Suction nozzle leveling module, pickup head of piece to be bonded, bonding method and storage medium

Abstract

The invention provides a suction nozzle leveling module, a pickup head of a to-be-bonded piece, a bonding method and a computer readable storage medium. The suction nozzle leveling module comprises a flexible plate structure and a plurality of displacement sensors. The flexible plate structure is installed below a suction nozzle of the pick-up head, a plurality of air holes are distributed in the flexible plate structure, and the flexible plate structure moves according to the difference of acting force generated by airflow flowing through the air holes. And the plurality of displacement sensors are arranged in the plurality of air holes and are respectively used for detecting the displacement amount of the corresponding air holes so as to represent the parallelism between the suction nozzle and the to-be-bonded piece. According to the invention, the parallelism between the suction nozzle and the to-be-bonded piece can be detected by using the flexible plate structure provided with the plurality of air holes and the displacement sensor, and the device is used for supporting real-time leveling of the pickup head in the process of picking up the to-be-bonded piece, so that the problem of parallelism change caused by multiple bonding is avoided, and the bonding precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a nozzle leveling module, a pickup head for a part to be bonded, a bonding method, and a computer-readable storage medium. Background Art

[0002] In the wafer and chip bonding process, the parallelism between the wafer or chip and the pickup device depends on the horizontal adjustment before bonding. However, in the prior art, it is impossible to measure the parallelism between the wafer or chip and the pickup device during the bonding process. Multiple bonding of the wafer and the chip may cause the parallelism between the wafer or chip and its pickup device to change, resulting in reduced bonding accuracy.

[0003] In order to overcome the above-mentioned defects of the prior art, the art urgently needs an improved nozzle leveling module to support real-time leveling of the pickup head during the process of picking up the parts to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding and improving the bonding accuracy. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects in the prior art, the present invention provides a nozzle leveling module, a picking head for a part to be bonded, a bonding method and a computer-readable storage medium, which can detect the parallelism between the nozzle and the part to be bonded by utilizing a flexible board structure provided with multiple air holes and a displacement sensor, and is used to support real-time leveling of the picking head during the process of picking up the part to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0006] Specifically, the nozzle leveling module provided according to the first aspect of the present invention includes a flexible board structure and a plurality of displacement sensors. The flexible board structure is installed below the nozzle of the pickup head, and has a plurality of air holes distributed thereon, so as to cause displacement according to the difference in the force generated by the air flow passing through each of the air holes. The plurality of displacement sensors are arranged in the plurality of air holes, and are respectively used to detect the displacement of the corresponding air holes, so as to characterize the parallelism between the nozzle and the workpiece to be bonded.

[0007] Furthermore, in some embodiments of the present invention, the suction nozzle is provided with a plurality of suction ducts, each of the air holes is aligned with one of the suction ducts, and the flexible plate structure is closely attached to the suction nozzle.

[0008] Furthermore, in some embodiments of the present invention, a filter structure is provided in the plurality of air holes to amplify the difference in force generated by the air flow passing through each of the air holes.

[0009] Furthermore, in some embodiments of the present invention, the nozzle leveling module further includes a controller. The controller is configured to: determine the displacement of the corresponding air holes via each displacement sensor when the pickup head approaches the workpiece to be bonded; determine the distances from multiple first positions of the nozzle to the second positions corresponding to the workpiece to be bonded according to the displacement of each air hole; and level the pickup head and / or the workpiece to be bonded according to the distances from each first position to the second positions corresponding to the workpiece to be bonded.

[0010] Further, in some embodiments of the present invention, the step of determining the distances from multiple first positions of the suction nozzle to the second positions corresponding to the part to be bonded according to the displacement of each of the air holes includes: determining the forces applied to each of the air holes according to the displacement of each of the air holes; determining the air flow speed passing through each of the air holes according to the forces applied to each of the air holes; and determining the distances from each of the first positions to the second positions corresponding to the part to be bonded according to the air flow speed passing through each of the air holes.

[0011] Further, in some embodiments of the present invention, the step of determining the force applied to each pore according to the displacement of each pore includes: determining the force F applied to each pore according to the displacement of each pore:

[0012]

[0013] Wherein, w is the displacement of each of the air holes, EI is the bending stiffness of the nozzle leveling module, and L is the distance from the force point to the boundary of each of the air holes.

[0014] Further, in some embodiments of the present invention, the step of determining the air flow velocity flowing through each of the pores according to the force applied to each of the pores comprises: determining the air pressure difference on both sides of each of the pores according to the force applied to each of the pores; and determining the air flow velocity v flowing through each of the pores according to the air pressure difference on both sides of each of the pores:

[0015]

[0016] Wherein, P is the air pressure on the side of the air hole facing the suction nozzle. P0 is the air pressure on the side of the air hole facing the air suction port. ρ is the gas density.

[0017] Further, in some embodiments of the present invention, the step of determining the distance from each first position to the second position corresponding to the component to be bonded according to the air flow velocity flowing through each air hole includes: calculating the air path volume V between each air hole and the component to be bonded according to the air flow velocity flowing through each air hole:

[0018] V=v*t*S

[0019] Wherein, v is the air flow velocity, t is the suction time, S is the area of ​​the air hole, and according to the air path volume V between each of the air holes and the part to be bonded, the distance from each corresponding first position on the suction nozzle to its corresponding second position is determined respectively.

[0020] Furthermore, in some embodiments of the present invention, the object to be bonded is selected from a wafer or a chip with at least one circuit element.

[0021] In addition, the pick-up head of the above-mentioned workpiece to be bonded provided according to the second aspect of the present invention comprises a body and a nozzle leveling module as provided in the first aspect of the present invention. The body comprises a nozzle and an air suction port. The air suction port provides negative pressure to the workpiece to be bonded via the nozzle to adsorb the workpiece to be bonded.

[0022] In addition, the above-mentioned bonding method provided according to the third aspect of the present invention includes the following steps: controlling the pick-up head provided as the second aspect of the present invention to approach the workpiece to be bonded, and detecting the parallelism between the suction nozzle of the pick-up head and the workpiece to be bonded; leveling the pick-up head and / or the workpiece to be bonded according to the parallelism; and contacting and picking up the workpiece to be bonded via the leveled pick-up head, and transferring it to a bonding head to bond the workpiece to be bonded to the target position.

[0023] Furthermore, in some embodiments of the present invention, the step of detecting the parallelism between the suction nozzle of the pickup head and the workpiece to be bonded includes: detecting the displacement of multiple air holes of the suction nozzle leveling module of the pickup head in the process of the pickup head approaching the workpiece to be bonded; and determining the distance from multiple first positions of the suction nozzle to the second positions corresponding to the workpiece to be bonded based on the displacement of each of the air holes.

[0024] In addition, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method provided in the third aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0026] Figure 1 A schematic structural diagram of a pickup head for a workpiece to be bonded provided according to some embodiments of the present invention is shown.

[0027] Figure 2 A schematic structural diagram of a pickup head provided according to some embodiments of the present invention is shown.

[0028] Figure 3 A schematic structural diagram of a nozzle leveling module provided according to some embodiments of the present invention is shown.

[0029] Figure 4 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0030] Figure 5 A schematic diagram of the deformation of a flexible board structure provided according to some embodiments of the present invention is shown.

[0031] Figure 6 A schematic diagram of the force of a flexible board structure provided according to some embodiments of the present invention is shown.

[0032] Figure 7 A schematic diagram showing the difference in air pressure on both sides of each air hole provided according to some embodiments of the present invention is shown.

[0033] Figure 8 A schematic diagram showing the air flow rate of each air hole provided according to some embodiments of the present invention is shown.

[0034] Fig. 9 A schematic diagram showing the distance from each corresponding first position to its corresponding second position on a suction nozzle provided according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0035] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0038] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0039] As mentioned above, in the wafer and chip bonding process, the parallelism between the wafer or chip and the pickup device depends on the horizontal adjustment before bonding. However, in the prior art, it is impossible to measure the parallelism between the wafer or chip and the pickup device during the bonding process. Multiple bonding of the wafer and the chip may cause the parallelism between the wafer or chip and its pickup device to change, thereby reducing the bonding accuracy.

[0040] In order to overcome the above-mentioned defects in the prior art, the present invention provides a nozzle leveling module, a picking head for a part to be bonded, a bonding method and a computer-readable storage medium, which can detect the parallelism between the nozzle and the part to be bonded by utilizing a flexible board structure provided with multiple air holes and a displacement sensor, and is used to support real-time leveling of the picking head during the process of picking up the part to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0041] Please refer to the reference for details Figure 1 to Figure 3 . Figure 1 A schematic structural diagram of a pickup head for a workpiece to be bonded provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of a pickup head provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a nozzle leveling module provided according to some embodiments of the present invention is shown.

[0042] exist Figure 1 and Figure 2 In the illustrated embodiment, the pick-up head 10 for the above-mentioned workpiece to be bonded provided by the first aspect of the present invention comprises a body and the above-mentioned nozzle leveling module 13 provided by the first aspect of the present invention. Here, the body comprises a nozzle 11 and an air suction port 12. The air suction port 12 provides negative pressure to the workpiece to be bonded via the nozzle 11 to adsorb the workpiece to be bonded.

[0043] Further, in Figure 3 In the embodiment shown, the nozzle leveling module 13 includes a flexible plate structure 131 and a plurality of displacement sensors 132. Here, the flexible plate structure 131 is installed below the nozzle 11 of the pickup head 10, and a plurality of air holes are distributed on the flexible plate structure 131, so as to be displaced according to the difference in the force generated by the air flow passing through each of the air holes. The plurality of displacement sensors 132 are arranged in the plurality of air holes, and are respectively used to detect the displacement of the corresponding air holes, so as to characterize the parallelism between the nozzle 11 and the workpiece to be bonded.

[0044] exist Figure 2 In the embodiment shown, a plurality of suction pipes are provided on the suction nozzle 11. Here, each of the air holes is aligned with one of the suction pipes to avoid measurement errors caused by air extraction deviation. The flexible plate structure 131 is closely attached to the suction nozzle 11.

[0045] In addition, in some preferred embodiments, a filter structure is provided in the above-mentioned multiple air holes to expand the force difference generated by the air flow passing through each air hole, and can also be used to filter out external pollution.

[0046] In addition, in some preferred embodiments, the pickup head for the above-mentioned bonded parts provided in the first aspect of the present invention also includes a cable, which connects multiple displacement sensors 132, the flexible board structure 131 and the suction nozzle 11, and is used to obtain the displacement signal detected by the displacement sensor 132.

[0047] In some non-limiting embodiments, the pickup head of the above-mentioned bonding part provided in the first aspect of the present invention further includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the bonding method provided in the third aspect of the present invention.

[0048] The working principle of the above pick-up head will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, and are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working methods of the pick-up head. Similarly, the pick-up head is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0049] Please refer to the reference for details Figures 4 to 9 . Figure 4 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown. Figure 5 A schematic diagram of the deformation of a flexible board structure provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of the force of a flexible board structure provided according to some embodiments of the present invention is shown. Figure 7 A schematic diagram showing the difference in air pressure on both sides of each air hole provided according to some embodiments of the present invention is shown. Figure 8 A schematic diagram showing the air flow rate of each air hole provided according to some embodiments of the present invention is shown. Fig. 9 A schematic diagram showing the distance from each corresponding first position to its corresponding second position on a suction nozzle provided according to some embodiments of the present invention is shown.

[0050] like Figure 4 As shown, the controller may first control the pick-up head 10 provided in the first aspect of the present invention to approach the workpiece to be bonded, and detect the parallelism between the suction nozzle 11 of the pick-up head 10 and the workpiece to be bonded.

[0051] Specifically, if Figure 5 As shown, when the pick-up head 10 approaches the workpiece to be bonded, the controller can detect the displacement w of the multiple air holes of the nozzle leveling module 13 of the pick-up head 10 via the multiple displacement sensors 132 .

[0052] Afterwards, the controller may determine the distances d from the plurality of first positions of the suction nozzle to the second positions corresponding to the to-be-bonded component according to the displacement w of each of the air holes.

[0053] Specifically, if Figure 6 As shown, the controller can first determine the force F exerted on each of the pores according to the displacement w of each of the pores:

[0054]

[0055] Wherein, w is the displacement of each of the air holes, EI is the bending stiffness of the nozzle leveling module 13, and L is the distance from the force point to the boundary of each of the air holes.

[0056] After that, if Figure 7 and Figure 8 As shown, the controller can determine the pressure difference P-P0 on both sides of each pore according to the force F on each pore, and determine the air flow velocity v flowing through each pore according to the pressure difference on both sides of each pore:

[0057]

[0058] Wherein, P is the air pressure on the side of the air hole facing the suction nozzle 11, P0 is the air pressure on the side of the air hole facing the suction port 12, and ρ is the gas density.

[0059] After that, if Fig. 9 As shown, the controller can calculate the air path volume V between each air hole and the to-be-bonded component according to the air flow velocity v flowing through each air hole:

[0060] V=v*t*S

[0061] Among them, v is the air flow velocity, t is the inspiration time, and S is the area of ​​the pore.

[0062] Afterwards, the controller may determine the distance d from each corresponding first position on the suction nozzle 11 to its corresponding second position according to the volume V of the air path between each air hole and the workpiece to be bonded.

[0063] Thereafter, the controller may level the pickup head 10 and / or the workpiece to be bonded according to the parallelism between the suction nozzle 11 and the workpiece to be bonded, or directly according to the distance d from multiple first positions of the suction nozzle 11 to the second positions corresponding to the workpiece to be bonded.

[0064] Afterwards, the controller may contact and pick up the to-be-bonded component via the leveled pickup head 10 , and transfer it to a bonding head so as to bond the to-be-bonded component to a target position.

[0065] In summary, the above-mentioned nozzle leveling module, the picking head of the part to be bonded, the bonding method and the storage medium provided by the present invention can detect the parallelism between the nozzle and the part to be bonded by utilizing a flexible board structure provided with multiple air holes and a displacement sensor, and is used to support real-time leveling of the picking head during the process of picking up the part to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0066] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0067] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0068] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0069] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0070] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0071] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A nozzle leveling module, characterized in that: include: A flexible plate structure is installed below the nozzle of the pickup head and has a plurality of air holes distributed thereon so as to be displaced according to the difference in force generated by the air flow passing through each of the air holes; as well as A plurality of displacement sensors are arranged in the plurality of air holes and are respectively used to detect the displacement of the corresponding air holes to characterize the parallelism between the suction nozzle and the workpiece to be bonded.

2. The nozzle leveling module according to claim 1, characterized in that: The suction nozzle is provided with a plurality of suction ducts, wherein each of the air holes is respectively aligned with one of the suction ducts, and the flexible plate structure is closely attached to the suction nozzle.

3. The nozzle leveling module according to claim 1, characterized in that: The plurality of air holes are provided with a filter structure for enlarging the difference in force generated by the air flow passing through each of the air holes.

4. The nozzle leveling module according to claim 1, characterized in that: The nozzle leveling module also includes a controller, which is configured to: When the pickup head approaches the workpiece to be bonded, the displacement of the corresponding pore is determined by each displacement sensor; Determining the distances from the plurality of first positions of the nozzle to the second positions corresponding to the to-be-bonded component according to the displacement of each of the air holes; as well as The pickup head and / or the part to be bonded are leveled according to the distance from each of the first positions to the second position corresponding to the part to be bonded.

5. The nozzle leveling module according to claim 4, characterized in that: The step of determining the distances from the plurality of first positions of the nozzle to the second positions corresponding to the to-be-bonded component according to the displacement of each of the air holes comprises: Determining the forces acting on each of the pores according to the displacement of each of the pores; Determining the air flow velocity flowing through each of the air holes according to the force applied to each of the air holes; and The distances from each of the first positions to the second positions corresponding to the components to be bonded are determined respectively according to the air flow speeds flowing through the air holes.

6. The nozzle leveling module according to claim 5, characterized in that: The step of determining the force applied to each of the pores according to the displacement of each of the pores comprises: According to the displacement of each pore, the force F exerted on each pore is determined respectively: Wherein, w is the displacement of each of the air holes, EI is the bending stiffness of the nozzle leveling module, and L is the distance from the force point to the boundary of each of the air holes.

7. The nozzle leveling module according to claim 5, characterized in that: The step of determining the air flow velocity flowing through each of the air holes according to the force applied to each of the air holes comprises: Determining the air pressure difference on both sides of each of the air holes according to the force applied to each of the air holes; and According to the air pressure difference on both sides of each pore, the air flow velocity v flowing through each pore is determined respectively: Wherein, P is the air pressure on the side of the air hole facing the suction nozzle, P0 is the air pressure on the side of the air hole facing the suction port, and ρ is the gas density.

8. The nozzle leveling module according to claim 5, characterized in that: The step of determining the distance from each first position to the second position corresponding to the to-be-bonded component according to the air flow velocity flowing through each air hole comprises: According to the air flow velocity flowing through each of the air holes, the air path volume V between each of the air holes and the to-be-bonded component is calculated respectively: V=v*t*S Wherein, v is the airflow velocity, t is the inhalation time, and S is the area of ​​the pore; and According to the volume V of the air path between each of the air holes and the workpiece to be bonded, the distance from each corresponding first position on the suction nozzle to its corresponding second position is determined respectively.

9. The nozzle leveling module according to claim 1, characterized in that: The object to be bonded is selected from a wafer or a chip with at least one circuit element.

10. A pick-up head for a part to be bonded, characterized in that: include: A body, comprising a suction nozzle and an air suction port, wherein the air suction port provides negative pressure to the workpiece to be bonded via the suction nozzle to adsorb the workpiece to be bonded; as well as The nozzle leveling module according to any one of claims 1 to 9.

11. A bonding method, characterized in that: The following steps are involved: Controlling the pick-up head as claimed in claim 10 to approach the workpiece to be bonded, and detecting the parallelism between the suction nozzle of the pick-up head and the workpiece to be bonded; Leveling the pickup head and / or the part to be bonded according to the parallelism; as well as The pick-up head contacts and picks up the bonded part through a leveling method, and transfers it to a bonding head to bond the bonded part to a target position.

12. The bonding method according to claim 11, characterized in that: The step of detecting the parallelism between the nozzle of the pickup head and the part to be bonded comprises: When the pickup head approaches the workpiece to be bonded, detecting the displacement of multiple air holes of the nozzle leveling module of the pickup head; and According to the displacement of each of the air holes, the distances from the plurality of first positions of the suction nozzle to the second positions corresponding to the to-be-bonded component are determined.

13. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 11 or 12 is implemented.

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