Semiconductor package conveying device with protection structure

Abstract

The application relates to the technical field of semiconductor conveying, and discloses a semiconductor packaging conveying device with a protection structure, which comprises a working shell, a bidirectional motor fixedly connected to the top of the working shell, reciprocating lead screws fixedly connected to the two ends of the bidirectional motor, one end of each of the reciprocating lead screws penetrating through the working shell and extending to the outside of the working shell, a main shaft disc fixedly connected to the outer wall of the one end of each of the reciprocating lead screws, and a belt rotationally connected to the outer wall of the main shaft disc, and the semiconductor packaging conveying device further comprises a packaging conveying mechanism comprising fixed rods fixedly connected to the inner wall of the working shell at both ends of one side of the working shell, the semiconductor packaging is placed on the top of the outer wall of a conveying belt, the bidirectional motor is started, the reciprocating lead screws are driven to rotate by the bidirectional motor, the main shaft discs are driven to rotate by the reciprocating lead screws, the belts are driven to rotate by the main shaft discs, the shaft sleeves are driven to rotate by the belts, the conveying belt is driven to rotate by the shaft sleeves, the semiconductor packaging is driven to convey by the conveying belt, and the semiconductor packaging is conveyed to work.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor conveying, and in particular to a semiconductor packaging conveying device with a protective structure. Background Art

[0002] Semiconductors are material products, typically composed of silicon, that have higher conductivity than insulators like glass but lower conductivity than pure conductors like copper or aluminum. Their conductivity and other properties can be modified by introducing impurities (called doping) to meet the specific needs of the electronic components they reside in. Semiconductor packaging involves processing tested wafers into individual chips according to product model and functional requirements, then encapsulating and protecting the individual chips in a plastic casing. This process also requires transporting the encapsulated semiconductors.

[0003] When packaged semiconductors are transported on a conveyor belt, the conveyor belt will experience slight bumps during transportation, causing the packaged semiconductors on the conveyor belt to move slightly. When the packaged semiconductors continue to move, they may fall halfway, thereby affecting the conveying work of the conveyor belt and reducing the stability of the conveyance. Summary of the Invention

[0004] An object of the present invention is to provide a semiconductor package conveying device with a protective structure to solve the problems raised in the above background technology.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a semiconductor packaging conveying device with a protective structure, comprising a working shell, a bidirectional motor fixedly connected to the top of the working shell, a reciprocating screw rod fixedly connected to both ends of the bidirectional motor, one end of the reciprocating screw rod passes through the working shell and extends to the outside of the working shell, an outer wall of one end of the reciprocating screw rod is fixedly connected to a spindle disk, an outer wall of the spindle disk is rotatably connected to a belt, and also comprises a packaging conveying mechanism, the packaging conveying mechanism comprises a fixed rod fixedly connected to both ends of one side of the inner wall of the working shell, an outer wall of the fixed rod is rotatably connected to a shaft sleeve, the inner walls of both ends of the belt away from the spindle disk are rotatably connected to the outer wall of the shaft sleeve, the outer wall of the shaft sleeve is rotatably connected to the conveyor belt, the two ends of the top of the working shell are fixedly connected to rectangular plates, and the outer wall of the reciprocating screw rod is provided with a lifting assembly.

[0007] Furthermore, the lifting assembly includes a threaded block threadedly connected to the outer wall of one end of the reciprocating screw rod, the top of the threaded block is rotatably connected to a rotating plate, the end of the rotating plate away from the threaded block is rotatably connected to the lifting block, and a sliding groove is opened on one side of the rectangular plate.

[0008] Furthermore, the outer wall of one end of the lifting block is slidably connected to the inner wall of the slide groove, the bottom of the lifting block is fixedly connected to the first spring, the bottom of the first spring is fixedly connected to the bottom of the inner wall of the slide groove, and both sides of the lifting block are fixedly connected to the fixed platform.

[0009] Furthermore, a stabilizing assembly is provided on the top of the fixed platform, and the stabilizing assembly includes a sliding rod passing through and slidably connected to the top of the fixed platform, the bottom of the sliding rod is fixedly connected to the square shell, and the top of the square shell is fixedly connected to the second spring.

[0010] Furthermore, the top of the second spring is fixedly connected to the bottom of the fixed platform, the two ends of one side of the inner wall of the square shell are rotatably connected to the rotating rods, and the outer wall of the rotating rod is rotatably connected to the transmission belt.

[0011] Furthermore, a positioning assembly is provided on the top of the square shell, and the positioning assembly includes a bent rod fixedly connected to both sides of the top of the square shell, the outer wall of one end of the bent rod is slidably connected to a sliding block, the top of the sliding block is rotatably connected to a rotating bar, the top of the rotating bar is rotatably connected to the bottom of the fixed platform, and one side of the sliding block is fixedly connected to a bent plate.

[0012] Furthermore, the two ends of the working shell close to the fixed rod are fixedly connected to cross bars, the outer walls of the two ends of the cross bars are slidably connected to square plates, one side of the square plate is fixedly connected to a return spring, and one end of the return spring is fixedly connected to one side of the inner wall of the working shell.

[0013] Furthermore, a tension assembly is provided at the bottom of the square plate, and the tension assembly includes a strip rod rotatably connected to the two ends of the bottom of the square plate, the bottom end of the strip rod is rotatably connected to a horizontal plate, an annular plate is fixedly connected between the two horizontal plates, and vertical rods are fixedly connected on both sides of the bottom of the inner wall of the working shell near the bidirectional motor.

[0014] Furthermore, one end of the vertical rod passes through the annular plate and extends to the outside of the annular plate. The two sides of the annular plate are fixedly connected with connecting plates. The top of the connecting plate is fixedly connected with an arc-shaped plate frame. The top of the arc-shaped plate frame contacts the bottom of the outer wall of the conveyor belt.

[0015] The present invention has the following beneficial effects:

[0016] (1) The present invention places the semiconductor package on the top of the outer wall of the conveyor belt, starts the bidirectional motor, the bidirectional motor drives the reciprocating screw to rotate, the reciprocating screw drives the main shaft disk to rotate, the main shaft disk drives the belt to rotate, the belt drives the shaft sleeve to rotate, the shaft sleeve drives the conveyor belt to rotate, the conveyor belt drives the semiconductor package to be transported, so that the semiconductor package can be transported, and the reciprocating screw drives the threaded block to move, the threaded block drives the rotating plate to move, the rotating plate drives the lifting block to move downward along the outer wall of the slide groove, the lifting block drives the fixed platform to descend, the fixed platform drives the sliding rod to descend, the sliding rod drives the square shell to descend, the square shell drives the rotating rod to descend, and the rotating rod drives the conveyor belt to descend. When the semiconductor package moves to the center of the top of the outer wall of the conveyor belt, the conveyor belt presses down the semiconductor package to prevent vibration during the transportation of the semiconductor package, causing the semiconductor package to have a small displacement phenomenon, thereby improving the stability of the semiconductor package transportation.

[0017] (2) In the present invention, when the conveyor belt contacts the semiconductor package, the semiconductor package is moved by the conveyor belt, so that the conveyor belt rotates around the rotating rod to prevent the semiconductor package from getting stuck during transportation, and the conveyor belt is subjected to the reaction force of the semiconductor package, so that the conveyor belt drives the rotating rod to move upward, the rotating rod drives the square shell to move upward, the square shell drives the sliding rod to move upward, and at the same time the square shell drives the bending rod to move upward, and the bending rod drives the sliding block to move upward. At this time, the distance between the fixed platform and the square shell is close to each other, so that the rotating bar can drive the sliding block to move along the outer wall of the bending rod, and the sliding block drives the bending plate to move. During the movement of the bending plate, it will come into contact with the square plate, causing the square plate to be squeezed, and the square plate slides along the outer wall of the cross bar. During the movement of the square plate, it will come into contact with the side wall of the semiconductor package, so that multiple semiconductor packages can be on the same horizontal line, further preventing the semiconductor package from having a small displacement during transportation, and improving the stability of semiconductor package transportation.

[0018] (3) In the present invention, when the two square plates move away from each other, the square plates drive the strip rods to move, which are limited by the vertical rods. The strip rods drive the horizontal plates to move upward, and the horizontal plates drive the annular plates to move upward along the outer walls of the vertical rods. The annular plates drive the connecting plates to move upward, and the connecting plates drive the arc-shaped plate racks to move upward. During the upward movement of the arc-shaped plate racks, the arc-shaped plate racks will come into contact with the bottom of the outer wall of the conveyor belt, pushing the bottom of the conveyor belt, thereby increasing the tension of the conveyor belt and making the contact between the top of the outer wall of the conveyor belt and the bottom of the semiconductor package more stable, preventing the tension of the conveyor belt from being too low, causing the semiconductor package to shake, and indirectly improving the stability of the transportation of the semiconductor package.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic diagram of the overall top view of the structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the working shell portion of the present invention;

[0024] Figure 4 This is a schematic diagram of the top view of the fixing platform of the present invention;

[0025] Figure 5 This is a schematic diagram of the cross-sectional structure of the square shell of the present invention;

[0026] Figure 6 This is a schematic cross-sectional structural diagram of the working shell of the present invention;

[0027] Figure 7 This is a schematic diagram of the top view of the curved plate frame of the present invention;

[0028] Figure 8 For the present invention Figure 2 A magnified view of the middle panel.

[0029] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0030] Figure: 1, working housing; 2, bidirectional motor; 3, reciprocating screw; 4, spindle disk; 5, belt; 6, package conveying mechanism; 61, fixed rod; 62, shaft sleeve; 63, conveyor belt; 64, rectangular plate; 65, lifting assembly; 66, stabilizing assembly; 67, positioning assembly; 68, tension assembly; 651, threaded block; 652, rotating plate; 653, first spring; 654, slide; 655, lifting block; 65 6. Fixed platform; 661. Sliding rod; 662. Second spring; 663. Square shell; 664. Rotating rod; 665. Conveyor belt; 671. Bending rod; 672. Sliding block; 673. Rotating bar; 674. Bending plate; 675. Cross bar; 676. Square plate; 677. Return spring; 681. Strip rod; 682. Cross plate; 683. Annular plate; 684. Vertical rod; 685. Connecting plate; 686. Arc plate frame. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Example 1: Please refer to Figure 1 - Figure 8 As shown, the present invention is a semiconductor package conveying device with a protective structure, comprising a working shell 1, a bidirectional motor 2 fixedly connected to the top of the working shell 1, a reciprocating screw 3 fixedly connected to both ends of the bidirectional motor 2, one end of the reciprocating screw 3 passes through the working shell 1 and extends to the outside of the working shell 1, one end of the reciprocating screw 3 is fixedly connected to the outer wall of the working shell 1, and a belt 5 is rotatably connected to the outer wall of the spindle disk 4, and further comprising;

[0033] The packaging conveying mechanism 6 includes a fixed rod 61 fixedly connected to both ends of the inner wall of one side of the working shell 1, the outer wall of the fixed rod 61 is rotatably connected to the shaft sleeve 62, the inner walls of the belt 5 at both ends away from the main shaft disk 4 are respectively rotatably connected to the outer wall of the shaft sleeve 62, the outer wall of the shaft sleeve 62 is rotatably connected to the conveyor belt 63, the semiconductor package is placed on the top of the outer wall of the conveyor belt 63, the bidirectional motor 2 is started, the bidirectional motor 2 drives the reciprocating screw 3 to rotate, the reciprocating screw 3 drives the main shaft disk 4 to rotate, the main shaft disk 4 drives the belt 5 to rotate, the belt 5 drives the shaft sleeve 62 to rotate, the shaft sleeve 62 drives the conveyor belt 63 to rotate, the conveyor belt 63 drives the semiconductor package to be conveyed, so that the semiconductor package is conveyed, the top two ends of the working shell 1 are respectively fixedly connected to rectangular plates 64, and the outer wall of the reciprocating screw 3 is provided with a lifting component 65.

[0034] The lifting assembly 65 includes a threaded block 651 threadedly connected to the outer wall of one end of the reciprocating screw rod 3, the top of the threaded block 651 is rotatably connected to a rotating plate 652, and the end of the rotating plate 652 away from the threaded block 651 is rotatably connected to a lifting block 655, and a sliding groove 654 is opened on one side of the rectangular plate 64.

[0035] The outer wall of one end of the lifting block 655 is slidably connected to the inner wall of the slide groove 654. The purpose of this setting is to enable the lifting block 655 to perform vertical lifting movement. The bottom of the lifting block 655 is fixedly connected to the first spring 653, and the bottom of the first spring 653 is fixedly connected to the bottom of the inner wall of the slide groove 654. Both sides of the lifting block 655 are fixedly connected to the fixed platform 656.

[0036] The top of the fixed table 656 is provided with a stabilizing assembly 66, which includes a sliding rod 661 penetrating and slidingly connected to the top of the fixed table 656, the bottom of the sliding rod 661 is fixedly connected with a square shell 663, and the top of the square shell 663 is fixedly connected with a second spring 662. The purpose of such arrangement is to reset.

[0037] The top of the second spring 662 is fixedly connected to the bottom of the fixed table 656, the inner wall of the square shell 663 is rotatably connected with a rotating rod 664 at both ends of one side, the outer wall of the rotating rod 664 is rotatably connected with a transmission belt 665. Due to the arrangement of the sliding groove 654 at the rectangular plate 64, the threaded block 651 is driven to move by the reciprocating lead screw 3, the rotating plate 652 is driven to move by the threaded block 651, the lifting block 655 is driven to move downward along the outer wall of the sliding groove 654 by the rotating plate 652, the fixed table 656 is driven to descend by the lifting block 655, the sliding rod 661 is driven to descend by the fixed table 656, the square shell 663 is driven to descend by the sliding rod 661, the rotating rod 664 is driven to descend by the square shell 663, and the transmission belt 665 is driven to descend by the rotating rod 664. When the semiconductor packaging piece moves to the top center of the outer wall of the conveying belt 63, the transmission belt 665 presses the semiconductor packaging piece downward to prevent the semiconductor packaging piece from vibrating during transportation, so that the semiconductor packaging piece is slightly displaced, and the stability of the semiconductor packaging piece transportation is improved. When the transmission belt 665 comes into contact with the semiconductor packaging piece, the semiconductor packaging piece is driven to move by the conveying belt 63, so that the transmission belt 665 rotates around the rotating rod 664 to prevent the semiconductor packaging piece from being stuck during transportation.

[0038] In embodiment 2, the top of the square shell 663 is provided with a positioning assembly 67, which includes a bent rod 671 fixedly connected to the top of the square shell 663 on both sides, a sliding block 672 slidingly connected to the outer wall of one end of the bent rod 671, a rotating rod 673 rotatably connected to the top of the sliding block 672, the top end of the rotating rod 673 is rotatably connected to the bottom of the fixed table 656, and a bent plate 674 is fixedly connected to one side of the sliding block 672.

[0039] The two ends of the working shell 1 near the fixed rod 61 are fixedly connected to the cross bar 675, and the outer walls of the two ends of the cross bar 675 are slidably connected to the square plate 676. One side of the square plate 676 is fixedly connected to the return spring 677. One end of the return spring 677 is fixedly connected to the inner wall of the working shell 1. Under the reaction force of the semiconductor package, the conveyor belt 665 drives the rotating rod 664 to move upward, the rotating rod 664 drives the square shell 663 to move upward, the square shell 663 drives the sliding rod 661 to move upward, and at the same time, the square shell 663 drives the bending rod 671 to move upward, and the bending rod 671 drives the sliding block 672 to move upward. At this time, the fixed platform 6 56 and the square shell 663 are closer to each other, so that the rotating bar 673 can drive the sliding block 672 to move along the outer wall of the bent rod 671, and the sliding block 672 drives the bent plate 674 to move. During the movement of the bent plate 674, it will come into contact with the square plate 676, so that the square plate 676 is squeezed, and the square plate 676 slides along the outer wall of the cross bar 675. During the movement of the square plate 676, it will come into contact with the side wall of the semiconductor package, so that multiple semiconductor packages can be on the same horizontal line, further preventing the semiconductor package from slightly displacing during transportation, and improving the stability of the semiconductor package transportation.

[0040] A tension assembly 68 is provided at the bottom of the square plate 676. The tension assembly 68 includes a strip rod 681 rotatably connected to the two ends of the bottom of the square plate 676. The bottom end of the strip rod 681 is rotatably connected to a horizontal plate 682. An annular plate 683 is fixedly connected between the two horizontal plates 682. Vertical rods 684 are fixedly connected on both sides of the bottom of the inner wall of the working shell 1 near the bidirectional motor 2.

[0041] One end of the vertical rod 684 passes through the annular plate 683 and extends to the outside of the annular plate 683. The purpose of this setting is to limit the annular plate 683. The two sides of the annular plate 683 are fixedly connected with connecting plates 685. The top of the connecting plate 685 is fixedly connected with an arc plate frame 686. The top of the arc plate frame 686 contacts the bottom of the outer wall of the conveyor belt 63. When the two square plates 676 move away from each other, the square plate 676 drives the strip rod 681 to move. Limited by the vertical rod 684, the strip rod 681 drives the horizontal plate 682 to move upward, and the horizontal plate 682 brings The movable annular plate 683 moves upward along the outer wall of the vertical rod 684, and the annular plate 683 drives the connecting plate 685 to move upward, and the connecting plate 685 drives the arc plate frame 686 to move upward. During the upward movement, the arc plate frame 686 will contact the bottom of the outer wall of the conveyor belt 63, pushing the bottom of the conveyor belt 63, thereby increasing the tension of the conveyor belt 63, making the contact between the top of the outer wall of the conveyor belt 63 and the bottom of the semiconductor package more stable, preventing the tension of the conveyor belt 63 from being too small, causing the semiconductor package to shake, and indirectly improving the stability of the transportation of the semiconductor package.

[0042] When in use, the semiconductor package is placed on the top of the outer wall of the conveyor belt 63, and the bidirectional motor 2 is started. The bidirectional motor 2 drives the reciprocating screw 3 to rotate, the reciprocating screw 3 drives the main shaft disk 4 to rotate, the main shaft disk 4 drives the belt 5 to rotate, the belt 5 drives the shaft sleeve 62 to rotate, the shaft sleeve 62 drives the conveyor belt 63 to rotate, and the conveyor belt 63 drives the semiconductor package to be transported, so that the semiconductor package can be transported, and is affected by the setting of the slide groove 654 at the rectangular plate 64. The reciprocating screw 3 drives the threaded block 651 to move, the threaded block 651 drives the rotating plate 652 to move, and the rotating plate 652 drives the lifting Block 655 moves downward along the outer wall of the slide groove 654, the lifting block 655 drives the fixed platform 656 to descend, the fixed platform 656 drives the sliding rod 661 to descend, the sliding rod 661 drives the square shell 663 to descend, the square shell 663 drives the rotating rod 664 to descend, and the rotating rod 664 drives the conveyor belt 665 to descend. When the semiconductor package moves to the top center of the outer wall of the conveyor belt 63, the conveyor belt 665 presses down on the semiconductor package to prevent vibration during the transportation of the semiconductor package, causing the semiconductor package to have a small displacement phenomenon, thereby improving the stability of the semiconductor package transportation.

[0043] When the conveyor belt 665 comes into contact with the semiconductor package, the semiconductor package is moved by the conveyor belt 63, so that the conveyor belt 665 rotates around the rotating rod 664 to prevent the semiconductor package from getting stuck during transportation. In addition, the reaction force of the semiconductor package causes the conveyor belt 665 to drive the rotating rod 664 to move upward, and the rotating rod 664 drives the square shell 663 to move upward, and the square shell 663 drives the sliding rod 661 to move upward. At the same time, the square shell 663 drives the bending rod 671 to move upward, and the bending rod 671 drives the sliding block 672 to move upward. At this time, the fixed platform 656 and the square shell 663 are in contact with each other. 3 are brought closer to each other, so that the rotating bar 673 can drive the sliding block 672 to move along the outer wall of the bent rod 671, and the sliding block 672 drives the bent plate 674 to move. During the movement of the bent plate 674, it will come into contact with the square plate 676, so that the square plate 676 is squeezed, and the square plate 676 slides along the outer wall of the cross bar 675. During the movement of the square plate 676, it will come into contact with the side wall of the semiconductor package, so that multiple semiconductor packages can be on the same horizontal line, further preventing the semiconductor packages from slightly displacing during transportation, and improving the stability of the semiconductor package transportation.

[0044] When the two square plates 676 move away from each other, the square plate 676 drives the strip rod 681 to move, and is limited by the vertical rod 684. The strip rod 681 drives the horizontal plate 682 to move upward, and the horizontal plate 682 drives the annular plate 683 to move upward along the outer wall of the vertical rod 684. The annular plate 683 drives the connecting plate 685 to move upward, and the connecting plate 685 drives the arc plate frame 686 to move upward. During the upward movement, the arc plate frame 686 will contact the bottom of the outer wall of the conveyor belt 63, pushing the bottom of the conveyor belt 63, thereby increasing the tension of the conveyor belt 63, making the contact between the top of the outer wall of the conveyor belt 63 and the bottom of the semiconductor package more stable, preventing the tension of the conveyor belt 63 from being too low, causing the semiconductor package to shake, and indirectly improving the stability of the transportation of the semiconductor package.

[0045] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor packaging conveying device with a protective structure, comprising a working shell (1), a bidirectional motor (2) fixedly connected to the top of the working shell (1), a reciprocating screw (3) fixedly connected to both ends of the bidirectional motor (2), one end of the reciprocating screw (3) passing through the working shell (1) and extending to the outside of the working shell (1), a main shaft disk (4) fixedly connected to the outer wall of one end of the reciprocating screw (3), and a belt (5) rotatably connected to the outer wall of the main shaft disk (4), characterized in that: Also includes; The packaging conveying mechanism (6) comprises a fixed rod (61) fixedly connected to both ends of the inner wall of one side of the working shell (1); the outer wall of the fixed rod (61) is rotatably connected to a shaft sleeve (62); the inner walls of both ends of the belt (5) away from the main shaft disk (4) are respectively rotatably connected to the outer wall of the shaft sleeve (62); the outer wall of the shaft sleeve (62) is rotatably connected to a conveying belt (63); the top two ends of the working shell (1) are respectively fixedly connected to rectangular plates (64); and the outer wall of the reciprocating screw rod (3) is provided with a lifting assembly (65).

2. The semiconductor package conveying device with a protective structure according to claim 1, wherein: The lifting assembly (65) includes a threaded block (651) threadedly connected to the outer wall of one end of the reciprocating screw rod (3); the top of the threaded block (651) is rotatably connected to a rotating plate (652); the end of the rotating plate (652) away from the threaded block (651) is rotatably connected to a lifting block (655); and a sliding groove (654) is provided on one side of the rectangular plate (64).

3. The semiconductor package conveying device with a protective structure according to claim 2, wherein: The outer wall of one end of the lifting block (655) is slidably connected to the inner wall of the slide groove (654), the bottom of the lifting block (655) is fixedly connected to the first spring (653), the bottom of the first spring (653) is fixedly connected to the bottom of the inner wall of the slide groove (654), and both sides of the lifting block (655) are fixedly connected to the fixed platform (656).

4. The semiconductor package conveying device with a protective structure according to claim 3, wherein: A stabilizing assembly (66) is provided on the top of the fixed platform (656), and the stabilizing assembly (66) includes a sliding rod (661) that passes through and is slidably connected to the top of the fixed platform (656), the bottom of the sliding rod (661) is fixedly connected to a square shell (663), and the top of the square shell (663) is fixedly connected to a second spring (662).

5. The semiconductor package conveying device with a protective structure according to claim 4, characterized in that: The top of the second spring (662) is fixedly connected to the bottom of the fixed platform (656), and the two ends of one side of the inner wall of the square shell (663) are rotatably connected to the rotating rod (664), and the outer wall of the rotating rod (664) is rotatably connected to the transmission belt (665).

6. The semiconductor package conveying device with a protective structure according to claim 5, characterized in that: A positioning assembly (67) is provided on the top of the square shell (663), and the positioning assembly (67) includes a bent rod (671) fixedly connected to both sides of the top of the square shell (663), and a sliding block (672) is slidably connected to the outer wall of one end of the bent rod (671), and the top of the sliding block (672) is rotatably connected to a rotating bar (673), and the top end of the rotating bar (673) is rotatably connected to the bottom of the fixed platform (656), and one side of the sliding block (672) is fixedly connected to a bent plate (674).

7. The semiconductor package conveying device with a protective structure according to claim 1, wherein: The two ends of the working shell (1) on one side close to the fixed rod (61) are respectively fixedly connected to a cross bar (675); the outer walls at both ends of the cross bar (675) are respectively slidably connected to a square plate (676); one side of the square plate (676) is fixedly connected to a return spring (677); one end of the return spring (677) is fixedly connected to one side of the inner wall of the working shell (1).

8. The semiconductor package conveying device with a protective structure according to claim 7, wherein: A tension assembly (68) is provided at the bottom of the square plate (676), and the tension assembly (68) includes a strip rod (681) rotatably connected to the two ends of the bottom of the square plate (676), the bottom end of the strip rod (681) is rotatably connected to a horizontal plate (682), and an annular plate (683) is fixedly connected between the two horizontal plates (682). Vertical rods (684) are fixedly connected to both sides of the bottom of the inner wall of the working shell (1) close to the bidirectional motor (2).

9. The semiconductor package conveying device with a protective structure according to claim 8, wherein: One end of the vertical rod (684) passes through the annular plate (683) and extends to the outside of the annular plate (683). Connecting plates (685) are fixedly connected to both sides of the annular plate (683). The top of the connecting plate (685) is fixedly connected to an arc-shaped plate frame (686). The top of the arc-shaped plate frame (686) contacts the bottom of the outer wall of the conveyor belt (63).

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