Wafer grabbing device
By designing a wafer grab device including limit module, movable grip and clamping wheel, the problems of inconvenience and safety hazards during wafer cleaning are solved, and automated wafer pick-up and placement and multi-size adaptation are achieved. .
Patent Information
- Application Number
- CN202411785665.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-02-14
AI Technical Summary
During the wafer cleaning process, due to the low frequency of wafer pick-up and discharge, strong operation instantaneous operation and high uncertainty in wafer size, the robot's automatic loading requires repeated debugging, resulting in inconvenient operation.
Design a wafer grab device, including a substrate, limiting module, movable grip, movable plate and clamping wheel, to automatically clamp and release wafers through reset device and spring mechanism, adapt to wafers of different sizes .
The device can ensure that the operator keeps his hands outside the equipment, avoids contamination of chemical liquid or accidentally being injured by the equipment, and supports the pick-up and placement of multiple wafer sizes without frequent debugging, which improves the convenience and safety of operation.
Smart Images
Figure CN119447018A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer grabbing device. Background Art
[0002] In the manufacture of integrated circuits / semiconductors (ICs), wafers need to be placed and picked up. However, the process of placing and picking up wafers manually requires operators to put their hands into the equipment, which can easily lead to contamination of chemical solutions or accidental injury by the equipment, resulting in danger.
[0003] Currently, wafers are mainly picked up and placed automatically, using a robot with a suction cup or fingers.
[0004] However, for the vast majority of wafer experimental testing and scientific research equipment, especially in the cleaning field, due to the low frequency of wafer placement, strong operation timeliness and high uncertainty of wafer size, the use of robotic arms for automatic loading requires repeated debugging according to the wafer size, causing inconvenience in operation. Summary of the invention
[0005] In view of this, the present application provides a wafer grabbing device to at least partially solve the above technical problems.
[0006] The first aspect of the present application provides a wafer grasping device, which is applied to a wafer cleaning device, comprising: a substrate; a limit module, which is arranged at the first end of the substrate and is used to limit the wafer; a movable handle, which is arranged at the second end of the substrate and is used to be in a gripping state under the action of an external force, and the distance from the limit module to the movable handle is greater than the distance from the wafer supporting part to the inlet and outlet of the wafer cleaning device; a movable plate, which is arranged on the substrate through a reset device, the first end of the movable plate is connected to the clamping wheel, and the second end is movably connected to the movable handle; when the movable handle is in a gripping state, the movable handle drives the movable plate to move to a first position, so as to drive the clamping wheel to move to a clamping position to clamp the wafer; when the movable handle is in a non-gripping state, the reset device drives the movable plate to move to a second position, so as to drive the clamping wheel to move to a non-clamping position.
[0007] Optionally, the reset module includes an adjustment block and a spring, one end of the spring is connected to the adjustment block, the other end of the spring is connected to the movable plate, and the adjustment block is connected to the base plate.
[0008] Optionally, the number of the springs includes a plurality, and the plurality of springs are arranged side by side in the length direction of the substrate and are symmetrically distributed about a center line in the length direction of the substrate.
[0009] Optionally, the device further includes: multiple groups of sliders and guide rails, the guide rails are arranged on the substrate, the sliders are connected to the movable plate, the sliders are sleeved on the guide rails, and the center lines of the multiple groups of sliders and guide rails in the sliding direction overlap with the center lines of the substrate in the length direction.
[0010] Optionally, there are multiple clamping wheels, and center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center line of the substrate in the length direction.
[0011] Optionally, the first end of the movable handle is provided with a plurality of protrusions symmetrically distributed about the center line in the length direction of the substrate, and the second end of the movable plate is provided with a plurality of slide grooves symmetrically distributed about the center line in the length direction of the substrate, and the protrusions are arranged in the slide grooves.
[0012] Optionally, the movable handle further comprises: a gripping portion, and the gripping portion is arranged on the outer surface of the movable handle.
[0013] Optionally, the limiting module comprises: a plurality of limiting blocks, the limiting blocks comprising a limiting portion and a bearing portion, the height of the limiting portion along a direction perpendicular to the substrate being higher than the height of the bearing portion along a direction perpendicular to the substrate.
[0014] Optionally, a height of the limiting module along a direction perpendicular to the substrate is positively correlated with a size of a wafer corresponding to the limiting module.
[0015] Optionally, the limiting modules include multiple ones, namely, a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.
[0016] In the present application, the operator takes and places the wafer using a wafer gripping device, which can ensure that the operator's hands are always kept outside the wafer processing equipment, thereby avoiding the risk of the operator putting his hands into the equipment and being contaminated by chemical liquids or getting injured. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0018] Figure 1 is a schematic diagram of a wafer grabbing device according to an embodiment of the present application; Figure 2 is a schematic diagram of a wafer grabbing device in a wafer grabbing state according to an embodiment of the present application; Figure 3 is a schematic diagram of a use scenario of a wafer grabbing device applicable to an embodiment of the present application; Figure 4 is a schematic diagram of a wafer grabbing device including a guide rail according to an embodiment of the present application; Figure 5 is a schematic diagram of a wafer grabbing device including a cover according to an embodiment of the present application; Figure 6 is a schematic diagram of a wafer grabbing device including a hanging ring according to an embodiment of the present application; Figure 7 is a schematic diagram of a wafer grasping device including a grasping portion according to an embodiment of the present application; Figure 8 It is a partial cross-sectional view of a wafer grabbing device according to an embodiment of the present application.
[0019] 10. Movable handle; 20. Movable plate; 30. Reset module; 40. Base plate; 50. Clamping wheel; 60. Limiting module; 70. Fixed handle; 1. Wafer grasping device; 2. Wafer feeding device; 31. Adjusting block; 32. Spring; 21. Slide groove; 11. Bump; 90. Guide rail; 80. Slider; 14. Connecting block; 15. Grasping part. DETAILED DESCRIPTION
[0020] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.
[0021] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0022] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0023] The technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.
[0024] Figure 1 A schematic diagram of a wafer grabbing device according to an embodiment of the present application, Figure 2 FIG. 1 is a schematic diagram of a wafer grabbing device in a wafer grabbing state according to an embodiment of the present application. Figure 1-2 As shown, the wafer grabbing device 1 comprises: substrate 40; A limiting module 60 is disposed at the first end of the substrate and is used to limit the wafer; A movable grip is arranged at the second end of the substrate and is used to be in a gripping state under the action of an external force, and the distance from the limit module to the movable grip is greater than the distance from the wafer carrying part to the inlet and outlet of the wafer cleaning device 2; A movable plate is arranged on the base plate through a reset device, a first end of the movable plate is connected to the clamping wheel, and a second end of the movable plate is movably connected to the movable handle; When the movable handle is in a gripping state, the movable handle drives the movable plate to move to a first position, thereby driving the clamping wheel to move to a non-clamping position to release the wafer; when the movable handle is in a non-clamping state, the reset device drives the movable plate to move to a second position, thereby driving the clamping wheel to move to a clamping position to clamp the wafer.
[0025] like Figure 3As shown, when obtaining the wafer, the operator applies external force to the movable handle 10, and the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move to a non-clamping position in a direction away from the limit module 60 under the action of the external force. After that, the wafer can enter the placement space defined by the limit module 60 corresponding to the size of the wafer. After the wafer is placed, the operator stops applying external force to the movable handle 10, and the reset module 30 drives the movable plate 20 to move to the second position, and the clamping wheel 50 also moves to a clamping position in a direction close to the limit module 60. At this time, the wafer is clamped by the clamping wheel 50 and the corresponding limit module 60 in the placement space, and the operator can place the limit module 60 on the wafer grasping device 1 into the wafer cleaning device 2 through the inlet and outlet of the wafer cleaning device 2. After the limiting module 60 and the wafer are moved into the wafer cleaning device 2, and the placement space where the wafer is located is located directly above the wafer supporting part of the wafer cleaning device 2, the operator applies an external force to the movable handle 10. The movable handle 10 drives the movable plate 20 to move to the first position under the action of the external force, and the clamping wheel 50 also moves in the direction away from the limiting module 60 to the non-clamping position, so that the wafer falls out of the placement space under the action of gravity and is then placed in the wafer supporting part.
[0026] It should be noted that there can be multiple limit modules 60, corresponding to wafers of different sizes. For example, the multiple limit modules 60 can include a limit module 60 corresponding to a four-inch wafer, a limit module 60 corresponding to a six-inch wafer, and a limit module 60 corresponding to an eight-inch wafer. In addition, the distance from the limit module 60 to the movable handle 10 is greater than the distance from the wafer carrying part of the wafer cleaning device 2 to the entrance and exit, which can ensure that the operator's hand will not be inserted into the wafer cleaning device 2, avoiding the operator's hand from being contaminated with chemical liquid, and being accidentally injured by the wafer cleaning device 2 and causing danger.
[0027] Specifically, the reset module 30 includes an adjustment block 31 and a spring 32 , one end of the spring 32 is connected to the adjustment block 31 , the other end of the spring 32 is connected to the movable plate 20 , and the adjustment block 31 is connected to the base plate 40 .
[0028] When the operator applies external force to the movable handle 10, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60 under the action of the external force. At this time, since the adjustment block 31 is fixed on the base plate 40, the movable plate 20 is displaced toward the adjustment block 31, resulting in the compression of the spring 32. When the operator stops applying external force to the movable handle 10, the spring 32 applies elastic force to the movable plate 20 to reset the movable plate 20. By providing the adjustment block 31 and the spring 32, the movable plate 20 moving in a direction away from the limit module 60 can be reset in time when the operator stops applying external force, thereby improving the efficiency of clamping the wafer.
[0029] The number of the springs includes a plurality, and the plurality of springs are arranged side by side in the length direction of the substrate and are symmetrically distributed about a center line in the length direction of the substrate.
[0030] The plurality of springs are arranged side by side in the length direction of the substrate, which means that the length direction of the springs is the same as the length direction of the substrate, and the arrangement direction of the plurality of springs is the width direction of the substrate.
[0031] The multiple springs are symmetrically distributed about the center line in the length direction of the substrate, which means that there can be two or more springs, and the center lines of the two or more springs in the length direction of the substrate overlap with the center line in the length direction of the substrate.
[0032] Through this arrangement, the overall force of the wafer grasping device 1 can be balanced, thereby improving the stability of the wafer grasping device in grasping the wafer.
[0033] Specifically, the wafer grasping device 1 further includes: a fixed handle 70 , the fixed handle 70 is connected to the base plate 40 , and the second end of the fixed handle 70 is connected to the first end of the movable handle 10 .
[0034] The first end of the movable handle 10 is provided with a plurality of protrusions 11 symmetrically distributed about the center line in the length direction of the substrate, and the second end of the movable plate 20 is provided with a plurality of slide grooves 21 symmetrically distributed about the center line in the length direction of the substrate, and the protrusions 11 are arranged in the slide grooves 21 and move in the slide grooves 21.
[0035] When the operator applies external force to the movable handle 10, the protrusion 11 moves in the slide groove 21, thereby driving the movable plate 20 to move in a direction away from the limit module 60. By providing the protrusion 11 and the slide groove 21, the movement of the movable plate 20 can be smoother and more stable. In addition, the protrusion 11 and the slide groove 21 are also symmetrical about the center line in the length direction of the substrate, further ensuring the force balance of the wafer grasping device 1.
[0036] When the operator does not need to apply pressure to the movable handle 10 but needs to apply external force to the wafer grasping device 1, for example, when moving the wafer grasping device 1, this can be achieved by grasping the fixed handle 70, thereby preventing the operator from accidentally applying pressure to the movable handle 10, which may cause the wafer to be clamped to be loosened. In addition, the movable handle 10 and the fixed handle 70 are arranged adjacent to each other and extend in the moving direction of the movable plate 20. The wafer grasping device arranged in this way has good balance when grasping the wafer, which can ensure that the pick-up and placement device can operate stably, and the adjacent movable handle 10 and the fixed handle 70 are also convenient for two-handed operation, which can reduce the operating difficulty of the operator.
[0037] In the embodiment of the present application, the operator can take and place the wafer through the wafer grasping device 1, which can ensure that the operator's hands are always kept outside the wafer processing equipment, thereby avoiding the risk of the operator putting his hands into the equipment and being contaminated by chemical liquid or being injured. In addition, since the wafer grasping device 1 is provided with a plurality of limit modules 60 corresponding to wafers of different sizes, the operator can take and place wafers of various specifications through the wafer grasping device 1, and there is no need to adjust the wafer grasping device 1, which is convenient to operate.
[0038] Figure 4 Schematic diagram of a wafer grabbing device including a guide rail according to an embodiment of the present application. Figure 4 As shown, the wafer grasping device 1 also includes: multiple groups of sliders 80 and guide rails 90, the guide rails 90 are arranged on the substrate 40, the sliders 80 are connected to the movable plate, the sliders 80 are slidably arranged on the guide rails 90, and the center lines of the multiple groups of sliders and guide rails in the sliding direction overlap with the center lines of the substrate in the length direction. Through the multiple groups of sliders 80 and guide rails 90, the movement process of the substrate can be ensured to be smooth, and the stability of the wafer grasping device 1 is ensured.
[0039] When the movable plate 20 is driven by the movable handle 10 or driven by the reset module 30, the movable plate 20 will simultaneously drive the slider 80 to move. Since the slider 80 is sleeved on the guide rail 90, the movable plate 20 is limited to move in a direction away from the limit module 60 or in a direction close to the limit module 60. Specifically, a plurality of guide rails 90 may be provided, and a plurality of sliders 80 may be provided on one guide rail 90. The more the number of guide rails 90 and sliders 80, the smoother the movement of the movable plate 20.
[0040] In the embodiment of the present application, by providing the guide rail 90 , the movement direction of the movable panel 20 can be further limited, and the slider 80 can also stabilize the movable panel 20 .
[0041] In an embodiment of the present application, there are multiple clamping wheels, and the center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center lines in the length direction of the substrate to further ensure the stability of grasping the wafer.
[0042] In the present application, the distance from the limit module to the movable handle is greater than the distance from the wafer supporting part to the inlet and outlet of the wafer cleaning device, which will cause the length of the substrate to be too long and the distance between the movable handle and the wafer to be far. If the movable handle is not held stably and shakes, the shake transmitted to the wafer may be amplified. By combining springs, bumps, slide rails and guide rails, clamping wheels, etc. symmetrically distributed about the center line in the length direction of the substrate, the stability of the wafer grasping device can be improved. Even if the movable handle is not held stably and shakes, the shake transmitted to the wafer part is smaller.
[0043] Figure 5 Schematic diagram of a wafer grabbing device including a cover according to an embodiment of the present application. Figure 5 As shown, the wafer grabbing device 1 further includes a cover 12 , and the cover 12 is connected to the substrate 40 .
[0044] The projections of the slider 80 , the guide rail 09 , the reset module 30 and the slide groove 21 on the base plate 40 are located within the projection of the cover 12 on the base plate 40 .
[0045] In the embodiment of the present application, by providing a cover outside the slider 80, the guide rail 09, the reset module 30 and the slide groove 21, the slider 80, the guide rail 09, the reset module 30 and the slide groove 21 can be protected to avoid damage caused by the invasion of contaminants, thereby improving the service life of the wafer grasping device 1.
[0046] Figure 6 is a schematic diagram of a wafer grabbing device including a hanging ring according to an embodiment of the present application. Figure 6 As shown, the wafer grasping device 1 further includes: a hanging ring 13 , and the hanging ring 13 is connected to the first end of the fixed handle 70 through a connecting block 14 .
[0047] In the embodiment of the present application, by providing a hanging ring 13 at the first end of the fixed handle 70, the wafer grasping device 1 can be hung on a wall or other location when the wafer grasping device 1 is not in use, so as to facilitate the storage of the wafer grasping device 1.
[0048] Figure 7 is a schematic diagram of a wafer grasping device including a grasping portion according to an embodiment of the present application. Figure 7 The movable handle 10 further includes a gripping portion 15 , which is disposed on the outer surface of the movable handle 10 .
[0049] The shape of the gripping portion 15 may correspond to the position of fingers when a person grips the hand.
[0050] In the embodiment of the present application, by providing a gripping portion 15 on the outer surface of the movable handle 10 , it is convenient for an operator to apply an external force to the movable handle 10 , thereby improving the user experience of the operator.
[0051] Figure 8 is a schematic diagram of a wafer grabbing device according to another embodiment of the present application. Figure 8 As shown, the limiting module 60 includes: a plurality of limiting blocks, each of which includes a limiting portion and a bearing portion, wherein a height of the limiting portion along a direction perpendicular to the substrate is higher than a height of the bearing portion along a direction perpendicular to the substrate.
[0052] The placement space for accommodating wafers is defined by the limiting parts and the bearing parts in the plurality of limiting modules 60. The bearing parts are used to bear the wafers, and when the limiting parts are in contact with the side of the wafers, the wafers can be limited. For example, the limiting module 60 corresponding to the four-inch wafer includes four limiting blocks. When the four-inch wafer is placed in the placement space, the bearing parts of the four limiting blocks are in contact with the bottom surface of the wafer, thereby bearing the wafer. After the reset module 30 drives the movable plate 20 and the clamping wheel 50 to move in the direction close to the limiting module 60, the wafer is clamped in the placement space by the clamping wheel 50 and the limiting parts of at least some of the limiting blocks in the four limiting blocks.
[0053] Specifically, the height of the limiting module 60 along the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module 60 .
[0054] Since the wafer grasping device 1 supports the placement of wafers of various sizes, the positions of the limit modules 60 corresponding to wafers of different sizes are different. At the same time, in order to avoid the large-sized wafers being affected by the limit modules 60 corresponding to the small-sized wafers, the height of the limit module 60 along the direction perpendicular to the substrate is set to be positively correlated with the size of the wafer corresponding to the limit module 60, that is, the height of the limit module 60 corresponding to the larger-sized wafer along the direction perpendicular to the substrate is higher than the height of the limit module 60 corresponding to the smaller-sized wafer along the direction perpendicular to the substrate.
[0055] In the embodiment of the present application, since the limiting block includes a limiting portion and a bearing portion, it can limit the wafer and support the wafer at the same time. Combined with the clamping wheel 50, the wafer can be clamped more stably.
[0056] When using the wafer grasping device 1 , the movable handle 10 and the fixed handle 70 can be respectively held with both hands, and the wafer grasping device 1 can be moved above or below the wafer to be grasped.
[0057] Then, the movable handle 10 can be gripped to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60 .
[0058] The movable handle 10 and the fixed handle 70 are moved by hand to allow the wafer to enter the placement space defined by the limiting module 60 corresponding to the size of the wafer. After entering, the movable handle 10 is released to allow the clamping wheel 50 to clamp the wafer.
[0059] The wafer is carried to the wafer processing area by holding the movable handle 10 and the fixed handle 70, that is, the cavity for processing the wafer, see Figure 3 , the handheld part is located outside the cavity of the wafer processing equipment.
[0060] After confirming that the wafer is in the correct position, the movable handle 10 is gripped to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60, the wafer is placed in the wafer processing equipment, and then the wafer grasping device 1 is moved out of the wafer processing equipment.
[0061] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the accompanying drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., it is functionally equivalent), even if the structure is not equivalent to the disclosed structure that performs the function in the exemplary implementation of the present specification shown herein.
[0062] That is, the above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
[0063] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0064] In order to enable any technician in the field to implement and use the application, the application provides the above description. In the above description, various details are listed for the purpose of explanation. It should be understood that those of ordinary skill in the art can recognize that the application can also be implemented without using these specific details. In other embodiments, the well-known process will not be elaborated in detail to avoid unnecessary details that make the description of the application obscure. Therefore, the application is not intended to be limited to the embodiments shown, but is consistent with the widest range of principles and features disclosed in the application.
[0065] It should be noted that, under the premise of no conflict, the various embodiments described in this application and / or the technical features in each embodiment can be arbitrarily combined with each other, and the technical solution obtained after the combination should also fall within the protection scope of this application.
[0066] It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art to better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and these improvements or modifications all fall within the scope of protection of the present application.
[0067] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A wafer grabbing device, applied to a wafer cleaning device, characterized in that: include: substrate; A limiting module, arranged at the first end of the substrate, for limiting the position of the wafer; A movable handle is arranged at the second end of the substrate and is used to be in a gripping state under the action of an external force, and the distance from the limit module to the movable handle is greater than the distance from the wafer carrying part to the inlet and outlet of the wafer cleaning device; A movable plate is arranged on the base plate through a reset device, a first end of the movable plate is connected to the clamping wheel, and a second end of the movable plate is movably connected to the movable handle; When the movable handle is in a gripping state, the movable handle drives the movable plate to move to a first position, thereby driving the clamping wheel to move to a non-clamping position; when the movable handle is in a non-clamping state, the reset device drives the movable plate to move to a second position, thereby driving the clamping wheel to move to a clamping position to clamp the wafer.
2. The device according to claim 1, characterized in that The reset module comprises an adjusting block and a spring, one end of the spring is connected to the adjusting block, the other end of the spring is connected to the movable plate, and the adjusting block is connected to the base plate.
3. The device according to claim 2, characterized in that The number of the springs includes a plurality, and the plurality of springs are arranged side by side in the length direction of the substrate and are symmetrically distributed about a center line in the length direction of the substrate.
4. The device according to claim 3, characterized in that The device also includes: multiple groups of sliders and guide rails, the guide rails are arranged on the base plate, the sliders are connected to the movable plate, the sliders are slidably arranged on the guide rails, and the center lines of the multiple groups of sliders and guide rails in the sliding direction overlap with the center line of the base plate in the length direction.
5. The device according to claim 4, characterized in that There are multiple clamping wheels, and center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center line of the substrate in the length direction.
6. The device according to claim 3, characterized in that The first end of the movable handle is provided with a plurality of protrusions symmetrically distributed about the center line in the length direction of the substrate, and the second end of the movable plate is provided with a plurality of slide grooves symmetrically distributed about the center line in the length direction of the substrate, and the protrusions are arranged in the slide grooves.
7. The device according to any one of claims 1 to 6, characterized in that: The movable handle further comprises: a gripping portion, and the gripping portion is arranged on the outer surface of the movable handle.
8. The device according to any one of claims 1 to 6, characterized in that: The limiting module comprises: a plurality of limiting blocks, each of which comprises a limiting portion and a bearing portion, wherein a height of the limiting portion along a direction perpendicular to the substrate is higher than a height of the bearing portion along a direction perpendicular to the substrate.
9. The device according to any one of claims 1 to 6, characterized in that: The height of the limiting module along a direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.
10. The device according to any one of claims 1 to 6, characterized in that: The limiting modules include a plurality of limiting modules, namely, a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.