Production process of bridge rectifier module

Abstract

The invention relates to the technical field of rectifiers, in particular to a production process of a bridge rectifier module, which comprises the following steps: preparing structural member materials of a bottom plate and a rectifying mechanism; a chip is welded and fixed with the first electrode plate and the second electrode plate through die bonding and vacuum eutectic processes to form an integrated rectifying mechanism, the integrated rectifying mechanism is tested and then welded and fixed with the bottom plate after being tested, assembly is completed, and detection is conducted again after assembly; and the detected structural part is subjected to one-time injection molding on the outer side of the rectification mechanism through an injection molding process to form a shell, and the rectifier module obtained after injection molding is tested and then put in storage. The novel rectifier bridge module structural design and the injection molding production process are adopted, the usage amount of raw materials is greatly reduced, resources are saved, the alternating current electrode is directly connected with the negative electrode of the chip, and the overcurrent capacity is improved; injection molding is directly completed at a time after the support is welded, the production period and efficiency are greatly improved, the process period is shortened, energy is saved, and energy consumption is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of rectifiers, and in particular to a production process of a bridge rectifier module. Background Art

[0002] The rectifier module works by the unidirectional conduction principle of the diode. Generally speaking, the diode conducts in the forward direction and cuts off in the reverse direction, that is, the diode only allows current to flow in from the anode and out from the cathode. Therefore, when it is connected to an AC circuit, it can rectify the current in the circuit into DC. A bridge rectifier device composed of several (two or four and six) rectifier diodes sealed together is called a rectifier bridge, and its main function is to convert AC into DC. Rectifier modules are divided into three-phase bridges, single-phase full bridges and half bridges.

[0003] The common welding rectifier module packaging structure mainly includes busbar electrodes, chips, welding layers, linings and substrates. The connection technology between the various parts constitutes the key technology of rectifier module packaging, which can be divided into two aspects: chip welding and fixing, and interconnection and lead-out of chip electrodes. In order to improve the reliability of the module, the thermal expansion coefficient (CTE) of each part of the material must match, the heat dissipation characteristics must be good, the connection interface must be as few as possible and the connection must be firm. The common existing welding processes include the following: Traditional wafer welding packaging process: chip deoxidation layer--tin paste coating--electrode chip placement--tunnel sintering (mostly electric furnace welding)--cleaning rosin residue--semi-finished product testing--pressing shell--filling with silicone gel--filling with epoxy resin---final test----warehousing; the existing process requires three steps: pressing shell--filling with silicone gel--filling with epoxy resin, and the time is three days.

[0004] Ordinary GPP chip welding process: structural parts preparation---solid crystal---adding molybdenum sheet---vacuum eutectic----void detection---secondary welding (electrode)---pressing shell---filling with silicone gel----final test----warehousing.

[0005] Shiling Electronics welding process: structural parts preparation --- solid crystal --- vacuum eutectic --- void inspection --- aluminum wire bonding --- secondary welding (electrode) --- press-fit shell --- silicone gel filling --- final test --- storage.

[0006] The existing welding packaging process has many production processes and consumes a lot of energy. Moreover, the electrode is generally made of a whole piece of material, which consumes a lot of materials. Due to the many and complex production processes, the production cycle is long and the production efficiency is low. Therefore, those skilled in the art provide a production process for a bridge rectifier module to solve the problems raised in the above background technology. Summary of the invention

[0007] To solve the above technical problems, the present invention provides a bridge rectifier module, including a base plate, a rectifier mechanism is welded and fixed to the upper end of the base plate, and an outer cover of the rectifier mechanism is provided with a shell that together with the base plate forms a protective shell for the rectifier mechanism.

[0008] Preferably: a through hole is provided on the left side of the bottom plate, and a U-shaped groove is provided on the right side thereof.

[0009] Preferably: a plurality of pads are provided at the upper end of the bottom plate, the pads are horizontally evenly distributed on the upper surface of the bottom plate, and the bottom plate is fixed to the rectifying mechanism by welding through the pads.

[0010] Preferably: the rectifying mechanism is made of copper, and comprises a plurality of electrode sheets 1, the number of the electrode sheets 1 corresponds to the number of the pads, the electrode sheets 1 are arranged in an L-shape, and the bottom of the electrode sheets 1 is welded and fixed on the pads.

[0011] Preferably: two power bridges are provided at the upper end of the electrode sheet 1, the two power bridges are distributed front and back, each power bridge is connected to the electrode sheet 1, and a protective ring is provided at the connection between the power bridge and the electrode sheet 1, and the protective ring is made of silicone ring.

[0012] Preferably: an electrode sheet 2 is provided on one side adjacent to the two power-carrying bridges, and the two electrode sheets 2 are arranged diagonally, one end of the electrode sheet 2 is connected to the power-carrying bridge, and the other end is connected to the lower side of the electrode sheet 1 through a support foot.

[0013] Preferably, the shell is made of plastic material, which is formed by injection molding and covers the outside of the rectification mechanism.

[0014] Preferably: side grooves are provided on both the left and right sides of the shell.

[0015] In addition, the present invention also provides a production process of a bridge rectifier module, which is used to process the above rectifier module, and the specific steps are as follows: 1) Structural parts preparation: prepare the structural parts materials of the base plate and rectifier mechanism; 2) Welding assembly: The chip is welded and fixed to the electrode sheet 1 and the electrode sheet 2 through the process of crystal bonding and vacuum eutectic to form an integrated rectifier mechanism, which is then tested and then welded and fixed to the base plate to complete the assembly. After assembly, the chip is tested again; 3) Injection molding: The structural parts tested in step 2) are molded at one time on the outside of the rectifier mechanism through the injection molding process to form a shell. The injection molded rectifier module is tested and stored in the warehouse.

[0016] Technical effects and advantages of the present invention: The present invention adopts a new rectifier bridge module structure design and an injection molding production process, which greatly reduces the use of raw materials and saves resources. The AC electrode is directly connected to the negative electrode of the chip to improve the current capacity. After the bracket is welded, the injection molding is completed in one go, which greatly improves the production cycle and efficiency, shortens the process cycle, saves energy, and reduces energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 is a top view of the present invention; Figure 3 It is a partial exploded schematic diagram of the present invention; Figure 4 It is a structural schematic diagram of the rectifying mechanism in the present invention.

[0018] In the figure: 1. Bottom plate; 11. Through hole; 12. U-shaped groove; 13. Pad; 2. Rectification mechanism; 21. Electrode sheet 1; 22. Power bridge; 23. Electrode sheet 2; 24. Support foot; 25. Protective ring; 3. Shell; 31. Side groove. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0020] Example 1 See also Figure 1 to Figure 4 In this embodiment, a bridge rectifier module is provided, including a base plate 1, a rectifier mechanism 2 is arranged on the upper end of the base plate 1, and the two are welded and fixed, and a shell 3 is arranged on the outer cover of the rectifier mechanism 2, and the shell 3 and the base plate 1 wrap and cover the rectifier mechanism 2, so as to protect the rectifier circuit and avoid the influence of external electrical components on it during use; Among them, a through hole 11 is opened on the left side of the bottom plate 1, and a U-shaped groove 12 is set on the right side. In addition, a plurality of pads 13 are provided on the upper end of the bottom plate 1. The pads 13 are horizontally evenly spaced and distributed on the upper surface of the bottom plate 1. In the present application, three pads 13 are provided, and the bottom plate 1 is welded and fixed to the rectifier mechanism 2 through the pads 13; The rectifier mechanism 2 is made of copper material with good heat dissipation and good electrical conductivity. In the rectifier mechanism 2, multiple electrode sheets 21 are included. The number of electrode sheets 21 corresponds to the number of pads 13. The electrode sheets 21 are set in an L shape, and their bottoms are welded and fixed on the pads 13, so as to form a form in which multiple electrode sheets 21 are horizontally distributed on the upper surface of the bottom plate 1. In the present application, three electrode sheets 21 are set, which corresponds to the number of pads 13. At the same time, two power bridges 22 are provided at the upper ends of the electrode sheets 21. , two power-on bridges 22 are distributed front and back, each power-on bridge 22 is connected to the electrode sheet 1 21, and a protective ring 25 is provided at the connection between the power-on bridge 22 and the electrode sheet 1 21. The protective ring 25 is made of a silicone ring and plays a role in protecting the chip. The electrode sheet 23 is provided on the side close to the two power-on bridges 22. The two electrode sheets 23 are arranged diagonally. One end of the electrode sheet 23 is connected to the power-on bridge 22, and the other end is connected to the lower side of the electrode sheet 1 21 through the support foot 24 to achieve stable support for the electrode sheet 23; The shell 3 is made of plastic and is formed by injection molding and covers the outside of the rectifier mechanism 2. Side grooves 31 are provided on both sides of the shell 3 to avoid affecting the through hole 11 and the U-shaped groove 12 so that they can be used normally.

[0021] Example 2 In this embodiment, a production process of a bridge rectifier module is provided, which is specifically used to process the rectifier module in Embodiment 1. The specific process steps are as follows: 1) Structural parts preparation: Prepare the structural parts materials of the bottom plate 1 and the rectifier mechanism 2. Among them, the electrode sheet 1 21 and the electrode sheet 2 23 are both single-piece structures, which are different from the traditional whole-piece structure. At the same time, the electrode sheet 23 and the power bridge 22 are integrated into an integrated molding design, which is convenient for assembly welding, conducive to installation, and saves time; 2) Welding assembly: The chip is welded and fixed to the electrode sheet 1 21 and the electrode sheet 2 23 through the process of crystal bonding and vacuum eutectic. Since the existing technology is adopted, the specific process parameters and processes are omitted here to form an integrated rectifier mechanism 2, which is tested and then welded and fixed to the bottom plate 1 to complete the assembly, and then tested again after assembly; 3) Injection molding: The structural parts tested in step 2) are injection molded on the outside of the rectifier mechanism 2 to form a housing 3. The injection molding can be completed in one step within 5-6 hours, and the injection molding process can be automated, which greatly saves time and improves efficiency. The process is now done by one person instead of five people. After the injection molded rectifier module is tested, it can be stored in the warehouse.

[0022] The rectifier bridge module of the present invention adopts the above-mentioned production process. Since the electrode is in a monomer form, more than 60% of copper materials are saved in the preparation of the electrode. The entire internal structure is changed from the original No. 123 chip reversely connected to the positive electrode of the No. 456 chip to the AC electrode directly connected to the negative electrode of the chip, which improves the current capacity. After the bracket is welded, the injection molding is completed in one time, which greatly improves the production cycle and efficiency. The present invention can greatly improve production efficiency and effectively reduce energy usage, such as electricity costs, and solve the problem of multiple production processes and high energy consumption in traditional processes; The present invention greatly reduces the use of materials, and the amount of copper used is greatly reduced. Compared with the traditional process, the amount of copper used is only 50% of the original; The production process of the invention is simple, and the original production cycle is reduced to two days, while the production cycle of the traditional process is about 6-7 days, thereby improving efficiency.

[0023] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A bridge rectifier module, characterized in that: It comprises a bottom plate (1), a rectifying mechanism (2) being welded and fixed to the upper end of the bottom plate (1), and an outer cover of the rectifying mechanism (2) being provided with a shell (3) which, together with the bottom plate (1), forms a protective function for the rectifying mechanism (2).

2. A bridge rectifier module according to claim 1, characterized in that: The left side of the bottom plate (1) is provided with a through hole (11), and the right side thereof is provided with a U-shaped groove (12).

3. A bridge rectifier module according to claim 2, characterized in that: A plurality of welding pads (13) are provided at the upper end of the bottom plate (1), the welding pads (13) are horizontally distributed at equal intervals on the upper surface of the bottom plate (1), and the bottom plate (1) is fixed to the rectifying mechanism (2) by welding via the welding pads (13).

4. A bridge rectifier module according to claim 3, characterized in that: The rectifying mechanism (2) is made of copper. The rectifying mechanism (2) comprises a plurality of electrode sheets (21). The number of electrode sheets (21) corresponds to the number of welding pads (13). The electrode sheets (21) are arranged in an L shape, and their bottoms are welded and fixed on the welding pads (13).

5. A bridge rectifier module according to claim 4, characterized in that: Two power bridges (22) are provided at the upper end of the electrode sheet one (21), the two power bridges (22) are distributed front and back, each power bridge (22) is connected to the electrode sheet one (21), and a protective ring (25) is provided at the connection between the power bridge (22) and the electrode sheet one (21), and the protective ring (25) is made of a silicone ring.

6. The bridge rectifier module according to claim 5, characterized in that: Electrode sheet 2 (23) is provided on one side of the two power-carrying bridges (22) that are close to each other. The two electrode sheets 2 (23) are arranged diagonally. One end of the electrode sheet 2 (23) is connected to the power-carrying bridge (22), and the other end is connected to the lower side of the electrode sheet 1 (21) via a support foot (24).

7. The bridge rectifier module according to claim 1, characterized in that: The housing (3) is made of plastic material, is formed by an injection molding process, and covers the outside of the rectification mechanism (2).

8. The bridge rectifier module according to claim 7, characterized in that: Side grooves (31) are provided on both left and right sides of the housing (3).

9. A production process for a bridge rectifier module, used for processing the rectifier module according to claims 1-8, characterized in that: The specific steps are as follows: 1) Preparation of structural parts: Prepare the structural parts materials of the base plate (1) and the rectifier mechanism (2); 2) Welding assembly: The chip is welded and fixed to the electrode sheet 1 (21) and the electrode sheet 2 (23) through the process of crystal bonding and vacuum eutectic to form an integrated rectifier mechanism (2), which is tested and then welded and fixed to the base plate (1) to complete the assembly, and then tested again after assembly; 3) Injection molding: The structural parts tested in step 2) are once-in-one injection molded on the outside of the rectifier mechanism (2) to form a housing (3) through an injection molding process. The injection molded rectifier module is tested and then stored in a warehouse.

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