Process device and process method for inverted bonding

Abstract

The invention discloses an inverted bonding process device and method. The process device comprises a plurality of process heads used for obtaining a plurality of chips for process treatment; the plurality of micro-motion structures are respectively connected with the process heads and are used for adjusting the poses of the plurality of process heads; the linear motor module is used for synchronously adjusting the spacing of the plurality of process heads on the linear motor module; the controller is configured to perform synchronous initial adjustment on the spacing of the plurality of process heads through the linear motor module according to the target positions of the plurality of process heads; and according to the target poses of the plurality of process heads, through the plurality of micro-motion structures, carrying out synchronous fine adjustment on the poses of the plurality of process heads, so that the plurality of chips accord with the target poses of the process processing. According to the invention, the compatibility of the machine table can be improved, the application scene can be expanded, multiple process heads can be accurately and synchronously adjusted in real time, the adjustment time is shortened, and the precision, efficiency and productivity of the machine table are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processes, and in particular to an inverted bonding process device, an inverted bonding process method, and a computer-readable storage medium. Background Art

[0002] In the field of hybrid bonding, chip-to-wafer bonding achieves performance improvement and size reduction through 3D stacking, which not only reduces costs, but also further improves circuit density and further reduces line width from another dimension. Therefore, in the field of chip-to-wafer bonding, bonding accuracy and production capacity per unit time are particularly important.

[0003] In the flip-chip bonding process, the bonding surface of the chip used to form an electrical connection with external components faces downward, and the chip is bonded downward to the wafer. However, in flip-chip bonding with the front side of the wafer facing upward, the bonding surface (front side) of the wafer is easily stained with particles, and when the chip is transferred, the wafer is in a waiting state. As the waiting time increases, there is a risk of particle accumulation on the bonding surface of the wafer. These particles will affect the subsequent bonding quality, cause the generation of bubbles after bonding, and reduce the overlay accuracy after bonding. In order to improve the problem of particle accumulation on the bonding surface, an inverted bonding process can be used for chip-to-wafer bonding. In the inverted bonding process, the bonding surface of the wafer faces downward, and the chip to be bonded needs to be bonded to the wafer from bottom to top, thereby solving the problem of particle accumulation on the bonding surface affecting the bonding quality.

[0004] However, the inverted bonding process requires higher machine precision for the bonding machine. Therefore, the machine precision suitable for inverted bonding cannot meet the process requirements of inverted bonding. Moreover, in the current bonding machines, whether it is a single-station or dual-station bonding machine, generally only one bonding head can be installed on a bonding component, that is, only one chip can be bonded at a time. Moreover, one bonding head means that different types of chips are not compatible, and the production capacity per unit time will also be limited. At the same time, when handing over the chip to the pick-up head, it is impossible to adjust the spacing between the bonding heads on multiple bonding components in real time.

[0005] In order to solve the above-mentioned problems existing in the prior art, the art is in urgent need of an improved semiconductor process technology that can process multiple different types of chips in one action, thereby improving machine compatibility and expanding application scenarios. At the same time, it can also accurately and synchronously adjust multiple process heads in real time according to process requirements, reduce adjustment time, and thus improve the accuracy, efficiency and production capacity of the machine. Summary of the invention

[0006] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides an inverted bonding process device, an inverted bonding process method, and a computer-readable storage medium, which can process multiple different types of chips in one action, thereby improving the compatibility of the machine and expanding the application scenarios. At the same time, it can also accurately and synchronously adjust multiple process heads in real time according to process requirements, reduce adjustment time, and thus improve the accuracy, efficiency and production capacity of the machine.

[0008] Specifically, the above-mentioned inverted bonding process device provided according to the first aspect of the present invention includes: multiple process heads, used to obtain multiple chips for process processing; multiple micro-motion structures, respectively connected to each of the process heads, used to adjust the posture of the multiple process heads; a linear motor module, so that the multiple process heads can synchronously adjust the spacing thereon; and a controller, which is configured to: synchronously initially adjust the spacing of the multiple process heads through the linear motor module according to the target positions of the multiple process heads; and synchronously finely adjust the posture of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads, so that the multiple chips thereon meet the target postures of the process processing.

[0009] Further, in some embodiments of the present invention, the multiple process heads are multiple bonding heads, and the step of synchronously and initially adjusting the spacing between the multiple process heads through the linear motor module according to the target positions of the multiple process heads includes: determining the target handover positions of the multiple bonding heads according to the handover positions of the multiple pickup heads; and synchronously and initially adjusting the spacing between the multiple bonding heads through the linear motor module.

[0010] Further, in some embodiments of the present invention, the step of synchronously and finely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon conform to the target postures of the process treatment includes: determining the target handover postures of the multiple bonding heads according to the handover postures of the multiple pickup heads; and synchronously and finely adjusting the postures of the multiple bonding heads through the multiple micro-motion structures so that they conform to the target handover postures.

[0011] Further, in some embodiments of the present invention, the step of synchronously and initially adjusting the spacing between the multiple process heads through the linear motor module according to the target positions of the multiple process heads also includes: in response to the multiple bonding heads accessing the multiple chips, obtaining the bonding positions of the multiple chips according to the inverted wafer image to be bonded; determining the target bonding positions of the multiple bonding heads according to the bonding positions of the multiple chips; and synchronously and initially adjusting the spacing between the multiple bonding heads through the linear motor module.

[0012] Further, in some embodiments of the present invention, the step of synchronously and finely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon conform to the target posture of the process treatment also includes: determining the bonding posture of the multiple chips according to the bonding area in the wafer image; determining the target bonding posture of the multiple bonding heads according to the bonding posture of the multiple chips; synchronously and finely adjusting the postures of the multiple bonding heads through the multiple micro-motion structures so that the multiple chips thereon conform to the target bonding posture; and driving the multiple bonding heads to rise so as to raise the multiple chips and bond them to the bonding area.

[0013] Further, in some embodiments of the present invention, the multiple process heads are multiple picking heads, and the step of synchronously and initially adjusting the spacing between the multiple process heads through the linear motor module according to the target positions of the multiple process heads includes: determining the target picking positions of the multiple picking heads according to the positions of the multiple chips to be picked up on the wafer disk; and synchronously and initially adjusting the spacing between the multiple picking heads through the linear motor module.

[0014] Further, in some embodiments of the present invention, the step of synchronously and finely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon conform to the target posture of the process treatment includes: determining the target picking postures of the multiple process heads according to the current postures of the multiple chips to be picked up; and synchronously and finely adjusting the postures of the multiple process heads through the multiple micro-motion structures so that they conform to the target picking postures.

[0015] Further, in some embodiments of the present invention, the plurality of bonding heads include bonding heads of various sizes, or the plurality of pickup heads include pickup heads of various sizes.

[0016] Furthermore, in some embodiments of the present invention, the micro-motion structure includes a first micro-motion portion and a second micro-motion portion, wherein the first micro-motion portion drives the process head to perform translational micro-motion in the X-axis direction and / or the Y-axis direction, and the second micro-motion portion drives the process head to perform rotational micro-motion around the Z-axis direction.

[0017] Furthermore, in some embodiments of the present invention, the process device also includes: a grating ruler, located below the multiple process heads; and a reading head, located in each of the process heads, for reading the coordinates of each of the process heads through the grating ruler.

[0018] In addition, the above-mentioned inverted bonding process method provided according to the second aspect of the present invention includes the following steps: according to the target positions of the multiple process heads in the above-mentioned inverted bonding process device provided by the first aspect of the present invention, the spacing of the multiple process heads is synchronously initially adjusted by a linear motor module; and according to the target postures of the multiple process heads, the postures of the multiple process heads are synchronously finely adjusted by a plurality of micro-motion structures so that the multiple chips thereon meet the target postures of the process treatment.

[0019] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned inverted bonding process method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 A schematic diagram of a top view of an inverted bonding process device provided according to some embodiments of the present invention is shown;

[0022] Figure 2 A schematic front view of a structure of an inverted bonding process device provided according to some embodiments of the present invention is shown; and

[0023] Figure 3 A flow chart of an inverted bonding process method provided according to some embodiments of the present invention is shown.

[0024] Reference numerals:

[0025] 100 Inverted bonding process device;

[0026] 110 first process head;

[0027] 120 second process head;

[0028] 130 micro-motion structure;

[0029] 131 first micro-motion unit;

[0030] 132 second micro-motion unit;

[0031] 140 linear motor module;

[0032] 150 grating ruler;

[0033] 160 readhead; and

[0034] Steps S310~S320. DETAILED DESCRIPTION

[0035] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0038] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0039] As mentioned above, the inverted bonding process requires higher machine precision for the bonding machine. Therefore, the machine precision suitable for inverted bonding cannot meet the process requirements of inverted bonding. Moreover, in the current bonding machines, whether it is a single-station or dual-station bonding machine, generally only one bonding head can be installed on a bonding component. One bonding head means that it is not compatible with different types of chips, and the production capacity per unit time will also be limited. At the same time, when handing over the chip to the pick-up head, it is impossible to adjust the spacing between the bonding heads on multiple bonding components in real time.

[0040] In order to solve the above-mentioned problems existing in the prior art, the present invention provides an inverted bonding process device, an inverted bonding process method, and a computer-readable storage medium, which can process multiple different types of chips in one action, thereby improving the compatibility of the machine and expanding the application scenarios. At the same time, it can also accurately and synchronously adjust multiple process heads in real time according to process requirements, reduce adjustment time, and thus improve the accuracy, efficiency and production capacity of the machine.

[0041] In some non-limiting embodiments, the inverted bonding process device provided in the first aspect of the present invention can be used to implement the inverted bonding process method provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention has computer instructions stored thereon. When the computer instructions are executed by the processor, they can be used to implement the inverted bonding process method provided in the second aspect of the present invention.

[0042] The working principle of the above-mentioned inverted bonding process device will be described below in conjunction with some embodiments of the inverted bonding process method. Those skilled in the art will understand that these embodiments of the inverted bonding process method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the inverted bonding process device. Similarly, the inverted bonding process device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these inverted bonding process methods.

[0043] Please see Figure 1 , Figure 1 A schematic top view of the structure of an inverted bonding process device provided according to some embodiments of the present invention is shown.

[0044] like Figure 1 As shown, in some embodiments of the present invention, the inverted bonding process device 100 may include multiple process heads, such as a first process head 110 and a second process head 120, which can be used to obtain multiple chips for process processing. Multiple process heads can be integrated on a linear motor module 140, and the linear motor module 140 can be used for multiple process heads to adjust the spacing synchronously thereon. A micro-motion structure 130 is connected to the bottom of each process head, and the micro-motion structure 130 can be used to adjust the posture of multiple process heads.

[0045] The inverted bonding process device 100 may also include a controller (not shown in the drawings), which is respectively connected to multiple process heads, micro-motion structures 130 and linear motor modules 140. The controller can be configured to perform each step in the inverted bonding process method. First, the controller can synchronize and initially adjust the spacing between multiple process heads through the linear motor module 140 according to the target positions of the multiple process heads. Then, the controller can synchronize and finely adjust the postures of the multiple process heads through the multiple micro-motion structures 130 according to the target postures of the multiple process heads, so that the multiple chips on them meet the target postures of the process.

[0046] Further, in some optional embodiments, the multiple process heads integrated on the linear motor module 140 can be multiple pick-up heads, wherein the pick-up heads are preferably non-contact suction heads. The chip picking process is to use multiple pick-up heads to pick up the front of the chip by suction above the multiple cut chips (die) placed on the wafer disk. Since the front of the chip includes a bump that forms an electrical connection with the outside, in order to facilitate the picking operation without destroying the circuit structure on the front of the chip, a non-contact suction head can be used to directly adsorb the front of the chip, and the back of the chip is facing the bonding head.

[0047] Since the pick-up head adsorbs the chip from the cut wafer disk, it adsorbs the front side of the chip (i.e. the bonding side), and the pick-up head cannot complete the bonding directly. Therefore, it is necessary to cooperate with the bonding head to transfer the chip once and turn the front side of the chip over to bond with the wafer to be bonded.

[0048] In some other optional embodiments, the multiple process heads integrated on the linear motor module 140 can also be replaced with multiple bonding heads, wherein the bonding head is preferably a vacuum suction head. In the process of handing the chip from the pickup head to the bonding head, the bonding head adsorbs the back of the chip. Therefore, the back of the chip can be vacuum adsorbed so that the front of the chip faces up. In the process of inverted bonding, the bonding surface (front side) of the wafer to be bonded faces downward, and the bonding is completed by pressing the chip up.

[0049] Furthermore, in some optional embodiments, a process device integrating multiple pickup heads and a process device integrating multiple bonding heads can be used in combination. The process device integrating multiple pickup heads can be used to perform synchronous pickup of multiple chips, and then the process device integrating multiple bonding heads can be used to perform synchronous bonding of multiple chips.

[0050] Preferably, the plurality of bonding heads may be bonding heads of various sizes. Similarly, the plurality of pickup heads may be pickup heads of various sizes, for respectively bonding or picking up chips of different sizes and / or types. Chips of different sizes refer to chips with different lengths and widths, for example Figure 1 The first process head 110 with a smaller size can obtain a chip with a size of 9.8×10.2mm, while the second process head 120 with a larger size can obtain a chip with a size of 13×16.5mm. The sizes of different chips can be selected according to needs. Different types of chips refer to different circuits or thicknesses on the chips, which will also require the use of different bonding heads for bonding. In other words, the inverted bonding process device 100 can be compatible with a variety of chips of different sizes and types at the same time, and perform multiple process treatments such as bonding or picking up on them at the same time, thereby improving process efficiency.

[0051] Please see Figure 2 , Figure 2 A front view structural schematic diagram of an inverted bonding process device provided according to some embodiments of the present invention is shown.

[0052] like Figure 2 As shown, in some embodiments of the present invention, a plurality of movers are provided on the linear motor module 140, and the plurality of movers are driven to perform linear motion by electromagnetic force. A plurality of process heads can be mounted on the corresponding plurality of movers, and the linear motor module 140 performs macro motion in the X-axis direction. Furthermore, preferably, the inverted bonded process device 100 may also include a linear motor module in another direction, which is connected to the linear motor module 140 to provide macro motion in the Y-axis direction to the plurality of process heads. The linear motor module 140 can be used to perform real-time synchronous macro-motion initial adjustment of the spacing between the plurality of process heads integrated thereon, so as to achieve micron-level position accuracy control, thereby improving the efficiency of the plurality of process heads reaching the target position.

[0053] Please continue as Figure 2 As shown, in some embodiments of the present invention, the micro-motion structure 130 may further include a first micro-motion part 131 and a second micro-motion part 132, wherein the first micro-motion part 131 may drive the process head to perform translational micro-motion in the X-axis direction and / or the Y-axis direction, and the second micro-motion part 132 may drive the process head to perform rotational micro-motion around the Z-axis direction. The micro-motion structure 130 may be used to perform real-time synchronous micro-motion fine adjustment of the position and posture of each process head, achieving nanometer-level position and posture precision control, thereby improving the efficiency of each process head reaching the target posture.

[0054] like Figure 2 As shown, in some preferred embodiments, the inverted bonding process device 100 may further include a grating ruler 150 and a reading head 160. The grating ruler 150 may be located below a plurality of process heads (such as the first process head 110 and the second process head 120). Each process head is provided with a reading head 160, and the coordinates of each process head can be read through the grating ruler 150. That is to say, in this embodiment, the position of each process head can be accurately obtained by cooperating with the reading head 160 installed on the process head, thereby determining the relative position relationship between each process head, so that the accuracy of the spacing adjustment mechanism can reach the micron level through the linear motor module and the grating ruler.

[0055] To better understand the above-mentioned inverted bonding process device 100, please refer to Figure 3 , Figure 3 A flow chart of an inverted bonding process method provided according to some embodiments of the present invention is shown. Figure 3 The inverted bonding process is shown.

[0056] like Figure 3 As shown, in some embodiments of the present invention, the inverted bonding process method may include the following steps: step S310: according to the target positions of the multiple process heads in the inverted bonding process device, synchronously and initially adjusting the spacing between the multiple process heads through a linear motor module; and step S320: according to the target postures of the multiple process heads, synchronously and finely adjusting the postures of the multiple process heads through multiple micro-motion structures so that the multiple chips thereon meet the target postures of the process.

[0057] Specifically, please combine Figure 2It is commonly understood that, optionally, in the first embodiment, the multiple process heads configured on the linear motor module 140 can be multiple pick-up heads. Multiple cut chips (dies) are placed on the wafer disk, and multiple pick-up heads are located above the wafer disk. The controller can obtain the positions of the multiple chips to be picked up on the wafer disk through the first visual component, thereby determining the target pick-up positions of the multiple pick-up heads.

[0058] Then, if Figure 2 As shown, the controller can obtain the current real-time spacing information of the two pickup heads, and then control the first pickup head and the second pickup head mounted on the linear motor module 140 to perform macro motion in the X-axis and / or Y-axis direction, thereby realizing real-time synchronous macro-motion initial adjustment of the spacing between the two pickup heads. The linear motor module 140 can adjust the real-time synchronous spacing of the two pickup heads to achieve micron-level position accuracy control, thereby improving the efficiency of multiple pickup heads reaching the target pickup position.

[0059] Then, the controller can continue to obtain the current posture of the multiple chips to be picked up through the first visual component, so as to determine the target picking posture of multiple pick-up heads. After that, the controller can control the micro-motion structure 130 corresponding to each of the first pick-up head and the second pick-up head, and perform synchronous fine adjustment on the posture of the first pick-up head and the second pick-up head. For example, the first micro-motion part 131 can be used to perform translational micro-motion in the X-axis direction and / or the Y-axis direction on the pick-up head, and the second micro-motion part 132 can be used to perform rotational micro-motion around the Z-axis direction on the pick-up head to align the multiple chips to be picked up on the wafer disk before picking up. Then, two chips are picked up at the same time, so as to quickly complete the picking of two chips. Through the micro-motion structure 130, it is possible to achieve real-time synchronous micro-motion fine adjustment of the position and posture of the two pick-up heads, and achieve nanometer-level posture accuracy control, thereby improving the efficiency of each pick-up head reaching the target picking posture.

[0060] In a second embodiment of the present invention, after completing the chip picking process in the first embodiment, another set of inverted bonding process equipment can be used to perform the chip bonding process, wherein the multiple picking heads configured on the linear motor module 140 are multiple bonding heads.

[0061] Specifically, the controller can determine the target handover positions of the multiple bonding heads according to the handover positions of the multiple pick-up heads, that is, the current real-time spacing information of the first pick-up head. Figure 2As shown, the controller can control the first bonding head and the second bonding head mounted on the linear motor module 140 to perform macro motion in the X-axis and / or Y-axis direction, thereby realizing real-time synchronous macro-motion initial adjustment of the spacing between the two bonding heads, so that the first bonding head corresponds to the first pickup head, and the second bonding head corresponds to the second pickup head. The linear motor module 140 can adjust the real-time synchronous spacing between the two bonding heads to achieve micron-level position accuracy control, thereby improving the efficiency of multiple bonding heads reaching the target bonding position.

[0062] Then, the controller can determine the target handover posture of multiple bond heads according to the handover posture of multiple pickup heads. Afterwards, the controller can control the micro-motion structure 130 corresponding to each of the first bond head and the second bond head to perform synchronous fine adjustment on the posture of the first bond head and the second bond head. For example, the first micro-motion part 131 can be used to perform translational micro-motion on the bond head in the X-axis direction and / or the Y-axis direction, and the second micro-motion part 132 can be used to perform rotational micro-motion on the bond head around the Z-axis direction to align the chip to be handed over before handover. Then, the two chips are handed over at the same time, so as to quickly complete the handover of the two chips. The micro-motion structure 130 can realize real-time synchronous micro-motion fine adjustment of the position and posture of the two bond heads, achieving nanometer-level posture accuracy control, thereby improving the efficiency of each bond head reaching the target handover posture.

[0063] After that, in the chip bonding process, in response to multiple bonding heads receiving multiple chips, the inverted wafer to be bonded located above can be scanned by an optical system to obtain a wafer map of the wafer to be bonded. A wafer map refers to the process of making a circuit on a wafer through various complex physical and chemical methods. In the final stage of production, different electrical function tests will be performed to ensure the functionality of the product. The pattern generated by using these test results and combining them with the shape of the wafer is the wafer map. The wafer map can be based on the chip, and the results of the test can be marked at the position of each chip with different colors, shapes or codes. The controller can obtain the bonding positions of multiple chips through the wafer map. Then, based on the bonding positions of the multiple chips, the controller can determine the target bonding positions of multiple bonding heads.

[0064] Then, if Figure 2As shown, the controller can obtain the current real-time spacing information of the two bond heads, and then control the first bond head and the second bond head mounted on the linear motor module 140 to perform macro movement in the X-axis and / or Y-axis direction again, thereby realizing real-time synchronous macro-motion initial adjustment of the spacing between the two bond heads. The linear motor module 140 can achieve micron-level position accuracy control for the real-time synchronous spacing adjustment of the two bond heads, thereby improving the efficiency of multiple bond heads reaching the target bonding position. In this step, by obtaining the relative position information of the upcoming bonding positions of the two bond heads, the spacing of the two bond heads is adjusted to be consistent with the spacing of the target bonding position, so as to perform bonding pre-alignment, thereby facilitating the subsequent rapid simultaneous bonding of the two chips.

[0065] Then, the controller can continue to determine the bonding posture of multiple chips through multiple patch areas in the inverted wafer image scanned by the optical system. The patch area is the area on the wafer where the chip is to be bonded, and the patch area can be distributed at multiple positions on the bonding surface of the wafer, and the bonding posture of the chip corresponding to different patch areas is different. For example, the bonding posture of the chip corresponding to the patch position in the center area of ​​the wafer is horizontal, while the bonding posture of the chip corresponding to the edge area of ​​the wafer is tilted.

[0066] Then, according to the bonding posture of the multiple chips, the controller can determine the target bonding posture of the first bonding head and the second bonding head. After that, the controller can control the micro-motion structure 130 corresponding to each of the first bonding head and the second bonding head to synchronize and finely adjust the posture of the first bonding head and the second bonding head again. Specifically, the first micro-motion part 131 can be used to perform translational micro-motion of the bonding head in the X-axis direction and / or the Y-axis direction, and the second micro-motion part 132 can be used to perform rotational micro-motion of the bonding head around the Z-axis direction, so that the two chips can meet their respective target bonding postures before bonding, and can be aligned with their respective patch areas on the wafer. Finally, the controller can drive the two bonding heads to rise at the same time to press and bond the multiple chips to their respective patch areas to achieve simultaneous bonding of the two chips. Through the micro-motion structure 130, the position and posture of the two bonding heads can be finely adjusted in real time and synchronously, achieving nanometer-level posture accuracy control, thereby improving the efficiency of each bonding head reaching the target bonding posture.

[0067] For the bonding assembly, since one bonding head can only be used for bonding one chip, a combination of multiple bonding heads is necessary in the present invention, which can reduce the replacement frequency of the bonding head and can also support carrying and bonding multiple different types of chips at the same time.

[0068] Those skilled in the art can understand that the above-mentioned solution of the process head group including two bonding heads or two pickup heads is only a non-limiting implementation method provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the scope of protection of the present invention. Optionally, in other embodiments, those skilled in the art can also appropriately increase the number of process heads based on the concept of the present invention, replace or make compatible with different types of process heads to meet the requirements of different process processing flows, so as to reduce adjustment time, improve work efficiency, be compatible with chips of different sizes and types, and expand the technical effects of application scenarios.

[0069] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0070] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0071] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0072] In summary, the present invention provides an inverted bonding process device, an inverted bonding process method, and a computer-readable storage medium, which can process multiple different types of chips in one action, thereby improving the compatibility of the machine and expanding the application scenarios. At the same time, it can also accurately and synchronously adjust multiple process heads in real time according to process requirements, reduce adjustment time, and thus improve the accuracy, efficiency and production capacity of the machine.

[0073] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A process device for inverted bonding, characterized in that: include: Multiple process heads for acquiring multiple chips for process processing; A plurality of micro-motion structures, respectively connected to the process heads, for adjusting the positions of the plurality of process heads; A linear motor module for the multiple process heads to adjust the spacing thereon synchronously; as well as The controller is configured to: synchronously and initially adjust the spacing between the multiple process heads through the linear motor module according to the target positions of the multiple process heads; And according to the target postures of the multiple process heads, the postures of the multiple process heads are synchronously and precisely adjusted through the multiple micro-motion structures so that the multiple chips thereon meet the target postures of the process treatment.

2. The process device according to claim 1, characterized in that: The multiple process heads are multiple bonding heads, and the step of synchronously pre-adjusting the spacing between the multiple process heads by the linear motor module according to the target positions of the multiple process heads includes: Determining target handover positions of the plurality of bonding heads according to the handover positions of the plurality of pickup heads; and The linear motor module is used to synchronously adjust the spacing between the multiple bonding heads.

3. The process device according to claim 2, characterized in that: The step of synchronously and precisely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon meet the target postures of the process treatment comprises: Determining target handover postures of the plurality of bonding heads according to the handover postures of the plurality of pickup heads; and The positions of the multiple bonding heads are precisely adjusted synchronously through the multiple micro-motion structures so as to conform to the target handover posture.

4. The process device according to claim 3, characterized in that: The step of synchronously preliminarily adjusting the spacing between the multiple process heads by the linear motor module according to the target positions of the multiple process heads also includes: In response to the plurality of bonding heads receiving the plurality of chips, acquiring bonding positions of the plurality of chips according to a wafer map of an inverted wafer to be bonded; Determining target bonding positions of the plurality of bonding heads according to the bonding positions of the plurality of chips; and The linear motor module is used to synchronously adjust the spacing between the multiple bonding heads.

5. The process device according to claim 4, characterized in that: The step of synchronously and precisely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon meet the target postures of the process further includes: Determining bonding postures of the plurality of chips according to a plurality of die bonding areas in the wafer map; Determining target bonding postures of the plurality of bonding heads according to the bonding postures of the plurality of chips; By using the multiple micro-motion structures, the positions of the multiple bonding heads are precisely adjusted synchronously so that the multiple chips thereon meet the target bonding posture; and The plurality of bonding heads are driven to rise, so as to raise the plurality of chips and bond them to the patch area.

6. The process device according to claim 1, characterized in that: The multiple process heads are multiple pickup heads, and the step of synchronously initially adjusting the spacing between the multiple process heads through the linear motor module according to the target positions of the multiple process heads includes: Determining target picking positions of the plurality of picking heads according to positions of the plurality of chips to be picked up on the wafer disk; and The linear motor module is used to synchronously adjust the spacing between the multiple pickup heads.

7. The process device according to claim 6, characterized in that: The step of synchronously and precisely adjusting the postures of the multiple process heads through the multiple micro-motion structures according to the target postures of the multiple process heads so that the multiple chips thereon meet the target postures of the process treatment comprises: Determining target picking postures of the plurality of process heads according to the current postures of the plurality of chips to be picked up; and The positions and postures of the multiple process heads are synchronously and precisely adjusted through the multiple micro-motion structures so as to conform to the target picking posture.

8. The process device according to claim 2 or 6, characterized in that: The plurality of bonding heads include bonding heads of various sizes, or the plurality of pickup heads include pickup heads of various sizes.

9. The process device according to claim 1, characterized in that: The micro-motion structure includes a first micro-motion part and a second micro-motion part, wherein the first micro-motion part drives the process head to perform translational micro-motion in the X-axis direction and / or the Y-axis direction, and the second micro-motion part drives the process head to perform rotational micro-motion around the Z-axis direction.

10. The process device according to claim 1, characterized in that: Also includes: A grating ruler, located below the plurality of process heads; as well as A reading head is located in each of the process heads and reads the coordinates of each of the process heads through the grating ruler.

11. A process for inverted bonding, characterized in that: The following steps are involved: According to the target positions of the multiple process heads in the inverted bonding process device according to any one of claims 1 to 10, the spacing of the multiple process heads is synchronously initially adjusted by a linear motor module; as well as According to the target postures of the multiple process heads, the postures of the multiple process heads are synchronously and precisely adjusted through multiple micro-motion structures so that the multiple chips thereon conform to the target postures of the process treatment.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the inverted bonding process method as claimed in claim 11 is implemented.

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