Heating device and evaporation equipment

Abstract

The invention discloses a heating device and evaporation equipment. The heating device comprises an evaporation assembly, an isolation assembly and at least one supporting assembly. The isolation assembly is circumferentially arranged around the evaporation assembly; the first end of the supporting assembly is connected with the evaporation assembly, and the second end of the supporting assembly is connected with the isolation assembly. The evaporation assembly is used for evaporating a to-be-evaporated material; the isolation assembly is used for isolating a heating source of the heating evaporation assembly; the supporting assembly is used for supporting the evaporation assembly, so that a height difference exists between the opening of the evaporation assembly and the isolation assembly; the opening of the evaporation assembly is higher than the isolation assembly in the direction perpendicular to the arrangement direction of the evaporation assembly and the isolation assembly. According to the heating device, the opening of the evaporation assembly can be higher than the isolation assembly through the internal supporting assembly, so that the situation that new materials are polluted by old materials left in the heating device in the process that the to-be-evaporated materials are evaporated through the evaporation assembly is avoided, and the normal preparation efficiency when the evaporation equipment is used for preparing the inner film layer of the display device is guaranteed.

Description

Technical Field

[0001] The present disclosure generally relates to the technical field of display devices, and more particularly to a heating device and an evaporation device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices are widely used in various electronic products due to their low power consumption, easy-to-carry design and easy to realize flexible display.

[0003] Specifically, in the process of preparing the above-mentioned OLED display device, an evaporation machine can be used to achieve the deposition of the film layer inside the OLED display device.

[0004] However, when the material to be evaporated is evaporated using the crucible inside the evaporation machine, the old material is prone to contamination of the new material during the material replacement process, which results in a longer film preparation time.

[0005] Therefore, the low efficiency of preparing the internal film layer of the existing OLED display device has become a problem that needs to be solved. Summary of the invention

[0006] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a heating device and an evaporation device, wherein the heating device can utilize an internal support component to make the opening of the evaporation component higher than the isolation component, thereby avoiding the contamination of the new material by the old material remaining in the heating device during the process of evaporating the material to be evaporated by the evaporation component, thereby ensuring the normal preparation efficiency of the evaporation device when preparing the internal film layer of the display device.

[0007] The heating device is as follows: According to a first aspect of the present application, a heating device is provided, the heating device comprising an evaporation component, an isolation component and at least one support component; wherein the isolation component is circumferentially arranged around the evaporation component; a first end of the support component is connected to the evaporation component, and a second end of the support component is connected to the isolation component; The evaporation component is used to evaporate the material to be evaporated; The isolation component is used to isolate the heating source that heats the evaporation component; The support assembly is used to support the evaporation assembly so that there is a height difference between the opening of the evaporation assembly and the isolation assembly; wherein, along the vertical direction of the arrangement direction of the evaporation assembly and the isolation assembly, the opening of the evaporation assembly is higher than the isolation assembly.

[0008] In addition, the heating device of the present application may also have the following additional technical features: In combination with the first aspect, in a possible implementation, the evaporation assembly includes a columnar cavity and an annular component sleeved on one end of the columnar cavity, and an inner circle area of ​​the annular component matches an opening area of ​​the columnar cavity; The first end of the supporting assembly is connected to a side of the annular component close to the columnar cavity.

[0009] In combination with the first aspect, in a possible implementation manner, the orthographic projection pattern of the support assembly partially overlaps with the orthographic projection patterns of the annular component and the isolation assembly, respectively.

[0010] In combination with the first aspect, in a possible implementation manner, along an extension direction of the annular component toward the isolation component, there is a spacing area between the annular component and the isolation component; A portion of the orthographic projection pattern of the support assembly coincides with the orthographic projection pattern of the spacing area.

[0011] In combination with the first aspect, in a possible implementation, the support assembly further includes a third end disposed between the first end and the second end, the third end extending toward the bottom of the evaporation assembly, wherein the third end contacts an end of the isolation assembly close to the evaporation assembly.

[0012] In combination with the first aspect, in a possible implementation, the orthographic projection pattern of the support component partially overlaps with the orthographic projection pattern of the isolation component; wherein one end of the overlapping portion corresponds to the second end, and the other end corresponds to the third end.

[0013] In combination with the first aspect, in a possible implementation manner, an extension direction of the first end is perpendicular to an extension direction of the second end, and a length of the support assembly in the extension direction of the first end is 12 mm.

[0014] In combination with the first aspect, in a possible implementation manner, the support component is made of alumina ceramics.

[0015] In combination with the first aspect, in a possible implementation manner, the evaporation component is a crucible.

[0016] According to a second aspect of the present application, a vapor deposition device is provided, and the vapor deposition device includes the heating device described in the first aspect.

[0017] Compared with the prior art in which the heating device in the evaporation equipment is prone to contaminating the material to be evaporated when evaporating the material to be evaporated, the heating device and evaporation equipment provided in the embodiments of the present application can use at least one supporting component to make the opening of the evaporation component inside the heating device higher than the isolation component, thereby avoiding the contamination of the new material by the old material remaining in the heating device during the process of evaporating the material to be evaporated by the evaporation component inside the heating device, thereby ensuring the normal preparation efficiency of the evaporation equipment when preparing the internal film layer of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings: Figure 1 This is a schematic diagram of the structure of a heating device in a conventional evaporation device of the present application; Figure 2 A schematic diagram of the structure of a heating device 20 provided in an embodiment of the present application; Figure 3 Another schematic diagram of the structure of the heating device 20 provided in the embodiment of the present application; Figure 4 Another schematic diagram of the structure of the heating device 20 provided in the embodiment of the present application; Figure 5 A schematic diagram of a design of a set of support components 203 provided in an embodiment of the present application; Figure 6 A schematic diagram of the process of preparing the internal film layer of an OLED display device provided in an embodiment of the present application; In the above picture: 10-heating device; 101-evaporation component; 102-isolating component; 103-the spacing area between the opening of the evaporation component 101 and the isolation component 102; 20-heating device; 201-evaporation component; 202-isolating component; 203-support component; 2031-the first end of the support component 203; 2032-the second end of the support component 203; 2033-the third end of the support component 203; 301-the spacing area between the annular component 2012 and the isolation component 202; 401-the overlapping area between the support component 203 provided with the third end 2033 and the isolation component 202. DETAILED DESCRIPTION

[0019] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0020] It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments. In addition, the term "and / or" herein is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order of objects.

[0021] With the continuous development of display technology, Organic Light-Emitting Diode (OLED) display devices are widely used in various electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc. due to their all-solid-state, ultra-thin, no viewing angle restrictions, fast response, ability to work at room temperature, and easy realization of flexible display and 3D display.

[0022] Specifically, in the process of preparing the above-mentioned OLED display device, an evaporation device (eg, an evaporation machine) may be used to achieve deposition of a film layer inside the OLED display device.

[0023] For example, Figure 1 is a schematic diagram of a heating device 10 in a conventional evaporation device of the present application, such as Figure 1 As shown, the heating device 10 may include an evaporation component 101 and an isolation component 102 disposed around an opening of the evaporation component 101; wherein the evaporation component 101 may be, for example, a crucible, and the isolation component 102 may be, for example, a sealing ring.

[0024] In a specific implementation, the heating source inside the heating device 10 can heat the evaporation component 101 so that the evaporation component 101 evaporates the material to be evaporated placed in its own cavity into a gaseous form, thereby completing the evaporation of the material to be evaporated by the heating device 10 .

[0025] Exemplarily, along the vertical direction of the arrangement direction of the evaporation component 101 and the isolation component 102 (ie, Figure 1 In the vertical direction shown in FIG. 1 ), the opening of the evaporation component 101 is lower than the isolation component 102, which results in a gap between the opening of the evaporation component 101 and the isolation component 102. Figure 1 The spacing area 103 is shown.

[0026] Based on this, in the process of using the heating source inside the heating device 10 to heat the evaporation component 101 so that the evaporation component 101 evaporates the material to be evaporated, since the spacing area 103 is a blank area, the evaporated material is easily deposited on the heating source and the side of the isolation component 102 away from the evaporation component 101 through the spacing area 103. This causes the old material deposited inside the heating device 10 to easily contaminate the new material during the process of replacing the material to be evaporated. At the same time, the spacing area 103 is also prone to blockage, which affects the normal preparation efficiency of the evaporation equipment when preparing the internal film layer of the display device and prolongs the preparation time of the film layer.

[0027] Therefore, the low efficiency of preparing the internal film layer of the existing OLED display device has become a problem that needs to be solved.

[0028] Based on this, an embodiment of the present application provides a heating device and an evaporation device, which can use an internal support component to make the opening of the evaporation component higher than the isolation component, thereby avoiding the contamination of new materials by old materials remaining in the heating device during the evaporation of the material to be evaporated by the evaporation component, thereby ensuring the normal preparation efficiency of the evaporation equipment when preparing the internal film layer of the display device.

[0029] Figure 2 is a schematic diagram of the structure of the heating device 20 provided in the embodiment of the present application, such as Figure 2 As shown, the heating device 20 may include an evaporation component 201, an isolation component 202 and at least one support component 203; wherein the isolation component 202 is circumferentially arranged around the evaporation component 201; the first end 2031 of the support component 203 is connected to the evaporation component 201, and the second end 2032 of the support component 203 is connected to the isolation component 202.

[0030] Specifically, the support component 203 can be used to support the evaporation component 201 so that there is a height difference between the opening of the evaporation component 201 and the isolation component 202; wherein, along the vertical direction of the arrangement direction of the evaporation component 201 and the isolation component 202, the opening of the evaporation component 201 is higher than the isolation component 202.

[0031] In a possible implementation, the evaporation component 201 may be used to evaporate a material to be evaporated, wherein the material to be evaporated may be, for example, a metal, an alloy or a compound.

[0032] Exemplarily, the material of the evaporation component 201 can be determined according to the melting point and chemical activity of the material to be evaporated. For example, the evaporation component 201 can be a crucible, and its material can include graphite, tungsten, molybdenum, etc.

[0033] It should be noted that before using the evaporation component 201 to evaporate the material to be evaporated, the evaporation component 201 needs to be cleaned to avoid contamination of the material to be evaporated.

[0034] In a possible implementation, the heating source inside the heating device 20 may be used to heat the evaporation component 201 to achieve the evaporation operation of the evaporation component 201 on the material to be evaporated.

[0035] Exemplarily, the evaporation component 201 may be heated by different heating methods.

[0036] Specifically, when the material of the evaporation component 201 itself includes a resistive material (such as a high melting point metal such as tungsten or molybdenum), the evaporation component 201 can be heated by resistance heating through contact between the evaporation component 201 and a resistance heating element (such as a resistance wire or a resistance sheet).

[0037] Optionally, a high-energy electron beam may be emitted by an electron gun and focused on the evaporation component 201 to heat the evaporation component 201 by electron beam heating.

[0038] Optionally, an induction coil may be used to generate an alternating magnetic field to generate eddy currents in the evaporation component 201 , thereby achieving contactless heating of the evaporation component 201 by induction heating.

[0039] Optionally, a halogen bulb may be placed near the evaporation component 201 to heat the evaporation component 201 by radiation heating. It should be noted that the present application does not limit the heating method of the evaporation component 201.

[0040] In a possible implementation, the isolation component 202 may be used to isolate a heating source of the heating evaporation component 201 .

[0041] Exemplarily, the isolation component 202 may be disposed around the opening of the evaporation component 201. For example, the isolation component 202 may be a sealing ring.

[0042] Specifically, when the isolation component 202 is a sealing ring, the isolation component 202 can have the characteristics of high temperature resistance, low gas evolution rate, good compatibility with the material of the evaporation component 201 and the material to be evaporated, and easy processing and installation.

[0043] In a possible implementation, at least one support assembly 203 may be provided between the opening circumference of the evaporation assembly 201 and the isolation assembly 202 , wherein a first end 2031 of the support assembly 203 is connected to the evaporation assembly 201 , and a second end 2032 of the support assembly 203 is connected to the isolation assembly 202 .

[0044] Exemplarily, the support component 203 can be connected to the evaporation component 201 through its first end 2031 , so that the opening of the evaporation component 201 is arranged higher than the isolation component 202 .

[0045] Based on this, reference Figure 2 , along the vertical direction of the arrangement direction of the evaporation component 201 and the isolation component 202 (ie, Figure 2 In the vertical direction shown in FIG. 2 ), the opening of the evaporation component 201 is higher than the isolation component 202.

[0046] In the embodiment of the present application, by designing a support component 203 between the evaporation component 201 and the isolation component 202, the evaporation component 201 can be arranged higher than the isolation component 202, thereby avoiding the Figure 1 As shown in the prior art, the isolation component 202 is arranged higher than the evaporation component 201 , and thus the new material evaporated in the evaporation component 201 is deposited on the isolation component 202 , and the old evaporated material contaminates the new material.

[0047] Exemplarily, the support component 203 may be made of alumina ceramic (ie, Al 2 O 3 ceramic).

[0048] Exemplarily, a group of support components 203 may be disposed between the circumference of the evaporation component 201 and the isolation component 202 , wherein the group of support components 203 may be two support components 203 uniformly disposed between the circumference of the evaporation component 201 and the isolation component 202 .

[0049] Compared with the heating device in the evaporation equipment in the prior art, which is easy to contaminate the material to be evaporated when evaporating the material to be evaporated, the heating device 20 provided in the embodiment of the present application can use at least one supporting component 203 to make the opening of the evaporation component 201 inside the heating device 20 higher than the isolation component 202, thereby avoiding the contamination of the new material by the old material remaining in the heating device 20 during the process of evaporating the material to be evaporated by the evaporation component 201 inside the heating device 20, thereby ensuring the normal preparation efficiency of the evaporation equipment when preparing the internal film layer of the display device.

[0050] In another embodiment of the present application, a specific structural distribution of the evaporation component 201 is also provided. For example, Figure 3 is another structural schematic diagram of the heating device 20 provided in the embodiment of the present application, such as Figure 3 As shown, the evaporation component 201 may include a columnar cavity 2011 and an annular component 2012 sleeved on one end of the columnar cavity 2011 , wherein the inner circle area of ​​the annular component 2012 matches the opening area of ​​the columnar cavity 2011 .

[0051] Specifically, the first end 2031 of the support assembly 203 is connected to a side of the annular component 2012 close to the columnar cavity 2011 .

[0052] In the embodiment of the present application, when the evaporation component 201 includes the annular component 2012, the support component 203 can be connected to the annular component 2012 through the first end 2031, so that the connection between itself and the evaporation component 201 is more stable, thereby ensuring the supporting effect of the support component 203 on the evaporation component 201.

[0053] In a possible implementation, the evaporation assembly 201 may include a columnar cavity 2011 and an annular component 2012 sleeved on one end of the columnar cavity 2011 .

[0054] Exemplarily, the inner circle area of ​​the annular component 2012 may match the opening area of ​​one end of the columnar cavity 2011 ; wherein the columnar cavity 2011 may be used to place the material to be evaporated.

[0055] For example, the inner radius of the annular component 2012 may be the same as the radius of the opening at one end of the columnar cavity 2011 (ie, the inner circumference of the annular component 2012 is the same as the circumference of the opening at one end of the columnar cavity 2011).

[0056] Exemplarily, one end opening of the columnar cavity 2011 may be in a welding state with the inner ring of the annular component 2012 .

[0057] In a possible implementation, the first end 2031 of the support assembly 203 may be connected to a side of the annular component 2012 close to the columnar cavity 2011 .

[0058] Exemplarily, when the support component 203 is set to a straight shape, the support component 203 can be based on the connection between its own first end 2031 and the annular component 2012 close to the side of the columnar cavity 2011, and through its own thickness, the annular component 2012 can be set higher than the isolation component 202, so that the opening of the columnar cavity 2011 in a connected state with the annular component 2012 is higher than the isolation component 202.

[0059] Exemplary, reference Figure 3 When the support component 203 is set to a right-angle shape (that is, the first end 2031 and the second end 2032 of the support component 203 are perpendicular to each other) and its own first end 2031 is connected to the side of the annular component 2012 close to the columnar cavity 2011, the support component 203 can make the annular component 2012 higher than the isolation component 202 by its own length in the direction of the first end 2031, so that the opening of the columnar cavity 2011 in a connected state with the annular component 2012 is higher than the isolation component 202.

[0060] In another embodiment of the present application, a specific arrangement of the components inside the heating device 20 is also provided.

[0061] In a possible implementation, the outer ring area of ​​the annular component 2012 of the evaporation component 201 may match the area of ​​the opening region surrounded by the isolation component 202 surrounding the evaporation component 201 in the circumferential direction.

[0062] Exemplarily, when the orthographic projection pattern of the heating component 20 is specifically that the outer ring of the annular component 2012 is seamlessly connected to the isolation component 202, the outer ring area of ​​the annular component 2012 can match the area of ​​the opening area surrounded by the isolation component 202; wherein the orthographic projection direction can, for example, be the direction in which the opening end of the evaporation component 201 points to the bottom end of the evaporation component 201.

[0063] Based on this, the orthographic projection pattern of the support component 203 may partially overlap with the orthographic projection patterns of the annular component 2012 and the isolation component 202 .

[0064] Specifically, a partial orthographic projection pattern of the first end 2031 of the support component 203 coincides with the orthographic projection pattern of the annular component 2012 , and a partial orthographic projection pattern of the second end 2032 coincides with the orthographic projection pattern of the isolation component 202 .

[0065] In a possible implementation, along the extension direction of the annular component 2012 of the evaporation component 201 toward the isolation component 202, there may be a gap between the annular component 2012 and the isolation component 202. Figure 3 The spacing area 301 is shown. When the direction from the opening end of the evaporation component 201 to the bottom end of the evaporation component 201 is a vertical direction, the extension direction of the annular component 2012 of the evaporation component 201 to the isolation component 202 may be a horizontal direction.

[0066] For example, when the orthographic projection pattern of the heating component 20 is specifically a ring-shaped blank area between the outer ring of the annular component 2012 and the isolation component 202, there may be a ring-shaped blank area between the annular component 2012 and the isolation component 202. Figure 3 The spacing area 301 is shown; wherein the orthographic projection direction may be, for example, a direction in which the opening end of the evaporation component 201 points to the bottom end of the evaporation component 201 .

[0067] Based on this, a portion of the orthographic projection pattern of the support assembly 203 may overlap with the orthographic projection pattern of the spacing area 301 .

[0068] Specifically, the support component 203 is provided with a partial orthographic projection pattern of the first end 2031 which coincides with the orthographic projection pattern of the annular component 2012, and a partial orthographic projection pattern of the second end 2032 which coincides with the orthographic projection pattern of the isolation component 202. The orthographic projection pattern of the area between the first end 2031 and the second end 2032 of the support component 203 may coincide with the orthographic projection pattern of the spacing area 301.

[0069] In the embodiment of the present application, based on the spacing area 301 between the above-mentioned annular component 2012 and the isolation component 202, the contact area between the support component 203 and the evaporation component 201 can be a hollow area, so that when the evaporation component 201 evaporates the material to be evaporated, the heat dissipation inside the heating device 20 can be reduced through the hollow area, thereby ensuring the evaporation efficiency of the evaporation component 201. At the same time, the hollow area avoids the clogging of the spacing area 301 by the material when evaporating the material to be evaporated.

[0070] In another embodiment of the present application, other designs of the support assembly 203 are also provided.

[0071] For example, Figure 4 is another structural schematic diagram of the heating device 20 provided in the embodiment of the present application, such as Figure 4 As shown, the support assembly 203 may further include a third end 2033 disposed between the first end 2031 and the second end 2032 , wherein the third end 2033 extends toward the bottom of the evaporation assembly 201 .

[0072] Specifically, the third end 2033 contacts an end of the isolation component 202 close to the evaporation component 201 .

[0073] In the embodiment of the present application, based on the design of the third end 2033 in the support component 203 that contacts one end of the isolation component 202 close to the evaporation component 201, the setting position of the support component 203 can be quickly determined through the relative position of the third end 2033 and one end of the isolation component 202, thereby ensuring the accuracy of the setting position of the support component 203 inside the heating device 20.

[0074] In a possible implementation, the third end 2033 of the support assembly 203 may be disposed between the first end 2031 and the second end 2032 .

[0075] Exemplarily, when the support component 203 is set in a straight shape, the third end 2033 can be set at a position between the first end 2031 and the second end 2032 so as to be in contact with an end of the isolation component 202 close to the evaporation component 201, wherein the third end 2033 extends toward the bottom of the evaporation component 201 (i.e., the bottom of the columnar cavity 2011).

[0076] For example, when the first end 2031 and the second end 2032 of the support component 203 are at right angles (i.e., the first end 2031 and the second end 2032 of the support component 203 are perpendicular to each other) and the first end 2031 is connected to the side of the annular component 2012 close to the columnar cavity 2011, the third end 2033 can be arranged as follows: Figure 4 The first end 2031 and the second end 2032 are located at a position where the isolation component 202 can contact one end of the evaporation component 201 ; wherein the third end 2033 is arranged parallel to the first end 2031 and perpendicular to the second end 2032 .

[0077] In a possible implementation, the orthographic projection pattern of the support component 203 may partially overlap with the orthographic projection pattern of the isolation component 202 , wherein one end of the overlapping portion may correspond to the second end 2032 , and the other end may correspond to the third end 2033 .

[0078] Exemplary, reference Figure 4 Along the orthographic projection direction of the heating device 40 (ie, the direction from the annular component 2012 to the columnar cavity 2011 of the evaporation component 201 ), the support component 203 provided with the third end 2033 and the isolation component 202 form an overlapping area 401 .

[0079] Specifically, since the third end 2033 of the supporting component 203 contacts the end of the isolating component 202 close to the evaporating component 201 , one end of the overlapping region 401 corresponds to the third end 2033 , and the other end corresponds to the first end 2031 .

[0080] It should be noted that, whether the outer ring area of ​​the annular component 2012 matches the area of ​​the opening area surrounded by the isolation component 202, or there is a gap between the annular component 2012 and the isolation component 202, Figure 3 In the spacing area 301 shown, one end of the overlapping area 401 of the support component 203 and the isolation component 202 in the orthographic projection direction corresponds to the third end 2033 of the support component 203 , and the other end corresponds to the first end 2031 of the support component 203 .

[0081] In a possible implementation, when the extension direction of the first end 2031 of the support assembly 203 is perpendicular to the extension direction of the second end 2032 of the support assembly 203 , the length of the support assembly 203 in the extension direction of the first end 2031 is 12 mm.

[0082] For example, Figure 5 203 is a schematic diagram of a set of support components 203 provided in an embodiment of the present application. Specifically, Figure 5The group of support assemblies 203 shown may be evenly disposed around the circumference of the evaporation assembly 201 and between the two support assemblies 203 of the isolation assembly 202 as described in the previous embodiments.

[0083] Exemplary, reference Figure 5 Each supporting assembly 203 may include a first end 2031 and a second end 2032 that are vertically arranged, and a third end 2033 that is arranged between the first end 2031 and the second end 2032; wherein the third end 2033 is arranged parallel to the first end 2031, and the third end 2033 is arranged vertically to the second end 2032.

[0084] Specifically, the support assembly 203 extends in the direction of the first end 2031 (ie, Figure 5 The length in the vertical direction shown in the figure) can be 12 mm, and the length in the vertical direction of the extension direction of the first end 2031 (ie, Figure 5 The length of the support assembly 203 in the horizontal direction of the second end 2031 (ie, Figure 5 The length in the vertical direction shown) can be 12 mm; the support assembly 203 extends in the direction of the third end 2033 (ie, Figure 5 The length in the vertical direction shown in the figure) can be 12 mm, and the length in the vertical direction of the extension direction of the third end 2033 (ie, Figure 5 The length in the horizontal direction (as shown) can be 12 mm.

[0085] It should be noted that the length of the support component 203 in the extension direction of the first end 2031 and the length of the support component 203 in the extension direction of the third end 2033 both terminate at the contact position with the extension direction of the second end 2032 .

[0086] Secondly, the shortest distance between the two first ends 2031 in a group of support components 203 is 30.5 mm (with an error of 0.4 mm), and the longest distance between the two first ends 2031 is 32.9 mm; the shortest distance between the two third ends 2033 in a group of support components 203 is 34.8 mm, and the longest distance between the two third ends 2033 is 37.2 mm (with an error of 0.4 mm); the longest distance between the two second ends 2032 in a group of support components 203 is 45 mm.

[0087] It should be noted that the shortest distance and the longest distance between different ends of the above-mentioned set of support components 203 can be designed according to the outer circle radius of the annular component 2012 of the evaporation component 201 and / or the size of the opening area formed around the isolation component 202, and the present application does not impose any specific restrictions on this.

[0088] In another embodiment of the present application, an evaporation device 30 is introduced. The evaporation device 30 may include the heating device 20 in the above embodiment.

[0089] Exemplarily, the evaporation device 30 may be an evaporation machine with a size of 200 mm*200 mm.

[0090] For example, the evaporation device 30 can be used to prepare the internal film layer of the OLED display device. Specifically, Figure 6 Schematic diagram of the process of preparing the internal film layer of the OLED display device provided in the embodiment of the present application, such as Figure 6 As shown, the preparation process may specifically include the following steps: Step 601 , establishing a vacuum environment in the evaporation device 30 .

[0091] For example, the vacuum degree inside the evaporation device 30 can be set to 10⁻³Pa~10⁻ 6 Pa, so as to establish a vacuum environment inside the evaporation equipment 30.

[0092] It should be noted that the internal environment of the evaporation device 30 is established as a vacuum environment because the evaporation process of the material needs to be carried out in a high vacuum environment. Specifically, the high vacuum environment can reduce the collision between gas molecules and evaporated atoms / molecules to avoid the evaporated atoms colliding with gas molecules before reaching the substrate, thereby reducing the quality of the film layer. At the same time, the high vacuum environment can prevent the film layer from being oxidized or contaminated.

[0093] Step 602 , heating the evaporation component 201 in the evaporation device 30 , so as to achieve evaporation of the material to be evaporated by utilizing the evaporation component 201 .

[0094] For example, when the material of the evaporation component 201 itself includes a resistive material (such as a high melting point metal such as tungsten or molybdenum), the evaporation component 201 can be heated by resistance heating through contact between the evaporation component 201 and a resistance heating element (such as a resistance wire or a resistance sheet).

[0095] Optionally, a high-energy electron beam may be emitted by an electron gun and focused on the evaporation component 201 to heat the evaporation component 201 by electron beam heating.

[0096] Optionally, an induction coil may be used to generate an alternating magnetic field to generate eddy currents in the evaporation component 201 , thereby achieving contactless heating of the evaporation component 201 by induction heating.

[0097] Optionally, a halogen bulb may be placed near the evaporation component 201 to heat the evaporation component 201 by radiation heating. It should be noted that the present application does not limit the heating method of the evaporation component 201.

[0098] Step 603 , forming a film layer inside the OLED display device by evaporated atoms or molecules of the material to be evaporated.

[0099] For example, the atoms or molecules formed by evaporating the material to be evaporated can move in all directions in a straight line in a vacuum environment, so that after the atoms or molecules move to the surface of the substrate, they form a film layer inside the OLED display device through a series of processes such as adsorption, migration, nucleation and growth.

[0100] Specifically, the evaporated atoms can gather at sites with lower energy on the substrate surface to form atomic clusters, thereby realizing the above-mentioned nucleation process; and then a continuous film layer can be formed based on the aggregation and connection of multiple atomic clusters.

[0101] Step 604 , cooling the film layer formed in step 603 .

[0102] It should be noted that after the film layer is formed, its temperature needs to be gradually cooled to room temperature to avoid stress or cracking of the film layer.

[0103] The evaporation device 30 provided in the embodiment of the present application can utilize at least one supporting component 203 disposed in the internal heating device 20 thereof to make the opening of the evaporation component 201 inside the heating device 20 higher than the isolation component 202, thereby avoiding the contamination of new materials by old materials remaining in the heating device 20 during the process of evaporating the material to be evaporated by the evaporation component 201 inside the heating device 20, thereby ensuring the normal preparation efficiency of the evaporation device 30 when preparing the internal film layer of the display device.

[0104] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned disclosed concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. A heating device, characterized in that: The heating device comprises an evaporation component, an isolation component and at least one support component; wherein the isolation component is circumferentially arranged around the evaporation component; a first end of the support component is connected to the evaporation component, and a second end of the support component is connected to the isolation component; The evaporation component is used to evaporate the material to be evaporated; The isolation component is used to isolate the heating source that heats the evaporation component; The support assembly is used to support the evaporation assembly so that there is a height difference between the opening of the evaporation assembly and the isolation assembly; wherein, along the vertical direction of the arrangement direction of the evaporation assembly and the isolation assembly, the opening of the evaporation assembly is higher than the isolation assembly.

2. The heating device according to claim 1, characterized in that The evaporation assembly comprises a columnar cavity and an annular component sleeved on one end of the columnar cavity, wherein the inner circle area of ​​the annular component matches the opening area of ​​the columnar cavity; The first end of the supporting assembly is connected to a side of the annular component close to the columnar cavity.

3. The heating device according to claim 2, characterized in that The orthographic projection pattern of the supporting component partially overlaps with the orthographic projection patterns of the annular component and the isolation component respectively.

4. The heating device according to claim 3, characterized in that Along the extension direction of the annular component toward the isolation component, there is a spacing area between the annular component and the isolation component; A portion of the orthographic projection pattern of the support assembly coincides with the orthographic projection pattern of the spacing area.

5. The heating device according to claim 1, characterized in that The support assembly further includes a third end disposed between the first end and the second end, the third end extending toward the bottom of the evaporation assembly, wherein the third end contacts an end of the isolation assembly close to the evaporation assembly.

6. The heating device according to claim 5, characterized in that The orthographic projection pattern of the support component partially overlaps with the orthographic projection pattern of the isolation component; wherein one end of the overlapping portion corresponds to the second end, and the other end corresponds to the third end.

7. The heating device according to claim 6, characterized in that An extension direction of the first end is perpendicular to an extension direction of the second end, and a length of the support assembly in the extension direction of the first end is 12 mm.

8. The heating device according to any one of claims 1 to 7, characterized in that: The support component is made of alumina ceramics.

9. The heating device according to any one of claims 1 to 8, characterized in that: The evaporation component is a crucible.

10. A vapor deposition device, characterized in that: A heating device comprising the heating device according to any one of claims 1 to 9.

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