Measurement method and detection equipment

Abstract

The invention discloses a measurement method and detection equipment, and the method comprises the following steps: selecting golden fingers of an image to be detected, selecting a target golden finger from the golden fingers, and determining the setting direction of the target golden finger; coordinates of an outer frame are obtained in the to-be-detected image, a golden finger chamfering area is determined according to the coordinates of the outer frame, and the golden finger chamfering area comprises frame lines which are located on the two sides of a target golden finger, are in the same direction with the target golden finger and are closest to the target golden finger and the golden finger located between the frame lines; according to the coordinates of the outer frame, determining the area outside the chamfering area of the golden finger as a non-chamfering area; according to the coordinates of the outer frame, a frame line in the same direction as the target golden finger in the non-chamfering area is obtained, the distance between the frame line of the non-chamfering area and the frame line of the golden finger chamfering area where the target golden finger is located is calculated, and measurement data are obtained. According to the measurement method, the possibility of measurement errors or omission can be reduced, and the measurement efficiency is improved. The detection equipment with the measurement method also has the advantages.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic processing, and in particular to a measuring method and a detection device. Background Art

[0002] In circuit board design, there are spacing requirements between areas with gold finger pads and areas without gold finger pads to ensure that the gold finger areas have good contact and connection.

[0003] In the related art, the positions to be measured are manually found on the design drawing of the circuit board, and then these positions are measured, and whether the circuit board meets the spacing requirements is determined based on the measured values. This measurement method is slow and inefficient. Moreover, when there are many positions to be measured, this measurement method is prone to measurement errors or omissions. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a measurement method and a detection device, which can reduce the possibility of measurement errors or omissions in the measurement process and improve the measurement efficiency.

[0005] The present invention also provides a detection device having the above measurement method.

[0006] The measuring method according to the first aspect of the present invention is used to detect a circuit board, and the measuring method comprises the following steps: Determine the direction: select the gold finger in the image to be tested, select the target gold finger from the gold fingers, and determine the setting direction of the target gold finger; Group: in the image to be tested, obtain the coordinates of the outer frame, and determine the gold finger chamfer area according to the coordinates of the outer frame, the gold finger chamfer area includes the border lines on both sides of the target gold finger that are in the same direction and closest to the target gold finger, and the gold finger located between the border lines; determine the area outside the gold finger chamfer area as the non-chamfer area according to the coordinates of the outer frame; Calculate: according to the coordinates of the outer frame, obtain the border line in the non-chamfer area that is in the same direction as the target gold finger, calculate the distance between the border line of the non-chamfer area and the border line of the gold finger chamfer area where the target gold finger is located, and obtain measurement data.

[0007] The measurement method according to the embodiment of the present invention has at least the following beneficial effects: the setting direction of the target gold finger and the coordinates of the outer frame can be determined by the method, so as to obtain all the targets that need to be measured on the circuit board, thereby avoiding omissions during the measurement process; at the same time, the gold finger chamfer area and non-chamfer area can be obtained by using the coordinates of the outer frame and the target gold finger, and the distance value can be directly obtained by measuring the spacing between the gold finger chamfer area and the non-chamfer area, thereby improving the measurement speed and efficiency, and effectively solving the problem of measurement errors or omissions, so the measured data is more reliable and can be used to determine whether the circuit board meets the spacing requirements, which is conducive to improving the accuracy of the judgment.

[0008] According to some embodiments of the present invention, in the step of determining the direction, the method of selecting the gold finger in the image to be tested includes: marking the gold finger according to the image to be tested, and selecting the gold finger by identifying the mark; or, selecting the gold finger from the image to be tested according to the shape structure; or, selecting the gold finger from the image to be tested according to the arrangement method.

[0009] According to some embodiments of the present invention, in the step of determining the direction, the method of determining the setting direction of the target golden finger includes: Obtaining the coordinates of any point within the outer frame as reference coordinates; Acquire border lines located on both sides of the reference coordinates along a first direction; Acquire border lines on both sides of the reference coordinates along the second direction; The first direction is perpendicular to the second direction, and the setting direction of the target gold finger is determined by the setting position of the target gold finger, wherein the target gold finger set on the border line on both sides of the reference coordinate along the first direction is defined as a vertical gold finger, and the setting direction is vertical; the target gold finger set on the border line on both sides of the reference coordinate along the second direction is a horizontal gold finger, and the setting direction is horizontal.

[0010] According to some embodiments of the present invention, in the grouping step, in the image to be tested, the coordinates of the outer frame are obtained, and the method for determining the gold finger chamfer area according to the coordinates of the outer frame includes: In the image to be tested, a border line in the same direction as the target golden finger is obtained; Acquire the coordinate parameters of the border line and the target golden finger in the same direction as the target golden finger; By using coordinate parameters, the distance between the border line in the same direction as the target golden finger and the target golden finger is measured, and the border lines located on both sides of the target golden finger and closest to the border line are selected from the border lines in the same direction as the target golden finger; Select the gold fingers located on both sides of the target gold finger and between the closest border lines; The border lines located on both sides of the target gold finger and closest to each other, and the gold fingers located between the border lines are collectively defined as a gold finger chamfer area.

[0011] According to some embodiments of the present invention, the method of selecting the gold fingers located on both sides of the target gold finger and between the closest border lines includes: Obtain the coordinate parameters of the border lines located on both sides of the target cheat sheet and closest to each other, and form a coordinate interval through the coordinate parameters; Obtaining a cheating finger with the same direction as the target cheating finger; Obtaining coordinate parameters of the golden finger in the same direction as the target golden finger; Select the cheating finger that is in the same direction as the target cheating finger and whose coordinate parameters are within the coordinate range.

[0012] According to some embodiments of the present invention, in the grouping step, if the circuit board has multiple groups of gold finger chamfer areas, before executing the method of determining the area outside the gold finger chamfer area as a non-chamfered area according to the coordinates of the outer frame, it is necessary to remove the border lines and gold fingers in the known gold finger chamfer area, and cyclically determine new gold finger chamfer areas until all gold finger chamfer areas in the circuit board are determined.

[0013] According to some embodiments of the present invention, in the grouping step, the method of determining the area outside the chamfered area of ​​the gold finger as the non-chamfered area according to the coordinates of the outer frame includes: Get the border line of the outer border; Get the border lines of all the gold finger chamfered areas; Remove the border line of the gold finger chamfer area from the border line of the outer border; The remaining frame lines of the outer frame are determined as non-chamfered areas.

[0014] According to some embodiments of the present invention, in the step of calculating, according to the coordinates of the outer frame, a frame line in the non-chamfered area in the same direction as the target gold finger is obtained, and the spacing between the frame line of the non-chamfered area and the frame line of the gold finger chamfered area where the target gold finger is located is calculated. The method for obtaining measurement data includes: Obtain the coordinates of the border line of the golden finger chamfer area where the target golden finger is located; Acquire the coordinates of the border line in the non-chamfered area that is in the same direction as the target golden finger; Measuring the distance between the border line of the chamfered area of ​​the gold finger where the target gold finger is located and the border line in the non-chamfered area in the same direction as the target gold finger; The measurement data is obtained.

[0015] According to some embodiments of the present invention, the measuring method further comprises the following steps: Acquire a minimum spacing from the measurement data, and compare the minimum spacing with a standard value; If the minimum spacing is not less than the standard value, the circuit board meets the spacing requirement; If the minimum spacing is smaller than the standard value, the circuit board does not meet the spacing requirement.

[0016] A detection device according to a second aspect of the present invention includes: A memory and a processor, wherein the memory communicates with the processor, a measurement program is stored in the memory, and the processor executes the measurement program to implement the steps of the measurement method described in any of the above embodiments.

[0017] The detection device according to the embodiment of the present invention has at least the following beneficial effects: the memory is used to store the measurement program, so that when the circuit board needs to be tested, the measurement program can be executed by the processor to obtain the distance between the chamfered area and the non-chamfered area of ​​the gold finger, so as to detect the circuit board.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 is a schematic diagram of a circuit board in an embodiment of the present invention; Figure 2 is a schematic diagram of a circuit board in an embodiment of the present invention; Figure 3 Schematic diagram of the measurement method in the embodiment of the present invention; Figure 4 Schematic diagram of the measurement method in the embodiment of the present invention; Figure 5 Schematic diagram of the measurement method in the embodiment of the present invention; Figure 6 Schematic diagram of the measurement method in the embodiment of the present invention; Figure 7 Schematic diagram of the measurement method in the embodiment of the present invention; Figure 8 Schematic diagram of the measurement method in the embodiment of the present invention.

[0020] Reference numerals: Circuit board 100; gold finger 110; vertical gold finger 111; horizontal gold finger 112; Outer frame 120; reference coordinates 121; frame line 122; measurement edge line 123; first boundary 1231; second boundary 1232; horizontal edge line 124; vertical edge line 125; Gold finger chamfered area 130; non-chamfered area 140; spacing h. DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0026] The following describes the measurement method of the first embodiment of the present invention with reference to the accompanying drawings. It should be noted that the first direction in the embodiment is shown as the up-down direction in the accompanying drawings, and the second direction is shown as the left-right direction in the accompanying drawings.

[0027] The embodiment of the present invention provides a measurement method for detecting a circuit board 100, including: determining direction, grouping and calculating. The step of determining direction includes: selecting a gold finger in the image to be tested, selecting a target gold finger from the gold fingers, and determining the setting direction of the target gold finger; the step of grouping includes: in the image to be tested, obtaining the coordinates of the outer frame, determining the gold finger chamfer area according to the coordinates of the outer frame, and determining the area outside the gold finger chamfer area as a non-chamfer area according to the coordinates of the outer frame; the step of calculating includes: according to the coordinates of the outer frame, obtaining the border line in the non-chamfer area in the same direction as the target gold finger, calculating the spacing between the border line of the non-chamfer area and the border line of the gold finger chamfer area where the target gold finger is located, and obtaining measurement data. When applied, the above steps of determining direction, grouping and calculating can be performed in sequence, for example: refer to Figures 1 to 3 As shown, the measurement method includes the following steps: S100, determining direction: selecting a gold finger in the image to be tested, selecting a target gold finger from the gold fingers, and determining a setting direction of the target gold finger; S200, grouping: in the image to be tested, obtaining the coordinates of the outer frame, determining the gold finger chamfer area according to the coordinates of the outer frame; and determining the area outside the gold finger chamfer area as the non-chamfer area according to the coordinates of the outer frame; wherein the gold finger chamfer area includes the frame lines on both sides of the target gold finger that are in the same direction and closest to the target gold finger, and the gold finger located between the frame lines; S300, calculation: according to the coordinates of the outer frame, obtain the frame line in the non-chamfered area in the same direction as the target gold finger, calculate the distance between the frame line of the non-chamfered area and the frame line of the gold finger chamfered area where the target gold finger is located, and obtain measurement data.

[0028] Alternatively, in some embodiments, the above-mentioned measurement method can be implemented in other orders, for example, "obtaining the coordinates of the outer border" can be performed before the step of selecting the gold fingers in the image to be tested; for example, the coordinate data of the gold fingers and the outer border in the image to be tested are obtained at the beginning of the measurement; or, after the step of "selecting the gold fingers in the image to be tested" is completed, the two steps of "selecting the target gold fingers from the gold fingers" and "obtaining the coordinates of the outer border" are performed simultaneously.

[0029] Specifically, in step S100, it is necessary to select all the gold fingers 110 in the image to be tested, and then select a target gold finger from all the gold fingers 110, and determine the setting direction of the target gold finger. The setting direction includes horizontal setting and vertical setting. It should be noted that the selected target gold finger can be any one or more.

[0030] In step S200, the coordinates of the outer frame 120 are obtained in the image to be tested. The outer frame 120 is the outer periphery of the circuit board 100, and the outer frame 120 includes a plurality of frame lines 122. The gold finger chamfer area 130 is determined according to the coordinates of the outer frame 120 and the setting direction of the target gold finger to achieve grouping. Among them, before determining the gold finger chamfer area 130, it is necessary to obtain the frame lines 122 that are located on both sides of the target gold finger and in the same direction as the target gold finger and closest to the target gold finger. The same direction means that the direction of the frame line 122 is the same as the setting direction of the gold finger 110, which is horizontal or vertical. For ease of understanding, refer to Figure 1 and Figure 2 As shown, in the embodiment of the present invention, the border lines 122 located on both sides of the target gold finger and in the same direction as the target gold finger and closest to the target gold finger are defined as the first boundary 1231 and the second boundary 1232 respectively. The gold finger chamfer area 130 includes the first boundary 1231, the second boundary 1232 and the gold finger 110 located between the first boundary 1231 and the second boundary 1232. In step S200, the step of "determining the area outside the gold finger chamfer area as the non-chamfer area according to the coordinates of the outer frame" needs to remove all the coordinates of the first boundary 1231 and the coordinates of the second boundary 1232 from the coordinates of the outer frame 120, and the remaining border line 122 is the non-chamfer area 140, the non-chamfer area 140 does not include the gold finger 110, and the gold finger chamfer area 130 and the non-chamfer area 140 are the targets to be measured. Through step S200, all the gold finger chamfer areas 130 and non-chamfer areas 140 that need to be measured in the measurement process can be found, thereby avoiding the possibility of measurement omissions in the measurement process, thereby improving the measurement efficiency.

[0031] In step S300, according to the coordinates of the outer frame 120, a frame line 122 in the same direction as the target gold finger is obtained in the non-chamfered area 140. For ease of understanding, refer to Figure 1 and Figure 2As shown, in the embodiment of the present invention, the border line 122 in the same direction as the target gold finger in the non-chamfered area 140 is defined as the measurement border line 123. Since the measurement border line 123 is a part of the outer border 120, the coordinates of the measurement border line 123 are also obtained by obtaining the coordinates of the outer border 120. The coordinates of the first boundary 1231 and the coordinates of the second boundary 1232 are respectively compared with the coordinates of the measurement border line 123 to obtain the spacing h between the border line 122 of the non-chamfered area 140 (i.e., the measurement border line 123) and the border line 122 of the gold finger chamfered area 130 where the target gold finger is located (i.e., the first boundary 1231 and the second boundary 1232), thereby obtaining the measurement data.

[0032] In the prior art, it is necessary to manually find the position to be measured on the design drawing of the circuit board 100, and then measure the position and record the measured value. Compared with the prior art, the measurement method provided by the present invention determines the setting direction of the target gold finger and the coordinates of the outer frame 120 to obtain all the targets to be measured on the circuit board 100, thereby avoiding omissions during the measurement process. At the same time, the circuit board 100 is grouped using the coordinates of the outer frame 120 and the setting direction of the target gold finger to form a gold finger chamfer area 130 and a non-chamfer area 140. The distance value can be directly obtained by measuring the spacing h between the gold finger chamfer area 130 and the non-chamfer area 140. The measurement method measures the circuit board 100 through simple and convenient steps, thereby improving the speed and efficiency of the measurement method.

[0033] In some embodiments, in step S100, the method of "selecting the gold fingers in the image to be tested" includes: before obtaining the image to be tested, marking the gold fingers 110 on the image to be tested, wherein the mark can be a symbol mark, such as: pre-drawing a shape symbol on the gold finger 110, or a digital symbol, or a pattern symbol, etc.; or a color mark, etc., and all the gold fingers 110 in the image to be tested are selected by identifying the mark.

[0034] In another embodiment, the gold fingers 110 in the image to be tested can be selected by the shape structure of the gold fingers 110. For example, if only the gold fingers 110 in the circuit board 100 are in a rectangular structure, all the gold fingers 110 can be selected by identifying and selecting the objects with rectangular structures. In other embodiments, the gold fingers 110 can also be selected by the arrangement method. For example, the arrangement method of the gold fingers 110 is often equidistant and array-distributed. By identifying this arrangement method, the gold fingers 110 can also be selected from the image to be tested.

[0035] In some embodiments, in step S100, the method of “determining the setting direction of the target gold finger” includes: Get the coordinates of any point within the outer frame as the reference coordinates; Acquire border lines on both sides of the reference coordinate along the first direction; Along the second direction, the border lines located on both sides of the reference coordinate are obtained.

[0036] Specifically, the setting direction of the target cheating finger can be determined by the setting position of the target cheating finger. Figure 1 and Figure 2 As shown, in the accompanying drawings, the up-down direction is the first direction, and the left-right direction is the second direction. Any point within the outer frame 120 is taken as the reference coordinate 121, and the coordinate parameters of the reference coordinate 121 are obtained, and the setting direction of the target gold finger is determined by the reference coordinate 121. Along the first direction, the border lines 122 located on the upper and lower sides of the reference coordinate 121 are obtained. For the convenience of understanding and description, the border lines 122 located on the upper and lower sides of the reference coordinate 121 are defined as horizontal border lines 124 below. Along the second direction, the border lines 122 located on the left and right sides of the reference coordinate 121 are obtained. For the convenience of understanding and description, the border lines 122 located on the left and right sides of the reference coordinate 121 are defined as vertical border lines 125 below. Since the setting direction of the target gold finger will be perpendicular to the border lines 122. Therefore, the target gold finger that is perpendicular to the horizontal edge 124 and located on the horizontal edge 124 is defined as the vertical gold finger 111, and the setting direction of the vertical gold finger 111 is vertical; the target gold finger that is perpendicular to the vertical edge 125 and located on the vertical edge 125 is defined as the horizontal gold finger 112, and the setting direction of the horizontal gold finger 112 is horizontal, thereby determining the setting direction of the target gold finger by the setting position of the target gold finger.

[0037] In some embodiments, see Figure 1 , Figure 2 and Figure 4 As shown, in step S200, the operation method of "obtaining the coordinates of the outer frame in the image to be tested, and determining the gold finger chamfer area according to the coordinates of the outer frame" includes: S210, in the image to be tested, obtaining a border line in the same direction as the target gold finger; S220, obtaining the border line in the same direction as the target cheating finger and the coordinate parameters of the target cheating finger; S230, measuring the distance between the border line in the same direction as the target cheating finger and the target cheating finger through the coordinate parameters, and selecting the border lines located on both sides of the target cheating finger and closest to the target cheating finger from the border lines in the same direction as the target cheating finger; S240, selecting the gold fingers located on both sides of the target gold finger and between the closest border lines.

[0038] Specifically, in step S210, since the outer frame 120 of the image to be tested includes a plurality of frame lines 122, it is necessary to select the frame line 122 in the same direction as the gold finger 110 from the plurality of frame lines 122. For ease of understanding and description, in this embodiment, the frame lines 122 in the same direction as the gold finger 110 are collectively referred to as the same-direction frame lines. In step S220, the coordinates of the same-direction frame lines and the target gold finger are obtained to obtain the first boundary 1231 and the second boundary 1232. In step S230, the distance between each same-direction frame line and the target gold finger is measured by the coordinate parameters of the same-direction frame line and the coordinate parameters of the target gold finger, thereby determining the frame line 122 closest to the target gold finger among the same-direction frame lines, thereby obtaining the first boundary 1231 and the second boundary 1232. Since the first boundary 1231 and the second boundary 1232 are respectively located on both sides of the target gold finger, and there is a spacing distance between the first boundary 1231 and the second boundary 1232, in order to define the gold finger chamfer area 130, in step S240, it is necessary to select all the gold fingers 110 located between the first boundary 1231 and the second boundary 1232, so that the first boundary 1231, the second boundary 1232 and all the gold fingers 110 between the first boundary 1231 and the second boundary 1232 are collectively defined as the gold finger chamfer area 130, thereby achieving the grouping effect of "determining the gold finger chamfer area according to the coordinates of the outer frame" in step S200.

[0039] In some embodiments, see Figure 1 , Figure 2 and Figure 5 As shown, step S240 specifically includes the following steps: S241, obtaining coordinate parameters of the border lines 122 located on both sides of the target golden finger and closest to each other, and forming a coordinate interval through the coordinate parameters; S242, obtaining a cheating finger with the same direction as the target cheating finger; S243, obtaining the coordinate parameters of the gold finger in the same direction as the target gold finger; S244, select a cheating finger that is in the same direction as the target cheating finger and whose coordinate parameters are within the coordinate range.

[0040] Specifically, since there is a spacing distance between the first boundary 1231 and the second boundary 1232, if there are other gold fingers 110 between the first boundary 1231 and the second boundary 1232 in addition to the target gold finger, it is necessary to select the other gold fingers 110 between the first boundary 1231 and the second boundary 1232 to define the gold finger chamfer area 130. In order to select the other gold fingers 110 located between the first boundary 1231 and the second boundary 1232, it is necessary to obtain the coordinate parameters of the first boundary 1231 and the second boundary 1232 through step S241. Since the first boundary 1231 and the second boundary 1232 are located on both sides of the target gold finger, the coordinate parameters of the first boundary 1231 and the coordinate parameters of the second boundary 1232 are different in the vertical direction or the horizontal direction. Figure 2 As shown, if the target gold finger is the horizontal gold finger 112, the first boundary 1231 and the second boundary 1232 are spaced apart in the first direction. Figure 1 As shown, if the target gold finger is a vertical gold finger 111, the first boundary 1231 and the second boundary 1232 have an interval in the second direction. The interval between the first boundary 1231 and the second boundary 1232 forms a coordinate interval. Since it is necessary to determine the direction of the target gold finger in step S100, other gold fingers 110 in the same direction as the target gold finger can be obtained in the same way in step S242. The coordinate parameters of the gold finger 110 in the same direction as the target gold finger are obtained in step S243. Finally, in step S244, the gold finger 110 in the same direction as the target gold finger and whose coordinate parameters are located in the coordinate interval formed by the first boundary 1231 and the second boundary 1232 is selected, so that the first boundary 1231, the second boundary 1232, the target gold finger and the selected gold finger 110 can be collectively defined as the gold finger chamfer area 130.

[0041] In some embodiments, see Figure 1 and Figure 2As shown, in step S200, if the circuit board 100 has multiple groups of gold finger chamfered areas 130, that is, the circuit board 100 includes at least two groups of gold finger chamfered areas 130. Before executing the operation of "determining the area outside the gold finger chamfered area as a non-chamfered area according to the coordinates of the outer frame" in step S200, it is necessary to remove the first boundary 1231, the second boundary 1232 and the gold finger 110 located between the first boundary 1231 and the second boundary 1232 in the determined gold finger chamfered area 130 from the outer frame 120 and the gold finger 110 selected in step S100, and then select a new target gold finger to determine other gold finger chamfered areas 130, so as to avoid the determined gold finger chamfered area 130 from affecting the process of selecting a new target gold finger to find a new gold finger chamfered area 130, resulting in repeated determination of the gold finger chamfered area 130. When all the gold finger chamfered areas 130 are determined, the operation of "determining the area outside the gold finger chamfered area as a non-chamfered area according to the coordinates of the outer frame" in step S200 is performed. Since each new gold finger chamfered area 130 is determined, the gold finger chamfered area 130 will include the gold finger 110. When determining a new gold finger chamfered area 130 and removing the known gold finger chamfered area 130, if all the gold fingers 110 in the circuit board 100 are removed and no gold fingers 110 can be selected as target gold fingers, it means that all the gold finger chamfered areas 130 in the circuit board 100 are determined, and the operation of "determining the area outside the gold finger chamfered area as a non-chamfered area according to the coordinates of the outer frame" in step S200 can be performed.

[0042] In some embodiments, see Figure 1 , Figure 2 and Figure 6 As shown, the operation of "determining the area outside the chamfered area of ​​the gold finger as the non-chamfered area according to the coordinates of the outer frame" in step S200 specifically includes the following steps: S250, obtaining the border line of the outer border; S260, obtaining the border lines of all gold finger chamfered areas; S270, removing the border line of the gold finger chamfer area from the border line of the outer border; S280: Determine the remaining border lines of the outer border as non-chamfered areas.

[0043] Specifically, after all the gold finger chamfered areas 130 of the circuit board 100 are determined, the border line 122 of the outer frame 120 is determined by step S250, wherein the first boundary 1231 and the second boundary 1232 of the gold finger chamfered area 130 are also included in the border line 122 of the outer frame 120. Then, the border lines 122 of all the gold finger chamfered areas 130, that is, all the first boundaries 1231 and the second boundaries 1232 on the circuit board 100 are obtained by step S260. In step S270, all the first boundaries 1231 and the second boundaries 1232 on the circuit board 100 are removed from the border line 122 of the outer frame 120 obtained in step S250. In step S280, the remaining border lines 122 are defined as non-chamfered areas 140, thereby all the border lines 122 in the outer frame 120 can be screened and classified to avoid omissions during the measurement process, and to facilitate the calculation of step S300.

[0044] In some embodiments, see Figure 1 , Figure 2 and Figure 7 As shown, step S300 also includes the following steps: S310, obtaining the coordinates of the border line of the gold finger chamfer area where the target gold finger is located; S320, obtaining the coordinates of the border line in the non-chamfered area in the same direction as the target gold finger; S330, measuring the distance between the border line of the chamfered area of ​​the target gold finger and the border line of the non-chamfered area in the same direction as the target gold finger.

[0045] Specifically, when multiple gold finger chamfered areas 130 and non-chamfered areas 140 need to be measured to detect the circuit board 100, it is necessary to obtain the coordinates of the border line 122 of the gold finger chamfered area 130 to be measured, that is, the coordinate parameters of the first boundary 1231 and the second boundary 1232 to be measured through step S310. Then, the coordinates of the border line 122 in the same direction as the target gold finger are obtained from the non-chamfered area 140 through step S320, that is, the coordinates of the measurement edge line 123 are obtained. Finally, in step S430, the distance between the first boundary 1231 and the measurement edge line 123, and the distance between the second boundary 1232 and the measurement edge line 123 are measured. Thus, the spacing h between the gold finger chamfered area 130 and each non-chamfered area 140 is obtained, and the measurement data is obtained.

[0046] In some embodiments, see Figure 1 , Figure 2 and Figure 8 As shown, the measuring method further comprises the following steps: S400, obtaining a minimum spacing from the measurement data, and comparing the minimum spacing with a standard value; S410. If the minimum spacing is not less than the standard value, the circuit board meets the spacing requirements; S420: If the minimum spacing is less than the standard value, the circuit board does not meet the spacing requirement.

[0047] Specifically, after executing step S300, the spacing h between each group of gold finger chamfered areas 130 and the measurement edge line 123 is obtained. In step S400, by comparing the values ​​of the spacing h, the minimum spacing value is obtained from all the measurement data. Since the circuit board 100 has spacing requirements between the gold finger chamfered area 130 and the non-chamfered area 140 during the design process, it is ensured that the gold finger chamfered area 130 has good contact and connection. Therefore, by comparing the minimum spacing value and the standard value, it can be judged whether the circuit board 100 meets the spacing requirements. If the minimum spacing value is not less than the spacing standard value of the circuit board 100, it means that the gold finger chamfered area 130 and the non-chamfered area 140 meet the spacing requirements, and the circuit board 100 can be used normally; if the minimum spacing value is less than the spacing standard value of the circuit board 100, it means that the gold finger chamfered area 130 and the non-chamfered area 140 do not meet the spacing requirements, the circuit board 100 cannot be used normally, and the circuit board 100 needs to be improved. Through these steps, the design result of the circuit board 100 can be directly obtained without the need to manually compare the measured values ​​one by one, thereby improving the measurement efficiency.

[0048] The following describes the detection device of the second embodiment of the present invention with reference to the accompanying drawings. Figures 1 to 8 As shown, the detection device includes a memory and a processor, wherein the processor communicates with the memory, the memory is a computer-readable storage medium, and a measurement program is stored in the memory, and the measurement program is a computer program for executing the steps of the method in the above embodiment. When it is necessary to detect the circuit board 100, the processor reads the storage content in the memory and executes the measurement program in the memory to implement the steps of the measurement method in any of the above embodiments.

[0049] The detection device of this embodiment uses a memory to store a measurement program, so that when the circuit board 100 needs to be tested, the measurement program can be executed by the processor to obtain the distance between the chamfered area 130 and the non-chamfered area 140 of the gold finger to detect the circuit board 100, thereby improving the detection efficiency of the circuit board 100.

[0050] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A measuring method for testing a circuit board, characterized in that: The measuring method comprises the following steps: Determine the direction: select the gold finger in the image to be tested, select the target gold finger from the gold fingers, and determine the setting direction of the target gold finger; Grouping: in the image to be tested, the coordinates of the outer frame are obtained, and the chamfered area of ​​the gold finger is determined according to the coordinates of the outer frame, wherein the chamfered area of ​​the gold finger includes the border lines on both sides of the target gold finger that are in the same direction and closest to the target gold finger, and the gold finger located between the border lines; according to the coordinates of the outer frame, the area outside the chamfered area of ​​the gold finger is determined as the non-chamfered area; Calculation: According to the coordinates of the outer frame, obtain the frame line in the non-chamfered area in the same direction as the target gold finger, calculate the distance between the frame line of the non-chamfered area and the frame line of the gold finger chamfered area where the target gold finger is located, and obtain measurement data.

2. The measuring method according to claim 1, characterized in that: In the step of determining the direction, the method of selecting the gold fingers in the image to be tested includes: marking the gold fingers according to the image to be tested, and selecting the gold fingers by identifying the marks; or selecting the gold fingers from the image to be tested according to the shape structure; or selecting the gold fingers from the image to be tested according to the arrangement method.

3. The measuring method according to claim 1, characterized in that: In the step of determining the direction, the method of determining the setting direction of the target golden finger includes: Obtaining the coordinates of any point within the outer frame as reference coordinates; Acquire border lines located on both sides of the reference coordinates along a first direction; Acquire border lines on both sides of the reference coordinates along the second direction; The first direction is perpendicular to the second direction, and the setting direction of the target gold finger is determined by the setting position of the target gold finger, wherein the target gold finger set on the border line on both sides of the reference coordinate along the first direction is defined as a vertical gold finger, and the setting direction is vertical; the target gold finger set on the border line on both sides of the reference coordinate along the second direction is a horizontal gold finger, and the setting direction is horizontal.

4. The measuring method according to claim 1, characterized in that: In the grouping step, in the image to be tested, the coordinates of the outer frame are obtained, and the method for determining the gold finger chamfer area according to the coordinates of the outer frame includes: In the image to be tested, a border line in the same direction as the target golden finger is obtained; Acquire the coordinate parameters of the border line and the target golden finger in the same direction as the target golden finger; By using coordinate parameters, the distance between the border line in the same direction as the target golden finger and the target golden finger is measured, and the border lines located on both sides of the target golden finger and closest to the border line are selected from the border lines in the same direction as the target golden finger; Select the gold fingers located on both sides of the target gold finger and between the closest border lines; The border lines located on both sides of the target golden finger and closest to each other, and the golden fingers located between the border lines are collectively defined as a golden finger chamfer area.

5. The measuring method according to claim 4, characterized in that: The method of selecting the gold fingers located on both sides of the target gold finger and between the nearest border lines includes: Obtain the coordinate parameters of the border lines located on both sides of the target cheat sheet and closest to each other, and form a coordinate interval through the coordinate parameters; Obtaining a cheating finger with the same direction as the target cheating finger; Obtaining coordinate parameters of the golden finger in the same direction as the target golden finger; Select the cheating finger that is in the same direction as the target cheating finger and whose coordinate parameters are within the coordinate range.

6. The measuring method according to claim 1, characterized in that: In the grouping step, if the circuit board has multiple groups of gold finger chamfer areas, before executing the method of determining the area outside the gold finger chamfer area as a non-chamfered area according to the coordinates of the outer frame, it is necessary to remove the border lines and gold fingers in the known gold finger chamfer area, and cyclically determine new gold finger chamfer areas until all gold finger chamfer areas in the circuit board are determined.

7. The measuring method according to claim 1, characterized in that: In the grouping step, the method of determining the area outside the chamfered area of ​​the gold finger as the non-chamfered area according to the coordinates of the outer frame includes: Get the border line of the outer border; Get the border lines of all the gold finger chamfered areas; Remove the border line of the gold finger chamfer area from the border line of the outer border; The remaining frame lines of the outer frame are determined as non-chamfered areas.

8. The measuring method according to claim 1, characterized in that: In the calculation step, according to the coordinates of the outer frame, a frame line in the non-chamfered area in the same direction as the target gold finger is obtained, and the spacing between the frame line of the non-chamfered area and the frame line of the gold finger chamfered area where the target gold finger is located is calculated. The method for obtaining measurement data includes: Obtain the coordinates of the border line of the golden finger chamfer area where the target golden finger is located; Acquire the coordinates of the border line in the non-chamfered area that is in the same direction as the target golden finger; Measuring the distance between the border line of the chamfered area of ​​the gold finger where the target gold finger is located and the border line in the non-chamfered area in the same direction as the target gold finger; The measurement data is obtained.

9. The measuring method according to claim 1, characterized in that: The measuring method further comprises the following steps: Acquire a minimum spacing from the measurement data, and compare the minimum spacing with a standard value; If the minimum spacing is not less than the standard value, the circuit board meets the spacing requirement; If the minimum spacing is smaller than the standard value, the circuit board does not meet the spacing requirement.

10. A detection device, characterized in that, include: A memory and a processor, wherein the memory communicates with the processor, a measurement program is stored in the memory, and the processor executes the measurement program to implement the steps of the measurement method according to any one of claims 1 to 9.

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