Double-sided polishing pad replacement device, method, and equipment

Abstract

The present disclosure provides a double-sided polishing pad replacement device, method, and apparatus. The double-sided polishing pad replacement device comprises: a telescopic arm unit, comprising a drive unit and a telescopic arm body, wherein the first end of the telescopic arm body is connected to the drive unit, and the second end is capable of reciprocating relative to the first end in a first direction; a bracket unit, which is capable of synchronously moving with the second end to enter or exit the space between the upper and lower fixed plates; a cutting tool unit, disposed on the bracket unit, comprising a first tool with a blade facing the upper fixed plate and a second tool with a blade facing the lower fixed plate; a gripping unit, comprising a first gripping assembly and a second gripping assembly, each capable of performing a gripping or releasing action; and a control unit, which is configured to control the operating states of the telescopic arm unit and the first gripping assembly. The double-sided polishing pad replacement device, method, and apparatus disclosed herein can reduce manual operation during double-sided polishing pad replacement, thereby reducing operational difficulty and safety hazards.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a double-sided polishing pad replacement device. Background Art

[0002] The polishing pads of double-sided polishing equipment need to be replaced regularly to ensure product quality. However, the polishing pads in double-sided polishing equipment currently require manual replacement by the operator.

[0003] When replacing the polishing pad, the operator first removes the old polishing pads from the upper and lower platens, inspects and cleans any residual adhesive on the surfaces, and then applies the new polishing pad. However, due to the large surface area of ​​the double-sided polishing machine's platens, replacing the polishing pad on the upper platen requires the operator to lean over and directly access the upper and lower platens, a task that is extremely inconvenient and poses certain safety risks.

[0004] In addition, the upper platen of the double-sided polishing machine is provided with slurry holes for supplying slurry during the polishing process. When attaching the polishing pad to the upper platen, the slurry holes on the polishing pad must be aligned with the slurry on the platen.

[0005] However, since the upper platen has a larger surface, when sticking the polishing pad on the upper platen, the polishing pad on the upper platen is usually placed upside down on the lower platen first, and then the polishing pad on the upper platen is fine-tuned and positioned according to the three-point positioning method and the approximate position distribution of the polishing liquid holes, and then the polishing pad is pressed down using the upper platen to bond.

[0006] During this process, the polishing pad cannot be precisely positioned. After the polishing pad is bonded to the upper platen, the operator must reconfirm that the polishing liquid holes are perfectly aligned. If the polishing liquid holes are blocked, the polishing pad must be replaced. This not only wastes materials and manpower, but also leads to inadequate inspection of the polishing liquid holes. This can lead to the polishing liquid holes being blocked by the polishing pad during processing, preventing the polishing liquid from flowing properly, causing bulging on the polishing pad and the risk of product defects and fragmentation. Summary of the Invention

[0007] In order to solve at least one of the problems in the above-mentioned prior art, the embodiments of the present disclosure provide a double-sided polishing pad replacement device, method and equipment.

[0008] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0009] In a first aspect, an embodiment of the present disclosure provides a double-sided polishing pad replacement device for replacing polishing pads on an upper platen and a lower platen in a double-sided polishing machine; the double-sided polishing pad replacement device comprises:

[0010] A telescopic arm unit, comprising a drive unit and a telescopic arm body, the telescopic arm body having a first end and a second end opposite to each other along a first direction, the first end being connected to the drive unit, and the second end being driven by the drive unit to reciprocate relative to the first end along the first direction;

[0011] a bracket unit connected to the second end of the telescopic arm body and moving synchronously with the second end in the first direction to enter or move out of the space between the upper fixed plate and the lower fixed plate;

[0012] a cutting tool unit, disposed on the support unit, comprising a first tool and a second tool, wherein the blade of the first tool faces the upper fixed plate and is used to cut the old polishing pad on the upper fixed plate, and the blade of the second tool faces the lower fixed plate and is used to cut the old polishing pad on the lower fixed plate;

[0013] a gripping unit comprising a first gripping assembly and a second gripping assembly, wherein both the first gripping assembly and the second gripping assembly are capable of performing gripping or releasing actions, and the first gripping assembly is located on a side of the support unit facing the upper platen, and the second gripping assembly is located on a side of the support unit facing the lower platen, and the second gripping assembly is used to grip a used polishing pad on the lower platen;

[0014] A control unit is connected to the telescopic arm unit and the grasping unit, and the control unit is used to control the working status of the telescopic arm unit and the first grasping assembly.

[0015] Exemplarily, the drive unit includes a drive motor and a transmission assembly, the transmission assembly includes a driving gear, a transmission chain and a driven gear, the driving gear is connected to the output shaft of the drive motor, the telescopic arm body has a rack segment extending along the first direction, the driven gear is meshed with the rack segment, and the transmission chain is connected between the driving gear and the driven gear.

[0016] Exemplarily, either the first gripping assembly or the second gripping assembly may include a plurality of gripping claws spaced apart and distributed on the support unit.

[0017] Exemplary, it also includes:

[0018] a detection unit, the detection unit being disposed on the support unit, and configured to obtain surface topography information of the upper and lower surface plates, and / or obtain surface topography information of polishing pads placed on the upper and lower surface plates, wherein the surface topography information includes residue information;

[0019] The control unit is also used to control the rotation of the upper fixed plate and the lower fixed plate, and / or control the extension and retraction of the telescopic arm unit, so that the detection unit scans the disk surface of the upper fixed plate and the lower fixed plate to obtain the disk surface morphology information and / or the pad surface morphology information.

[0020] Exemplarily, a cleaning unit is further included, the cleaning unit being disposed on the bracket unit, the cleaning unit comprising a first cleaning assembly and a second cleaning assembly; wherein the first cleaning assembly is configured to spray fluid toward the upper fixed plate to clean residues on the surface of the upper fixed plate; and the second cleaning assembly is configured to spray fluid toward the lower fixed plate to clean residues on the surface of the lower fixed plate.

[0021] The control unit is further configured to:

[0022] Based on the residue information, controlling the upper fixed plate and the lower fixed plate to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the cleaning unit moves to a target cleaning position; and when the cleaning unit moves to the target cleaning position, controlling the cleaning unit to start performing a residue cleaning operation;

[0023] And / or, based on pad surface topography information of a new polishing pad placed on the lower platen and platen surface topography information of the upper platen, determining whether the relative position of the new polishing pad and the upper platen is offset.

[0024] Exemplarily, either the first cleaning assembly or the second cleaning assembly includes at least one air jet nozzle and at least one liquid jet nozzle disposed on the bracket unit.

[0025] In a second aspect, the present disclosure also provides a double-sided polishing pad replacement method, which is applied to the double-sided polishing pad replacement device described above. The method includes the following steps:

[0026] controlling the working state of the telescopic arm unit so that the bracket unit enters the space between the upper fixed plate and the lower fixed plate and drives the cutting tool unit to move along the first direction, so that the first tool cuts the old polishing pad on the upper fixed plate and the second tool cuts the old polishing pad on the lower fixed plate, so that each old polishing pad is cut into at least two pad blocks;

[0027] Controlling the working state of the telescopic arm unit so that the grabbing unit moves to the position of the cushion block, and controlling the first grabbing assembly to grab the cushion block on the upper fixed plate, and the second grabbing assembly to grab the cushion block on the lower fixed plate;

[0028] The first grabbing assembly is controlled to tear the pad off from the upper fixed plate, and the second grabbing assembly is controlled to tear the pad off from the lower fixed plate.

[0029] Exemplarily, after the first grabbing assembly tears the cushion block from the upper fixed plate and the second grabbing assembly tears the cushion block from the lower fixed plate, the method further comprises the following steps:

[0030] controlling the upper fixed plate and the lower fixed plate to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the detection unit scans the surfaces of the upper fixed plate and the lower fixed plate, so that the detection unit obtains surface morphology information of the upper fixed plate and the lower fixed plate;

[0031] Based on the residue information, controlling the upper fixed plate and the lower fixed plate to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the cleaning unit moves to a target cleaning position;

[0032] When the cleaning unit moves to the target cleaning position, the cleaning unit is controlled to start performing an operation of cleaning residues.

[0033] Exemplarily, after controlling the cleaning unit to start performing the operation of cleaning the residue, the method further includes the following steps:

[0034] placing a new polishing pad on the lower platen;

[0035] controlling the upper and lower fixed plates to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the detection unit scans the surfaces of the upper and lower fixed plates to obtain pad surface topography information of the new polishing pad and the upper fixed plate;

[0036] determining whether a relative position of the new polishing pad and the upper platen is offset based on pad surface topography information of the new polishing pad and platen topography information of the upper platen;

[0037] When the relative position of the new polishing pad and the upper platen is offset, adjusting the position of the new polishing pad based on the pad surface topography information of the new polishing pad and the platen surface topography information of the upper platen until the relative position of the new polishing pad and the upper platen is not offset;

[0038] The upper platen is pressed downward to press the new polishing pad onto the upper platen.

[0039] In a third aspect, an embodiment of the present disclosure further provides a device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; the device being characterized in that the double-sided polishing pad replacement method as described above is implemented when the processor executes the computer program.

[0040] The beneficial effects brought about by the embodiments of the present disclosure are as follows:

[0041] In the double-sided polishing pad replacement device, method, and equipment provided by the embodiments of the present disclosure, by controlling the working state of the telescopic arm unit, the bracket unit can enter the space between the upper and lower fixed plates and drive the cutting tool unit to move along the first direction, so that the first tool cuts the old polishing pad on the upper fixed plate and the second tool cuts the old polishing pad on the lower fixed plate, so that each old polishing pad is cut into at least two pad blocks; the working state of the telescopic arm unit is controlled so that the gripping unit moves to the position of the pad block, and the first gripping component is controlled to grip the pad block on the upper fixed plate and the second gripping component is controlled to grip the pad block on the lower fixed plate; the first gripping component is controlled to tear the pad block from the upper fixed plate and the second gripping component is controlled to tear the pad block from the lower fixed plate. In this way, the double-sided polishing pad replacement device, method, and equipment can reduce manual operations during double-sided polishing pad replacement, reduce the inconvenience of operators bending over to drill into the upper and lower fixed plates, and reduce safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A schematic diagram showing the working process of the double-sided polishing pad replacement device provided in some embodiments of the present disclosure;

[0043] Figure 2 A top view of a support unit of a double-sided polishing pad changing device in some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0044] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0045] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0046] As used in the embodiments of the present disclosure, the terms "parallel," "perpendicular," and "identical" include the strict sense of "parallel," "perpendicular," and "identical," as well as "approximately parallel," "approximately perpendicular," and "approximately identical" with respect to a certain tolerance, which, taking into account the tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the stated value.

[0047] In addition, in this document, unless otherwise defined, the terms "substantially," "essentially," "approximately," and "about" are used to describe and explain small variations. When used in connection with an event or circumstance, these terms can encompass situations where the event or circumstance occurs exactly, as well as situations where the event or circumstance occurs approximately. For example, when used in connection with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being aligned along the same plane within the micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0048] like Figure 1 As shown, the double-sided polishing machine may include an upper platen 10 and a lower platen 20 arranged opposite to each other, and polishing pads are respectively attached to the surfaces of the upper platen 10 and the lower platen 20. The two polishing pads can be respectively referred to as an upper polishing pad 11 and a lower polishing pad 12.

[0049] The double-sided polishing pad replacement device provided in the embodiment of the present disclosure can be used to replace the polishing pads on the upper platen 10 and the lower platen 20 in a double-sided polishing machine. For ease of description, the polishing pad to be replaced can be referred to as the old polishing pad, and the polishing pad that replaces the old polishing pad can be referred to as the new polishing pad.

[0050] like Figure 1 As shown, the double-sided polishing pad replacement device includes:

[0051] The telescopic arm unit 100 includes a drive unit 110 and a telescopic arm body 120. The telescopic arm body 120 has a first end and a second end opposite to each other along a first direction X. The first end is connected to the drive unit 110, and the second end is driven by the drive unit 110 to reciprocate relative to the first end along the first direction X.

[0052] a bracket unit 200 connected to the second end of the telescopic arm body 120 and moving synchronously with the second end in the first direction X to enter or move out of the space between the upper fixed plate 10 and the lower fixed plate 20;

[0053] The cutting tool unit 300 is disposed on the support unit 200 and includes a first tool 310 and a second tool 320. The blade of the first tool 310 faces the upper fixed plate 10 and is used to cut the used polishing pad on the upper fixed plate 10. The blade of the second tool 320 faces the lower fixed plate 20 and is used to cut the used polishing pad on the lower fixed plate 20.

[0054] The grabbing unit 400 includes a first grabbing assembly 410 and a second grabbing assembly 420. Both the first grabbing assembly 410 and the second grabbing assembly 420 can perform grabbing or releasing actions. The first grabbing assembly 410 is located on a side of the support unit 200 facing the upper platen 10, and the second grabbing assembly 420 is located on a side of the support unit 200 facing the lower platen 20. The second grabbing assembly 420 is used to grab a used polishing pad on the lower platen 20.

[0055] The control unit 500 is connected to the telescopic arm unit 100 and the grabbing unit 400 . The control unit 500 is used to control the working states of the telescopic arm unit 100 and the first grabbing assembly 410 .

[0056] The above scheme controls the working state of the telescopic arm unit 100 so that the bracket unit 200 can enter the space between the upper fixed plate 10 and the lower fixed plate 20, and drives the cutting tool unit 300 to move along the first direction X, so that the first tool 310 cuts the old polishing pad on the upper fixed plate 10, and the second tool 320 cuts the old polishing pad on the lower fixed plate 20, so that each of the old polishing pads is cut to form at least two pads; controls the working state of the telescopic arm unit 100 so that the grabbing unit 400 moves to the position of the pad, and controls the first grabbing component 410 to grab the pad on the upper fixed plate 10, and the second grabbing component 420 to grab the pad on the lower fixed plate 20; the pad is torn off from the upper fixed plate 10 by the first grabbing component 410, and the pad is torn off from the lower fixed plate 20 by the second grabbing component 420.

[0057] In this way, the double-sided polishing pad replacement device can reduce manual operations during double-sided polishing pad replacement, reduce the inconvenience of operators bending over and drilling into the upper and lower fixed plates 20, reduce safety hazards, reduce unnecessary manpower, and achieve the purpose of reducing costs and increasing efficiency.

[0058] It should be noted that when the pad is torn off by the grabbing unit 400, the grabbing unit 400 can be moved by controlling the telescopic arm unit 100 to extend or retract to tear off the pad; or the grabbing unit 400 can be moved relative to the upper fixed plate 10 and the lower fixed plate 20 by controlling the rotation of the upper fixed plate 10 and the lower fixed plate 20 to tear off the pad; or the telescopic arm unit 100 can be controlled to extend or retract, and the upper fixed plate 10 and the lower fixed plate 20 can be controlled to rotate at the same time to tear off the pad.

[0059] In some embodiments, as Figure 1 As shown, the drive unit 110 includes a drive motor 111 and a transmission assembly, the transmission assembly includes a driving gear 112, a transmission chain 113 and a driven gear 114, the driving gear 112 is connected to the output shaft of the drive motor 111, the telescopic arm body 120 has a rack segment extending along the first direction X, the driven gear 114 is engaged with the rack segment, and the transmission chain 113 is transmission-connected between the driving gear 112 and the driven gear 114.

[0060] Thus, when the driving motor 111 drives the driving gear 112 to rotate, the transmission chain 113 meshing with the driving gear 112 drives the driven gear to rotate, and the telescopic arm body 120 meshing with the driven gear performs a corresponding linear motion along the first direction X. It should be understood that the above is only one embodiment of the driving unit 110 and is not limited thereto.

[0061] In some embodiments, combined Figure 1 and Figure 2 As shown, either the first gripping assembly 410 or the second gripping assembly 420 may include a plurality of gripping jaws 400A spaced apart on the support unit 200. For example, the gripping jaws 400A may be driven by a cylinder or other actuator to achieve gripping and releasing actions. The specific structure of the gripping jaws 400A is not limited herein.

[0062] In some embodiments, the first cutting tool 310 and the second cutting tool 320 can be made of special materials to cut only the polishing pad without damaging the platen. For example, the first cutting tool 310 and the second cutting tool 320 can be made of metal cutting tools.

[0063] In some embodiments, as Figure 1 As shown, the double-sided polishing pad replacement device also includes a detection unit 600, which is arranged on the bracket unit 200. The detection unit 600 is used to obtain the disk surface morphology information of the upper fixed plate 10 and the lower fixed plate 20, and / or obtain the pad surface morphology information of the polishing pad placed on the upper fixed plate 10 and the lower fixed plate 20.

[0064] In which, the control unit 500 is also used to control the rotation of the upper fixed plate 10 and the lower fixed plate 20, and / or control the extension and retraction of the telescopic arm unit 100, so that the detection unit 600 scans the disk surface of the upper fixed plate 10 and the lower fixed plate 20 to obtain the disk surface morphology information and / or the pad surface morphology information.

[0065] Illustratively, the detection unit 600 is used to detect the surface morphology of the upper platen 10 or the surface morphology of the upper polishing pad 11 , and the surface morphology of the lower platen 20 or the surface morphology of the lower polishing pad 12 .

[0066] In the above scheme, when the bracket assembly enters the space between the upper fixed plate 10 and the lower fixed plate 20, the disk surface scanning of the upper fixed plate 10 and the lower fixed plate 20 or the surface scanning of the upper polishing pad 11 and the lower polishing pad 12 can be achieved by moving the telescopic arm unit 100, or rotating the upper and lower fixed plates 20, or by coordinating the linear movement of the telescopic arm unit 100 with the rotational movement of the upper fixed plate 10 and the lower fixed plate 20, so as to obtain the disk surface morphology information and / or the pad surface morphology information.

[0067] For example, the detection unit 600 can be implemented using an infrared sensor. The operating principle of using the infrared sensor to obtain topographic information of the surface of the platen or the polishing pad can be as follows: the infrared sensor emits an infrared detection beam toward the surface of the platen and receives the detection beam reflected by the surface of the platen or the polishing pad. Based on the distance traveled by the detection beam, the concave-convex topography of the surface of the platen or the polishing pad can be determined.

[0068] For example, after removing the old polishing pad from the upper platen 10 or the lower platen 20, some residue may remain. Therefore, the detection unit 600 can detect the topography of the upper platen 10 and the lower platen 20 to determine the location, size, and other information of the residue. Furthermore, polishing liquid holes may be provided on the surface of the upper platen 10 and the upper polishing pad 11. Once the surface of the upper platen 10 is clean, the detection unit 600 can also detect the location of the polishing liquid holes on the surface of the upper platen 10 and the upper polishing pad.

[0069] In addition, during daily production, the polishing pad may develop an uneven surface after long-term use. The detection unit 600 can also scan the surface of the polishing pad to obtain the concave and convex information of the polishing pad surface. Based on the concave and convex information of the pad surface, the corresponding uneven positions can be trimmed as needed to achieve precise polishing pad management and improve the quality of the grinding products.

[0070] Therefore, the disk surface topography information may include but is not limited to residue information, polishing liquid hole position information, etc. The pad surface topography information may include but is not limited to polishing liquid hole position information, pad surface concave-convex information, etc.

[0071] In some embodiments, as Figure 1As shown, the double-sided polishing pad replacement device also includes a cleaning unit 700, which is arranged on the bracket unit 200, and the cleaning unit 700 includes a first cleaning component 710 and a second cleaning component 720; wherein, the first cleaning component 710 is configured to spray fluid toward the upper fixed plate 10 to clean the residue on the disk surface of the upper fixed plate 10; the second cleaning component 720 is configured to spray fluid toward the lower fixed plate 20 to clean the residue on the disk surface of the lower fixed plate 20.

[0072] The control unit 500 is also used to: based on the residue information, control the rotation of the upper fixed plate 10 and the lower fixed plate 20, and / or control the extension and retraction of the telescopic arm unit 100, so that the cleaning unit 700 moves to the target cleaning position; and when the cleaning unit 700 moves to the target cleaning position, control the cleaning unit 700 to start performing the operation of cleaning the residue.

[0073] In the above scheme, after the grabbing unit 400 tears off the pad, the upper fixed plate 10 and the lower fixed plate 20 can be controlled to rotate, and / or the telescopic arm unit 100 can be controlled to extend and retract, so that the detection unit 600 scans the disk surface of the upper fixed plate 10 and the lower fixed plate 20, so that the detection unit 600 obtains the disk surface morphology information of the upper fixed plate 10 and the lower fixed plate 20; and based on the residue information, the upper fixed plate 10 and the lower fixed plate 20 are controlled to rotate, and / or the telescopic arm unit 100 is controlled to extend and retract, so that the cleaning unit 700 moves to the target cleaning position; when the cleaning unit 700 moves to the target cleaning position, the cleaning unit 700 is controlled to start performing the operation of cleaning the residue.

[0074] In some embodiments, combined Figure 1 and Figure 2 As shown, each of the first cleaning assembly 710 and the second cleaning assembly 720 includes at least one air jet nozzle 700A and at least one liquid jet nozzle 700B provided on the support unit 200. Thus, the residue is cleaned by spraying liquid and air jets to the area where the residue is located, and the cleaned area is free of foreign matter and residual water stains, so as to facilitate the attachment of a new polishing pad.

[0075] In some embodiments, the air nozzle 700A and the liquid nozzle 700B can be controlled to open or close by a control valve such as a pneumatic valve, and the gas channel and liquid channel for supplying gas and liquid can be set in the bracket unit 200 or outside the bracket unit 200, without limitation.

[0076] In addition, in some embodiments, the control unit 500 can also be used to determine whether the relative position of the new polishing pad and the upper platen 10 is offset based on the pad surface morphology information of the new polishing pad placed on the lower platen 20 and the platen surface morphology information of the upper platen 10.

[0077] With the above solution, after the residue is cleaned, the operator can tear off the adhesive sealing paper on the new polishing pad of the upper platen 10 and place it on the lower platen 20. The operator can roughly position the new polishing pad based on past experience, and then control the detection unit 600 to scan the disk surface of the upper platen 10 and the pad surface of the new polishing pad to respectively obtain the disk surface morphology information of the upper platen 10 and the pad surface morphology information of the new polishing pad, and then determine the position of the new polishing pad based on the pad surface morphology information of the new polishing pad. The new polishing pad is adjusted based on the pad surface morphology information of the new polishing pad and the disk surface morphology information of the upper fixed plate 10, to determine whether the relative position of the new polishing pad and the upper fixed plate 10 is offset. When the relative position of the new polishing pad and the upper fixed plate 10 is offset, the position of the new polishing pad is adjusted based on the pad surface morphology information of the new polishing pad and the disk surface morphology information of the upper fixed plate 10, until the relative position of the new polishing pad and the upper fixed plate 10 is not offset. Thereafter, the upper fixed plate 10 is pressed downward to press the new polishing pad onto the upper fixed plate 10.

[0078] It should be noted that in the above scheme, the disk surface morphology information and the pad surface morphology information can be processed by the control unit 500 and presented on the display in the form of images respectively. By comparing the corresponding images of the two, it can be determined whether the relative position of the new polishing pad and the upper fixed plate 10 is offset.

[0079] Specifically, polishing liquid holes S are respectively provided on the new polishing pad and the upper platen 10 . Whether the relative positions of the new polishing pad and the upper platen 10 are offset can be determined based on whether the polishing liquid holes S in the images of the new polishing pad and the upper platen 10 overlap.

[0080] When the relative position of the new polishing pad and the upper fixed plate 10 is offset, the position of the new polishing pad can be moved manually by the operator or by using a mechanical moving structure according to the real-time displayed image until the polishing liquid hole S in the image of the new polishing pad and the upper fixed plate 10 coincides, thereby achieving precise positioning of the new polishing pad and the upper fixed plate 10, avoiding defects such as bubbling of the polishing pad due to blockage of the polishing liquid hole S due to human operation, reducing material waste and improving production efficiency.

[0081] In addition, it should be noted that no polishing liquid hole S is provided on the lower polishing pad 12 of the lower fixed plate 20. Therefore, after the upper polishing pad 11 is pasted, it is only necessary to tear off the adhesive sealing paper on the back of the lower polishing pad 12, place it on the lower fixed plate 20, control the upper fixed plate 10 and the lower fixed plate 20 to close the plates, apply pressure, and press for a certain period of time to complete the pasting of the lower polishing pad 12.

[0082] In addition, as shown in the figure, in some embodiments, the bracket unit 200 may include a rectangular frame 210, and the cutting tool unit 300 may be installed at the center of the rectangular frame 210, and the rectangular frame 210 has a first surface and a second surface facing each other, the first surface may face the upper fixed plate 10, and the second surface may face the lower fixed plate 20.

[0083] like Figure 2 As shown, either the first cleaning assembly or the second cleaning assembly may include at least two liquid spraying nozzles 700B and at least four air spraying nozzles 700A, and at least two of the liquid spraying nozzles 700B are spaced apart and disposed on the first side 211 of the rectangular frame 210 .

[0084] At least two air nozzles 700A form a group, and the two groups of air nozzles 700A are respectively disposed on the second side 212 and the third side 213 of the rectangular frame 210. Each of the first gripping assembly 410 and the second gripping assembly 420 may include at least two gripping jaws 400A, and the at least two gripping jaws 400A are spaced apart and disposed on the fourth side 214 of the rectangular frame 210. In addition, the detection unit 600 may be disposed on a side surface of the rectangular frame 210.

[0085] It is understandable that the above is merely an exemplary description of the relative positional relationship between the bracket unit 200 and other components, and is not limited thereto.

[0086] In addition, the present disclosure also provides a double-sided polishing pad replacement method, which is applied to the double-sided polishing pad replacement device provided in the present disclosure. The method includes the following steps:

[0087] Step S01: Controlling the working state of the telescopic arm unit 100 so that the support unit 200 enters the space between the upper fixed plate 10 and the lower fixed plate 20 and drives the cutting tool unit 300 to move along the first direction X, so that the first tool 310 cuts the old polishing pad on the upper fixed plate 10, and the second tool 320 cuts the old polishing pad on the lower fixed plate 20, so that each old polishing pad is cut into at least two pad blocks;

[0088] Step S02: Control the working state of the telescopic arm unit 100 so that the grabbing unit 400 moves to the position of the cushion block, and control the first grabbing assembly 410 to grab the cushion block on the upper fixed plate 10, and the second grabbing assembly 420 to grab the cushion block on the lower fixed plate 20;

[0089] Step S03 : Control the first grabbing assembly 410 to tear the cushion block off the upper fixed plate 10 , and control the second grabbing assembly 420 to tear the cushion block off the lower fixed plate 20 .

[0090] Exemplarily, after the above step S03, the method further includes the following steps:

[0091] Step S04: controlling the upper fixed plate 10 and the lower fixed plate 20 to rotate, and / or controlling the telescopic arm unit 100 to extend and retract, so that the detection unit 600 scans the surfaces of the upper fixed plate 10 and the lower fixed plate 20, so that the detection unit 600 obtains surface morphology information of the upper fixed plate 10 and the lower fixed plate 20;

[0092] Step S05: Based on the residue information, controlling the upper fixed plate 10 and the lower fixed plate 20 to rotate, and / or controlling the telescopic arm unit 100 to extend and retract, so that the cleaning unit 700 moves to a target cleaning position;

[0093] Step S06: When the cleaning unit 700 moves to the target cleaning position, the cleaning unit 700 is controlled to start performing an operation of cleaning residues.

[0094] Exemplarily, after the above step S06, the method further includes the following steps:

[0095] Step S07: placing a new polishing pad on the lower plate 20;

[0096] Step S08: Control the upper fixed plate 10 and the lower fixed plate 20 to rotate, and / or control the telescopic arm unit 100 to extend and retract, so that the detection unit 600 scans the surfaces of the upper fixed plate 10 and the lower fixed plate 20 to obtain pad surface topography information of the new polishing pad and the surface topography information of the upper fixed plate 10;

[0097] Step S09: determining whether the relative positions of the new polishing pad and the upper platen 10 are offset based on the surface topography information of the new polishing pad and the surface topography information of the upper platen 10;

[0098] Step S10: When the relative position of the new polishing pad and the upper platen 10 is offset, adjusting the position of the new polishing pad based on the pad surface topography information of the new polishing pad and the platen surface topography information of the upper platen 10 until the relative position of the new polishing pad and the upper platen 10 is not offset;

[0099] Step S11 , pressing the upper platen 10 downward to press the new polishing pad onto the upper platen 10 .

[0100] Obviously, the double-sided polishing pad replacement method provided in the embodiment of the present disclosure also has the beneficial effects brought by the double-sided polishing pad replacement device provided in the embodiment of the present disclosure, which will not be described in detail here.

[0101] In addition, an embodiment of the present disclosure also provides a device, including a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, the double-sided polishing pad replacement method as described above is implemented.

[0102] It should be noted here that the above-mentioned equipment provided by the embodiment of the present invention can implement all the method steps implemented in the above-mentioned double-sided polishing pad replacement method embodiment, and can achieve the same technical effect. The parts and beneficial effects of this embodiment that are the same as the method embodiment will not be described in detail here.

[0103] In addition, an embodiment of the present disclosure further provides a readable storage medium on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps in the double-sided polishing pad replacement method as described above are implemented.

[0104] An embodiment of the present invention provides a computer-readable storage medium having a program or instruction stored thereon. When executed by a processor, the program or instruction implements the steps of the double-sided polishing pad replacement method described above and achieves the same technical effect. To avoid repetition, the description is omitted here. The computer-readable storage medium may be, for example, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0105] There are a few points to note:

[0106] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0107] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.

[0108] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0109] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A double-sided polishing pad replacement device for replacing the polishing pads on the upper and lower platens of a double-sided polishing machine; characterized in that: The double-sided polishing pad replacement device comprises: A telescopic arm unit, comprising a drive unit and a telescopic arm body, the telescopic arm body having a first end and a second end opposite to each other along a first direction, the first end being connected to the drive unit, and the second end being driven by the drive unit to reciprocate relative to the first end along the first direction; a bracket unit connected to the second end of the telescopic arm body and moving synchronously with the second end in the first direction to enter or move out of the space between the upper fixed plate and the lower fixed plate; a cutting tool unit, disposed on the support unit, comprising a first tool and a second tool, wherein the blade of the first tool faces the upper fixed plate and is used to cut the old polishing pad on the upper fixed plate, and the blade of the second tool faces the lower fixed plate and is used to cut the old polishing pad on the lower fixed plate; a gripping unit comprising a first gripping assembly and a second gripping assembly, wherein both the first gripping assembly and the second gripping assembly are capable of performing gripping or releasing actions, and the first gripping assembly is located on a side of the bracket unit facing the upper fixed plate, and the second gripping assembly is located on a side of the bracket unit facing the lower fixed plate; A control unit is connected to the telescopic arm unit and the grasping unit, and the control unit is used to control the working status of the telescopic arm unit and the first grasping assembly.

2. The double-sided polishing pad replacement device according to claim 1, characterized in that: The drive unit includes a drive motor and a transmission assembly, the transmission assembly includes a driving gear, a transmission chain and a driven gear, the driving gear is connected to the output shaft of the drive motor, the telescopic arm body has a rack segment extending along the first direction, the driven gear is engaged with the rack segment, and the transmission chain is transmission-connected between the driving gear and the driven gear.

3. The double-sided polishing pad replacement device according to claim 1, characterized in that: Either the first gripping assembly or the second gripping assembly may include a plurality of gripping claws spaced apart on the support unit.

4. The double-sided polishing pad replacement device according to claim 1, characterized in that: Also includes: a detection unit, the detection unit being disposed on the support unit, and configured to obtain surface topography information of the upper and lower surface plates, and / or obtain surface topography information of polishing pads placed on the upper and lower surface plates, wherein the surface topography information includes residue information; The control unit is also used to control the rotation of the upper fixed plate and the lower fixed plate, and / or control the extension and retraction of the telescopic arm unit, so that the detection unit scans the disk surface of the upper fixed plate and the lower fixed plate to obtain the disk surface morphology information and / or the pad surface morphology information.

5. The double-sided polishing pad replacement device according to claim 4, characterized in that: The double-sided polishing pad replacement device further comprises a cleaning unit, which is arranged on the support unit, and comprises a first cleaning assembly and a second cleaning assembly; wherein the first cleaning assembly is configured to spray fluid toward the upper fixed plate to clean residues on the disk surface of the upper fixed plate; the second cleaning assembly is configured to spray fluid toward the lower fixed plate to clean residues on the disk surface of the lower fixed plate; the control unit is further configured to control the upper fixed plate and the lower fixed plate to rotate and / or control the telescopic arm unit to extend and retract based on the residue information, so that the cleaning unit moves to a target cleaning position; and when the cleaning unit moves to the target cleaning position, control the cleaning unit to start performing an operation of cleaning the residue; And / or, the control unit is further configured to determine whether the relative position of the new polishing pad and the upper platen is offset based on pad surface morphology information of the new polishing pad placed on the lower platen and platen surface morphology information of the upper platen.

6. The double-sided polishing pad replacement device according to claim 5, characterized in that: Either the first cleaning assembly or the second cleaning assembly includes at least one air jet nozzle and at least one liquid jet nozzle provided on the bracket unit.

7. A method for replacing a double-sided polishing pad, characterized in that: Applied to the double-sided polishing pad replacement device according to any one of claims 1 to 6, the method comprises the following steps: controlling the working state of the telescopic arm unit so that the bracket unit enters the space between the upper fixed plate and the lower fixed plate and drives the cutting tool unit to move along the first direction, so that the first tool cuts the old polishing pad on the upper fixed plate and the second tool cuts the old polishing pad on the lower fixed plate, so that each old polishing pad is cut into at least two pad blocks; Controlling the working state of the telescopic arm unit so that the grabbing unit moves to the position of the cushion block, and controlling the first grabbing assembly to grab the cushion block on the upper fixed plate, and the second grabbing assembly to grab the cushion block on the lower fixed plate; The first grabbing assembly is controlled to tear the pad off from the upper fixed plate, and the second grabbing assembly is controlled to tear the pad off from the lower fixed plate.

8. The double-sided polishing pad replacement method according to claim 7, wherein: When applied to the double-sided polishing pad replacement device according to claim 4, after the first gripping assembly tears the pad block from the upper platen and the second gripping assembly tears the pad block from the lower platen, the method further comprises the following steps: Controlling the detection unit to scan the disk surfaces of the upper and lower fixed disks, so that the detection unit obtains disk surface morphology information of the upper and lower fixed disks; Based on the residue information, controlling the upper fixed plate and the lower fixed plate to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the cleaning unit moves to a target cleaning position; When the cleaning unit moves to the target cleaning position, the cleaning unit is controlled to start performing an operation of cleaning residues.

9. The double-sided polishing pad replacement method according to claim 7, wherein: When applied to the double-sided polishing pad replacement device according to claim 5, after controlling the cleaning unit to start performing the operation of cleaning the residue, the method further includes the following steps: placing a new polishing pad on the lower platen; controlling the upper and lower fixed plates to rotate, and / or controlling the telescopic arm unit to extend and retract, so that the detection unit scans the surfaces of the upper and lower fixed plates to obtain pad surface topography information of the new polishing pad and the upper fixed plate; determining whether a relative position of the new polishing pad and the upper platen is offset based on pad surface topography information of the new polishing pad and platen topography information of the upper platen; When the relative position of the new polishing pad and the upper platen is offset, adjusting the position of the new polishing pad based on the pad surface topography information of the new polishing pad and the platen surface topography information of the upper platen until the relative position of the new polishing pad and the upper platen is not offset; The upper platen is pressed downward to press the new polishing pad onto the upper platen.

10. A device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; When the processor executes the computer program, the double-sided polishing pad replacement method according to any one of claims 7 to 9 is implemented.

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