Wafer-level reflow equipment

Abstract

The present invention provides a wafer-level reflow soldering equipment, which belongs to the field of reflow soldering technology, and solves the problems of low efficiency of existing reflow soldering equipment and poor wafer reflow soldering processing effect. It includes an EFEM system and a process area box placed on the rear side of the EFEM system, two wafer loaders and unloaders are arranged on the front side of the EFEM system, a control system is arranged on the side of the EFEM system, a handling robot and an equipment fan filter are arranged inside the EFEM system, a rotary welding system, a valve island box, a power supply box, a power distribution cabinet, an exhaust system and a formic acid storage tank are arranged inside the process area box, the formic acid storage tank is connected to the rotary welding system through a pipeline, and the air inlet of the formic acid storage tank is connected to an external liquid nitrogen tank through a pipeline. The present invention can stably transport and place the wafer, first heat up and then cool down the suspension uniform heating treatment and quickly cool down the suspension uniform cooling treatment, and realize positioning loading and auxiliary cooling and cooling treatment, so as to ensure high wafer processing efficiency and good processing effect.

Description

Technical Field

[0001] The invention belongs to the technical field of reflow soldering and relates to a wafer-level reflow soldering device. Background Art

[0002] With the continuous improvement of the miniaturization and integration of electronic components, the requirements for welding technology are getting higher and higher. Traditional welding methods may not be able to meet the precise welding needs of tiny components. Formic acid reflow soldering, with its precise temperature control and excellent wettability, can ensure high-quality welding on a micro scale, thereby meeting the manufacturing requirements of miniaturized and integrated components. As an efficient, high-quality and environmentally friendly welding technology, formic acid reflow soldering equipment will have broader development prospects in the future. At the same time, with the continuous advancement and innovation of technology, formic acid reflow soldering equipment will also continue to upgrade and improve, and develop in a more diversified and intelligent direction to better meet market demand.

[0003] Reflow soldering equipment is widely used in electronics, communications, computers, aerospace and other fields. Its working principle is to melt the metal powder in the solder paste by heating, and then gradually increase the temperature to make it cool and solidify quickly, so as to achieve a firm connection between the assembly and the circuit board.

[0004] Based on this, we propose a wafer-level reflow soldering equipment that can stably transport and place wafers, heat up and then cool down the wafers for uniform heating, quickly cool down the wafers for uniform cooling, and realize positioning loading and auxiliary cooling, ensuring high wafer processing efficiency and good processing effect. Summary of the invention

[0005] The purpose of the present invention is to address the above-mentioned problems in the existing technology and to propose a wafer-level reflow soldering equipment. The technical problem to be solved by the invention is: how to achieve stable transportation and placement of wafers, first heating up and then cooling down for uniform suspension heating treatment and rapid cooling and uniform suspension cooling treatment, as well as positioning loading and auxiliary cooling treatment, to ensure high wafer processing efficiency and good processing effect.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A wafer-level reflow soldering device comprises an EFEM system and a process area box arranged at the rear side of the EFEM system, wherein two wafer loaders are arranged at the front side of the EFEM system, a control system is arranged at the side of the EFEM system, a handling robot and an equipment fan filter are arranged inside the EFEM system, a rotary welding system, a valve island box, a power supply box, a power distribution cabinet, an exhaust system and a formic acid storage tank are arranged inside the process area box, the formic acid storage tank is connected to the rotary welding system through a pipeline, and an air inlet of the formic acid storage tank is connected to an external liquid nitrogen tank through a pipeline.

[0008] The working principle of the present invention is as follows: a plurality of wafers to be processed are placed on one of the wafer loaders and unloaders, and a handling robot places the wafers to be processed into a rotary welding system in sequence. An external liquid nitrogen tank injects nitrogen into a formic acid storage tank, and nitrogen and formic acid form a mixed gas. The mixed gas is injected into the upper and lower sides of the rotary welding system through a valve island box and enters the interior of the rotary welding system; the wafers are subjected to a heating treatment of first heating up and then cooling down, and a cooling treatment of cooling down. The metal powder in the solder paste is melted by the heating treatment, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, remove the oxides in the solder, and pass The over-cooling treatment allows it to cool down and solidify quickly, thereby achieving a firm connection between the assembly and the circuit board. During this process, the wafer will be lifted up, suspended and rotated when gas is injected from the bottom to ensure uniform heating of the wafer. In this system, the equipment fan filter is always working to ensure the cleanliness of the air inside the chamber. The cooled and solidified wafer is then placed on another wafer loader by a handling robot. The exhaust system discharges the formic acid volatile gas inside the process area box and the exhaust gas inside the rotating welding system. The power box mainly provides operating power for each electrical appliance. The distribution cabinet is used to distribute power to each electrical appliance.

[0009] The EFEM system includes an EFEM lower chassis and an EFEM upper chassis arranged at the upper end of the EFEM lower chassis, a robot control box is arranged inside the EFEM lower chassis, a handling robot is arranged inside the EFEM lower chassis, two wafer loaders are located on the front side of the EFEM lower chassis, a safety grating, an emergency stop switch and a warning light are arranged on the front side of the EFEM lower chassis, the safety grating is located on the front side of the two wafer loaders, foot cups and universal wheels are arranged at the four corners of the lower end of the EFEM lower chassis, a control touch screen and a plurality of control buttons are arranged on the side of the EFEM lower chassis, an equipment fan filter is arranged inside the EFEM upper chassis, a high-definition camera is arranged on the front side of the EFEM upper chassis, and a camera and an edge finder are arranged inside the EFEM upper chassis.

[0010] With the above structure, the robot control box is used to control the handling robot to perform various actions, the safety grating can monitor the working area at all times, ensure the safety of mechanical equipment, and improve the production efficiency of equipment; the high-definition camera is used to detect the external working environment, the emergency stop switch is used for emergency stop of equipment, the warning light flashes for warning under unconventional conditions, the control touch screen and several control buttons are used to set the operation information of each electrical equipment, the camera and the edge finder can stably monitor the internal activities of the transmission space, and the edge finder can detect the edge of the wafer surface through optical sensors to determine the position and direction of the wafer, greatly improving the transmission efficiency.

[0011] The control system mainly includes the FA factory end, CTC host computer and IAP slave computer. The CTC host computer mainly includes GUI and scheduling modules, and the IAP slave computer includes PLC module, Wafer Robot module and Load Port module, which is responsible for the control of the transmission module.

[0012] With the above structure, the FA factory side is the factory application level of the factory automation system, which ensures that the automation equipment can work continuously and stably; the main functions of the CTC host computer are data collection and processing, monitoring and display, control and command issuance, system interaction and information management, alarm and fault handling, to ensure the safe operation of the system; the main function of the IAP slave computer is to receive and parse upgrade instructions, firmware upgrade operations, feedback upgrade status, and ensure system security and stability.

[0013] The process area box includes a process lower chamber and a process upper chamber arranged at the upper end of the process lower chamber, a plurality of differential pressure gauges are arranged on the side of the process upper chamber, a formic acid storage tank, a valve island box, a power box and a distribution cabinet are all arranged inside the process lower chamber, a rotary welding system is arranged at the inner rear side of the process lower chamber, an exhaust system includes a gas cabinet exhaust component, an electric cabinet exhaust component, a process chamber exhaust component and a process chamber exhaust pipe, the gas cabinet exhaust component includes a gas cabinet and a gas cabinet exhaust pipe connected to the upper end of the gas cabinet and a gas cabinet flange pipe connected to the upper end of the gas cabinet exhaust pipe, the gas cabinet is arranged at the inner front side of the process upper chamber, the electric cabinet exhaust component includes an electric cabinet and an electric cabinet exhaust pipe connected to the upper end of the electric cabinet and an electric cabinet flange pipe group connected to the upper end of the electric cabinet exhaust pipe The gas cabinet and the electric cabinet are arranged on the inner front side of the process upper chamber, the gas cabinet exhaust pipe, the gas cabinet flange pipe, the electric cabinet exhaust pipe and the electric cabinet flange pipe extend out of the upper end of the process upper chamber, the process chamber exhaust pipe is connected to the upper end of the process upper chamber and is located directly above the rotary welding system, the process chamber exhaust component includes a connecting box, the connecting box is arranged on the inner front side of the process upper chamber, two process chamber exhaust pipes are provided at the lower end of the connecting box, one of the process chamber exhaust pipes is located above the formic acid storage tank, a butterfly valve and a differential pressure gauge are provided on the other process chamber exhaust pipe, the other process chamber exhaust pipe is connected to the rotary welding system, the upper end of the connecting box is provided with a process chamber flange pipe, and the process chamber flange pipe extends out of the upper end of the process upper chamber.

[0014] With the above structure, several differential pressure gauges are used to monitor the internal air pressure of the process upper chamber. The gas cabinet of the gas cabinet exhaust is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when gas leakage occurs in the gas cabinet to achieve the purpose of protecting personnel safety and equipment service life; Several electrical equipment are arranged inside the electric cabinet. The electrical equipment will generate heat and possible harmful gases during operation. The exhaust of the electric cabinet is to ensure the normal operation of the equipment and extend its service life;

[0015] One of the process chamber exhaust pipes is located above the formic acid storage tank and is used to discharge the volatilized formic acid from the formic acid storage tank to the connecting box and then to the process chamber flange pipe. When the rotary welding system is exhausting, the gas is discharged to the connecting box through another process chamber exhaust pipe and then to the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure and the butterfly valve is used to control the exhaust volume.

[0016] The rotary welding system comprises a lower fixed plate, the lower fixed plate is fixed to the inner bottom side of the process upper chamber, the upper end of the lower fixed plate is hinged with the upper fixed plate by two opening hinges, two symmetrically arranged turning power parts are arranged between the lower fixed plate and the upper fixed plate, a power motor is fixed to the middle part of the lower end of the lower fixed plate, a sealing mounting seat is fixed on the output shaft of the power motor, a supporting turntable is fixed on the upper end of the sealing mounting seat, and the supporting turntable is rotatably arranged between the upper fixed plate and the lower fixed plate, and six circumferentially evenly distributed heating and cooling disk members are arranged at the lower end of the lower fixed plate, and a lifting chamber assembly is arranged at the lower end of the heating and cooling disk members, wherein five heating and cooling disk members are each provided with a heating and cooling disk unit, and another heating and cooling disk member is provided with a loading cooling disk member, and the heating and cooling disk unit and the loading cooling disk member are both arranged above the lifting chamber assembly;

[0017] The upper end of the lower fixed plate is provided with a high vertical L-shaped valve, a flap assembly, a cooling cavity and four heating upper cavities, the flap assembly is located at the upper end of the loading cooling plate, the cooling cavity and the four heating upper cavities are arranged clockwise and are located at the upper end of the five heating and cooling plate units, the upper ends of the upper fixed plate and the four heating upper cavities are provided with a vacuum assembly, the vacuum assembly is connected to the exhaust pipe of another process chamber, the four heating upper cavities and the formic acid storage tanks and the heating and cooling plate units under the four heating upper cavities and the formic acid storage tanks are connected through a valve island box, the heating and cooling plate units under the cooling cavity and the loading cooling plate are connected to an external cold source, the upper end of the upper fixed plate is provided with an upper water pipe, the lower end of the lower fixed plate is provided with a lower water pipe, the lower water pipe is connected to the upper water pipe, and the lower water pipe and the upper water pipe are both connected to an external cold source.

[0018] With the above structure, two flip power parts drive the upper fixed plate to open and close at the upper end of the lower fixed plate through two flip hinges; the flap assembly is opened, and the handling robot places the wafers to be processed on the wafer loader and unloader on the support turntable above the loading and cooling plate in sequence. After the wafers to be processed are placed, the flip assembly is closed; the external liquid nitrogen tank injects nitrogen into the formic acid storage tank, and the nitrogen and formic acid form a mixed gas, which is injected into the upper heating cavity through the valve island box; the output shaft of the power motor drives the seal mounting seat to rotate intermittently, thereby driving the support turntable to rotate intermittently between the upper fixed plate and the lower fixed plate. , passing through five heating and cooling disks and the four heating upper cavities and cooling cavities at the corresponding positions in turn, the heating and cooling disk units under the four heating upper cavities and the formic acid storage tank are connected to the valve island box, and the temperature is first increased and then reduced. The metal powder in the solder paste is melted by heating treatment, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, and remove the oxide in the solder. The cooling cavity is connected to an external cold source to solidify the wafer through rapid cooling treatment, and then rotated back to the flap assembly and the loading cooling disk to perform auxiliary cooling treatment on the wafer. After the processing is completed, it is placed on another wafer loader and unloader through a handling robot; each time it passes a heating and cooling disk, the lifting chamber assembly lifts the heating and cooling disk unit and the loading and cooling disk, and then the external liquid nitrogen tank injects nitrogen into the formic acid storage tank. Nitrogen and formic acid form a mixed gas, which is injected into the hot cooling disk unit through the valve island box and blown onto the wafer above the heating and cooling disk unit, allowing the wafer to suspend and rotate to ensure that the wafer is heated evenly. The loading and cooling disk is connected to an external cold source to ensure that the wafer is cooled evenly, and then the injection of the mixed gas is stopped, and the wafer falls on the heating and cooling disk unit and the loading and cooling disk. On, the lifting chamber assembly then drops the heating and cooling plate unit and the loading cooling plate component, the heating and cooling plate unit and the loading cooling plate component are separated from the wafer, and the wafer is placed on the supporting turntable; the vacuum assembly is used to suck the waste gas generated after the working process between the four heating upper cavities and the heating and cooling plate components at the corresponding positions, and then discharge the waste gas to the connecting box through another process chamber exhaust pipe, and then discharge it from the process chamber flange pipe. The differential pressure gauge is used to monitor the air pressure, and the butterfly valve is used to control the exhaust volume; during the working process, the external cold source is drawn into the lower water pipe, and then enters the upper water pipe, and flows back to the external cold source for repeated use.

[0019] The lower fixed plate is provided with a plurality of avoidance through holes, and a sealing ring is provided on the outer edge of the upper end of the lower fixed plate; the flip power member includes a vertical plate and a hydraulic push rod, the vertical plate is fixed to the upper end of the upper fixed plate, and the two ends of the hydraulic push rod are respectively hinged to the lower fixed plate and the vertical plate, and the upper end of the upper fixed plate is provided with a loading port and five storage slots, and the loading port and the five storage slots are evenly distributed in a circle, and the loading port is located at the upper end of the loading cooling plate, and the upper end of the upper fixed plate is provided with an upper water pipe groove, and the upper water pipe is clamped inside the upper water pipe groove, and the upper end of the upper fixed plate is fixed with a plurality of quick clamps, and the quick clamps are detachably clamped on the lower fixed plate; the flap assembly includes a nitrogen pipeline flap and two Flap bracket, two flap brackets are fixed on the upper end of the upper fixed plate, and the two flap brackets are located on both sides of the loading port, one end of the nitrogen pipeline flap is hinged to the upper end of the upper fixed plate, and both sides of the other end of the nitrogen pipeline flap are provided with flap cylinders between the flap brackets on the same side, and the nitrogen pipeline flap is connected to an external cold source; six circumferentially evenly distributed sealing holes and one mounting through hole are provided on the support turntable, the mounting through hole is located in the middle position of the support turntable, the mounting through hole is connected to the upper end of the sealing mounting seat, and sealing rings are provided inside the sealing holes, and three circumferentially evenly distributed pin clamping grooves are provided on the sealing rings, and the pin clamping grooves can be detachably clamped with pin support plates.

[0020] With the above structure, the hydraulic push rod is extended, driving the vertical plate to pull the upper fixed plate to open through the two opening hinges, on the contrary, the hydraulic push rod is retracted, and the upper fixed plate is closed for easy installation. The loading port is used to place and remove the wafer, and the upper water pipe is engaged with the inside of the upper water pipe groove for cooling by cooling liquid. Several quick clamp locks are used to lock the upper fixed plate and the lower fixed plate to ensure that the upper and lower fixed plates are locked stably; when placing and removing the wafer, when the flap cylinder is retracted, the nitrogen pipeline flap is driven to rotate and open, on the contrary, when the flap cylinder is extended, the nitrogen pipeline flap is rotated and closed, and abuts against the loading port, and the nitrogen pipeline flap is connected to an external cold source, so that the nitrogen pipeline flap can be cooled, and the wafer is subjected to auxiliary cooling treatment; the sealing mounting seat drives the support turntable to rotate through the mounting through hole, and the three pin support plates are used to place the wafer, driving the wafer to rotate with the support turntable.

[0021] The heating upper cavity and the cooling cavity are detachably connected to the storage slots at corresponding positions, and the upper ends of the heating upper cavities are provided with upper cavity air inlet and outlet cover plates, and formic acid gas pipelines are connected between the four upper cavity air inlet and outlet cover plates, and the formic acid gas pipelines are connected to the air outlet of the formic acid storage tank through the valve island box. The upper end of the third heating upper cavity in counterclockwise order is provided with a vacuum pneumatic valve, and the formic acid gas pipeline connected to the third heating upper cavity in counterclockwise order is provided with a diaphragm sealing valve, and the lower ends of the four heating upper cavities are provided with upper heating discs; the vacuum pumping assembly includes a pressure chamber, the pressure chamber is fixedly connected to the middle part of the upper end of the upper fixed disc, and the pressure chamber is connected to the upper fixed disc, the upper end of the pressure chamber is connected with a conversion head, the conversion head is connected to the exhaust pipe of another process chamber, and a number of filter tanks are connected to the conversion head, and the filter tanks are respectively connected to the tops of the four upper cavity air inlet and outlet cover plates through filter tubes, and spiral heating tubes are provided inside the filter tubes, and the filter tubes connected to the third upper cavity air inlet and outlet cover plate in counterclockwise order are connected with aluminum baffle valves.

[0022] With the above structure, the external liquid nitrogen tank injects nitrogen into the formic acid storage tank, and the nitrogen and formic acid form a mixed gas. The mixed gas is injected into the four upper chamber inlet and outlet cover plates through the valve island box and the formic acid gas pipeline, and is heated by the upper heating plate to form a mixed hot gas. The vacuum pneumatic valve is used to switch the gas path and control the airflow to relieve pressure. The diaphragm sealing valve is used to cut off and adjust the injected mixed gas. When exhausting, the pressure chamber draws out the waste gas on the inner side of the upper fixed plate and enters the conversion head. The waste gas of the four heated upper chambers enters the filter tube through the four upper chamber inlet and outlet cover plates. The spiral heating tube inside the filter tube heats the inside of the filter tube to prevent cold air from entering the upper chamber inlet and outlet cover plates, thereby ensuring the internal temperature of the four heated upper chambers is stable. After the waste gas is drawn into the filter tank for filtration, the waste gas enters the conversion head and then enters another process chamber exhaust pipe for discharge. The aluminum baffle valve is used to control the exhaust flow of the third upper chamber inlet and outlet cover plate in counterclockwise order.

[0023] The lifting chamber assembly includes a fixed frame and a corrugated lifting sleeve, pneumatic push rods are fixed on both sides of the fixed frame, a lifting frame is fixed between the telescopic ends of the two pneumatic push rods, a lifting sleeve shaft is fixed on the upper end of the lifting frame, and the lifting sleeve shaft extends into and passes through the corrugated lifting sleeve; the heating and cooling plate component includes a lower cavity and a plurality of multi-way solenoid valves, the lower cavity is fixed to the lower end of the lower fixed plate, the fixed frame and the corrugated lifting sleeve are fixed to the lower end of the lower cavity at corresponding positions, the lower end of the corrugated lifting sleeve is fixed on the lifting sleeve shaft, a lower cavity is provided inside the lower cavity, and the lifting sleeve shaft passes through the lower cavity The upper end of the lifting sleeve shaft is fixedly connected to the lower end of the lower cavity, the upper end of the lower cavity is provided with a cavity sealing ring, the inner bottom of the lower cavity is provided with a lower pad, the interior of the lower cavity is provided with a lower heat insulation cover, the lower heat insulation cover is placed above the lower pad, the heating and cooling disk unit and the loading cooling disk are respectively arranged on the upper end of the lifting sleeve shaft at corresponding positions, and the heating and cooling disk unit and the loading cooling disk are respectively located inside the lower heat insulation cover at corresponding positions, a number of multi-way solenoid valves are placed inside the valve island box, and the several multi-way solenoid valves are respectively connected to the formic acid storage tank and the heating and cooling disk unit through pipelines.

[0024] With the above structure, the telescopic ends of the two pneumatic push rods drive the lifting frame to rise and fall, and the lifting frame drives the lifting sleeve shaft to rise and fall. When the lifting sleeve shaft rises, the corrugated lifting sleeve is compressed for sealing. The lifting sleeve shaft drives the lower cavity to rise and fall. At this time, the lower pad and the lower heat insulation cover are lifted and lowered synchronously. When the lower cavity rises, the cavity sealing ring contacts the lower end of the sealing ring for sealing. At the same time, the lifting sleeve shaft drives the heating and cooling disk unit and the loading and cooling disk component to rise and fall. When the heating and cooling disk unit and the loading and cooling disk component are lifted, the wafer is lifted off the three pin support plates. The lower heat insulation cover is used for heat insulation. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank. Nitrogen and formic acid form a mixed gas. The mixed gas is injected into the hot cooling disk unit through several multi-way solenoid valves inside the valve island box and blown onto the wafer above the heating and cooling disk unit, so that the wafer is suspended and rotated to ensure that the wafer is heated evenly.

[0025] The heating and cooling plate unit comprises a lower plate body and a lower heating plate bottom cover, a suspended ventilation cylinder is fixed on the upper end of the lower plate body, a plurality of spiral ventilation grooves are provided on the inner wall of the suspended ventilation cylinder, a plurality of groups of inclined ventilation holes are provided on the upper end of the lower plate body, the ventilation holes are connected to the multi-way solenoid valves at corresponding positions through pipelines, a plurality of temperature measuring holes are provided on the upper end of the lower plate body, three circumferentially evenly distributed avoidance holes are provided on the lower plate body and the suspended ventilation cylinder, the avoidance holes are located below the pin support plates at corresponding positions, a heat insulation board is fixed on the upper end of the lower heating plate bottom cover, a plurality of circumferentially evenly distributed heat insulation air guide boxes are fixed on the upper end of the heat insulation board, and the heat insulation air guide boxes are located at a group of ventilation holes at corresponding positions. Directly below the air hole, a guide tube is fixed to the lower end of the bottom cover of the lower heating plate, and the guide tube is inserted into the lifting sleeve shaft at the corresponding position, and the guide tube is connected with the lifting sleeve shaft at the corresponding position. A number of wiring holes evenly distributed around the circumference are opened inside the heat insulation plate, one end of the wiring hole is connected with the guide tube, and the other end of the wiring hole is connected with the heat-insulating air guide box at the corresponding position; an electric heating wire is provided at the lower end of the lower plate body of four heating and cooling plate units, and the wiring terminal of the electric heating wire extends into and passes through the guide tube at the corresponding position; a cooling coil is provided at the lower end of the lower plate body of another heating and cooling plate unit, and the connecting end of the cooling coil extends into and passes through the guide tube at the corresponding position, and the connecting end of the cooling coil is connected to an external cold source.

[0026] With the above structure, the wiring hole is connected with the guide tube and the heat-insulating air guide box, and the guide tube is connected with the lifting sleeve shaft at the corresponding position, which is used to place the pipeline between the vent hole and the multi-way solenoid valve at the corresponding position. At the same time, the guide tube is connected with the lifting sleeve shaft at the corresponding position, which is used to route the wiring terminals of electrical equipment such as electric heating wires and temperature sensors. The mixed gas is injected into the vent hole through a plurality of multi-way solenoid valves inside the valve island box to form mixed hot air, which is blown onto the wafer above the heating and cooling plate unit. The air flow is blown out through a plurality of spiral ventilation grooves on the inner wall of the suspension vent tube, so that the wafer is stably suspended and rotated, ensuring that the wafer is heated evenly; the temperature measurement hole is used to install the temperature sensor, the avoidance hole 1 is used to avoid the pin support plate, the heat insulation plate is used to insulate and protect the transmission line and the pipeline between the vent hole and the multi-way solenoid valve at the corresponding position, and the heat insulation air guide box is used to insulate and protect the pipeline between the vent hole and the multi-way solenoid valve at the corresponding position; the external cold source is injected into the cooling coil to cool the lower plate to form mixed cold air, which also allows the wafer to be stably suspended and rotated to ensure that the wafer is cooled evenly.

[0027] The loading cooling disk assembly includes a lock insulation disk, which is inserted into the lifting sleeve shaft at the corresponding position, and the lock insulation disk is located in the lower insulation cover at the corresponding position. A lock cooling upper disk is provided at the upper end of the lock insulation disk, and an avoidance groove and three circumferentially evenly distributed avoidance holes are opened at the upper end of the lock cooling upper disk. A lock cooling pipe is provided between the lock cooling upper disk and the lock insulation disk, and the connection end of the lock cooling pipe extends out of the lock insulation disk, and the connecting end of the lock cooling pipe extends into and passes through the guide tube at the corresponding position, and the connecting end of the lock cooling pipe is connected to an external cold source.

[0028] With the above structure, the lifting sleeve shaft drives the lock insulation plate to rise and fall, thereby driving the lock cooling upper plate and the lock cooling pipe to rise and fall, and the external cold source is injected into the lock cooling pipe to cool the lock cooling upper plate, and the lock cooling upper plate performs auxiliary cooling treatment on the wafer above it, and the lock insulation plate is used for thermal insulation.

[0029] Compared with the existing technology, this wafer-level reflow equipment has the following advantages:

[0030] Through the cooperation of the EFEM system, the handling robot, the safety grating and the equipment fan filter, the wafers can be stably handled and the air cleanliness inside the chamber can be guaranteed. At the same time, through the cooperation of the handling robot and two wafer loaders, the wafers before and after processing can be stably handled. Through the cooperation of the formic acid storage tank, the valve island box and the rotary welding system, the wafers can be heated first and then cooled, cooled quickly and cooled assistedly. The heating treatment is first performed to melt the metal powder in the solder paste, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, remove the oxide in the solder, and then cool and solidify the wafer. Through the flip plate assembly, the loading cooling plate, the heating cooling plate and the lifting chamber assembly and the lower fixed plate and the upper fixed plate The loading chamber is formed by cooperation to realize positioning loading and auxiliary cooling treatment; four heating chambers are formed respectively by cooperation between four heating upper cavities and the heating and cooling plate units with electric heating wires installed at the corresponding positions, the heating and cooling plate parts and the lifting chamber assembly and the lower fixed plate and the upper fixed plate; the heating and cooling plate unit cooperates with the formic acid storage tank and the valve island box to blow hot air on the wafer, so that the wafer can be stably suspended and rotated, ensuring uniform heating of the wafer; a cooling chamber is formed by cooperation between the cooling cavity and the heating and cooling plate units with cooling coils installed at the corresponding positions, the heating and cooling plate parts and the lifting chamber assembly and the lower fixed plate and the upper fixed plate; the heating and cooling plate unit cooperates with the formic acid storage tank and the valve island box to blow cold air on the wafer, so that the wafer can be stably suspended and rotated, ensuring uniform cooling of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the front three-dimensional structure of the present invention.

[0032] Figure 2 It is a schematic diagram of the rear three-dimensional structure of the present invention.

[0033] Figure 3 It is a front side stereoscopic structural diagram of the EFEM system, control system and wafer handling machine in the present invention.

[0034] Figure 4 It is a schematic diagram of the rear three-dimensional structure of the EFEM system, control system and wafer handling machine in the present invention.

[0035] Figure 5 It is a schematic diagram of the right three-dimensional structure of the exhaust system, process area box and rotary welding system in the present invention.

[0036] Figure 6 It is a schematic diagram of the left three-dimensional structure of the exhaust system, process area box and rotary welding system in the present invention.

[0037] Figure 7 It is a three-dimensional structural schematic diagram of the rotary welding system in the present invention.

[0038] Figure 8 It is a schematic diagram of the exploded structure of the rotary welding system in the present invention.

[0039] Fig. 9 It is a schematic diagram of the exploded structure of the heating and cooling disk in the present invention.

[0040] Fig.10 It is a schematic diagram of the upper exploded structure of the heating and cooling disk unit in the present invention.

[0041] Fig.11 It is a schematic diagram of the exploded structure of the lower side of the heating and cooling plate unit in the present invention when it is used as a heating plate.

[0042] Fig.12 It is a partial structural schematic diagram of the heating-cooling disk unit in the present invention when used as a cooling disk.

[0043] Fig.13 It is a schematic diagram of the exploded structure of the cooling plate loading device in the present invention.

[0044] Fig.14 It is a partial cross-sectional schematic diagram of the rotary welding system in the present invention.

[0045] Fig.15 It is a schematic diagram of the exhaust system in the present invention.

[0046] In the figure, 1. EFEM system; 2. control system; 3. wafer loader; 4. exhaust system; 5. process area box; 6. EFEM lower chassis; 7. EFEM upper chassis; 8. emergency stop switch; 9. high-definition camera; 10. warning light; 11. control touch screen; 12. foot cup; 13. universal wheel; 14. robot control box; 15. handling robot; 16. safety grating; 17. process upper chamber; 18. gas cabinet exhaust parts; 19. electric cabinet exhaust parts; 20. process chamber exhaust parts; 21. process chamber exhaust pipe; 22. rotary welding system; 23. valve island box; 24. power box; 25. distribution cabinet; 26. 1. Process chamber; 2. Butterfly valve; 2. Differential pressure gauge; 2. Process chamber exhaust pipe; 3. Formic acid storage tank; 3. Differential pressure gauge; 3. Upper fixed plate; 3. Lifting chamber assembly; 3. Cooling chamber; 3. Lower fixed plate; 3. Flipping power piece; 3. Quick clamp lock buckle; 3. Heating upper chamber; 3. Vacuuming assembly; 4. Flap assembly; 4. High-pressure L-type valve; 4. Pressure chamber; 4. Conversion head; 4. Filter tank; 4. Aluminum baffle valve; 4. Spiral heating tube; 4. Upper chamber inlet and outlet cover plate; 4. Vacuum pneumatic valve; 4. Formic acid gas pipeline; 5. Diaphragm sealing valve; 51. Flap Bracket; 52, flap cylinder; 53, nitrogen pipeline flap; 54, upper water pipe groove; 55, loading port; 56, storage slot hole; 57, vertical plate; 58, pin snap-in groove; 59, installation through hole; 60, sealing hole; 61, sealing ring; 62, pin support plate; 63, upper water pipe; 64, open hinge; 65, sealing ring; 66, avoid through hole; 67, hydraulic push rod; 68, lower water pipe; 69, sealing mounting seat; 70, power motor; 71, loading cooling plate; 72, heating cooling plate; 73, lifting frame; 74, pneumatic push rod; 75, corrugated lifting sleeve; 76, lower cavity; 77, lower mold cavity; 78, lower pad; 79, lower heat insulation cover; 80, heating and cooling plate unit; 81, avoidance hole one; 82, suspended ventilator; 83, spiral vent groove; 84, vent; 85, temperature measurement hole; 86, heat insulation air guide box; 87, wiring hole; 88, heat insulation board; 89, multi-way solenoid valve; 90, lower plate; 91, electric heating wire; 92, lower heating plate bottom cover; 93, guide cylinder; 94, cooling coil; 95, support turntable; 96, avoidance hole two; 97, avoidance groove; 98, lock cooling upper plate; 99, lock insulation plate; 100, lock cooling pipe; 101, fixed frame; 102, lifting sleeve shaft. DETAILED DESCRIPTION

[0047] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0048] like Figure 1-Figure 15As shown, the wafer-level reflow soldering equipment includes an EFEM system 1 and a process area box 5 disposed at the rear side of the EFEM system 1, two wafer loaders 3 are disposed at the front side of the EFEM system 1, a control system 2 is disposed at the side of the EFEM system 1, a handling robot 15 and an equipment fan filter are disposed inside the EFEM system 1, a rotary welding system 22, a valve island box 23, a power supply box 24, a power distribution cabinet 25, an exhaust system 4 and a formic acid storage tank 30 are disposed inside the process area box 5, the formic acid storage tank 30 is connected to the rotary welding system 22 through a pipeline, and the air inlet of the formic acid storage tank 30 is connected to an external liquid nitrogen tank through a pipeline.

[0049] A number of wafers to be processed are placed on one of the wafer loaders and unloaders 3, and the handling robot 15 places the wafers to be processed into the rotary welding system 22 in sequence. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixed gas. The mixed gas is injected into the upper and lower sides of the rotary welding system 22 through the valve island box 23 and enters the interior of the rotary welding system 22; the wafers are subjected to a heating treatment and a cooling treatment, and the metal powder in the solder paste is melted by the heating treatment, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, remove the oxide in the solder, and cool down the wafer. The cooling treatment makes it cool down and solidify quickly, so as to realize the firm connection between the assembly and the circuit board. In this process, the wafer will be lifted up, suspended and rotated when the gas is injected from the lower side to ensure the uniform heating of the wafer. In this system, the equipment fan filter is always working to ensure the cleanliness of the air inside the chamber. The cooled and solidified wafer is then placed on another wafer loader 3 by the handling robot 15. The exhaust system 4 discharges the formic acid volatile gas inside the process area box 5 and the exhaust gas inside the rotating welding system 22. The power box 24 mainly provides operating power for each electrical appliance. The distribution cabinet 25 is used to distribute electricity to each electrical appliance.

[0050] The EFEM system 1 includes an EFEM lower chassis 6 and an EFEM upper chassis 7 arranged at the upper end of the EFEM lower chassis 6, a robot control box 14 is arranged inside the EFEM lower chassis 6, a handling robot 15 is arranged inside the EFEM lower chassis 6, two wafer loaders 3 are located on the front side of the EFEM lower chassis 6, a safety grating 16, an emergency stop switch 8 and a warning light 10 are arranged on the front side of the EFEM lower chassis 6, the safety grating 16 is located on the front side of the two wafer loaders 3, foot cups 12 and universal wheels 13 are arranged at the four corners of the lower end of the EFEM lower chassis 6, a control touch screen 11 and a plurality of control buttons are arranged on the side of the EFEM lower chassis 6, an equipment fan filter is arranged inside the EFEM upper chassis 7, a high-definition camera 9 is arranged on the front side of the EFEM upper chassis 7, and a camera and an edge finder are arranged inside the EFEM upper chassis 7.

[0051] The robot control box 14 is used to control the transport robot 15 to perform various actions. The safety grating 16 can monitor the working area at all times to ensure the safety of mechanical equipment and improve equipment production efficiency. The high-definition camera 9 is used to detect the external working environment. The emergency stop switch 8 is used for emergency stop of equipment. The warning light 10 flashes for warning under unconventional conditions. The control touch screen 11 and several control buttons are used to set the operating information of each electrical equipment. The camera and edge finder can stably monitor the internal activities of the transmission space, and the edge finder can detect the edge of the wafer surface through optical sensors to determine the position and direction of the wafer, thereby greatly improving the transmission efficiency.

[0052] The control system mainly includes the FA factory end, CTC host computer and IAP slave computer. The CTC host computer mainly includes GUI and scheduling modules, and the IAP slave computer includes PLC module, Wafer Robot module and Load Port module, which is responsible for the control of the transmission module.

[0053] The FA factory side is the factory application level of the factory automation system. The FA factory side ensures that the automation equipment can work continuously and stably. The main functions of the CTC host computer are data collection and processing, monitoring and display, control and command issuance, system interaction and information management, alarm and fault handling, to ensure the safe operation of the system. The main function of the IAP slave computer is to receive and parse upgrade instructions, firmware upgrade operations, feedback upgrade status, and ensure system security and stability.

[0054] The process area box 5 includes a process lower chamber 26 and a process upper chamber 17 arranged at the upper end of the process lower chamber 26. A plurality of differential pressure gauges 31 are arranged on the side of the process upper chamber 17. The formic acid storage tank 30, the valve island box 23, the power box 24 and the distribution cabinet 25 are all arranged inside the process lower chamber 26. The rotary welding system 22 is arranged at the inner rear side of the process lower chamber 26. The exhaust system 4 includes a gas cabinet exhaust member 18, an electric cabinet exhaust member 19, a process chamber exhaust member 20 and a process chamber exhaust pipe 21. The gas cabinet exhaust member 18 includes a gas cabinet and a gas cabinet exhaust pipe connected to the upper end of the gas cabinet and a gas cabinet flange pipe connected to the upper end of the gas cabinet exhaust pipe. The gas cabinet is arranged on the inner front side of the process upper chamber 17. The electric cabinet exhaust member 19 includes an electric cabinet and an electric cabinet exhaust pipe connected to the upper end of the electric cabinet and an electric cabinet flange connected to the upper end of the electric cabinet exhaust pipe. The process chamber exhaust pipe 21 is connected to the upper end of the process chamber 17 and is located directly above the rotary welding system 22. The process chamber exhaust component 20 includes a connecting box, which is arranged on the inner front side of the process chamber 17. Two process chamber exhaust pipes 29 are provided at the lower end of the connecting box, one of which is located above the formic acid storage tank 30. A butterfly valve 27 and a differential pressure gauge 28 are provided on the other process chamber exhaust pipe 29. The other process chamber exhaust pipe 29 is connected to the rotary welding system 22. A process chamber flange connecting pipe is provided at the upper end of the connecting box, which extends out of the upper end of the process chamber 17.

[0055] A plurality of differential pressure gauges 31 are used to monitor the internal air pressure of the process upper chamber 17. The gas cabinet of the gas cabinet exhaust part 18 is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when a gas leak occurs in the gas cabinet, so as to protect the safety of personnel and the service life of the equipment. A plurality of electrical equipment are arranged inside the electric cabinet. The electrical equipment will generate heat and possible harmful gases during operation. The exhaust of the electric cabinet is to ensure the normal operation of the equipment and extend its service life.

[0056] One of the process chamber exhaust pipes 29 is located above the formic acid storage tank 30, and is used to discharge the volatilized formic acid in the formic acid storage tank 30 to the connecting box, and then discharged from the process chamber flange pipe. When the rotary welding system 22 is exhausting, the gas is discharged to the connecting box through another process chamber exhaust pipe 29, and then discharged from the process chamber flange pipe. The differential pressure gauge is used to monitor the air pressure, and the butterfly valve is used to control the exhaust volume.

[0057] The rotary welding system 22 includes a lower fixed plate 35, which is fixed to the inner bottom side of the process upper chamber 17. The upper end of the lower fixed plate 35 is hinged to the upper fixed plate 32 through two opening hinges 64. Two symmetrically arranged flip power members 36 are arranged between the lower fixed plate 35 and the upper fixed plate 32. A power motor 70 is fixed to the middle part of the lower end of the lower fixed plate 35. A sealing mounting seat 69 is fixed to the output shaft of the power motor 70. A supporting turntable 95 is fixed to the upper end of the sealing mounting seat 69. The supporting turntable 95 is rotatably arranged between the upper fixed plate 32 and the lower fixed plate 35. Six circumferentially evenly distributed heating and cooling discs 72 are arranged at the lower end of the lower fixed plate 35. The lower ends of the heating and cooling discs 72 are all provided with lifting chamber assemblies 33, wherein five heating and cooling discs 72 are all provided with heating and cooling disc units 80, and another heating and cooling disc 72 is provided with a loading and cooling disc 71, and the heating and cooling disc unit 80 and the loading and cooling disc 71 are both arranged above the lifting chamber assembly 33.

[0058] The upper end of the lower fixed plate 35 is provided with a high vertical air L-shaped valve 41, a flap assembly 40, a cooling cavity 34 and four heating upper cavities 38. The flap assembly 40 is located at the upper end of the loading cooling plate 71. The cooling cavity 34 and the four heating upper cavities 38 are arranged clockwise and are located at the upper end of the five heating cooling plate units 80. The upper end of the upper fixed plate 32 and the four heating upper cavities 38 is provided with a vacuum assembly 39. The vacuum assembly 39 is connected to another process chamber exhaust pipe 29. The four heating upper cavities 3 8 and the formic acid storage tank 30, and the heating and cooling disk units 80 below the four heating upper cavities 38 and the formic acid storage tank 30 are all connected through the valve island box 23, the heating and cooling disk unit 80 below the cooling cavity 34 and the loading cooling disk 71 are connected to an external cold source, an upper water pipe 63 is provided at the upper end of the upper fixed disk 32, and a lower water pipe 68 is provided at the lower end of the lower fixed disk 35, the lower water pipe 68 is connected to the upper water pipe 63, and the lower water pipe 68 and the upper water pipe 63 are both connected to an external cold source.

[0059] The two flip power members 36 drive the upper fixed plate 32 to open and close at the upper end of the lower fixed plate 35 through the two flip hinges 64; the flap assembly 40 is opened, and the handling robot 15 places the wafers to be processed on the wafer loading and unloading machine on the support turntable 95 above the loading and cooling plate member 71 in sequence. After the wafers to be processed are placed, the flip assembly 40 is closed; the external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixed gas, which is injected into the heating upper cavity 38 through the valve island box 23; the output shaft of the power motor 70 drives the sealing mounting seat 69 to rotate intermittently, thereby driving the support turntable 95 between the upper fixed plate 32 and the lower fixed plate 35. The cooling chamber 34 is connected to the valve island box 23, and the heating and cooling disc units 80 under the four upper heating cavities 38 and the formic acid storage tank 30 are connected to the valve island box 23, and the heating treatment is first heated and then cooled. The metal powder in the solder paste is melted by the heating treatment, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, and remove the oxide in the solder. The cooling chamber 34 is connected to an external cold source, and the wafer is quickly cooled and cooled for solidification, and then rotated back to between the flap assembly 40 and the loading cooling disc 71, and the wafer is subjected to auxiliary cooling treatment. After the processing is completed, it is placed on another wafer loading and unloading machine 3 through the handling robot 15; each time it passes a heating and cooling disk 72, the lifting chamber assembly 33 lifts the heating and cooling disk unit 80 and the loading cooling disk 71, and then the external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixed gas, which is injected into the hot cooling disk unit 80 through the valve island box 23 and blown onto the wafer above the heating and cooling disk unit 80, so that the wafer is suspended and rotated to ensure that the wafer is heated evenly, and the loading cooling disk 71 is connected to an external cold source to ensure that the wafer is cooled evenly, and then the injection of the mixed gas is stopped, and the wafer falls on the heating and cooling disk unit 80 and the loading cooling disk 71. On, the lifting chamber assembly 33 then drops the heating and cooling disk unit 80 and the loading and cooling disk component 71, and the heating and cooling disk unit 80 and the loading and cooling disk component 71 are separated from the wafer, and the wafer is placed on the supporting turntable 95; the vacuum assembly 39 is used to absorb the waste gas generated after the working process between the four heating upper cavities 38 and the heating and cooling disk components 72 at the corresponding positions, and then discharge the waste gas to the connecting box through another process chamber exhaust pipe 29, and then discharge it from the process chamber flange pipe, the differential pressure gauge is used to monitor the air pressure, and the butterfly valve is used to control the exhaust volume; during the working process, the external cold source is drawn into the lower water pipe 68, and then enters the upper water pipe 63, and flows back to the external cold source for repeated use.

[0060] The lower fixed plate 35 is provided with a plurality of escape through holes 66, and a sealing ring 65 is provided on the outer edge of the upper end of the lower fixed plate 35; the flip power member 36 includes a vertical plate 57 and a hydraulic push rod 67, the vertical plate 57 is fixed to the upper end of the upper fixed plate 32, and the two ends of the hydraulic push rod 67 are respectively hinged on the lower fixed plate 35 and the vertical plate 57, and the upper end of the upper fixed plate 32 is provided with a loading port 55 and five storage slots 56, and the loading port 55 and the five storage slots 56 are evenly distributed in a circle, and the loading port 55 is located at the upper end of the loading cooling plate member 71, and the upper end of the upper fixed plate 32 is provided with an upper water pipe groove 54, and the upper water pipe 63 is clamped inside the upper water pipe groove 54, and the upper end of the upper fixed plate 32 is fixed with a plurality of quick clamp lock buckles 37, and the quick clamp lock buckle 37 is detachably clamped on the lower fixed plate 35; the flap assembly 40 includes a nitrogen pipeline flap 53 and two flap brackets 51, the two flap brackets 51 are fixed on the upper end of the upper fixed plate 32, and the two flap brackets 51 are located on both sides of the loading port 55, one end of the nitrogen pipeline flap 53 is hinged to the upper end of the upper fixed plate 32, and both sides of the other end of the nitrogen pipeline flap 53 are provided with flap cylinders 52 between the flap brackets 51 on the same side, and the nitrogen pipeline flap 53 is connected to an external cold source; six circumferentially evenly distributed sealing holes 60 and a mounting through hole 59 are opened on the support turntable 95, the mounting through hole 59 is located in the middle position of the support turntable 95, and the mounting through hole 59 is connected to the upper end of the sealing mounting seat 69, and the inside of the sealing hole 60 is provided with a sealing ring 61, and the sealing ring 61 is provided with three circumferentially evenly distributed pin clamping grooves 58, and the inside of the pin clamping groove 58 can be detachably clamped with a pin support plate 62.

[0061] The hydraulic push rod 67 extends, driving the vertical plate 57 to pull the upper fixed plate 32 to open through the two opening hinges 64. Conversely, the hydraulic push rod 67 is retracted, and the upper fixed plate 32 is closed for easy installation. The loading port 55 is used to place and remove wafers. The upper water pipe 63 is engaged with the inside of the upper water pipe groove 54 for cooling with cooling liquid. A plurality of quick clamp lock buckles 37 are used to lock the upper fixed plate 32 and the lower fixed plate 35 to ensure that the upper fixed plate 32 and the lower fixed plate 35 are locked stably. When placing and removing wafers, the flip-up When the plate cylinder 52 is retracted, the nitrogen pipeline flap 53 is driven to rotate and open. Conversely, when the flap cylinder 52 is extended, the nitrogen pipeline flap 53 is rotated and closed, and abuts against the loading port 55. The nitrogen pipeline flap 53 is connected to an external cold source, which can cool the nitrogen pipeline flap 53 and perform auxiliary cooling treatment on the wafer; the sealing mounting seat 69 drives the support turntable 95 to rotate through the mounting through hole 59, and the three pin support plates 62 are used to place the wafer, driving the wafer to rotate with the support turntable 95.

[0062] The heating upper cavity 38 and the cooling cavity 34 are detachably connected to the inside of the storage slot 56 at the corresponding position. The upper end of the heating upper cavity 38 is provided with an upper cavity air inlet and outlet cover plate 47. A formic acid gas pipeline 49 is connected between the four upper cavity air inlet and outlet cover plates 47. The formic acid gas pipeline 49 is connected to the gas outlet of the formic acid storage tank 30 through the valve island box 23. The upper end of the third heating upper cavity 38 in counterclockwise order is provided with a vacuum pneumatic valve 48, and the formic acid gas pipeline 49 connected to the third heating upper cavity 38 in counterclockwise order is provided with a diaphragm sealing valve 50. The lower ends of the four heating upper cavities 38 are provided with upper Heating plate body; the vacuum assembly 39 includes a pressure chamber 42, the pressure chamber 42 is fixedly connected to the middle part of the upper end of the upper fixed plate 32, and the pressure chamber 42 is communicated with the upper fixed plate 32, the upper end of the pressure chamber 42 is connected with a conversion head 43, the conversion head 43 is connected with another process chamber exhaust pipe 29, the conversion head 43 is connected with a plurality of filter tanks 44, the filter tanks 44 are respectively connected with the tops of the four upper chamber air inlet and outlet cover plates 47 through filter tubes, the inside of the filter tubes are provided with spiral heating tubes 46, and the filter tube connected to the third upper chamber air inlet and outlet cover plate 47 in counterclockwise order is connected with an aluminum baffle valve 45.

[0063] The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixed gas. The mixed gas is injected into the four upper cavity inlet and outlet gas cover plates 47 through the valve island box 23 and the formic acid gas pipeline 49, and is heated by the upper heating plate to form a mixed hot gas. The vacuum pneumatic valve 48 is used to switch the gas path and control the airflow to relieve pressure. The diaphragm sealing valve 50 is used to cut off and adjust the injected mixed gas. When exhausting, the pressure chamber 42 draws out the exhaust gas inside the upper fixed plate 32 and enters the conversion head 43. The exhaust gas from the heated upper chamber 38 enters the filter tube through the four upper chamber air inlet and outlet cover plates 47. The spiral heating tube 46 inside the filter tube heats the inside of the filter tube to prevent cold air from entering the upper chamber air inlet and outlet cover plates 47, thereby ensuring the internal temperature of the four heated upper chambers 38 is stable. After the exhaust gas is drawn into the filter tank 44 for filtration, the exhaust gas enters the conversion head 43 and then enters another process chamber exhaust pipe 29 for discharge. The aluminum baffle valve 45 is used to control the exhaust flow rate of the third upper chamber air inlet and outlet cover plate 47 in counterclockwise order.

[0064] The lifting chamber assembly 33 includes a fixed frame 101 and a corrugated lifting sleeve 75, pneumatic push rods 74 are fixed on both sides of the fixed frame 101, a lifting frame 73 is fixed between the telescopic ends of the two pneumatic push rods 74, a lifting sleeve shaft 102 is fixed on the upper end of the lifting frame 73, and the lifting sleeve shaft 102 extends into and passes through the corrugated lifting sleeve 75; the heating and cooling plate 72 includes a lower cavity 76 and a plurality of multi-way solenoid valves 89, the lower cavity 76 is fixed to the lower end of the lower fixed plate 35, the fixed frame 101 and the corrugated lifting sleeve 75 are fixed to the lower end of the lower cavity 76 at the corresponding position, the lower end of the corrugated lifting sleeve 75 is fixed on the lifting sleeve shaft 102, the lower cavity 76 is provided with a lower cavity 77, and the lifting sleeve shaft 102 extends into and passes through the The upper end of the lifting sleeve shaft 102 is fixedly connected to the lower end of the lower cavity 77 through the lower cavity 76, the upper end of the lower cavity 77 is provided with a cavity sealing ring, the inner bottom of the lower cavity 77 is provided with a lower pad 78, the interior of the lower cavity 77 is provided with a lower heat insulation cover 79, the lower heat insulation cover 79 is placed above the lower pad 78, the heating and cooling disk unit 80 and the loading cooling disk component 71 are respectively arranged on the upper end of the lifting sleeve shaft 102 at the corresponding positions, and the heating and cooling disk unit 80 and the loading cooling disk component 71 are respectively located inside the lower heat insulation cover 79 at the corresponding positions, a number of multi-way solenoid valves 89 are placed inside the valve island box 23, and the several multi-way solenoid valves 89 are respectively connected to the formic acid storage tank 30 and the heating and cooling disk unit 80 through pipelines.

[0065] The telescopic ends of the two pneumatic push rods 74 drive the lifting frame 73 to move up and down, and the lifting frame 73 drives the lifting sleeve shaft 102 to move up and down. When the lifting sleeve shaft 102 is lifted, the corrugated lifting sleeve 75 is compressed for sealing. The lifting sleeve shaft 102 drives the lower cavity 77 to move up and down. At this time, the lower pad 78 and the lower heat insulation cover 79 are lifted and lowered synchronously. When the lower cavity 77 is lifted, the cavity sealing ring contacts the lower end of the sealing ring 61 for sealing. At the same time, the lifting sleeve shaft 102 drives the heating and cooling disk unit 80 and the loading and cooling disk components 71 is raised and lowered. When the heating and cooling plate unit 80 and the loading and cooling plate 71 are raised, the wafer is lifted up and separated from the three pin support plates 62. The lower heat insulation cover 79 is used for heat insulation. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30. The nitrogen and formic acid form a mixed gas. The mixed gas is injected into the hot cooling plate unit 80 through several multi-way solenoid valves 89 inside the valve island box 23, and blown onto the wafer above the heating and cooling plate unit 80, so that the wafer is suspended and rotated, ensuring that the wafer is heated evenly.

[0066] The heating and cooling plate unit 80 includes a lower plate body 90 and a lower heating plate bottom cover 92. A suspended ventilation cylinder 82 is fixed to the upper end of the lower plate body 90. A plurality of spiral ventilation grooves 83 are provided on the inner wall of the suspended ventilation cylinder 82. A plurality of groups of inclined ventilation holes 84 are provided on the upper end of the lower plate body 90. The ventilation holes 84 are connected to the multi-way solenoid valves 89 at corresponding positions through pipelines. A plurality of temperature measuring holes 85 are provided on the upper end of the lower plate body 90. Three circumferentially evenly distributed avoidance holes 81 are provided on the lower plate body 90 and the suspended ventilation cylinder 82. The avoidance holes 81 are located below the pin support plate 62 at corresponding positions. A heat insulation plate 88 is fixed to the upper end of the lower heating plate bottom cover 92. A plurality of circumferentially evenly distributed heat insulation air guide boxes 86 are fixed to the upper end of the heat insulation plate 88. The heat insulation air guide boxes 86 are located at a group of ventilation holes 88 at corresponding positions. 4, a guide tube 93 is fixed to the lower end of the lower heating plate bottom cover 92, and the guide tube 93 is inserted into the lifting sleeve shaft 102 at the corresponding position, and the guide tube 93 is communicated with the lifting sleeve shaft 102 at the corresponding position, and a plurality of wiring holes 87 uniformly distributed around the circumference are opened inside the heat insulation plate 88, one end of the wiring hole 87 is communicated with the guide tube 93, and the other end of the wiring hole 87 is communicated with the heat insulation air guide box 86 at the corresponding position; the lower end of the lower plate body 90 of four heating and cooling plate units 80 is provided with an electric heating wire 91, and the wiring terminal of the electric heating wire 91 extends into and passes through the guide tube 93 at the corresponding position, and the lower end of the lower plate body 90 of another heating and cooling plate unit 80 is provided with a cooling coil 94, and the connecting end of the cooling coil 94 extends into and passes through the guide tube 93 at the corresponding position, and the connecting end of the cooling coil 94 is connected to an external cold source.

[0067] The wiring hole 87 is connected with the guide tube 93 and the heat-insulating air guide box 86, and the guide tube 93 is connected with the lifting sleeve shaft 102 at the corresponding position, which is used to place the pipeline between the vent hole 84 and the multi-way solenoid valve 89 at the corresponding position. At the same time, the guide tube 93 is connected with the lifting sleeve shaft 102 at the corresponding position, which is used to route the wiring terminals of electrical equipment such as the electric heating wire 91 and the temperature sensor. The mixed gas is injected into the vent hole 84 through several multi-way solenoid valves 89 inside the valve island box 23 to form mixed hot gas, which is blown onto the wafer above the heating and cooling plate unit 80. The airflow passes through several spirals on the inner wall of the suspended vent tube 82. The air is blown out through the swirl ventilation groove 83, allowing the wafer to stably suspend and rotate, ensuring that the wafer is heated evenly; the temperature measurement hole 85 is used to install the temperature sensor, the avoidance hole 81 is used to avoid the pin support plate 62, the insulation plate 88 is used to insulate the transmission line and the pipeline between the vent hole 84 and the corresponding multi-way solenoid valve 89, and the insulation air guide box 86 is used to insulate the pipeline between the vent hole 84 and the corresponding multi-way solenoid valve 89; the external cold source is injected into the cooling coil 94 to cool the lower plate 90 to form a mixed cold air, which also allows the wafer to stably suspend and rotate, ensuring that the wafer is cooled evenly.

[0068] The loading cooling plate member 71 includes a lock insulation plate 99, which is inserted into the lifting sleeve shaft 102 at the corresponding position. The lock insulation plate 99 is located in the lower heat insulation cover 79 at the corresponding position. A lock cooling upper plate 98 is provided at the upper end of the lock insulation plate 99. An avoidance groove 97 and three circumferentially evenly distributed avoidance holes 96 are opened at the upper end of the lock cooling upper plate 98. A lock cooling pipe 100 is provided between the lock cooling upper plate 98 and the lock insulation plate 99. The connection end of the lock cooling pipe 100 extends out of the lock insulation plate 99, and the connecting end of the lock cooling pipe 100 extends into and passes through the guide tube 93 at the corresponding position. The connecting end of the lock cooling pipe 100 is connected to an external cold source.

[0069] The lifting sleeve shaft 102 drives the lock insulation plate 99 to rise and fall, thereby driving the lock cooling upper plate 98 and the lock cooling pipe 100 to rise and fall. The external cold source is injected into the lock cooling pipe 100 to cool the lock cooling upper plate 98. The lock cooling upper plate 98 performs auxiliary cooling treatment on the wafer above it. The lock insulation plate 99 is used for heat preservation and insulation.

[0070] Working principle of the present invention: FA factory end is the factory application level of the factory automation system, and FA factory end ensures that the automation equipment can work continuously and stably; the main functions of the CTC host computer are data collection and processing, monitoring and display, control and instruction issuance, system interaction and information management, alarm and fault processing, to ensure the safe operation of the system; the main function of the IAP slave computer is to receive and analyze upgrade instructions, firmware upgrade operations, feedback upgrade status, and ensure system security and stability;

[0071] The safety grating 16 can monitor the working area at all times to ensure the safety of mechanical equipment and improve the production efficiency of the equipment; the high-definition camera 9 is used to detect the external working environment, the emergency stop switch 8 is used for emergency stop of the equipment, the warning light 10 flashes for warning in an unconventional state, and the control touch screen 11 and a number of control buttons are used to set the operation information of each electrical equipment. The camera and the edge finder can stably monitor the internal activities of the transmission space, and the edge finder can detect the edge of the wafer surface through an optical sensor to determine the position and direction of the wafer, which greatly improves the transmission efficiency;

[0072] The corresponding positions of the flap assembly 40, the loading and cooling plate 71, the heating and cooling plate 72, and the lifting chamber assembly 33 form a loading chamber between the lower fixed plate 35 and the upper fixed plate 32;

[0073] Four heating upper chambers 38 and the corresponding heating and cooling plate units 80, heating and cooling plate components 72, and the lifting chamber assembly 33 and the lower fixed plate 35 and the upper fixed plate 32 respectively form four heating chambers; the temperature of the heating upper chambers 38 of the four heating chambers is 180°C, and the internal temperatures of the four heating chambers are controlled to be 165°C, 300°C, 235°C and 195°C in a counterclockwise order;

[0074] The cooling chamber is formed between the cooling chamber 34 and the corresponding heating and cooling plate unit 80, the heating and cooling plate member 72, the lifting chamber assembly 33, the lower fixed plate 35 and the upper fixed plate 32;

[0075] The electric heating wire 91 heats the four lower disks 90, and the external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixed gas. The mixed gas is injected into the vent hole 84 through a plurality of multi-way solenoid valves 89 inside the valve island box 23 to form a mixed hot gas. At the same time, the mixed gas is injected into the four upper cavity inlet and outlet gas cover plates 47 through the valve island box 23 and the formic acid gas pipeline 49, and is heated by the upper heating disk to form a mixed hot gas. The mixed hot gas enters the four heating chambers respectively, so that the temperature meets the above settings;

[0076] The external cold source is injected into the cooling coil 94 to cool the lower plate 90 to form mixed cold air, which is then injected into the cooling chamber;

[0077] A number of wafers to be processed are placed on one of the wafer handling machines 3, and the flap cylinder 52 is retracted, driving the nitrogen pipeline flap 53 to rotate and open, exposing the loading port 55 below and the lock cooling upper plate 98 below the loading port 55. The robot control box 14 is used to control the handling robot 15 to place the wafers to be processed on the three pin support plates 62 in sequence. After the placement is completed, the flap cylinder 52 is extended, and the nitrogen pipeline flap 53 is rotated and closed to contact the loading port 55;

[0078] The telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the flap assembly 40 drive the lifting frame 73 to rise, and the lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, the corrugated lifting sleeve 75 is compressed, and the lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring contacts the lower end of the sealing ring 61 to seal. At the same time, the lifting sleeve shaft 102 drives the lock cooling upper plate 98 to rise, and the lock cooling upper plate 98 lifts the wafer off the three pin support plates 62 to position the wafer. After positioning, the telescopic ends of the two pneumatic push rods 74 at this position drive the lifting frame 73 to descend, and the wafer falls back to the three pin support plates 62.

[0079] The output shaft of the power motor 70 drives the seal mounting seat 69 to rotate intermittently, thereby driving the support turntable 95 to rotate intermittently between the upper fixed plate 32 and the lower fixed plate 35, and sequentially passes through the five heating and cooling discs 72 and the four heating upper chambers 38 and the cooling chambers 34 at the corresponding positions, that is, sequentially enters the four heating chambers and the cooling chambers;

[0080] After entering the four heating chambers, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the four heating upper cavities 38 drive the lifting frame 73 to rise, and the lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, the corrugated lifting sleeve 75 is compressed, and the lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring contacts the lower end of the sealing ring 61 for sealing. At the same time, the lifting sleeve shaft 102 drives the heating and cooling plate unit 80 to rise. The heating and cooling plate unit 80 lifts the wafer off the three pin support plates 62, injects the mixed hot air into the vent hole 84, and blows it onto the heating and cooling plate unit 80. 0, the airflow is blown out through the spiral ventilation grooves 83 on the inner wall of the suspension ventilation cylinder 82, so that the wafer is stably suspended and rotated to ensure that the wafer is heated evenly. After the heating is completed, the injection of the mixed gas is stopped, and the wafer falls back on the heating and cooling plate unit 80. Then, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the four heating upper cavities 38 drive the lifting frame 73 to descend, and the wafer falls back on the three pin support plates 62, and then enters the inside of the other three heating chambers in turn, and is heated first and then cooled. The metal powder in the solder paste is melted by heating, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, and remove the oxides in the solder.

[0081] After entering the cooling chamber, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the cooling chamber body 34 drive the lifting frame 73 to rise, and the lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, the corrugated lifting sleeve 75 is compressed, and the lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring contacts the lower end of the sealing ring 61 for sealing. At the same time, the lifting sleeve shaft 102 drives the heating and cooling plate unit 80 to rise, and the heating and cooling plate unit 80 lifts the wafer off the three pin supports Plate 62, the mixed cold air injected into the vent hole 84 is blown onto the wafer above the heating and cooling plate unit 80, and the airflow is blown out through a number of spiral vent grooves 83 on the inner wall of the suspension vent cylinder 82, so that the wafer is stably suspended and rotated to ensure uniform cooling of the wafer. After the cooling is completed, the injection of the mixed air is stopped, and the wafer falls back onto the heating and cooling plate unit 80, and then the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the cooling cavity 34 drive the lifting frame 73 to descend, and the wafer falls back onto the three pin support plates 62, completing the cooling process, and solidifying the wafer rapid cooling process;

[0082] The output shaft of the power motor 70 drives the sealing mounting seat 69 to continue to rotate intermittently, thereby driving the supporting turntable 95 to rotate intermittently between the upper fixed plate 32 and the lower fixed plate 35, and then enters the loading chamber. The nitrogen pipeline flap 53 is connected to an external cold source, so that the nitrogen pipeline flap 53 can be cooled, and the wafer is subjected to auxiliary cooling treatment, and the wafer is subjected to optimized cooling;

[0083] Then the flap cylinder 52 is retracted, driving the nitrogen pipeline flap 53 to rotate and open, and then the wafer is placed on another wafer handling machine 3 by the transport robot 15;

[0084] In this process, a plurality of differential pressure gauges 31 are used to monitor the internal air pressure of the process upper chamber 17. The gas cabinet of the gas cabinet exhaust part 18 is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when a gas leak occurs in the gas cabinet, so as to protect the safety of personnel and the service life of the equipment. A plurality of electrical equipment are arranged inside the electric cabinet. The electrical equipment will generate heat and possible harmful gases during operation. The exhaust of the electric cabinet is to ensure the normal operation of the equipment and extend its service life.

[0085] One of the process chamber exhaust pipes 29 is located above the formic acid storage tank 30, and is used to discharge the volatilized formic acid in the formic acid storage tank 30 to the connecting box, and then to be discharged from the process chamber flange pipe. When the rotary welding system 22 is exhausting, the gas is discharged to the connecting box through another process chamber exhaust pipe 29, and then to be discharged from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure, and the butterfly valve is used to control the exhaust volume;

[0086] That is, when exhausting, the pressure chamber 42 draws out the waste gas inside the upper fixed plate 32 and enters the conversion head 43. The waste gas of the four heating upper chambers 38 enters the filter tube through the four upper chamber inlet and outlet cover plates 47. The spiral heating tube 46 inside the filter tube heats the inside of the filter tube to prevent cold air from entering the upper chamber inlet and outlet cover plates 47, ensuring that the internal temperature of the four heating upper chambers 38 is stable. After the waste gas is drawn into the filter tank 44 for filtration, the waste gas enters the conversion head 43 and then enters another process chamber exhaust pipe 29 for discharge. The aluminum baffle valve 45 is used to control the exhaust flow of the third upper chamber inlet and outlet cover plate 47 in counterclockwise order.

[0087] During the operation of the system, the fan filter of the equipment is always working to ensure the cleanliness of the air inside the chamber; the power box 24 is mainly used to provide operating power for each electrical appliance; and the distribution cabinet 25 is used to distribute power to each electrical appliance.

[0088] In summary, the EFEM system 1, the handling robot 15 cooperates with the safety grating 16 and the equipment fan filter to achieve stable wafer handling and ensure the air cleanliness inside the chamber. At the same time, the handling robot 15 cooperates with the two wafer loaders and unloaders 3 to stably transport the wafers before and after processing.

[0089] The formic acid storage tank 30 cooperates with the valve island box 23 and the rotary welding system 22 to realize the heating treatment of first heating and then cooling, the rapid cooling treatment and the auxiliary cooling treatment of the wafer in sequence. The heating treatment is first performed to melt the metal powder in the solder paste, which can effectively reduce the height difference of each bump, reduce the roughness of the surface of the welding bump, remove the oxide in the solder, and then cool the wafer to solidify;

[0090] The loading chamber is formed by the cooperation between the flap assembly 40, the loading and cooling plate 71, the heating and cooling plate 72, and the lifting chamber assembly 33, the lower fixed plate 35, and the upper fixed plate 32, so as to realize the positioning loading and auxiliary cooling treatment;

[0091] Four heating upper cavities 38 are formed by the cooperation between the heating and cooling plate units 80 with electric heating wires 91 installed at the corresponding positions, the heating and cooling plate components 72, and the lifting chamber assembly 33, the lower fixed plate 35, and the upper fixed plate 32. The heating and cooling plate unit 80 cooperates with the formic acid storage tank 30 and the valve island box 23 to blow hot air onto the wafer, so that the wafer is stably suspended and rotated, ensuring uniform heating of the wafer.

[0092] A cooling chamber is formed by the cooperation between the cooling cavity 34 and the cooling coil 94 installed at the corresponding position to heat the cooling plate unit 80, the heating cooling plate member 72 and the lifting chamber assembly 33 and the lower fixed plate 35 and the upper fixed plate 32. The heating cooling plate unit 80 cooperates with the formic acid storage tank 30 and the valve island box 23 to blow cold air onto the wafer, allowing the wafer to be stably suspended and rotated, thereby ensuring uniform cooling of the wafer.

[0093] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A wafer-level reflow soldering device, comprising an EFEM system (1) and a process area box (5) disposed at the rear side of the EFEM system (1), characterized in that: The front side of the EFEM system (1) is provided with two wafer loaders (3), the side of the EFEM system (1) is provided with a control system (2), the interior of the EFEM system (1) is provided with a handling robot (15) and an equipment fan filter, the interior of the process area box (5) is provided with a rotary welding system (22), a valve island box (23), a power supply box (24), a power distribution cabinet (25) and an exhaust system (4) and a formic acid storage tank (30), the formic acid storage tank (30) and the rotary welding system (22) are connected via a pipeline, and the air inlet of the formic acid storage tank (30) is connected to an external liquid nitrogen tank via a pipeline; The process area box (5) comprises a process lower chamber (26) and a process upper chamber (17) arranged at the upper end of the process lower chamber (26); The rotary welding system (22) comprises a lower fixed plate (35), the lower fixed plate (35) being fixed to the inner bottom side of the process upper chamber (17), the upper end of the lower fixed plate (35) being hingedly connected to the upper fixed plate (32) via two opening hinges (64), two symmetrically arranged turning power members (36) being arranged between the lower fixed plate (35) and the upper fixed plate (32), a power motor (70) being fixed to the middle part of the lower end of the lower fixed plate (35), a sealing mounting seat (69) being fixed to the output shaft of the power motor (70), and a supporting rotating plate (90) being fixed to the upper end of the sealing mounting seat (69). 5), a supporting turntable (95) is rotatably arranged between an upper fixed plate (32) and a lower fixed plate (35), six circumferentially evenly distributed heating and cooling discs (72) are arranged at the lower end of the lower fixed plate (35), and a lifting chamber assembly (33) is arranged at the lower end of each of the heating and cooling discs (72), wherein five of the heating and cooling discs (72) are each provided with a heating and cooling disc unit (80), and another heating and cooling disc (72) is provided with a loading and cooling disc (71), and the heating and cooling disc unit (80) and the loading and cooling disc (71) are both arranged above the lifting chamber assembly (33); The upper end of the lower fixed plate (35) is provided with a high vertical air L-shaped valve (41), a flap assembly (40), a cooling cavity (34) and four heating upper cavities (38); the flap assembly (40) is located at the upper end of the loading cooling plate (71); the cooling cavity (34) and the four heating upper cavities (38) are arranged clockwise and are located at the upper end of the five heating cooling plate units (80); the upper ends of the upper fixed plate (32) and the four heating upper cavities (38) are provided with a vacuum assembly (39); the vacuum assembly (39) is connected to another process chamber exhaust pipe (29); the four heating upper cavities (3 8) and the formic acid storage tank (30) and the heating and cooling disk units (80) below the four heating upper cavities (38) and the formic acid storage tank (30) are all connected via a valve island box (23); the heating and cooling disk units (80) below the cooling cavity (34) and the loading cooling disk member (71) are connected to an external cold source; an upper water pipe (63) is provided at the upper end of the upper fixed disk (32); a lower water pipe (68) is provided at the lower end of the lower fixed disk (35); the lower water pipe (68) is connected to the upper water pipe (63), and the lower water pipe (68) and the upper water pipe (63) are both connected to an external cold source.

2. The wafer-level reflow soldering equipment according to claim 1, characterized in that: The EFEM system (1) comprises an EFEM lower chassis (6) and an EFEM upper chassis (7) arranged at the upper end of the EFEM lower chassis (6); a robot control box (14) is arranged inside the EFEM lower chassis (6); a handling robot (15) is arranged inside the EFEM lower chassis (6); two wafer handlers (3) are located at the front side of the EFEM lower chassis (6); a safety grating (16), an emergency stop switch (8) and a warning light (10) are arranged at the front side of the EFEM lower chassis (6); the safety grating (16) is located at the front side of the two wafer handlers (3); foot cups (12) and universal wheels (13) are arranged at the four corners of the lower end of the EFEM lower chassis (6); a control touch screen (11) and a plurality of control buttons are arranged on the side of the EFEM lower chassis (6); an equipment fan filter is arranged inside the EFEM upper chassis (7); a high-definition camera (9) is arranged at the front side of the EFEM upper chassis (7); and a camera and an edge finder are arranged inside the EFEM upper chassis (7).

3. The wafer-level reflow soldering equipment according to claim 2, characterized in that: The control system mainly includes the FA factory end, CTC host computer and IAP slave computer. The CTC host computer mainly includes GUI and scheduling modules, and the IAP slave computer includes PLC module, Wafer Robot module and Load Port module, which is responsible for the control of the transmission module.

4. The wafer-level reflow soldering equipment according to claim 3, characterized in that: A plurality of differential pressure gauges (31) are provided on the side of the process upper chamber (17); a formic acid storage tank (30), a valve island box (23), a power supply box (24) and a power distribution cabinet (25) are all arranged inside the process lower chamber (26); a rotary welding system (22) is arranged at the rear side inside the process lower chamber (26); an exhaust system (4) comprises a gas cabinet exhaust component (18), an electric cabinet exhaust component (19), a process chamber exhaust component (20) and a process chamber exhaust pipe (21); the gas cabinet exhaust component (18) comprises a gas cabinet and a gas cabinet exhaust pipe connected to the upper end of the gas cabinet and a gas cabinet flange pipe connected to the upper end of the gas cabinet exhaust pipe; the gas cabinet is arranged at the front side inside the process upper chamber (17); the electric cabinet exhaust component (19) comprises an electric cabinet and an electric cabinet exhaust pipe connected to the upper end of the electric cabinet and an electric cabinet flange pipe connected to the upper end of the electric cabinet exhaust pipe; the gas cabinet and the electric cabinet are arranged in the process upper chamber The process chamber (17) is provided with a gas cabinet exhaust pipe, a gas cabinet flange pipe, an electric cabinet exhaust pipe and an electric cabinet flange pipe extending out of the upper end of the process upper chamber (17); a process chamber exhaust pipe (21) is connected to the upper end of the process upper chamber (17) and is located directly above the rotary welding system (22); a process chamber exhaust member (20) comprises a connecting box, which is arranged at the inner front side of the process upper chamber (17); two process chamber exhaust pipes (29) are arranged at the lower end of the connecting box, one of the process chamber exhaust pipes (29) is located above the formic acid storage tank (30); a butterfly valve (27) and a differential pressure gauge (28) are arranged on the other process chamber exhaust pipe (29); the other process chamber exhaust pipe (29) is connected to the rotary welding system (22); a process chamber flange pipe is arranged at the upper end of the connecting box, and the process chamber flange pipe extends out of the upper end of the process upper chamber (17).

5. The wafer-level reflow soldering equipment according to claim 4, characterized in that: The lower fixed plate (35) is provided with a plurality of escape through holes (66), and a sealing ring (65) is provided on the outer edge of the upper end of the lower fixed plate (35); The tilting power member (36) comprises a vertical plate (57) and a hydraulic push rod (67), the vertical plate (57) being fixed to the upper end of the upper fixed plate (32), the two ends of the hydraulic push rod (67) being hinged to the lower fixed plate (35) and the vertical plate (57) respectively, the upper end of the upper fixed plate (32) being provided with a loading port (55) and five storage slots (56), the loading port (55) and the five storage slots (56) being evenly distributed in a circle, the loading port (55) being located at the upper end of the loading cooling plate member (71), the upper end of the upper fixed plate (32) being provided with an upper water pipe groove (54), the upper water pipe (63) being clamped in the upper water pipe groove (54), the upper end of the upper fixed plate (32) being fixed with a plurality of quick clamp lock buckles (37), the quick clamp lock buckles (37) being detachably clamped to the lower fixed plate (35); The flap assembly (40) comprises a nitrogen pipeline flap (53) and two flap brackets (51), the two flap brackets (51) being fixed to the upper end of the upper fixed plate (32), and the two flap brackets (51) being located on both sides of the loading port (55), one end of the nitrogen pipeline flap (53) being hinged to the upper end of the upper fixed plate (32), and flap cylinders (52) being provided between both sides of the other end of the nitrogen pipeline flap (53) and the flap brackets (51) on the same side, and the nitrogen pipeline flap (53) being connected to an external cold source; The support turntable (95) is provided with six circumferentially evenly distributed sealing holes (60) and a mounting through hole (59), the mounting through hole (59) being located in the middle of the support turntable (95), the mounting through hole (59) being connected to the upper end of the sealing mounting seat (69), the sealing holes (60) being provided with sealing rings (61) inside, the sealing rings (61) being provided with three circumferentially evenly distributed pin engaging grooves (58), the pin engaging grooves (58) being provided with detachable pin support plates (62) inside.

6. The wafer-level reflow soldering equipment according to claim 5, characterized in that: The heating upper cavity (38) and the cooling cavity (34) are detachably connected to the inside of the storage slot (56) at the corresponding position; the upper end of each heating upper cavity (38) is provided with an upper cavity air inlet and outlet cover plate (47); a formic acid gas pipeline (49) is connected between the four upper cavity air inlet and outlet cover plates (47); the formic acid gas pipeline (49) is connected to the gas outlet of the formic acid storage tank (30) through the valve island box (23); the upper end of the third heating upper cavity (38) in counterclockwise order is provided with a vacuum pneumatic valve (48); and the formic acid gas pipeline (49) connected to the third heating upper cavity (38) in counterclockwise order is provided with a diaphragm sealing valve (50); and the lower ends of the four heating upper cavities (38) are provided with an upper heating disk; The vacuum pumping assembly (39) comprises a pressure chamber (42), the pressure chamber (42) being fixedly connected to the middle of the upper end of the upper fixed plate (32), and the pressure chamber (42) being in communication with the upper fixed plate (32), the upper end of the pressure chamber (42) being connected to a conversion head (43), the conversion head (43) being connected to another process chamber exhaust pipe (29), the conversion head (43) being connected to a plurality of filter tanks (44), the filter tanks (44) being respectively in communication with the tops of four upper chamber inlet and outlet cover plates (47) through filter tubes, the filter tubes being provided with spiral heating tubes (46) inside, and the filter tube connected to the third upper chamber inlet and outlet cover plate (47) in counterclockwise order being connected to an aluminum baffle valve (45).

7. The wafer-level reflow soldering equipment according to claim 6, characterized in that: The lifting chamber assembly (33) comprises a fixed frame (101) and a corrugated lifting sleeve (75), pneumatic push rods (74) are fixed on both sides of the fixed frame (101), a lifting frame (73) is fixed between the telescopic ends of the two pneumatic push rods (74), a lifting sleeve shaft (102) is fixed on the upper end of the lifting frame (73), and the lifting sleeve shaft (102) extends into and passes through the corrugated lifting sleeve (75); The heating and cooling disk (72) comprises a lower cavity (76) and a plurality of multi-way solenoid valves (89); the lower cavity (76) is fixed to the lower end of the lower fixed disk (35); the fixing frame (101) and the corrugated lifting sleeve (75) are fixed to the lower end of the lower cavity (76) at corresponding positions; the lower end of the corrugated lifting sleeve (75) is fixed to the lifting sleeve shaft (102); a lower mold cavity (77) is provided inside the lower cavity (76); the lifting sleeve shaft (102) passes through the lower cavity (76) and the upper end of the lifting sleeve shaft (102) is fixedly connected to the lower end of the lower mold cavity (77); a mold cavity sealing ring is provided at the upper end of the lower mold cavity (77); and the lower mold cavity (77) is provided with a mold cavity sealing ring. ) is provided with a lower pad (78) at the inner bottom, a lower heat insulation cover (79) is provided inside the lower cavity (77), the lower heat insulation cover (79) is placed above the lower pad (78), the heating and cooling disk unit (80) and the loading and cooling disk component (71) are respectively arranged at the upper end of the lifting sleeve shaft (102) at corresponding positions, and the heating and cooling disk unit (80) and the loading and cooling disk component (71) are respectively located inside the lower heat insulation cover (79) at corresponding positions, a plurality of multi-way solenoid valves (89) are placed inside the valve island box (23), and the plurality of multi-way solenoid valves (89) are respectively connected to the formic acid storage tank (30) and the heating and cooling disk unit (80) through pipelines.

8. The wafer-level reflow soldering equipment according to claim 7, characterized in that: The heating and cooling plate unit (80) comprises a lower plate body (90) and a lower heating plate bottom cover (92); a suspended ventilation cylinder (82) is fixed to the upper end of the lower plate body (90); a plurality of spiral ventilation grooves (83) are provided on the inner wall of the suspended ventilation cylinder (82); a plurality of groups of obliquely arranged ventilation holes (84) are provided at the upper end of the lower plate body (90); the ventilation holes (84) are connected to the multi-way solenoid valves (89) at corresponding positions via pipelines; and a plurality of spiral ventilation grooves (83) are provided on the inner wall of the suspended ventilation cylinder (82); and a plurality of groups of obliquely arranged ventilation holes (84) are provided at the upper end of the lower plate body (90). A plurality of temperature measuring holes (85) are provided, three circumferentially evenly distributed avoidance holes (81) are provided on the lower plate body (90) and the suspended ventilation cylinder (82), the avoidance holes (81) are located below the pin support plate (62) at the corresponding position, a heat insulation plate (88) is fixed at the upper end of the lower heating plate bottom cover (92), a plurality of circumferentially evenly distributed heat insulation air guide boxes (86) are fixed at the upper end of the heat insulation plate (88), and the heat insulation air guide boxes (86) are located at a group of ventilation holes ( 84), a guide tube (93) is fixed at the lower end of the lower heating plate bottom cover (92), the guide tube (93) is inserted into the lifting sleeve shaft (102) at the corresponding position, and the guide tube (93) is connected to the lifting sleeve shaft (102) at the corresponding position, and a plurality of wiring holes (87) evenly distributed around the circumference are opened inside the heat insulation plate (88), one end of the wiring hole (87) is connected to the guide tube (93), and the other end of the wiring hole (87) is connected to the heat insulation air guide box (88) at the corresponding position. 6) are connected; wherein the lower ends of the lower disk bodies (90) of four heating and cooling disk units (80) are provided with electric heating wires (91), the connection ends of the electric heating wires (91) extend into and pass through the guide tubes (93) at corresponding positions, and the lower ends of the lower disk bodies (90) of another heating and cooling disk unit (80) are provided with cooling coils (94), the connection ends of the cooling coils (94) extend into and pass through the guide tubes (93) at corresponding positions, and the connection ends of the cooling coils (94) are connected to an external cold source.

9. The wafer-level reflow soldering equipment according to claim 8, characterized in that: The loading cooling disk component (71) comprises a lock insulation disk (99), the lock insulation disk (99) is inserted into the inside of the lifting sleeve shaft (102) at the corresponding position, the lock insulation disk (99) is located inside the lower insulation cover (79) at the corresponding position, the upper end of the lock insulation disk (99) is provided with a lock cooling upper disk (98), the upper end of the lock cooling upper disk (98) is provided with an avoidance groove (97) and three avoidance holes (96) evenly distributed around the circumference, a lock cooling pipe (100) is provided between the lock cooling upper disk (98) and the lock insulation disk (99), the connection end of the lock cooling pipe (100) extends out of the lock insulation disk (99), and the connection end of the lock cooling pipe (100) extends into and passes through the guide tube (93) at the corresponding position, and the connection end of the lock cooling pipe (100) is connected to an external cold source.

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