Laser module

Abstract

The invention relates to a laser module. The laser module comprises a circuit carrier plate which comprises a hard plate layer and a flexible plate layer, a part of the flexible plate layer and the hard plate layer are stacked to form a hard plate part of the circuit carrier plate, and a part of the flexible plate layer is located outside the hard plate layer to form a flexible plate part of the circuit carrier plate, the flexible plate part is provided with a first electrode used for being electrically connected with an external element. The laser chip is arranged on the hard plate part and is electrically connected with the first electrode through the hard plate part and the flexible plate part; and the lens assembly is arranged on the hard plate part and corresponds to the laser chip. According to the laser module, the preparation process of the laser module is simplified, and the influence of high temperature in the welding process on the structure and performance reliability of the lens assembly and the laser chip is reduced.

Description

Technical Field

[0001] The present application relates to the field of laser application technology, and in particular to a laser module. Background Art

[0002] Line laser modules usually include a lens for optical shaping, a sleeve for mounting the lens, and a chip carrier for setting the chip. The sleeve is set on the chip carrier by gluing. In traditional line laser modules, the chip carrier usually uses a ceramic substrate made of ceramic material. The ceramic substrate is not easy to be electrically interconnected with the circuit boards of other components. It is usually necessary to weld an additional terminal wire or a flexible circuit board on the ceramic substrate to facilitate electrical connection with the circuit boards of other components. However, the high temperature during the welding process can easily cause problems such as lens deformation or failure of the bonding glue, affecting the structure and performance reliability of the line laser module. Summary of the invention

[0003] Based on this, it is necessary to provide a laser module to improve the structure and performance reliability of the line laser module.

[0004] A laser module, comprising: A circuit board, comprising a hard board layer and a flexible board layer, wherein a portion of the flexible board layer is stacked with the hard board layer to form a hard board portion of the circuit board, and a portion of the flexible board layer is located outside the hard board layer to form a flexible board portion of the circuit board, wherein a first electrode for electrically connecting to an external element is provided on the flexible board portion; a laser chip, which is disposed on the hard board portion and is electrically connected to the first electrode through the hard board portion and the flexible board portion; and, The lens assembly is arranged on the hard plate portion and corresponds to the laser chip.

[0005] The above-mentioned laser module adopts a rigid-flexible integrated board including a flexible board part and a hard board part as a circuit carrier for carrying the laser chip and the lens assembly. The hard board part can meet the bearing strength requirements of the laser chip and the lens assembly, and the first electrode on the flexible board part can be electrically connected to the external element to realize the electrical connection between the laser chip and the external element, thereby eliminating the need to weld terminal wires or flexible circuit boards on the hard board part to achieve electrical connection requirements, which is conducive to simplifying the preparation process of the laser module, omitting a welding process, and reducing the influence of high temperature during the welding process on the structure and performance reliability of the lens assembly and the laser chip, thereby helping to improve the structure and performance reliability of the laser module. In one embodiment, the lens assembly includes a sleeve, a collimating lens and a diffuser lens, and the laser module also includes a bonding structure. The sleeve is bonded to the hard plate portion through the bonding structure and is arranged around the laser chip. The collimating lens and the diffuser lens are arranged in the sleeve and are arranged opposite to the laser chip.

[0006] In one embodiment, the bonding structure is disposed on the surface of the hard plate portion on which the laser chip is disposed, and is disposed around the laser chip, the radial dimension of the sleeve is smaller than the radial dimension of the hard plate portion, the end surface of the sleeve facing the hard plate portion is bonded to the bonding structure, and the orthographic projection of the lens assembly on the hard plate portion falls into the hard plate portion. This is conducive to improving the overall structural reliability of the laser module, and is also conducive to the lead-out of the flexible plate portion, reducing the complexity of the electrical connection structure, and simplifying the preparation process.

[0007] In one of the embodiments, the flexible board layer includes a flexible covering layer, a flexible conductive layer, a flexible insulating layer, a flexible conductive layer and a flexible covering layer stacked in sequence, and the circuit carrier includes two hard board layers, and the two hard board layers are respectively stacked on the two flexible covering layers, and in the direction where the flexible board layer points to the hard board layer, the hard board layer includes a hard insulating layer and a hard conductive layer stacked in sequence.

[0008] In one embodiment, the hard board layer further comprises an electroplated conductive layer disposed on the hard conductive layer facing away from the flexible board layer; and / or, The circuit carrier also includes a solder resist layer stacked on a side of the hard board layer facing away from the flexible board layer.

[0009] In one embodiment, the rigid insulating layer comprises epoxy glass fiber cloth laminate, bismaleimide-triazine resin plate or metal-based reinforcement plate, and the flexible insulating layer is made of polyimide or polyester.

[0010] In one embodiment, the first electrode includes a first positive electrode and a first negative electrode, the hard board portion has a first surface and a second surface disposed opposite to each other, the circuit carrier also includes a patch structure and a second positive electrode disposed on the first surface, and a second negative electrode and a test positive electrode disposed on the second surface, the laser chip is disposed on the patch structure, the patch structure, the second positive electrode, the test positive electrode and the first positive electrode are electrically connected to each other, and the patch structure, the second negative electrode and the first negative electrode are electrically connected to each other.

[0011] In one embodiment, the hard board portion is provided with a first through hole and a second through hole penetrating the hard board portion, and the circuit carrier further comprises a first conductive layer provided on the inner wall surface of the first through hole and a second conductive layer provided on the inner wall surface of the second through hole, the first conductive layer being electrically connected to the second positive electrode and the test positive electrode on the first surface and the second surface, and the second conductive layer being electrically connected to the patch structure and the second negative electrode on the first surface and the second surface. The first through hole and the second through hole are provided in the hard board portion, and the electrical connection between the electrodes is realized through the first conductive layer and the second conductive layer on the inner wall of the first through hole and the second through hole, which is conducive to simplifying the circuit structure setting of the circuit carrier, compressing the size of the circuit carrier, and also conducive to improving the heat dissipation efficiency of the circuit carrier through the provision of through holes.

[0012] In one embodiment, the circuit carrier further includes a heat dissipation structure filled in the first through hole and the second through hole.

[0013] In one embodiment, the circuit carrier further includes a solder resist layer disposed on the hard board portion, the solder resist layer covers the first surface and the second surface corresponding to the patch structure, the second positive electrode, the second negative electrode and the test positive electrode. The circuit carrier further includes a plated cap covering the two end surfaces opposite to the heat dissipation structure, the plated cap seals the first through hole and the second through hole, and is flush with the surface of the solder resist layer facing away from the hard board portion. Thus, the surface flatness of the circuit carrier can be improved, which is conducive to the circuit carrier to better realize the load-bearing and electrical connection functions, and is also conducive to improving the sealing performance inside the circuit carrier and improving the performance stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the structure of the laser module in some embodiments.

[0015] Figure 2 for Figure 1 A schematic diagram of the structure of the laser module from another angle is shown.

[0016] Figure 3 for Figure 2 The cross-sectional schematic diagram of the laser module along the AA direction is shown.

[0017] Figure 4 Schematic cross-sectional view of a circuit carrier in some embodiments.

[0018] Figure 5 FIG. 4 is a schematic diagram of the structure of the first surface side of the circuit carrier in some embodiments.

[0019] Figure 6 FIG. 4 is a schematic diagram of the structure of the second surface side of the circuit carrier in some embodiments.

[0020] Figure 7 Schematic diagram of the internal structure of a circuit carrier in some embodiments.

[0021] Figure 8 FIG. 4 is another block diagram of a circuit carrier in some embodiments.

[0022] Fig. 9 for Figure 8 The cross-sectional view of the circuit carrier along the BB direction is shown.

[0023] Reference numerals: 10. Laser module; 11. Circuit board; 111. Hard board layer; 1111. Hard insulating layer; 1112. Hard conductive layer; 1113. Electroplated conductive layer; 112. Flexible board layer; 1121. Flexible covering layer; 1122. Flexible conductive layer; 1123. Flexible insulating layer; 113. Hard board portion; 1131. First surface; 1132. Second surface; 1133. First through hole; 1134. Second through hole; 1135. The first conductive layer; 1136, heat dissipation structure; 1137, positioning mark; 114, flexible board part; 1151, first positive electrode; 1152, first negative electrode; 1153, solder mask layer; 1154, patch structure; 1155, second positive electrode; 1156, second negative electrode; 1157, test positive electrode; 12, laser chip; 13, lens assembly; 131, sleeve; 132, collimating lens; 133, diffusion lens; 134, adhesion structure. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0025] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0026] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0028] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0030] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 and Figure 2 They are schematic diagrams of the structure of the laser module 10 at different angles in some embodiments, Figure 3 for Figure 2The cross-sectional schematic diagram of the laser module 10 along the AA direction is shown. The laser module 10 provided in the present application can be used to emit laser, and the laser spot emitted by the laser module 10 includes but is not limited to line laser, and the laser module 10 includes but is not limited to any applicable fields such as cutting, welding, measurement, scanning, experimental research, etc.

[0031] In some embodiments, the laser module 10 includes a circuit board 11, a laser chip 12, and a lens assembly 13. The laser chip 12 is used as the light source of the laser module 10 to emit laser light. The type of the laser chip 12 includes but is not limited to any applicable type of laser such as a vertical cavity surface emitting laser, an edge emitting laser, and a horizontal cavity surface emitting laser. The wavelength band of the laser emitted by the laser chip 12 is also not limited, and can be specifically designed according to the application scenario requirements of the laser module 10. The laser chip 12 is arranged on the circuit board 11 and is electrically connected to the circuit board 11. The circuit board 11 is also used to electrically connect to external components, such as external components used to power and / or control the laser chip 12, so as to realize the power supply and control of the laser chip 12 by the external components. In other words, the circuit board 11 plays the role of structural bearing and electrical connection of the laser chip 12.

[0032] The lens assembly 13 is arranged on the circuit board 11 and corresponds to the laser chip 12. The lens assembly 13 may include a sleeve 131 arranged on the circuit board 11 and one or more lenses arranged in the sleeve 131. The sleeve 131 is arranged on the circuit board 11 and arranged around the laser chip 12. The lenses are opposite to the laser chip 12 and are used to optically shape the light emitted by the laser chip 12 before emitting it. The number and type of lenses in the lens assembly 13 are not limited, and can be specifically set according to the optical shaping requirements of the laser module 10. For example, when the laser module 10 is used to emit a line laser, the lens assembly 13 may include a collimating lens 132 and a diffusing lens 133. The collimating lens 132 and the diffusing lens 133 are both opposite to the light emitting side of the laser chip 12. The diffusing lens 133 is arranged on the side of the collimating lens 132 facing away from the laser chip 12. The laser emitted by the laser chip 12 is sequentially shaped by the collimating lens 132 and the diffusing lens 133 before emitting it. The collimating lens 132 includes but is not limited to a plano-convex lens, a biconvex lens, etc., and is used to collimate the light emitted by the laser chip 12 so that the light tends to be a parallel beam. The diffusing lens 133 includes but is not limited to a concave lens, a microlens array, a wave mirror, a holographic diffuser, etc. The diffusing lens 133 is used to diffuse the laser, for example, to diffuse it in one direction to form a line laser.

[0033] Furthermore, combined with Figure 4 and Figure 5As shown, in some embodiments, the circuit carrier 11 includes a hard board layer 111 and a flexible board layer 112, at least part of the layer structure of the hard board layer 111 is made of hard material, and at least part of the material of the flexible board layer 112 is made of flexible material. The flexible board layer 112 is divided into two parts in the extension direction, one of which is stacked with the hard board layer 111 to form a hard board part 113 of the circuit carrier 11 together with the hard board layer 111, and the other part is located outside the hard board layer 111 and forms a flexible board part 114 of the circuit carrier 11. It can be understood that the circuit carrier 11 can be divided into two parts in the extension direction, the hard board part 113 and the flexible board part 114, wherein the hard board part 113 is hard as a whole due to the existence of the hard board layer 111, and the flexible board part 114 is flexible and has flexible deformation ability. Since the flexible board portion 114 and the flexible board layer 112 in the rigid board portion 113 are an integrated structure, the flexible board portion 114 and the rigid board portion 113 can also be regarded as an integrated structure, and the circuit carrier 11 is a rigid-flexible integrated board.

[0034] The laser chip 12 and the lens assembly 13 are both arranged on the hard board layer 111 of the hard board part 113, and the hard board part 113 serves as a structural carrier of the laser chip 12 and the lens assembly 13. A first electrode for electrically connecting to an external element is provided on the flexible board part 114, and the laser chip 12 is electrically connected to the first electrode through the hard board part 113 and the flexible board part 114, so as to realize electrical connection with the external element through the first electrode. In some embodiments, the laser module 10 also includes an adhesion structure 134, which is arranged on the hard board part 113 and around the laser chip 12, and the adhesion structure 134 is located between the end face of the sleeve 131 and the hard board part 113, so as to adhere the sleeve 131 to the hard board part 113.

[0035] The above-mentioned laser module 10 adopts a rigid-flexible integrated board including a flexible board part 114 and a hard board part 113 as a circuit carrier 11 for carrying the laser chip 12 and the lens assembly 13. The hard board part 113 can meet the bearing strength requirements of the laser chip 12 and the lens assembly 13, and the first electrode on the flexible board part 114 can be electrically connected to external components to realize the electrical connection between the laser chip 12 and the external components, so that there is no need to weld terminal wires or flexible circuit boards on the hard board part 113 to achieve electrical connection requirements, which is beneficial to simplifying the preparation process of the laser module 10 and omitting a welding process. At the same time, it is also beneficial to avoid the high temperature of welding causing the adhesion structure 134 to fail and affect the adhesion of the sleeve 131 and the circuit carrier 11, or causing deformation of the lens, etc., thereby reducing the influence of the high temperature during welding on the structure and performance reliability of the lens assembly 13 and the laser chip 12, which is beneficial to improving the structure and performance reliability of the laser module 10.

[0036] In the present application, the cross-sectional shapes of the hard plate portion 113 and the flexible plate portion 114 include but are not limited to any applicable shapes such as square and circle, and can be specifically designed according to installation requirements.

[0037] In some embodiments, the first electrode includes a first positive electrode 1151 and a first negative electrode 1152. The first electrode can be formed by a copper layer, and the first electrode can be electrically connected to an external element by any applicable method such as plugging, buckling, etc. It should be noted that in some embodiments, the first positive electrode 1151 and the first negative electrode 1152 can also be electrically connected to an external element by welding. The first positive electrode 1151 and the first negative electrode 1152 can be formed at one end of the flexible board portion 114 away from the hard board portion 113. Since the first electrode is away from the hard board portion 113, during the welding process of the first electrode, the welding temperature is not easily transmitted to the lens assembly 13, so that it is not easy to cause the adhesion structure 134 to fail or the lens to deform.

[0038] In some embodiments, the radial dimension of the sleeve 131 is smaller than the radial dimension of the hard board portion 113, the end surface of the sleeve 131 facing the hard board portion 113 is bonded to the bonding structure 134, and the orthographic projection of the lens assembly 13 on the hard board portion 113 falls into the hard board portion 113. In other words, the lens assembly 13 is disposed on one side of the hard board portion 113 as a whole, which is beneficial to improving the overall structural reliability of the laser module 10 compared to the traditional method of embedding the circuit board in the sleeve 131, and is also beneficial to the extraction of the flexible board portion 114, reducing the complexity of the electrical connection structure, and simplifying the preparation process.

[0039] refer to Figure 4 As shown, in some embodiments, the flexible board layer 112 includes a flexible covering layer 1121, a flexible conductive layer 1122, a flexible insulating layer 1123, a flexible conductive layer 1122 and a flexible covering layer 1121 which are stacked in sequence. The flexible insulating layer 1123 serves as the base layer of the flexible board layer 112 and plays a major supporting role in the flexible board layer 112. The material of the flexible insulating layer 1123 includes but is not limited to any applicable flexible insulating material such as polyimide (PI) or polyethylene terephthalate (PET). The flexible conductive layer 1122 includes but is not limited to a copper layer. The flexible conductive layer 1122 may be provided with a circuit pattern as a circuit layer of the flexible board layer 112. The material of the flexible covering layer 1121 includes but is not limited to any applicable flexible insulating material such as PI and PET. The flexible covering layer 1121 plays an insulating and protective role for the flexible conductive layer 1122.

[0040] In some embodiments, the first electrode can be formed by partially shrinking the flexible covering layer 1121 to expose a portion of the flexible conductive layer 1122. The flexible board layer 112 arranged in the above-mentioned layer structure can simplify the setting process of the first electrode and facilitate the electrical connection between the circuit carrier 11 and other components.

[0041] In some embodiments, the circuit carrier 11 includes two hard board layers 111, and the two hard board layers 111 are respectively stacked on two flexible cover layers 1121, that is, they are respectively arranged on two opposite sides of the flexible board layer 112. The two hard board layers 111 can provide effective support and protection for the flexible board layer 112 of the hard board portion 113, thereby improving the structural reliability of the circuit carrier 11.

[0042] In some embodiments, in the direction in which the flexible board layer 112 points to the hard board layer 111, the hard board layer 111 includes a hard insulating layer 1111 and a hard conductive layer 1112 which are stacked in sequence. The hard insulating layer 1111 serves as the base layer of the hard board layer 111 and plays a supporting role in the hard board layer 111. The hard insulating layer 1111 includes but is not limited to any applicable hard insulating board material such as an oxygen glass fiber cloth laminate (FR4), a bismaleimide-triazine resin board (BT) or a metal-based reinforcement board. When a metal-based reinforcement board is used as the hard insulating layer 1111, the metal collective includes but is not limited to aluminum or copper, which is beneficial to improving the heat dissipation efficiency of the hard board part 113, thereby improving the overall heat dissipation performance of the laser module 10, and is beneficial to improving the performance stability and service life of the laser module 10. The hard conductive layer 1112 may be provided with a circuit pattern. As the circuit layer of the hard board layer 111, the material of the hard conductive layer 1112 includes but is not limited to copper.

[0043] In some embodiments, the rigid board layer 111 further includes an electroplated conductive layer 1113 disposed on the rigid conductive layer 1112 facing away from the flexible board layer 112. The material of the electroplated conductive layer 1113 includes, but is not limited to, copper. The electroplated conductive layer 1113 is disposed on the outermost side of the rigid board layer 111 through an electroplating process, which is beneficial to improving the overall surface flatness of the circuit carrier 11, thereby facilitating the circuit carrier 11 to better achieve structural bearing and electrical connection, and also beneficial to enhancing the heat dissipation function of the circuit carrier 11. The single layer thickness or the overall thickness of the two layers of the electroplated conductive layer 1113 and the rigid conductive layer 1112 may be greater than or equal to 2Oz, so that the heat can be rapidly expanded and dissipated in the rigid board layer 111, effectively improving the heat dissipation efficiency of the circuit carrier 11.

[0044] In some embodiments, the circuit carrier 11 also includes a solder resist layer 1153 stacked on the side of the hard board layer 111 facing away from the flexible board layer 112. The material of the solder resist layer 1153 includes but is not limited to any applicable material such as epoxy resin, acrylic resin, ink, etc. The solder resist layer 1153 is used to provide protection for the circuit carrier 11 and reduce the risks of short circuit, corrosion, oxidation, etc.

[0045] See also Figure 5 and Figure 6 As shown, in some embodiments, the hard board portion 113 has a first surface 1131 and a second surface 1132 disposed opposite to each other, and the laser chip 12 and the lens assembly 13 can be disposed on one side of the first surface 1131 of the hard board portion 113. The circuit carrier 11 further includes a patch structure 1154 and a second positive electrode 1155 disposed on the first surface 1131, and a second negative electrode 1156 and a test positive electrode 1157 disposed on the second surface 1132. The patch structure 1154 is electrically connected to the second positive electrode 1155 through any applicable conductive member such as a gold wire, and is used to set the laser chip 12. The laser chip 12 can be fixed on the patch structure 1154 by any applicable method such as silver glue bonding. The patch structure 1154, the second positive electrode 1155, the second negative electrode 1156 and the test positive electrode 1157 can all be any applicable conductive layer such as a copper layer set on the surface of the hard board part 113, and of course, they can also be formed by partially exposing the hard conductive layer 1112 of the hard board part 113. The patch structure 1154, the second positive electrode 1155, the test positive electrode 1157 and the first positive electrode 1151 are electrically connected to each other, and the patch structure 1154, the second negative electrode 1156 and the first negative electrode 1152 are electrically connected to each other. It is understandable that when the first positive electrode 1151 and the first negative electrode 1152 are electrically connected to an external element, the laser chip 12 forms an electrical connection loop with the first positive electrode 1151 and the first negative electrode 1152 through the patch structure 1154, thereby achieving electrical connection with the external element. The test positive electrode 1157 is arranged on the second surface 1132, so that the laser chip 12 can be tested through the test positive electrode 1157 and the second negative electrode 1156 on the second surface 1132 during the test phase of the laser module 10, thereby reducing the test difficulty and test cost.

[0046] Furthermore, combined with Figure 4 , Figure 7 , Figure 8 and Fig. 9As shown, the hard board portion 113 is provided with a first through hole 1133 and a second through hole 1134 that penetrate the hard board portion 113, and the circuit carrier 11 further includes a first conductive layer 1135 provided on the inner wall surface of the first through hole 1133 and a second conductive layer (not shown) provided on the inner wall surface of the second through hole 1134. The first conductive layer 1135 is electrically connected to the second positive electrode 1155 and the test positive electrode 1157 on the first surface 1131 and the second surface 1132, and the first conductive layer 1135 is also electrically connected to the flexible conductive layer 1122 in the flexible board layer 112 on the inner wall surface of the first through hole 1133, so that the second positive electrode 1155 is electrically connected to the first positive electrode 1151. The second conductive layer is electrically connected to the patch structure 1154 and the second negative electrode 1156 on the first surface 1131 and the second surface 1132. The second conductive layer is also electrically connected to the flexible conductive layer 1122 in the flexible board layer 112 on the inner wall surface of the second through hole 1134, so that the patch structure 1154, the second negative electrode 1156 and the first negative electrode 1152 are electrically connected. The first through hole 1133 and the second through hole 1134 are arranged in the hard board part 113, and the electrical connection between the electrodes is achieved through the first conductive layer 1135 and the second conductive layer on the inner wall of the first through hole 1133 and the second through hole 1134, which is conducive to simplifying the circuit structure setting of the circuit carrier 11, compressing the size of the circuit carrier 11, and also conducive to improving the heat dissipation efficiency of the circuit carrier 11 through the arrangement of the through holes.

[0047] In some embodiments, the circuit carrier 11 further includes a heat dissipation structure 1136 filled in the first through hole 1133 and the second through hole 1134 . The material of the heat dissipation structure 1136 includes but is not limited to any suitable insulating thermally conductive material such as epoxy resin, silicone, graphite, etc., so as to further improve the heat dissipation efficiency of the circuit carrier 11 .

[0048] Combination Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the solder resist layer 1153 on the surface of the hard board portion 113 can avoid conductive structures such as the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156 and the test electrode. The solder resist layer 1153 covers the first surface 1131 and the second surface 1132 corresponding to the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156 and the test positive electrode 1157, so as to improve the performance reliability of the circuit carrier 11 without affecting the electrical connection performance of the circuit carrier 11.

[0049] In some embodiments, the circuit board 11 further includes electroplated caps covering the two end surfaces opposite to each other of the heat dissipation structure 1136, the electroplated caps seal the first through hole 1133 and the second through hole 1134, and are flush with the surface of the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156 or the test positive electrode 1157 facing away from the hard board portion 113. Thus, the surface flatness of the circuit board 11 can be improved, which is conducive to the circuit board 11 to better realize the load-bearing and electrical connection functions, and is also conducive to improving the sealing performance inside the circuit board 11 and improving the performance stability. The material of the electroplated cap includes but is not limited to copper. It is understandable that one or more of the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, the test positive electrode 1157 and the electroplated cap can be formed by the same layer of electroplated copper layer. For example, after the heat dissipation structure 1136 is filled in the first through hole 1133 and the second through hole 1134, the electroplated conductive layer 1113 of the hard board layer 111 is formed by the electroplated copper layer, and then the solder resist layer 1153 is set, and the parts of the electroplated conductive layer 1113 exposed from the solder resist layer 1153 respectively form different electrodes or cap structures, which is conducive to simplifying the preparation process of the circuit carrier 11 and reducing the preparation cost.

[0050] The number and arrangement order of the first through holes 1133 and the second through holes 1134 are not limited. Figure 7-Figure 9 As shown, in some embodiments, the first through hole 1133 and the second through hole 1134 are provided with a plurality of spaced apart portions, and the first conductive layer 1135 and the second conductive layer provided in the first through hole 1133 and the second through hole 1134 can be directly in contact and connected with the corresponding electrodes on the first surface 1131 and the second surface 1132, or can be electrically connected with the corresponding electrodes through the circuit layer. Providing a plurality of first through holes 1133 and second through holes 1134 can improve the reliability of the electrical connection performance of the circuit carrier 11, and further improve the heat dissipation efficiency of the circuit carrier 11.

[0051] Please see again Figure 5 In some embodiments, the circuit board 11 further includes a positioning mark 1137 disposed on the first surface 1131. The positioning mark 1137 is disposed adjacent to the laser chip 12 and is used to provide a positioning reference for the patch operation of the laser chip 12 on the patch structure 1154 and the assembly operation of the lens assembly 13 on the circuit board 11, thereby improving the positioning accuracy and efficiency. The positioning mark 1137 includes but is not limited to any applicable graphics such as a circle, or a marking point, as long as it can be used as a positioning reference. Figure 5In the embodiment shown, the positioning mark 1137 is taken as two spaced circles as an example. The positioning mark 1137 can be formed by partially exposing the copper conductive layer to adapt to the structure of the circuit carrier 11 and simplify the preparation process of the positioning mark 1137. Of course, the positioning mark 1137 can also be formed by any applicable structure additionally provided on the circuit carrier 11.

[0052] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laser module, characterized in that: include: A circuit board, comprising a hard board layer and a flexible board layer, wherein a portion of the flexible board layer is stacked with the hard board layer to form a hard board portion of the circuit board, and a portion of the flexible board layer is located outside the hard board layer to form a flexible board portion of the circuit board, wherein a first electrode for electrically connecting to an external element is provided on the flexible board portion; A laser chip is disposed on the hard board portion and is electrically connected to the first electrode through the hard board portion and the flexible board portion; and, The lens assembly is arranged on the hard plate portion and corresponds to the laser chip.

2. The laser module according to claim 1, characterized in that: The lens assembly includes a sleeve, a collimating lens and a diffusing lens. The laser module also includes an adhesive structure. The sleeve is bonded to the hard plate portion through the adhesive structure and is arranged around the laser chip. The collimating lens and the diffusing lens are arranged in the sleeve and are arranged opposite to the laser chip.

3. The laser module according to claim 2, characterized in that: The adhesion structure is arranged on the surface of the hard plate part on which the laser chip is arranged, and is arranged around the laser chip. The radial dimension of the sleeve is smaller than the radial dimension of the hard plate part of the sleeve. The end face of the sleeve facing the hard plate part is adhered to the adhesion structure, and the orthographic projection of the lens assembly on the hard plate part falls into the hard plate part.

4. The laser module according to claim 1, characterized in that: The flexible board layer includes a flexible covering layer, a flexible conductive layer, a flexible insulating layer, a flexible conductive layer and a flexible covering layer which are stacked in sequence. The circuit carrier includes two hard board layers, and the two hard board layers are respectively stacked on the two flexible covering layers. In the direction in which the flexible board layer points to the hard board layer, the hard board layer includes a hard insulating layer and a hard conductive layer which are stacked in sequence.

5. The laser module according to claim 4, characterized in that: The hard board layer further includes an electroplated conductive layer disposed on the hard conductive layer facing away from the flexible board layer; and / or, The circuit carrier also includes a solder resist layer stacked on a side of the hard board layer facing away from the flexible board layer.

6. The laser module according to claim 4, characterized in that: The rigid insulating layer comprises an epoxy glass fiber cloth laminate, a bismaleimide-triazine resin plate or a metal-based reinforcement plate, and the material of the flexible insulating layer comprises polyimide or polyester.

7. The laser module according to any one of claims 1 to 6, characterized in that: The first electrode includes a first positive electrode and a first negative electrode, the hard board portion has a first surface and a second surface disposed opposite to each other, the circuit carrier also includes a patch structure and a second positive electrode disposed on the first surface, and a second negative electrode and a test positive electrode disposed on the second surface, the laser chip is disposed on the patch structure, the patch structure, the second positive electrode, the test positive electrode and the first positive electrode are electrically connected to each other, and the patch structure, the second negative electrode and the first negative electrode are electrically connected to each other.

8. The laser module according to claim 7, characterized in that: The hard board portion is provided with a first through hole and a second through hole which pass through the hard board portion, and the circuit carrier also includes a first conductive layer provided on the inner wall surface of the first through hole and a second conductive layer provided on the inner wall surface of the second through hole, the first conductive layer is electrically connected to the second positive electrode and the test positive electrode on the first surface and the second surface, and the second conductive layer is electrically connected to the patch structure and the second negative electrode on the first surface and the second surface.

9. The laser module according to claim 8, characterized in that: The circuit carrier further includes a heat dissipation structure filled in the first through hole and the second through hole.

10. The laser module according to claim 9, characterized in that: The circuit carrier also includes a solder resist layer arranged on the hard board portion, the solder resist layer covers the first surface and the second surface corresponding to the portion outside the patch structure, the second positive electrode, the second negative electrode and the test positive electrode, the circuit carrier also includes an electroplated cap covering the two end surfaces opposite to each other of the heat dissipation structure, the electroplated cap seals the first through hole and the second through hole, and is flush with the surface of the patch structure, the second positive electrode, the second negative electrode and the test positive electrode facing away from the hard board portion.

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