Layout device and method for semiconductor secondary piping installation project

Abstract

The invention discloses a layout device and method for a semiconductor secondary piping installation project, and the device comprises a file uploading module which receives a layout file of a semiconductor production line; the data analysis module is used for analyzing the layout file, acquiring attribute information and position information of the equipment and transmitting the attribute information and the position information to a secondary piping database; the data analysis layout module is used for giving a secondary piping installation pipeline diagram, and obtaining a corresponding pipeline instrument assembly in a secondary piping database by combining an assembly matching algorithm to form a pipeline instrument flow chart; and the three-dimensional space management module is combined with a three-dimensional model generation algorithm to generate a layout model of the semiconductor secondary piping installation project. Through linkage of semiconductor layout information and a secondary piping database, in combination with a component matching algorithm, information of a secondary piping component is obtained, and according to a three-dimensional model generation algorithm, automatic output of semiconductor secondary piping layout is realized and visual display is performed in a three-dimensional scene.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production layout, and in particular relates to a layout device and method for a semiconductor secondary piping installation project. Background Art

[0002] During the construction of semiconductor plants and the semiconductor production process, the production equipment will be moved in or relocated due to the gradual improvement of production lines, increased production capacity or product variations. Frequent changes in the movement of production equipment will have a linkage effect on the connections between the power source and the pipelines, instruments, etc. between the production equipment. The process of connecting the main pipeline interface to the semiconductor production equipment is a key link in the semiconductor manufacturing process, carrying the heavy responsibility of accurately and efficiently connecting the power sources of various infrastructure systems to complex process machines.

[0003] At present, the research on secondary piping is limited to the secondary piping component structure. For example, patent CN109585347A provides an integrated device for secondary piping of semiconductor production equipment, including: a pump frame body, an integrated pipeline, an integrated circuit and a vacuum pump. The pump frame body is a rectangular frame welded by carbon steel and stainless steel profiles, divided into upper and lower layers. The integrated pipeline includes a vacuum pipeline, a process cooling water pipeline and a nitrogen pipeline. The integrated circuit includes a strong current system and a weak current system. The vacuum pump includes a pump body A and a pump body B. Pump body A is arranged on the upper layer of the pump frame body, and pump body B is arranged on the lower layer of the pump frame body. The four bottom parts of pump body A and pump body B are all provided with supporting fixed feet. This scheme integrates the device, shortens the installation cycle of the entire semiconductor production equipment, reduces the occupied area of ​​the plant, has good mobility, meets the needs of temporary adjustment of the machine position, adopts modular standardized manufacturing, solves the problems of long on-site construction period and uncontrollable progress, and the construction quality is effectively guaranteed to meet the requirements of uninterrupted operation of semiconductor factories.

[0004] The layout design of semiconductor secondary piping is often done manually by secondary piping designers, which consumes a lot of time and energy. Moreover, the drawn semiconductor secondary piping layout design drawing can only present a two-dimensional pipeline instrument flow chart, and cannot be simulated, presented, or simulated in a three-dimensional scene.

[0005] Therefore, how to obtain the information of secondary piping components by parsing the semiconductor production line layout file to realize the automatic output of the semiconductor secondary piping installation project layout, and to be able to visualize it in a three-dimensional scene and apply it to the transmission simulation of the power source is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0006] In view of the defects existing in the above-mentioned prior art, the present invention provides a layout device and method for semiconductor secondary piping installation engineering, including: a file upload module, receiving the layout file of the semiconductor production line; a data analysis module, parsing the layout file, obtaining the attribute information and location information of the equipment, and transmitting it to the secondary piping database; a data analysis layout module, giving the secondary piping installation pipeline diagram, and then combining with the component matching algorithm, obtaining the corresponding pipeline instrument components in the secondary piping database, and forming a pipeline instrument flow chart; a three-dimensional space management module, combining with the three-dimensional model generation algorithm, generating a layout model of the semiconductor secondary piping installation engineering. Through the linkage of semiconductor layout information and the secondary piping database, combined with the component matching algorithm, the information of the secondary piping components is obtained, and according to the three-dimensional model generation algorithm, the automatic output of the semiconductor secondary piping layout is realized and visualized in a three-dimensional scene.

[0007] In a first aspect, the present invention provides a layout device for a semiconductor secondary piping installation project, specifically comprising: a signal-connected file upload module, a data parsing module, a data analysis layout module, a three-dimensional space management module, and a secondary piping database;

[0008] Signal-connected file upload module, data parsing module, data analysis layout module, three-dimensional space management module and secondary piping database;

[0009] A file upload module for receiving a layout file of a semiconductor production line;

[0010] A data analysis module is used to analyze the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment;

[0011] The data analysis and layout module is used to obtain the corresponding pipeline instrument components in the secondary piping database based on the attribute information and location information of the equipment and the component matching algorithm, and connect the equipment and the corresponding pipeline instrument components to form a pipeline instrument flow chart and provide a secondary piping installation pipeline diagram;

[0012] The three-dimensional space management module is used to generate a layout model of a semiconductor secondary piping installation project based on a secondary piping installation pipeline diagram and a three-dimensional model generation algorithm.

[0013] Further, the layout file includes a device configuration file, a layout design file, and a feature information file;

[0014] The attribute information of the equipment includes the equipment type, equipment manufacturer information and interface information. The attribute information of the plant system equipment also includes flow information, pressure information and remarks information.

[0015] The location information of the device is the coordinate information of the device on the semiconductor production layout plane.

[0016] Furthermore, the secondary piping database is used to receive and store the attribute information and location information of the equipment, the attribute information of the pipeline instrument components and the attribute information of the three-dimensional components.

[0017] Furthermore, the layout file of the semiconductor production line is parsed to obtain the attribute information and location information of the equipment, including:

[0018] Based on the analysis of device configuration files, the attribute information of each device is obtained;

[0019] The layout design file is matched with the devices in the characteristic information file, the layout of each device is analyzed, and the location information of each device is given.

[0020] Furthermore, it also includes: a simulation module, a fluid system capacity management module and a construction management module;

[0021] The simulation module is connected to the three-dimensional space management module by signal, and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and combined with the power supply parameters;

[0022] The plant system capacity management module is connected to the data analysis layout module by signal, and is used to set and monitor the power supply points based on the pipeline instrument flow chart, and to guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points;

[0023] The construction management module is connected to the plant system capacity management module by signal, and is used to update the status of the power supply point based on the progress of the construction and transmit it to the plant system capacity management module.

[0024] Furthermore, based on the attribute information and location information of the equipment, combined with the component matching algorithm, the pipeline instrument components corresponding to the secondary piping database are obtained, specifically including:

[0025] According to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the corresponding pipeline instrument components supplied to each equipment, and the attribute information of the pipeline instrument components is extracted, wherein the attribute information of the pipeline instrument components includes the type, size rating and power supply of the pipeline instrument components;

[0026] Each pipeline instrument component is classified and delineated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment.

[0027] Furthermore, according to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the corresponding pipeline instrument components supplied to each device, specifically including:

[0028] Query and confirm the matching equipment in the secondary piping database;

[0029] The semiconductor production equipment is grouped according to the equipment type and the semiconductor production area where it is located, and the group numbers are marked;

[0030] Analyze the power source demand of each group of semiconductor production equipment, determine the power source supply of the factory system equipment based on the power source demand, and provide the power source supply path between the factory system equipment and the semiconductor production equipment;

[0031] In the secondary piping database, each group of semiconductor production equipment is matched with the attribute information of the pipeline instrument components to determine the corresponding pipeline instrument components.

[0032] Furthermore, each pipeline instrument component is classified and delineated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment, specifically including:

[0033] Classify each identified pipeline instrumentation component along the power source supply path between the plant system equipment and the semiconductor production equipment;

[0034] Determine the ordinate information of various types of pipeline instrument components in the layout plane according to the group number of the corresponding supplied semiconductor production equipment, wherein the ordinate information represents the semiconductor production area where the pipeline instrument components are located;

[0035] According to the location information of the corresponding supplied semiconductor production equipment, determine the horizontal coordinate position of all pipeline instrument components corresponding to the semiconductor production equipment in the layout plane;

[0036] According to the preset attribute information of each pipeline instrument component, the horizontal axis position is divided to determine the horizontal axis information of each pipeline instrument component in the layout plane, wherein the horizontal axis information represents the relative interval between the pipeline instrument component and the corresponding semiconductor production equipment.

[0037] Furthermore, based on the secondary piping installation pipeline diagram and combined with the three-dimensional model generation algorithm, a layout model of semiconductor secondary piping is generated, specifically including:

[0038] Perform component analysis on the secondary piping installation pipeline diagram to obtain each pipeline instrument component;

[0039] Match each pipeline instrument component with the three-dimensional component of the secondary piping database to determine the three-dimensional component of the corresponding pipeline instrument;

[0040] Combined with the location information of each pipeline instrument component and based on the analysis of the attribute information of the three-dimensional component, the shape of the three-dimensional component is updated to generate a layout model of the semiconductor secondary piping installation project, wherein the attribute information of the three-dimensional component includes the shape information and size information of the three-dimensional component.

[0041] Furthermore, the shape of the three-dimensional component is updated based on the position information of each pipeline instrument component and the attribute information of the three-dimensional component, which is specifically expressed as follows:

[0042] Compare the horizontal and vertical coordinate information of each pipeline instrument component on the layout plane in pairs, determine the pipeline instrument components with layout intersections, and form a first pipeline instrument component set;

[0043] Mapping and matching the three-dimensional components of pipeline instruments with each pipeline instrument component in the first pipeline instrument component set to form a first three-dimensional component set;

[0044] In the first three-dimensional component set, the vertical dimension information of each three-dimensional component is compared in pairs, and combined with the preset layout model space of the semiconductor secondary piping installation project, the three-dimensional components with intersections are given, and the pipeline instrument components corresponding to the intersections of the three-dimensional components are collected to form a second pipeline instrument component set;

[0045] Adjusting the horizontal coordinates and / or the vertical coordinate information of each pipeline instrument component in the second pipeline instrument component set on the layout plane, and / or adjusting the vertical dimension information of each pipeline instrument component in the second pipeline instrument component set;

[0046] Repeat the above comparison of the horizontal and vertical coordinate information of the pipeline instrument components on the layout plane and the vertical size information of each three-dimensional component until the first pipeline instrument component set and the second pipeline instrument component set are both empty sets, completing the shape update of the three-dimensional component.

[0047] Furthermore, the first pipeline instrument component set is specifically represented as follows:

[0048]

[0049] Where C is the set of all pipeline instrument components, c 1 、c 2 、c i 、c j 、c n are the 1st, 2nd, i, j, and nth pipeline instrument components respectively, C 1 is the first pipeline instrument component set, x i ,y i is the horizontal and vertical coordinates of the i-th pipeline instrument component in the layout plane, x j ,y jis the horizontal and vertical coordinates of the jth pipeline instrument component in the layout plane, Is an empty set.

[0050] Furthermore, the second pipeline instrument component set is specifically represented as follows:

[0051]

[0052] Among them, C 1 ' is the first three-dimensional component set, c k 、c s are the kth and sth pipeline instrument components, respectively, c i '、c j '、c k '、c s 'Respectively match the pipeline instrument components c i 、c j 、c k 、c s The three-dimensional component, M() is the mapping matching function, C 2 is the second pipeline instrumentation component set, z k ' is the three-dimensional component c k 'Vertical dimension data, z s ' is the three-dimensional component c s The vertical dimension data, Is an empty set.

[0053] Furthermore, the data analysis layout module is also used to: after forming the pipeline instrument flow diagram,

[0054] By receiving the touch interaction information, the attribute information and / or the position information of each pipeline instrument component are optimized to form an initial diagram of the secondary piping installation pipeline;

[0055] The initial diagram of the pipeline instrument process is adaptively detected, and based on the analysis of the adaptive detection results, a secondary piping installation pipeline diagram is formed.

[0056] In a second aspect, the present invention further provides a layout method for a semiconductor secondary piping installation project, using the layout device for the semiconductor secondary piping installation project as described above, specifically comprising the following steps:

[0057] Receive layout files for semiconductor production lines;

[0058] Parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment;

[0059] Based on the attribute information and location information of the equipment, combined with the component matching algorithm, the corresponding pipeline instrument components in the secondary piping database are obtained, and the equipment and the corresponding pipeline instrument components are connected to form a pipeline instrument flow chart, and a secondary piping installation pipeline diagram is given;

[0060] Based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model of the semiconductor secondary piping installation project is generated.

[0061] The present invention provides a layout device and method for semiconductor secondary piping installation engineering, which at least includes the following beneficial effects:

[0062] (1) The present invention obtains information about secondary piping components by linking semiconductor layout information with a secondary piping database and combining a component matching algorithm. Based on a three-dimensional model generation algorithm, the present invention realizes automatic generation of semiconductor secondary piping layout and visualizes it in a three-dimensional scene.

[0063] (2) Based on the attribute information and location information of semiconductor production equipment and factory system equipment, the power source supply path is first given, and then the pipeline instrument components are matched, and the location information representing the semiconductor production area and the interval with the semiconductor production equipment is determined in the layout plane. This makes the secondary piping process of the pipeline instrument components meet the requirements of semiconductor production rules and is convenient for subsequent adjustments to meet user-defined needs, taking into account both efficiency and flexibility, and ensuring the accuracy of the generation of the pipeline instrument flow chart.

[0064] (3) Based on the secondary piping installation pipeline diagram and the three-dimensional model generation algorithm, a three-dimensional layout model of the semiconductor secondary piping installation project is obtained, which solves the duplication and intersection problems that may exist in the conversion of the two-dimensional pipeline instrument flow chart to the three-dimensional layout model of the semiconductor secondary piping installation project, and provides a more intuitive and accurate three-dimensional visualization solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 A schematic diagram of the structure of a layout device for a semiconductor secondary piping installation project according to a first embodiment of the present invention;

[0066] Figure 2 A schematic diagram of the structure of a layout device for a semiconductor secondary piping installation project according to a second embodiment of the present invention;

[0067] Figure 3 A schematic diagram of a process for matching components in a secondary piping database to determine corresponding pipeline instrument components for supplying each device according to attribute information of the device provided by a certain embodiment of the present invention;

[0068] Figure 4A schematic diagram of a process for classifying and demarcating each pipeline instrument component according to a certain embodiment of the present invention, and providing the location information of each pipeline instrument component in combination with the location information of the corresponding supplied equipment;

[0069] Figure 5 An example diagram of the secondary piping installation pipeline diagram provided by the present invention;

[0070] Figure 6 A schematic diagram of the process of generating a layout model of a semiconductor secondary piping installation project based on a secondary piping installation pipeline diagram and a three-dimensional model generation algorithm provided by the present invention;

[0071] Figure 7 A schematic diagram of a process for updating the shape of a three-dimensional component by combining the position information of each pipeline instrument component and analyzing the attribute information of the three-dimensional component provided by the present invention;

[0072] Figure 8 An example diagram of the layout model of the semiconductor secondary piping installation project provided by the present invention;

[0073] Fig. 9 A schematic flow chart of a layout method for a semiconductor secondary piping installation project provided by the present invention. DETAILED DESCRIPTION

[0074] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0075] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0076] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0077] Semiconductor secondary piping refers to the second piping performed according to the various semiconductor production equipment of the semiconductor production line after the main pipeline of the semiconductor production line is completed. The layout process of semiconductor secondary piping requires not only a high degree of technical integration and coordination, but also strict compliance with industry standards and specifications to ensure that each step of the operation meets the best safety and performance standards.

[0078] At this stage, factory systems such as electricity as power sources, cooling water, pure water, and bulk and special gases need to be precisely introduced into each process link to provide a stable and reliable environment for the production of semiconductor chips.

[0079] This means that the layout of secondary piping needs to be precisely measured and use advanced connection technology and materials to ensure smooth and safe transmission of gas, liquid and electricity. At the same time, the diversity and complexity of semiconductor production also brings considerable challenges to semiconductor secondary piping. Different semiconductor production process machines have different requirements for power sources, and new process equipment is constantly emerging. The layout of secondary piping needs to be easy to adjust on the basis of readability.

[0080] Therefore, it is necessary to speed up the efficiency of semiconductor secondary piping layout and improve response speed through digital means.

[0081] The current configuration process of secondary piping components such as pipelines faces significant challenges in efficiency and flexibility. Especially when reconfiguring, it is heavily dependent on manual drawing by secondary piping technicians, which is time-consuming and laborious; new technicians need to undergo long-term training before taking up their posts. In addition, manual secondary piping layout can only provide a two-dimensional pipeline instrument flow chart, which limits real-time visualization in three-dimensional scenes.

[0082] In addition, the 3D model constructed based on manual drawing cannot be directly reused in subsequent simulation verification and needs to be frequently remodeled according to the highly variable semiconductor pipeline configuration scheme, which greatly increases the complexity and cost of the simulation work.

[0083] To solve the above problems, by developing an advanced platform, setting up corresponding modules and platform architecture, the layout file of the semiconductor production line can be input, and the equipment information can be parsed to quickly generate a pipeline instrument flow chart that meets the business and user-defined rules. The pipeline instrument flow scheme does not require experience review, which directly ensures the rationality of the scheme foundation. At the same time, the corresponding layout module is also set to support the automatic conversion from two-dimensional flow charts to three-dimensional models, providing an intuitive three-dimensional visualization solution for semiconductor secondary piping installation projects.

[0084] like Figure 1 As shown, the present invention provides a layout device for a semiconductor secondary piping installation project, specifically comprising:

[0085] Signal-connected file upload module, data parsing module, data analysis layout module, three-dimensional space management module and secondary piping database;

[0086] A file upload module for receiving a layout file of a semiconductor production line;

[0087] A data analysis module is used to analyze the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment;

[0088] The data analysis and layout module is used to obtain the corresponding pipeline instrument components in the secondary piping database based on the attribute information and location information of the equipment and the component matching algorithm, and connect the equipment and the corresponding pipeline instrument components to form a pipeline instrument flow chart and provide a secondary piping installation pipeline diagram;

[0089] The three-dimensional space management module is used to generate a layout model of a semiconductor secondary piping installation project based on a secondary piping installation pipeline diagram and a three-dimensional model generation algorithm.

[0090] The present invention obtains information on secondary piping components by linking semiconductor layout information with a secondary piping database and combining a component matching algorithm. Based on a three-dimensional model generation algorithm, the present invention realizes automatic generation of semiconductor secondary piping layout and visualizes it in a three-dimensional scene.

[0091] The layout file includes the device configuration file, the layout design file and the feature information file. Part of the above layout file is uploaded in the form of a graph for graph parsing, and the other part is uploaded in the form of a table for data extraction and analysis.

[0092] The data analysis module performs data analysis on the uploaded layout file to obtain the attribute information and location information of the semiconductor production equipment and the factory system equipment in the layout file.

[0093] The attribute information of the equipment (i.e., semiconductor production equipment and factory system equipment) includes equipment type, equipment manufacturer information and interface information, and the attribute information of the factory system equipment also includes flow information, pressure information and remarks information;

[0094] The location information of the device is the coordinate information of the device on the semiconductor production layout plane.

[0095] Pipeline instrumentation components include pipelines, valves, test / measurement instruments, etc.

[0096] At the same time, after obtaining the attribute information and location information of the equipment, the data analysis module will interact with the secondary piping database and transmit the attribute information and location information of the equipment to the secondary piping database.

[0097] The secondary piping database receives and stores the property information and location information of the equipment. In addition, the secondary piping database also receives and stores the property information of the related pipeline instrument components and the corresponding three-dimensional components used for the semiconductor secondary piping.

[0098] In addition, the layout device of the semiconductor secondary piping installation project may also include a display module and a three-dimensional model conversion module, wherein the display module is used to display the pipeline instrument flow chart and the layout model of the semiconductor secondary piping.

[0099] The 3D model conversion module is used to convert the layout model of semiconductor secondary piping into the target model format. The 3D model conversion module can process the 3D model through code, convert it into the model data format accepted by other software APIs, and send the converted data to the API for model building of other simulation software.

[0100] Furthermore, if Figure 2 As shown, the layout device of the semiconductor secondary piping installation project also includes: a simulation module, a fluid system capacity management module and a construction management module;

[0101] The simulation module is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and combined with the power supply parameters;

[0102] The simulation module is connected to the three-dimensional space management module by signal, and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and combined with the power supply parameters;

[0103] The plant system capacity management module is connected to the data analysis layout module by signal, and is used to set and monitor the power supply points based on the pipeline instrument flow chart, and to guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points;

[0104] The construction management module is connected to the plant system capacity management module by signal, and is used to update the status of the power supply point based on the progress of the construction and transmit it to the plant system capacity management module.

[0105] Power supply points can also be called fluid supply points. The monitoring of fluid supply points by the plant system capacity management module is mainly status monitoring, management and push. For fluid supply points that are not arranged with secondary piping, after the fluid supply point information is synchronized to the plant system capacity management module, the fluid supply point information is pushed to the data analysis layout module based on the principle of the closest distance between the equipment and the point; then, it is judged whether the point information meets the needs of other equipment, and the best point is recommended according to the equipment requirements, guiding the generation of the secondary piping installation pipeline diagram in the data analysis layout module; the construction supervision module is used to update the status of the power supply point based on the progress of the construction, and transmit it to the plant system capacity management module to ensure that the point information is updated in real time and is consistent with the actual situation on site, ensuring a virtuous cycle of dispatching points. After adding the simulation module, the plant system capacity management module and the construction management module, the layout device includes the entire process of secondary piping installation engineering design, construction, operation and maintenance, which is of great significance to improving the consistency, quality and progress of secondary piping design, and can reduce secondary piping investment and operating costs.

[0106] Parse the layout file of the semiconductor production line to obtain the attribute information and location information of the equipment, including:

[0107] Based on the analysis of device configuration files, the attribute information of each device is obtained;

[0108] The layout design file is matched with the devices in the characteristic information file, the layout of each device is analyzed, and the location information of each device is given.

[0109] After the data analysis module obtains the attribute information and location information of the equipment, the data analysis layout module can realize the production of pipeline instrument flow charts, secondary piping installation pipeline diagrams and layout models of semiconductor secondary piping installation projects.

[0110] The data analysis layout module uses the component matching algorithm and 3D model generation algorithm in the data acquisition layout module. Based on the attribute information and location information of the equipment, combined with the component matching algorithm, the pipeline instrument components corresponding to the secondary piping database are obtained, including:

[0111] According to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the corresponding pipeline instrument components supplied to each equipment, and the attribute information of the pipeline instrument components is extracted, wherein the attribute information of the pipeline instrument components includes the type, size and rated power supply of the pipeline instrument components;

[0112] Each pipeline instrument component is classified and delineated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment.

[0113] The component matching algorithm mainly matches and extracts the pipeline instrument components in the secondary piping database based on the attribute information of the equipment. Specifically, Figure 3 As shown, according to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the corresponding pipeline instrument components supplied to each device, specifically including:

[0114] Query and confirm the matching equipment in the secondary piping database;

[0115] The semiconductor production equipment is grouped according to the equipment type and the semiconductor production area where it is located, and the group numbers are marked;

[0116] Analyze the power source demand of each group of semiconductor production equipment, determine the power source supply of the factory system equipment based on the power source demand, and provide the power source supply path between the factory system equipment and the semiconductor production equipment;

[0117] In the secondary piping database, each group of semiconductor production equipment is matched with the attribute information of the pipeline instrument components to determine the corresponding pipeline instrument components.

[0118] For example, in a specific application scenario, the data acquisition layout module sends instructions to the secondary piping database, and the attribute information of the equipment obtained by the data analysis module is confirmed in the secondary piping database. Of course, the confirmed equipment includes both semiconductor production equipment and plant system equipment. After that, it is mainly based on the grouping of various types of semiconductor production equipment in each semiconductor production area, and each group of semiconductor production equipment is marked. At this time, the semiconductor production area can be distinguished by the floors of the semiconductor production plant.

[0119] For each marked group of semiconductor production equipment, calculate the power source demand and then allocate the power source supply. For the principle of power source supply, the total supply flow can be based on the maximum value of the power source demand. At the same time, the rated power supply of each pipeline instrument component is considered to determine the power source supply for each group of semiconductor production equipment. For example, when the total supply flow meets the maximum value of the power source demand, but the pressure obviously exceeds the rated power supply of the pipeline instrument component, the power source supply needs to be adjusted. After the adjustment, the power source supply path between the factory system equipment and the semiconductor production equipment is given.

[0120] The pipeline instrument components for secondary piping are laid out according to the power source supply path, and the corresponding relationship between the pipeline instrument components and the semiconductor production equipment is used to determine each corresponding pipeline instrument component required for each semiconductor production equipment. Of course, each pipeline instrument component will also be matched with the factory system equipment based on attribute information.

[0121] After determining the semiconductor production equipment, plant system equipment, power supply path and corresponding pipeline instrument components, such as Figure 4 As shown, each pipeline instrument component is classified and demarcated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment, including:

[0122] Classify each identified pipeline instrumentation component along the power source supply path between the plant system equipment and the semiconductor production equipment;

[0123] Determine the ordinate information of various types of pipeline instrument components in the layout plane according to the group number of the corresponding supplied semiconductor production equipment, wherein the ordinate information represents the semiconductor production area where the pipeline instrument components are located;

[0124] According to the location information of the corresponding supplied semiconductor production equipment, determine the horizontal coordinate position of all pipeline instrument components corresponding to the semiconductor production equipment in the layout plane;

[0125] According to the preset attribute information of each pipeline instrument component, the horizontal axis position is divided to determine the horizontal axis information of each pipeline instrument component in the layout plane, wherein the horizontal axis information represents the relative interval between the pipeline instrument component and the corresponding semiconductor production equipment.

[0126] The classification of each pipeline instrument component along the power source supply path is mainly based on the semiconductor production area. Taking the above application scenario as an example, each pipeline instrument component can be divided into different categories corresponding to the floors of different semiconductor production plants. Since the semiconductor production equipment at this time is also marked with group numbers according to the semiconductor production area, at this time, the semiconductor production area of ​​a specific group number and the pipeline instrument component of a specific classification can determine the corresponding relationship, thus, the vertical coordinate information in the layout plane is used to represent the semiconductor production area, that is, the floor of the semiconductor production plant in this application scenario.

[0127] The horizontal coordinate information of the pipeline instrument component represents the relative distance between the corresponding semiconductor production equipment. The horizontal coordinate position of all the pipeline instrument components corresponding to a certain semiconductor production equipment is first determined, and then the large horizontal coordinate position is divided according to the type, size and other attribute information of each pipeline instrument component to obtain the horizontal coordinate information of each pipeline instrument component in the layout plane.

[0128] Based on the attribute information and location information of semiconductor production equipment and factory system equipment, the power source supply path is first given, and then the pipeline instrument components are matched, and the location information representing the semiconductor production area and the interval with the semiconductor production equipment is determined in the layout plane, such as Figure 5As shown in the figure, the secondary piping process of the pipeline instrument components meets the requirements of semiconductor production rules, and is easy to adjust to meet user-defined needs in the later stage, taking into account efficiency and flexibility, and ensuring the accuracy of the generation of the pipeline instrument flow chart.

[0129] In addition, the data analysis layout module is also used to: after forming the pipeline instrument flow diagram,

[0130] By receiving the touch interaction information, the attribute information and / or the position information of each pipeline instrument component are optimized to form an initial diagram of the secondary piping installation pipeline;

[0131] The initial diagram of the pipeline instrument process is adaptively detected, and based on the analysis of the adaptive detection results, a secondary piping installation pipeline diagram is formed.

[0132] Considering the needs of users' customization in the later stage, the data analysis layout module is set to interact by touch to adjust the attribute information and / or location information of the pipeline instrument components. After the adjustment, adaptive detection will also be performed based on the basic rules of secondary piping, and finally the secondary piping installation pipeline diagram will be obtained.

[0133] Adjustments based on touch interaction can be viewed and displayed through the display module, and the adjusted pipeline instrument flow chart can be presented in the display module.

[0134] like Figure 6 As shown, based on the secondary piping installation pipeline diagram and combined with the three-dimensional model generation algorithm, a layout model of semiconductor secondary piping is generated, which specifically includes:

[0135] Perform component analysis on the secondary piping installation pipeline diagram to obtain each pipeline instrument component;

[0136] Match each pipeline instrument component with the three-dimensional component of the secondary piping database to determine the three-dimensional component of the corresponding pipeline instrument;

[0137] In combination with the position information of each pipeline instrument component and based on the analysis of the attribute information of the three-dimensional component, the shape of the three-dimensional component is updated to generate a layout model of the semiconductor secondary piping, wherein the attribute information of the three-dimensional component includes the shape information and size information of the three-dimensional component.

[0138] For the secondary piping installation pipeline diagram, the layout model of the semiconductor secondary piping installation project can be obtained according to the three-dimensional model generation algorithm. The core of the three-dimensional model generation algorithm lies in the analysis of overlap and intersection, as well as the readjustment of the properties of each three-dimensional component.

[0139] like Figure 7As shown, the shape of the three-dimensional component is updated based on the position information of each pipeline instrument component and the attribute information of the three-dimensional component, which is specifically expressed as follows:

[0140] Compare the horizontal and vertical coordinate information of each pipeline instrument component on the layout plane in pairs, determine the pipeline instrument components with layout intersections, and form a first pipeline instrument component set;

[0141] Mapping and matching the three-dimensional components of pipeline instruments with each pipeline instrument component in the first pipeline instrument component set to form a first three-dimensional component set;

[0142] In the first three-dimensional component set, the vertical dimension information of each three-dimensional component is compared in pairs, and combined with the preset layout model space of the semiconductor secondary piping installation project, the three-dimensional components with intersections are given, and the pipeline instrument components corresponding to the intersections of the three-dimensional components are collected to form a second pipeline instrument component set;

[0143] Adjusting the horizontal coordinates and / or the vertical coordinate information of each pipeline instrument component in the second pipeline instrument component set on the layout plane, and / or adjusting the vertical dimension information of each pipeline instrument component in the second pipeline instrument component set;

[0144] Repeat the above comparison of the horizontal and vertical coordinate information of the pipeline instrument components on the layout plane and the vertical size information of each three-dimensional component until the first pipeline instrument component set and the second pipeline instrument component set are both empty sets, completing the shape update of the three-dimensional component.

[0145] The first pipeline instrument component set is specifically represented as follows:

[0146]

[0147] Where C is the set of all pipeline instrument components, c 1 、c 2 、c i 、c j 、c n are the 1st, 2nd, i, j, and nth pipeline instrument components respectively, C 1 is the first pipeline instrument component set, x i ,y i is the horizontal and vertical coordinates of the i-th pipeline instrument component in the layout plane, x j ,y j is the horizontal and vertical coordinates of the jth pipeline instrument component in the layout plane, Is an empty set.

[0148] The second pipeline instrument component set is specifically represented as follows:

[0149]

[0150] Among them, C 1 ' is the first three-dimensional component set, c k 、c s are the kth and sth pipeline instrument components, respectively, c i '、c j '、c k '、c s 'Respectively match the pipeline instrument components c i 、c j 、c k 、c s The three-dimensional component, M() is the mapping matching function, C 2 is the second pipeline instrumentation component set, z k ' is the three-dimensional component c k 'Vertical dimension data, z s ' is the three-dimensional component c s The vertical dimension data, Is an empty set.

[0151] In a specific application scenario, such as Figure 8 As shown, a pipeline in the layout plane may be two or even multiple overlapping pipelines in the three-dimensional layout model space, but one is located above the other (i.e., the vertical dimension information is different), covering the other. Therefore, when converting the two-dimensional secondary piping installation pipeline diagram to the three-dimensional semiconductor secondary piping layout model, these overlapping pipelines must be judged. The judgment method is based on their coordinate information on the layout plane and the vertical dimension information as a three-dimensional component. If the x and y coordinates of the pipeline instrument components on the layout plane are the same, then calculate the vertical dimension information z value of its three-dimensional component to avoid overlap and intersection in the three-dimensional layout model space. Because the pipelines in the semiconductor production plant are very complex and the space is very small, the readjustment process includes recalculation of the z value, and also includes, for example, up and down adjustment (i.e., adjustment of the vertical coordinate information of the layout plane) or left and right adjustment (i.e., adjustment of the horizontal coordinate information of the layout plane). Repeating the above process completes the shape update of the three-dimensional component and the determination of the coordinates of the three-dimensional component in the layout model space.

[0152] Based on the secondary piping installation pipeline diagram and the 3D model generation algorithm, a 3D semiconductor secondary piping layout model is obtained. This solves the problems of duplication and intersection that may exist in the conversion of the 2D piping instrument flow chart to the 3D semiconductor secondary piping layout model, and provides a more intuitive and accurate 3D visualization solution.

[0153] like Fig. 9As shown, the present invention also provides a layout method for a semiconductor secondary piping installation project, using the layout device for the semiconductor secondary piping installation project as described above, specifically comprising the following steps:

[0154] Receive layout files for semiconductor production lines;

[0155] Parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment;

[0156] Based on the attribute information and location information of the equipment, combined with the component matching algorithm, the corresponding pipeline instrument components in the secondary piping database are obtained, and the equipment and the corresponding pipeline instrument components are connected to form a pipeline instrument flow chart, and a secondary piping installation pipeline diagram is given;

[0157] Based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model of the semiconductor secondary piping installation project is generated.

[0158] The present invention provides a layout device and method for semiconductor secondary piping installation engineering, which at least includes the following beneficial effects:

[0159] (1) The present invention obtains information about secondary piping components by linking semiconductor layout information with a secondary piping database and combining a component matching algorithm. Based on a three-dimensional model generation algorithm, the present invention realizes automatic generation of semiconductor secondary piping layout and visualizes it in a three-dimensional scene.

[0160] (2) Based on the attribute information and location information of semiconductor production equipment and factory system equipment, the power source supply path is first given, and then the pipeline instrument components are matched, and the location information representing the semiconductor production area and the interval with the semiconductor production equipment is determined in the layout plane. This makes the secondary piping process of the pipeline instrument components meet the requirements of semiconductor production rules and is convenient for subsequent adjustments to meet user-defined needs, taking into account both efficiency and flexibility, and ensuring the accuracy of the generation of the pipeline instrument flow chart.

[0161] (3) Based on the secondary piping installation pipeline diagram and the three-dimensional model generation algorithm, a three-dimensional layout model of the semiconductor secondary piping installation project is obtained, which solves the duplication and intersection problems that may exist in the conversion of the two-dimensional pipeline instrument flow chart to the three-dimensional layout model of the semiconductor secondary piping installation project, and provides a more intuitive and accurate three-dimensional visualization solution.

[0162] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A layout device for semiconductor secondary piping installation engineering, characterized in that: Specifically include: signal connection file upload module, data analysis module, data analysis layout module, three-dimensional space management module and secondary piping database; A file upload module for receiving a layout file of a semiconductor production line; A data analysis module is used to analyze the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment; The data analysis and layout module is used to obtain the corresponding pipeline instrument components in the secondary piping database based on the attribute information and location information of the equipment and the component matching algorithm, and connect the equipment and the corresponding pipeline instrument components to form a pipeline instrument flow chart and provide a secondary piping installation pipeline diagram; The three-dimensional space management module is used to generate a layout model of a semiconductor secondary piping installation project based on a secondary piping installation pipeline diagram and a three-dimensional model generation algorithm.

2. The layout device for semiconductor secondary piping installation engineering according to claim 1, characterized in that: The layout file includes a device configuration file, a layout design file, and a feature information file; The attribute information of the equipment includes the equipment type, equipment manufacturer information and interface information. The attribute information of the plant system equipment also includes flow information, pressure information and remarks information. The location information of the device is the coordinate information of the device on the semiconductor production layout plane; Among them, the layout file of the semiconductor production line is parsed to obtain the attribute information and location information of the equipment, including: Based on the analysis of device configuration files, the attribute information of each device is obtained; The layout design file is matched with the devices in the characteristic information file, the layout of each device is analyzed, and the location information of each device is given.

3. The layout device for semiconductor secondary piping installation engineering according to claim 1, characterized in that: Also includes: Simulation module, fluid system capacity management module and construction management module; The simulation module is connected to the three-dimensional space management module by signal, and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and combined with the power supply parameters; The plant system capacity management module is connected to the data analysis layout module by signal, and is used to set and monitor the power supply points based on the pipeline instrument flow chart, and to guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points; The construction management module is connected to the plant system capacity management module by signal, and is used to update the status of the power supply point based on the progress of the construction and transmit it to the plant system capacity management module.

4. The layout device for semiconductor secondary piping installation engineering according to claim 1, characterized in that: Based on the attribute information and location information of the equipment, combined with the component matching algorithm, the pipeline instrument components corresponding to the secondary piping database are obtained, including: According to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the corresponding pipeline instrument components supplied to each equipment, and the attribute information of the pipeline instrument components is extracted, wherein the attribute information of the pipeline instrument components includes the type, size rating and power supply of the pipeline instrument components; Each pipeline instrument component is classified and delineated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment.

5. The layout device for semiconductor secondary piping installation engineering according to claim 4, characterized in that: According to the attribute information of the equipment, the components are matched in the secondary piping database to determine the corresponding pipeline instrument components supplied to each equipment, including: Query and confirm the matching equipment in the secondary piping database; The semiconductor production equipment is grouped according to the equipment type and the semiconductor production area where it is located, and the group numbers are marked; Analyze the power source demand of each group of semiconductor production equipment, determine the power source supply of the factory system equipment based on the power source demand, and provide the power source supply path between the factory system equipment and the semiconductor production equipment; In the secondary piping database, each group of semiconductor production equipment is matched with the attribute information of the pipeline instrument components to determine the corresponding pipeline instrument components.

6. The layout device for semiconductor secondary piping installation engineering according to claim 5, characterized in that: Classify and define each pipeline instrument component, and provide the location information of each pipeline instrument component in combination with the location information of the corresponding supplied equipment, including: Classify each identified pipeline instrumentation component along the power source supply path between the plant system equipment and the semiconductor production equipment; Determine the ordinate information of various types of pipeline instrument components in the layout plane according to the group number of the corresponding supplied semiconductor production equipment, wherein the ordinate information represents the semiconductor production area where the pipeline instrument components are located; According to the location information of the corresponding supplied semiconductor production equipment, determine the horizontal coordinate position of all pipeline instrument components corresponding to the semiconductor production equipment in the layout plane; According to the preset attribute information of each pipeline instrument component, the horizontal axis position is divided to determine the horizontal axis information of each pipeline instrument component in the layout plane, wherein the horizontal axis information represents the relative interval between the pipeline instrument component and the corresponding semiconductor production equipment.

7. The layout device for semiconductor secondary piping installation engineering according to claim 1, characterized in that: Based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model of semiconductor secondary piping is generated, including: Perform component analysis on the secondary piping installation pipeline diagram to obtain each pipeline instrument component; Match each pipeline instrument component with the three-dimensional component of the secondary piping database to determine the three-dimensional component of the corresponding pipeline instrument; Combined with the location information of each pipeline instrument component and based on the analysis of the attribute information of the three-dimensional component, the shape of the three-dimensional component is updated to generate a layout model of the semiconductor secondary piping installation project, wherein the attribute information of the three-dimensional component includes the shape information and size information of the three-dimensional component.

8. The layout device for semiconductor secondary piping installation engineering according to claim 7, characterized in that: Combined with the location information of each pipeline instrument component and based on the analysis of the attribute information of the three-dimensional component, the shape of the three-dimensional component is updated, which is specifically expressed as follows: Compare the horizontal and vertical coordinate information of each pipeline instrument component on the layout plane in pairs, determine the pipeline instrument components with layout intersections, and form a first pipeline instrument component set; Mapping and matching the three-dimensional components of pipeline instruments with each pipeline instrument component in the first pipeline instrument component set to form a first three-dimensional component set; In the first three-dimensional component set, the vertical dimension information of each three-dimensional component is compared in pairs, and combined with the preset layout model space of the semiconductor secondary piping installation project, the three-dimensional components with intersections are given, and the pipeline instrument components corresponding to the intersections of the three-dimensional components are collected to form a second pipeline instrument component set; Adjusting the horizontal coordinates and / or the vertical coordinate information of each pipeline instrument component in the second pipeline instrument component set on the layout plane, and / or adjusting the vertical dimension information of each pipeline instrument component in the second pipeline instrument component set; Repeat the above comparison of the horizontal and vertical coordinate information of the pipeline instrument components on the layout plane and the vertical size information of each three-dimensional component until the first pipeline instrument component set and the second pipeline instrument component set are both empty sets, completing the shape update of the three-dimensional component.

9. The layout device for semiconductor secondary piping installation engineering according to claim 4, characterized in that: The data analysis layout module is also used to: After forming the piping instrument flow diagram, By receiving the touch interaction information, the attribute information and / or the position information of each pipeline instrument component are optimized to form an initial diagram of the secondary piping installation pipeline; The initial diagram of the pipeline instrument process is adaptively detected, and based on the analysis of the adaptive detection results, a secondary piping installation pipeline diagram is formed.

10. A layout method for semiconductor secondary piping installation engineering, characterized in that: The layout device for semiconductor secondary piping installation engineering as claimed in any one of claims 1 to 9 specifically comprises the following steps: Receive layout files for semiconductor production lines; Parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, wherein the equipment includes semiconductor production equipment and factory system equipment; Based on the attribute information and location information of the equipment, combined with the component matching algorithm, the corresponding pipeline instrument components in the secondary piping database are obtained, and the equipment and the corresponding pipeline instrument components are connected to form a pipeline instrument flow chart, and a secondary piping installation pipeline diagram is given; Based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model of the semiconductor secondary piping installation project is generated.

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