Wafer grabbing device

Abstract

The invention discloses a wafer grabbing device which comprises a movable grab handle, a movable plate, a reset module, a base plate, a clamping wheel and a plurality of limiting modules. The first end of the movable grab handle is connected with the base plate, the second end of the movable grab handle is connected with the first end of the movable plate, and the second end of the movable plate is connected with the clamping wheel; the reset module is connected with the movable plate and the base plate. The limiting modules are connected with the substrate, and different limiting modules correspond to wafers of different sizes; the movable grab handle is used for driving the movable plate and the clamping wheel to move in the direction far away from the limiting module under the action of external force, so that the wafer can enter and exit the placing space limited by the limiting module and corresponding to the size of the wafer; and the reset module is used for driving the movable plate and the clamping wheel to move in the direction close to the limiting module. According to the wafer grabbing device, wafers of various sizes can be grabbed, and operation is convenient.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer grabbing device. Background Art

[0002] In the manufacture of integrated circuits / semiconductors (ICs), wafers need to be placed and picked up. However, the process of placing and picking up wafers manually requires operators to put their hands into the equipment, which can easily lead to contamination of chemical solutions or accidental injury by the equipment, resulting in danger.

[0003] Currently, wafers are mainly picked up and placed automatically, using a robot with a suction cup or fingers.

[0004] However, for the vast majority of wafer experimental testing and scientific research equipment, especially in the cleaning field, due to the low frequency of wafer placement, strong operation timeliness and high uncertainty of wafer size, the use of robotic arms for automatic loading requires repeated debugging according to the wafer size, causing inconvenience in operation. Summary of the invention

[0005] In view of this, the present application provides a wafer grabbing device to at least partially solve the above technical problems.

[0006] The first aspect of the present application provides a wafer grasping device, comprising: a movable handle, a movable plate, a reset module, a base plate, a clamping wheel and a plurality of limit modules; the first end of the movable handle is connected to the base plate, the second end of the movable handle is connected to the first end of the movable plate, and the second end of the movable plate is connected to the clamping wheel; the reset module is connected to the movable plate and the base plate respectively; the limit module is connected to the base plate, and different limit modules correspond to wafers of different sizes; the movable handle is used to drive the movable plate and the clamping wheel to move in a direction away from the limit module under the action of an external force, so that the wafer can enter and exit the placement space defined by the limit module corresponding to the size of the wafer; the reset module is used to drive the movable plate and the clamping wheel to move in a direction close to the limit module, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheel and the corresponding limit module.

[0007] Optionally, the reset module includes an adjustment block and a spring, one end of the spring is connected to the adjustment block, the other end of the spring is connected to the movable plate, and the adjustment block is connected to the base plate.

[0008] Optionally, the device further comprises: a slider and a guide rail, wherein the guide rail is arranged on the substrate, and the straight line where the guide rail is located is parallel to the straight line where the center line of the spring is located, the slider is connected to the movable plate, and the slider is sleeved on the guide rail.

[0009] Optionally, the device also includes: a fixed handle, the fixed handle is connected to the base plate, the second end of the fixed handle is connected to the first end of the movable handle; the second end of the movable handle is provided with a protrusion, the first end of the movable plate is provided with a slide groove, and the protrusion is provided in the slide groove.

[0010] Optionally, the device further includes: a cover, which is connected to the substrate; and projections of the slider, the guide rail, the reset module and the slide groove on the substrate are located within the projection of the cover on the substrate.

[0011] Optionally, the device further comprises: a hanging ring, wherein the hanging ring is connected to the first end of the fixed handle via a connecting block.

[0012] Optionally, the movable handle further comprises: a gripping portion, and the gripping portion is arranged on the outer surface of the movable handle.

[0013] Optionally, the limiting module comprises: a plurality of limiting blocks, the limiting blocks comprising a limiting portion and a bearing portion, the height of the limiting portion along a direction perpendicular to the substrate being higher than the height of the bearing portion along a direction perpendicular to the substrate.

[0014] Optionally, a height of the limiting module along a direction perpendicular to the substrate is positively correlated with a size of a wafer corresponding to the limiting module.

[0015] Optionally, the multiple limiting modules include a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.

[0016] In this application, the operator takes and places the wafers through the wafer gripping device, which can ensure that the operator's hands are always kept outside the wafer processing equipment, thereby avoiding the risk of the operator putting his hands into the equipment and being contaminated by chemical liquid or being injured. In addition, since the wafer gripping device is provided with a plurality of limit modules corresponding to wafers of different sizes, the operator can take and place wafers of various specifications through the wafer gripping device, and there is no need to adjust the wafer gripping device, which is convenient to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0018] Figure 1 is a schematic diagram of a wafer grabbing device according to an embodiment of the present application; Figure 2 is a schematic diagram of a wafer grabbing device in a wafer grabbing state according to an embodiment of the present application; Figure 3 is a schematic diagram of a use scenario of a wafer grabbing device applicable to an embodiment of the present application; Figure 4 is a schematic diagram of a wafer grabbing device including a guide rail according to an embodiment of the present application; Figure 5 is a schematic diagram of a wafer grabbing device including a cover according to an embodiment of the present application; Figure 6 is a schematic diagram of a wafer grabbing device including a hanging ring according to an embodiment of the present application; Figure 7 is a schematic diagram of a wafer grasping device including a grasping portion according to an embodiment of the present application; Figure 8 It is a partial cross-sectional view of a wafer grabbing device according to an embodiment of the present application.

[0019] 10. Movable handle; 20. Movable plate; 30. Reset module; 40. Base plate; 50. Clamping wheel; 60. Limiting module; 70. Fixed handle; 1. Wafer grasping device; 2. Wafer feeding device; 31. Adjusting block; 32. Spring; 21. Slide groove; 11. Bump; 90. Guide rail; 80. Slider; 14. Connecting block; 15. Grasping part. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0021] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0022] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0023] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0024] Figure 1 A schematic diagram of a wafer grabbing device according to an embodiment of the present application, Figure 2 FIG. 1 is a schematic diagram of a wafer grabbing device in a wafer grabbing state according to an embodiment of the present application. Figure 1-2 As shown, the wafer grasping device 1 includes: a movable handle 10 , a movable plate 20 , a resetting module 30 , a base plate 40 , a clamping wheel 50 and a plurality of limiting modules 60 .

[0025] The first end of the movable handle 10 is connected to the base plate 40, the second end of the movable handle 10 is connected to the first end of the movable plate 20, the second end of the movable plate 20 is connected to the clamping wheel 50, the reset module 30 is respectively connected to the movable plate 20 and the base plate 40, the limit module 60 is connected to the base plate 40, different limit modules 60 correspond to wafers of different sizes, the movable handle 10 is used to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60 under the action of external force, so that the wafer can enter and exit the placement space defined by the limit module 60 corresponding to the size of the wafer, and the reset module 30 is used to drive the movable plate 20 and the clamping wheel 50 to move in a direction close to the limit module 60, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheel 50 and the corresponding limit module 60.

[0026] like Figure 3As shown, when obtaining the wafer, the operator grasps the wafer grasping device 1 and extends the wafer grasping device 1 into the wafer feeding device 2. Then the operator applies external force to the movable handle 10. Under the action of the external force, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60. Then the wafer feeding device 2 lowers the wafer, and the wafer enters the placement space defined by the limit module 60 corresponding to the size of the wafer. After the wafer is placed, the operator stops applying external force to the movable handle 10, and the reset module 30 drives the movable plate 20 and the clamping wheel 50 to move in a direction close to the limit module 60. At this time, the wafer is clamped by the clamping wheel 50 and the corresponding limit module 60 in the placement space. The operator can take out the wafer grasping device 1 and move it to the wafer processing area. When the wafer grasping device 1 is moved to the wafer processing area and the placement space where the wafer is located is located directly above the wafer processing point, the operator applies an external force to the movable handle 10. Under the action of the external force, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60, so that the wafer falls out of the placement space under the action of gravity and is then placed at the wafer processing point.

[0027] It should be noted that different limit modules 60 correspond to wafers of different sizes. For example, the plurality of limit modules 60 may include a limit module 60 corresponding to a four-inch wafer, a limit module 60 corresponding to a six-inch wafer, and a limit module 60 corresponding to an eight-inch wafer. In addition, the length of the movable plate 20 is greater than or equal to the distance from the wafer carrying portion to the wafer access port in the wafer feeding device 2, which can ensure that the operator's hands will not extend into the wafer feeding device 2, thereby preventing the operator's hands from being contaminated with chemical liquids and being accidentally injured by the wafer feeding device 2 and causing danger.

[0028] Specifically, the reset module 30 includes an adjustment block 31 and a spring 32 , one end of the spring 32 is connected to the adjustment block 31 , the other end of the spring 32 is connected to the movable plate 20 , and the adjustment block 31 is connected to the base plate 40 .

[0029] When the operator applies external force to the movable handle 10, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60 under the action of the external force. At this time, since the adjustment block 31 is fixed on the base plate 40, the movable plate 20 is displaced toward the adjustment block 31, resulting in the compression of the spring 32. When the operator stops applying external force to the movable handle 10, the spring 32 applies elastic force to the movable plate 20 to reset the movable plate 20. By providing the adjustment block 31 and the spring 32, the movable plate 20 moving in a direction away from the limit module 60 can be reset in time when the operator stops applying external force, thereby improving the efficiency of clamping the wafer.

[0030] Specifically, the wafer grabbing device 1 further includes: a fixed handle 70, the fixed handle 70 is connected to the base plate 40, and the second end of the fixed handle 70 is connected to the first end of the movable handle 10. The second end of the movable handle 10 is provided with a protrusion 11, and the first end of the movable plate 20 is provided with a slide groove 21, and the protrusion 11 is arranged in the slide groove 21 and moves in the slide groove 21.

[0031] When the operator applies external force to the movable handle 10, the protrusion 11 moves in the slide groove 21, thereby driving the movable plate 20 to move in a direction away from the limiting module 60. By providing the protrusion 11 and the slide groove 21, the movable plate 20 can move more smoothly and steadily.

[0032] When the operator does not need to apply pressure to the movable handle 10 but needs to apply external force to the wafer grasping device 1, for example, when moving the wafer grasping device 1, this can be achieved by grasping the fixed handle 70, thereby preventing the operator from accidentally applying pressure to the movable handle 10, which may cause the wafer to be clamped to be loosened. In addition, the movable handle 10 and the fixed handle 70 are arranged adjacent to each other and extend in the moving direction of the movable plate 20. The wafer grasping device arranged in this way has good balance when grasping the wafer, which can ensure that the pick-up and placement device can operate stably, and the adjacent movable handle 10 and the fixed handle 70 are also convenient for two-handed operation, which can reduce the operating difficulty of the operator.

[0033] In the embodiment of the present application, the operator can take and place the wafer through the wafer grasping device 1, which can ensure that the operator's hands are always kept outside the wafer processing equipment, thereby avoiding the risk of the operator putting his hands into the equipment and being contaminated by chemical liquid or being injured. In addition, since the wafer grasping device 1 is provided with a plurality of limit modules 60 corresponding to wafers of different sizes, the operator can take and place wafers of various specifications through the wafer grasping device 1, and there is no need to adjust the wafer grasping device 1, which is convenient to operate.

[0034] Figure 4 Schematic diagram of a wafer grabbing device including a guide rail according to an embodiment of the present application. Figure 4 As shown, the wafer grasping device 1 also includes: a slider 80 and a guide rail 90, the guide rail 90 is arranged on the substrate 40, and the straight line where the guide rail 90 is located is parallel to the straight line where the center line of the spring 32 is located, the slider 80 is connected to the movable plate 20, and the slider 80 is sleeved on the guide rail 90.

[0035] When the movable plate 20 is driven by the movable handle 10 or driven by the reset module 30, the movable plate 20 will simultaneously drive the slider 80 to move. Since the slider 80 is sleeved on the guide rail 90, the movable plate 20 is limited to move in a direction away from the limit module 60 or in a direction close to the limit module 60. Specifically, a plurality of guide rails 90 may be provided, and a plurality of sliders 80 may be provided on one guide rail 90. The more the number of guide rails 90 and sliders 80, the smoother the movement of the movable plate 20.

[0036] In the embodiment of the present application, by providing the guide rail 90 , the movement direction of the movable panel 20 can be further limited, and the slider 80 can also stabilize the movable panel 20 .

[0037] Figure 5 Schematic diagram of a wafer grabbing device including a cover according to an embodiment of the present application. Figure 5 As shown, the wafer grabbing device 1 further includes a cover 12 , and the cover 12 is connected to the substrate 40 .

[0038] The projections of the slider 80 , the guide rail 09 , the reset module 30 and the slide groove 21 on the base plate 40 are located within the projection of the cover 12 on the base plate 40 .

[0039] In the embodiment of the present application, by providing a cover outside the slider 80, the guide rail 09, the reset module 30 and the slide groove 21, the slider 80, the guide rail 09, the reset module 30 and the slide groove 21 can be protected to avoid damage caused by the invasion of contaminants, thereby improving the service life of the wafer grasping device 1.

[0040] Figure 6 is a schematic diagram of a wafer grabbing device including a hanging ring according to an embodiment of the present application. Figure 6 As shown, the wafer grasping device 1 further includes: a hanging ring 13 , and the hanging ring 13 is connected to the first end of the fixed handle 70 through a connecting block 14 .

[0041] In the embodiment of the present application, by providing a hanging ring 13 at the first end of the fixed handle 70, the wafer grasping device 1 can be hung on a wall or other location when the wafer grasping device 1 is not in use, so as to facilitate the storage of the wafer grasping device 1.

[0042] Figure 7 is a schematic diagram of a wafer grasping device including a grasping portion according to an embodiment of the present application. Figure 7 The movable handle 10 further includes a gripping portion 15 , which is disposed on the outer surface of the movable handle 10 .

[0043] The shape of the gripping portion 15 may correspond to the position of fingers when a person grips the hand.

[0044] In the embodiment of the present application, by providing a gripping portion 15 on the outer surface of the movable handle 10 , it is convenient for an operator to apply an external force to the movable handle 10 , thereby improving the user experience of the operator.

[0045] Figure 8 is a schematic diagram of a wafer grabbing device according to another embodiment of the present application. Figure 8 As shown, the limiting module 60 includes: a plurality of limiting blocks, each of which includes a limiting portion and a bearing portion, wherein a height of the limiting portion along a direction perpendicular to the substrate is higher than a height of the bearing portion along a direction perpendicular to the substrate.

[0046] The placement space for accommodating wafers is defined by the limiting parts and the bearing parts in the plurality of limiting modules 60. The bearing parts are used to bear the wafers, and when the limiting parts are in contact with the side of the wafers, the wafers can be limited. For example, the limiting module 60 corresponding to the four-inch wafer includes four limiting blocks. When the four-inch wafer is placed in the placement space, the bearing parts of the four limiting blocks are in contact with the bottom surface of the wafer, thereby bearing the wafer. After the reset module 30 drives the movable plate 20 and the clamping wheel 50 to move in the direction close to the limiting module 60, the wafer is clamped in the placement space by the clamping wheel 50 and the limiting parts of at least some of the limiting blocks in the four limiting blocks.

[0047] Specifically, the height of the limiting module 60 along the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module 60 .

[0048] Since the wafer grasping device 1 supports the placement of wafers of various sizes, the positions of the limit modules 60 corresponding to wafers of different sizes are different. At the same time, in order to avoid the large-sized wafers being affected by the limit modules 60 corresponding to the small-sized wafers, the height of the limit module 60 along the direction perpendicular to the substrate is set to be positively correlated with the size of the wafer corresponding to the limit module 60, that is, the height of the limit module 60 corresponding to the larger-sized wafer along the direction perpendicular to the substrate is higher than the height of the limit module 60 corresponding to the smaller-sized wafer along the direction perpendicular to the substrate.

[0049] In the embodiment of the present application, since the limiting block includes a limiting portion and a bearing portion, it can limit the wafer and support the wafer at the same time. Combined with the clamping wheel 50, the wafer can be clamped more stably.

[0050] When using the wafer grasping device 1 , the movable handle 10 and the fixed handle 70 can be respectively held with both hands, and the wafer grasping device 1 can be moved above or below the wafer to be grasped.

[0051] Then, the movable handle 10 can be gripped to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60 .

[0052] The movable handle 10 and the fixed handle 70 are moved by hand to allow the wafer to enter the placement space defined by the limiting module 60 corresponding to the size of the wafer. After entering, the movable handle 10 is released to allow the clamping wheel 50 to clamp the wafer.

[0053] The wafer is carried to the wafer processing area by holding the movable handle 10 and the fixed handle 70, that is, the cavity for processing the wafer, see Figure 3 , the handheld part is located outside the cavity of the wafer processing equipment.

[0054] After confirming that the wafer is in the correct position, the movable handle 10 is gripped to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60, the wafer is placed in the wafer processing equipment, and then the wafer grasping device 1 is moved out of the wafer processing equipment.

[0055] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the accompanying drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., it is functionally equivalent), even if the structure is not equivalent to the disclosed structure that performs the function in the exemplary implementation of the present specification shown herein.

[0056] That is, the above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] In order to enable any technician in the field to implement and use the application, the application provides the above description. In the above description, various details are listed for the purpose of explanation. It should be understood that those of ordinary skill in the art can recognize that the application can also be implemented without using these specific details. In other embodiments, the well-known process will not be elaborated in detail to avoid unnecessary details that make the description of the application obscure. Therefore, the application is not intended to be limited to the embodiments shown, but is consistent with the widest range of principles and features disclosed in the application.

[0059] It should be noted that, under the premise of no conflict, the various embodiments and / or the technical features in the various embodiments described in this application can be arbitrarily combined with each other, and the technical solution obtained after the combination should also fall within the protection scope of this application.

[0060] It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art to better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and these improvements or modifications all fall within the scope of protection of the present application.

[0061] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer grabbing device, characterized in that: include: A movable handle, a movable plate, a reset module, a base plate, a clamping wheel and a plurality of limit modules; The first end of the movable handle is connected to the base plate, the second end of the movable handle is connected to the first end of the movable plate, and the second end of the movable plate is connected to the clamping wheel; The reset module is connected to the movable plate and the base plate respectively; The limiting module is connected to the substrate, and different limiting modules correspond to wafers of different sizes; The movable handle is used to drive the movable plate and the clamping wheel to move in a direction away from the limiting module under the action of an external force, so that the wafer can enter and exit the placement space defined by the limiting module corresponding to the size of the wafer; The resetting module is used to drive the movable plate and the clamping wheel to move in a direction close to the limiting module, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheel and the corresponding limiting module.

2. The device according to claim 1, characterized in that The reset module comprises an adjusting block and a spring, one end of the spring is connected to the adjusting block, the other end of the spring is connected to the movable plate, and the adjusting block is connected to the base plate.

3. The device according to claim 2, characterized in that The device further comprises: a slider and a guide rail, wherein the guide rail is arranged on the base plate, and a straight line where the guide rail is located is parallel to a straight line where a center line of the spring is located, the slider is connected to the movable plate, and the slider is sleeved on the guide rail.

4. The device according to claim 3, characterized in that The device further comprises: a fixed handle, the fixed handle being connected to the base plate, the second end of the fixed handle being connected to the first end of the movable handle; The second end of the movable handle is provided with a protrusion, the first end of the movable plate is provided with a slide groove, and the protrusion is arranged in the slide groove.

5. The device according to claim 4, characterized in that The device further comprises: a cover, the cover being connected to the substrate; The projections of the slider, the guide rail, the reset module and the slide groove on the substrate are located within the projection of the cover on the substrate.

6. The device according to claim 4, characterized in that The device further comprises: a hanging ring, wherein the hanging ring is connected to the first end of the fixed handle via a connecting block.

7. The device according to claim 1, characterized in that The movable handle further comprises: a gripping portion, and the gripping portion is arranged on the outer surface of the movable handle.

8. The device according to claim 1, characterized in that The limiting module comprises: a plurality of limiting blocks, each of which comprises a limiting portion and a bearing portion, wherein a height of the limiting portion along a direction perpendicular to the substrate is higher than a height of the bearing portion along a direction perpendicular to the substrate.

9. The device according to claim 1, characterized in that The height of the limiting module along a direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.

10. The device according to any one of claims 1 to 9, characterized in that: The plurality of limiting modules include a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.

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