Heat conduction component, manufacturing method thereof and circuit board

Abstract

The invention discloses a heat conduction component, a manufacturing method thereof and a circuit board. Wherein the heat conduction part comprises a metal heat conduction main body, at least one surface of the metal heat conduction main body in the thickness direction is provided with insulating ceramic, the insulating ceramic comprises a ceramic substrate and metal films arranged on two opposite surfaces of the ceramic substrate, and the insulating ceramic and the metal heat conduction main body are connected through a metal sintering material. The manufacturing method of the heat-conducting component comprises the following steps of: fixing a metal mask with mask through holes on at least one side surface of a metal heat-conducting plate; a precursor of a metal sintering material is arranged at the bottom of the mask through hole, and then insulating ceramic is placed in the mask through hole; hot pressed sintering is carried out to realize connection between the insulating ceramic and the metal heat-conducting plate by using a metal sintering material; and cutting the metal heat-conducting plate to obtain the heat-conducting component. The heat-conducting component has good heat-conducting and insulating properties, and has better heat-conducting stability than a ceramic heat-conducting component.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards; more specifically, to a heat-conducting component for a circuit board and a manufacturing method thereof. Background Art

[0002] In order to improve the thermal conductivity, a metal thermal conductive component such as pure copper can be set in the circuit board. Pure copper material has good processability and a thermal conductivity of up to about 400W / m·K, and the thermal conductivity only slightly decreases with the increase of the operating temperature, and has good thermal conductivity stability. However, because copper is a conductive material, when using copper thermal conductive components, conductive structures cannot be made on the copper thermal conductive components. The circuit board needs to adopt a structural design of electrical and thermal separation, and it is easy to cause the problem of relatively poor voltage resistance performance of the circuit board.

[0003] Compared with metal thermal conductive parts, the use of ceramic thermal conductive parts with insulating properties can improve the voltage resistance of the circuit board, and the conductive structure can be set on the ceramic thermal conductive parts, but the thermal conductivity of the ceramic thermal conductive parts will significantly decrease with the increase of the working temperature. Taking aluminum nitride ceramics as an example, its thermal conductivity at room temperature is about 170W / m·K, but it decreases to about 150W / m·K (a decrease of about 11.7%) with the increase of the working temperature. There are problems such as poor thermal conductivity stability and a significant decrease in thermal conductivity at working temperature. Summary of the invention

[0004] In view of the deficiencies of the prior art, the main purpose of the present invention is to provide a heat-conducting component having both heat-conducting and insulating properties and improved heat-conducting stability, and a method for manufacturing the same.

[0005] Another object of the present invention is to provide a circuit board using the aforementioned heat-conducting component.

[0006] In order to achieve the above-mentioned main purpose, the first aspect of the present invention discloses a heat-conducting component, including a metal heat-conducting body; the metal heat-conducting body is provided with a metallized insulating ceramic on at least one surface in its thickness direction, the insulating ceramic includes a ceramic substrate and a metal film, the metal film is arranged on the surface of the ceramic substrate facing and facing away from the metal heat-conducting body, and the insulating ceramic and the metal heat-conducting body are fixedly connected by a metal sintered material.

[0007] In the above technical solution, the heat-conducting component includes a metal heat-conducting body and an insulating ceramic with a metallized surface, which has good thermal conductivity and insulation properties; the metal heat-conducting body and the insulating ceramic are connected by a metal sintered material, which is beneficial to improve the bonding strength and reduce the interface thermal resistance; a conductive structure can be set on the insulating ceramic of the heat-conducting component to meet the different electric heating structure design requirements of the circuit board.

[0008] In addition, compared with ceramic thermal conductive components, thermal conductive components including metal and ceramic can reduce the amount of ceramics with relatively poor thermal conductivity stability, give full play to the advantages of high thermal conductivity stability of the metal thermal conductive body, and make the thermal conductive component have a more stable thermal conductivity as a whole.

[0009] Furthermore, the thickness of the metal heat-conducting body is 0.6 mm to 2.0 mm, and the thickness of the ceramic substrate is 0.1 mm to 0.5 mm.

[0010] Furthermore, the material of the ceramic substrate is aluminum nitride, aluminum oxide or silicon nitride ceramic, and the material of the metal heat-conducting body is pure copper.

[0011] Furthermore, a copper foil layer is provided on the metal film on a side of the ceramic substrate away from the metal heat-conducting body.

[0012] In order to achieve the above main purpose, the second aspect of the present invention discloses a method for manufacturing a heat conducting component, comprising the following steps:

[0013] S101, fixing a metal mask on at least one side of the metal heat conducting plate, wherein a plurality of mask through holes are processed in the metal mask;

[0014] S102, placing a precursor of a metal sintering material at the bottom of the mask through hole, and then placing an insulating ceramic in the mask through hole; wherein the insulating ceramic includes a ceramic substrate and a metal film disposed on two opposite surfaces of the ceramic substrate;

[0015] S103, hot pressing and sintering, so as to use the metal sintered material to realize a fixed connection between the insulating ceramic and the metal heat conducting plate;

[0016] S104, cutting the metal heat-conducting plate to obtain the heat-conducting component.

[0017] In the above technical solution, multiple independent insulating ceramics are first sintered and connected on the metal heat conducting plate, and then the metal heat conducting plate is cut into plates to obtain the heat conducting component. On the one hand, it is beneficial to reduce the sintering stress between the metal heat conducting plate and the insulating ceramic, reduce the warping deformation of the metal heat conducting plate, and improve the shape and dimensional accuracy of the heat conducting component. On the other hand, there is no need to cut the insulating ceramic when dividing the plate, which can reduce the difficulty of dividing the plate and improve production efficiency. The mask through hole of the metal mask can limit the setting range of the metal sintering material precursor and position the insulating ceramic to achieve precise sintering of the insulating ceramic on the metal heat conducting plate.

[0018] Furthermore, in step S102, after the insulating ceramic is placed, a metal cover is fixed on the metal mask, and the metal cover is in contact with the insulating ceramic.

[0019] Furthermore, in step S101, the metal masks are respectively set on both side surfaces of the metal heat conducting plate; in step S102, the metal masks on both side surfaces of the metal heat conducting plate are successively made to face upward, and the upward metal masks are subjected to operations of setting a precursor of a metal sintering material, placing insulating ceramics, and setting a metal cover plate.

[0020] Furthermore, the thermally conductive component manufacturing method includes the following steps performed between step S103 and step S104:

[0021] S201, electroplating a copper foil layer on the metal film on a side of the ceramic substrate away from the metal heat conducting plate.

[0022] According to a specific implementation of the present invention, the metal mask is a copper mask.

[0023] In order to achieve the other objective mentioned above, the third aspect of the present invention discloses a circuit board, comprising a substrate; any one of the aforementioned heat-conducting components is provided in the substrate.

[0024] Optionally, at least one side surface of the circuit board has a surface circuit layer arranged on the substrate and the ceramic substrate.

[0025] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of the first structure of the heat conducting component in Example 1;

[0027] Figure 2 is a schematic diagram of a second structure of the heat conducting component in Example 1;

[0028] Figure 3 is a third structural schematic diagram of the heat conducting component in Example 1;

[0029] Figure 4 is a schematic diagram of the structure after a metal mask is provided on the surface of the metal heat conducting plate in Example 1;

[0030] Figure 5 is a schematic structural diagram of the embodiment 1 after a metal sintering material precursor is disposed at the bottom of the upward mask through hole;

[0031] Figure 6 It is a schematic diagram of the structure after insulating ceramic is placed in the upward mask through hole and a metal cover plate is arranged on the metal mask in Example 1;

[0032] Figure 7It is a schematic diagram of the structure in which the metal heat conducting plate in Example 1 is turned over, an insulating ceramic is placed in the through hole of the upward mask, and a metal cover plate is arranged on the metal mask;

[0033] Figure 8 is a schematic diagram of the structure of cutting the metal heat conducting plate into plates in Example 1;

[0034] Fig. 9 is a schematic structural diagram of the heat conducting component in Example 2;

[0035] Fig.10 is a schematic diagram of the structure after the copper foil layer is electroplated on the metal film of the insulating ceramic in Example 2;

[0036] Fig.11 is a schematic diagram of the structure of cutting the metal heat conducting plate into plates in Example 2;

[0037] Fig.12 is a first structural schematic diagram of a circuit board embodiment;

[0038] Fig.13 2 is a second structural schematic diagram of a circuit board embodiment. DETAILED DESCRIPTION

[0039] In the following description, many specific details are explained in conjunction with specific embodiments to facilitate a full understanding of the present invention. However, it should be understood that the following embodiments and detailed descriptions are only for illustrative purposes and do not limit the scope of protection of the present invention.

[0040] Heat-conducting component and manufacturing method thereof Embodiment 1

[0041] like Figures 1 to 3 As shown, the heat conducting component 100 of Embodiment 1 includes a metal heat conducting body 110, and the metal heat conducting body 110 is provided with an insulating ceramic 120 on one or two surfaces in the thickness direction thereof, and the insulating ceramic 120 and the metal heat conducting body 110 are connected by a metal sintering material 130. The thickness direction of the metal heat conducting body 110 refers to a direction perpendicular to the surface of the metal heat conducting body 110 connected to the insulating ceramic 120, such as the up and down direction shown in the figure.

[0042] In the embodiment, the heat conducting component 100 includes a metal heat conducting body 110 and an insulating ceramic 120, which has good heat conducting and insulating properties. A conductive structure can be provided on the insulating ceramic 120 of the heat conducting component 100 to meet different electric heating structure design requirements of the circuit board.

[0043] When viewed along the thickness direction of the metal heat-conducting body 110, the insulating ceramic 120 may cover the surface of the metal heat-conducting body 110 (see FIG. Figure 1 and Figure 3 ), and may also have a distance from the surface edge of the metal heat-conducting body 110 (see Figure 2 ). There is no limitation on the outer shape of the metal heat-conducting body 110; for example, the projection shape of the metal heat-conducting body 110 in the thickness direction thereof may be circular or square.

[0044] The material of the metal heat-conducting body 110 is preferably pure copper with high thermal conductivity. The insulating ceramic 120 is a ceramic with metallized surface, including a ceramic substrate 121 and a metal film 122. The metal film 122 is arranged on the surface of the ceramic substrate 121 facing and facing away from the metal heat-conducting body 110, so as to realize the reliable connection between the insulating ceramic 120 and the metal heat-conducting body 110 and to make a copper foil layer on the insulating ceramic 120.

[0045] In the present invention, the material of the ceramic substrate 121 can be any one of aluminum nitride, aluminum oxide and silicon nitride ceramics. The metal film 122 can be made by PVD (Physical Vapor Deposition) technology, and its thickness is generally not more than 5μm, such as 0.5μm to 5μm. Exemplarily, the metal film 122 can be a single-layer metal film or a multi-layer metal film, such as a multi-layer composite metal film including a titanium film and a copper film, and the titanium film is arranged between the copper film and the ceramic substrate 121 to ensure good bonding between the metal film 122 and the ceramic substrate 121.

[0046] Preferably, the ceramic substrate 121 has a thickness less than that of the metal heat-conducting body 110, so as to further reduce the amount of ceramic with relatively poor thermal conductivity stability in the heat-conducting component 100, give full play to the advantage of high thermal conductivity stability of the metal heat-conducting body 110, and make the heat-conducting component 100 have a more stable thermal conductivity as a whole. More preferably, the thickness of the metal heat-conducting body 110 is at least four times that of the ceramic substrate 121. Exemplarily, the thickness of the metal heat-conducting body 110 is 0.6 mm to 2.0 mm, for example, about 1.1 mm; the thickness of the ceramic substrate 121 is 0.1 mm to 0.5 mm, for example, about 0.2 mm.

[0047] The metal sintering material 130 may be a silver sintering material, and nano silver sintering material is particularly preferred. The thickness of the metal sintering material 130 may be 0.01 mm to 0.1 mm, for example, about 0.05 mm. The metal heat conducting body 110 and the insulating ceramic 120 are connected by the metal sintering material 130, which is beneficial to improve the bonding force and reduce the interface thermal resistance.

[0048] In a specific embodiment, the metal heat-conducting body 110 is pure copper with a thickness of 1.1 mm, the ceramic substrate 121 of the insulating ceramic 120 on both surfaces is aluminum nitride ceramic with a thickness of 0.2 mm, and the metal sintering material 130 is a silver sintering material with a thickness of 0.05 mm and a thermal conductivity of 150 W / m·K. In this specific embodiment, the overall thermal conductivity of the heat-conducting component 100 at room temperature is about 280 W / m·K, and the thermal conductivity at the working temperature is about 260 W / m·K, and the decrease in thermal conductivity is about 7.1%, which has better thermal conductivity and thermal stability than the aluminum nitride ceramic heat-conducting component.

[0049] Hereinafter, an exemplary method for manufacturing a heat-conducting component in the present invention is described by taking a heat-conducting component 100 in which insulating ceramics 120 are disposed on two opposite surfaces of a metal heat-conducting body 110 in a thickness direction as an example.

[0050] like Figure 3 As shown, the method for manufacturing a heat-conducting component includes step S101 of setting a metal mask 310: providing a metal heat-conducting plate 110a for forming a metal heat-conducting body 110, and setting metal masks 310 with multiple mask through holes 311 on both side surfaces of the metal heat-conducting plate 110a.

[0051] In the present invention, the metal mask 310 can be a copper mask, an aluminum mask or a stainless steel mask, preferably a copper mask to conduct sintering heat more quickly. The mask through hole 311 can be obtained by laser or mechanical cutting, punching, etc., and the present invention is not limited to this.

[0052] like Figures 4 to 6 As shown, after step S101, the following step S102 is performed: the metal masks 310 on both side surfaces of the metal heat conducting plate 110a are successively directed upward, and the precursor 130a of the metal sintering material 130 is successively arranged at the bottom of the upward mask through hole 311 (i.e., the surface of the metal heat conducting plate 110a exposed to the mask through hole 311), the insulating ceramic 120 is placed in the mask through hole 311, and the metal cover plate 320 is arranged on the metal mask 310.

[0053] In the present invention, the insulating ceramic 120 can be obtained by cutting the insulating ceramic plate with a metallized surface. For example, the insulating ceramic plate to be cut is first adhered to a UV tape, and then cut using a wafer saw to obtain a plurality of independent insulating ceramics. After the cutting is completed, the tape is irradiated with a UV light source to reduce the viscosity of the tape, so as to facilitate the subsequent removal of the cut insulating ceramic from the tape.

[0054] The mask through hole 311 can position the insulating ceramic 120. For example, the mask through hole 311 has a shape matching the insulating ceramic 120 or a positioning portion that can position the insulating ceramic 120. That is, after the insulating ceramic 120 is placed in the mask through hole 311, it contacts the metal mask 310 and is positioned, thereby achieving precise sintering of the insulating ceramic 120 on the metal heat conductive plate 110a.

[0055] The metal cover plate 320 is in contact with the insulating ceramic 120 to maintain the consistency of the surface height between the plurality of insulating ceramics 120 and to transfer pressure to the insulating ceramic 120 during subsequent hot pressing sintering. The metal cover plate 320 may be a copper cover plate, a stainless steel cover plate or an aluminum cover plate, and preferably a copper cover plate is used to conduct the sintering heat more quickly.

[0056] The metal heat conducting plate 110a, the metal mask 310 and the metal cover plate 320 are detachably connected. For example, positioning holes are processed at corresponding positions on the metal heat conducting plate 110a, the metal mask 310 and the metal cover plate 320, and positioning pins are inserted into the positioning holes, so that the three can be detachably and tightly fitted together.

[0057] After step S102, hot pressing and sintering step S103 is performed to achieve connection between the insulating ceramic 120 and the metal heat conducting plate 110a using the metal sintering material 130. In the present invention, the specific process parameters of hot pressing and sintering (such as pressure and sintering temperature) can be determined according to the selected sintering material.

[0058] like Figure 7 As shown, after hot pressing and sintering, the following step S104 is performed: the metal cover plate 320 and the metal mask 310 are removed, and the metal heat conducting plate 110a is cut into plates along a predetermined track (for example, the edge of the insulating ceramic 120) to obtain the heat conducting component 100. After cutting, the metal heat conducting plate 110a may retain micro-connections that connect multiple heat conducting components 100 together but are easy to break.

[0059] In the above exemplary manufacturing method, the insulating ceramic 120 is sintered and connected on both sides of the metal heat conducting plate 110a at the same time, which is conducive to improving production efficiency. As a variation of the above exemplary manufacturing method, the insulating ceramic 120 can also be sintered and connected on one side of the metal heat conducting plate 110a, and then the insulating ceramic 120 is sintered on the other side of the metal heat conducting plate 110a.

[0060] It should be pointed out that when the insulating ceramic 120 is sintered and connected on the single-side surface of the metal heat conductive plate 110a, the provision of the metal cover plate 320 is not necessary. For example, the pressure plate of the hot pressing sintering equipment itself can be used to directly apply pressure to the insulating ceramic 120 and maintain the consistency of the surface height between multiple insulating ceramics 120.

[0061] Compared with directly sintering the metallized insulating ceramic plate on the metal heat conducting plate 110a and then cutting the two to produce the heat conducting component, the production method of the embodiment first sinters and connects multiple independent insulating ceramics 120 on the metal heat conducting plate 110a, and then cuts the metal heat conducting plate 110a to obtain the heat conducting component 100, which is beneficial to reducing the sintering stress between the metal heat conducting plate 110a and the insulating ceramic 120, reducing the warping deformation of the metal heat conducting plate 110a, and improving the shape and dimensional accuracy of the heat conducting component 100; in addition, when cutting the plates, only the metal heat conducting plate 110a needs to be cut, which can reduce the difficulty of cutting the plates and improve production efficiency.

[0062] Heat-conducting component and its manufacturing method embodiment 2

[0063] like Fig. 9 As shown, in the heat-conducting component 100 of Example 2, a copper foil layer 123 is provided on the metal film 122 on the side of the ceramic substrate 121 away from the metal heat-conducting body 110. The total thickness of the metal film 122 and the copper foil layer 123 provided thereon can be substantially equal to the thickness of the outer copper foil on the outermost insulating core board used to make the circuit board substrate (see the following description for details), thereby improving the thickness consistency of the circuit on the surface of the circuit board. Exemplarily, the thickness of the copper foil layer 123 can be 20μm to 80μm.

[0064] like Fig.10 As shown, the manufacturing method of the heat conducting component 100 in the second embodiment includes the following step S201 performed between steps S103 and S104: electroplating a copper foil layer 123 on the metal film 122 on the side of the ceramic substrate 121 away from the metal heat conducting plate 110a. When electroplating the copper foil layer 123, the metal mask 310 can be used to transmit current to the metal film 122 in contact with the metal mask 310. Fig.11 As shown, after step S201 , the metal mask 310 is removed, and the metal heat-conducting plate 110 a is cut to obtain the heat-conducting component 100 .

[0065] Circuit board embodiment

[0066] like Fig.12 and Fig.13 As shown, the third embodiment of the present invention discloses a circuit board 200 provided with the aforementioned heat-conducting component 100. The circuit board 200 includes a substrate 210 and a heat-conducting component 100 disposed in the substrate 210, and the heat-conducting component 100 is used to form a heat-conducting channel penetrating the substrate 210 in the thickness direction of the circuit board to quickly conduct heat.

[0067] Exemplarily, the substrate 210 includes a single-layer or multi-layer double-sided copper-clad insulating core board 211, the insulating core board 211 has an outer copper foil 211a and an inner copper foil 211b, and the multiple insulating core boards 211 are connected by bonding sheets 212; wherein the insulating core board 211 can be a FR-4 or FR-15 copper-clad core board, and the bonding sheet 212 can be a prepreg, which is not limited by the present invention. An inner conductive circuit can be provided inside the substrate 210, for example, the inner copper foil 211b of the insulating core board 211 can be etched to form an inner conductive circuit.

[0068] The substrate 210 can be obtained by a hot pressing method commonly used in the field of circuit boards. Before hot pressing, through holes for placing the heat-conducting component 100 are pre-processed in the insulating core board 211 and the bonding sheet 212. During the hot pressing process, the resin in the bonding sheet 212 flows to fill the gap in the through hole, so as to achieve a fixed connection between the heat-conducting component 100 and the substrate 210. In addition, the substrate 210 can be made first, and then a through hole is processed in the substrate 210 and the heat-conducting component 100 is placed therein, and then the gap in the through hole is filled by a resin plugging method commonly used in the field of circuit boards, which can also achieve a fixed connection between the heat-conducting component 100 and the substrate 210.

[0069] After the heat-conducting component 100 is fixed to the substrate 210, the first surface copper foil layer 230a and the second surface copper foil layer 230b can be made by copper plating on both sides of the circuit board 200, and the opposite sides of the heat-conducting component 100 are connected to the first surface copper foil layer 230a and the second surface copper foil layer 230b respectively. Subsequently, the surface circuit layer 230 can be made by etching on at least one side of the circuit board 200; wherein the conductive circuit of the surface circuit layer 230 can be set on the substrate 210 and the ceramic substrate 121.

[0070] In such Fig.12 In the first embodiment of the circuit board shown, the metal heat-conducting body 110 of the heat-conducting component 100 is provided with insulating ceramics 120 on both surfaces in the thickness direction thereof, but the insulating ceramics 120 are not provided with a copper foil layer 123. One side surface of the circuit board 200 (for example, the surface provided with the first surface copper foil layer 230a) has a surface circuit layer 230 provided on the substrate 210 and the ceramic substrate 121, and the surface circuit layer 230 is obtained by etching the first surface copper foil layer 230a, the outer copper foil 211a and the metal film 122 of the side surface; the second surface copper foil layer 230b on the other side surface of the circuit board 200 may not be etched and may be used as a heat dissipation surface as a whole. As a variation of the first embodiment of the circuit board, the other side surface of the circuit board may also be etched to form a conductive circuit.

[0071] In such Fig.13In the second embodiment of the circuit board shown, the metal heat-conducting body 110 of the heat-conducting component 100 is provided with an insulating ceramic 120 on one surface in the thickness direction thereof, and a copper foil layer 123 is provided on the metal film 122 on the side of the ceramic substrate 121 away from the metal heat-conducting body 110 in the insulating ceramic 120, and the copper foil layer 123 is connected to the first surface copper foil layer 230a, and the metal heat-conducting body 110 is connected to the second surface copper foil layer 230b. The first surface copper foil layer 230a, the outer copper foil 211a, the copper foil layer 123 and the metal film 122 are etched to form a surface circuit layer 230; wherein the total thickness of the metal film 122 and the copper foil layer 123 is substantially equal to the thickness of the outer copper foil 211a on the insulating core board 211, so as to improve the thickness consistency of the surface circuit layer 230. The second surface copper foil layer 230b may not be etched and may be used as a heat dissipation surface as a whole.

[0072] It should be noted that for the sake of simplicity, some identical descriptions in the above different embodiments are omitted. Unless there are contradictory or exclusive situations, the different embodiments disclosed above can be referenced, referred to or combined with each other, and the technical features / components of different embodiments can also be combined and / or replaced with each other.

[0073] Although the present invention is disclosed as above with specific embodiments, these specific embodiments are not intended to limit the scope of the present invention. Any person skilled in the art can make some changes / replacements without departing from the scope of the present invention, that is, all equivalent changes made according to the present invention should be covered by the protection scope of the present invention.

Claims

1. A heat-conducting component, comprising a metal heat-conducting body; characterized in that: The metal heat-conducting body is provided with metallized insulating ceramic on at least one surface in the thickness direction thereof, the insulating ceramic comprises a ceramic substrate and a metal film, the metal film is arranged on the surface of the ceramic substrate facing and facing away from the metal heat-conducting body, and the insulating ceramic is connected to the metal heat-conducting body by a metal sintering material.

2. The heat conducting component according to claim 1, characterized in that: The thickness of the metal heat-conducting body is 0.6 mm to 2.0 mm, and the thickness of the insulating ceramic is 0.1 mm to 0.5 mm.

3. The heat conducting component according to claim 1, characterized in that: The material of the metal heat-conducting body is pure copper, and the material of the ceramic substrate is aluminum nitride, aluminum oxide or silicon nitride ceramic.

4. The heat conducting component according to claim 1, characterized in that: A copper foil layer is provided on the metal film at a side of the ceramic substrate away from the metal heat-conducting body.

5. A method for manufacturing a heat-conducting component, characterized in that The steps include: S101, disposing a metal mask on at least one side of the metal heat conducting plate, wherein the metal mask is processed with a plurality of mask through holes; S102, placing a precursor of a metal sintering material at the bottom of the mask through hole, and then placing an insulating ceramic in the mask through hole; wherein the insulating ceramic includes a ceramic substrate and a metal film disposed on two opposite surfaces of the ceramic substrate; S103, hot pressing and sintering, so as to realize connection between the insulating ceramic and the metal heat conducting plate by using the metal sintered material; S104, cutting the metal heat-conducting plate to obtain the heat-conducting component.

6. The method for manufacturing a heat conducting component according to claim 5, characterized in that: In step S102 , after the insulating ceramic is placed, a metal cover is disposed on the metal mask, and the metal cover is in contact with the insulating ceramic.

7. The method for manufacturing a heat conducting component according to claim 6, characterized in that: In step S101, the metal masks are respectively set on both side surfaces of the metal heat conducting plate; in step S102, the metal masks on both side surfaces of the metal heat conducting plate are successively made to face upward, and the upward metal masks are subjected to the operations of setting the precursor of the metal sintering material, placing the insulating ceramic and setting the metal cover plate.

8. The method for manufacturing a heat conducting component according to claim 5, characterized in that The following steps are included between step S103 and step S104: S201, electroplating a copper foil layer on the metal film on a side of the ceramic substrate away from the metal heat conducting plate.

9. The method for manufacturing a heat conducting component according to claim 5, characterized in that: The metal mask is a copper mask.

10. A circuit board, comprising a substrate; characterized in that: The substrate is provided with a heat-conducting component as described in any one of claims 1 to 4; optionally, at least one side surface of the circuit board has a surface circuit layer arranged on the substrate and the ceramic substrate.

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