Printed circuit board module, heat dissipation method of printed circuit board and electronic water pump

Abstract

The embodiment of the invention discloses a printed circuit board module, a heat dissipation method of a printed circuit board and an electronic water pump, and relates to the technical field of electronics, the printed circuit board module comprises a printed circuit board body and at least one cooling flow channel which is arranged corresponding to at least one element on the printed circuit board body; the flow control assembly is connected with at least one cooling flow channel; the processing assembly is electrically connected with the flow control assembly and is used for acquiring heat dissipation demand information associated with the printed circuit board body; determining at least one to-be-cooled element in the at least one element according to the heat dissipation demand information, and determining a heat dissipation mode corresponding to each to-be-cooled element; according to the heat dissipation mode corresponding to each to-be-cooled element, the flow control assembly corresponding to each to-be-cooled element is controlled, the flow of the cooling liquid in the cooling flow channel corresponding to the control assembly is adjusted, and heat dissipation is carried out through the heat dissipation mode corresponding to each to-be-cooled element, so that heat dissipation of the PCB is realized, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a printed circuit board module, a heat dissipation method for a printed circuit board, and an electronic water pump. Background Art

[0002] Printed Circuit Board (PCB) integrates many electronic components, such as chips, transistors, capacitors, etc. These components generate heat during operation. If the heat cannot be dissipated in time, it is easy to cause PCB board failure. For example, the electronic water pump in a vehicle runs under high load for a long time, and the temperature of the components on the PCB of the electronic water pump remains high, which is very likely to cause failure.

[0003] In the related art, air cooling or water cooling is often used to dissipate heat from the PCB board, but the heat dissipation efficiency is low.

[0004] Application Contents

[0005] In view of this, one of the purposes of the present application is to provide a printed circuit board module, a heat dissipation method for a printed circuit board, and an electronic water pump, which can improve the heat dissipation efficiency.

[0006] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a printed circuit board module, the printed circuit board module comprising:

[0008] A printed circuit board body, on which at least one component is arranged;

[0009] At least one cooling channel, wherein the at least one cooling channel is arranged corresponding to the at least one component, and each cooling channel is provided with a flowable coolant;

[0010] A flow control component, the flow control component is connected to at least one cooling channel, and the flow control component is used to control the flow of the coolant in each cooling channel;

[0011] The processing component is electrically connected to the flow control component, and the processing component is used for:

[0012] Acquire heat dissipation requirement information associated with the printed circuit board body, the heat dissipation requirement information being used to characterize the heat dissipation requirement of each component in the printed circuit board body;

[0013] According to the heat dissipation requirement information, determining at least one component to be cooled in at least one component, and determining a heat dissipation mode corresponding to each component to be cooled;

[0014] According to the heat dissipation mode corresponding to each heat dissipation component, the flow control component corresponding to each heat dissipation component is controlled to adjust the flow of the coolant in the cooling channel corresponding to the control component.

[0015] In a possible implementation, the printed circuit board module further includes:

[0016] A main flow channel, the main flow channel being in communication with at least one cooling flow channel;

[0017] A coolant drive assembly, the coolant drive assembly is connected to the main channel and the processing assembly, and the coolant drive assembly is used to drive the flow of coolant in the main channel and at least one cooling channel;

[0018] The heat dissipation requirement information includes load information of the coolant drive component, and at least some components of at least one component of the coolant drive component have different heat dissipation requirements under different load information.

[0019] In a possible implementation, the printed circuit board module further includes:

[0020] A temperature detection component, which is arranged corresponding to at least one element and connected to the processing component, and is used to detect temperature information of each element;

[0021] The heat dissipation requirement information includes temperature information of at least one component, and each component has different heat dissipation requirements under different temperature information.

[0022] In a possible implementation manner, the cross-sectional area of ​​each cooling channel perpendicular to the flow direction of the coolant is associated with the power of the corresponding component.

[0023] In a second aspect, an embodiment of the present application provides a heat dissipation method for a printed circuit board, which can be applied to the printed circuit board module of the first aspect, and the method includes:

[0024] Acquire heat dissipation requirement information associated with a printed circuit board body of the printed circuit board module, the heat dissipation requirement information being used to characterize the heat dissipation requirement of each component in the printed circuit board body;

[0025] According to the heat dissipation requirement information, determining at least one component to be cooled in at least one component, and determining a heat dissipation mode corresponding to each component to be cooled;

[0026] According to the heat dissipation mode corresponding to each heat dissipation element, the flow control component corresponding to the heat dissipation element is controlled to adjust the flow of the coolant in the cooling channel corresponding to the control component.

[0027] In a possible implementation, obtaining heat dissipation requirement information associated with a printed circuit board body of a printed circuit board module includes:

[0028] Get the temperature information of each component;

[0029] The heat dissipation requirement information includes temperature information of at least one component, and each component has different heat dissipation requirements under different temperature information.

[0030] In a possible implementation, the temperature information includes temperatures at multiple time points, and according to the heat dissipation requirement information, at least one component to be cooled is determined in at least one component, and a heat dissipation mode corresponding to each component to be cooled is determined, including:

[0031] Determine the temperature change rate of each component according to the temperature of each component at multiple time points in the heat dissipation demand information;

[0032] At least one element to be cooled is determined in at least one element according to the temperature change rate, and a cooling mode corresponding to each element to be cooled is determined.

[0033] In a possible implementation, obtaining heat dissipation requirement information associated with a printed circuit board body of a printed circuit board module includes:

[0034] Obtaining load information of a coolant driving component in a printed circuit board module;

[0035] The heat dissipation requirement information includes load information of the coolant drive component, and at least some components in at least one component of the coolant drive component have different heat dissipation requirements under different load information.

[0036] In a possible implementation, according to the heat dissipation mode corresponding to each heat dissipation element, the flow control component corresponding to each heat dissipation element is controlled to adjust the flow of the coolant in the cooling channel corresponding to the control component, including at least one of the following:

[0037] When the load information indicates that the coolant drive component is under a first load, closing at least one cooling channel;

[0038] When the load information indicates that the coolant drive assembly is at a second load, opening a cooling channel corresponding to at least one first element according to a first preset flow rate, wherein the second load is greater than the first load, and the at least one first element is a partial element of the at least one element;

[0039] When the load information indicates that the coolant drive component is at a third load, the cooling channel corresponding to at least one first element is opened according to the second preset flow rate, and the cooling channel corresponding to at least one second element is opened, wherein the third load is greater than the second load, the second preset flow rate is greater than the first preset flow rate, the second element is an element other than the first element, and the power consumption of the second element is lower than the power consumption of the first element;

[0040] When the load information indicates that the coolant drive component is at a maximum load, at least one cooling channel is opened at a maximum flow rate.

[0041] In a third aspect, an embodiment of the present application provides an electronic water pump, which may include the printed circuit board module provided in the first aspect.

[0042] In a fourth aspect, an embodiment of the present application provides a vehicle, the vehicle comprising at least one of the following:

[0043] The printed circuit board module of the first aspect;

[0044] Such as the electronic water pump in the third aspect.

[0045] The embodiment of the present application provides a printed circuit board module, which includes a printed circuit board body, at least one cooling channel, which is arranged corresponding to at least one component on the printed circuit board body; a flow control component, which is connected to at least one cooling channel and is used to control the flow of coolant in each cooling channel; a processing component, which is electrically connected to the flow control component and is used to: obtain heat dissipation demand information associated with the printed circuit board body; determine at least one component to be cooled in at least one component according to the heat dissipation demand information, and determine the heat dissipation mode corresponding to each component to be cooled; according to the heat dissipation mode corresponding to each component to be cooled, control the flow control component corresponding to each component to be cooled, adjust the flow of coolant in the cooling channel corresponding to the control component, and dissipate heat through the heat dissipation mode corresponding to each component to be cooled, so as to achieve heat dissipation of the PCB board with high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. It should be understood that the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0047] Figure 1 A schematic diagram of functional modules of a printed circuit board module provided in an embodiment of the present application;

[0048] Figure 2A schematic diagram of temperature simulation of an electronic water pump PCB board involved in a printed circuit board module provided in an embodiment of the present application;

[0049] Figure 3 A schematic diagram of a cooling channel involved in a printed circuit board module provided in an embodiment of the present application;

[0050] Figure 4 A schematic diagram of a heat dissipation method for a printed circuit board provided in an embodiment of the present application;

[0051] Figure 5 A schematic diagram of the functional modules of a heat dissipation device for a printed circuit board provided in an embodiment of the present application.

[0052] Description of reference numerals:

[0053] The printed circuit board module 100 , the printed circuit board body 110 , the cooling channel 120 , the flow control component 130 , the processing component 140 , the acquisition module 510 , the determination module 520 , and the control module 530 . DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0055] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0056] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0057] In various embodiments of the present application, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0058] In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, it is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the product of the invention is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0059] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0060] It should be noted that, in the absence of conflict, the features in the embodiments of the present application may be combined with each other.

[0061] Furthermore, in the embodiments of the present application, the term "connection" may refer to "electrical connection" or "direct connection". "Electrical connection" may refer to direct electrical connection between two components or electrical connection between two components via one or more normally open tubes or other components.

[0062] In order to solve the technical problems in the background technology, the embodiments of the present application provide a printed circuit board module, a heat dissipation method of a printed circuit board, and an electronic water pump. The printed circuit board module 100 provided in the embodiments of the present application is first introduced below.

[0063] See also Figure 1 , Figure 1 A functional module diagram of a printed circuit board module 100 provided in an embodiment of the present application. The printed circuit board module 100 includes:

[0064] A printed circuit board body 110, wherein at least one component is disposed on the printed circuit board body 110;

[0065] At least one cooling channel 120, wherein the at least one cooling channel 120 is arranged corresponding to the at least one element, and each cooling channel 120 is provided with a flowable coolant;

[0066] A flow control component 130, wherein the flow control component 130 is connected to the at least one cooling channel 120, and the flow control component 130 is used to control the flow of the coolant in each cooling channel 120;

[0067] A processing component 140, wherein the processing component 140 is electrically connected to the flow control component 130, and the processing component 140 is used for:

[0068] Acquire heat dissipation requirement information associated with the printed circuit board body 110, wherein the heat dissipation requirement information is used to characterize the heat dissipation requirement of each of the components in the printed circuit board body 110;

[0069] According to the heat dissipation requirement information, determining at least one component to be cooled among the at least one component, and determining a heat dissipation mode corresponding to each of the components to be cooled;

[0070] According to the heat dissipation mode corresponding to each of the components to be cooled, the flow control components 130 corresponding to each of the components to be cooled are controlled to adjust the flow of the coolant in the cooling channel 120 corresponding to the control components.

[0071] The embodiment of the present application provides a printed circuit board module, which includes a printed circuit board body, at least one cooling channel, which is arranged corresponding to at least one component on the printed circuit board body; a flow control component, which is connected to at least one cooling channel and is used to control the flow of coolant in each cooling channel; a processing component, which is electrically connected to the flow control component and is used to: obtain heat dissipation demand information associated with the printed circuit board body; determine at least one component to be cooled in at least one component according to the heat dissipation demand information, and determine the heat dissipation mode corresponding to each component to be cooled; according to the heat dissipation mode corresponding to each component to be cooled, control the flow control component corresponding to each component to be cooled, adjust the flow of coolant in the cooling channel corresponding to the control component, and dissipate heat through the heat dissipation mode corresponding to each component to be cooled, so as to achieve heat dissipation of the PCB board with high heat dissipation efficiency.

[0072] The various components of the printed circuit board module 100 are described in detail below:

[0073] The printed circuit board body 110, i.e., the PCB board, is an assembly board on which mounting holes, connecting wires, and pads for assembling and welding electronic components are selectively processed on an insulating substrate to achieve electrical connection between components. The at least one component arranged on the PCB board may include components such as a chip, a transistor, a capacitor, and an inductor. Generally, the PCB board includes a welding surface and a component surface, and at least one component is arranged on the component surface of the PCB board.

[0074] The cooling channel 120 can be used to transport coolant, and can take away the heat generated around the cooling channel 120 when the components on the PCB are working normally, thereby achieving heat dissipation of the PCB. In addition, the cooling channel 120 is arranged corresponding to the components on the PCB, and can achieve targeted heat dissipation of the components on the PCB.

[0075] In some embodiments, if the PCB board is a single-layer board, there is an insulating substrate material between the component surface and the welding surface of the PCB board. The substrate material that can be used includes glass fiber epoxy resin, which mainly provides mechanical support for the PCB board, ensures that the components can be firmly mounted on the component surface, and at the same time insulates the component surface and the welding surface from each other. This can prevent failures due to short circuits between component pins or between different circuit networks. For example, when a component is mounted on the component surface and its pins pass through the vias of the circuit board to reach the welding surface for welding, the substrate formed by the glass fiber epoxy resin can prevent electrical connection between the pins.

[0076] If the PCB board is a single-layer board, in addition to glass fiber epoxy resin, polytetrafluoroethylene can also be used as the basic material. For example, in high-frequency circuit scenarios, polytetrafluoroethylene has a lower dielectric constant and loss factor, which can meet the requirements of high-frequency signal transmission and reduce signal attenuation and reflection.

[0077] At least one cooling channel 120 can be attached and fixed to the welding surface of the single-layer PCB board and on a side away from the component surface, and at least one cooling channel 120 is arranged corresponding to at least one component.

[0078] For example, element A 1 and A 2 Set on the component side of the PCB board, cooling channel B 1 Can be mounted on the soldering surface of the PCB and away from the component surface. Cooling channel B 1 Can pass through component A 1 and / or A 2 Or, there is a cooling channel B 2 With cooling channel B 1 Passing through component A 1 and / or A 2 Directly below.

[0079] In component A 1 When the working temperature is high and needs to be cooled down, the cooling channel B can be used. 1 and / or B 2 Transport coolant to component A 1 The cooling channel 120 does not need to transport the cooling liquid for cooling. On the one hand, it can not only achieve targeted heat dissipation and improve the heat dissipation efficiency, but also reduce the energy consumption of the cooling liquid driving components such as the water pump.

[0080] In some embodiments, if the PCB board is a multi-layer board, at least one cooling channel 120 can be set between the welding surface and the component surface of the PCB board as needed without affecting the normal operation of the PCB board, or it can be set in the same manner as the aforementioned single-layer PCB board, that is, set on the welding surface of the PCB board and away from the side of the component surface.

[0081] In some embodiments, the coolant used as the heat dissipation medium may include water-based coolants, oil-based coolants, and other types of coolants. Water-based coolants include pure water, ethylene glycol, and propylene glycol. Oil-based coolants include mineral oil coolants and synthetic oil coolants. Other types of coolants include fluorocarbon coolants and liquid metal coolants. The specific coolant to be used can be selected according to actual needs and is not limited here.

[0082] In some embodiments, the coolant includes pure water. Water has a large specific heat capacity, which means that when it absorbs the same amount of heat, the temperature rise is relatively small compared to other coolants with smaller specific heat capacities. In addition, pure water has a low viscosity and can flow quickly in the cooling system. It can easily pass through the cooling channel 120 to ensure that the heat can be brought to the heat dissipation area in a timely manner. In addition, pure water is a non-polluting substance. When the cooling channel 120 leaks, pure water will not pollute the environment like some coolants containing chemicals.

[0083] The flow control component 130 can be used to control the flow of the coolant in the cooling channel 120. Generally, the heat dissipation effect of the coolant with a large flow in the same cooling channel 120 is higher than that of the coolant with a small flow, and a large flow often requires more energy consumption of the coolant drive component used to drive the coolant. Controlling the flow of the coolant in the cooling channel 120 by the flow control component 130 can not only improve the flexibility of heat dissipation control, but also reduce the energy consumption of the coolant drive component.

[0084] In some embodiments, the flow control assembly 130 includes a flow valve.

[0085] The processing component 140 can be a control chip in the printed circuit board module 100. The processing component 140 is electrically connected to the flow control component 130 and can be used to obtain the heat dissipation requirement information associated with the PCB board, and then form a heat dissipation mode corresponding to each component based on the heat dissipation requirement information, thereby formulating different heat dissipation methods for different components and improving heat dissipation efficiency.

[0086] In some embodiments, if the printed circuit board module 100 is disposed in a vehicle, the processing component 140 may include an onboard controller.

[0087] Specifically, the heat dissipation requirement information includes parameters such as temperature information, operating power, operating voltage, and operating current. Taking temperature as an example, the heat dissipation requirement information associated with the PCB board may include temperature information of each component on the PCB board. The component to be cooled may be a component on the PCB board that needs to be cooled and cooled. The processing component 140 may analyze based on the heat dissipation requirement information, and then determine the component to be cooled and cooled from at least one component, and the corresponding heat dissipation mode.

[0088] Still with the aforementioned element A 1 and A 2 For example, the processing component 140 analyzes the component A 1 and A 2 The temperature of element A is determined 1 and A 2 All are components to be cooled. For component A 1 The cooling mode is:

[0089] The processing component 140 controls and controls the component A 1 Corresponding cooling channel B 1 The flow control assembly 130 on the device is turned off to achieve the effect of 1 Alternatively, the processing component 140 controls the heat dissipation of the component A. 1 Corresponding cooling channel B 1 and B 2 The flow control assembly 130 is turned off to achieve heat dissipation for the element A1.

[0090] For component A 2 The cooling mode is:

[0091] The processing component 140 controls and controls the component A 2 Corresponding cooling channel B 2 The flow control assembly 130 on the device is turned off to achieve the effect of 2 Alternatively, the processing component 140 controls the heat dissipation of the component A. 2 Corresponding cooling channel B 1 and B 2 The flow control assembly 130 on the device is turned off to achieve the effect of 2 heat dissipation.

[0092] In some embodiments, at least one cooling channel 120 can be set on a cooling plate, and the cooling plate can be attached to the side of the welding surface of the PCB board away from the component surface. The thermal conductivity of the cooling plate can be used to transfer the heat generated by the components on the PCB board to the cooling channel 120 to achieve cooling and heat dissipation.

[0093] It should be noted that the printed circuit board module 100 in the embodiment of the present application can be applicable to any PCB board with heat dissipation requirements.

[0094] In one possible embodiment, the flow control component 130 includes at least one flow valve, at least one flow valve is connected to the processing component 140 and is respectively arranged corresponding to at least one cooling channel 120, and each flow valve is used to control the flow of coolant in the corresponding cooling channel 120.

[0095] In this embodiment, a flow valve is provided to control the flow of the coolant in the cooling channel 120. The opening of the flow valve can realize precise adjustment of the coolant in the cooling channel 120, and while improving the heat dissipation efficiency, the energy consumption of the coolant driving component used to drive the coolant can be flexibly controlled.

[0096] In some embodiments, the flow valve may be an electrically controlled valve and may be electrically connected to the processing component 140 .

[0097] In a possible implementation, the printed circuit board module 100 further includes:

[0098] A main flow channel, the main flow channel is connected to at least one cooling flow channel 120;

[0099] A coolant driving component, the coolant driving component is connected to the main channel and the processing component 140, and the coolant driving component is used to drive the flow of coolant in the main channel and at least one cooling channel 120;

[0100] The heat dissipation requirement information includes load information of the coolant drive component, and at least some components of at least one component of the coolant drive component have different heat dissipation requirements under different load information.

[0101] In this embodiment, by providing a main flow channel and the main flow channel being connected to at least one cooling flow channel 120 , the heat dissipation of each component can be flexibly controlled through at least one cooling flow channel 120 .

[0102] Specifically, the coolant driving assembly is connected to the main channel, including a water outlet of the coolant driving assembly communicating with one end of the main channel, and a water inlet of the coolant driving assembly communicating with the other end of the main channel. The coolant can be stored in a water tank corresponding to the coolant driving assembly.

[0103] In some embodiments, the load information of the coolant drive component can be determined by collecting the temperature of the coolant drive component, and the load information may include at least one of low load, medium load, high load, high load and severe working conditions.

[0104] For example, see Figure 2 , Figure 2A temperature simulation schematic diagram of an electronic water pump PCB board involved in a printed circuit board module 100 provided in an embodiment of the present application. The electronic water pump may be a water pump in a vehicle engine, wherein different colors correspond to different temperatures, and it can be found that different components on the electronic water pump PCB board operate at different temperatures, and different water pump monitoring temperatures correspond to different load information, and the water pump monitoring temperature can be determined by the thermistor R41 on the electronic water pump PCB board. Different components on the electronic water pump PCB board correspond to different flow distributions of coolant in the cooling channel 120. Based on the simulation test, a flow distribution table of the electronic water pump can be obtained, as shown in Table 1:

[0105] Table 1

[0106]

[0107] Figure 2 The following are the descriptions of the part numbers:

[0108] L11 represents an inductor, IC31 represents a control chip on the electronic water pump PCB board, E41 to E44 represent capacitors, M11 represents an anti-reverse MOS tube (a MOS tube that prevents reverse connection of the power supply), M42 to M46 represent MOS tubes, and R41 represents a thermistor.

[0109] In Table 1, a flow rate of 20% corresponding to a medium load is used as an example. 20% may indicate that when the coolant driving component is in a medium load state, the flow rate control proportion of the coolant for cooling the MOS tube is one fifth of the total coolant.

[0110] Still taking the example of 10% to 30% corresponding to medium load, 10% may represent the minimum proportion of coolant used by the coolant drive component to dissipate heat for the main chip under medium load, and 30% may represent the corresponding maximum proportion.

[0111] The proportion of the coolant flow rate can be adjusted by controlling the opening of the flow valve associated with the corresponding cooling channel 120 .

[0112] Although the flow distribution of the coolant as shown in Table 1 is shown for illustrative purposes, flow distribution with different values ​​may be set as needed and is not limited here.

[0113] In some embodiments, the coolant driving assembly is electrically connected to the processing assembly 140 .

[0114] In a possible implementation, the printed circuit board module 100 further includes:

[0115] A temperature detection component, which is provided corresponding to at least one component and connected to the processing component 140, and is used to detect temperature information of each component;

[0116] The heat dissipation requirement information includes temperature information of at least one component, and each component has different heat dissipation requirements under different temperature information.

[0117] In this embodiment, a temperature detection component is provided to determine the temperature information of each component on the PCB board, and the temperature detection component can be connected to the processing component 140, so that the processing component 140 can obtain the temperature information of each component on the PCB board and determine the heat dissipation mode of each component based on the temperature information.

[0118] The temperature detection component includes any one of a temperature sensor and a thermistor.

[0119] In some embodiments, the temperature information includes a single temperature value, and may also include a dynamically changing temperature range.

[0120] For example, for element A 1 , A 1 When the temperature is at 120° and 130°, there are different heat dissipation requirements, and the corresponding heat dissipation modes may be different. 1 When the temperature is between 111° and 120°, and between 121° and 130°, there are different heat dissipation requirements, and the corresponding heat dissipation modes may be different.

[0121] In a possible implementation manner, the cross-sectional area of ​​each cooling channel 120 perpendicular to the flow direction of the coolant is associated with the power of the corresponding component.

[0122] The cross-sectional area of ​​the cross section of the cooling channel 120 perpendicular to the flow direction of the coolant can represent the area of ​​the cooling channel 120 attached to the soldering surface of the PCB board or the surface where the cooling plate is located. The cross-sectional area is associated with the power of the corresponding component, which can indicate that the cross-sectional areas of the cooling channel 120 corresponding to components of different powers are different, or it can be understood that the sizes of the cooling channel 120 corresponding to components of different powers are different.

[0123] The power of the components is different, and accordingly, the heat generated when the components are working normally is generally different, so cooling channels 120 with different cross-sectional areas can be set correspondingly for components with different powers.

[0124] For example, element A 1 The power is 50W, and the cross-sectional area of ​​the corresponding cooling channel 120 is 0.5cm. 2 The power is 100 W, and the cross-sectional area of ​​the corresponding cooling channel 120 is 1 cm.

[0125] In some embodiments, the power of a component includes operating power or rated power, which can be selected based on actual needs and is not limited here.

[0126] To clearly illustrate the cooling channel 120 in the printed circuit board module 100, see Figure 3 , Figure 3 A schematic diagram of a cooling channel 120 involved in a printed circuit board module 100 provided in an embodiment of the present application is shown in FIG. The yellow line portion represents the cooling channel 120 , and it can be found that there are cooling channels 120 with widths of 0.5 cm, 1.2 cm, 1.5 cm, and 2 cm, respectively.

[0127] See also Figure 4 , Figure 4 A schematic diagram of a heat dissipation method for a printed circuit board provided in an embodiment of the present application is provided. The method can be applied to the printed circuit board module 100 in the aforementioned embodiment. The method specifically includes the following steps:

[0128] Step 410 , obtaining heat dissipation requirement information associated with the printed circuit board body 110 of the printed circuit board module 100 , where the heat dissipation requirement information is used to characterize the heat dissipation requirement of each component in the printed circuit board body 110 .

[0129] Step 420 : determining at least one component to be cooled in at least one component according to the cooling requirement information, and determining a cooling mode corresponding to each component to be cooled.

[0130] Step 430 , according to the heat dissipation mode corresponding to each heat dissipation component, control the flow control component 130 corresponding to the heat dissipation component to adjust the flow of the coolant in the cooling channel 120 corresponding to the control component.

[0131] The heat dissipation method of the printed circuit board provided in the embodiment of the present application can obtain the heat dissipation requirement information associated with the printed circuit board body of the printed circuit board module, and determine at least one element to be dissipated in at least one element according to the heat dissipation requirement information, and determine the heat dissipation mode corresponding to each element to be dissipated. Finally, according to the heat dissipation mode corresponding to each element to be dissipated, the flow control component corresponding to the element to be dissipated can be controlled to adjust the flow of the coolant in the cooling channel corresponding to the control component to achieve heat dissipation of the PCB board and to reduce the temperature and dissipate the heat in a targeted manner by controlling the cooling channel corresponding to each element on the PCB, and the heat dissipation efficiency is high.

[0132] The implementation process of the above steps 410 to 430 is similar to or the same as the implementation process of the processing component 140 in the above-mentioned embodiment of the printed circuit board module 100, and will not be repeated here.

[0133] In a possible implementation, obtaining heat dissipation requirement information associated with the printed circuit board body 110 of the printed circuit board module 100 includes:

[0134] Get the temperature information of each component;

[0135] The heat dissipation requirement information includes temperature information of at least one component, and each component has different heat dissipation requirements under different temperature information.

[0136] Specifically, the temperature information of each component can be collected through the temperature detection component in the aforementioned embodiment. The implementation process of this embodiment can refer to the implementation process of the temperature detection component in the aforementioned printed circuit board module 100 embodiment, which will not be repeated here.

[0137] In a possible implementation, the temperature information includes temperatures at multiple time points, and according to the heat dissipation requirement information, at least one component to be cooled is determined in at least one component, and a heat dissipation mode corresponding to each component to be cooled is determined, including:

[0138] Determine the temperature change rate of each component according to the temperature of each component at multiple time points in the heat dissipation demand information;

[0139] At least one element to be cooled is determined in at least one element according to the temperature change rate, and a cooling mode corresponding to each element to be cooled is determined.

[0140] This embodiment determines the components to be cooled and the corresponding cooling modes from the components on the PCB board based on the temperature change rate of each component, thereby achieving pre-cooling of the components on the PCB board and further improving the cooling efficiency.

[0141] Specifically, the temperature change rate can reflect how fast the temperature of a component changes over a period of time. Even if a component does not meet the temperature setting conditions, such as being greater than a preset temperature threshold, the temperature change rate can be used to determine whether the component needs to be pre-cooled.

[0142] For example, if the cooling setting condition includes a temperature greater than 120°, element A 1 If the temperature reaches 120° within half an hour, but the temperature keeps increasing within half an hour, and the temperature change rate is greater than the preset change threshold of 50%, then component A can be 1 As a heat dissipation component. The processing component 140 can be based on the component A 1 The actual temperature change rate under temperature increase determines the corresponding heat dissipation mode, such as determining heat dissipation mode 1: component A 1 Corresponding cooling channel B 1 , and cooling channel B 1 The opening degree of the associated flow valve is the first opening degree. Or determine heat dissipation mode 2: Component A 1 Corresponding cooling channel B 1 and B 2 , and cooling channel B 1 The opening degree of the associated flow valve is the second opening degree, and the cooling flow channel B2 The opening degree of the associated flow valve is the third opening degree.

[0143] Accordingly, in the case of component A 1 In the case of heat dissipation, if the temperature is in a decreasing state and the temperature change rate is greater than the preset change threshold of 50%, the component A can be controlled 1 Corresponding cooling channel B 1 The opening of the flow valve associated with the cooling channel 120B1 is slowly reduced to avoid the temperature dropping too fast to the element A. 1 The thermal shock, thermal fatigue or elastic deformation caused by this will affect component A. 1 normal operation or service life.

[0144] Although a specific preset change threshold is shown for illustrative purposes, other values ​​may be selected as the preset change threshold according to actual needs.

[0145] In a possible implementation, obtaining heat dissipation requirement information associated with the printed circuit board body 110 of the printed circuit board module 100 includes:

[0146] Obtaining load information of a coolant driving component in the printed circuit board module 100;

[0147] The heat dissipation requirement information includes load information of the coolant drive component, and at least some components in at least one component of the coolant drive component have different heat dissipation requirements under different load information.

[0148] The implementation process of this embodiment can refer to the implementation process of the coolant driving component in the aforementioned embodiment of the printed circuit board module 100, which will not be repeated here.

[0149] In a possible implementation, according to the heat dissipation mode corresponding to each heat dissipation element, the flow control component 130 corresponding to each heat dissipation element is controlled to adjust the flow of the coolant in the cooling channel 120 corresponding to the control component, including at least one of the following:

[0150] When the load information indicates that the coolant drive component is under a first load, closing at least one cooling channel 120;

[0151] When the load information indicates that the coolant drive assembly is at a second load, the cooling channel 120 corresponding to the at least one first element is opened according to the first preset flow rate, wherein the second load is greater than the first load, and the at least one first element is a partial element of the at least one element;

[0152] When the load information indicates that the coolant drive component is at a third load, the cooling channel 120 corresponding to at least one first element is opened according to the second preset flow rate, and the cooling channel 120 corresponding to at least one second element is opened, wherein the third load is greater than the second load, the second preset flow rate is greater than the first preset flow rate, the second element is an element other than the first element, and the power consumption of the second element is lower than the power consumption of the first element;

[0153] When the load information indicates that the coolant drive assembly is at the maximum load, at least one cooling channel 120 is opened at the maximum flow rate.

[0154] The first load, the second load, the third load and the maximum load in this embodiment may correspond to the low load, the medium load, the high load and the high load + the severe working condition in Table 1 in the aforementioned embodiment, respectively.

[0155] As described in conjunction with Table 1, when the coolant drive assembly is at the first load, at least one cooling channel 120 is closed, including closing all cooling channels 120, and controlling the opening of the flow valves associated with all cooling channels 120 to be zero.

[0156] When the coolant drive component is in the second load, the cooling channel 120 corresponding to at least one first element can be opened. The first element includes high-power consumption elements such as a main chip, a MOS tube and an anti-reverse MOS tube. The opening of the flow valve associated with the cooling channel 120 corresponding to at least one first element can be controlled to be a first opening, and the first opening is greater than zero.

[0157] When the coolant drive component is in the third load, the cooling channel 120 corresponding to at least one first element and at least one second element can be opened, and the second element includes a low-power element such as a capacitor, an inductor and a diode, that is, the opening of the flow valve associated with the cooling channel 120 corresponding to at least one first element can be controlled to be a first opening, and the opening of the flow valve associated with the cooling channel 120 corresponding to at least one second element can be controlled to be a second opening, and the first opening and the second opening are both greater than zero.

[0158] When the coolant drive assembly is at maximum load, the flow valves associated with all cooling channels 120 can be controlled to have a maximum opening, and at the maximum opening, the flow distribution complies with Table 1.

[0159] In some embodiments, a fourth load can be added to further improve the accuracy of heat dissipation control, that is, when the load information indicates that the coolant drive component is at the fourth load, the cooling channel 120 corresponding to at least one first element is opened according to the maximum flow rate, wherein the fourth load is greater than the third load, and the maximum flow rate is greater than the second preset flow rate.

[0160] It should be noted that, in the above embodiment, after the heat dissipation of the heat dissipation element is realized, the opening of the flow valve in the heat dissipation mode corresponding to the heat dissipation element needs to be adjusted accordingly, so that the working temperature of the heat dissipation element is below the preset safety temperature threshold. The preset safety temperature threshold corresponding to different elements may be different, and the preset safety temperature threshold may be selected according to the actual use situation, which is not limited here.

[0161] The present application also provides an electronic water pump, which may include the printed circuit board module in the above embodiment. The electronic water pump can be applied to the vehicle field, such as being installed near the fire battery pack in the engine compartment. The electronic water pump can also be applied to the industrial equipment field, such as being installed in the cooling system of CNC machine tools, laser cutting machines and other equipment. The electronic device can also be applied to the household equipment field, such as being installed in an aquarium.

[0162] The electronic water pump provided in the embodiment of the present application can achieve similar or identical technical effects as the printed circuit board module, and will not be described again here to avoid repetition.

[0163] Corresponding to the above method embodiment, the present application embodiment also provides a heat dissipation device for a printed circuit board, see Figure 5 , Figure 5 A functional module diagram of a heat dissipation device for a printed circuit board provided in an embodiment of the present application, wherein the heat dissipation device 500 for a printed circuit board includes:

[0164] The acquisition module 510 is used to acquire heat dissipation requirement information associated with the printed circuit board body 110 of the printed circuit board module 100, where the heat dissipation requirement information is used to characterize the heat dissipation requirement of each component in the printed circuit board body 110;

[0165] A determination module 520, configured to determine at least one component to be cooled in at least one component according to the cooling requirement information, and to determine a cooling mode corresponding to each component to be cooled;

[0166] The control module 530 is used to control the flow control component 130 corresponding to the element to be cooled according to the cooling mode corresponding to each element to be cooled, and adjust the flow of the coolant in the cooling channel 120 corresponding to the control component.

[0167] The heat dissipation device of the printed circuit board provided in the embodiment of the present application can achieve the following Figure 4 The various processes implemented in the method embodiments can achieve similar or identical technical effects, and will not be described again here to avoid repetition.

[0168] In a possible implementation, the acquisition module 510 is further configured to:

[0169] Acquire temperature information of each component detected by the temperature detection component;

[0170] The heat dissipation requirement information includes temperature information of at least one component, and each component has different heat dissipation requirements under different temperature information.

[0171] In a possible implementation, the temperature information includes temperatures at multiple time points. According to the heat dissipation requirement information, the determination module 520 is further configured to:

[0172] Determine the temperature change rate of each component according to the temperature of each component at multiple time points in the heat dissipation demand information;

[0173] At least one element to be cooled is determined in at least one element according to the temperature change rate, and a cooling mode corresponding to each element to be cooled is determined.

[0174] In a possible implementation, the acquisition module 510 is further configured to:

[0175] Obtaining load information of a coolant driving component in the printed circuit board module 100;

[0176] The heat dissipation requirement information includes load information of the coolant drive component, and at least some components in at least one component of the coolant drive component have different heat dissipation requirements under different load information.

[0177] In a possible implementation, the control module 530 is further configured to:

[0178] When the load information indicates that the coolant drive component is under a first load, closing at least one cooling channel 120;

[0179] When the load information indicates that the coolant drive assembly is at a second load, the cooling channel 120 corresponding to the at least one first element is opened according to the first preset flow rate, wherein the second load is greater than the first load, and the at least one first element is a partial element of the at least one element;

[0180] When the load information indicates that the coolant drive component is at a third load, the cooling channel 120 corresponding to at least one first element is opened according to the second preset flow rate, and the cooling channel 120 corresponding to at least one second element is opened, wherein the third load is greater than the second load, the second preset flow rate is greater than the first preset flow rate, the second element is an element other than the first element, and the power consumption of the second element is lower than the power consumption of the first element;

[0181] When the load information indicates that the coolant drive assembly is at the maximum load, at least one cooling channel 120 is opened at the maximum flow rate.

[0182] The embodiment of the present application further discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the heat dissipation method of a printed circuit board in the method embodiment is implemented.

[0183] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the embodiment of the heat dissipation method for a printed circuit board as described above, and can achieve similar or identical technical effects. To avoid repetition, it will not be described here.

[0184] The embodiments of the present application also disclose a vehicle, on which is installed a printed circuit board module 100, an electronic water pump, a heat dissipation device for a printed circuit board, or a computer-readable storage medium capable of implementing any of the above embodiments.

[0185] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0186] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A printed circuit board module, characterized in that: The printed circuit board module comprises: A printed circuit board body, wherein at least one component is arranged on the printed circuit board body; At least one cooling channel, wherein the at least one cooling channel is arranged corresponding to the at least one element, and each cooling channel is provided with a flowable coolant; A flow control component, the flow control component is connected to the at least one cooling channel, and the flow control component is used to control the flow of the coolant in each cooling channel; A processing component, the processing component is electrically connected to the flow control component, and the processing component is used to: Acquire heat dissipation requirement information associated with the printed circuit board body, wherein the heat dissipation requirement information is used to characterize the heat dissipation requirement of each of the components in the printed circuit board body; According to the heat dissipation requirement information, determining at least one component to be cooled among the at least one component, and determining a heat dissipation mode corresponding to each of the components to be cooled; According to the heat dissipation mode corresponding to each of the heat dissipation components, the flow control components corresponding to each of the heat dissipation components are controlled to adjust the flow of the coolant in the cooling channel corresponding to the control components.

2. The printed circuit board module according to claim 1, characterized in that: The printed circuit board module also includes: a main flow channel, the main flow channel being in communication with the at least one cooling flow channel; A coolant driving component, the coolant driving component is connected to the main channel and the processing component, and the coolant driving component is used to drive the flow of coolant in the main channel and the at least one cooling channel; The heat dissipation requirement information includes load information of the coolant drive component, and under different load information of the coolant drive component, at least some of the at least one component have different heat dissipation requirements.

3. The printed circuit board module according to claim 1, characterized in that: The printed circuit board module also includes: a temperature detection component, the temperature detection component being arranged corresponding to the at least one element and connected to the processing component, the temperature detection component being used to detect temperature information of each of the elements; The heat dissipation requirement information includes temperature information of the at least one component, and under different temperature information, each component has different heat dissipation requirements.

4. The printed circuit board module according to claim 1, characterized in that: The cross-sectional area of ​​each cooling channel perpendicular to the flow direction of the coolant is associated with the power of the corresponding component.

5. A method for heat dissipation of a printed circuit board, characterized in that: Applied to a printed circuit board module as claimed in any one of claims 1 to 4, the method comprising: Acquire heat dissipation requirement information associated with a printed circuit board body of the printed circuit board module, wherein the heat dissipation requirement information is used to characterize the heat dissipation requirement of each component in the printed circuit board body; According to the heat dissipation requirement information, determining at least one component to be cooled among the at least one component, and determining a heat dissipation mode corresponding to each of the components to be cooled; According to the heat dissipation mode corresponding to each of the heat dissipation components, the flow control component corresponding to the heat dissipation component is controlled to adjust the flow of the coolant in the cooling channel corresponding to the control component.

6. The method according to claim 5, characterized in that The obtaining of heat dissipation requirement information associated with the printed circuit board body of the printed circuit board module includes: Acquiring temperature information of each of the components; The heat dissipation requirement information includes temperature information of the at least one component, and under different temperature information, each component has different heat dissipation requirements.

7. The method according to claim 6, characterized in that The temperature information includes temperatures at multiple time points, and determining at least one component to be cooled from the at least one component according to the heat dissipation requirement information, and determining a heat dissipation mode corresponding to each of the components to be cooled, includes: Determine the temperature change rate of each of the components according to the temperature of each of the components at the multiple time points in the heat dissipation requirement information; At least one element to be cooled is determined among the at least one element according to the temperature change rate, and a cooling mode corresponding to each of the elements to be cooled is determined.

8. The method according to claim 5, characterized in that The obtaining of heat dissipation requirement information associated with the printed circuit board body of the printed circuit board module includes: Obtaining load information of a coolant driving component in the printed circuit board module; The heat dissipation requirement information includes load information of the coolant drive component, and under different load information of the coolant drive component, at least some of the at least one component have different heat dissipation requirements.

9. The method according to claim 8, characterized in that According to the heat dissipation mode corresponding to each of the heat dissipation components, controlling the flow control components corresponding to each of the heat dissipation components to adjust the flow of the coolant in the cooling channel corresponding to the control components includes at least one of the following: When the load information indicates that the coolant drive assembly is under a first load, closing the at least one cooling channel; When the load information indicates that the coolant drive assembly is at a second load, opening a cooling channel corresponding to at least one first element according to a first preset flow rate, wherein the second load is greater than the first load, and the at least one first element is a partial element of the at least one element; When the load information indicates that the coolant drive component is at a third load, the cooling channel corresponding to the at least one first element is opened according to a second preset flow rate, and the cooling channel corresponding to the at least one second element is opened, wherein the third load is greater than the second load, the second preset flow rate is greater than the first preset flow rate, the second element is an element other than the first element, and the power consumption of the second element is lower than the power consumption of the first element; When the load information indicates that the coolant drive assembly is at a maximum load, the at least one cooling channel is opened at a maximum flow rate.

10. An electronic water pump, characterized in that: A printed circuit board module comprising any one of claims 1 to 4.

11. A vehicle, characterized in that: Include at least one of the following: A printed circuit board module as claimed in any one of claims 1 to 4; The electronic water pump as claimed in claim 10.

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