Semiconductor process machine and process method

Abstract

The invention discloses a semiconductor process machine table and a process method. The process machine table comprises a pickup device, wherein the pickup device comprises two pickup heads; the bonding equipment and the pickup equipment are arranged at an interval, and the bonding equipment comprises two bonding heads; and a controller configured to: in response to the first pick-up head picking up the first chip at the chip pick-up position, the second pick-up head and the second bonding head handover the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position; and in response to the two pick-up heads respectively completing a pick-up action and a handover action, and / or in response to the two bonding heads respectively completing a bonding work and a handover action, controlling the two pick-up heads and / or the two bonding heads to move oppositely at the same time, so that each pick-up head and / or each bonding head return to an initial position. According to the invention, the vibration interference among the process modules in the machine can be reduced, the bonding quality is improved, and the bonding efficiency can be improved, so that the productivity of the machine is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a semiconductor process machine, a semiconductor process method, and a computer-readable storage medium. Background Art

[0002] In the semiconductor process, such as Figure 1 As shown, the semiconductor process machine 100 includes multiple process modules, such as a pick-up module 110 and a bonding module 120, and the multiple modules are interconnected. Since the accuracy of the motion axis is easily affected by the acceleration force in the same direction, in order to ensure the bonding accuracy during the bonding process, other modules (such as the pick-up module) are required to be as still as possible. However, this limitation leads to the process machine being unable to balance the unit hourly output (Units Per Hour, UPH) and bonding accuracy in bonding process projects with relatively high requirements for timing control.

[0003] When a process module moves, the vibration it generates will interfere with the adjacent modules. During the bonding process, stability is a very important factor in the design of chip to wafer bonding equipment. Since other process modules are in motion, for example, the pickup module 110 will vibrate when picking up a chip, the interference caused by the vibration of these other modules will cause the bonding quality of the bonding module 120 to deteriorate.

[0004] In order to solve the above problems existing in the prior art, the art urgently needs an improved semiconductor process technology that can reduce the vibration interference between the process modules in the machine, improve the bonding quality, and at the same time improve the bonding efficiency, thereby greatly improving the machine production capacity. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor process equipment, a semiconductor process method, and a computer-readable storage medium, which can reduce the vibration interference between the process modules in the machine, improve the bonding quality, and at the same time improve the bonding efficiency, thereby greatly improving the machine's production capacity.

[0007] Specifically, the semiconductor process machine provided according to the first aspect of the present invention comprises: a pick-up device, comprising two pick-up heads; a bonding device, spaced apart from the pick-up device, comprising two bonding heads; and a controller, configured to: in response to the first pick-up head picking up the first chip at the chip picking position, the second pick-up head and the second bonding head handing over the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position; and in response to the two pick-up heads completing the pick-up action and the handover action respectively, and / or in response to the two bonding heads completing the bonding work and the handover action respectively, control the two pick-up heads and / or the two bonding heads to move towards each other at the same time, so that each of the pick-up heads and / or each of the bonding heads returns to the initial position respectively.

[0008] Furthermore, in some embodiments of the present invention, it further comprises: two active vibration absorbers, and the two active vibration absorbers are arranged at an interval to independently carry the picking device and the bonding device respectively.

[0009] Furthermore, in some embodiments of the present invention, the pickup machine includes a wafer table, and the wafer table extends into the interior of the bonding device so that the bonding device can obtain a plurality of chips to be picked up.

[0010] Furthermore, in some embodiments of the present invention, the bonding device includes an inverted tray assembly located above the bonding head, for fixing the wafer invertedly above the bonding head with the bonding surface of the wafer facing downward.

[0011] Furthermore, in some embodiments of the present invention, the inverted tray assembly includes an inverted suction cup and an L-shaped lifting pin, which is used to receive the wafer when the L-shaped lifting pin descends, so that the wafer is located on the bottom surface of the L-shaped lifting pin, and to drive the wafer to rise when the L-shaped lifting pin rises, and to be adsorbed and fixed by the inverted suction cup.

[0012] Furthermore, in some embodiments of the present invention, the bonding equipment also includes: a wafer vision component, located below the inverted tray assembly, for obtaining a wafer image of the inverted wafer above it, wherein the wafer image includes multiple patch marks for indicating the target bonding position of each chip.

[0013] Furthermore, in some embodiments of the present invention, the bonding device also includes a motion platform for driving the two bonding heads located thereon to perform macro movements in the X, Y, and Z directions so as to adjust the positions of the two bonding heads carrying the two chips to be below the two target bonding positions, and the bonding head includes a micro-motion mechanism for driving the bonding head to perform micro-movements in the X, Y, and Rz directions so as to adjust the position of the chip on each of the bonding heads to the corresponding target bonding position.

[0014] Furthermore, in some embodiments of the present invention, the picking device includes a downward-looking camera, which is arranged above the chip picking position, and the step of the first picking head picking up the first chip includes: identifying the position and posture of the first chip at the chip picking position through the downward-looking camera; adjusting the downward-looking camera in the direction of the X-axis and / or the Y-axis and / or the Z-axis to align and focus the downward-looking camera on the first chip; and in response to the downward-looking camera aligning and focusing the first chip, controlling the first picking head to pick up the first chip at the chip picking position.

[0015] Furthermore, in some embodiments of the present invention, it also includes: a posture correction camera, which is arranged above the handover position, and the step of handing over the second chip between the second pick-up head and the second bonding head at the handover position includes: identifying the current position and posture of the second chip located on the second pick-up head at the handover position through the posture correction camera; correcting the position of the second chip through the second pick-up head based on the current position and posture of the second chip; and controlling the second bonding head to receive the second chip from the second pick-up head in response to the completion of the position correction of the second chip.

[0016] Further, in some embodiments of the present invention, in response to the two pick-up heads completing the picking action and the handover action respectively, and / or in response to the two bonding heads completing the bonding work and the handover action respectively, the step of controlling the two pick-up heads and / or the two bonding heads to move toward each other at the same time so that each of the pick-up heads and / or each of the bonding heads returns to the initial position respectively includes: in response to the first pick-up head completing the picking action and the second pick-up head completing the handover action, controlling the first pick-up head and the second pick-up head to move toward each other simultaneously in the X-axis direction; Move towards each other to exchange positions, the first pick-up head moves to the handover position, and the second pick-up head moves to the wafer picking position to perform the next round of picking action and handover action, and / or in response to the first bonding head completing the bonding action, and the second bonding head completing the handover action, control the first bonding head and the second bonding head to move towards each other in the X-axis direction at the same time to exchange positions, the first bonding head moves to the handover position, and the second bonding head moves to the bonding position to perform the next round of handover action and bonding action.

[0017] Furthermore, in some embodiments of the present invention, it also includes: two foundations, used to respectively support the pickup device and the bonding device, wherein the two foundations are spaced apart, and the anti-micro-vibration control standard of each foundation is VC-C level.

[0018] In addition, the above-mentioned semiconductor process method provided according to the second aspect of the present invention includes the following steps: in response to the first pick-up head picking up the first chip at the chip picking position, the second pick-up head and the second bonding head handing over the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position; and in response to the two pick-up heads completing the picking action and the handover action respectively, and / or in response to the two bonding heads completing the bonding work and the handover action respectively, controlling the two pick-up heads and / or the two bonding heads to move toward each other at the same time, so that each of the pick-up heads and / or each of the bonding heads returns to the initial position respectively.

[0019] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the semiconductor process method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 The structural schematic diagram of the process equipment in the prior art is shown;

[0022] Figure 2 A schematic structural diagram of a semiconductor process equipment provided according to some embodiments of the present invention is shown;

[0023] Figure 3 A schematic structural diagram of a semiconductor process device provided according to some other embodiments of the present invention is shown;

[0024] Figure 4 A schematic diagram of a top view of a pickup device provided according to some embodiments of the present invention is shown;

[0025] Figure 5 A schematic structural diagram of an inverted tray assembly provided according to some embodiments of the present invention is shown;

[0026] Figure 6 A flowchart showing a semiconductor process method provided according to some embodiments of the present invention; and

[0027] Figure 7 A schematic diagram of the process of chip picking, handover and bonding provided according to some embodiments of the present invention is shown.

[0028] Reference numerals:

[0029] 100, 200 semiconductor process equipment;

[0030] 110 Pickup module;

[0031] 120 bonding module;

[0032] 210 Pickup Equipment;

[0033] 211 Pickup Head;

[0034] 220 Bonding equipment;

[0035] 221 Bonding head;

[0036] 231, 232 Active shock absorbers;

[0037] 310 foundation;

[0038] 311 Steel structure;

[0039] 320 Inverted tray assembly;

[0040] 401 wafer stage;

[0041] 410 first pickup head;

[0042] 420 second pickup head;

[0043] 431 X-axis linear module;

[0044] 432 Y-axis linear module;

[0045] Steps S610 to S620;

[0046] 701 First Chip;

[0047] 702 second chip;

[0048] 703 third chip;

[0049] 704 wafer;

[0050] 710 a first bonding head; and

[0051] 720 Second bonding head. DETAILED DESCRIPTION

[0052] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0053] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0055] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0056] As mentioned above, Figure 1As shown, the semiconductor process machine 100 includes multiple process modules, such as a pick-up module 110 and a bonding module 120, and the multiple modules are interconnected. Since the accuracy of the motion axis is easily affected by the acceleration force in the same direction, in order to ensure the bonding accuracy during the bonding process, other modules (such as the pick-up module) are required to be as still as possible. However, in the bonding process project with relatively high requirements for timing control, it is not possible to take into account the unit hourly output (Units Per Hour, UPH) and bonding accuracy. When a process module moves, the vibration it generates will interfere with the adjacent modules. In the bonding process, stability is a very important factor in the design process of chip to wafer bonding equipment. Due to the existence of other process modules in motion, for example, the pick-up module 110 will vibrate when picking up the chip, and the interference caused by the vibration of these other modules will cause the bonding quality of the bonding module 120 to decrease.

[0057] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a semiconductor process equipment, a semiconductor process method, and a computer-readable storage medium, which can reduce the vibration interference between the process modules in the machine, improve the bonding quality, and at the same time improve the bonding efficiency, thereby greatly improving the machine's production capacity.

[0058] In some non-limiting embodiments, the semiconductor process equipment provided in the first aspect of the present invention can be used to implement the semiconductor process method provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention has computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the semiconductor process method provided in the second aspect of the present invention.

[0059] The working principle of the above-mentioned semiconductor process equipment will be described below in conjunction with some embodiments of semiconductor process methods. Those skilled in the art will understand that these embodiments of semiconductor process methods are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the semiconductor process equipment. Similarly, the semiconductor process equipment is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these semiconductor process methods.

[0060] Please see Figure 2 , Figure 2 A schematic structural diagram of a semiconductor process equipment provided according to some embodiments of the present invention is shown.

[0061] like Figure 2As shown, in some embodiments of the present invention, the semiconductor process machine 200 may include a pickup device 210, a bonding device 220 and a controller (not shown in the drawings). The pickup device 210 may include a pickup head 211, and the bonding device 220 may include a bonding head 221.

[0062] Furthermore, if Figure 2 As shown in the locally enlarged area I in the figure, the bonding device 220 and the picking device 210 are spaced apart. Preferably, the spacing distance d between the two devices can be about 10 mm. Therefore, the vibrations generated by the two devices during movement do not interfere with each other, thereby isolating the interference of other vibration sources and improving the bonding quality. In this embodiment, the pickup module 110 and the bonding module 120 that generate larger vibrations in the semiconductor process machine 100 in the prior art are separated and divided into two independent process devices, the pickup device 210 and the bonding device 220, so that the vibration sources from each other can be effectively isolated, the vibration interference can be reduced, and the accuracy of picking up the chip and the picking rate can be ensured during the picking process. At the same time, it can also ensure that there will be no interference from the vibration of other modules during the bonding process, isolating 90% of the vibration interference and improving the bonding quality.

[0063] On this basis, since the associated process modules in a semiconductor process machine are split into two independent process devices, each process device has increased a certain amount of space. Thanks to the increase in space of each process device, the number of process heads can be increased in the pick-up device 210 and the bonding device 220 to improve the bonding efficiency. For example, the pick-up device 210 may include two bonding heads 221, and the bonding device 220 may include two bonding heads 221. In this embodiment, the number of multiple bonding heads in the bonding device 220 can correspond to the number of multiple pick-up heads in the pick-up device 210, so that each bonding head can pick up the chip to be bonded from the corresponding pick-up head, thereby improving the number of wafers per hour (Unit Per Hour, UPH) of the semiconductor process machine 200.

[0064] like Figure 2As shown, in some optional embodiments, the semiconductor process machine 200 may include two active vibration absorbers for attenuating foundation vibration and direct load disturbance to maintain the stability of the load platform of the process equipment. Specifically, four active vibration absorbers 231 may be provided at the four corners below the pickup device 210 to support the pickup device 210. Four active vibration absorbers 232 may also be provided at the four corners below the bonding device 220 to support the bonding device 220. In addition, the two active vibration absorbers 231 and 232 are also spaced apart from each other to independently carry the pickup device 210 and the bonding device 220, respectively. By adopting two spaced apart active vibration absorbers 231 and 232, the setting time of each process equipment carried by them can be reduced, and the accuracy and efficiency of the bonding and picking processes can be improved.

[0065] Further, optionally, see Figure 3 , Figure 3 A schematic structural diagram of semiconductor process equipment provided according to some other embodiments of the present invention is shown.

[0066] like Figure 3 As shown, in some embodiments, the semiconductor process machine 200 may also include two foundations 310 (foundation) for carrying the pickup device 210 and the bonding device 220 respectively, wherein the two foundations 310 may also be spaced apart, for example, the spacing distance d between the two foundations may also be about 10 mm. Further, the anti-micro-vibration control standard of each foundation 310 is VC-C grade. Generally speaking, the grades of the foundation may include VC-A, VC-B, VC-C and VC-D, wherein VC-A has the lowest grade, VC-D has the highest grade, and has the best anti-micro-vibration effect. The higher the grade, the higher the cost, the greater the construction difficulty and cycle. In this embodiment, combined with the anti-micro-vibration requirements, cost and delivery period of the semiconductor process machine 200, a VC-C grade foundation 310 is preferably used to support the pickup device 210 and the bonding device 220 respectively.

[0067] Continue as Figure 3 As shown, in some embodiments, the pick-up device 210 and the bonding device 220 can be mounted on the foundation 310 of the VC-C through a steel structure 311, so that the pick-up head 211 and the bonding head 221 can be smoothly connected during the connection process. Through the cooperation of the two sets of steel structures 311 and the foundation 310, when the bonding head 221 is bonding the chip, the vibration caused by the pick-up head 211 during the chip picking and movement process will not affect the bonding head, so that the equipment runs more smoothly and the bonding accuracy can also be improved.

[0068] Next, see Figure 4 , Figure 4 A schematic diagram of the top view of the structure of a pickup device provided according to some embodiments of the present invention is shown.

[0069] like Figure 4 As shown, in some embodiments, the pick-up device 210 may include a wafer table 401. The wafer table 401 may hold multiple cut chips for the first pick-up head 410 and / or the second pick-up head 420 to pick up the chips. Optionally, the first pick-up head 410 and the second pick-up head 420 may be symmetrically arranged so that two chips can be picked up at the same time, thereby improving the efficiency of picking up the chips.

[0070] Furthermore, if Figure 4 As shown, part of the wafer table 401 in the picking device 210 can extend into the interior of the bonding device 220 next to it, which not only makes the space of the entire machine more compact and occupies a smaller area, but also shortens the handover path between the picking head and the bonding head, so that the bonding device 220 can quickly obtain the several chips to be picked up.

[0071] Specifically, the picking device 210 may also include a plurality of linear modules. Figure 4 As shown, the pick-up device 210 may include an X-axis linear module 431 and a Y-axis linear module 432. The first pick-up head 410 and the second pick-up head 420 may be mounted on the Y-axis linear module 432, and the Y-axis linear module 432 may be mounted on the X-axis linear module 431, so that the first pick-up head 410 and the second pick-up head 420 can be moved forward, backward, left and right to transfer the chip. Further, the X-axis linear module 431 may also partially extend into the bonding device 220 to shorten the handover path of the first pick-up head 410 and / or the second pick-up head 420. The bonding device 220, after receiving the chip from the pick-up device 210, can perform chip-to-wafer bonding.

[0072] Please combine Figure 3 and Figure 5 , Figure 5 A schematic structural diagram of an inverted tray assembly provided according to some embodiments of the present invention is shown.

[0073] like Figure 3 As shown, in some embodiments, an inverted tray assembly 320 may be provided above the bonding device 220. Specifically, the inverted tray assembly 320 may be located above the bonding head, and is used to fix the wafer invertedly above the bonding head with the bonding surface of the wafer facing downward.

[0074] Specifically, in some optional embodiments, the inverted tray assembly 320 may include an inverted suction cup 321 and an L-shaped lifting pin 322. Specifically, when the L-shaped lifting pin 322 descends, there is a certain space between it and the inverted suction cup 321, which can receive the wafer. At this time, the wafer can be placed on the bottom surface of the L-shaped lifting pin 322. Subsequently, when the L-shaped lifting pin rises, the wafer can be driven to rise and fixed by the inverted suction cup 321.

[0075] After the bonding target wafer is fixed, the posture of each bonding head in the bonding device 220 can be adjusted to bond the received chip to be bonded to the target bonding position of the wafer from bottom to top.

[0076] In some embodiments, the bonding device 220 may further include a wafer vision component, which is located below the inverted tray component 320 and is used to obtain a wafer map of the inverted wafer above it, wherein the wafer map may include multiple patch marks to indicate the target bonding position of each chip. Optionally, the wafer vision component may be provided in the motion platform in the bonding device 220.

[0077] In some embodiments, the motion platform can be used to drive the two bonding heads located thereon to perform macro movements in the X, Y, and Z directions, so as to adjust the positions of the two bonding heads carrying multiple chips to be located below the two target bonding positions at the same time. Furthermore, the bonding head may also include a micro-motion mechanism for driving the bonding head to perform micro-movements in the X, Y, and Rz directions (rotation around the Z-axis direction) to adjust the position of the chip on each bonding head to the corresponding target bonding position. For example, the chip position corresponding to the target bonding position in the center area of ​​the wafer requires the chip to present a certain tilt angle in order to be fully fitted, while the chip position corresponding to the target bonding position in the center area of ​​the wafer requires the chip to remain horizontal in order to be fully fitted.

[0078] The controller in the semiconductor process machine 200 provided by the present invention can be used to execute each step in the semiconductor process method of another aspect of the present invention. The controller can perform asynchronous timing multi-chip picking, handover and bonding processes for multiple chips bonded to the same wafer based on two pick-up heads in the pick-up device 210 in the semiconductor process machine 200 and the bonding head in the bonding device 220 spaced therefrom, and improve the timing planning, handover method and mounting logic, thereby improving the bonding efficiency and the machine production capacity.

[0079] Specifically, see Figure 6 , Figure 6 A flow chart of a semiconductor process method provided according to some embodiments of the present invention is shown.

[0080] like Figure 6As shown, in some embodiments of the present invention, the semiconductor process method may include the following steps. First, step S610 may be performed: in response to the first pick-up head picking up the first chip at the chip picking position, the second pick-up head and the second bonding head handing over the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position.

[0081] Specifically, see Figure 7 , Figure 7 A schematic diagram of the process of chip picking, handover and bonding provided according to some embodiments of the present invention is shown.

[0082] like Figure 7 As shown in the A and B areas in FIG. 4 , the wafer stage 401 has the function of expanding and rotating the UV film, and can also move in the XY direction to move the wafer stage 401 to the wafer picking position. A pin can be provided below the wafer stage 401 to lift the chip so that the chip can be removed from the film.

[0083] In this embodiment, the chip picking position and the handover position of the two pick-up heads are at the same position. Taking the complete picking, handover and bonding process of the first chip 801 as an example, a set of pick-up heads and bonding heads are required to cooperate and complete, for example, the first pick-up head 410 and the first bonding head 710.

[0084] like Figure 7 As shown in the A area in FIG. 1 , the first pickup head 410 performs a downward pressing picking action in the Z-axis direction at the chip picking position, and does not flip after picking up the first chip 701 from the wafer table 401, but continues to perform the X-axis positive ( Figure 7 The first chip 701 is moved to the handover position and handed over to the corresponding first bonding head located below it. Then, after the first bonding head obtains the first chip 701, it does not flip over and continues to move in the positive direction of the X axis ( Figure 7 The first chip 701 is moved to the bonding position by moving the first bonding head 701 to the right in the middle. Then, at the bonding position, the first bonding head bonds the first chip 701 to the bonding surface of the inverted wafer 704 from bottom to top.

[0085] Furthermore, since the semiconductor processing machine 200 may include two pick-up heads and two bonding heads, and each pick-up head and each bonding head do not interfere with each other. Figure 7 As shown in the A and B areas in FIG. 1 , in order to ensure that the maximum UPH is achieved, when the first pick-up head 410 picks up the first chip 701 at the chip picking position, its corresponding first bonding head 710 can bond the third chip 703 at the bonding position. At this time, another set of pick-up head bonding heads, i.e., the second pick-up head 420 and the second bonding head 720, can perform the handover action of the second chip 802 at the handover position.

[0086] Preferably, the semiconductor process machine 200 may include a downward camera. The downward camera may be arranged above the chip picking position in the pickup device 210. The step of the first pickup head 410 picking up the first chip 701 at the chip picking position may further include: identifying the position and posture of the first chip 701 at the chip picking position by the downward camera, and then the controller may adjust the downward camera in the direction of the X-axis and / or the Y-axis and / or the Z-axis so that the downward camera is aligned and focused on the first chip 701 to be picked up on the wafer table 401, and the position and posture of the first chip 701 before picking up is obtained. Then, by adjusting the position of the wafer table 401, the position of the first chip 801 to be picked up may be corrected so that it is within the range of the chip picking position, so that the first pickup head 410 can pick up the chip. After the controller obtains the position and posture of the first chip 701 via the downward camera, the first pickup head 410 may be controlled to pick up the first chip 701 at the chip picking position. Those skilled in the art can understand that both the first pickup head and the second pickup head can pick up different chips at the chip picking position, and here only the first pickup head picking up the first chip is taken as an example for illustration.

[0087] In some other optional embodiments, the semiconductor process machine 200 may further include a posture correction camera. The posture correction camera may be arranged above the handover position between the pickup device 210 and the bonding device 220, and is used to identify the current position and posture of the second chip 702 located on the second pickup head 420 at the handover position. Then, based on the current position and posture of the second chip 702, the controller may correct the position of the second chip 702 through the second pickup head 420, and after the second chip 702 completes the position correction, control the second pickup head 420 to hand over the second chip 802 from top to bottom to the second bonding head 720. By configuring the posture correction camera, the handover accuracy can be improved.

[0088] When the first pick-up head picks up the first chip at the chip picking position and the second pick-up head and the second bonding head hand over the second chip at the handover position, the controller can control the first bonding head 710 to perform chip bonding. The controller can adjust the position and posture of the first bonding head 710 carrying the third chip 703 according to the target bonding position of the third chip 703 in the wafer map, and finally press upward to accurately attach the third chip 703 to the target bonding position.

[0089] Please continue to return Figure 6 , step S620 can be executed: in response to the two picking heads completing the picking mechanism and the handover action respectively, and / or in response to the two bonding heads completing the bonding work and the handover action respectively, the two picking heads and / or the two bonding heads are controlled to move towards each other at the same time, so that each picking head and / or each bonding head returns to the initial position respectively.

[0090] Specifically, in some embodiments, after the first pickup head 410 and the second pickup head 420 complete the picking action and the handover action respectively, the first pickup head 410 and the second pickup head 420 can simultaneously move toward each other in the X-axis direction to exchange positions, that is, the first pickup head 410 moves to the handover position, and the second pickup head 420 moves to the film picking position to perform the next round of picking action and handover action. Since the film picking positions of the two pickup heads are in the same position, before the two pickup heads move toward each other, one of the pickup heads needs to move in the Y-axis direction to avoid first, and then the two pickup heads can move toward each other in the X-axis direction. In this embodiment, the offset of the acceleration force brought about by the simultaneous movement of the two pickup heads toward each other can further meet the timing requirements, improve the setting time of the machine, thereby improving the bonding efficiency and the production capacity of the machine.

[0091] Optionally, during the wafer transfer process between the picking device 210 and the bonding device 220, the wafer vision component in the motion platform can scan the wafer image of the wafer to be bonded located above it to obtain multiple patch marks on the wafer image, thereby determining multiple target bonding positions of multiple chips (for example, the first chip 701, the second chip 702 and the third chip 703).

[0092] like Figure 7 As shown, after the first bonding head 710 moves to below the target bonding position, the Z-axis lifting motor can be used to drive the first bonding head 710 to rise, thereby lifting the third chip 703 on the first bonding head 710 and pressing it against the wafer 704 located above it, thereby completing the chip-to-wafer inverted bonding process.

[0093] Preferably, after the first bond head 710 and the second bond head 720 complete the handover and bonding processes respectively, the first bond head 711 and the second bond head 720 can also simultaneously move toward each other in the X-axis direction to exchange positions, that is, the first bond head 710 moves to the handover position, and the second bond head 720 moves to the bonding position. In this embodiment, during the movement of the bond heads, the two bond heads need to move relative to each other as much as possible during motion control. The offset of the acceleration force brought about by the simultaneous opposite movement of the two groups of bond heads can not only meet the timing requirements and improve the setting time of the machine, but also reduce the vibration due to the offset of the acceleration force, ensure the positioning accuracy and the accuracy of subsequent bonding, thereby improving the bonding efficiency and the production capacity of the machine.

[0094] In the process of the two pick-up heads or the two bonding heads moving towards each other at the same time to quickly exchange positions, the acceleration forces between the two pick-up heads or the two bonding heads are respectively ensured to be in opposite directions. Since F=ma, the travel of the pick-up heads or the two bonding heads can be controlled by ensuring that the mass of the two pick-up heads or the two bonding heads is inversely proportional to the acceleration as much as possible.

[0095] Those skilled in the art will understand that Figure 7 The scheme in which the first pickup head 410 is used for picking up the film, the second pickup head 420 and the second bonding head 720 are used for handover, and the first bonding head 710 is used for bonding is only a non-limiting implementation provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific scheme that is convenient for the public to implement, rather than to limit the protection scope of the present invention. Each pickup head can be located at the film picking position to pick up the film, or at the handover position to handover, and each bonding head can also be located at the handover position to handover, or at the bonding position to bond.

[0096] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0097] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0098] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0099] In summary, the present invention provides a semiconductor process equipment, a semiconductor process method, and a computer-readable storage medium, which can reduce the vibration interference between the process modules in the machine, improve the bonding quality, and at the same time improve the bonding efficiency, thereby greatly improving the machine's production capacity.

[0100] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor process machine, characterized in that: include: A picking device, including two picking heads; a bonding device, spaced apart from the pickup device, comprising two bonding heads; and a controller configured to: in response to the first pick-up head picking up the first chip at the chip picking position, the second pick-up head and the second bonding head handing over the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position; In response to the two pick-up heads completing the pick-up action and the hand-over action respectively, and / or in response to the two bonding heads completing the bonding work and the hand-over action respectively, the two pick-up heads and / or the two bonding heads are controlled to move toward each other at the same time, so that each pick-up head and / or each bonding head returns to its initial position respectively.

2. The semiconductor processing machine according to claim 1, wherein: Also includes: Two active vibration absorbers are arranged at an interval to independently carry the picking device and the bonding device respectively.

3. The semiconductor processing machine according to claim 1, wherein: The pickup machine includes a wafer table, and the wafer table extends into the interior of the bonding device so that the bonding device can obtain a plurality of chips to be picked up.

4. The semiconductor processing machine according to claim 1, wherein: The bonding device comprises an inverted tray assembly, which is located above the bonding head and is used for fixing the wafer invertedly above the bonding head with the bonding surface of the wafer facing downward.

5. The semiconductor processing machine according to claim 4, wherein: The inverted tray assembly includes an inverted suction cup and an L-shaped lifting pin, which is used to receive the wafer when the L-shaped lifting pin descends so that the wafer is located on the bottom surface of the L-shaped lifting pin, and to drive the wafer to rise when the L-shaped lifting pin rises, and to be adsorbed and fixed by the inverted suction cup.

6. The semiconductor processing machine according to claim 4, wherein: The bonding equipment also includes: a wafer vision component, located below the inverted tray component, for obtaining a wafer image of the inverted wafer above it, wherein the wafer image includes a plurality of patch marks for indicating a target bonding position of each chip.

7. The semiconductor processing machine according to claim 6, wherein: The bonding device further includes a motion platform for driving the two bonding heads thereon to perform macro motion in the X, Y, and Z directions, so as to adjust the positions of the two bonding heads carrying the two chips to be located below the two target bonding positions, and The bonding head includes a micro-motion mechanism for driving the bonding head to perform micro-motion in the X, Y and Rz directions, so as to adjust the position of the chip on each bonding head to correspond to the target bonding position.

8. The semiconductor processing machine according to claim 1, wherein: The picking device includes a downward-looking camera disposed above the chip picking position, and the step of the first picking head picking up the first chip includes: Identifying the position and posture of the first chip at the chip picking position by the downward-looking camera; Adjusting the downward-looking camera in the direction of the X-axis and / or the Y-axis and / or the Z-axis so that the downward-looking camera is aligned and focuses on the first chip; and In response to the downward-looking camera aligning and focusing on the first chip, the first pickup head is controlled to pick up the first chip at a chip picking position.

9. The semiconductor processing machine according to claim 1, wherein: Also includes: The posture correction camera is arranged above the handover position, and the step of handing over the second chip by the second pickup head and the second bonding head at the handover position includes: Identifying the current position and posture of the second chip on the second pickup head at the handover position by means of the posture correction camera; Based on the current position and posture of the second chip, correcting the position of the second chip by the second pickup head; and In response to the second chip completing position correction, controlling the second bonding head to receive the second chip from the second pickup head.

10. The semiconductor processing machine according to claim 1, wherein: In response to the two pick-up heads completing the pick-up action and the handover action respectively, and / or in response to the two bonding heads completing the bonding work and the handover action respectively, the steps of controlling the two pick-up heads and / or the two bonding heads to move toward each other simultaneously so that each of the pick-up heads and / or each of the bonding heads returns to an initial position respectively include: In response to the first pickup head completing the picking action and the second pickup head completing the handover action, the first pickup head and the second pickup head are controlled to move toward each other simultaneously in the X-axis direction to exchange positions, the first pickup head moves to the handover position, and the second pickup head moves to the film picking position to perform the next round of picking action and handover action, and / or In response to the first bond head completing the bonding action and the second bond head completing the handover action, the first bond head and the second bond head are controlled to move toward each other simultaneously in the X-axis direction to exchange positions, the first bond head moves to the handover position, and the second bond head moves to the bonding position to perform the next round of handover action and bonding action.

11. The semiconductor processing machine according to claim 1, wherein: Also includes: Two foundations are used to respectively support the pickup device and the bonding device, wherein the two foundations are spaced apart and the anti-micro-vibration control standard of each foundation is VC-C level.

12. A semiconductor process method, characterized in that: The following steps are involved: In response to the first pick-up head picking up the first chip at the chip picking position, the second pick-up head and the second bonding head handing over the second chip at the handover position, and the first bonding head bonding the third chip at the bonding position; as well as In response to the two pick-up heads completing the pick-up action and the hand-over action respectively, and / or in response to the two bonding heads completing the bonding work and the hand-over action respectively, the two pick-up heads and / or the two bonding heads are controlled to move toward each other at the same time, so that each pick-up head and / or each bonding head returns to its initial position respectively.

13. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the semiconductor process method according to claim 12 is implemented.

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