Wafer test result inspection method and system, electronic equipment and storage medium
By comparing the format data in the inkless map file with the standard format data of the target batch, the problem of errors in the generated file is solved, and the occurrence of systemic risks is prevented and the correctness of the file is ensured.
Patent Information
- Application Number
- CN202411270528.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-02-14
AI Technical Summary
In the prior art, the generated inkless map files are susceptible to problems such as accidental template changes, generation program bugs or program changes, resulting in file errors and thus causing systemic risks.
By obtaining the inkless map file of the test results of the current wafer to be tested in the target batch, extracting its format data, and comparing it with the standard format data of the target batch. When the format data matches, it is determined that the wafer passes the inspection; otherwise, it is determined that the inspection is not passed and the alarm information is output.
It effectively prevents the wrong inkless map files from being transferred to the encapsulation process, avoids the occurrence of systemic risks, and ensures the absolute correctness of the generated files.
Smart Images
Figure CN119441841A_ABST
Abstract
Description
Background Art
[0002] Wafer testing and chip packaging are important post-processes in chip manufacturing. After wafer testing is completed, the mainstream practice is to generate an inkless map file according to the requirements of the packaging factory. The packaging factory uses this file to determine the test results of each chip (DIE) in the wafer and packages the DIEs that pass the test. Therefore, the generated inkless map must be absolutely correct and strictly prevent various possible generation problems, such as accidental changes in the inkless map template, bugs in the generation program, or program changes.
[0003] Therefore, it is urgent to provide a technical solution to solve the above problems. Summary of the invention
[0004] In order to solve the above technical problems, the present invention provides a wafer test result inspection method, system, electronic device and storage medium.
[0005] In a first aspect, the present invention provides a method for inspecting wafer test results, and the technical solution of the method is as follows:
[0006] Obtaining an inkless map file for characterizing the test results of the current wafer to be tested of the target batch, and extracting format data in the inkless map file;
[0007] When the format data is identical to the standard format data of the target batch, it is determined that the current wafer to be tested passes the inspection.
[0008] The beneficial effects of a wafer test result inspection method of the present invention are as follows:
[0009] The method of the present invention can prevent erroneous inkless map files from flowing to the packaging link, and effectively prevent the systemic risks generated by erroneous inkless map files.
[0010] On the basis of the above scheme, a wafer test result inspection method of the present invention can also be improved as follows.
[0011] In an optional manner, the method further includes:
[0012] When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
[0013] In an optional manner, the method further includes:
[0014] The format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0015] In an optional manner, the step of determining the format data corresponding to the first wafer to be tested of the target batch as the standard format data of the target batch includes:
[0016] When the current wafer to be tested is the first wafer to be tested of the target batch, the format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0017] In an optional manner, the method further includes:
[0018] When the current wafer to be tested is not the first wafer to be tested of the target batch, it is determined whether the format data corresponding to the current wafer to be tested is the same as the standard format data of the target batch.
[0019] In a second aspect, the present invention provides a wafer test result inspection system, the technical solution of the system is as follows:
[0020] Including: acquisition module and inspection module;
[0021] The acquisition module is used to: acquire an inkless map file for characterizing the test results of the current wafer to be tested of the target batch, and extract format data in the inkless map file;
[0022] The inspection module is used to determine that the current wafer to be tested has passed the inspection when the format data is the same as the standard format data of the target batch.
[0023] The beneficial effects of a wafer test result inspection system of the present invention are as follows:
[0024] The system of the present invention can prevent erroneous inkless map files from flowing to the packaging link, and effectively prevent the systemic risks generated by erroneous inkless map files.
[0025] Based on the above solution, a wafer test result inspection system of the present invention can also be improved as follows.
[0026] In an optional manner, the device further includes an alarm module; the alarm module is used to:
[0027] When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
[0028] In an optional manner, the method further includes: a preprocessing module; the preprocessing module is used to:
[0029] The format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0030] In a third aspect, a technical solution of an electronic device of the present invention is as follows:
[0031] The invention comprises a memory, a processor and a program stored in the memory and running on the processor. When the processor executes the program, the steps of the wafer test result inspection method of the present invention are realized.
[0032] In a fourth aspect, the present invention provides a computer-readable storage medium having the following technical solution:
[0033] Instructions are stored in the computer-readable storage medium. When the computer-readable storage medium reads the instructions, the computer-readable storage medium executes the steps of the wafer test result inspection method of the present invention.
[0034] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:
[0036] Figure 1 A schematic diagram of a process flow of an embodiment of a wafer test result inspection method of the present invention;
[0037] Figure 2 A schematic structural diagram of an embodiment of a wafer test result inspection system of the present invention;
[0038] Figure 3 The figure is a schematic structural diagram of an embodiment of an electronic device of the present invention. DETAILED DESCRIPTION
[0039] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.
[0040] Figure 1A flow chart of an embodiment of a wafer test result verification method provided by the present invention is shown, and the wafer test result verification method can be executed by an electronic device such as a terminal device or a server. Among them, the terminal device can be any fixed or mobile terminal such as a user equipment (User Equipment, UE), a mobile device, a user terminal, a terminal, a cellular phone, a cordless phone, a personal digital assistant (Personal Digital Assistant, PDA), a handheld device, a computing device, a vehicle-mounted device, a wearable device, etc. The server can be a single server or a server cluster composed of multiple servers. Any electronic device can implement the wafer test result verification method by calling the computer-readable instructions stored in the memory through the processor. As Figure 1 As shown, the following steps are included:
[0041] S1. Obtain an inkless map file for characterizing test results of a current wafer to be tested of a target batch, and extract format data in the inkless map file.
[0042] The target batch is any batch in the wafer test, and the specifications of the wafers to be tested in the same batch are the same. The inkless map file is a text format file generated by the map file of the wafer test, which contains the information required by the wafer packaging factory. The wafer packaging factory determines the test results of each chip (DIE) in the wafer based on the inkless map file and packages the chips with valid test results.
[0043] It should be noted that the content example in the inkless map file is:
[0044] PRODUCT ID:MY00041
[0045] Lot ID: MYLOT.00
[0046] Wafer ID: 01
[0047] WAFER SIZE: 8INCH
[0048] TEST SITE: CATI
[0049] Notch Side: Down
[0050] GROSSDIE: 119
[0051] BIN=A PASS
[0052] BIN=X FAIL
[0053] Begin map
[0054] zzzzzzzzzzzzz
[0055] zzXAAAAAAAAAAAAAAzz
[0056] zzAAAAAAAAAAAAAAAAAAzz
[0057] zzAAAAAAAAAAAAAAAAAXAAzz
[0058] zAAAAAAAAAAAAAAAAAAAAAzz
[0059] zAAAAAAAAAAAAAAAAXAAAzzz
[0060] zAAAAAAAAAAAAAAzzzzz
[0061] zAAAAAAAAAAAAAAAzzz
[0062] zzzzzzzzzzzz
[0063] End map
[0064] Among them, PRODUCT ID represents product ID, Lot ID represents batch number, Wafer ID represents wafer number, WAFERSIZE represents wafer size, Notch Side row represents wafer notch direction (notch is process opening), GROSSDIE represents number of effective dies on wafer, BIN=A PASS indicates that pass die is represented by A in inkless map dot matrix, BIN=X FAIL indicates that fail die is represented by X in inkless map dot matrix, the dot matrix of die in wafer is between Begin map and End map, character z represents mark die, A represents pass die, and X represents Fail Die.
[0065] An example of format data in an inkless map file is:
[0066] PRODUCT ID:
[0067] Lot ID:
[0068] Wafer ID:
[0069] WAFER SIZE: 8INCH
[0070]
[0071] The format data in the inkless map file is: the data obtained by removing the change information in the inkless map file, specifically: removing the specific values of PRODUCT ID, Lot ID, Wafer ID, and removing the A and X characters (these two characters represent pass die and fail die, respectively).
[0072] S2. When the format data is the same as the standard format data of the target batch, it is determined that the current wafer to be tested passes the inspection.
[0073] Wherein, the format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0074] In an optional manner, the method further includes:
[0075] When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
[0076] The alarm information is output to a target terminal, which includes but is not limited to a mobile phone, a tablet, a computer, etc. The alarm information may be at least one of a voice alarm information, a text alarm information, and an audible and visual alarm information.
[0077] In an optional manner, the step of determining the format data corresponding to the first wafer to be tested of the target batch as the standard format data of the target batch includes:
[0078] When the current wafer to be tested is the first wafer to be tested of the target batch, the format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0079] If the current wafer to be tested is the first wafer to be tested of the target batch, the judgment process is not performed, and the format data corresponding to the current wafer to be tested is directly determined as the standard format data of the target batch.
[0080] In an optional manner, the method further includes:
[0081] When the current wafer to be tested is not the first wafer to be tested of the target batch, it is determined whether the format data corresponding to the current wafer to be tested is the same as the standard format data of the target batch.
[0082] It should be noted that when various conditions change abnormally, an error alarm may be triggered, which effectively avoids the abnormal output of inkless maps caused by bugs in the inkless map generation program, version upgrades, or engineers failing to change the inkless map format according to the normal process, as well as changes in the map format.
[0083] The technical solution of this embodiment can prevent erroneous inkless map files from flowing to the packaging link, and effectively prevent the systemic risks caused by erroneous inkless map files.
[0084] Figure 2 FIG. 2 is a schematic diagram showing a structure of an embodiment of a wafer test result inspection system 200 provided by the present invention. Figure 2 As shown, the system 200 includes: an acquisition module 210 and a verification module 220;
[0085] The acquisition module 210 is used to: acquire an inkless map file for characterizing the test results of the current wafer to be tested of the target batch, and extract format data in the inkless map file;
[0086] The inspection module 220 is used to determine that the current wafer to be tested passes the inspection when the format data is the same as the standard format data of the target batch.
[0087] In an optional manner, the device further includes an alarm module; the alarm module is used to:
[0088] When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
[0089] In an optional manner, the method further includes: a preprocessing module; the preprocessing module is used to:
[0090] The format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0091] In an optional manner, the preprocessing module is specifically used for:
[0092] When the current wafer to be tested is the first wafer to be tested of the target batch, the format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
[0093] In an optional manner, the method further includes: a judgment module; the judgment module is used to:
[0094] When the current wafer to be tested is not the first wafer to be tested of the target batch, it is determined whether the format data corresponding to the current wafer to be tested is the same as the standard format data of the target batch.
[0095] The technical solution of this embodiment can prevent erroneous inkless map files from flowing to the packaging link, and effectively prevent the systemic risks caused by erroneous inkless map files.
[0096] The above-mentioned parameters and steps for each module to implement corresponding functions in the wafer test result inspection system 200 of this embodiment can refer to the parameters and steps in the embodiment of the wafer test result inspection method above, and will not be repeated here.
[0097] like Figure 3 As shown, an electronic device 300 according to an embodiment of the present invention includes a processor 320, the processor 320 is coupled to a memory 310, and the memory 310 stores at least one computer program 330, and the at least one computer program 330 is loaded and executed by the processor 320, so that the electronic device 300 implements any of the above-mentioned wafer test result inspection methods, specifically:
[0098] The electronic device 300 may have relatively large differences due to different configurations or performances, and may include one or more processors 320 (Central Processing Units, CPU) and one or more memories 310, wherein at least one computer program 330 is stored in the one or more memories 310, and the at least one computer program 330 is loaded and executed by the one or more processors 320, so that the electronic device 300 implements any of the wafer test result inspection methods provided in the above embodiments. Of course, the electronic device 300 may also have components such as a wired or wireless network interface, a keyboard, and an input and output interface for input and output, and the electronic device 300 may also include other components for implementing device functions, which will not be repeated here.
[0099] A computer-readable storage medium according to an embodiment of the present invention stores at least one computer program, and the at least one computer program is loaded and executed by a processor so that a computer implements any of the above-mentioned wafer test result inspection methods.
[0100] Optionally, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, and the like.
[0101] In an exemplary embodiment, a computer program product or a computer program is also provided, the computer program product or the computer program comprising computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the electronic device performs any of the above-mentioned wafer test result inspection methods.
[0102] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects and represent the definition of a specific order or sequence. The order of use of similar objects can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than the order shown or described.
[0103] Those skilled in the art know that the present invention can be implemented as a system, method or computer program product. Therefore, the present disclosure can be specifically implemented in the following forms, namely: it can be complete hardware, it can be complete software (including firmware, resident software, microcode, etc.), or it can be a combination of hardware and software, which is generally referred to as "circuit", "module" or "system" herein. In addition, in some embodiments, the present invention can also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium contains computer-readable program code.
[0104] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.
[0105] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.
Claims
1. A wafer test result inspection method, characterized in that: include: Obtaining an inkless map file for characterizing the test results of the current wafer to be tested of the target batch, and extracting format data in the inkless map file; When the format data is identical to the standard format data of the target batch, it is determined that the current wafer to be tested passes the inspection.
2. The wafer test result inspection method according to claim 1, characterized in that: Also includes: When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
3. The wafer test result inspection method according to claim 1, characterized in that: Also includes: The format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
4. The wafer test result inspection method according to claim 3, characterized in that: The step of determining the format data corresponding to the first wafer to be tested of the target batch as the standard format data of the target batch comprises: When the current wafer to be tested is the first wafer to be tested of the target batch, the format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
5. The wafer test result inspection method according to claim 3 or 4, characterized in that: Also includes: When the current wafer to be tested is not the first wafer to be tested of the target batch, it is determined whether the format data corresponding to the current wafer to be tested is the same as the standard format data of the target batch.
6. A wafer test result inspection system, characterized in that: include: Acquisition module and inspection module; The acquisition module is used to: acquire an inklessmap file for characterizing the test results of the current wafer to be tested of the target batch, and extract format data in the inkless map file; The inspection module is used to determine that the current wafer to be tested has passed the inspection when the format data is the same as the standard format data of the target batch.
7. The wafer test result inspection system according to claim 6, characterized in that: Also includes: Alarm module; the alarm module is used for: When the format data is different from the standard format data of the target batch, it is determined that the current wafer to be tested has failed the inspection, and an alarm message is output.
8. The wafer test result inspection system according to claim 6, characterized in that: Also includes: Preprocessing module; The pre-processing module is used for: The format data corresponding to the first wafer to be tested of the target batch is determined as the standard format data of the target batch.
9. An electronic device, characterized in that: The electronic device includes a processor, the processor is coupled to a memory, the memory stores at least one computer program, and the at least one computer program is loaded and executed by the processor so that the electronic device implements the wafer test result inspection method as described in any one of claims 1 to 5.
10. A computer-readable storage medium, characterized in that: At least one computer program is stored in the computer-readable storage medium, and the at least one computer program is loaded and executed by the processor, so that the computer-readable storage medium implements the wafer test result inspection method according to any one of claims 1 to 5.