Temperature determination method and electronic equipment

Abstract

The embodiment of the invention discloses a temperature determination method, and the method comprises the steps: determining a first contact region, which is in contact with a user, of electronic equipment when it is detected that the electronic equipment is in contact with the user; determining a first equipment area corresponding to the first contact area; the first equipment area comprises a part of the first contact area and a part of a non-contact area which is not contacted by the user; and determining the temperature of the first contact area based on the temperatures detected by at least two temperature measurement points in the first equipment area. The embodiment of the invention further discloses electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a temperature determination method and electronic equipment. Background Art

[0002] Smartphones, tablets, laptops and other mobile terminals have become necessities for modern people's lives and work due to their excellent performance. However, with the enhancement of various functions in mobile terminals, their batteries are getting bigger and bigger, and the heat generated is also increasing. Therefore, the regulation of the shell temperature is becoming more and more difficult in the design of the whole machine. Summary of the invention

[0003] In order to solve the above technical problems, the embodiments of the present application hope to provide a temperature determination method and an electronic device.

[0004] The technical solution of the embodiment of the present application is implemented as follows:

[0005] A temperature determination method, the temperature determination method comprising:

[0006] When it is detected that the electronic device is touched by the user, determining a first contact area of ​​the electronic device touched by the user;

[0007] Determine a first device area corresponding to the first contact area; the first device area includes a portion of the first contact area and a portion of a non-contact area that is not touched by the user;

[0008] The temperature of the first contact area is determined based on the temperatures detected by at least two temperature measurement points in the first device area.

[0009] An electronic device, comprising: a processor, a memory and a communication bus;

[0010] The communication bus is used to realize the communication connection between the processor and the memory;

[0011] The processor is used to execute the temperature determination program in the memory to implement the following steps:

[0012] When it is detected that the electronic device is touched by the user, determining a first contact area of ​​the electronic device touched by the user;

[0013] Determine a first device area corresponding to the first contact area; the first device area includes a portion of the first contact area and a portion of a non-contact area that is not touched by the user;

[0014] The temperature of the first contact area is determined based on the temperatures detected by at least two temperature measurement points in the first device area. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A schematic diagram of a temperature determination method provided in an embodiment of the present application Figure 1 ;

[0016] Figure 2 A schematic diagram of the internal structure of an electronic device in a temperature determination method provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of a contact area in a temperature determination method provided in an embodiment of the present application Figure 1 ;

[0018] Figure 4 A schematic diagram of a contact area in a temperature determination method provided in an embodiment of the present application Figure 2 ;

[0019] Figure 5 A schematic diagram of a temperature determination method provided in an embodiment of the present application Figure 2 ;

[0020] Figure 6 A schematic diagram of the deployment of a capacitive sensor in a temperature determination method provided in an embodiment of the present application;

[0021] FIG. 7( a ) is a schematic diagram of a grip posture in a temperature determination method provided in an embodiment of the present application. Figure 1 ;

[0022] FIG. 7( b ) is a schematic diagram of a grip posture in a temperature determination method provided in an embodiment of the present application. Figure 2 ;

[0023] Figure 8 A schematic diagram of a hand-holding area in a temperature determination method provided in an embodiment of the present application;

[0024] Fig. 9 A schematic diagram of the conversion of the contact area in a temperature determination method provided in an embodiment of the present application Figure 1 ;

[0025] Fig.10 A schematic diagram of the conversion of the contact area in a temperature determination method provided in an embodiment of the present application Figure 2 ;

[0026] Fig.11 A schematic diagram of a temperature determination method provided in an embodiment of the present application Figure 3 ;

[0027] Fig.12 A schematic diagram of the structure of a temperature determination device provided in an embodiment of the present application;

[0028] Fig.13 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0030] It should be understood that the "embodiments of the present application" or "the aforementioned embodiments" mentioned throughout the specification mean that specific features, structures or characteristics related to the embodiments are included in at least one embodiment of the present application. Therefore, "in the embodiments of the present application" or "in the aforementioned embodiments" appearing throughout the specification may not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the various embodiments of the present application, the size of the sequence numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned sequence numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.

[0031] Unless otherwise specified, the electronic device performs any step in the embodiments of the present application, and the processor of the electronic device may perform the step. It is also worth noting that the embodiments of the present application do not limit the order in which the electronic device performs the following steps. In addition, the methods used to process data in different embodiments may be the same method or different methods. It should also be noted that any step in the embodiments of the present application can be independently executed by the electronic device, that is, when the electronic device executes any step in the following embodiments, it may not rely on the execution of other steps.

[0032] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] The following is a description of the related technical solutions involved in the embodiments of the present application.

[0034] Portable devices are now everywhere. Smartphones, tablet computers and other mobile terminals have become necessities for modern people's lives and work due to their excellent performance. However, with the enhancement of various functions in mobile terminals, their batteries are getting bigger and bigger, and the heat generated is also increasing. When designing the whole machine, the balance between temperature and performance is becoming more and more difficult.

[0035] In order to solve this problem, major manufacturers have made great efforts in internal design and system optimization, and heat dissipation solutions have been improving in recent years. Existing solutions basically use various passive heat dissipation solutions, from using copper foil, graphite, heat pipes and other materials for heat dissipation to the current large-scale use of vacuum chambers (VC) heat spreaders for heat dissipation. These existing solutions are all non-active. In the process of temperature rise in the system, heat dissipation materials are used for rapid heat conduction to flatten the high and low temperature differences of the entire shell. Once the heat is not evenly distributed in a short period of time, hot spots are easily formed, causing the temperature of the user's hand holding area to be too high, affecting the user experience.

[0036] In terms of balancing system temperature and performance, relevant balance and dynamic adjustment are also required. In order to achieve a dynamic balance between performance and system heat dissipation, how to optimize the system's performance burst in various scenarios and improve the user's temperature experience in the grip area in different scenarios is becoming more and more a key point in the design.

[0037] To this end, an embodiment of the present application provides a temperature determination method, which can be applied to an electronic device, and the electronic device can refer to a device with data processing capabilities such as a laptop, a tablet, and a smart phone. Figure 1 As shown, the method includes the following steps 101 to 103:

[0038] Step 101: When it is detected that an electronic device is touched by a user, a first contact area of ​​the electronic device touched by the user is determined.

[0039] The first contact area refers to the area of ​​the electronic device that is touched by the user, also known as the hand holding area.

[0040] In some embodiments, step 101 may be specifically implemented by measuring the capacitance change between the device surface and the user's skin through a capacitance sensor to determine whether contact occurs; when contact occurs, determining the first contact area based on the capacitance change.

[0041] In some implementations, step 101 may be specifically implemented by measuring the pressure applied by the user to the surface of the device through a pressure sensor to determine whether contact occurs; when contact occurs, determining the first contact area based on pressure changes.

[0042] Step 102: Determine a first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of a non-contact area that is not touched by the user.

[0043] The embodiment of the present application divides the electronic device into multiple device areas. In a feasible implementation, the electronic device can be divided according to the distribution of each device in the electronic device; or the electronic device can be divided according to the use of each device in the electronic device; or the electronic device can be divided according to the multiple gripping postures of the user when touching the electronic device.

[0044] Examples, such as Figure 2 As shown, the electronic device includes: a camera, a main board, a battery, a first sub-board, a second sub-board, and a third sub-board. According to the distribution of the devices in the electronic device, the electronic device is divided into a camera area 21, a main board area 22, a battery area 23, a first sub-board area 24, a second sub-board area 25, a third sub-board area 26, and a detection area 27 composed of a negative temperature coefficient (NTC).

[0045] The first device area corresponding to the first contact area may be one device area or multiple device areas. Figure 3 As shown, when the first contact area is area A, the first device area is the main board area 22. When the first contact area is area B, the first device area includes the main board area 22 and the second sub-board area 25.

[0046] It should be noted that when a human hand is in contact with an electronic device, there may be partial contact and partial non-contact. For example, when a human hand is in contact with an electronic device, the palm of the hand is not in direct contact with the electronic device, but the temperature of the area where the palm is not in direct contact also needs to be adjusted. In addition, when a user is in contact with an electronic device, the temperature of the contact area depends not only on the heat generated by the device in the area, but also on the heat generated by the device within a certain range from the first contact area. Therefore, the embodiment of the present application does not directly use the first contact area for temperature measurement, but uses the first device area including part of the first contact area and part of the non-contact area that is not touched by the user for temperature measurement.

[0047] Step 103: Determine the temperature of the first contact area based on the temperatures detected by at least two temperature measurement points in the first equipment area.

[0048] The temperature measuring point is used to detect the temperature in the equipment area. Figure 2 As shown, the camera area 21 includes NTC11; the main board area 22 includes NTC1, NTC2, NTC3, NTC4, NTC5, and NTC7; the battery area 23 includes NTC6; the first sub-board area 24 includes NTC8; the second sub-board area 25 includes NTC9; the third sub-board area 26 includes NTC10; and the detection area 27 includes NTC11 and NTC12.

[0049] In some embodiments, step 103 may be specifically implemented by: selecting at least two temperature measuring points from a plurality of temperature measuring points in the first device area; performing mathematical fitting on the temperatures detected by the at least two temperature measuring points to obtain the temperature of the first contact area.

[0050] Mathematical fitting, also known as function fitting, is a mathematical method used to approximate a set of data points through a function. The purpose of fitting is to find the best function that is closest to the data points in some sense (e.g., minimizing errors). Mathematical fitting may include, but is not limited to, linear fitting, polynomial fitting, exponential fitting, and nonlinear least squares method. The numerical value after fitting in this scheme can be the average value of multiple temperatures or a range containing the average values ​​of multiple temperatures.

[0051] In a feasible implementation, the implementation method of determining at least two temperature measurement points may include but is not limited to: a temperature measurement point pre-set in the contact area, a temperature measurement point pre-set in the non-contact area; and at least one temperature measurement point randomly selected in the contact area, and at least one temperature measurement point randomly selected in the non-contact area.

[0052] Examples, such as Figure 3 As shown, when the first device area is the mainboard area 22, the selected temperature measurement points may be NTC1, NTC4, and NTC7. Figure 4 As shown, when the first device area includes the main board area 22 and the second sub-board area 25, the selected temperature measurement points may be NTC1, NTC4, and NTC9.

[0053] It should be noted that no matter whether a VC heat spreader is used in the electronic device, or copper foil, graphite, heat pipe and other materials are used for heat dissipation, the temperature of the first contact area of ​​the electronic device touched by the user can be obtained by the temperature determination method provided in the embodiment of the present application, and the temperature of the first contact area can be adjusted in time when the heat has not been evenly distributed to form a hot spot in a short period of time, thereby achieving precise temperature control, minimizing the safety risks caused by excessive temperature, and improving the user experience.

[0054] In an embodiment of the present application, when it is detected that the electronic device is touched by the user, the first contact area of ​​the electronic device touched by the user is determined; the first device area corresponding to the first contact area is determined; the first device area includes part of the first contact area and part of the non-contact area that is not touched by the user; based on the temperatures detected by at least two temperature measuring points in the first device area, the temperature of the first contact area is determined. In this way, the temperature of the first contact area is determined by combining the first contact area of ​​the electronic device touched by the user and the part of the non-contact area in the first device area that is not touched by the user, and the determined temperature is more accurate; and no matter what material is used in the electronic device, the temperature of the first contact area of ​​the electronic device touched by the user can be obtained by the temperature determination method provided in the embodiment of the present application, which has strong applicability. Furthermore, by adjusting the temperature of the first contact area, precise temperature control is achieved, the safety risks caused by excessive temperature are minimized, and the user experience is improved.

[0055] Based on the above embodiments, the embodiments of the present application provide a temperature determination method, which is applied to electronic equipment, referring to Figure 5 As shown, the method includes the following steps 501 to 507:

[0056] Step 501: Determine whether the capacitance in the electronic device changes based on the capacitance value collected by the capacitance sensing device in the electronic device at the current moment.

[0057] Capacitive sensing devices are used to collect capacitance values ​​in electronic devices. Figure 6 As shown, a plurality of capacitive sensors are built into the rear shell area of ​​the electronic device, and the plurality of capacitive sensors constitute a capacitive sensor array. The capacitance value of the capacitive sensor array is read by a multi-channel capacitive sensor detection chip to determine whether the capacitance in the electronic device has changed.

[0058] Step 502: If the capacitance in the electronic device changes, it is determined that the electronic device is touched by the user.

[0059] Step 503: Determine the first contact area based on the capacitance change of each area of ​​the electronic device.

[0060] In some implementations, step 503 may be specifically implemented by taking the area in the electronic device where the capacitance change is the largest as the first contact area.

[0061] In some embodiments, the specific implementation method of step 503 can also be: determining the user's first gripping posture based on the capacitance change of each area of ​​the electronic device; determining the first contact area based on the association between the gripping posture and the contact area and the first gripping posture.

[0062] The first gripping posture is the posture of the electronic device being touched by the user at the current moment.

[0063] In some embodiments, the specific implementation method of "determining the first gripping posture of the user based on the change in capacitance of each area of ​​the electronic device" can be: determining whether the mode of the electronic device when the user touches it is a landscape mode or a portrait mode based on an acceleration sensor built into the electronic device; determining the first gripping posture of the user based on the mode of the electronic device when the user touches it and the change in capacitance of each area of ​​the electronic device.

[0064] In some embodiments, the "association relationship between the grip posture and the contact area" is determined in the following manner: based on the historical grip posture information of the user before the current moment, determining multiple second grip postures of the user; based on the historical grip posture information and the distribution of each device in the electronic device, determining the contact areas corresponding to each of the multiple second grip postures; associating the multiple second grip postures with the corresponding contact areas to obtain the association relationship between the grip posture and the contact area.

[0065] The historical grip information refers to the posture of the user touching the electronic device before the current moment. The historical grip information may include, but is not limited to: contact time, contact posture (grip), contact area, device area corresponding to the contact area, and other information. The second grip refers to the grip of the user before the current moment, also known as the historical grip.

[0066] In a feasible implementation, the plurality of second gripping postures may be associated with the corresponding contact areas in the form of a table; or, the plurality of second gripping postures may be associated with the corresponding contact areas in the form of a graphic connection.

[0067] For example, the user's common grip posture is the posture in the horizontal screen mode shown in Figure 7 (a) and the posture in the vertical screen mode shown in Figure 7 (b). If the user touches the electronic device in the posture shown in Figure 7 (a), the first contact area is Figure 8 If the user touches the electronic device in the posture shown in FIG7( b ), the first contact area is Figure 8 The hand grip area 3 and the hand grip area 4 in the.

[0068] Here, the above steps 501 to 503 correspond to the above step 101, and the specific implementation of the above step 101 may be referred to during implementation.

[0069] Step 504: Determine a first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of a non-contact area that is not touched by the user.

[0070] Here, the above step 504 corresponds to the above step 102, and the specific implementation of the above step 102 may be referred to during implementation.

[0071] Step 505: Determine the temperature of the first contact area based on the temperatures detected by at least two temperature measurement points in the first device area.

[0072] Here, the above step 505 corresponds to the above step 103, and the specific implementation of the above step 103 may be referred to during implementation.

[0073] In some embodiments, "at least two temperature measurement points in the first device area" are determined by selecting at least two second temperature sensing devices from at least two first temperature sensing devices as temperature measurement points based at least on the positions of each first temperature sensing device in the content of the first device area.

[0074] The first temperature sensing device refers to one or more temperature sensing devices contained in the first equipment area. For example, the first temperature sensing device can be Figures 2 to 4 NTC in. NTC is mainly distributed in the heat source area and cold area of ​​the motherboard. Some NTCs are used to measure the temperature changes of different hot spots, and some NTCs are used to read the temperature of the cold area to simulate the ambient temperature detection.

[0075] Since the temperature of the first contact area depends not only on the devices in the area, but also on the devices within a certain range from the first contact area, the temperature measurement point is not limited to the temperature sensing devices in the first contact area, but all temperature sensing devices in the first equipment area are considered.

[0076] In a feasible implementation method, the specific implementation method of "selecting at least two second temperature sensing devices from at least two first temperature sensing devices as temperature measurement points based on at least the positions of each first temperature sensing device in the content of the first device area" can be: based on at least one of the positions of each first temperature sensing device in the content of the first device area, the number of times selected, the measurement accuracy and the weight, at least two second temperature sensing devices are selected from at least two first temperature sensing devices as temperature measurement points.

[0077] In some implementations, step 505 may be specifically implemented by: determining the weights of the temperature measuring points in the first device area and the real-time temperatures of the temperature measuring points; and determining the temperature of the first contact area based on the weights and real-time temperatures of the temperature measuring points.

[0078] The weights of the temperature measurement points can be determined in at least four ways:

[0079] The first method is to determine the weight of the temperature measuring point based on the difference between the actual temperature of the electronic device and the real-time temperature of the temperature measuring point.

[0080] The greater the difference between the actual temperature of the electronic device and the real-time temperature of the temperature measuring point, the smaller the weight of the temperature measuring point; the smaller the difference between the actual temperature of the electronic device and the real-time temperature of the temperature measuring point, the greater the weight of the temperature measuring point; that is, the two are negatively correlated.

[0081] The second method is to determine the weight of the temperature measuring point based on the position of the temperature measuring point.

[0082] If the location of the temperature measurement point is the location of the device that generates the highest heat, the weight of the temperature measurement point is greater. Alternatively, if the location of the temperature measurement point best represents the temperature change of the current device area, the weight of the temperature measurement point is greater.

[0083] The third method is to determine the weight of the temperature measuring point based on the number of times the temperature measuring point is selected.

[0084] If a temperature measuring point is elected more times, the weight of the temperature measuring point will be greater; if a temperature measuring point is elected less times, the weight of the temperature measuring point will be smaller.

[0085] A fourth method is to determine the weight of the temperature measuring point based on the surface material of the electronic device corresponding to the temperature measuring point; different surface materials correspond to different weights.

[0086] Generally, the front shell of an electronic device is made of glass, and the back shell is made of metal aluminum, or a combination of leather, plastic, glass, etc. Since different materials have different heat dissipation speeds, if the surface material of the electronic device corresponding to the temperature measurement point has a fast heat dissipation speed, the weight can be slightly lower; if the surface material of the electronic device corresponding to the temperature measurement point has a slow heat dissipation speed, the weight can be slightly higher.

[0087] In some embodiments, the specific implementation method of "determining the temperature of the first contact area based on the weights and real-time temperatures of the temperature measuring points" may be: using a fitting function to mathematically fit the weights and real-time temperatures of the temperature measuring points to obtain the temperature of the first contact area.

[0088] In some embodiments, the fitting value (temperature of the first contact area) obtained by the fitting function can be compared with the actual temperature of the electronic device to fine-tune the weights of each NTC. The fitting value is the temperature fitted by several NTCs with weights.

[0089] Step 506: Determine a temperature threshold based on the temperatures detected at each temperature measuring point in the first device area.

[0090] In some implementations, step 506 may be specifically implemented by taking the average value of the temperatures detected by the temperature measuring points in the first device area as the temperature threshold, or taking the lowest value of the temperatures detected by the temperature measuring points in the first device area as the temperature threshold.

[0091] In some embodiments, the specific implementation of determining the temperature threshold may be: determining the temperature threshold based on the temperatures detected by all temperature measuring points in the electronic device, or determining the temperature threshold based on the temperatures detected by a preset temperature measuring point in each device area in the electronic device.

[0092] Step 507: Adjust the temperature of the first contact area to the temperature threshold.

[0093] It should be noted that, in addition to the temperature control method of adjusting the temperature of the first contact area, the temperature control can also be achieved by controlling the operation of each device in the first equipment area.

[0094] Based on the above embodiment, the temperature determination method provided in the embodiment of the present application can also dynamically fit the temperature of the contact area after the conversion based on the conversion of the contact area of ​​the electronic device being contacted by the user, specifically including the following steps 508 to 510:

[0095] Step 508: When it is detected that the contact area of ​​the electronic device touched by the user is converted from the first contact area to the second contact area, an overlapping area between the first contact area and the second contact area is determined.

[0096] The second contact area is the converted contact area.

[0097] Step 509: If the overlapping area meets a preset area threshold, determine the temperature of the second contact area based on the temperatures of multiple temperature measurement points in the first contact area.

[0098] The regional threshold can be preset and can be set specifically according to the actual business scenario.

[0099] like Fig. 9 As shown, when the first contact area is Fig. 9 When the A area is shown, the temperature detected by NTC1, NTC4 and NTC9 is used, and the respective weights of NTC1, NTC4 and NTC9 are combined to use the fitting function f1 (NTC1, NTC4, NTC7) to fit the core temperature of the A area. If the contact area of ​​the electronic device touched by the user is converted from the A area to the B area, since the overlapping area of ​​the A area and the B area meets the area threshold, NTC1, NTC4 and NTC9 can continue to be used, but the weights have been dynamically adjusted, and the fitting function f2 (NTC1, NTC4, NTC7) is used to fit the temperature of the B area.

[0100] Step 510: If the overlapping area does not meet the area threshold, determine the temperature of the second contact area based on temperatures detected by at least two temperature measurement points in the first device area corresponding to the second contact area.

[0101] like Fig.10 As shown, when the first contact area is Fig.10 When the A area is shown, the temperature detected by NTC1, NTC4 and NTC7 is used, and the respective weights of NTC1, NTC4 and NTC7 are combined to fit the core temperature of area A using the fitting function f1 (NTC1, NTC4, NTC7). If the contact area of ​​the electronic device touched by the user is converted from area A to area B, since the overlapping area of ​​area A and area B does not meet the area threshold, the temperature measurement point is dynamically converted to NTC1, NTC4 and NTC9, and the respective weights of NTC1, NTC4 and NTC9 are combined to fit the core temperature of area B.

[0102] In the embodiment of the present application, the temperature of the first contact area of ​​the electronic device touched by the user and the non-contact area of ​​the first device area that is not touched by the user are combined to determine the temperature of the first contact area, and the determined temperature is more accurate; and no matter what material is used in the electronic device, the temperature of the first contact area of ​​the electronic device touched by the user can be obtained by the temperature determination method provided in the embodiment of the present application, which has strong applicability. Furthermore, by adjusting the temperature of the first contact area, precise temperature control is achieved, which minimizes the safety risks caused by excessive temperature and improves the user experience.

[0103] The following describes the application of the temperature determination method provided in the embodiment of the present application in a practical scenario.

[0104] In some embodiments, after determining the temperature of the contact area, the target housing temperature value or target housing temperature range to be adjusted can be further determined, and then the temperature of the contact area is adjusted to the target housing temperature value or target housing temperature range. Specifically, the user's hand holding area of ​​the mobile terminal (the first contact area of ​​the electronic device touched by the user) is dynamically identified, and the housing temperature of the hand holding area can be dynamically fitted.

[0105] The specific implementation scheme of the embodiment of this application is as follows:

[0106] 1. Grip detection

[0107] like Figure 6 As shown, multiple capacitive sensor arrays are built into the entire back shell area of ​​the mobile terminal, and the capacitance value of the capacitive sensor array is read by a multi-channel capacitive sensor detection chip. The specific position of the user's hand holding area is determined by the capacitance values ​​of the capacitive sensor arrays in multiple areas.

[0108] like Figure 6 and Figure 8 As shown, the capacitive sensor array is distributed in Figure 6 The position of the capacitive sensor array is mainly set according to the size of the tablet and the position where the hands are often held; for example, the capacitive sensor array is set according to the conventional horizontal screen mode and vertical screen mode, where the user often holds the hand.

[0109] If multiple capacitance values ​​in a certain area all increase and fluctuate, the area is determined as a hand-gripping area.

[0110] 2. Dynamic NTC array switching

[0111] As described above, after the capacitive sensor determines the user's current grip area, it identifies the user's grip area and mode, such as one hand or two hands, and then dynamically adjusts the NTC and weight corresponding to the fitting function to more accurately fit the temperature of the grip area. How to determine the horizontal and vertical screen modes: 1. The mobile terminal generally confirms whether it is a horizontal or vertical screen mode based on the built-in accelerometer of the mobile terminal; 2. Adding grip area capacitive recognition can be combined with the accelerometer to identify the user's grip area and mode.

[0112] For example, let's take the layout structure of a conventional tablet computer as an example. Figure 2 As shown in the figure, a certain number of NTC temperature detection sensors are placed in various areas throughout the system, which can read the temperature of the location in real time. Of course, the number of NTCs is not limited to these numbers, and the corresponding number can be increased according to the actual needs of the business scenario.

[0113] These NTCs are distributed in the heat source area and cold area of ​​the motherboard. Some are used to detect the temperature changes of different hot spots; some are used to read the temperature of the cold area and simulate the ambient temperature detection. Each time the fitting is performed, the combination of NTC resistors is dynamically selected; the fitting algorithm does not use all NTC resistors, but selects 3-4 NTCs to achieve temperature fitting.

[0114] The weight adjustment of NTC is based on the temperatures read by several selected NTC sensors, using a fitting function (fitting planning solution algorithm) to obtain a software value, comparing the software fitting value with the actual temperature, and using the comparison result to make fine adjustments.

[0115] Fitting temperature refers to calculating the temperature values ​​of multiple NTCs using different weights. That is, the maximum temperature of each area is the temperature fitted by several NTCs with weights.

[0116] Dynamic fitting 1: Fig.10As shown in the figure, when the user's hand holding area is area A, NTC1, NTC4 and NTC7 are used for the area touched by the user, and different weights are combined to fit the core temperature of area A. If the user's hand holding area changes to area B, the temperature fitting can be dynamically switched to NTC1, NTC4 and NTC9, and the temperature of area B is fitted with the corresponding weights.

[0117] Dynamic Fit 2: As Fig. 9 As shown in the figure, when the user's hand holding area is area A, NTC1, NTC4 and NTC7 are used for the area touched by the user, and a fitting function f1 (NTC1, NTC4, NTC7) is used in combination with a certain weight to fit the core temperature of area A. If the user's hand holding area changes to area B, the temperature fitting can continue to use NTC1, NTC4 and NTC7, but the weight is dynamically adjusted, and the fitting function f2 (NTC1, NTC4, NTC7) is used to fit the temperature of area B.

[0118] Based on the above hardware design, the embodiment of the present application designs an intelligent control method, which intelligently controls the heat according to the position of the user's hand to improve the user experience. The entire control process includes the following steps 1101 to 1115:

[0119] Step 1101: The user holds a tablet.

[0120] Step 1102: The multi-channel capacitance sensor detection chip built into the tablet detects capacitance changes in the electronic device.

[0121] Step 1103: Determine the horizontal or vertical screen mode and the gripping posture based on the capacitance change of each area of ​​the electronic device. If the gripping posture is the left hand gripping posture, execute step 1104; if the gripping posture is the right hand gripping posture, execute step

[0122] Step 1104: If it is a left-hand grip, determine the grip area A.

[0123] Step 1105: Select NTC combination 1.

[0124] Step 1106: Use the first fitting function to perform shell temperature fitting.

[0125] Step 1107: If the left hand grip posture changes, determine the grip area B.

[0126] Step 1108, select NTC combination 2.

[0127] Step 1109: Use the second fitting function to perform shell temperature fitting.

[0128] Step 1110: If the grip is right-handed, determine the grip area C.

[0129] Step 1111, select NTC combination 3.

[0130] Step 1112: Use the third fitting function to perform shell temperature fitting.

[0131] Step 1113: If the right hand grip posture changes, determine the hand grip area D.

[0132] Step 1114, select NTC combination 4.

[0133] Step 1115: Use the fourth fitting function to perform shell temperature fitting.

[0134] In the embodiment of the present application, in the system-level design, it is possible to detect the user's usage posture and sense the hand-grip area through a capacitive sensor or other sensor detection scheme, and dynamically adjust the NTC and weight of the shell temperature fitting in combination with the changing hand-grip area, and flexibly fit the shell temperature of the hand-grip area in combination with the dynamic algorithm to obtain the target shell temperature value or target shell temperature range that needs to be adjusted, and adjust the shell temperature through a temperature control method in combination with the user's usage scenario; wherein the temperature control method may include adjusting the operating state of the device corresponding to the hand-grip area (e.g., the operating frequency of the CPU). The embodiment of the present application is applicable to device areas of different materials in electronic devices, as well as grip posture detection in different user usage scenarios, and realizes differentiated shell temperature fitting for different materials and different usage scenarios. The application can better dynamically adjust the shell temperature of the device.

[0135] Based on the above embodiments, the present invention provides a temperature determination device, which can be applied to Figure 1 and Figure 5 In the temperature determination method provided in the corresponding embodiment, refer to Fig.12 As shown, the temperature determination device 1200 may include:

[0136] The determination module 1210 is configured to determine a first contact area of ​​the electronic device touched by the user when it is detected that the electronic device is touched by the user;

[0137] The determination module 1210 is further configured to determine a first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of a non-contact area not touched by the user;

[0138] The processing module 1220 is configured to determine the temperature of the first contact area based on the temperatures detected by at least two temperature measurement points in the first device area.

[0139] In other embodiments of the present application, the processing module 1220 is further configured to: determine a temperature threshold based on the temperatures detected by each temperature measuring point of the first device area; and adjust the temperature of the first contact area to the temperature threshold.

[0140] In other embodiments of the present application, the determination module 1210 is further configured to: determine whether the capacitance in the electronic device has changed based on the capacitance value collected by the capacitance sensing device in the electronic device at the current moment; if the capacitance in the electronic device has changed, determine that the electronic device has been touched by the user; and determine the first contact area based on the capacitance changes in various areas of the electronic device.

[0141] In other embodiments of the present application, the determination module 1210 is further configured to: determine the first gripping posture of the user based on the capacitance change of each area of ​​the electronic device; determine the first contact area based on the association between the gripping posture and the contact area and the first gripping posture.

[0142] In other embodiments of the present application, the association relationship between the gripping posture and the contact area is determined in the following manner: based on the historical gripping posture information of the user before the current moment, determining multiple second gripping postures of the user; based on the historical gripping posture information and the distribution of each device in the electronic device, determining the contact areas corresponding to each of the multiple second gripping postures; associating the multiple second gripping postures with the corresponding contact areas to obtain the association relationship between the gripping posture and the contact area.

[0143] In other embodiments of the present application, at least two temperature measurement points in the first equipment area are determined in the following manner: at least two second temperature sensing devices are selected from at least two first temperature sensing devices as temperature measurement points based at least on the positions of each first temperature sensing device in the content of the first equipment area.

[0144] In other embodiments of the present application, the processing unit 1220 is further configured to: determine the weights of the temperature measuring points in the first device area and the real-time temperatures of the temperature measuring points; and determine the temperature of the first contact area based on the weights and real-time temperatures of the temperature measuring points.

[0145] In other embodiments of the present application, determining the weight of the temperature measuring point includes at least one of the following: determining the weight of the temperature measuring point based on the difference between the actual temperature of the electronic device and the real-time temperature of the temperature measuring point; determining the weight of the temperature measuring point based on the position of the temperature measuring point; determining the weight of the temperature measuring point based on the number of times the temperature measuring point is selected; determining the weight of the temperature measuring point based on the surface material of the electronic device corresponding to the temperature measuring point; different surface materials correspond to different weights.

[0146] In other embodiments of the present application, the processing unit 1220 is further configured to: when it is detected that the contact area of ​​the electronic device contacted by the user is converted from the first contact area to the second contact area, determine the overlapping area between the first contact area and the second contact area; if the overlapping area meets a preset area threshold, determine the temperature of the second contact area based on the temperatures of multiple temperature measuring points within the first contact area; if the overlapping area does not meet the area threshold, determine the temperature of the second contact area based on the temperatures detected by at least two temperature measuring points within the first device area corresponding to the second contact area.

[0147] It should be noted that the specific description of the steps performed by each unit can be found in Figure 1 and Figure 5 The temperature determination method provided in the corresponding embodiment will not be described again here.

[0148] The temperature determination device provided in the embodiment of the present application determines the temperature of the first contact area of ​​the electronic device by combining the first contact area of ​​the electronic device touched by the user and the non-contact area of ​​the first device area that is not touched by the user, and the determined temperature is more accurate; and no matter what material is used in the electronic device, the temperature of the first contact area of ​​the electronic device touched by the user can be obtained by the temperature determination method provided in the embodiment of the present application, which has strong applicability. Furthermore, by adjusting the temperature of the first contact area, precise temperature control is achieved, which minimizes the safety risks caused by excessive temperature and improves the user experience.

[0149] Based on the above embodiments, the embodiments of the present application provide an electronic device, which can be applied to Figure 1 and Figure 5 In the temperature determination method provided in the corresponding embodiment, refer to Fig.13 As shown, the electronic device 1300 may include: a processor 1310, a memory 1320 and a communication bus 1330;

[0150] The communication bus 1330 is used to realize the communication connection between the processor 1310 and the memory 1320;

[0151] The processor 1310 is used to execute the temperature determination program in the memory 1320 to implement the following steps: when it is detected that the electronic device is touched by the user, determine the first contact area of ​​the electronic device touched by the user; determine the first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of the non-contact area that is not touched by the user; based on the temperatures detected by at least two temperature measuring points in the first device area, determine the temperature of the first contact area.

[0152] In other embodiments of the present application, the processor 1310 is used to execute the temperature determination program in the memory 1320, and can also implement the following steps: determine the temperature threshold based on the temperatures detected by each temperature measurement point in the first device area; adjust the temperature of the first contact area to the temperature threshold.

[0153] In other embodiments of the present application, the processor 1310 is used to execute the temperature determination program in the memory 1320, when it is detected that the electronic device is touched by the user, to determine the first contact area of ​​the electronic device touched by the user, so as to implement the following steps: based on the capacitance value collected by the capacitance sensing device in the electronic device at the current moment, determine whether the capacitance in the electronic device changes; if the capacitance in the electronic device changes, determine that the electronic device is touched by the user; based on the capacitance change of each area of ​​the electronic device, determine the first contact area.

[0154] In other embodiments of the present application, the processor 1310 is used to execute the temperature determination program in the memory 1320 to determine the first contact area based on the capacitance change of each area of ​​the electronic device, and can implement the following steps: determine the first gripping posture of the user based on the capacitance change of each area of ​​the electronic device; determine the first contact area based on the association between the gripping posture and the contact area and the first gripping posture.

[0155] In other embodiments of the present application, the association relationship between the gripping posture and the contact area is determined in the following manner: based on the historical gripping posture information of the user before the current moment, determining multiple second gripping postures of the user; based on the historical gripping posture information and the distribution of each device in the electronic device, determining the contact areas corresponding to each of the multiple second gripping postures; associating the multiple second gripping postures with the corresponding contact areas to obtain the association relationship between the gripping posture and the contact area.

[0156] In other embodiments of the present application, at least two temperature measurement points in the first equipment area are determined in the following manner: at least two second temperature sensing devices are selected from at least two first temperature sensing devices as temperature measurement points based at least on the positions of each first temperature sensing device in the content of the first equipment area.

[0157] In other embodiments of the present application, the processor 1310 is used to execute a temperature determination program in the memory 1320 to determine the temperature of the first contact area based on the temperatures of at least two temperature measuring points within the first device area, and can implement the following steps: determine the weights of the temperature measuring points within the first device area, and the real-time temperatures of the temperature measuring points; determine the temperature of the first contact area based on the weights and real-time temperatures of the temperature measuring points.

[0158] In other embodiments of the present application, determining the weight of the temperature measuring point includes at least one of the following: determining the weight of the temperature measuring point based on the difference between the actual temperature of the electronic device and the real-time temperature of the temperature measuring point; determining the weight of the temperature measuring point based on the position of the temperature measuring point; determining the weight of the temperature measuring point based on the number of times the temperature measuring point is selected; determining the weight of the temperature measuring point based on the surface material of the electronic device corresponding to the temperature measuring point; different surface materials correspond to different weights.

[0159] In other embodiments of the present application, the processor 1310 is used to execute the temperature determination program in the memory 1320, and can also implement the following steps: when it is detected that the contact area of ​​the electronic device contacted by the user is converted from the first contact area to the second contact area, determine the overlapping area between the first contact area and the second contact area; if the overlapping area meets a preset area threshold, based on the temperatures of multiple temperature measuring points within the first contact area, determine the temperature of the second contact area; if the overlapping area does not meet the area threshold, based on the temperatures detected by at least two temperature measuring points within the first device area corresponding to the second contact area, determine the temperature of the second contact area.

[0160] It should be noted that the specific description of the steps performed by the processor can be referred to Figure 1 and Figure 5 The temperature determination method provided in the corresponding embodiment will not be described again here.

[0161] The electronic device provided in the embodiment of the present application determines the temperature of the first contact area of ​​the electronic device by combining the first contact area of ​​the electronic device touched by the user and the non-contact area of ​​the first device area that is not touched by the user, and the determined temperature is more accurate; and no matter what material is used in the electronic device, the temperature of the first contact area of ​​the electronic device touched by the user can be obtained by the temperature determination method provided in the embodiment of the present application, which has strong applicability. Furthermore, by adjusting the temperature of the first contact area, precise temperature control is achieved, which minimizes the safety risks caused by excessive temperature and improves the user experience.

[0162] Based on the foregoing embodiments, the embodiments of the present application provide a computer-readable storage medium, which stores one or more programs, and the one or more programs can be executed by one or more processors to implement Figure 1 and Figure 5 The corresponding embodiments provide steps of the temperature determination method.

[0163] It should be noted that the above-mentioned computer-readable storage medium can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory (Flash Memory), a magnetic surface memory, an optical disc, or a compact disc read-only memory (CD-ROM) and other memories; it can also be various electronic devices including one or any combination of the above-mentioned memories, such as mobile phones, computers, tablet devices, personal digital assistants, etc.

[0164] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0165] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0166] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course, by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0167] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0168] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0169] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0170] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature determination method, the temperature determination method comprising: When it is detected that the electronic device is touched by the user, determining a first contact area of ​​the electronic device touched by the user; Determine a first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of a non-contact area not touched by the user; The temperature of the first contact area is determined based on the temperatures detected by at least two temperature measurement points in the first device area.

2. The temperature determination method according to claim 1, further comprising: Determining a temperature threshold based on temperatures detected at each temperature measuring point in the first device area; The temperature of the first contact area is adjusted to the temperature threshold.

3. The temperature determination method according to claim 1 or 2, wherein when it is detected that the electronic device is touched by the user, determining a first contact area of ​​the electronic device touched by the user comprises: Determining whether the capacitance in the electronic device changes based on the capacitance value collected by the capacitance sensing device in the electronic device at the current moment; If the capacitance in the electronic device changes, determining that the electronic device is touched by the user; The first contact area is determined based on the capacitance change of each area of ​​the electronic device.

4. The temperature determination method according to claim 3, wherein determining the first contact area based on the capacitance change of each area of ​​the electronic device comprises: Determining a first grip posture of the user based on changes in capacitance of each area of ​​the electronic device; The first contact area is determined based on the association relationship between the grip posture and the contact area and the first grip posture.

5. The temperature determination method according to claim 4, wherein the association relationship between the grip posture and the contact area is determined by: Determining a plurality of second grip postures of the user based on historical grip posture information of the user before a current moment; Determining contact areas corresponding to each of the plurality of second gripping postures based on the historical gripping posture information and the distribution of the devices in the electronic device; The plurality of second gripping postures are associated with corresponding contact areas to obtain an association relationship between the gripping postures and the contact areas.

6. The temperature determination method according to any one of claims 1 to 2, or 4 to 5, wherein the at least two temperature measurement points in the first equipment area are determined by: At least two second temperature sensing devices are selected from at least two of the first temperature sensing devices as temperature measurement points based at least on the positions of the first temperature sensing devices in the first equipment area content.

7. The temperature determination method according to any one of claims 1 to 2, or 4 to 5, wherein determining the temperature of the first contact area based on the temperatures detected by at least two temperature measurement points in the first device area comprises: Determine the weight of the temperature measuring point in the first device area and the real-time temperature of the temperature measuring point; The temperature of the first contact area is determined based on the weights of the temperature measurement points and the real-time temperature.

8. The temperature determination method according to claim 7, wherein: The determining of the weights of the temperature measurement points in the first device area includes at least one of the following: Determining a weight of the temperature measuring point based on a difference between an actual temperature of the electronic device and a real-time temperature of the temperature measuring point; Determining the weight of the temperature measuring point based on the position of the temperature measuring point; Determining the weight of the temperature measuring point based on the number of times the temperature measuring point is selected; Determining a weight of the temperature measurement point based on a surface material of the electronic device corresponding to the temperature measurement point; Different surface materials correspond to different weights.

9. The temperature determination method according to any one of claims 1 to 2, or 4 to 5, or 8, further comprising: When detecting that the contact area of ​​the electronic device touched by the user is converted from the first contact area to the second contact area, determining an overlapping area between the first contact area and the second contact area; If the overlapping area meets a preset area threshold, determining the temperature of the second contact area based on the temperatures of a plurality of temperature measurement points in the first contact area; If the overlapping area does not meet the area threshold, the temperature of the second contact area is determined based on temperatures detected by at least two temperature measurement points in the first device area corresponding to the second contact area.

10. An electronic device, comprising: processor, memory, and communication bus; The communication bus is used to realize the communication connection between the processor and the memory; The processor is used to execute the temperature determination program in the memory to implement the following steps: When it is detected that the electronic device is touched by the user, determining a first contact area of ​​the electronic device touched by the user; Determine a first device area corresponding to the first contact area; the first device area includes part of the first contact area and part of a non-contact area not touched by the user; The temperature of the first contact area is determined based on the temperatures detected by at least two temperature measurement points in the first device area.

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