechanism is used for conveying trays, the tray overturning mechanism is used for overturning chips in the trays, the sorting mechanism is used for taking out defective chips, and the visual detection modules are used for detecting the defective chips. The material tray conveying mechanism is used for conveying the material tray to the material tray turnover mechanism, the sorting mechanism is used for conveying the material tray to the material tray turnover mechanism, good chips are supplemented to vacant positions of the material tray, the two visual detection modules are used for detecting the first faces and the second faces of the chips respectively, and one visual detection module, the material tray turnover mechanism, the other visual detection module and the sorting mechanism are sequentially arranged in the conveying direction of the material tray conveying mechanism. According to the chip optical detection equipment provided by the invention, both sides of the chip can be detected by the visual detection module, manual turn-over is not needed, the chip does not need to be sucked up, the detection efficiency of chip double-side detection is improved, and meanwhile, the possibility that the chip is polluted is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection, and more specifically, relates to a chip optical detection device. Background Art

[0002] During the production process or factory testing, the chips need to be inspected for appearance and other tests to ensure the production quality of the chips. In the field of testing, there are two types of optical inspection equipment, one is only able to perform single-sided inspection (only inspecting the solder ball surface or mirror surface), which has low inspection efficiency and requires manual flipping for double-sided inspection; the other is a contact-type double-sided inspection, which requires the product to be sucked up to inspect the back of the chip. The suction process will contaminate the mirror area of ​​the chip, resulting in a decrease in yield. At present, the efficiency of these two types of inspection equipment is very low, and it is impossible to perform cyclic high-speed testing. Summary of the invention

[0003] The purpose of the embodiment of the present invention is to provide a chip optical detection device to solve the technical problems existing in the prior art that the chip detection efficiency is low and the chip is easily contaminated.

[0004] To achieve the above object, the technical solution adopted by the present invention is: to provide a chip optical detection device, comprising:

[0005] A tray transmission mechanism, used for transmitting a tray, wherein the tray is used for loading chips;

[0006] A tray flipping mechanism, used to flip the chips in the tray;

[0007] A sorting mechanism, used to take out defective chips and replenish good chips to the empty positions of the tray;

[0008] The visual inspection module includes two visual inspection modules, which are respectively used to inspect the first side and the second side of the chip, wherein one of the visual inspection modules and the tray flipping mechanism, and the other visual inspection module and the sorting mechanism are sequentially arranged along the transmission direction of the tray transmission mechanism.

[0009] Optionally, the tray flipping mechanism includes a flipping frame, a lifting assembly, a clamping and flipping assembly, and a flipping tray, the flipping tray is used to be inverted on the tray located on the tray transmission mechanism, the flipping frame, the lifting assembly and the clamping and flipping assembly are connected in sequence, and the clamping and flipping assembly is used to clamp and flip the flipping tray and the tray located on the tray transmission mechanism.

[0010] Optionally, the clamping and flipping assembly includes a clamping fixed seat and at least two clamping and flipping structures, the clamping and flipping structures include a clamping cylinder, a cylinder fixing plate, a flipping motor and a tray clamp, the cylinder fixing plate is slidably connected to the clamping fixed seat, the clamping cylinder and the flipping motor are both fixed to the cylinder fixing plate, and the cylinder rod of the clamping cylinder is fixedly connected to the clamping fixed seat, and the rotating motion end of the flipping motor is fixedly connected to the tray clamp.

[0011] Optionally, the clamping fixing seat includes a clamping fixing plate and a clamping fixing block fixed to the clamping fixing plate, the clamping cylinder is fixed to the cylinder fixing plate, the cylinder fixing plate is slidably connected to the clamping fixing plate, and the cylinder rod passes through the cylinder fixing plate and is fixedly connected to the clamping fixing block.

[0012] Optionally, the lifting assembly includes a first lifting drive member fixed to the turning frame, and a moving end of the first lifting drive member is fixedly connected to the clamping fixing seat.

[0013] Optionally, the chip optical inspection device further includes a loading mechanism and / or an unloading mechanism, wherein the loading mechanism is used to place the tray loaded with the chips on the tray conveying mechanism, and the unloading mechanism is used to collect the tray loaded with the inspected chips.

[0014] Optionally, the loading mechanism and / or the unloading mechanism includes a silo for accommodating a plurality of stacked trays, a second lifting drive member fixed to the silo, and a telescopic drive member fixedly connected to a moving end of the second lifting drive member, wherein the telescopic direction of the telescopic drive member is perpendicular to the stacking direction of the trays, and the telescopic drive member is used to separate the bottom layer of the stacked trays from the bottom of the stacked trays, or to stack the trays to the bottom of the stacked trays.

[0015] Optionally, the tray transmission mechanism is arranged end to end.

[0016] Optionally, the tray transmission mechanism includes an annular track, a tray fixture that slides along the annular track and is used to accommodate the tray, and a transmission drive member that is used to drive the tray fixture to slide.

[0017] Optionally, the sorting mechanism includes a first mobile module, a second mobile module and a material picking and placing assembly connected in sequence, and also includes a good product placement area and a defective product placement area. The transport direction of the first mobile module and the transport direction of the second mobile module are arranged at an angle, so that the material picking and placing assembly can move between the material tray transmission mechanism, the good product placement area and the defective product placement area.

[0018] Optionally, the visual inspection module includes a third mobile module, a fourth mobile module and a visual device connected in sequence, the transport direction of the third mobile module and the transport direction of the fourth mobile module are set at an angle, and the visual device is used to photograph the chip.

[0019] Optionally, the visual device includes a visual camera, a fine-tuning mechanism for adjusting the height of the visual camera, and a light source assembly arranged below the visual camera, and the fine-tuning mechanism is interconnected with the fourth movable module.

[0020] The beneficial effect of the chip optical detection device provided by the present invention is that compared with the prior art, the chip optical detection device of the present invention includes a tray transmission mechanism, a tray flipping mechanism, a sorting mechanism and two visual detection modules. The tray circulates on the tray transmission mechanism. After the first visual detection module detects one side of the chip, the tray flipping mechanism flips the tray to expose the other side of the chip. The other side of the chip is detected by another visual detection module. After the chip detection is completed, the sorting mechanism picks out the defective chips and replenishes the good chips to the empty positions of the tray. In this way, both sides of the chip can be detected by the visual detection module, and there is no need to manually flip the side or suck up the chip, which improves the detection efficiency of the double-sided detection of the chip and reduces the possibility of chip contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A three-dimensional structural diagram of a chip optical detection device provided by an embodiment of the present invention;

[0023] Figure 2 A top view of a chip optical detection device provided by an embodiment of the present invention;

[0024] Figure 3 The three-dimensional structure of the tray turning mechanism provided in the embodiment of the present invention Figure 1 ;

[0025] Figure 4 The three-dimensional structure of the tray turning mechanism provided in the embodiment of the present invention Figure 2 (Turning rack not shown);

[0026] Figure 5 A three-dimensional structural diagram of a feeding mechanism provided in an embodiment of the present invention;

[0027] Figure 6 A cross-sectional view of a feeding mechanism provided in an embodiment of the present invention;

[0028] Figure 7 A three-dimensional structural diagram of a sorting mechanism provided in an embodiment of the present invention;

[0029] Figure 8 A three-dimensional structural diagram of a material handling assembly provided in an embodiment of the present invention;

[0030] Fig. 9 A three-dimensional structural diagram of a visual inspection module provided by an embodiment of the present invention;

[0031] Fig.10 The three-dimensional structure of the third mobile module and the fourth mobile module provided in the embodiment of the present invention Figure 1 ;

[0032] Fig.11 The three-dimensional structure of the third mobile module and the fourth mobile module provided in the embodiment of the present invention Figure 2 ;

[0033] Fig.12 A three-dimensional structural diagram of a visual device provided in an embodiment of the present invention.

[0034] Among them, the reference numerals in the figure are:

[0035] 1-tray transmission mechanism; 11-annular track; 2-feeding mechanism; 21-loading and unloading rack; 22-bin; 221-second slide rail; 23-second lifting drive member; 231-mounting plate; 24-lifting plate; 25-telescopic drive member; 3-visual detection module; 31-third moving module; 311-third motor; 312-first conveyor belt assembly; 313-third screw rod; 32-fourth moving module; 321-fourth motor; 322-second conveyor belt assembly; 323-fourth screw rod; 33-visual device; 331-visual camera; 332-light source assembly; 3321-upper light source; 3322-lower light source; 3323-first fixed adjustment frame; 3324-second fixed adjustment frame; 333-fine adjustment mechanism; 3331-fine adjustment body; 3332-fine adjustment fixed plate; 3333-fine adjustment rotating member; 334-visual Frame; 4-tray turning mechanism; 41-turning frame; 42-lifting assembly; 421-first lifting drive member; 422-guide rod; 43-clamping and turning assembly; 431-clamping fixed seat; 4311-clamping fixed plate; 43111-first slide rail; 4312-clamping fixed block; 432-clamping and turning structure; 4321-clamping cylinder; 4322-cylinder fixing plate; 4323-turning motor; 43 24-tray clamp; 5-sorting mechanism; 51-first moving module; 513-first nut; 52-second moving module; 521-second motor; 522-second screw rod; 523-second nut; 53-material picking and unloading assembly; 531-material picking and unloading motor; 532-material picking and unloading gear; 533-material picking and unloading rack; 534-suction cup structure; 54-good product placement area; 55-bad product placement area; 6-unloading mechanism. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] Chip optical inspection equipment can perform optical inspection on the appearance of the chip to ensure that the chip meets production requirements. During the production process of the chip, a variety of defects will occur on its surface, such as scratches, broken edges, white spots, solder ball foreign matter, solder ball white spots, etc., which affect the appearance of the chip and even affect the performance of the chip. Therefore, during the chip production process or after production, the chip needs to be optically inspected to ensure the production yield and factory yield of the chip. Optical inspection is required on both the front and back of the chip. At present, some optical inspection equipment can only perform single-sided inspection. After the single-sided inspection is completed, it needs to be manually turned over for inspection on the other side; some optical inspection equipment needs to suck up the chip after the single-sided inspection is completed, and then inspect the other side. The chip will be contaminated during the adsorption process, causing the mirror area of ​​the chip to be contaminated.

[0041] In order to overcome the above technical problems such as low detection efficiency and easy chip contamination in double-sided chip detection, the present invention proposes a new chip optical detection device.

[0042] The chip optical detection device provided by the embodiment of the present invention is now described.

[0043] Please also read Figure 1 and Figure 2 The chip optical inspection device includes a tray transmission mechanism 1, a tray turning mechanism 4, a sorting mechanism 5 and a visual inspection module 3.

[0044] The tray transmission mechanism 1 is used to transmit the tray, and the tray is used to load the chip. The tray is provided with a plurality of chip slots for placing the chip. By placing the chip on the tray for transportation, multiple chips can be transported at one time, thereby improving the chip transportation efficiency and detection efficiency. The tray transmission mechanism 1 has at least a tray turning station, a detection station, a sorting station, etc. The tray transmission mechanism 1 can transport the tray to each station.

[0045] The tray flipping mechanism 4 is used to flip the chips in the tray. Specifically, the tray flipping mechanism 4 can flip the tray, thereby turning over the chips in the tray, or directly turn over the chips in the tray. The chip has a first side and a second side that are arranged opposite to each other, the first side is one of the front side or the back side of the chip, and the second side is the other of the front side or the back side of the chip. After the first side of the chip is detected, the tray flipping mechanism 4 flips the chip to expose its second side, and then detects the second side of the chip, so that both the first side and the second side of the chip can be detected, and there is no need to contact the first side or the second side of the chip, thereby reducing the possibility of contaminating the chip.

[0046] Sorting mechanism 5, the sorting mechanism 5 is used to take out defective chips and add good chips to the empty positions of the tray. After the visual inspection module 3 inspects the chips, the chips with defects are defective chips. The sorting mechanism 5 can take the defective chips out of the tray on the tray transmission mechanism 1. At this time, the tray is not fully loaded and has multiple empty positions (the number of empty positions is the same as the number of defective chips). In order to fully load the tray on the tray transmission mechanism 1, the sorting mechanism 5 adds good chips to the above-mentioned multiple empty positions, so that each tray passing through the sorting mechanism 5 is fully loaded, which is convenient for the subsequent collection of the tray.

[0047] The visual inspection module 3 is used to inspect the chip. The visual inspection module 3 can take a photo of the chip. After the first and second sides of the chip are photographed by the visual inspection module 3, after the photos are recognized by a computer, it can be obtained whether there are defective chips, the location information of the defective chips, etc. The sorting mechanism 5 moves to the corresponding position according to the location information of the defective chips, takes out the defective chips, and replenishes the good chips. Among them, the number of visual inspection modules 3 is two, one of which is used to inspect the first side of the chip, and the other visual inspection module 3 is used to inspect the second side of the chip.

[0048] The tray flipping mechanism 4, one of the visual inspection modules 3, the tray flipping mechanism 4, another visual inspection module 3 and the sorting mechanism 5 are sequentially arranged along the transmission direction of the tray transmission mechanism 1. Specifically, the tray transmission mechanism 1 has at least one of the inspection stations, the tray flipping station, another inspection station and the sorting station sequentially arranged. Two visual inspection modules 3 are correspondingly arranged at two inspection stations, the tray flipping mechanism 4 is arranged at the tray flipping station, and the sorting mechanism 5 is arranged at the sorting station.

[0049] In this way, after the tray loaded with the chips to be inspected is placed on the tray conveying mechanism 1, the tray is first transported to the first inspection station, the first visual inspection module 3 inspects the first side of the chip and marks the position of the defective chip, and then the tray is transported to the tray flipping station, the tray flipping mechanism 4 flips the chip in the tray 180 degrees to expose the second side of the chip, and then the tray is transported to the second inspection station, the second visual inspection module 3 inspects the second side of the chip and marks the position of the defective chip, and then the tray is transported to the sorting station, the sorting mechanism 5 takes out all the marked defective chips and replenishes them with good chips.

[0050] The chip optical inspection device in the above embodiment includes a tray transmission mechanism 1, a tray flipping mechanism 4, a sorting mechanism 5 and two visual inspection modules 3. The tray circulates on the tray transmission mechanism 1. After the first visual inspection module 3 detects one side of the chip, the tray flipping mechanism 4 flips the tray to expose the other side of the chip. The other side of the chip is inspected by another visual inspection module 3. After the chip inspection is completed, the sorting mechanism 5 picks out the defective chips and replenishes the good chips to the empty positions of the tray. In this way, both sides of the chip can be inspected by the visual inspection module 3, and there is no need to manually flip the chip or suck up the chip, which improves the inspection efficiency of double-sided inspection of the chip and reduces the possibility of chip contamination.

[0051] In some embodiments of the present invention, see Figure 3 and Figure 4 The tray turning mechanism 4 includes a turning frame 41, a lifting assembly 42, a clamping and turning assembly 43, and a turning tray. The turning frame 41, the lifting assembly 42, and the clamping and turning assembly 43 are connected in sequence. The turning frame 41 can be fixedly arranged. The lifting assembly 42 is arranged on the turning frame 41. The lifting assembly 42 can make the clamping and turning assembly 43 rise or fall. The clamping and turning assembly 43 is used to clamp and turn over the turning tray and the tray on the tray transmission mechanism 1.

[0052] Specifically, the tray on the tray transmission mechanism 1 can be referred to as the transmission tray. When the transmission tray is transported to the flipping station, the first side of the chip on the transmission tray is exposed, and the first side of the chip has been detected by one of the visual inspection modules 3. The lifting assembly 42 drives the clamping flip assembly 43 and the flip tray to move toward the transmission tray directly below. At this time, the flip tray is clamped at the clamping flip assembly 43, and the front of the flip tray faces downward. After the flip tray moves downward until it is inverted on the transmission tray, the clamping flip assembly 43 clamps the flip tray and the transmission tray at the same time, flips the flip tray and the transmission tray 180 degrees at the same time, so that the transmission tray is located above the flip tray, and the chip is also flipped 180 degrees and falls into the flip tray. The clamping and flipping assembly 43 clamps the transmission tray, and the lifting assembly 42 drives the clamping and flipping assembly 43 and the transmission tray to rise (the transmission tray is the flipping tray in the next round of flipping), and the second side of the chip is exposed, so that another visual inspection module 3 can detect the second side of the chip.

[0053] In some embodiments, see Figure 3 and Figure 4 The clamping and flipping assembly 43 includes a clamping fixed seat 431 and at least two clamping and flipping structures 432. The number of the clamping and flipping structures 432 is two, three, four, etc., wherein the two clamping and flipping structures 432 are spaced apart and arranged opposite to each other, and are respectively used to clamp on opposite sides of the material tray.

[0054] The clamping and flipping structure 432 includes a clamping cylinder 4321, a cylinder fixing plate 4322, a flipping motor 4323 and a tray clamp 4324. The clamping cylinder 4321 is fixed on the cylinder fixing plate 4322. The cylinder rod of the clamping cylinder 4321 is fixedly connected to the clamping and fixing seat 431, so that when the clamping cylinder 4321 is working, the cylinder rod does not move, and the clamping cylinder 4321 itself slides relative to the clamping and fixing seat 431. The clamping cylinder 4321 is fixed on the cylinder fixing plate 4322, that is, the clamping cylinder 4321 and the cylinder fixing plate 4322 are slidably connected to the clamping and fixing seat 431. For two spaced-apart clamping and flipping structures 432, the distance between the two spaced-apart cylinder fixing plates 4322 can be shortened or lengthened to clamp or release the tray.

[0055] The flip motor 4323 is fixed on the cylinder fixing plate 4322, and the rotating end of the flip motor 4323 is fixedly connected to the material tray clamp 4324. In this way, the flip motor 4323 will move synchronously with the cylinder fixing plate 4322, so that the material tray clamp 4324 moves to clamp or release the material tray. Moreover, when the flip motor 4323 is working, the material tray clamp 4324 can be rotated, so that the material tray clamped by the material tray clamp 4324 can be flipped.

[0056] In some embodiments, see Figure 4The clamping and fixing seat 431 includes a clamping and fixing plate 4311 and a clamping and fixing block 4312, and the clamping and fixing plate 4311 and the clamping and fixing block 4312 are fixedly connected to each other. The cylinder fixing plate 4322 is slidably connected to the clamping and fixing plate 4311, and the cylinder fixing plate 4322 and the clamping and fixing plate 4311 can be vertically arranged, so that the distance between the end of the cylinder fixing plate 4322 away from the clamping and fixing plate 4311 is relatively far, so that the distance between the flipping motor 4323 and the clamping and fixing plate 4311 is relatively far, providing a certain flipping space for the material tray to flip. The clamping cylinder 4321 is fixed to the cylinder fixing plate 4322, and the cylinder rod of the clamping cylinder 4321 passes through the cylinder fixing plate 4322 and is fixedly connected to the clamping and fixing block 4312. In this way, when the clamping cylinder 4321 is working, the cylinder rod is fixed, and the clamping cylinder 4321 itself moves relative to the cylinder rod, that is, moves relative to the clamping fixing plate 4311.

[0057] Optionally, there is a sliding guide structure between the clamping plate 4311 and the cylinder fixing plate 4322 to make the sliding of the cylinder fixing plate 4322 more stable. For example, the clamping plate 4311 is provided with a first slide rail 43111, and the cylinder fixing plate 4322 is provided with a slide groove, so that the sliding of the cylinder fixing plate 4322 relative to the clamping plate 4311 is more stable.

[0058] Optionally, there are two clamping and flipping structures 432, and two cylinder fixing plates 4322 are respectively arranged on opposite sides of the clamping and fixing block 4312, and the cylinder rod passes through the cylinder fixing plate 4322 to the clamping and fixing block 4312. The two cylinder rods can be staggered (set in parallel with each other) to avoid the first slide rail 43111 and other structures, and the two cylinder rods can also be set opposite each other (the center lines of the two cylinder rods coincide with each other). It should be noted that a flipping space is formed between the two cylinder fixing plates 4322, and the clamping cylinder 4321 and the flipping motor 4323 are both fixed on the side of the cylinder fixing plate 4322 that is away from the flipping space, so that the flipping of the material tray will not be affected.

[0059] In some embodiments, see Figure 3 and Figure 4 The lifting assembly 42 includes a first lifting drive member 421, and the moving end of the first lifting drive member 421 is fixedly connected to the clamping fixed seat 431, so that the first lifting drive member 421 can drive the clamping and flipping assembly 43 to move up and down. The movement direction of the clamping and flipping assembly 43 is the vertical direction, so that it can move downward to approach or upward to move away from the tray transmission mechanism 1. The moving end of the first lifting drive member 421 can output linear motion, and the first lifting drive member 421 can be a drive member that can output linear motion, such as a cylinder.

[0060] Optionally, the moving end of the first lifting drive member 421 is fixedly connected to the clamping plate 4311. The clamping plate 4311 can be used as an installation platform for the clamping and flipping structure 432, and has a large installation area, which is convenient for installing the first lifting drive member 421 and the clamping plate 4311. The first lifting drive member 421 can be fixed on the flipping frame 41, and the moving end of the first lifting drive member 421 passes through the flipping frame 41 and is fixedly connected to the clamping plate 4311.

[0061] Optionally, the lifting assembly 42 further includes a guide rod 422, one end of which is fixed to the clamping fixing plate 4311, the other end of which passes through the flip frame 41, and the guide rod 422 can slide relative to the flip frame 41. The guide rod 422 is used to guide the lifting movement of the clamping flip assembly 43, so that the lifting movement of the clamping flip assembly 43 is more stable. The number of guide rods 422 can be multiple, and the multiple guide rods 422 are arranged around the first lifting drive member 421. For example, the number of guide rods 422 is two, and the two guide rods 422 are respectively arranged on both sides of the first lifting drive member 421.

[0062] In some embodiments of the present invention, see Figure 1 and Figure 2 The chip optical detection device further includes a loading mechanism 2 and / or a unloading mechanism 6. Specifically, there are three embodiments: the chip optical detection device includes a loading mechanism 2; the chip optical detection device includes an unloading mechanism 6; and the chip optical detection device includes a loading mechanism 2 and an unloading mechanism 6.

[0063] The loading mechanism 2 is used to place the tray loaded with chips on the tray conveying mechanism 1. The loading mechanism 2 can place trays one by one on the tray conveying mechanism 1 in sequence according to the production rhythm, and the tray conveying mechanism 1 will convey the trays to the corresponding workstations. The setting of the loading mechanism 2 can realize automatic loading of the trays without the need for manual transportation of the trays to the tray conveying mechanism 1.

[0064] The unloading mechanism 6 is used to collect the trays loaded with the tested chips. After the chip testing is completed, the corresponding trays need to be removed from the tray conveying mechanism 1. When the trays are transported to the unloading mechanism 6, the unloading mechanism 6 collects the trays (with tested chips) one by one. The setting of the unloading mechanism 6 can realize the automatic unloading of the trays, without the need for manual handling of the trays from the tray conveying mechanism 1.

[0065] In some embodiments, the structures of the loading mechanism 2 and the unloading mechanism 6 are exactly the same, that is, the loading mechanism 2 and the unloading mechanism 6 are universal, and there is no need to design multiple loading and unloading mechanisms, making the structure of the chip optical detection equipment relatively simple.

[0066] In some embodiments, see Figure 5 and Figure 6 The feeding mechanism 2 includes a hopper 22 , a second lifting drive member 23 and a telescopic drive member 25 .

[0067] The silo 22 is used to accommodate a plurality of stacked trays, and the inner cavity of the silo 22 can be set in a rectangular parallelepiped, so that the trays can be stacked in the silo 22. Optionally, the silo 22 includes four limiting walls connected end to end in sequence, and the four limiting walls surround a rectangular inner cavity. Optionally, the silo 22 includes four limiting bars with an L-shaped cross section, and the four limiting bars with an L-shaped cross section are arranged to form an inner cavity shape with a rectangular cross section, and each L-shaped limiting bar is used to limit each corner of the tray.

[0068] The second lifting drive member 23 is used to drive the telescopic drive member 25 to move up and down. The second lifting drive member 23 is fixedly connected to the bin 22, and the moving end of the second lifting drive member 23 is fixedly connected to the telescopic drive member 25. The second lifting drive member 23 is a drive member capable of outputting linear motion, such as a cylinder, etc. The direction of the linear motion output by the second lifting drive member 23 is the same as the stacking direction of the tray.

[0069] The telescopic driving member 25 has a telescopic direction perpendicular to the stacking direction of the materials, and in the feeding mechanism 2, the telescopic driving member 25 is used to separate the bottommost material tray of the stacked material tray from the bottom of the stacked material tray. The telescopic driving member 25 can be a structure such as a telescopic cylinder.

[0070] Specifically, when the loading mechanism 2 is not loading, the telescopic drive member 25 is located at the bottom of the stacked trays and is used to support the stacked trays. When the loading mechanism 2 is ready to load, the second lifting drive member 23 drives the telescopic drive member 25 down to near the tray transmission mechanism 1, and the stacked trays also drop accordingly, and the telescopic drive member 25 retracts and separates from the stacked trays, and the stacked trays fall into the tray transmission mechanism 1, and the second lifting drive member 23 drives the telescopic drive member 25 up to the second-to-last tray, and the telescopic drive member 25 clamps the second-to-last tray, or extends between the second-to-last tray and the bottom tray to support the remaining stacked trays, and the second lifting drive member 23 drives the telescopic drive member 25 up, thereby driving the stacked trays to rise, and at the same time the bottom tray remains on the tray transmission mechanism 1 and is transmitted by the tray transmission mechanism 1, so that the loading of one tray is completed.

[0071] When the unloading mechanism 6 has the same structure as the loading mechanism 2, the unloading process of the unloading mechanism 6 is as follows: when the unloading mechanism 6 is not unloading, the telescopic drive member 25 is located at the bottom of the stacked trays, used to support the stacked trays. When the unloading mechanism 6 is ready to unload, the second lifting drive member 23 drives the telescopic drive member 25 down to near the tray transmission mechanism 1, and the stacked trays also drop accordingly, and the telescopic drive member 25 retracts and separates from the stacked trays, and the stacked trays are stacked on the trays of the tray transmission mechanism 1. The second lifting drive member 23 drives the telescopic drive member 25 down to the trays on the tray transmission mechanism 1, and the telescopic drive member 25 clamps the bottom tray, or extends into the bottom of the bottom tray to support all trays. The second lifting drive member 23 drives the telescopic drive member 25 to rise, thereby driving the stacked trays to rise, and thus completing the unloading of one tray.

[0072] In some embodiments, see Figure 5 and Figure 6 The loading mechanism 2 also includes a loading and unloading rack 21, and a silo 22 is fixed on the loading and unloading rack 21. The setting of the loading and unloading rack 21 is convenient for installing the silo 22, and the position of the silo 22 can be changed by the loading rack, so that the height position of the stacked trays relative to the tray transmission mechanism 1 is more appropriate.

[0073] In some embodiments, see Figure 5 and Figure 6 The feeding mechanism 2 further includes a mounting plate 231, which is fixed on the silo 22, and the second lifting drive member 23 is fixed on the mounting plate 231. Specifically, the mounting plate 231 is fixed on the outer side of the silo 22, and the thickness direction of the mounting plate 231 is perpendicular to the stacking direction of the stacked material trays. The feeding mechanism 2 further includes a lifting plate 24, which is fixedly connected to the moving end of the second lifting drive member 23, and the telescopic drive member 25 is fixed on the lifting plate 24. The lifting plate 24 can be arranged parallel to the side wall of the silo 22, and the lifting plate 24 is slidably connected to the silo 22. A guide structure is arranged between the lifting plate 24 and the silo 22, so that the movement of the lifting plate 24 is more stable. For example, the guide structure includes a second slide rail 221 and a slide groove, and the second slide rail 221 is arranged on the outer side of the silo 22, and a guide groove is provided on the lifting plate 24, so that the lifting plate 24 can slide smoothly relative to the silo 22.

[0074] In some embodiments, the number of the telescopic driving members 25 is at least two, wherein the two telescopic driving members 25 are respectively disposed on opposite sides of the material tray to support the opposite sides of the stacked material tray. For example, the number of the telescopic driving members 25 is two, and the number of the second lifting driving members 23 is also two, and the two second lifting driving members 23 are respectively used to drive the corresponding two telescopic driving members 25. In other embodiments, the number of the telescopic driving members 25 is two, and the number of the second lifting driving member 23 can also be one, and the two telescopic driving members 25 are driven simultaneously by one second lifting driving member 23.

[0075] In some embodiments of the present invention, see Figure 1 and Figure 2 The tray transmission mechanism 1 is arranged end to end, which can make the space occupied by the tray transmission mechanism 1 smaller, and the tray transmission mechanism 1 is arranged in a ring shape as a whole. The visual inspection module 3, the tray turning mechanism 4, the loading mechanism 2, the unloading mechanism 6, etc. are also arranged in a ring shape to form a circular inspection device, which can not only reduce the space occupied by the chip optical inspection equipment, but also enable the loading mechanism 2 and the unloading mechanism 6 to be arranged adjacently, and the operator can place or recycle the stacked trays at the same position.

[0076] Optionally, the tray transmission mechanism 1 includes a circular track 11, a tray fixture, and a transmission drive. The tray fixture is used to install the tray, and the tray fixture can slide along the circular track 11 to transport the tray to the corresponding workstation. The transmission drive is used to drive the tray fixture to slide on the circular track 11. The specific structure of the transmission drive is not limited here, as long as it can drive the tray fixture. For example, the transmission drive includes a motor and a conveyor belt assembly, the motor drives the conveyor belt of the conveyor belt assembly to move, and the conveyor belt drives the tray fixture to move.

[0077] In some embodiments of the present invention, see Figure 7 The sorting mechanism 5 includes a first mobile module 51, a second mobile module 52 and a material taking and placing assembly 53 which are connected in sequence. The sorting mechanism 5 also includes a good product placement area 54 and a bad product placement area 55. The good product placement area 54 can be used to place chips that have been tested and have good quality, and the bad product placement area 55 is used to place bad product chips. The transportation direction of the first mobile module 51 and the transportation direction of the second mobile module 52 are set at an angle. For example, the transportation direction of the first mobile module 51 and the transportation direction of the second mobile module 52 are perpendicular to each other. The cooperation of the first mobile module 51 and the second mobile module 52 can make the material taking and placing assembly 53 move in the horizontal direction, for example, move between the tray transmission mechanism 1, the good product placement area 54 and the bad product placement area 55.

[0078] When the sorting mechanism 5 is working, the first movable module 51 and the second movable module 52 cooperate with each other to move the material picking and placing component 53 to the sorting station of the tray transmission mechanism 1, and the suction nozzle of the material picking and placing component 53 descends to take out the defective chips from the tray and move them to the defective product placement area 55. Then, the material picking and placing component 53 moves to the good product placement area 54, takes out the good chips from the good product placement area 54, and then moves to the empty position of the tray at the sorting station to fill the vacant position in the tray.

[0079] In some embodiments, see Figure 7 , the number of the first movable modules 51 is two, and they are arranged side by side. The first movable module 51 can be a screw-nut structure, and the first movable module 51 includes a first motor, a first screw and a first nut 513. The first motor drives the first screw to rotate, and the first nut 513 is threadedly connected to the first screw. The second movable module 52 is connected to the first nut 513, and the linear motion of the first nut 513 drives the second movable module 52 and the material taking and placing assembly 53 to move. The two first movable modules 51 are arranged in parallel with each other, that is, the two first screws are arranged in parallel with each other, and the two ends of the second movable module 52 can be respectively connected to the two first nuts 513, so that the movement of the second movable module 52 is more stable.

[0080] The second moving module 52 can be a screw-nut structure, and the second moving module 52 includes a second motor 521, a second screw 522, and a second nut 523. The second motor 521 drives the second screw 522 to rotate, and the second nut 523 is threadedly connected to the second screw 522. The material taking and placing assembly 53 is connected to the second nut 523, and the linear motion of the second nut 523 drives the material taking and placing assembly 53 to move. Among them, the frame of the second moving module 52 is connected to the first nut 513.

[0081] In other embodiments, the first moving module 51 and the second moving module 52 may also be other transmission structures capable of outputting linear motion.

[0082] In some embodiments, see Figure 8The material picking and unloading assembly 53 includes a material picking and unloading motor 531, a material picking and unloading gear 532, a material picking and unloading rack 533 and a suction cup structure 534. The material picking and unloading gear 532 is connected to the material picking and unloading motor 531, the material picking and unloading gear 532 and the material picking and unloading rack 533 are meshed with each other, the suction cup structure 534 and the material picking and unloading rack 533 are fixedly connected, and the suction cup structure 534 is used to adsorb the chip. The material picking and unloading motor 531 is used to drive the material picking and unloading gear 532 to rotate, the material picking and unloading gear 532 and the material picking and unloading rack 533 are meshed with each other, so that the material picking and unloading rack 533 moves linearly, thereby driving the suction cup structure 534 to move linearly. The material picking and unloading rack 533 is vertically arranged, and when its linear motion direction is vertical, the lifting and lowering motion of the suction cup structure 534 can be realized. The material picking and unloading assembly 53 can also be a structure that can output linear motion, such as a screw nut assembly and a cylinder.

[0083] In some embodiments of the present invention, see Figures 9 to 12 The visual inspection module 3 includes a third mobile module 31, a fourth mobile module 32 and a visual device 33 which are connected in sequence. The visual device 33 is used to photograph the chip, and whether the chip is a good chip can be determined based on the image of the photographed chip. The transportation directions of the third mobile module 31 and the fourth mobile module 32 are arranged at an angle. For example, the transportation directions of the third mobile module 31 and the fourth mobile module 32 are perpendicular to each other, so that the visual device 33 can be easily adjusted through the third mobile module 31 and the fourth mobile module 32, so that the visual device 33 can be directly opposite to the material tray below it.

[0084] See also Fig.10 The third moving module 31 includes a third motor 311, a first conveyor belt assembly 312, a third screw rod 313 and a third nut. The moving end of the third motor 311 is connected to the first conveyor belt assembly 312, the first conveyor belt assembly 312 is connected to the third screw rod 313, and the third nut is threadedly connected to the third screw rod 313. When the third motor 311 is working, the first conveyor belt assembly 312 moves, driving the third screw rod 313 to rotate, and the third screw rod 313 moves the third nut. The fourth moving module 32 is connected to the third nut, so that the third nut drives the fourth moving module 32 and the visual device 33 to move.

[0085] See also Fig.11, the fourth moving module 32 may have the same structure as the third moving module 31. The fourth moving module 32 includes a fourth motor 321, a second conveyor belt assembly 322, a fourth screw rod 323 and a fourth nut. The moving end of the fourth motor 321 is connected to the second conveyor belt assembly 322, the second conveyor belt assembly 322 is connected to the fourth screw rod 323, and the fourth nut is threadedly connected to the fourth screw rod 323. When the fourth motor 321 is working, the second conveyor belt assembly 322 moves, driving the fourth screw rod 323 to rotate, the fourth screw rod 323 moves the fourth nut, and the fourth nut is connected to the visual device 33, so that the fourth nut drives the visual device 33 to move.

[0086] In other embodiments, the third movable module 31 and the fourth movable module 32 may also be other types of structures, such as the same structure as the first movable module 51 in the above embodiment.

[0087] Optionally, the fourth movable module 32 is disposed above the third movable module 31 , so that the horizontal space occupied by the visual inspection module 3 is smaller.

[0088] In some embodiments of the present invention, see Fig.12 The visual device 33 includes a visual camera 331, a fine-tuning mechanism 333 and a light source assembly 332. The visual camera 331 is used to take pictures of the chip, the fine-tuning mechanism 333 is used to adjust the height of the visual camera 331, and the fine-tuning mechanism 333 is connected to the fourth mobile module 32. The light source assembly 332 is used to provide enough light for the chip so that the visual camera 331 has enough light when photographing the chip, and the light source assembly 332 is arranged below the visual camera 331.

[0089] Optionally, the visual device 33 further includes a visual frame 334 , the fine-tuning mechanism 333 is fixed on the visual frame 334 , and the visual frame 334 is fixedly connected to the moving end of the fourth moving module 32 .

[0090] Optionally, the light source assembly 332 includes an upper light source 3321 and a lower light source 3322, and the lower light source 3322 is arranged below the lower light source 3322. The visual device 33 also includes a first fixed adjustment frame 3323 and a second fixed adjustment frame 3324, the upper light source 3321 is fixed on the first fixed adjustment frame 3323, and the lower light source 3322 is fixed on the second fixed adjustment frame 3324, the first fixed adjustment frame 3323 and the second fixed adjustment frame 3324 are both mounted on the visual frame 334, and the position relative to the visual frame 334 is adjustable, so that the position of the upper light source 3321 and the lower light source 3322 can be adjusted. In some embodiments, a plurality of mounting holes are provided on the visual frame 334, and the first fixed adjustment frame 3323 and the second fixed adjustment frame 3324 can be selectively mounted on the corresponding mounting holes, so that the position of the upper light source 3321 and the lower light source 3322 can be adjusted.

[0091] Optionally, the fine-tuning mechanism 333 includes a fine-tuning fixing plate 3332, a fine-tuning body 3331 and a fine-tuning rotating member 3333. The fine-tuning fixing plate 3332 and the fine-tuning body 3331 are slidably connected, the fine-tuning fixing plate 3332 is fixedly connected to the vision frame 334, the fine-tuning body 3331 is fixedly connected to the vision camera 331, and the fine-tuning rotating member 3333 passes through the fine-tuning body 3331 and is threadedly connected to the fine-tuning fixing plate 3332. When the fine-tuning rotating member 3333 is rotated, the fine-tuning body 3331 slides relative to the fine-tuning fixing plate 3332, so that the height position of the vision camera 331 can be fine-tuned.

[0092] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip optical detection device, characterized in that: include: A tray transmission mechanism, used for transmitting a tray, wherein the tray is used for loading chips; A tray flipping mechanism, used to flip the chips in the tray; A sorting mechanism, used to take out defective chips and replenish good chips to the empty positions of the tray; The visual inspection module includes two visual inspection modules, which are respectively used to inspect the first side and the second side of the chip, wherein one of the visual inspection modules and the tray flipping mechanism, and the other visual inspection module and the sorting mechanism are sequentially arranged along the transmission direction of the tray transmission mechanism.

2. The chip optical detection device according to claim 1, characterized in that: The tray flipping mechanism includes a flipping frame, a lifting assembly, a clamping and flipping assembly, and a flipping tray. The flipping tray is used to be inverted on the tray located on the tray transmission mechanism. The flipping frame, the lifting assembly, and the clamping and flipping assembly are connected in sequence. The clamping and flipping assembly is used to clamp and flip the flipping tray and the tray located on the tray transmission mechanism.

3. The chip optical detection device according to claim 2, characterized in that: The clamping and flipping assembly includes a clamping fixed seat and at least two clamping and flipping structures, the clamping and flipping structure includes a clamping cylinder, a cylinder fixing plate, a flipping motor and a tray clamp, the cylinder fixing plate is slidably connected to the clamping fixed seat, the clamping cylinder and the flipping motor are both fixed to the cylinder fixing plate, and the cylinder rod of the clamping cylinder is fixedly connected to the clamping fixed seat, and the rotating motion end of the flipping motor is fixedly connected to the tray clamp.

4. The chip optical detection device according to claim 3, characterized in that: The clamping fixing seat includes a clamping fixing plate and a clamping fixing block fixed to the clamping fixing plate, the clamping cylinder is fixed to the cylinder fixing plate, the cylinder fixing plate is slidably connected to the clamping fixing plate, and the cylinder rod passes through the cylinder fixing plate and is fixedly connected to the clamping fixing block.

5. The chip optical detection device according to claim 3, characterized in that: The lifting assembly includes a first lifting driving member fixed to the overturning frame, and a moving end of the first lifting driving member is fixedly connected to the clamping fixing seat.

6. The chip optical detection device according to any one of claims 1 to 5, characterized in that: The chip optical inspection device also includes a loading mechanism and / or an unloading mechanism, wherein the loading mechanism is used to place the tray loaded with the chips on the tray transmission mechanism, and the unloading mechanism is used to collect the tray loaded with the inspected chips.

7. The chip optical detection device according to claim 6, characterized in that: The loading mechanism and / or the unloading mechanism includes a silo for accommodating a plurality of stacked trays, a second lifting drive member fixed to the silo, and a telescopic drive member fixedly connected to a moving end of the second lifting drive member, wherein the telescopic direction of the telescopic drive member is perpendicular to the stacking direction of the trays, and the telescopic drive member is used to separate the bottom layer of the stacked trays from the bottom of the stacked trays, or to stack the trays to the bottom of the stacked trays.

8. The chip optical detection device according to any one of claims 1 to 5, characterized in that: The tray transmission mechanisms are arranged end to end; and / or, The tray transmission mechanism includes an annular track, a tray fixture that slides along the annular track and is used to accommodate the tray, and a transmission drive member that is used to drive the tray fixture to slide.

9. The chip optical detection device according to any one of claims 1 to 5, characterized in that: The sorting mechanism includes a first mobile module, a second mobile module and a material picking and placing assembly which are connected in sequence, and also includes a good product placement area and a defective product placement area. The transport direction of the first mobile module and the transport direction of the second mobile module are arranged at an angle, so that the material picking and placing assembly can move between the material tray transmission mechanism, the good product placement area and the defective product placement area.

10. The chip optical detection device according to any one of claims 1 to 5, characterized in that: The visual inspection module includes a third mobile module, a fourth mobile module and a visual device which are connected in sequence. The transport direction of the third mobile module and the transport direction of the fourth mobile module are arranged at an angle. The visual device is used to photograph the chip.

11. The chip optical detection device according to claim 10, characterized in that: The visual device includes a visual camera, a fine-tuning mechanism for adjusting the height of the visual camera, and a light source assembly arranged below the visual camera, and the fine-tuning mechanism is interconnected with the fourth movable module.

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