Identifier recognition device and method

Abstract

The invention discloses an identifier recognition device and method. The identification recognition device comprises a light source for providing an alignment light beam; the image acquisition assembly comprises a corner structure and an optical imaging system which are located between the light source and the chip, the corner structure receives the alignment light beam and adjusts the pose of the image acquisition assembly to adjust the light path of the alignment light beam, so that the alignment light beam is aligned to the identification position of the chip, and the optical imaging system is used for imaging the chip. And the optical imaging system obtains the identification pattern on the chip and identifies the identification pattern. According to the identification identification device, the size of the identification device can be reduced, and the limitation of the structure of the identification device on identification identification on a small-size chip is eliminated, so that the identification identification device can be compatible with chips with various different sizes to carry out identification identification on the chips.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to an identification device, an identification method, and a computer-readable storage medium. Background Art

[0002] As chip size decreases, the demand for high-density integration technology becomes increasingly urgent, and hybrid bonding technology becomes an important means to achieve this goal. Especially in the field of 3D packaging, hybrid bonding technology plays an irreplaceable role. According to the bonding object, it can be divided into wafer to wafer bonding, chip to wafer bonding, and chip to die bonding. Chip to wafer bonding is widely used. In addition to the traditional bonding of a single type of chip, it can realize several bonding of different types of chips. Different types of chips may have different sizes, so higher requirements are placed on the design of a series of related devices in the bonding step.

[0003] In the prior art, the identification device in the bonding equipment cannot identify the identification on the chip with a smaller size. Figure 1 As shown, the current identification recognition device 100 regards the left and right image acquisition components 110 and 120 as two independent individuals, and the middle optical path adjustment component 130 is composed of two independent triangular prisms 131 and 132. The two triangular prisms 131 and 132 cannot be completely fitted together, that is, there will be a spacing h between the two, which makes it impossible for the distance between the two alignment light beams 101 and 102 to be further reduced. Therefore, only the identification 141 and 142 on the chip 140 of regular size and above can be identified, and the identification on the chip smaller than the regular size cannot be well identified and located, which also makes it impossible to perform subsequent precise bonding of small-sized chips. In other words, the existing identification recognition device is not compatible with chips of different sizes.

[0004] In order to solve the above problems existing in the prior art, this field is in urgent need of an identification recognition technology that can reduce the size of the identification device and remove the restrictions of the structure of the identification device on identification recognition on small-sized chips, so that it can be compatible with chips of various sizes for identification recognition. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides an identification device, an identification method, and a computer-readable storage medium, which can reduce the size of the identification device and remove the limitations of the structure of the identification device on identification on small-sized chips, so that it can be compatible with a variety of chips of different sizes for identification.

[0007] Specifically, the above-mentioned identification recognition device provided according to the first aspect of the present invention includes: a light source, which provides an alignment light beam; an image acquisition component, which includes a corner structure and an optical imaging system located between the light source and the chip, wherein the corner structure receives the alignment light beam and adjusts the posture of the image acquisition component to adjust the optical path of the alignment light beam so that it is aligned with the identification of the chip, and the optical imaging system obtains the identification pattern on the chip and recognizes the identification pattern.

[0008] Furthermore, in some embodiments of the present invention, the chip includes two marks, and the corner structure includes a corner component group, which is respectively located on both sides above the chip to perform an optical path adjustment on the two received alignment light beams so that the two alignment light beams are respectively aligned with the two marks.

[0009] Furthermore, in some embodiments of the present invention, it also includes: a reflecting prism, located between the corner piece group, for receiving the two alignment light beams after the first optical path adjustment by the corner piece group, and performing a second optical path adjustment thereon, so that the two alignment light beams are respectively aligned to the two marks.

[0010] Furthermore, in some embodiments of the present invention, each corner piece in the corner piece group includes a 90° corner surface to perform a primary optical path adjustment of the two received alignment light beams by 90°, and the reflecting prism includes two 45° reflecting surfaces to perform a secondary optical path adjustment of the two alignment light beams by 45° after the primary optical path adjustment through the corner piece group.

[0011] Furthermore, in some embodiments of the present invention, the identification device also includes a controller, which is configured to: obtain a chip image of the chip, wherein the chip image includes two identifications; adjust the posture of the image acquisition component based on the size of the chip to adjust the optical path of the alignment light beam so that it is aligned with the identification of the chip; and obtain the identification pattern on the chip through the optical imaging system to identify the identification pattern.

[0012] Furthermore, in some embodiments of the present invention, the step of adjusting the posture of the image acquisition component based on the size of the chip to adjust the optical path of the alignment light beam so that it is aligned with the mark of the chip includes: in response to the size of the first chip being smaller than the conventional size, downwardly adjusting the position of the image acquisition component to approach the distance between the two alignment light beams so that it is aligned with the two marks of the first chip; and in response to the two alignment light beams being aligned with the two marks, adjusting the posture of any one or more of the corner piece group and / or the optical imaging system so that the two alignment light beams are located at the center of the two marks.

[0013] Furthermore, in some embodiments of the present invention, the step of adjusting the posture of the image acquisition component based on the size of the chip to adjust the optical path of the alignment light beam so that it is aligned with the mark of the chip includes: in response to the size of the second chip being larger than the conventional size, adjusting the position of the image acquisition component upward to increase the distance between the two alignment light beams so that they are aligned with the two marks of the second chip; and in response to the two alignment light beams being aligned with the two marks, adjusting the posture of any one or more of the corner piece group and / or the optical imaging system so that the two alignment light beams are located at the center of the two marks.

[0014] Further, in some embodiments of the present invention, the conventional-sized chip is a 4 mm chip, and the size of the first chip is greater than 1 mm and less than 4 mm.

[0015] Furthermore, in some embodiments of the present invention, the light source includes alignment beams of multiple bands, and the step of obtaining the chip image of the chip includes: switching the alignment beams of multiple bands provided by the light source to obtain the chip image of the chip corresponding to the alignment beams of the multiple bands; calculating the imaging contrast of the multiple chip images to obtain multiple imaging contrast values; and based on the multiple contrast imaging values, taking the alignment beam corresponding to the band with the highest contrast imaging value as the optimal alignment beam.

[0016] In addition, the above-mentioned identification recognition method provided in the second aspect of the present invention includes the following steps: obtaining a chip image of the chip, wherein the chip image includes the identification; based on the size of the chip, adjusting the posture of the image acquisition component in the above-mentioned identification recognition device provided by the first aspect of the present invention to adjust the optical path of the alignment light beam so that it is aligned with the identification of the chip; and based on the alignment light beam, obtaining the identification pattern on the chip to identify the identification pattern.

[0017] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned identification method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic diagram of the structure of a marking recognition device in the prior art is shown;

[0020] Figure 2 A schematic structural diagram of an identification recognition device provided in some embodiments of the present invention is shown;

[0021] Figure 3 A schematic diagram showing position adjustment of an identification recognition device provided in some embodiments of the present invention is shown; and

[0022] Figure 4 A flow chart of a method for identifying an identifier provided according to some embodiments of the present invention is shown.

[0023] Reference numerals:

[0024] 100, 200 identification device;

[0025] 110, 120 image acquisition component;

[0026] 130 optical path adjustment member;

[0027] 131, 132 triangular prism;

[0028] 101, 102 alignment beam;

[0029] 140, 230 chips;

[0030] 141, 142 logo;

[0031] 210 light source;

[0032] 220 image acquisition component;

[0033] 240 Corner structure;

[0034] 241 Corner piece set;

[0035] 242 Reflecting prism;

[0036] 250 Optical Imaging Systems;

[0037] 260 alignment beam;

[0038] 231, 232 logo;

[0039] 310 Regular size chip;

[0040] 320 First Chip;

[0041] 330 second chip; and

[0042] Steps S410 to S430. DETAILED DESCRIPTION

[0043] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0046] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0047] As mentioned above, in the prior art, the identification device in the bonding equipment cannot identify the identification on the chip with a smaller size. Figure 1 As shown, the current identification recognition device 100 regards the left and right image acquisition components 110 and 120 as two independent individuals, and the middle optical path adjustment component 130 is composed of two independent triangular prisms 131 and 132. The two triangular prisms 131 and 132 cannot be completely fitted together, that is, there will be a spacing h between the two, which makes it impossible for the distance between the two alignment light beams 101 and 102 to be further reduced. Therefore, only the identification 141 and 142 on the chip 140 of regular size and above can be identified, and the identification on the chip smaller than the regular size cannot be well identified and located, which also makes it impossible to perform subsequent precise bonding of small-sized chips. In other words, the existing identification recognition device is not compatible with chips of different sizes.

[0048] In order to solve the above-mentioned problems existing in the prior art, the present invention provides an identification device, an identification method, and a computer-readable storage medium, which can reduce the size of the identification device and remove the limitations of the structure of the identification device on identification on small-sized chips, so that it can be compatible with chips of various different sizes for identification.

[0049] In some non-limiting embodiments, the identification recognition device provided in the first aspect of the present invention can be used to implement the identification recognition method provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention has computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the identification recognition method provided in the second aspect of the present invention.

[0050] The working principle of the above-mentioned identification device will be described below in conjunction with some embodiments of the identification method. Those skilled in the art will understand that these embodiments of the identification method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the identification device. Similarly, the identification device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these identification methods.

[0051] Please see Figure 2 , Figure 2 A schematic structural diagram of an identification recognition device provided according to some embodiments of the present invention is shown.

[0052] like Figure 2 As shown, in some embodiments of the present invention, the identification recognition device 100 may mainly include: a light source 210 and an image acquisition component 220, wherein the light source 210 may provide an alignment beam 260. The image acquisition component 220 may include a corner structure 240 and an optical imaging system 250 located between the light source 210 and the chip 230. The corner structure 240 and the optical imaging system 250 in the image acquisition component 220 are a whole and may be connected by a mechanical device. At the same time, the image acquisition component 220 may also be connected to an external motor to drive it to move up and down at least in the z-axis direction. The corner structure 240 may be used to receive the alignment beam 260, and by adjusting the posture of the image acquisition component 220 as a whole, the optical path of the alignment beam 260 may be adjusted to align it to the identification of the chip 230. The optical imaging system 250 may be used to obtain the identification pattern on the chip 230 and identify the identification pattern.

[0053] Further, please continue as Figure 2 As shown, in order to facilitate the subsequent bonding process, the identification on the chip to be bonded is aligned with the identification on the bonding object wafer to ensure the accuracy requirement, the chip 230 can include at least two identifications 231 and 232. Compared with setting a single identification on the chip, by setting at least two identifications 231 and 232 on the chip, the rotation angle of the chip to be bonded can be adjusted before bonding, which is conducive to improving the alignment accuracy of the chip identification and the wafer identification.

[0054] In some embodiments, the corner structure 240 may include a pair of corner component groups 241. The pair of corner component groups 241 may be located on both sides above the chip 230 to adjust the optical paths of the two received alignment beams 260 so that the two alignment beams 260 can be aligned to the two marks 231 and 232 respectively.

[0055] For example, the corner component set 241 may optionally include a 135° corner surface, which can provide a 135° optical path angle. In this case, the pair of corner component sets 241 may be disposed on both sides of the outer portion above the chip 230, so that the received alignment light beam 260 can be adjusted once by a 135° angle, and the two alignment light beams 260 are aligned to the two marks 231 and 232, respectively.

[0056] Please continue to see Figure 2 In other embodiments, the identification device 200 may further include a reflective prism 242. The reflective prism 242 may be located between the pair of corner piece groups 241 and mechanically fixed. The reflective prism 242 may be used to receive the two alignment light beams 260 after the first optical path adjustment via the corner piece group 241, and perform a second optical path adjustment on the two alignment light beams 260, so that the two alignment light beams 260 can be aligned to the two identifications 231 and 232 respectively.

[0057] Furthermore, if Figure 2 As shown, in some optional embodiments, each corner piece in the corner piece group 241 may include a 90° corner surface, which is used to perform a primary optical path adjustment of the two received alignment light beams 260 by a 90° angle. In addition, in order to eliminate the defect of a large distance between the two alignment light beams caused by the use of two triangular prisms for alignment light beam reflection in the prior art, a pair of corner piece groups 241 in this embodiment can share a reflecting prism 242, that is, only one triangular prism is needed to complete the reflected light path adjustment. The reflecting prism 242 may include two 45° reflecting surfaces, so that the two alignment light beams 260 that have completed the primary optical path adjustment through the corner piece group 241 can be subjected to a secondary optical path adjustment of 45° reflection.

[0058] like Figure 2 As shown, since the optical axis distances from the two image acquisition components 220 to the two markings 231 and 232 of the chip 230 can be determined by the working distance of each image acquisition component 220, after the position of the middle reflection prism 242 is fixed, the positions of the image acquisition components 220 on both sides can be adjusted, for example, by adjusting the position of the image acquisition component 220 up and down, and / or adjusting the posture of the image acquisition component 220 in the X, Y, and Z axis directions, thereby adjusting the working distance of the alignment light beam 260 irradiated to the marking on the chip 230.

[0059] Specifically, see Figure 3 , Figure 3 A schematic diagram of position adjustment of an identification recognition device provided according to some embodiments of the present invention is shown.

[0060] like Figure 3As shown, in some embodiments, it is assumed that when two logos on a chip 310 of regular size are to be identified, the two image acquisition components 220 are located at the initial position. The chip 310 of regular size is usually a chip of about 4 mm in size. When two logos on some first chips 320 of smaller size are to be identified, the positions of the two image acquisition components 220 can be adjusted downward synchronously in the Z-axis direction to approach the distance between the two alignment beams 260 so that they are aligned to the two logos of the first chip 320 of smaller size, thereby completing the identification of the small-sized chip. In this embodiment, the size of the first chip 320 can be greater than 1 mm and less than 4 mm.

[0061] Continue as Figure 3 As shown, when identifying the two marks on some larger second chips 330, the positions of the two image acquisition components 220 can be adjusted upward in the Z-axis direction to increase the distance between the two alignment beams 260 so that they are aligned to the two marks of the larger second chip 330, thereby completing the identification of the large-size chip. In this embodiment, the size of the second chip 330 can be greater than 4 mm.

[0062] In some preferred embodiments of the present invention, the identification device 200 may further include a controller (not shown in the drawings). The controller may be used to implement the identification method provided in another aspect of the present invention. Figure 4 , Figure 4 A flow chart of a method for identifying an identifier provided according to some embodiments of the present invention is shown.

[0063] like Figure 4 As shown, in some embodiments of the present invention, the identification method may include the following steps: First, step S410 may be performed: obtaining a chip image of a chip.

[0064] Specifically, in some embodiments, during the chip-to-wafer bonding process, the chip to be bonded may first be obtained and placed in an identification position, that is, transferred to the bottom of the identification device 200 in the bonding device, waiting for chip identification to be identified. Figure 2 As shown, a chip image of the chip can be acquired through the light source 210 and the optical imaging system 250 in the image acquisition component 220, wherein the chip image can include multiple identifiers.

[0065] Furthermore, since the thin films prepared on the surfaces of wafers and chips of different products are different, the same light source cannot be adapted to multiple products. In this regard, in some preferred embodiments of the present invention, the light source 210 may include alignment beams of multiple bands. When imaging and focusing wafers and chips of different products through the optical imaging system 250, the alignment beams of multiple bands provided by the light source 210 may be switched by the controller first, so as to obtain chip images of the chips to be bonded corresponding to the alignment beams of multiple bands.

[0066] Specifically, light sources 210 of different wavelengths can be used to image the logo on the chip respectively to obtain chip images. Then, the imaging contrast of multiple chip images is calculated by the controller to obtain multiple imaging contrast values. After that, these multiple imaging contrast values ​​are fed back to the controller, and the controller can use the alignment beam corresponding to the wavelength band with the highest contrast imaging value as the optimal alignment beam based on these multiple contrast imaging values. In other words, the beam of the wavelength band corresponding to the highest contrast imaging value can provide the best lighting environment.

[0067] Then the light source 210 is controlled to switch to the wavelength band corresponding to the optimal alignment beam. In this embodiment, by using a multi-band light source 210, the optimal lighting environment can be achieved by switching light sources of different wavelength bands, thereby improving image quality, further improving mark recognition, and subsequent bonding accuracy.

[0068] Next, step S420 may be performed: based on the size of the chip, the position of the corner structure in the identification recognition device is adjusted to adjust the optical path of the light beam so that it is aligned with the identification of the chip.

[0069] Specifically, it can be combined Figure 3 It is commonly understood that in some embodiments, in the initial state, the image acquisition component 220 in the identification recognition device 200 can be located at the initial position. The image acquisition component 220 in the initial position can correspond to the working distance of the chip 310 of regular size, thereby facilitating rapid identification of the chip 310 of regular size.

[0070] Optionally, the size of the chip to be bonded can be determined based on the chip image obtained in the previous step. Figure 3 As shown, in some embodiments, when the size of the chip to be bonded is smaller than the conventional size, for example, the size of the chip to be bonded is greater than 1 mm and less than 4 mm. The chip to be bonded may be the first chip 320. The position of the image acquisition component 220 in the z-axis direction may be adjusted to obtain a spacing that matches the alignment mark on the first chip 320. Specifically, the position of the image acquisition component 220 may be adjusted downward in the z-axis direction synchronously to approach the distance between the two alignment beams 260 so that they are aligned to the two marks of the first chip 320 of smaller size.

[0071] like Figure 3 As shown, in some embodiments, after the two alignment light beams 260 are aligned to the two marks on the first chip 320, the posture of any one or more of the corner component groups 241 and / or the optical imaging system 250 in each image acquisition component 220 can be further adjusted, for example, by micro-movement in the X, Y, and Z axis directions or rotation around the Z axis direction, so that the two alignment light beams 260 can be located at the center of the two marks.

[0072] like Figure 3 As shown, in other embodiments, when the size of the chip to be bonded is larger than the conventional size, for example, the size of the chip to be bonded is larger than 4 mm. The chip to be bonded may be the second chip 330. The position of the image acquisition component 220 in the z-axis direction may be adjusted to obtain a spacing that matches the alignment mark on the second chip 330. Specifically, the position of the image acquisition component 220 may be adjusted upward in the z-axis direction to increase the distance between the two alignment beams 260 so that they are aligned to the two marks of the second chip 330 with a larger size.

[0073] Likewise, if Figure 3 As shown, in some embodiments, after the two alignment light beams 260 are aligned to the two marks on the second chip 330, the posture of any one or more of the corner component groups 241 and / or the optical imaging system 250 in each image acquisition component 220 can be further adjusted, for example, by micro-movement in the X, Y, and Z axis directions or rotation around the Z axis direction, so that the two alignment light beams 260 can be located at the center of the two marks.

[0074] In the above step S420, the suitability of the visual system is adjusted according to the different sizes of the chips to be bonded. That is, through the movable image acquisition component 220 in the identification recognition device 200, the identification recognition device 200 can be compatible with the identification recognition of chips of various sizes, and the device can subsequently meet the bonding requirements of chips with a size of 1 mm or more.

[0075] Afterwards, step S430 may be performed: acquiring the identification pattern on the chip and identifying the identification pattern.

[0076] Specifically, in some embodiments, the optical imaging system 250 in the image acquisition component 220 can be used to image the alignment mark on the chip, and then the relative positions of the two marks can be identified based on the mark pattern on the chip.

[0077] Further, in some optional embodiments, after completing the above step S430, a subsequent bonding process can be performed. Specifically, after identifying the logo on the chip to be bonded, align it with the logo on the wafer. For example, the logo on the wafer can be used as a reference, and based on the position information of the logo identification on the chip obtained in the previous step, position compensation between the chip logo and the wafer logo can be performed, including rotating and translating the chip to adjust the position and position of the wafer and the chip. Finally, the chip to be bonded after the logo is aligned can be bonded to the bonding target wafer by applying pressure through a pin.

[0078] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0079] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0080] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0081] In summary, the present invention provides an identification device, an identification method, and a computer-readable storage medium, which can reduce the size of the identification device and remove the limitations of the structure of the identification device on identification on small-sized chips, thereby being compatible with a variety of chips of different sizes for identification.

[0082] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A marking recognition device, characterized in that: include: A light source, providing an alignment beam; as well as The image acquisition component includes a corner structure and an optical imaging system located between the light source and the chip, wherein the corner structure receives the alignment light beam and adjusts the posture of the image acquisition component to adjust the optical path of the alignment light beam so that it is aligned with the identification of the chip, and the optical imaging system obtains the identification pattern on the chip and recognizes the identification pattern.

2. The identification device according to claim 1, characterized in that: The chip includes two marks, and the corner structure includes a corner component group, which is respectively located on both sides above the chip to adjust the optical path of the two received alignment light beams so that the two alignment light beams are respectively aligned with the two marks.

3. The identification device according to claim 2, characterized in that: Also includes: A reflecting prism is located between the corner piece groups, and is used to receive the two alignment light beams after the primary optical path adjustment by the corner piece group, and perform secondary optical path adjustment on them, so that the two alignment light beams are aligned to the two marks respectively.

4. The identification device according to claim 3, characterized in that: Each corner piece in the corner piece group includes a 90° corner surface to perform a primary optical path adjustment of the two received alignment light beams by 90°, and the reflecting prism includes two 45° reflecting surfaces to perform a secondary optical path adjustment of the two alignment light beams by 45° after the primary optical path adjustment through the corner piece group.

5. The identification device according to claim 4, characterized in that: The identification recognition device further includes a controller, which is configured to: Acquire a chip image of the chip, wherein the chip image includes two identifiers; Based on the size of the chip, adjusting the position of the image acquisition component to adjust the optical path of the alignment light beam so that it is aligned to the mark of the chip; and The identification pattern on the chip is acquired through the optical imaging system, and the identification pattern is identified.

6. The identification device according to claim 5, characterized in that: The step of adjusting the posture of the image acquisition component based on the size of the chip to adjust the optical path of the alignment light beam so that it is aligned to the mark of the chip includes: In response to the size of the first chip being smaller than the conventional size, the position of the image acquisition component is adjusted downward to approach the distance between the two alignment light beams so as to align the two marks of the first chip; and In response to the two alignment light beams being aligned to the two marks, the posture of any one or more of the corner piece assembly and / or the optical imaging system is adjusted so that the two alignment light beams are located at the center of the two marks.

7. The identification device according to claim 6, characterized in that: The step of adjusting the posture of the image acquisition component based on the size of the chip to adjust the optical path of the alignment light beam so that it is aligned to the mark of the chip includes: In response to the second chip being larger than a conventional size, the position of the image acquisition component is adjusted upward to increase the distance between the two alignment light beams so as to align the two marks of the second chip; and In response to the two alignment light beams being aligned to the two marks, the posture of any one or more of the corner piece assembly and / or the optical imaging system is adjusted so that the two alignment light beams are located at the center of the two marks.

8. The identification device according to claim 6, characterized in that: The chip of regular size is a 4 mm chip, and the size of the first chip is larger than 1 mm and smaller than 4 mm.

9. The identification device according to claim 6, characterized in that: The light source includes alignment light beams of multiple wavelength bands, and the step of acquiring the chip image of the chip includes: Switching the alignment light beams of multiple wavelength bands provided by the light source to obtain chip images of the chip corresponding to the alignment light beams of the multiple wavelength bands; Calculating the imaging contrast of the plurality of chip images to obtain a plurality of imaging contrast values; and Based on the multiple contrast imaging values, the alignment beam corresponding to the wavelength band with the highest contrast imaging value is used as the optimal alignment beam.

10. A method for identifying a logo, characterized in that: The following steps are involved: Acquire a chip image of the chip, wherein the chip image includes a logo; Based on the size of the chip, adjusting the position of the image acquisition component in the identification recognition device according to any one of claims 1 to 9 to adjust the optical path of the alignment light beam so that it is aligned with the identification of the chip; and The identification pattern on the chip is obtained, and the identification pattern is identified.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the identification method as claimed in claim 10 is implemented.

Images